PP150B120-ND [POWEREX]
H-Bridge POW-R-PAK IGBT Assembly 150 Amperes/1200 Volts; H桥POW -R - PAK IGBT大会150安培/ 1200伏型号: | PP150B120-ND |
厂家: | POWEREX POWER SEMICONDUCTORS |
描述: | H-Bridge POW-R-PAK IGBT Assembly 150 Amperes/1200 Volts |
文件: | 总5页 (文件大小:583K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PP150B120-ND
Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272
www.pwrx.com
H-Bridge POW-R-PAK™
IGBT Assembly
150 Amperes/1200 Volts
R
J
N (4 PLACES)
+DC
H
F
M (6 PLACES)
PIN 1
L
E
K
S
H
G
–DC
P
B
A
Q
C
Description:
D
T
The Powerex POW-R-PAK™ is a configurable IGBT
based power assembly that may be used as a converter,
chopper, half or full bridge, or three phase inverter for
motor control, power supply, UPS or other power
conversion applications.
+DC
C1
C1
The power assembly is mounted on a forced air-cooled
heatsink and features state-of-the-art Powerex IGBTs
with low conduction and low switching losses for high
efficiency operation. The POW-R-PAK™ includes a low
inductance laminated bus structure, optically isolated
gate drive interfaces, isolated gate drive power supplies,
and a DC-link capacitor bank. The control board
provides a simple user interface along with built-in
protection features including overvoltage, undervoltage
lockout, overcurrent, overtemperature, and short circuit
detection.
G1
E1
G1
E1
1
2
G2
G2
E2
E2
E2
E2
-DC
Gate Driver Board
P1
Customer Interface (See Table 1)
Depending on application characteristics, the POW-R-
PAK™ is suitable for operation with DC bus voltages up
to 800VDC and switching frequencies below 20kHz.
Outline Drawing and Circuit Diagram
Dim.
A
B
C
D
E
F
G
H
Inches
14.9
14.25
7.6
5.43
10.15
7.2
2.01
0.79
0.3
mm
378.4
362.0
193.0
138.0
257.8
183.0
51.0
Dim.
K
L
M
N
P
Q
R
S
Inches
5.91
8.0
M6 Metric
0.256 Dia.
1.0
0.32
14.32
2.05
mm
150.0
203.2
M6
6.5 Dia.
25.4
8.2
363.6
52.0
Features:
£ High performance IGBT inverter bridge
£ Integrated gate drive with fault monitoring and
protection
£ System status / troubleshooting LEDs to verify
or monitor proper operation
£ Isolated gate drive power supplies
£ Low inductance laminated bus
£ Output current measurement and feedback
£ Superior short circuit detection & shoot through
prevention
20.0
J
7.7
T
5.4
137.1
01/14 Rev. 0
1
Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP150B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
150 Amperes/1200 Volts
Absolute Maximum Ratings, T = 25°C unless otherwise specified
j
Module
Characteristics
Symbol
Rating
-40 to +150
-40 to +65
-20 to +60
900
Units
°C
IGBT Junction Temperature
Storage Temperature
T
j
T
°C
stg
Operating Temperature
T
op
°C
Voltage Applied to DC Terminals
Isolation Voltage, Main Terminals to Heatsink
V
CC
Volts
Volts
V
2500
iso
IGBT Part
Characteristics
Symbol
Rating
150
Units
Collector Current (DC, T = 83°C)
C'
I
C
Amperes
Amperes
Amperes
Amperes
Watts
Peak Collector Current
I
300
150
CM
Emitter Current (T = 25°C)
C
I
E
Peak Emitter Current
I
300
960
EM
Maximum Collector Dissipation (T < 150°C per Module)
j
P
C
Interface Board
Characteristics
Symbol
—
Rating
30
Units
Volts
Volts
Volts
mA
Unregulated +24V Power Supply Input
IGBT Command Signal Input Voltage
Fault Output Supply Voltage
Fault Output Current
—
20
—
30
—
50
2
01/14 Rev. 0
Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP150B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
150 Amperes/1200 Volts
Electrical Characteristics, T = 25°C unless otherwise specified
j
IGBT Part
Characteristics
Symbol
Test Conditions
= V , V = 0V
Min.
Typ.
Max.
Units
Collector Cutoff Current
I
V
—
—
—
—
—
—
—
—
—
—
—
2.1
2.4
—
1.0
3.0
—
mA
Volts
Volts
Volts
Ns
CES
CE
CES GE
= 150A, T = 25°C
Collector-Emitter Saturation Voltage
V
I
CE(sat)
C
j
I
= 150A, T = 125°C
j
C
Emitter-Collector Voltage
Turn-on Delay Time
Rise Time
V
I
E
= 150A
3.8
130
100
450
350
150
—
EC
t
—
d(on)
t
V
CC
= 600V, I = 150A, V
= 15V,
= 1.6Ω, Inductive Load
G
—
Ns
r
C
GE
Turn-off Delay Time
Fall Time
t
R
—
Ns
d(off)
t
f
—
Ns
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
t
I
= 150A
= 150A
—
Ns
rr
E
Q
I
E
9.0
μC
rr
Interface Board
Characteristics
Min.
Typ.
Max.
Units
Unregulated +24V Power Supply Input
Power Supply Current Consumption
IGBT Command Signal ON Threshold
IGBT Command Signal OFF Threshold
IGBT Command Signal Input Impedance
IGBT Command Signal Input Capacitance
Dead Time
20
—
12
—
—
—
—
24
—
15
0
30
800
—
2
Volts
mA
Volts
Volts
kΩ
10
1
—
—
—
nF
3.0
μs
Feedback Signal and Fault Characteristics
Characteristics
Min.
