PE43701MLI [PSEMI]

50 Ω RF Digital Attenuator 7-bit, 31.75 dB, DC-4.0 GHz; 50 Ω RF数字衰减器7位, 31.75分贝, DC- 4.0 GHz的
PE43701MLI
型号: PE43701MLI
厂家: Peregrine Semiconductor    Peregrine Semiconductor
描述:

50 Ω RF Digital Attenuator 7-bit, 31.75 dB, DC-4.0 GHz
50 Ω RF数字衰减器7位, 31.75分贝, DC- 4.0 GHz的

射频 微波 衰减器
文件: 总13页 (文件大小:405K)
中文:  中文翻译
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Product Specification  
PE43701  
50 RF Digital Attenuator  
7-bit, 31.75 dB, DC-4.0 GHz  
Product Description  
Features  
The PE43701 is a HaRP-enhanced, high linearity, 7-bit RF  
Digital Step Attenuator (DSA). This highly versatile DSA  
covers a 31.75 dB attenuation range in 0.25 dB steps. The  
Peregrine 50RF DSA provides a parallel or serial-  
addressable CMOS control interface. It maintains high  
attenuation accuracy over frequency and temperature and  
exhibits very low insertion loss and low power consumption.  
Performance does not change with Vdd due to on-board  
regulator. This next generation Peregrine DSA is available in a  
5x5 mm 32-lead QFN footprint.  
HaRP™-enhanced UltraCMOS™ device  
Attenuation: 0.25 dB steps to 31.75 dB  
High Linearity: Typical +59 dBm IIP3  
Excellent low-frequency performance  
3.3 V or 5.0 V Power Supply Voltage  
Fast switch settling time  
Programming Modes:  
Direct Parallel  
Latched Parallel  
Serial-Addressable: Program up to  
eight addresses 000 - 111  
The PE43701 is manufactured on Peregrine’s UltraCMOS™  
process, a patented variation of silicon-on-insulator (SOI)  
technology on a sapphire substrate, offering the performance  
of GaAs with the economy and integration of conventional  
CMOS.  
High-attenuation state @ power-up (PUP)  
CMOS Compatible  
Figure 1. Package Type  
No DC blocking capacitors required  
Packaged in a 32-lead 5x5x0.85 mm QFN  
32-lead 5x5x0.85 mm QFN Package  
Figure 2. Functional Schematic Diagram  
Switched Attenuator Array  
RF Input  
RF Output  
7
Parallel Control  
Serial In  
Control Logic Interface  
CLK  
LE  
A0  
A1  
A2  
P/S  
Document No. 70-0243-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 1 of 13  
PE43701  
Product Specification  
Table 1. Electrical Specifications @ +25°C, VDD = 3.3 V or 5.0 V  
Parameter  
Test Conditions  
Frequency  
Min  
Typical  
Max  
Units  
Frequency Range  
Attenuation Range  
Insertion Loss  
DC – 4  
0 – 31.75  
1.9  
GHz  
dB  
0.25 dB Step  
DC 4 GHz  
2.4  
dB  
±(0.2+1.5%)  
±(0.15+4%)  
±(0.25+4.5%)  
0 dB - 7.75 dB Attenuation settings  
8 dB - 31.75 dB Attenuation settings  
0 dB - 31.75 dB Attenuation settings  
DC < 3 GHz  
DC < 3 GHz  
3 GHz 4 GHz  
dB  
dB  
dB  
Attenuation Error  
Return Loss  
DC - 4 GHz  
DC - 4 GHz  
20 MHz - 4 GHz  
20 MHz - 4 GHz  
1MHz  
18  
44  
dB  
deg  
Relative Phase  
P1dB  
All States  
Input  
30  
32  
dBm  
dBm  
dBm  
mVpp  
IIP3  
Two tones at +18 dBm, 20 MHz spacing  
59  
Typical Spurious Value  
Video Feed Through  
-110  
10  
Switching Time  
RF Trise/Tfall  
50% DC CTRL to 10% / 90% RF  
10% / 90% RF  
650  
400  
ns  
ns  
RF settled to within 0.05 dB of final value  
RBW = 5 MHz, Averaging ON.  
