4245-52 [PSEMI]
SPDT UltraCMOS⑩ RF Switch; 单刀双掷的UltraCMOS ™射频开关型号: | 4245-52 |
厂家: | Peregrine Semiconductor |
描述: | SPDT UltraCMOS⑩ RF Switch |
文件: | 总8页 (文件大小:282K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Product Specification
PE4245
SPDT UltraCMOS™ RF Switch
DC - 4000 MHz
Product Description
The PE4245 RF Switch is designed to cover a broad range of
applications from near DC to 4000 MHz. This switch integrates
on-board CMOS control logic with a low voltage CMOS
compatible control input. Using a +3-volt nominal power
supply voltage, a 1 dB compression point of +27 dBm can be
achieved. The PE4245 also exhibits excellent isolation of
better than 42 dB at 1000 MHz and is offered in a small 3x3
mm DFN package.
Features
• Single 3.0 V Power Supply
• Low insertion loss: 0.6 dB at 1000 MHz,
0.7 dB at 2000 MHz
• High isolation of 42 dB at 1000 MHz,
32 dB at 2000 MHz
• Typical 1 dB compression of +27 dBm
• Single-pin CMOS logic control
The PE4245 is manufactured on Peregrine’s UltraCMOS™
process, a patented variation of silicon-on-insulator (SOI)
technology on a sapphire substrate, offering the performance
of GaAs with the economy and integration of conventional
CMOS.
• Available in a 6-lead DFN package
Figure 1. Functional Diagram
Figure 2. Package Type
6-lead DFN
RFC
RF1
RF2
CMOS
Control
Driver
CTRL
Table 1. Electrical Specifications @ +25 °C, VDD = 3 V (ZS = ZL = 50 Ω)
Parameter
Operation Frequency1
Insertion Loss
Conditions
Minimum
Typical
Maximum
Units
DC
4000
MHz
1000 MHz
2000 MHz
1000 MHz
2000 MHz
1000 MHz
2000 MHz
1000 MHz
2000 MHz
0.6
0.7
42
32
36
29
23
22
0.75
0.85
dB
dB
dB
dB
dB
dB
dB
dB
39
30
34
27
21
20
Isolation – RFC to RF1/RF2
Isolation – RF1 to RF2
Return Loss
‘ON’ Switching Time
‘OFF’ Switching Time
Video Feedthrough2
Input 1 dB Compression
Input IP3
CTRL to 0.1 dB final value, 2 GHz
CTRL to 25 dB isolation, 2 GHz
200
90
ns
ns
15
mVpp
dBm
dBm
2000 MHz
26
43
27
2000 MHz, 14 dBm
45
Notes: 1. Device linearity will begin to degrade below 10 MHz.
2. The DC transient at the output of any port of the switch when the control voltage is switched from Low to
High or High to Low in a 50 Ω test set-up, measured with 1ns risetime pulses and 500 MHz bandwidth.
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ www.psemi.com
Page 1 of 8
PE4245
Product Specification
Figure 3. Pin Configuration
Table 4. Absolute Maximum Ratings
Symbol
VDD
Parameter/Conditions Min
Max Units
RF2
GND
RF1
1
2
3
6
5
4
RFC
CTRL
VDD
Power supply voltage
Voltage on any input
Storage temperature range
Input power (50Ω)
-0.3
-0.3
-65
4.0
V
V
VDD
+
VI
Exposed Solder
Pad - Shorted
to Pin 2
0.3
TST
150
30
°C
(bottom side)
PIN
dBm
V
ESD voltage (Human Body
Model)
VESD
1500
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be
restricted to the limits in the Operating Ranges
table. Operation between operating range
maximum and absolute maximum for extended
periods may reduce reliability.
Table 2. Pin Descriptions
Pin
No.
Pin
Name
Description
1
2
RF2
RF2 port (Note 1)
Ground Connection. Traces should be
physically short and connected to the
ground plane. This pin is connected to
the exposed solder pad that also must
be soldered to the ground plane for best
performance.
