4245-52 [PSEMI]

SPDT UltraCMOS⑩ RF Switch; 单刀双掷的UltraCMOS ™射频开关
4245-52
型号: 4245-52
厂家: Peregrine Semiconductor    Peregrine Semiconductor
描述:

SPDT UltraCMOS⑩ RF Switch
单刀双掷的UltraCMOS ™射频开关

开关 射频开关 微波 光电二极管
文件: 总8页 (文件大小:282K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Product Specification  
PE4245  
SPDT UltraCMOS™ RF Switch  
DC - 4000 MHz  
Product Description  
The PE4245 RF Switch is designed to cover a broad range of  
applications from near DC to 4000 MHz. This switch integrates  
on-board CMOS control logic with a low voltage CMOS  
compatible control input. Using a +3-volt nominal power  
supply voltage, a 1 dB compression point of +27 dBm can be  
achieved. The PE4245 also exhibits excellent isolation of  
better than 42 dB at 1000 MHz and is offered in a small 3x3  
mm DFN package.  
Features  
Single 3.0 V Power Supply  
Low insertion loss: 0.6 dB at 1000 MHz,  
0.7 dB at 2000 MHz  
High isolation of 42 dB at 1000 MHz,  
32 dB at 2000 MHz  
Typical 1 dB compression of +27 dBm  
Single-pin CMOS logic control  
The PE4245 is manufactured on Peregrine’s UltraCMOS™  
process, a patented variation of silicon-on-insulator (SOI)  
technology on a sapphire substrate, offering the performance  
of GaAs with the economy and integration of conventional  
CMOS.  
Available in a 6-lead DFN package  
Figure 1. Functional Diagram  
Figure 2. Package Type  
6-lead DFN  
RFC  
RF1  
RF2  
CMOS  
Control  
Driver  
CTRL  
Table 1. Electrical Specifications @ +25 °C, VDD = 3 V (ZS = ZL = 50 )  
Parameter  
Operation Frequency1  
Insertion Loss  
Conditions  
Minimum  
Typical  
Maximum  
Units  
DC  
4000  
MHz  
1000 MHz  
2000 MHz  
1000 MHz  
2000 MHz  
1000 MHz  
2000 MHz  
1000 MHz  
2000 MHz  
0.6  
0.7  
42  
32  
36  
29  
23  
22  
0.75  
0.85  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
39  
30  
34  
27  
21  
20  
Isolation – RFC to RF1/RF2  
Isolation – RF1 to RF2  
Return Loss  
‘ON’ Switching Time  
‘OFF’ Switching Time  
Video Feedthrough2  
Input 1 dB Compression  
Input IP3  
CTRL to 0.1 dB final value, 2 GHz  
CTRL to 25 dB isolation, 2 GHz  
200  
90  
ns  
ns  
15  
mVpp  
dBm  
dBm  
2000 MHz  
26  
43  
27  
2000 MHz, 14 dBm  
45  
Notes: 1. Device linearity will begin to degrade below 10 MHz.  
2. The DC transient at the output of any port of the switch when the control voltage is switched from Low to  
High or High to Low in a 50 test set-up, measured with 1ns risetime pulses and 500 MHz bandwidth.  
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 www.psemi.com  
Page 1 of 8  
PE4245  
Product Specification  
Figure 3. Pin Configuration  
Table 4. Absolute Maximum Ratings  
Symbol  
VDD  
Parameter/Conditions Min  
Max Units  
RF2  
GND  
RF1  
1
2
3
6
5
4
RFC  
CTRL  
VDD  
Power supply voltage  
Voltage on any input  
Storage temperature range  
Input power (50)  
-0.3  
-0.3  
-65  
4.0  
V
V
VDD  
+
VI  
Exposed Solder  
Pad - Shorted  
to Pin 2  
0.3  
TST  
150  
30  
°C  
(bottom side)  
PIN  
dBm  
V
ESD voltage (Human Body  
Model)  
VESD  
1500  
Exceeding absolute maximum ratings may cause  
permanent damage. Operation should be  
restricted to the limits in the Operating Ranges  
table. Operation between operating range  
maximum and absolute maximum for extended  
periods may reduce reliability.  
Table 2. Pin Descriptions  
Pin  
No.  
Pin  
Name  
Description  
1
2
RF2  
RF2 port (Note 1)  
Ground Connection. Traces should be  
physically short and connected to the  
ground plane. This pin is connected to  
the exposed solder pad that also must  
be soldered to the ground plane for best  
performance.  
GND  
Table 5. Control Logic Truth Table  
Control Voltage  
Signal Path  
3
4
RF1  
VDD  
RF1 port (Note 1)  
CTRL = CMOS High  
CTRL = CMOS Low  
RFC to RF1  
RFC to RF2  
Nominal 3 V supply connection.  
