ESD4-LFC-T73 [PROTEC]
Transient Suppressor,;
| 型号： | ESD4-LFC-T73 |
| 厂家： | 
PROTEK DEVICES |
| 描述： | Transient Suppressor, |
| 文件： | 总6页 (文件大小：467K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESD4-LFC
Only One Name Means ProTek’Tion™
LOW CAPACITANCE FLIP ChIP TꢀS ARRAy
DESCRIPTION
The ESD4-LFC is a low capacitance flip chip transient voltage suppressor array, designed to protect portable devices
from the effects of Electrostaꢀc Discharge (ESD) and Electrical Fast Transients (EFT). This series meets the IEC 61000-
4-2 and 61000-4-4 requirements. This device is ideally suited for portable devices, PCMCIA and SMART phones.
The ESD4-LFC features superior clamping performance, low leakage current characterisꢀcs and a response ꢀme of less
than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.
5 BuMP PACꢁAꢂE
FEATuRES
APPLICATIONS
• SMART Phones
• I/O Port Interfaces
• Portable Devices
• Ground Posiꢀoning Systems (GPS)
• SMART Cards
• Compaꢀble with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compaꢀble with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protecꢀon > 25 kilovolts
• Unidirecꢀonal Configuraꢀon
• Low Capacitance: 15pF
• Protecꢀon for 4 Data Lines
• RoHS Compliant
• REACH Compliant
MEChANICAL ChARACTERISTICS
• 5 Bump Flip Chip Package
• Approximate Weight: 0.73 milligrams
• Lead-Free Plaꢀng
• Solder Reflow Temperature:
•
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Raꢀng UL 94V-0
• 8mm Tape per EIA Standard 481
CIRCuIT DIAꢂRAM
G1
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Page 1
ESD4-LFC
Only One Name Means ProTek’Tion™
TyPICAL DEꢀICE ChARACTERISTICS
MAXIMuM RATINꢂS @ 25°C unless Otꢃerwise Specified
PARAMETER
SyMBOL
ꢀALuE
200
uNITS
mW
°C
DC Power Raꢀng
P
TA
Operaꢀng Temperature
Storage Temperature
-40 to 85
-55 to 150
TSTG
°C
ELECTRICAL ChARACTERISTICS PER LINE @ 25°C unless Otꢃerwise Specified
PART
NuMBER
MARꢁINꢂ
CODE
RATED
STANDꢄOFF
ꢀOLTAꢂE
MINIMuM
BREAꢁDOWN
ꢀOLTAꢂE
MAXIMuM
CLAMPINꢂ
ꢀOLTAꢂE
TyPICAL
FORWARD
ꢀOLTAꢂE
MAXIMuM
LEAꢁAꢂE
CuRRENT
TyPICAL
CAPACITANCE
PER LINE
(Note 1)
ꢅ2.5ꢀ, 1Mhz
C
ꢅ 1mA
ꢀ(BR)
ꢅ IP = 10mA
ꢀC
ꢅ 10mA
ꢀF
ꢅ 3.3ꢀ
ID
ꢀWM
ꢀOLTS
ꢀOLTS
ꢀOLTS
ꢀOLTS
µA
pF
ESD4-LFC
4L
5.0
6.0
8
0.8
0.1
15
NOTES
1. ±20% tolerance.
FIꢂuRE 1
CAPACITANCE ꢀS REꢀERSE ꢀOLTAꢂE
(Normalized to Capacꢆance at 2.5ꢀ DC & 25°C)
1.6
1.2
0.8
0.4
0
0
1
2
3
4
5
6
ꢀR - Reverse ꢀoltage - ꢀolts
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Page 2
ESD4-LFC
Only One Name Means ProTek’Tion™
SOLDER REFLOW INFORMATION
PRINTED CIRCuIT BOARD RECOMMENDATIONS
PARAMETER
ꢀALuE
Pad Size on PCB
Pad Shape
0.275mm
Round
Pad Definiꢀon
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Paste Type
0.330mm Round
No Clean
Pad Protecꢀve Finish
OSP (Entek Cu Plus 106A)
±50µm
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
60 seconds
270°C
REquIREMENTS
RECOMMENDED NONꢄSOLDER MASꢁ
DEFINED PAD ILLuSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (Sn/Ag/Cu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat ꢀme and temperature depends on solder paste and flux acꢀva-
ꢀon temperature, component size, weight, surface area and plaꢀng.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximꢉm Solder Reflow