GND
Table 5. Control Logic Truth Table
Control Voltage
Signal Path
3
4
RF1
VDD
RF1 port (Note 1)
CTRL = CMOS High
CTRL = CMOS Low
RFC to RF1
RFC to RF2
Nominal 3 V supply connection.
CMOS logic level:
5
6
CTRL
RFC
High = RFC to RF1 signal path
Low = RFC to RF2 signal path
Electrostatic Discharge (ESD) Precautions
Common RF port for switch (Note 1)
When handling this UltraCMOS™ device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rating specified in Table 4.
Notes: 1. All RF pins must be DC blocked with an external series
capacitor or held at 0 VDC
.
Table 3. Operating Ranges
Parameter
Min
Typ
Max
Units
Latch-Up Avoidance
VDD Power Supply Voltage
2.7
3.0
3.3
V
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
IDD Power Supply Current
VDD = 3V, VCTRL = 3V
250
500
85
nA
TOP Operating temperature
-40
°C
V
range
0.7x
VDD
Control Voltage High
0.3x
VDD
Control Voltage Low
V
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ UltraCMOS™ RFIC Solutions
Page 2 of 8
PE4245
Product Specification
Typical Performance Data @ 25 °C (Unless Otherwise Noted)
Figure 4. Insertion Loss - RFC to RF1
T = -40 °C to 85 °C
Figure 5. Input 1dB Compression Point and IIP3
0
60
50
40
30
20
60
50
40
30
20
-40°C
-0.3
-0.6
85°C
25°C
-0.9
-1.2
-1.5
0
800
1600
2400
3200
4000
0
800
1600
2400
3200
4000
Frequency (MHz)
Frequency (MHz)
Figure 6. Insertion Loss - RFC to RF2
T = -40 °C to 85 °C
Figure 7. Isolation - RFC to RF1
0
0
-20
-40°C
-0.3
-0.6
-40
85°C
25°C
-0.9
-1.2
-1.5
-60
-80
-100
0
800
1600
2400
3200
4000
0
800
1600
2400
3200
4000
Frequency (MHz)
Frequency (MHz)
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ www.psemi.com
Page 3 of 8
PE4245
Product Specification
Typical Performance Data @ 25 °C
Figure 8. Isolation – RFC to RF2
Figure 9. Isolation – RF1 to RF2, RF2 to RF1
0
-20
0
-25
-50
-40
-60
-75
-80
-100
-100
0
800
1600
2400
3200
4000
0
800
1600
2400
3200
4000
Frequency (MHz)
Frequency (MHz)
Figure 10. Return Loss – RFC to RF1, RF2
Figure 11. Return Loss – RF1, RF2
0
0
-10
-10
RF1
-20
-20
RF1
RF2
-30
-30
RF2
-40
-40
0
800
1600
2400
3200
4000
0
800
1600
2400
3200
4000
Frequency (MHz)
Frequency (MHz)
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ UltraCMOS™ RFIC Solutions
Page 4 of 8
PE4245
Product Specification
Figure 12. Evaluation Board Layouts
Peregrine Specification 101/0085
Evaluation Kit
The SPDT Switch Evaluation Kit board was
designed to ease customer evaluation of the
PE4245 SPDT switch. The RF common port is
connected through a 50 Ω transmission line to the
top left SMA connector, J1. Port 1 and Port 2 are
connected through 50 Ω transmission lines to the
top two SMA connectors on the right side of the
board, J2 and J3. A through transmission line
connects SMA connectors J4 and J5. This
transmission line can be used to estimate the loss
of the PCB over the environmental conditions
being evaluated.
The board is constructed of a two metal layer FR4
material with a total thickness of 0.031”. The
bottom layer provides ground for the RF
transmission lines. The transmission lines were
designed using a coplanar waveguide with ground
plane model using a trace width of 0.0476”, trace
gaps of 0.030”, dielectric thickness of 0.028”,
metal thickness of 0.0021” and εr of 4.4.
J6 provides a means for controlling DC and digital
inputs to the device. Starting from the lower left
pin, the second pin to the right (J6-3) is connected
to the device CTRL input. The fourth pin to the
right (J6-7) is connected to the device VDD input.