CMOS logic level:  
5
6
CTRL  
RFC  
High = RFC to RF1 signal path  
Low = RFC to RF2 signal path  
Electrostatic Discharge (ESD) Precautions  
Common RF port for switch (Note 1)  
When handling this UltraCMOS™ device, observe  
the same precautions that you would use with  
other ESD-sensitive devices. Although this device  
contains circuitry to protect it from damage due to  
ESD, precautions should be taken to avoid  
exceeding the rating specified in Table 4.  
Notes: 1. All RF pins must be DC blocked with an external series  
capacitor or held at 0 VDC  
.
Table 3. Operating Ranges  
Parameter  
Min  
Typ  
Max  
Units  
Latch-Up Avoidance  
VDD Power Supply Voltage  
2.7  
3.0  
3.3  
V
Unlike conventional CMOS devices, UltraCMOS™  
devices are immune to latch-up.  
IDD Power Supply Current  
VDD = 3V, VCTRL = 3V  
250  
500  
85  
nA  
TOP Operating temperature  
-40  
°C  
V
range  
0.7x  
VDD  
Control Voltage High  
0.3x  
VDD  
Control Voltage Low  
V
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 UltraCMOS™ RFIC Solutions  
Page 2 of 8  
PE4245  
Product Specification  
Typical Performance Data @ 25 °C (Unless Otherwise Noted)  
Figure 4. Insertion Loss - RFC to RF1  
T = -40 °C to 85 °C  
Figure 5. Input 1dB Compression Point and IIP3  
0
60  
50  
40  
30  
20  
60  
50  
40  
30  
20  
-40°C  
-0.3  
-0.6  
85°C  
25°C  
-0.9  
-1.2  
-1.5  
0
800  
1600  
2400  
3200  
4000  
0
800  
1600  
2400  
3200  
4000  
Frequency (MHz)  
Frequency (MHz)  
Figure 6. Insertion Loss - RFC to RF2  
T = -40 °C to 85 °C  
Figure 7. Isolation - RFC to RF1  
0
0
-20  
-40°C  
-0.3  
-0.6  
-40  
85°C  
25°C  
-0.9  
-1.2  
-1.5  
-60  
-80  
-100  
0
800  
1600  
2400  
3200  
4000  
0
800  
1600  
2400  
3200  
4000  
Frequency (MHz)  
Frequency (MHz)  
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 www.psemi.com  
Page 3 of 8  
PE4245  
Product Specification  
Typical Performance Data @ 25 °C  
Figure 8. Isolation – RFC to RF2  
Figure 9. Isolation – RF1 to RF2, RF2 to RF1  
0
-20  
0
-25  
-50  
-40  
-60  
-75  
-80  
-100  
-100  
0
800  
1600  
2400  
3200  
4000  
0
800  
1600  
2400  
3200  
4000  
Frequency (MHz)  
Frequency (MHz)  
Figure 10. Return Loss – RFC to RF1, RF2  
Figure 11. Return Loss – RF1, RF2  
0
0
-10  
-10  
RF1  
-20  
-20  
RF1  
RF2  
-30  
-30  
RF2  
-40  
-40  
0
800  
1600  
2400  
3200  
4000  
0
800  
1600  
2400  
3200  
4000  
Frequency (MHz)  
Frequency (MHz)  
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 UltraCMOS™ RFIC Solutions  
Page 4 of 8  
PE4245  
Product Specification  
Figure 12. Evaluation Board Layouts  
Peregrine Specification 101/0085  
Evaluation Kit  
The SPDT Switch Evaluation Kit board was  
designed to ease customer evaluation of the  
PE4245 SPDT switch. The RF common port is  
connected through a 50 transmission line to the  
top left SMA connector, J1. Port 1 and Port 2 are  
connected through 50 transmission lines to the  
top two SMA connectors on the right side of the  
board, J2 and J3. A through transmission line  
connects SMA connectors J4 and J5. This  
transmission line can be used to estimate the loss  
of the PCB over the environmental conditions  
being evaluated.  
The board is constructed of a two metal layer FR4  
material with a total thickness of 0.031”. The  
bottom layer provides ground for the RF  
transmission lines. The transmission lines were  
designed using a coplanar waveguide with ground  
plane model using a trace width of 0.0476”, trace  
gaps of 0.030”, dielectric thickness of 0.028”,  
metal thickness of 0.0021” and εr of 4.4.  
J6 provides a means for controlling DC and digital  
inputs to the device. Starting from the lower left  
pin, the second pin to the right (J6-3) is connected  
to the device CTRL input. The fourth pin to the  
right (J6-7) is connected to the device VDD input.  
