PE9304_06 [PSEMI]
1 GHz - 7 GHz Low Power UltraCMOS Divide-by-2 Prescaler Rad-hard for Space Applications; 1千兆赫 - 7 GHz的低功耗的UltraCMOS分频预分频器抗辐射的空间应用
| 型号： | PE9304_06 |
| 厂家： | 
Peregrine Semiconductor |
| 描述： | 1 GHz - 7 GHz Low Power UltraCMOS Divide-by-2 Prescaler Rad-hard for Space Applications |
| 文件： | 总6页 (文件大小：214K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product Specification
PE9304
1 GHz - 7 GHz Low Power UltraCMOS™
Divide-by-2 Prescaler
Rad-hard for Space Applications
Product Description
The PE9304 is a high-performance UltraCMOS™ prescaler
with a fixed divide ratio of 2. Its operating frequency range is
1000 MHz to 7000 MHz. The PE9304 operates on a nominal
3 V supply and draws only 13.5 mA. It is packaged in a small
8-lead ceramic SOIC and is ideal for frequency scaling and
clock generation solutions.
Features
• Fixed divide ratio of 2
• Low-power operation: 13.5 mA typical
@ 3 V
• Small package: 8-lead Ceramic SOIC
The PE9301 is manufactured on Peregrine’s UltraCMOS™
process, a patented variation of silicon-on-insulator (SOI)
technology on a sapphire substrate, offering the performance
of GaAs with the economy and integration of conventional
CMOS.
• Guaranteed 100 Krads(Si) Total Dose
Performance
• Superior Single Event Upset Immunity
Figure 1. Functional Diagram
Figure 2. Package Type
8-lead CSOIC
D
Q
F
OUT
CLK
DEC
F
IN
DRIVER
OUTPUT BUFFER
QB
I
PREAMP
OFF-CHIP
BYPASS
Table 1. Electrical Specifications (ZS = ZL = 50 Ω)
VDD = 3.0 V, -40° C ≤ TA ≤ 85° C, unless otherwise specified
Parameter
Conditions
Minimum
Typical
Maximum
Units
V
Supply Voltage
2.85
3.0
3.15
18.0
7
Supply Current
13.5
mA
Input Frequency (FIN)
1
+5
0
GHz
1000 MHz ≤ FIN < 2000 MHz
2000 MHz ≤ FIN < 6000 MHz
6000 MHz ≤ FIN ≤ 7000 MHz
1000 MHz ≤ FIN < 2000 MHz
2000 MHz ≤ FIN < 6000 MHz
6000 MHz ≤ FIN ≤ 7000 MHz
+12
+12
+12
dBm
dBm
dBm
dBm
Input Sensitivity (PIN)
+5
0
Output Power (POUT
)
-7
-12
Document No. 70-0152-02 │ www.psemi.com
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.
Page 1 of 7
PE9304
Product Specification
Figure 3. Pin Configuration
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rating specified in Table 3.
1
2
3
4
8
7
6
5
VDD
IN
GND
OUT
NC
PE9304
DEC
GND
GND
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Table 2. Pin Descriptions
Pin
Pin No.
Description
Name
Device Functional Considerations
Power supply pin. Bypassing is required
(eg. 1000pF & 100pF).
1
2
3
VDD
IN
The PE9304 divides a 1000 MHz – 7000 MHz
input signal by a factor of two thereby producing
an output frequency at half the input frequency. To
work properly at higher frequencies, the input and
output signals (pins 2 & 7) must be AC coupled
via an external capacitor, as shown in the test
circuit in Figure 5.
Input signal pin. Should be coupled with a
capacitor (eg. 2.2pF).
Decoupling Pin. This pin should have two
capacitors in parallel (eg. 1000pf, 10nF)
DEC
Ground pin. Ground pattern on the board
should be as wide as possible to reduce
ground impedance.
4
GND
5
6
GND
NC
Ground pin.
The ground pattern on the board should be made
as wide as possible to minimize ground
impedance.
No connection. This pin should be left
open.
Divided frequency output pin. This pin
should be coupled with a capacitor
(eg. 2.2pF).
7
8
OUT
GND
Ground Pin.
Table 3. Absolute Maximum Ratings
Symbol
VDD
Parameter/Conditions
Supply voltage
Min Max Units
3.3
V
Pin
Input Power
+12
dBm
VDD
+0.3
VIN
Voltage on input
-0.3
V
TST
TOP
Storage temperature range
Operating temperature range
-65
-40
150
85
°C
°C
ESD voltage (Human Body
Model, MIL-STD 883 Method
3015.7)
ESD voltage (Machine Model,
JEDEC, JESD22-A114-B)
500
50
V
V
V
VESD
ESD voltage (Charged Device
Model, JEDEC, JESD22-
C101)
1000
Absolute Maximum Ratings are those values
listed in the above table. Exceeding these values
may cause permanent device damage.
Functional operation should be restricted to the
limits in the DC Electrical Specifications table.
Exposure to absolute maximum ratings for
extended periods may affect device reliability.