Settling Time  
4
25  
µs  
Performance Plots  
Figure 3. 0.25 dB Step Error vs. Frequency*  
Figure 4. 0.25dB Attenuation vs. Attenuation  
200 MHz  
900 MHz  
1800 MHz  
2200 MHz  
3000 MHz  
35  
0.500  
0.400  
0.300  
0.200  
0.100  
0.000  
900 MHz  
1800 MHz  
30  
2200 MHz  
3800 MHz  
25  
20  
15  
10  
5
0
0.0  
4.0  
8.0  
12.0  
16.0  
20.0  
24.0  
28.0  
32.0  
0
5
10  
15  
20  
25  
30  
35  
Attenuation Setting (dB.)  
Attenuation State  
*Monotonicity is held so long as Step-Error does not cross zero  
Figure 6. 0.25 dB Attenuation Error vs. Frequency  
Figure 5. 0.25 dB Major State Bit Error  
0.25dB State  
4dB State  
0.5 dB State  
8dB State  
1dB State  
2dB State  
200 MHz  
2200 MHZ  
900 MHz  
3000 MHz  
1800 MHz  
4000 MHz  
16dB State  
31.75dB State  
1.500  
1.000  
0.500  
0.000  
-0.500  
-1.000  
-1.500  
2.00  
1.50  
1.00  
0.50  
0.00  
-0.50  
-1.00  
-1.50  
-2.00  
0.0  
4.0  
8.0  
12.0  
16.0  
20.0  
24.0  
28.0  
32.0  
0.0  
1.0  
2.0  
Frequency (GHz)  
3.0  
4.0  
Attenuation Setting (dB.)  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0243-04 UltraCMOS™ RFIC Solutions  
Page 2 of 13  
PE43701  
Product Specification  
Figure 7. Insertion Loss vs. Temperature  
Figure 8. Input Return Loss vs. Attenuation:  
T = +25C  
0dB  
4dB  
0.25dB  
8dB  
0.5dB  
16dB  
1dB  
31.75dB  
2dB  
-40C  
+25C  
+85C  
0
-0.5  
-1  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-1.5  
-2  
-2.5  
-3  
-3.5  
-4  
-4.5  
-5  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
Frequency (GHz)  
0
1
2
3
4
5
6
7
8
9
Frequency (GHz.)  
Figure 10. Input Return Loss vs. Temperature:  
16dB State  
Figure 9. Output Return Loss vs. Attenuation:  
T = +25C  
0dB  
4dB  
0.25dB  
8dB  
0.5dB  
16dB  
1dB  
31.75dB  
2dB  
-40C  
25C  
85C  
0
-10  
-20  
-30  
-40  
-50  
-60  
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
Frequency (GHz.)  
Frequency (GHz.)  
Figure 12. Relative Phase vs. Frequency  
Figure 11. Output Return Loss vs. Temperature:  
16dB State  
0dB  
4dB  
0.25dB  
8dB  
0.5dB  
16dB  
1dB  
31.75dB  
2dB  
-40C  
25C  
85C  
120  
100  
80  
60  
40  
20  
0
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
-50  
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
Frequency (GHz.)  
Frequency (GHz.)  
Document No. 70-0243-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 3 of 13  
PE43701  
Product Specification  
Figure 13. Relative Phase vs. Temperature:  
31.75dB State  
Figure 14. Attenuation Error vs. Attenuation  
Setting: 900 MHz  
900 MHz @ T=+25 C  
900 MHz @ T= -40C  
900 MHz @ T= +85C  
900 MHz  
1800 MHz  
3000 MHz  
0.500  
0.300  
35.00  
30.00  
25.00  
20.00  
15.00  
10.00  
5.00  
0.100  
-0.100  
-0.300  
-0.500  
0.00  
-40  
-20  
0
20  
40  
60  
80  
0.0  
4.0  
8.0  
12.0  
16.0  
20.0  
24.0  
28.0  
32.0  
Attenuation Setting (dB.)  
Temperature (Deg. C.)  
