PKFC3.3C [PROTEC]
PACKAGED FLIP CHIP ARRAY; PACKAGED倒装芯片阵列
| 型号： | PKFC3.3C |
| 厂家： | 
PROTEK DEVICES |
| 描述： | PACKAGED FLIP CHIP ARRAY |
| 文件： | 总5页 (文件大小：68K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PKFC3.3C*
thru
PKFC36C*
PACKAGED FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ Chip Scale Package 0.050” (1.270mm) x 0.030” (0.762mm)
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 Line
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Encapsulated 0502 Chip
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Consult Factory for Leaded Device Availability
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
PIN CONFIGURATION
05180.R4 2/07
1
www.protekdevices.com
*PATENT PENDING
PKFC3.3C*
thru
PKFC36C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
250
UNITS
Watts
°C
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
PPP
TA
-55 to 150
-55 to 150
Storage Temperature
TSTG
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
DEVICE
MARKING
CODE
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
MAXIMUM
BREAKDOWN CLAMPING
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
VOLTAGE
VOLTAGE
(See Fig. 2)
(See Fig. 2)
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@VWM
ID
µA
@0V, 1 MHz
VWM
VOLTS
@8/20µs
VC @ IPP
C
pF
03
05
08
12
15
24
36
PKFC3.3C
PKFC05C
PKFC08C
PKFC12C
PKFC15C
PKFC24C
PKFC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
75*
10**
10***
1
1
1
150
100
75
50
40
13.4
19.0
24.0
43.0
64.0
30
25
1
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Typical leakage current < 5µA @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.
FIGURE 1
FIGURE 2
PEAK PULSE POWER VS PULSE TIME
PULSE WAVE FORM
120
100
10,000
1,000
TEST
tf
WAVEFORM
PARAMETERS
tf = 8µs
Peak Value IPP
80
60
40
td = 20µs
e-t
250W, 8/20µs Waveform
100
10
td = t
IPP/2
20
0
0.01
1
10
100
1,000
10,000
0
5
10
15
20
25
30
td - Pulse Duration - µs
t - Time - µs
05180.R4 2/07
www.protekdevices.com
*PATENT PENDING
2
PKFC3.3C*
thru
PKFC36C*
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
80
Peak Pulse Power
8/20µs
60
40
20
0
Average Power
0
25
50
75
100
125 150
TA - Ambient Temperature - °C
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
05180.R4 2/07
3
www.protekdevices.com
*PATENT PENDING
PKFC3.3C*
thru
PKFC36C*
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
0.275mm
Round
Pad Definition
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
0.330mm Round
No Clean
Pad Protective Finish
OSP(Entek Cu Plus 106A)
50µm
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
20µm
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
Temperature:
0.275mm DIA.
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Ramp-up
Ramp-down
T
L
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05180.R4 2/07
www.protekdevices.com
*PATENT PENDING
4
PKFC3.3C*
thru
PKFC36C*
0502 PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM
MILLIMETERS
INCHES
NOM
C
A
H
MIN
NOM
MAX
MIN
MAX
A
B
C
D
E
F
G
H
J
0.73
1.22
0.73
0.54
0.10
0.55
0.27
0.38
0.35
0.35
0.76
1.27
0.76
0.57
0.13
0.58
0.30
0.41
0.38
0.38
0.79
1.32
0.79
0.60
0.16
0.61
0.33
0.44
0.41
0.41
0.029
0.048
0.029
0.021
0.004
0.022
0.011
0.015
0.014
0.014
0.030
0.050
0.030
0.023
0.005
0.023
0.012
0.016
0.015
0.015
0.031
0.052
0.031
0.024
0.006
0.024
0.013
0.017
0.016
0.016
D
F
K
J
BOTTOM
SIDE
TOP
B
E
K
NOTES
1. Controlling dimensions in inches.
G
2. Decimal tolerances for mounting pad : 0.003” ( 0.08mm).
3. Maximum size: 0.052” (1.321mm) by 0.036” (0.914mm).
4. All dimensions 0.003” on package outline.
PAD DIMENSIONS
MOUNTING PAD
DIM
INCHES
NOM
MILLIMETERS
A
MIN
NOM
MAX
MIN
MAX
A
B
C
E
F
G
J
0.039
0.024
0.056
0.007
0.019
0.012
0.012
0.040
0.025
0.058
0.008
0.020
0.013
0.013
0.041
0.026
0.060
0.009
0.021
0.014
0.014
1.00
0.62
1.44
0.18
0.49
0.31
0.31
1.04
0.66
1.50
0.22
0.53
0.35
0.35
1.02
0.64
1.47
0.20
0.51
0.33
0.33
G
B
C
F
E
TAPE & REEL ORIENTATION
Package Outline
J
Package Contact Pads
Solder Print Diameter
0.010” - 0.012”
TAPE & REEL ORDERING NOMENCLATURE
NOTE
1. Surface mount product is taped and reeled in accordance with EIA 481.
1. Top view of tape. Solder PADS face down in tape package.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1).
3. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., PKFC05C-LF-T75-1.
Outline & Dimensions: Rev 1 - 8/03, 06040
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia. Tape Width
178mm (7”) 8mm
A0
B0
K0
D
E
F
W
P0
P2
P
t
1.08 0.05 1.60 0.05 0.72 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 4.00 0.10 0.20 0.025
P0
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
P2
D
t
E
F
Top cover tape
K0
A0
W
B0
P
User Direction of Feed
ProTek Devices
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
2929 South Fair Lane, Tempe,AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
05180.R4 2/07
5
www.protekdevices.com
*PATENT PENDING
相关型号：
PKFC3.3C-LF
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2
PROTEC
PKFC3.3C-LF-T75-1
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, ROHS AND REACH COMPLIANT, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2
PROTEC
PKFC3.3C-LF-T75-2
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2
PROTEC
PKFC3.3C-T75-1
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2
PROTEC
PKFC36C-LF-T75-2
Trans Voltage Suppressor Diode, 250W, 36V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2
PROTEC
PKFC36C-T75-1
Trans Voltage Suppressor Diode, 250W, 36V V(RWM), Bidirectional, 1 Element, Silicon, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2
PROTEC
PKFC36C-T75-2
Trans Voltage Suppressor Diode, 250W, 36V V(RWM), Bidirectional, 1 Element, Silicon, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2
PROTEC
©2020 ICPDF网 联系我们和版权申明