EFM104F [RECTRON]
SURFACE MOUNT GLASS PASSIVATED SUPER FAST SILICON RECTIFIER VOLTAGE RANGE 50 to 600 Volts CURRENT 1.0 Ampere;型号: | EFM104F |
厂家: | RECTRON SEMICONDUCTOR |
描述: | SURFACE MOUNT GLASS PASSIVATED SUPER FAST SILICON RECTIFIER VOLTAGE RANGE 50 to 600 Volts CURRENT 1.0 Ampere |
文件: | 总7页 (文件大小:100K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
EFM101F
THRU
EFM107F
SURFACE MOUNT GLASS PASSIVATED
SUPER FAST SILICON RECTIFIER
VOLTAGE RANGE 50 to 600 Volts CURRENT 1.0 Ampere
FEATURES
* Glass passivated device
* Ideal for surface mounted applications
* Low leakage current
* Metallurgically bonded construction
* Mounting position: Any
SMAF
(
2.8 0.110
)
)
2.4 0.094
(
MECHANICAL DATA
* Epoxy : Device has UL flammability classification 94V-0
MAX 1.05
(
)
)
0.15 0.006
(
0.11 0.004
.
(
)
13 0.051
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
Resistive or inductive load.
(
)
0.028.
0.7
0
Dimensions in millimeters and (inches)
O
MAXIMUM RATINGS (@ T
A
=25 C unless otherwise noted)
RATINGS
SYMBOL
EFM101F EFM102F EFM103F EFM104F EFM105F EFM106F EFM107F UNITS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
150
V
50
100
200
300
Volts
Volts
Volts
400
280
400
600
420
600
RRM
105
150
V
35
50
70
140
200
210
300
RMS
100
Maximum DC Blocking Voltage
V
DC
Maximum Average Forward Rectified Current
A
I
1.0
30
Amps
Amps
at T = 55oC
O
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
I
FSM
I2T
A2S
Typical Current Square Time
3.7
85
R
QJA
0C/W
Typical Thermal Resistance (Note 4)
R
35
QJL
Typical Junction Capacitance (Note 2)
C
15
10
pF
0C
J
Operating and Storage Temperature Range
T , T
-55 to + 150
J
STG
O
ELECTRICAL CHARACTERISTICS(@T
A
=25 C unless otherwise noted)
CHARACTERISTICS
SYMBOL
UNITS
Volts
EFM101F EFM102F EFM103F EFM104F EFM105F EFM106F EFM107F
Maximum Instantaneous Forward Voltage at 1.0A DC
V
0.95
1.25
1.50
F
@T = 25oC
A
5.0
Maximum DC Reverse Current
at Rated DC Blocking Voltage
MAmps
I
R
@T = 100oC
100
A
Maximum Reverse Recovery Time (Note 1)
trr
35
50
nSec
2015-10
REV: O
NOTES : 1. Reverse Recovery Test Conditions: I
F
= 0.5A, I
R
= -1.0A, IRR = -0.25A
2. Measured at 1 MH
Z
and applied reverse voltage of 4.0 volts
3. “Fully ROHS compliant”, “100% Sn plating (Pb-free)”.
4. Thermal Resistance : Mounted on PCB.
RATING AND CHARACTERISTICS CURVES ( EFM101F THRU EFM107F )
trr
+0.5A
50
10
NONINDUCTIVE
NONINDUCTIVE
( - )
D.U.T
0
( + )
PULSE
25 Vdc
(approx)
( - )
GENERATOR
(NOTE 2)
-0.25A
1
( + )
OSCILLOSCOPE
(NOTE 1)
NON-
INDUCTIVE
NOTES: 1 Rise Time = 7ns max. Input Impedance =
1 megohm. 22pF.
-1.0A
2. Rise Time = 10ns max. Source Impedance =
50 ohms.