Figure 16. Attenuation Error vs. Attenuation  
Setting: 3000 MHz  
Figure 15. Attenuation Error vs. Attenuation  
Setting: 1800 MHz  
1800 MHz @ T= +25C  
1800 MHz @ T= -40C  
1800 MHz @ T= +85C  
3000 MHz@ T= +25C  
3000 MHz @ T= -40C  
3000 MHz@ T= +85C  
0.500  
0.300  
0.100  
-0.100  
-0.300  
-0.500  
0.500  
0.300  
0.100  
-0.100  
-0.300  
-0.500  
0.0  
4.0  
8.0  
12.0  
16.0  
20.0  
24.0  
28.0  
32.0  
0.0  
4.0  
8.0  
12.0  
16.0  
20.0  
24.0  
28.0  
32.0  
Attenuation Setting (dB.)  
Attenuation Setting (dB.)  
Figure 17. Input IP3 vs. Frequency  
0dB  
4dB  
0.25dB  
8dB  
0.5dB  
16dB  
1dB  
31.75dB  
2dB  
70  
65  
60  
55  
50  
45  
40  
35  
30  
0
500  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
4500  
Frequency (MHz.)  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0243-04 UltraCMOS™ RFIC Solutions  
Page 4 of 13  
PE43701  
Product Specification  
Figure 18. Pin Configuration (Top View)  
Electrostatic Discharge (ESD) Precautions  
When handling this UltraCMOS™ device, observe the  
same precautions that you would use with other ESD-  
sensitive devices. Although this device contains  
circuitry to protect it from damage due to ESD,  
precautions should be taken to avoid exceeding the  
specified rating.  
32 31 30 29 28 27 26 25  
NC  
VDD  
CLK  
LE  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
P/S  
A1  
Latch-Up Avoidance  
A0  
A2  
Exposed  
Unlike conventional CMOS devices, UltraCMOS™  
devices are immune to latch-up.  
GND  
GND  
RF1  
GND  
GND  
GND  
RF2  
GND  
Solder pad  
Moisture Sensitivity Level  
The Moisture Sensitivity Level rating for the PE43701 in  
the 5x5 QFN package is MSL1.  
9
10 11 12 13 14 15 16  
Switching Frequency  
The PE43701 has a maximum 25 kHz switching rate.  
Switching rate is defined to be the speed at which the  
DSA can be toggled across attenuation states.  
Table 2. Pin Descriptions  
Pin No.  
Pin Name  
Description  
Exposed Solder Pad Connection  
1
2
3
4
N/C  
VDD  
P/S  
A0  
No Connect  
The exposed solder pad on the bottom of the package  
must be grounded for proper device operation.  
Power supply pin  
Serial/Parallel mode select  
Address Bit A0 (LSB)  
5, 6, 8-17,  
19, 20  
GND  
Ground  
7
18  
RF1  
RF2  
A2  
RF1 port  
RF2 port  
21  
Address Bit A2  
22  
A1  
Address Bit A1  
23  
LE  
Latch Enable input  
24  
CLK  
SI  
Serial interface clock input  
Serial Interface input  
Attenuation control bit, 16 dB  
Attenuation control bit, 8 dB  
Attenuation control bit, 4 dB  
Attenuation control bit, 2 dB  
Attenuation control bit, 1 dB  
Attenuation control bit, 0.5 dB  
Attenuation control bit, 0.25 dB  
Ground for proper operation  
25  
26  
C16  
C8  
27  
28  
C4  
29  
C2  
30  
C1  
31  
C0.5  
C0.25  
GND  
32  
Paddle  
Document No. 70-0243-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 5 of 13  
PE43701  
Product Specification  
Table 3. Operating Ranges  
Table 4. Absolute Maximum Ratings  
Parameter  
Min  
Typ  
3.3  
5.0  
70  
Max  
Units  
V
Symbol  
VDD  
Parameter/Conditions  
Power supply voltage  
Min  
-0.3  
-0.3  
Max  
6.0  
Units  
V
DD Power Supply Voltage  
DD Power Supply Voltage  
3.0  
V
V
V
5.5  
350  
5.5  
V
VI  
Voltage on any Digital input  
5.8  
Input power (50)  
1 Hz 20 MHz  
IDD Power Supply Current  
Digital Input High  
µA  
V
PIN  
TST  
See fig. 19 dBm  
20 MHz 4 GHz  
+23  
dBm  
2.6  
Storage temperature range  
-65  
150  
°C  
P
IN Input power (50):  
1 Hz 20 MHz  
20 MHz 4 GHz  
See fig. 19  
dBm  
dBm  
+23  
ESD voltage (HBM)1  
ESD voltage (Machine Model)  
500  
100  
V
V
VESD  
T
OP Operating temperature  
-40  
0
25  
85  
°C  
range  
Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7)  
Digital Input Low  
1
V
Exceeding absolute maximum ratings may cause  
permanent damage. Operation should be restricted to  
the limits in the Operating Ranges table. Operation  
between operating range maximum and absolute  
maximum for extended periods may reduce reliability.  
