PE35400A-G [PSEMI]
UltraCMOS Divide-by-4 Prescaler, 3â13.5 GHz;
| 型号： | PE35400A-G |
| 厂家： | 
Peregrine Semiconductor |
| 描述： | UltraCMOS Divide-by-4 Prescaler, 3â13.5 GHz |
| 文件： | 总13页 (文件大小：2388K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PE35400
Document Category: Product Specification
UltraCMOS® Divide-by-4 Prescaler, 3–13.5 GHz
Features
• High frequency support up to 13.5 GHz
Figure 1 • PE35400 Functional Diagram
• Low SSB phase noise of –135 dBc/Hz @
3.025 GHz output frequency
D
Q
D
Q
• Low supply current of 16 mA
• Bare die
Q
Q
Applications
• Wireless communication
• Test and measurement
• Phased array radar
Product Description
The PE35400 is a high-performance UltraCMOS® prescaler with a fixed divide ratio of 4. It supports an operating
frequency range from 3–13.5 GHz. It operates on a single voltage supply with a frequency-selecting bias resistor
and draws a low current of 16 mA. The PE35400 is available in bare die.
The PE35400 is manufactured on Peregrine’s UltraCMOS process, a patented variation of silicon-on-insulator
(SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of
conventional CMOS.
©2015, Peregrine Semiconductor Corporation. All rights reserved. • Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121
Product Specification
DOC-64872-2 – (10/2015)
www.psemi.com
PE35400
Divide-by-4 Prescaler
Absolute Maximum Ratings
Exceeding absolute maximum ratings listed in Table 1 may cause permanent damage. Operation should be
restricted to the limits in Table 2. Operation between operating range maximum and absolute maximum for
extended periods may reduce reliability.
ESD Precautions
When handling this UltraCMOS device, observe the same precautions as with any other ESD-sensitive devices.
Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to
avoid exceeding the rating specified in Table 1.
Latch-up Immunity
Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up.
Table 1 • Absolute Maximum Ratings for PE35400
Parameter/Condition
Min
Max
Unit
Supply voltage, VDD
–0.3
3.3
+14
+150
250
V
dBm
°C
Input power, 50Ω
Storage temperature range
–65
ESD voltage HBM, all pins(*)
V
Note: * Human body model (MIL-STD 883 Method 3015).
Recommended Operating Conditions
Table 2 lists the recommending operating conditions for the PE35400. Devices should not be operated outside
the recommended operating conditions listed below.
Table 2 • Recommended Operating Conditions for PE35400
Parameter
Min
Typ
Max
Unit
Supply voltage, VDD
2.65
2.8
2.95
+7
V
Input power, 50Ω, based on optimal RBIAS (see Figure 3), PIN
Operating temperature range
dBm
°C
–40
+85
Page 2
DOC-64872-2 – (10/2015)
www.psemi.com
PE35400
Divide-by-4 Prescaler
Electrical Specifications
Table 3 provides the PE35400 key electrical specifications @ +25 °C, VDD = 2.8V (ZS = ZL = 50Ω), unless
otherwise specified.
Table 3 • PE35400 Electrical Specifications(*)
Parameter
Condition
Min
Typ
Max
Unit
Operating frequency, FIN
3.0 GHz
13.5 GHz As shown
F
IN = 3–4.5 GHz
FIN = >4.5–11.5 GHz
IN = >11.5–13.5 GHz
–5
–15
–1
0
> –7
> –20
> –7
5
dBm
dBm
dBm
dBm
dBm
dBc/Hz
mA
Input power sensitivity
F
Output power
0.75–3.375 GHz output frequency range
FIN = 3–13.5 GHz, PIN = 0 dBm
Reverse leakage
SSB phase noise
Supply current, IDD
–45
–135
16
3.025 GHz output frequency @ 100 kHz offset, PIN = 0 dBm
FIN = 8 GHz
Note: * All values in Min/Max columns are guaranteed by design characterization.
DOC-64872-2 – (10/2015)
Page 3
www.psemi.com
PE35400
Divide-by-4 Prescaler
Device Functional Considerations
The PE35400 divides a 3.0–13.5 GHz input signal by four, producing a 750 MHz to 3.375 GHz output signal. In
order for the prescaler to work properly, several conditions need to be adhered to. It is crucial that VBYPS and VDD
are supplied with bypass capacitors to ground. In addition, the output signal RFOUT needs to be AC coupled via
an external capacitor, as shown in Figure 2. The input frequency range is selected by the value of RBIAS
according to Figure 3. The ground pattern on the board should be made as wide as possible to minimize ground
impedance.