Figure 13. Evaluation Board Schematic  
Peregrine Specification 102/0110  
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 www.psemi.com  
Page 5 of 8  
PE4245  
Product Specification  
Figure 14. Package Drawing  
6-lead DFN  
NOTE: The exposed solder pad (on the bottom of the package) is electrically connected to pin 2 (fused.)  
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 UltraCMOS™ RFIC Solutions  
Page 6 of 8  
PE4245  
Product Specification  
Figure 15. Tape and Reel Specifications  
6-lead DFN  
Table 6. Dimensions  
Dimension  
DFN 3x3 mm  
3.23 ± 0.1  
3.17 ± 0.1  
1.37 ± 0.1  
4 ± 0.1  
Ao  
Bo  
Ko  
P
W
8 +0.3, -0.1  
0.254 ± 0.02  
3000  
T
R7 Quantity  
R13 Quantity  
N.A.  
Note: R7 = 7 inch Lock Reel, R13 = 13 inch Lock Reel  
Table 7. Ordering Information  
Order Code  
4245-51  
Part Marking  
4245  
Description  
Package  
Shipping Method  
Tape or loose  
3000 units / T&R  
1 / Box  
PE4245G-06DFN 3x3mm-12800F  
PE4245G-06DFN 3x3mm-3000C  
PE4245-06DFN 3x3mm-EK  
Green 6-lead 3x3 mm DFN  
Green 6-lead 3x3 mm DFN  
Evaluation Kit  
4245-52  
4245  
4245-00  
PE4245-EK  
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 www.psemi.com  
Page 7 of 8  
PE4245  
Product Specification  
Sales Offices  
The Americas  
North Asia Pacific  
Peregrine Semiconductor Corporation  
Peregrine Semiconductor K.K.  
9380 Carroll Park Drive  
San Diego, CA 92121  
Tel: 858-731-9400  
Teikoku Hotel Tower 10B-6  
1-1-1 Uchisaiwai-cho, Chiyoda-ku  
Tokyo 100-0011 Japan  
Fax: 858-731-9499  
Tel: +81-3-3502-5211  
Fax: +81-3-3502-5213  
Europe  
Peregrine Semiconductor, Korea  
#B-2402, Kolon Tripolis, #210  
Geumgok-dong, Bundang-gu, Seongnam-si  
Gyeonggi-do, 463-480 S. Korea  
Tel: +82-31-728-4300  
Peregrine Semiconductor Europe  
Bâtiment Maine  
13-15 rue des Quatre Vents  
F-92380 Garches, France  
Tel: +33-1-47-41-91-73  
Fax : +33-1-47-41-91-73  
Fax: +82-31-728-4305  
South Asia Pacific  
Space and Defense Products  
Americas:  
Peregrine Semiconductor, China  
Shanghai, 200040, P.R. China  
Tel: +86-21-5836-8276  
Tel: 858-731-9453  
Fax: +86-21-5836-7652  
Europe, Asia Pacific:  
180 Rue Jean de Guiramand  
13852 Aix-En-Provence Cedex 3, France  
Tel: +33(0) 4 4239 3361  
Fax: +33(0) 4 4239 7227  
For a list of representatives in your area, please refer to our Web site at: www.psemi.com  
Data Sheet Identification  
Advance Information  
The information in this data sheet is believed to be reliable.  
However, Peregrine assumes no liability for the use of this  
information. Use shall be entirely at the user’s own risk.  
The product is in a formative or design stage. The data  
sheet contains design target specifications for product  
development. Specifications and features may change in  
any manner without notice.  
No patent rights or licenses to any circuits described in this  
data sheet are implied or granted to any third party.  
Preliminary Specification  
Peregrine’s products are not designed or intended for use in  
devices or systems intended for surgical implant, or in other  
applications intended to support or sustain life, or in any  
application in which the failure of the Peregrine product could  
create a situation in which personal injury or death might occur.  
Peregrine assumes no liability for damages, including  
consequential or incidental damages, arising out of the use of  
its products in such applications.  
The data sheet contains preliminary data. Additional data  
may be added at a later date. Peregrine reserves the right  
to change specifications at any time without notice in order  
to supply the best possible product.  
Product Specification  
The data sheet contains final data. In the event Peregrine  
decides to change the specifications, Peregrine will notify  
customers of the intended changes by issuing a DCN  
(Document Change Notice).  
The Peregrine name, logo, and UTSi are registered trademarks  
and UltraCMOS and HaRP are trademarks of Peregrine  
Semiconductor Corp.  
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0104-06 UltraCMOS™ RFIC Solutions  
Page 8 of 8  

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