Digital Input Leakage1  
15  
µA  
Note 1. Input leakage current per Control pin  
Figure 19. Maximum Power Handling Capability: Z0 = 50 Ω  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
0.0  
1.0E+03  
1.0E+04  
1.0E+05  
1.0E+06  
1.0E+07  
1.0E+08  
1.0E+09  
Hz  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0243-04 UltraCMOS™ RFIC Solutions  
Page 6 of 13  
PE43701  
Product Specification  
Table 5. Control Voltage  
Table 8. Address Word Truth Table  
State  
Bias Condition  
Address Word  
Address  
Setting  
A7  
(MSB)  
0 to +1.0 Vdc at 2 µA (typ)  
Low  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
+2.6 to +5 Vdc at 10 µA (typ)  
High  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
L
L
L
L
L
H
L
000  
001  
010  
011  
100  
101  
110  
111  
L
H
H
L
Table 6. Latch and Clock Specifications  
L
H
L
H
H
H
H
Shift Clock  
Latch Enable  
Function  
L
H
L
0
Shift Register Clocked  
H
H
Contents of shift register  
transferred to attenuator core  
X
H
Table 7. Parallel Truth Table  
Table 9. Attenuation Word Truth Table  
Attenuation Word  
Parallel Control Setting  
Attenuation  
Setting  
RF1-RF2  
Attenuation  
Setting  
RF1-RF2  
D0  
(LSB)  
D6  
D7  
D5  
D4  
D3  
D2  
D1  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
X
X
X
X
X
X
X
X
X
L
L
L
L
L
L
L
H
H
L
L
L
L
L
L
H
L
H
L
L
L
L
L
H
L
L
H
L
L
L
L
H
L
L
L
H
L
L
L
H
L
L
L
L
H
L
L
H
L
L
L
L
L
H
L
H
L
L
L
L
L
L
H
Reference I.L.  
0.25 dB  
0.5 dB  
1 dB  
L
L
L
L
L
L
L
H
H
L
L
L
L
L
L
H
L
H
L
L
L
L
L
H
L
L
H
L
L
L
L
H
L
L
L
H
L
L
L
H
L
L
L
L
H
L
L
H
L
L
L
L
L
H
L
H
L
L
L
L
L
L
H
Reference I.L.  
0.25 dB  
0.5 dB  
1 dB  
2 dB  
2 dB  
4 dB  
4 dB  
8 dB  
8 dB  
16 dB  
16 dB  
31.75 dB  
31.75 dB  
Table 10. Serial-Addressable Register Map  
Bits can either be set to logic high or logic low  
MSB (last in)  
LSB (first in)  
Q15  
Q14  
A6  
Q13  
Q12  
Q11  
Q10  
Q9  
Q8  
Q7  
Q6  
Q5  
Q4  
D4  
Q3  
D3  
Q2  
D2  
Q1  
Q0  
A7  
A5  
A4  
A3  
A2  
A1  
A0  
D7  
D6  
D5  
D1  
D0  
Address Word  
Attenuation Word  
Attenuation Word is derived directly from the attenuation value. For example, to program the 18.25 dB state  
at address 3:  
Address word: XXXXX011  
Attenuation Word: Multiply by 4 and convert to binary 4 * 18.25 dB 73 X1001001  
Serial Input: XXXXX011X1001001  
Document No. 70-0243-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 7 of 13  
PE43701  
Product Specification  
Programming Options  
The serial-addressable interface is controlled  
Parallel/Serial Selection  
using three CMOS-compatible signals: Serial-In  
(SI), Clock (CLK), and Latch Enable (LE). The SI  
and CLK inputs allow data to be serially entered  
into the shift register. Serial data is clocked in  
LSB first, beginning with the attenuation word.  
Either a parallel or serial interface can be used to  
control the PE43701. The P/S bit provides this  
selection, with P/S=LOW selecting the parallel  
interface and P/S=HIGH selecting the serial  
interface.  