Figure 2 • Circuit Block Diagram for PE35400(*)
10 pF
RBIAS
GND
RBIAS
VBYPS
0.01 μF
10 pF
VDD
VDD
10 pF
0.01 μF
VBYPS
50Ω
RFOUT
6.8 pF
RFIN
50Ω
GND
Transmission
Line
Die ID
Transmission
Line
Note: * For optimal performance, the following bond wire configuration is recommended. V
: 2 bond wires per pad. RF : 1 bond wire. GND: 3
IN
BYPS
bond wires per pad. RF
: 2 bond wires. V : 2 bond wires. R
: 1 bond wire.
BIAS
OUT DD
Page 4
DOC-64872-2 – (10/2015)
www.psemi.com
PE35400
Divide-by-4 Prescaler
Typical Performance Data
Figure 3 through Figure 11 show the typical performance data @ +25 °C, VDD = 2.8V (ZS = ZL = 50Ω), based on
optimal RBIAS as shown in Figure 3, unless otherwise specified.
Figure 3 • Frequency vs RBIAS
Lower Freq Limit (PIN = 0 dBm)
Optimal Level
Upper Freq Limit (PIN = 0 dBm)
Lower Freq Limit (PIN = -7 dBm)
Upper Freq Limit (PIN = -7 dBm)
16
14
12
10
8
6
4
2
0
5.6
8.2
12
18
27
39
56
RBIAS (kΩ)
DOC-64872-2 – (10/2015)
Page 5
www.psemi.com
PE35400
Divide-by-4 Prescaler
Figure 4 • Input Power Sensitivity
Min PIN
Max PIN
10
5
0
Recommended input power
operating region
-5
-10
-15
-20
RBIAS = 56 kΩ
RBIAS = 5.6 kΩ
-25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Input Frequency (GHz)
4.5 GHz
11.5 GHz
Figure 5 • Input Power Sensitivity vs Temperature
Min PIN -40 °C
Max PIN -40 °C
Min PIN +25 °C
Max PIN +25 °C
Min PIN +85 °C
Max PIN +85 °C
10
5
RBIAS = 56 kΩ
RBIAS = 5.6 kΩ
0
-5
-10
-15
-20
-25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Input Frequency (GHz)
4.5 GHz
11.5 GHz
Page 6
DOC-64872-2 – (10/2015)
www.psemi.com
PE35400
Divide-by-4 Prescaler
Figure 6 • Output Power vs VDD
Output power @ 2.65V
Output power @ 2.8V
Output power @ 2.95V
10
9
8
7
6
5
4
3
2
1
0
2
14
3
4
5
6
7
8
9
10
11
12
13
RBIAS Max
= 56 kΩ
RBIAS Min
= 5.6 kΩ
Input Frequency (GHz)
Figure 7 • Output Power vs Temperature
Output power @ -40 °C
Output power @ +25 °C
Output power @ +85 °C
10
9
8
7
6
5
4
3
2
1
0
2
14
3
4
6
7
8
9
10
11
12
13
RBIAS Max
= 56 kΩ
RBIAS Min
= 5.6 kΩ
Input Frequency (GHz)
DOC-64872-2 – (10/2015)
Page 7
www.psemi.com
PE35400
Divide-by-4 Prescaler
Figure 8 • SSB Phase Noise @ 3.025 GHz Output Frequency, PIN = 0 dBm
SSB Phase Noise @ 3.025 GHz Output Frequency
-125
-130
-135
-140
-145
-150
-155
-160
1.E+05
1.E+06
1.E+07
Offset Frequency (Hz)
Figure 9 • Output Harmonics, PIN = 0 dBm
2nd Harmonic
3rd Harmonic
Feedthru
0
-5
-10
-15
-20
-25
-30
-35
-40
2
4
6
8
10
12
14
Input Frequency (GHz)
Page 8
DOC-64872-2 – (10/2015)
www.psemi.com
PE35400
Divide-by-4 Prescaler
Figure 10 • IDD vs RBIAS
Supply Current
20
19
18
17
16
15
14
13
12
11
10
5.6
8.2
12
18
27
39
56
RBIAS (kΩ)
Figure 11 • Reverse Leakage, PIN = 0 dBm
Reverse Leakage
-20
-30
-40
-50
-60
-70
2
3
4
5
6
7
8
9
10
11
12
13
14
Input Frequency (GHz)
DOC-64872-2 – (10/2015)
Page 9
www.psemi.com
PE35400
Divide-by-4 Prescaler
Pad Configuration
This section provides pad information for the
PE35400. Figure 12 shows the pad configuration of
this device. Table 4 provides a description for each
pad.
