SLVU2.8-4-T7 [PROTEC]
ULTRA LOW CAPACITANCE TVS ARRAY; 超低电容TVS阵列
| 型号： | SLVU2.8-4-T7 |
| 厂家： | 
PROTEK DEVICES |
| 描述： | ULTRA LOW CAPACITANCE TVS ARRAY |
| 文件： | 总5页 (文件大小：91K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SLVU2.8-4
Only One Name Means ProTek’Tion™
ULTRA LOW CAPACITANCE TVS ARRAY
APPLICATIONS
✔ Ethernet - 10/100/1000 Base T
✔ Cellular Phones
✔ Audio/Video Inputs
✔ Personal Digital Assistant (PDA)
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
✔ 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line-Ground) & Level 3(Line-Line)
SO-8
FEATURES
✔ 600 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Provides Protection For Two Line Pairs
✔ ESD Protection > 40 kilovolts
✔ LOW LEAKAGE CURRENT < 1.0µA
✔ ULTRA LOW CAPACITANCE: 3pF Typical
✔ RoHS Complaint in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔ Molded JEDEC SO-8
✔ Weight 70 milligrams (Approximate)
✔ Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
✔ Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 12mm Tape and Reel Per EIAStandard 481
✔ Device Marking: Marking Code, Logo, Date Code & Pin One Defined By DOT on Package
PIN CONFIGURATION
8
5
7
6
1
2
3
4
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SLVU2.8-4
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
SYMBOL
PPP
VALUE
600
UNITS
Watts
Amps
°C
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Peak Pulse Current (tp = 8/20µs)
Lead SolderingTemperature
IPP
30
IFRM
260°C (10s)
-55°C to 150°C
-55°C to 150°C
Operating Temperature
TJ
°C
Storage Temperature
TSTG
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER MARKING STAND-OFF BREAKDOWN SNAPBACK
CODE VOLTAGE VOLTAGE VOLTAGE
(See Note 1) (See Note 1) (See Note 1)
DEVICE
RATED
MINIMUM
MINIMUM
MAXIMUM
CLAMPING
VOLTAGE
(See Note 1)
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
(See Note 1) (See Note 1)
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Note 1)
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 1)
TYPICAL
CAPACITANCE
(See Note 1)
(See Fig. 2)
@ 1mA
V(BR)
@ISB = 50mA
VSB
@IP = 2A
VC
@IP = 5A
VC
@IP = 24A
VC
@IP = 30A
VC
@VWM
ID
@0V, 1MHz
VWM
C
VOLTS
VOLTS
VOLTS
VOLTS
VOLTS
VOLTS
VOLTS
µA
pF
SLVU2.8-4
SL4
2.8
3.0
2.8
5.5
8.5
15
21
1.0
3
Note 1: Device measured between pin 1 to 2, pin 3 to 4, pin 5 to 6 and pin 7 to 8.
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SLVU2.8-4
GRAPHS
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
1,000
600W, 8/20µs Waveform
100
10
0.01
1
10
100
1,000
10,000
td - Pulse Duration - µs
FIGURE 2
PULSE WAVE FORM
120
100
TEST
tf
WAVEFORM
PARAMETERS
tf = 8µs
Peak Value IPP
e-t
80
60
40
td = 20µs
td = t
IPP/2
20
0
0
5
10
15
20
25
30
t - Time - µs
FIGURE 3
FIGURE 4
POWER DERATING CURVE
Typical Clamping Voltage vs Peak Pulse Current
20
100
80
Peak Pulse Power
8/20µs
PIN 2 TO 1
16
60
40
20
12
8
PIN 3 TO 1
4
0
Average Power
0
0
25
50
75
100
125 150
0
5
10
15
20
25
30
TL - Lead Temperature - °C
IPP - Peak Pulse Current A
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SLVU2.8-4
APPLICATION NOTE
Electronic equipment is susceptible to damage caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and tertiary lightning
effects. Knowing that equipment can be damaged, the SLVU2.8-4 was designed to provide the level of protection required to safe guard sensitive
equipment. This product can be used in different configurations to provide a level of protection to meet unidirectional line requirements as well as
bidirectional requirements either in a common-mode or differential-mode configuration.