Figure 13. Evaluation Board Schematic
Peregrine Specification 102/0110
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ www.psemi.com
Page 5 of 8
PE4245
Product Specification
Figure 14. Package Drawing
6-lead DFN
NOTE: The exposed solder pad (on the bottom of the package) is electrically connected to pin 2 (fused.)
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ UltraCMOS™ RFIC Solutions
Page 6 of 8
PE4245
Product Specification
Figure 15. Tape and Reel Specifications
6-lead DFN
Table 6. Dimensions
Dimension
DFN 3x3 mm
3.23 ± 0.1
3.17 ± 0.1
1.37 ± 0.1
4 ± 0.1
Ao
Bo
Ko
P
W
8 +0.3, -0.1
0.254 ± 0.02
3000
T
R7 Quantity
R13 Quantity
N.A.
Note: R7 = 7 inch Lock Reel, R13 = 13 inch Lock Reel
Table 7. Ordering Information
Order Code
4245-51
Part Marking
4245
Description
Package
Shipping Method
Tape or loose
3000 units / T&R
1 / Box
PE4245G-06DFN 3x3mm-12800F
PE4245G-06DFN 3x3mm-3000C
PE4245-06DFN 3x3mm-EK
Green 6-lead 3x3 mm DFN
Green 6-lead 3x3 mm DFN
Evaluation Kit
4245-52
4245
4245-00
PE4245-EK
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ www.psemi.com
Page 7 of 8
PE4245
Product Specification
Sales Offices
The Americas
North Asia Pacific
Peregrine Semiconductor Corporation
Peregrine Semiconductor K.K.
9380 Carroll Park Drive
San Diego, CA 92121
Tel: 858-731-9400
Teikoku Hotel Tower 10B-6
1-1-1 Uchisaiwai-cho, Chiyoda-ku
Tokyo 100-0011 Japan
Fax: 858-731-9499
Tel: +81-3-3502-5211
Fax: +81-3-3502-5213
Europe
Peregrine Semiconductor, Korea
#B-2402, Kolon Tripolis, #210
Geumgok-dong, Bundang-gu, Seongnam-si
Gyeonggi-do, 463-480 S. Korea
Tel: +82-31-728-4300
Peregrine Semiconductor Europe
Bâtiment Maine
13-15 rue des Quatre Vents
F-92380 Garches, France
Tel: +33-1-47-41-91-73
Fax : +33-1-47-41-91-73
Fax: +82-31-728-4305
South Asia Pacific
Space and Defense Products
Americas:
Peregrine Semiconductor, China
Shanghai, 200040, P.R. China
Tel: +86-21-5836-8276
Tel: 858-731-9453
Fax: +86-21-5836-7652
Europe, Asia Pacific:
180 Rue Jean de Guiramand
13852 Aix-En-Provence Cedex 3, France
Tel: +33(0) 4 4239 3361
Fax: +33(0) 4 4239 7227
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The information in this data sheet is believed to be reliable.
However, Peregrine assumes no liability for the use of this
information. Use shall be entirely at the user’s own risk.
The product is in a formative or design stage. The data
sheet contains design target specifications for product
development. Specifications and features may change in
any manner without notice.
No patent rights or licenses to any circuits described in this
data sheet are implied or granted to any third party.
Preliminary Specification
Peregrine’s products are not designed or intended for use in
devices or systems intended for surgical implant, or in other
applications intended to support or sustain life, or in any
application in which the failure of the Peregrine product could
create a situation in which personal injury or death might occur.
Peregrine assumes no liability for damages, including
consequential or incidental damages, arising out of the use of
its products in such applications.
The data sheet contains preliminary data. Additional data
may be added at a later date. Peregrine reserves the right
to change specifications at any time without notice in order
to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine
decides to change the specifications, Peregrine will notify
customers of the intended changes by issuing a DCN
(Document Change Notice).
The Peregrine name, logo, and UTSi are registered trademarks
and UltraCMOS and HaRP are trademarks of Peregrine
Semiconductor Corp.
©2003-2008 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0104-06 │ UltraCMOS™ RFIC Solutions
Page 8 of 8
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