The shift register must be loaded while LE is held  
LOW to prevent the attenuator value from  
Parallel Mode Interface  
The parallel interface consists of seven CMOS-  
compatible control lines that select the desired  
attenuation state, as shown in Table 7.  
changing as data is entered. The LE input should  
then be toggled HIGH and brought LOW again,  
latching the new data into the DSA. Address word  
and attenuation word truth tables are listed in  
Table 8 & Table 9, respectively. A programming  
example of the serial-addressable register is  
illustrated in Table 10. The serial-addressable  
timing diagram is illustrated in Fig. 20.  
The parallel interface timing requirements are  
defined by Fig. 21 (Parallel Interface Timing  
Diagram), Table 12 (Parallel Interface AC  
Characteristics), and switching speed (Table 1).  
For latched-parallel programming the Latch  
Enable (LE) should be held LOW while changing  
attenuation state control values, then pulse LE  
HIGH to LOW (per Fig. 21) to latch new  
attenuation state into device.  
Power-up Control Settings  
The PE43701 will always initialize to the maximum  
attenuation setting (31.75 dB) on power-up for  
both the serial-addressable and latched-parallel  
modes of operation and will remain in this setting  
until the user latches in the next programming  
word. In direct-parallel mode, the DSA can be  
preset to any state within the 31.75 dB range by  
pre-setting the parallel control pins prior to power-  
up. In this mode, there is a 400-µs delay between  
the time the DSA is powered-up to the time the  
desired state is set. During this power-up delay,  
the device attenuates to the maximum attenuation  
setting (31.75 dB) before defaulting to the user  
defined state. If the control pins are left floating in  
this mode during power-up, the device will default  
to the minimum attenuation setting (insertion loss  
state).  
For direct parallel programming, the Latch Enable  
(LE) line should be pulled HIGH. Changing  
attenuation state control values will change device  
state to new attenuation. Direct Mode is ideal for  
manual control of the device (using hardwire,  
switches, or jumpers).  
Serial-Addressable Interface  
The serial-addressable interface is a 16-bit serial-  
in, parallel-out shift register buffered by a  
transparent latch. The 16-bits make up two words  
comprised of 8-bits each. The first word is the  
Attenuation Word, which controls the state of the  
DSA. The second word is the Address Word,  
which is compared to the static (or programmed)  
logical states of the A0, A1 and A2 digital inputs. If  
there is an address match, the DSA changes  
state; otherwise its current state will remain  
unchanged. Fig. 20 illustrates a example timing  
diagram for programming a state. It is  
recommended that all parallel control inputs be  
grounded when the DSA is used in Serial Mode.  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0243-04 UltraCMOS™ RFIC Solutions  
Page 8 of 13  
PE43701  
Product Specification  
Figure 20. Serial-Addressable Timing Diagram  
Bits can either be set to logic high or logic low  
DI[6:0]  
ADD[2:0]  
P/S  
TDISU  
VALID  
TASU  
TDIH  
TAH  
TPSSU  
TPSH  
D[0]  
D[1]  
TCLKL  
D[2]  
D[3]  
D[4]  
D[5]  
D[6]  
A[0]  
A[1]  
A[2]  
SI  
TSISU  
TSIH  
CLK  
LE  
TCLKH  
TLESU  
TLEPW  
TPD  
VALID  
DO[6:0]  
Figure 21. Latched-Parallel/Direct-Parallel Timing Diagram  
P/S  
TPSSU  
TPSH  
VALID  
DI[6:0]  
TDISU  
TDIH  
LE  
TLEPW  
VALID  
TPD  
DO[6:0]  
TDIPD  
Table 11. Serial Interface AC Characteristics  
VDD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified  
Table 12. Parallel and Direct Interface AC  
Characteristics  
VDD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified  
Symbol  
Parameter  
Min Max Unit  
FCLK  
TCLKH  
TCLKL  
Serial clock frequency  
Serial clock HIGH time  
Serial clock LOW time  
-
10  
-
MHz  
ns  
Symbol  
Parameter  
Min Max Unit  
30  
30  
Latch Enable minimum  
pulse width  
TLEPW  
30  
-
ns  
-
ns  
Last serial clock rising edge  
setup time to Latch Enable  
rising edge  
TDISU  
TDIH  
TPSSU  
TPSIH  
Parallel data setup time  
Parallel data hold time  
Parallel/Serial setup time  
Parallel/Serial hold time  
100  
100  
100  
100  
-
-
-
-
ns  
ns  
ns  
ns  
TLESU  
10  
-
ns  
TLEPW  
TSISU  
TSIH  
Latch Enable min. pulse width  
Serial data setup time  
Serial data hold time  
30  
10  
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
10  
-
TDISU  
TDIH  
Parallel data setup time  
Parallel data hold time  
Address setup time  
100  
100  
100  
100  
100  
100  
-
-
Digital register delay  
(internal)  
TPD  
-
-
10  
5
ns  
ns  
-
Digital register delay  
(internal, direct mode only)  
TASU  
TAH  
-
TDIPD  
Address hold time  
-
TPSSU  
TPSH  
TPD  
Parallel/Serial setup time  
Parallel/Serial hold time  
Digital register delay (internal)  
-
-
10  
Note:  
fClk is verified during the functional pattern test. Serial  
programming sections of the functional pattern are clocked  
at 10 MHz to verify fclk specification.  