Figure 1. Unidirectional Common-Mode Protection
UNIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1)
The SLVU2.8-4 provides up to four lines of protection in a common-mode configuration as
depicted in figure 1.
Circuit connectivity is as follows:
✔
✔
✔
✔
✔
Line 1 is connected to Pin 1
Line 2 is connected to Pin 7
Line 3 is connected to Pin 3
Line 4 is connected to Pin 5
Pins 2, 4, 7 and 8 are connected to ground
BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 2)
The SLVU2.8-4 provides up to two lines of protection in a common-mode configuration as
depicted in figure 1.
Circuit connectivity is as follows:
✔
✔
✔
Line 1 is connected to Pins 1 & 8
Line 2 is connected to Pins 4 & 5
Pins 2, 3, 6, and 7 are connected to ground
External diode to ground is a low capacitance
diode of less than 10pF
BIDIRECTIONAL DIFFERENTIAL-MODE CONFIGURATION (Figure 3)
The SLVU2.8-4 provides up to two-line pairs of protection in a differenital-mode configuration as
depicted in figure 1.
Figure 2. Bidirectional Common-Mode Protection
Circuit connectivity is as follows:
✔
✔
✔
✔
Line Pair 1 is connected to Pins 1 & 2
Line Pair 1 is connected to Pins 7 & 8
Line Pair 2 is connected to Pins 3 & 4
Line Pair 2 is connected to Pins 5 & 6
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
✔
The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
✔
✔
✔
The path length between the TVS device and
the protected line should be minimized.
Figure 3. Bidirectional Differential-Mode Protection
All conductive loops including power and ground
loops should be minimized.
The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
✔
Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
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SLVU2.8-4
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
SO-8
-A-
8
1
5
0.010 (0.25 MM)
B
M
M
+
PACKAGE DIMENSIONS
P
-B -
4 PL
INCHES
MILLIMETERS
4
DIM
MIN
MAX
MIN
MAX
A
B
C
D
F
G
J
K
P
R
4.80
3.80
1.35
0.35
0.40
5.00
4.00
1.75
0.49
1.250
0.189
0.150
0.054
0.014
0.016
0.196
0.157
0.068
0.019
0.049
D
G
C
R x 45°
1.27 BSC 1.27 BSC 0.05 BSC 0.05 BSC
0.18
0.10
5.80
0.25
0.25
0.25
6.20
0.50
0.007
0.004
0.229
0.010
0.009
0.008
0.244
0.019
0° - 10°
-T-
J
K
F
NOTES
0.010 (0.25 MM)
T B
A
S S
M
+
8 PL
1. - T - = Seating Plane and Datum Surface.
2. Dimensions “A” and “B” are Datum.
3. Dimensions “A” and “B” do not include mold protrusion.
4. Maximum mold protrusion is 0.015” (0.380 mm) per side.
5. Dimensioning and tolerances per ANSI Y14.5M, 1982.
6. Dimensions are exclusive of mold flash and metal burrs.
MOUNTING PAD
0.050 ± 0.005
0.030 ± 0.005
TAPE & REEL/BULK ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 12mm tape,
i.e., SLVU2.8-4-T7.
0.160 ± 0.005
0.245 MIN
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 12mm tape,
i.e., SLVU2.8-4-T13.
4. Suffix - LF = Lead-Free, Pure Tin Plating,
i.e., SLVU2.8-4-LF-T7.
5. No Suffix = Product Shipped in Tubes of 98 pcs per Tube.
0.045 ± 0.005
Outline & Dimensions: Rev 1 - 11/01, 06009
ProTek Devices
COPYRIGHT © ProTek Devices 2005
2929 South Fair Lane, Tempe,AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
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