ꢇ35-53°C Above Maximꢉm Solder Melt Tempꢈ
TP
Solder Melt
ꢇMaximꢉm Tempꢈ
Ramp-up
Ramp-Down
Preꢃeat
ꢇStaꢊ Below Flꢉx Acꢆvaꢆon Tempꢈ
30-60 seconds
Ramp-up
15 seconds
ꢇMinimizeꢈ
Solder-Time
15-20 seconds
Ramp-Down
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05210.R4 1/11
Page 3
ESD4-LFC
Only One Name Means ProTek’Tion™
5 BuMP PACꢁAꢂE INFORMATION
BOTTOM VIEW
A
OuTLINE DIMENSIONS
MILLIMETERS
MIN
INChES
G
DIM
C
MAX
1.016
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
MIN
0.036
MAX
0.040
SIDE VIEW
E
A
0.914
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
B
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.017
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.022
O
F
C
D
B
J
G
I
E
H
F
G
H
1
2
I
I
J
0.013
0.018
SOLDER BUMPS
D
NOTES
1. Controlling dimensions in millimeters.
2. Solder bumps (63/67 Sn/Pb) 0.30 dia.
LAyOuT DIMENSIONS
A
MILLIMETERS
INChES
DIM
Non solder mask
MIN
MAX
0.25
0.50
0.86
MIN
0.010
0.020
0.034
MAX
0.010
0.020
0.034
defined pad 0.275mm
A
0.25
0.50
0.86
Solder mask opening
0.325mm
B
C
C
NOTES
Solder stencil
1. Controlling dimensions in millimeters
opening 0.330mm
B
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Page 4
ESD4-LFC
Only One Name Means ProTek’Tion™
TAPE AND REEL INFORMATION
10 Pitches Cumulaꢀve
Tolerance on tape ± 0.2
E
P0
D
t
P2
Top Cover
Tape
A0
P
F
W
K0
B0
Orientaꢀon Dot
User Direcꢀon of Feed
SPECIFICATIONS
TAPE
WIDTh
REEL DIA.
A0
B0
ꢁ0
D
E
F
W
P0
P2
P
Tmax
178(7”)
8
1.08±0.05 1.60±0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.30 4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 0.20±0.025
NOTES
1. Dimensions in millimeters.
2. Top view of tape. Solder bumps are face down in tape package.
3. Surface mount product is taped and reeled in accordance with EIA 481.
4. 8mm plasꢀc tape: 7” Reels - 3,000 pieces per reel.
Package outline, pad layout and tape specificaꢀons per document number 06055.R2 9/09.
ORDERINꢂ INFORMATION
BASE PART NuMBER
LEADFREE SuFFIX
TAPE SuFFIX
qTy/REEL
REEL SIZE
TuBE qTy
ESD4-LFC
-LF
-T73
3,000
7”
n/a
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Page 5
ESD4-LFC
Only One Name Means ProTek’Tion™
COMPANy INFORMATION
COMPANy PROFILE
ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for
the protecꢀon of electronic systems from the effects of lightning, Electrostaꢀc Discharge (ESD), Nuclear Electromagneꢀc Pulse (NEMP), in-
ducꢀve switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide
applicaꢀon specific protecꢀon soluꢀons for all electronic equipment/systems.
ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products.
CONTACT uS
Corporate headꢋꢉarters
2929 South Fair Lane
Tempe, Arizona 85282
USA
Bꢊ Telepꢃone
General: 602-431-8101
Sales: 602-414-5109
Customer Service: 602-414-5114
Bꢊ Fax
General: 602-431-2288
Bꢊ E-mail:
Sales: sales@protekdevices.com
Customer Service: service@protekdevices.com
Technical Support: support@protekdevices.com
Web
www.protekdevices.com
www.protekanalog.com
COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characterisꢀcs described herein without noꢀce.
DESIGN CHANGES: ProTek reserves the right to disconꢀnue product lines without noꢀce and that the final judgement concerning selecꢀon and specificaꢀons is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selecꢀon or specificaꢀons of such products. ProTek makes no warranty, representaꢀon or guarantee regarding the suitability of
its products for any parꢀcular purpose, nor does ProTek assume any liability arising out of the applicaꢀon or use of any product or circuit and specifically disclaims any and all liability without limitaꢀon special,
consequenꢀal or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without wriꢁen consent from the factory.
PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”.
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Page 6
相关型号：
ESD4-LFC-T73-1
Trans Voltage Suppressor Diode, 200W, 5V V(RWM), Unidirectional, 4 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-5
PROTEC
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