Document No. 70-0243-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 9 of 13  
PE43701  
Product Specification  
Figure 22. Evaluation Board Layout  
Peregrine Specification 101-0312  
Evaluation Kit  
The Digital Attenuator Evaluation Kit board was  
designed to ease customer evaluation of the  
PE43701 Digital Step Attenuator.  
Direct-Parallel Programming Procedure  
For automated direct-parallel programming,  
connect the test harness provided with the EVK  
from the parallel port of the PC to the J1 & Serial  
header pin and set the D0-D6 SP3T switches to the  
‘MIDDLE’ toggle position. Position the Parallel/  
Serial (P/S) select switch to the Parallel (or left)  
position. The evaluation software is written to  
operate the DSA in either Parallel or Serial-  
Addressable Mode. Ensure that the software is set  
to program in Direct-Parallel mode. Using the  
software, enable or disable each setting to the  
desired attenuation state. The software  
Note: Reference Fig. 23 for Evaluation Board Schematic  
automatically programs the DSA each time an  
attenuation state is enabled or disabled.  
Serial-Addressable Programming Procedure  
Position the Parallel/Serial (P/S) select switch to  
the Serial (or right) position. Prior to  
For manual direct-parallel programming,  
disconnect the test harness provided with the EVK  
from the J1 and Serial header pins. Position the  
Parallel/Serial (P/S) select switch to the Parallel (or  
left) position. The LE pin on the Serial header must  
be tied to VDD. Switches D0-D6 are SP3T switches  
which enable the user to manually program the  
parallel bits. When any input D0-D6 is toggled  
‘UP’, logic high is presented to the parallel input.  
When toggled ‘DOWN’, logic low is presented to  
the parallel input. Setting D0-D6 to the ‘MIDDLE’  
toggle position presents an OPEN, which forces an  
on-chip logic low. Table 9 depicts the parallel  
programming truth table and Fig. 21 illustrates the  
parallel programming timing diagram.  
programming, the user must define an address  
setting using the ADD header pin. Jump the  
middle pins on the ADD header A0-A2 (or lower)  
row of pins to set logic high, or jump the middle  
pins to the upper row of pins to set logic low. If  
the ADD pins are left open, then 000 become the  
default address. The evaluation software is  
written to operate the DSA in either Parallel or  
Serial-Addressable Mode. Ensure that the  
software is set to program in Serial-Addressable  
mode. Using the software, enable or disable each  
setting to the desired attenuation state. The  
software automatically programs the DSA each  
time an attenuation state is enabled or disabled.  
Latched-Parallel Programming Procedure  
For automated latched-parallel programming, the  
procedure is identical to the direct-parallel method.  
The user only must ensure that Latched-Parallel is  
selected in the software.  
For manual latched-parallel programming, the  
procedure is identical to direct-parallel except now  
the LE pin on the Serial header must be logic low  
as the parallel bits are applied. The user must then  
pulse LE from 0V to VDD and back to 0V to latch the  
programming word into the DSA. LE must be logic  
low prior to programming the next word.  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0243-04 UltraCMOS™ RFIC Solutions  
Page 10 of 13  
PE43701  
Product Specification  
Figure 23. Evaluation Board Schematic  
Peregrine Specification 102-0381  
Note: Capacitors C1-C8, C13, & C14 may be omitted.  