1cm
SET TIME BASE FOR 10/1 ns/cm
FIG.1 TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTIC
1.25
1.00
1000
100
T
= 100 OC
A
0.75
0.50
10
T
= 25 OC
A
1.0
0.1
Single Phase
Half Wave 60Hz
Resistive or
0.25
0
Inductive Load
0
25
50
75
100
125
150
175
0
20
40
60
80
100
120
140
O
AMBIENT TEMPERATURE, ( C)
PERCENT OF RATED PEAK REVERSE VOLTAGE, (%)
FIG.2 TYPICAL FORWARD CURRENT
DERATTING CURVE
FIG.3 TYPICAL REVERSE
CHARACTERISTICS
RATING AND CHARACTERISTICS CURVES ( EFM101F THRU EFM107F )
20
10
200
100
8.3ms Single Half Sine-Wave
(JEDED Method)
T
= 25 OC
J
3.0
1.0
EFM107F
50
EFM105F~EFM107F
0.3
0.1
30
20
EFM101F~EFM104F
0.03
0.01
Pulse Width=300uS
1% Duty Cycle
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1
5
10
50
100
INSTANTANEOUS FORWARD VOLTAGE, (V)
NUMBER OF CYCLES AT 60Hz
FIG.4 TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
FIG.5 MAXIIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
200
100
T
= 25 OC
J
60
40
EFM101F~EFM104F
20
10
6
4
EFM105F~EFM107F
2
1
0.1 0.2
0.4
1.0
2
4
10
20
40
100
REVERSE VOLTAGE, (V)
FIG.6 TYPICAL JUNCTION CAPACITANCE
1. Internal Circuit
Anode
Cathode
2. Marking on the body
Part No.
Voltage-code
1-------50V
2-------100V
3-------150V
4-------200V
E X
V X X X
5-------300V
6-------400V
7-------600V
Cathode Band
Plant - code
Year – code
(Y: Last digit of year &
A:2010,B:2011……)
Week – code
(WW:01~52)
REEL TAPING SPECIFICATIONS FOR
SURFACE MOUNT DEVICES-FLAT MELF
( SMAF )
D1
D2
W1
D
Fig.: Configuration of FLAT MELF TAPING
(SMAF)
ITEM
SYMBOL
SMAF mm(inch)
Carrier width
Carrier length
Carrier depth
A
B
C
2.9 0.10 (0.114 0.004)
5.35 0.10 (0.211 0.004)
1.15 0.10 (0.045 0.004)
Sprocket hole
D0
D
1.55 0.05 (0.061 0.002)
178 2.0 (7.0 0.079)
50 Min.
13 0.5 (0.512 0.020)
1.75 0.1 (0.069 0.004)
5.50 0.05 (0.217 0.002)
4.0 0.1 (0.157 0.004)
4.0 0.1 (0.157 0.004)
Reel outside diameter
Reel inner diameter
Feed hole diameter
Strocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Totall tape thickness
Tape width
D
1
D
2
E
F
P
P
0
P1
2.0 0.05 (0.079 0.002)
0.23 0.02 (0.009 0.001)
T
W
0.3
0.1
0.012
0.004
12.0
(0.472
)
Reel width
W1
16.8 2.0 (0.661 0.079)
Note: 1.Devices are packed in accordance with EIA standard RS-481-D and specification given above.
2.Available on 7 inch ( 1500 ct. ) or 13 inch ( 5000 ct. ) diameter reels.
PACKAGING OF DIODE AND BRIDGE RECTIFIERS
REEL PACK
COMPONENT
SPACE
EA PER
INNER
BOX
PACKING
CODE
EA PER
REEL
REEL DIA CARTON SIZE EA PER
GROSS
TAPE SPACE
(mm)
PACKAGE
(mm)
(mm)
CARTON WEIGHT(Kg)
(mm)
SMAF
SMAF
-T
3,000
12,000
---
---
178
330
390*205*310 96,000
360*355*360 160,000
---
---
---
---
-W
10,000 20,000
DISCLAIMER NOTICE
Rectron Inc reserves the right to make changes without notice to any product
specification herein, to make corrections, modifications, enhancements or other
changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi-
lity for any errors or inaccuracies. Data sheet specifications and its information
contained are intended to provide a product description only. "Typical" paramet-
ers which may be included on RECTRON data sheets and/ or specifications ca-
n and do vary in different applications and actual performance may vary over ti-
me. Rectron Inc does not assume any liability arising out of the application or
use of any product or circuit.
Rectron products are not designed, intended or authorized for use in medical,
life-saving implant or other applications intended for life-sustaining or other rela-
ted applications where a failure or malfunction of component or circuitry may di-
rectly or indirectly cause injury or threaten a life without expressed written appr-
oval of Rectron Inc. Customers using or selling Rectron components for use in
such applications do so at their own risk and shall agree to fully indemnify Rect-
ron Inc and its subsidiaries harmless against all claims, damages and expendit-
ures.
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