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0152-02 │ UltraCMOS™ RFIC Solutions
Page 2 of 7
PE9304
Product Specification
Figure 4. Evaluation Board Layout
Peregrine specification 101/0034
Evaluation Kit Operation
The Ceramic SOIC Prescaler Evaluation Board was
designed to help customers evaluate the PE9304
divide-by-2 prescaler. On this board, the device
input (pin 2) is connected to the SMA connector J1
through a 50 ꢀ transmission line. A series capacitor
(C3) provides the necessary DC block for the device
input. A value of 2.2 pF was used for the evaluation
board; other applications may require a different
value.
The device output (pin 7) is connected to SMA
connector J3 through a 50 ꢀ transmission line. A
series capacitor (C1) provides the necessary DC
block for the device output. This capacitor value
must be chosen to have low impedance at the
desired output frequency of the device. A value of
2.2 pF was chosen for the evaluation board.
Applications Support
If you have a problem with your evaluation kit or if
you have applications questions, please contact
applications support:
J2 provides DC power to the device via pin 1. Two
decoupling capacitors (C2=1000 pF, C10=100 pF)
are included on this trace. It is the responsibility of
the customer to determine proper supply decoupling
for their design application.
E-Mail: help@psemi.com (fastest response)
Phone: (858) 731-9400
The board is constructed using 4 layers. The top
and bottom layers are comprised of Rogers low loss
4350 material having a core thickness of 0.010”;
while the internal layers are comprised of FR-4. The
overall board thickness is 0.062”.
Figure 5. Evaluation Board Schematic
Peregrine specification 102/0223
Document No. 70-0152-02 │ www.psemi.com
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.
Page 3 of 7
PE9304
Product Specification
Typical Performance Data @ +25 °C
Figure 6. Input Sensitivity
Figure 7. Device Current
Specified
Operating Window
Figure 8. Output Power
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0152-02 │ UltraCMOS™ RFIC Solutions
Page 4 of 7
PE9304
Product Specification
Figure 9. Package Drawing
8-lead CSOIC
Table 4. Ordering Information
Order Code
9304-01
Part Marking
PE9304
Description
PE9304-08CFPG-1A Engineering Samples
PE9304-08CFPG-1A Flight Units
PE9304 Evaluation Kit
Package
Gullwing Glass Flatpack
Gullwing Glass Flatpack
Evaluation Kit
Shipping Method
20 / Tray
9304-11
PE9304
50 / Tray
1 / Box
9304-00
PE9304-EK
Document No. 70-0152-02 │ www.psemi.com
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.
Page 5 of 7
PE9304
Product Specification
Sales Offices
The Americas
North Asia Pacific
Peregrine Semiconductor Corporation
Peregrine Semiconductor K.K.
9450 Carroll Park Drive
San Diego, CA 92121
Tel: 858-731-9400
Teikoku Hotel Tower 10B-6
1-1-1 Uchisaiwai-cho, Chiyoda-ku
Tokyo 100-0011 Japan
Fax: 858-731-9499
Tel: +81-3-3502-5211
Fax: +81-3-3502-5213
Europe
Peregrine Semiconductor, Korea
#B-2402, Kolon Tripolis, #210
Geumgok-dong, Bundang-gu, Seongnam-si
Gyeonggi-do, 463-480 S. Korea
Tel: +82-31-728-4300
Peregrine Semiconductor Europe
Bâtiment Maine
13-15 rue des Quatre Vents
F-92380 Garches, France
Tel: +33-1-47-41-91-73
Fax : +33-1-47-41-91-73
Fax: +82-31-728-4305
South Asia Pacific
Space and Defense Products
Americas:
Peregrine Semiconductor, China
Shanghai, 200040, P.R. China
Tel: +86-21-5836-8276
Tel: 858-731-9453
Fax: +86-21-5836-7652
Europe, Asia Pacific:
180 Rue Jean de Guiramand
13852 Aix-En-Provence Cedex 3, France
Tel: +33(0) 4 4239 3361
Fax: +33(0) 4 4239 7227
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The information in this data sheet is believed to be reliable.
However, Peregrine assumes no liability for the use of this
information. Use shall be entirely at the user’s own risk.
The product is in a formative or design stage. The data
sheet contains design target specifications for product
development. Specifications and features may change in
any manner without notice.
No patent rights or licenses to any circuits described in this
data sheet are implied or granted to any third party.
Preliminary Specification
Peregrine’s products are not designed or intended for use in
devices or systems intended for surgical implant, or in other
applications intended to support or sustain life, or in any
application in which the failure of the Peregrine product could
create a situation in which personal injury or death might occur.
Peregrine assumes no liability for damages, including
consequential or incidental damages, arising out of the use of
its products in such applications.
The data sheet contains preliminary data. Additional data
may be added at a later date. Peregrine reserves the right
to change specifications at any time without notice in order
to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine
decides to change the specifications, Peregrine will notify
customers of the intended changes by issuing a DCN
(Document Change Notice).
The Peregrine name, logo, and UTSi are registered trademarks
and UltraCMOS and HaRP are trademarks of Peregrine
Semiconductor Corp.
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0152-02 │ UltraCMOS™ RFIC Solutions
Page 6 of 7
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