Figure 24. Package Drawing  
QFN 5x5 mm  
MAX  
NOM  
MIN  
0.900  
0.850  
0.800  
A
Document No. 70-0243-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 11 of 13  
PE43701  
Product Specification  
Figure 25. Tape and Reel Drawing  
Tape Feed Direction  
Pin 1  
Top of  
Device  
Device Orientation in Tape  
Figure 26. Marking Specifications  
43701  
YYWW  
ZZZZZ  
YYWW = Date Code  
ZZZZZ = Last five digits of Lot Number  
Table 13. Ordering Information  
Order Code Part Marking  
Description  
Package  
Shipping Method  
Bulk or tape cut from reel  
3000 units / T&R  
PE43701MLI  
PE43701MLI-Z  
EK43701-01  
43701  
43701  
43701  
PE43701 G - 32QFN 5x5mm-75A  
PE43701 G – 32QFN 5x5mm-3000C  
PE43701 G – 32QFN 5x5mm-EK  
Green 32-lead 5x5mm QFN  
Green 32-lead 5x5mm QFN  
Evaluation Kit  
1 / Box  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0243-04 UltraCMOS™ RFIC Solutions  
Page 12 of 13  
PE43701  
Product Specification  
Sales Offices  
The Americas  
Peregrine Semiconductor Corporation  
Peregrine Semiconductor, Asia Pacific (APAC)  
Shanghai, 200040, P.R. China  
Tel: +86-21-5836-8276  
Fax: +86-21-5836-7652  
9380 Carroll Park Drive  
San Diego, CA 92121  
Tel: 858-731-9400  
Fax: 858-731-9499  
Peregrine Semiconductor, Korea  
#B-2607, Kolon Tripolis, 210  
Geumgok-dong, Bundang-gu, Seongnam-si  
Gyeonggi-do, 463-943 South Korea  
Tel: +82-31-728-3939  
Europe  
Peregrine Semiconductor Europe  
Bâtiment Maine  
Fax: +82-31-728-3940  
13-15 rue des Quatre Vents  
F-92380 Garches, France  
Tel: +33-1-4741-9173  
Fax : +33-1-4741-9173  
Peregrine Semiconductor K.K., Japan  
Teikoku Hotel Tower 10B-6  
1-1-1 Uchisaiwai-cho, Chiyoda-ku  
Tokyo 100-0011 Japan  
Tel: +81-3-3502-5211  
Fax: +81-3-3502-5213  
High-Reliability and Defense Products  
Americas  
San Diego, CA, USA  
Phone: 858-731-9475  
Fax: 848-731-9499  
Europe/Asia-Pacific  
Aix-En-Provence Cedex 3, France  
Phone: +33-4-4239-3361  
Fax: +33-4-4239-7227  
For a list of representatives in your area, please refer to our Web site at: www.psemi.com  
Data Sheet Identification  
Advance Information  
The information in this data sheet is believed to be reliable.  
However, Peregrine assumes no liability for the use of this  
information. Use shall be entirely at the user’s own risk.  
The product is in a formative or design stage. The data  
sheet contains design target specifications for product  
development. Specifications and features may change in  
any manner without notice.  
No patent rights or licenses to any circuits described in this  
data sheet are implied or granted to any third party.  
Preliminary Specification  
Peregrine’s products are not designed or intended for use in  
devices or systems intended for surgical implant, or in other  
applications intended to support or sustain life, or in any  
application in which the failure of the Peregrine product could  
create a situation in which personal injury or death might occur.  
Peregrine assumes no liability for damages, including  
consequential or incidental damages, arising out of the use of  
its products in such applications.  
The data sheet contains preliminary data. Additional data  
may be added at a later date. Peregrine reserves the right  
to change specifications at any time without notice in order  
to supply the best possible product.  
Product Specification  
The data sheet contains final data. In the event Peregrine  
decides to change the specifications, Peregrine will notify  
customers of the intended changes by issuing a DCN  
(Document Change Notice).  
The Peregrine name, logo, and UTSi are registered trademarks  
and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks  
of Peregrine Semiconductor Corp.  
Document No. 70-0243-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 13 of 13  

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