Table 4 • Pad Descriptions for PE35400
Pad
Pad No.
Description
Name
VBYPS
VBYPS
RFIN
Figure 12 • Pad Configuration (Top View)
1
2
3
4
5
6
7
8
Prescaler supply bypass
Prescaler supply bypass
RF input
8
GND
7
1
RBIAS
GND
Ground
VBYPS
RFOUT
RF output
6
VDD
VDD
RBIAS
GND
Supply voltage
2
Frequency selecting bias resistor
Ground
VBYPS
5
3
RFOUT
4
GND
RFIN
Die ID
Page 10
DOC-64872-2 – (10/2015)
www.psemi.com
PE35400
Divide-by-4 Prescaler
Die Mechanical Specifications
This section provides the die mechanical specifications for the PE35400.
Table 5 • Mechanical Specifications for PE35400
Parameter
Min
Typ
Max
Unit
Condition
Including excess sapphire, max
tolerance = –20/+30 µm
Die size, singulated (x,y)
866 × 716
180
886 × 736
916 × 766
220
µm
Wafer thickness
Wafer size
200
150
µm
mm
Table 6 • Pad Coordinates for PE35400(*)
Figure 13 • Pad Layout for PE35400(1)(2)
Pad Opening
Size (µm)
Pad Center (µm)
Pad Pad
No. Name
8
GND
7
1
RBIAS
X
Y
X
Y
VBYPS
VBYPS
VBPYS
RFIN
1
2
3
4
5
6
7
8
–303
–303
–303
68
198
–3
160
160
100
290
100
130
130
290
180
180
100
130
190
190
130
130
6
VDD
2
–208
–243
–193
40
VBYPS
GND
5
RFOUT
333
318
318
14
3
RFOUT
4
RFIN
VDD
RBIAS
GND
GND
Die ID
243
243
886 μm (−20 / +30 μm)
Notes:
1) Drawings are not drawn to scale.
Note: * All pad locations originate from the die center and refer to the
2) Singulated die size shown, pad side up.
center of the pad.
DOC-64872-2 – (10/2015)
Page 11
www.psemi.com
PE35400
Divide-by-4 Prescaler
Waffle Pack Information
Figure 14 provides the waffle pack information for the PE35400.
Figure 14 • 2 × 2 Inch Waffle Pack for PE35400(1)(2)(3)
Notch
Pocket Closeup
Pad 1
Die ID
Notes:
1) Drawings are not drawn to scale.
2) Die in pocket shown pad side up.
3) Die will be oriented in the same direction in and within all waffle packs. Unless otherwise stated, die will be oriented such that the top left corner
of die will be in-line with the "notched" corner of the die plate base and corner. The die base cover label will be affixed on the die base cover
such that the top of the label indicates the top of the die within the waffle pack.
Page 12
DOC-64872-2 – (10/2015)
www.psemi.com
PE35400
Divide-by-4 Prescaler
Ordering Information
Table 7 lists the available ordering code for the PE35400 as well as available shipping method.
Table 7 • Order Code for PE35400
Order Codes
Description
Packaging
Shipping Method
PE35400A–G
PE35400 die
Die in 2 × 2 inch waffle pack
100 die/waffle pack
Document Categories
Advance Information
The product is in a formative or design stage. The datasheet contains
design target specifications for product development. Specifications
and features may change in any manner without notice.
Product Brief
This document contains a shortened version of the datasheet. For the
full datasheet, contact sales@psemi.com.
Not Recommended for New Designs (NRND)
This product is in production but is not recommended for new designs.
Preliminary Specification
The datasheet contains preliminary data. Additional data may be added
at a later date. Peregrine reserves the right to change specifications at
any time without notice in order to supply the best possible product.
End of Life (EOL)
This product is currently going through the EOL process. It has a
specific last-time buy date.
Product Specification
The datasheet contains final data. In the event Peregrine decides to
change the specifications, Peregrine will notify customers of the
intended changes by issuing a CNF (Customer Notification Form).
Obsolete
This product is discontinued. Orders are no longer accepted for this
product.
Sales Contact
For additional information, contact Sales at sales@psemi.com.
Disclaimers
The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be
entirely at the user’s own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to
support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death
might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in
such applications.
Patent Statement
Peregrine products are protected under one or more of the following U.S. patents: patents.psemi.com
Copyright and Trademark
©2015, Peregrine Semiconductor Corporation. All rights reserved. The Peregrine name, logo, UTSi and UltraCMOS are registered trademarks and
HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp.
Product Specification
www.psemi.com
DOC-64872-2 – (10/2015)
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