Typ.
Max.
Units
Output Over Current Trip
Heatsink Over Temperature Trip
Bus Over Voltage Trip
—
—
—
—
—
—
—
—
250
95
—
—
—
—
—
—
—
—
Amperes
°C
920
Volts
Volts
μs
Power Supply Under Voltage Trip
Fault Reset Time
18.9
9
Heatsink Temperature Feedback
Output Current Feedback (Bipolar)
DC Link Feedback
0.1 V/°C
0.01 V/Amp
0.01 V/V
Volts
Volts
Volts
01/14 Rev. 0
3
Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP150B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
150 Amperes/1200 Volts
Electrical Characteristics, T = 25°C unless otherwise specified
j
Other Electrical Component Specifications
Characteristics
Min.
Typ.
Max.
Units
DC Link Capacitor Bank
Total Nominal Capacitance
—
—
—
—
2300
11.6
1000
10
—
—
—
—
μF
Nominal Ripple Current Rating per Capacitor (@ 85°C, 120Hz)
Nominal Total Voltage Rating
A
RMS
Volts
Minimum Life @ Nominal Ripple Current (80°C)
khrs
Output Current Sensor
Primary Current Measuring Range
—
—
±200
< ±1
< ±1
< 5
—
—
—
—
25
Amperes
Accuracy (@ I , 25°C)
PN
%
%
Linearity Error
—
Response Time
Bandwidth (-3 dB)
—
μs
DC
—
kHz
Thermal Characteristics, T = 25°C unless otherwise specified
j
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
IGBT Thermal Resistance, Junction-to-Case
FWD Thermal Resistance, Junction-to-Case
Contact Thermal Resistance
R
Q
Per IGBT, 1/2 Module
Per FWD, 1/2 Module
Per 1/2 Module
—
—
—
—
—
0.13
0.23
—
°C/W
°C/W
°C/W
°C/W
th(j-c)
R
D
th(j-c)
—
R
0.022
0.037
th(c-f)
Heatsink Thermal Resistance
R
286 CFM Airflow
—
th(f-a)
Mechanical Characteristics, T = 25°C unless otherwise specified
j
Characteristics
Min.
Typ.
Max.
Units
Mounting Torque, Output Power Terminals
Mounting Torque, DC Bus Terminals
Weight
—
—
—
75
130
39
90
150
—
in-lb
in-lb
lb
Relevant Standards
UL508C: Power Conversion Equipment
EN50178: Electronic Equipment for Use in Power Installations
4
01/14 Rev. 0
Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
PP150B120-ND
H-Bridge POW-R-PAK™ IGBT Assembly
150 Amperes/1200 Volts
Interface Board Signal Defintions (Table 1)
Pin
Signal Name
Description
1
2
3
Shield
Internally Conected to PGND
Gate 1 Neg.
0-15V Signal Controlling, Lower IGBT, HIGH = IGBT on
Open Collector Output, External Pull-up Resistor Required
LOW = No Error; HIGH = Phase A Over Current or Short Circuit OR Power Supply UV
0-15V Signal Controlling, Upper IGBT, HIGH = IGBT on
0-15V Signal Controlling, Lower IGBT, HIGH = IGBT on
Open Collector Output, External Pull-up Resistor Required
LOW = No Error; HIGH = Phase A Over Current or Short Circuit OR Power Supply UV
0-15V Signal Controlling, Upper IGBT, HIGH = IGBT on
No Connect - Do Not Ground
1
Leg 1 Error
4
5
6
Gate 1 Pos.
Gate 2 Neg.
1
Leg 2 Error
7
8
Gate 2 Pos.
N/C
9
N/C
No Connect - Do Not Ground
10
11
N/C
No Connect - Do Not Ground
1
Over Temperature
Open Collector Output, External Pull-up Resistor Required
LOW = No Error; HIGH = Heatsink OT
3
12
13
14
15
16
17
18
19
20
21
22
23
24
25
25
External Fault Reset
DC Link Voltage
24 VDC Input Power
24 VDC Input Power
N/C
Active Low: Must be High for Operation; Low for 10microseconds to Reset Faults
Analog Voltage Feedback of DC Link Voltage
20-30 VDC Input Power Supply
20-30 VDC Input Power Supply
No Connect - Do Not Ground
N/C
No Connect - Do Not Ground
PGND
Ground Reference for 24 VDC Power Supply
Ground Reference for 24 VDC Power Supply
Analog Voltage Representation of Heatsink Temperature
Tied to Pins 10 and 11
PGND
Heatsink Temperature
2
AGND
I
Phase A
2
Analog Voltage Representation of Output Current
Tied to Pins 10 and 11
OUT
AGND
I
Phase B
2
Analog Voltage Representation of Output Current
Tied to Pins 10 and 11
OUT
AGND
N/C
No Connect - Do Not Ground
1. Open collectors can be pulled up to 30V max. and sink 50mA continuous.
2. AGND signals to be used for analog feedback signals (i.e. twisted pair with I
Phase A).
OUT
3. On the board is a jumper that enables fault reset by bringing all leg control signals low for 10 microseconds (default).
Interface Board Connector
Description
Symbol
Type
Manufacturer
Gate Drive Board Interface Header
Recommended Mating Socket
Recommended Strain Relief
P1
—
—
0.100" x 0.100" Latching Header, 26 Pin
0.100" x 0.100" IDC Socket, 26 Pin
Plastic Strain Relief
3M# 3429-6002 or Equivalent
3M# 3499-7600 or Equivalent
3M# 3448-3026 or Equivalent
01/14 Rev. 0
5
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