A19A-W3SS3913-C7 [REFOND]
The white light of this light emitting diode is formed by mixing light from a blue light chip;
| 型号： | A19A-W3SS3913-C7 |
| 厂家： | 
SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. |
| 描述： | The white light of this light emitting diode is formed by mixing light from a blue light chip |
| 文件： | 总23页 (文件大小：1688K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TG-201804100927EP
SPECIFICATION
REFOND P/N
A19A-W*SS3913-C7
Mass Product
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PAGE:1
TG-201804100927EP
Contents
1. Description
..................................................................................................................................3
................................................................................................................3
1.1 General Description
1.2 Features
....................................................................................................................................3
................................................................................................................................3
1.3 Application
1.4 Package Dimension
1.5 Product Parameters
................................................................................................................4
................................................................................................................5
1.6 Bin Range Of Luminous Flux and The Chromaticity Diagram (IF=1000mA)
(IF=1000mA)................................................................................................................................................7
1.7 Typical optical characteristics curves ..................................................................9
2. Packaging .................................................................................................................................14
2.1 Packaging Specification
2.1.1 Suction box Dimension
BIN
.......................................................................................................14
...................................................................................14
2.1.2 Label Form Specification
2.2 Moisture Resistant Packing
....................................................................................15
.................................................................................................15
2.3 Cardboard Box
.......................................................................................................................16
2.4 Reliability Test Items And Conditions
2.5 Criteria For Judging Damage
........................................................16
......................................................................................17
3. Soldering Instructions
4. Handling Precautions
4.1 Handling Precautions
........................................................................................................18
..............................................................................................19
............................................................................................19
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TG-201804100927EP
1. Description
1.1 General Description
The white light of this light emitting diode is formed by mixing light from a blue light chip Size：
19mmX19mmX1.0mm。
1.2 Features
► COB Package.
► High power density.
► Integrated packaging module,no SMT.
► Aluminum substrate package，low thermal resistance，high electrical insulation strength.
► RoHS compliant.
1.3 Application
► Commercial lighting.
► Indoor lighting.
► Supermarket lighting.
► General use.
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TG-201804100927EP
1.4 Package Dimension
Fig.1-1 Top view
Fig.1-2 Side view
19
1
7
φ1
0.6
Cathode
（Tc measurement point）
13S7P
Fig.1-3 Polarity
Notes
1. All dimensions units are millimeters.
2. All dimensions tolerances are 0.5mm unless otherwise noted.
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TG-201804100927EP
1.5 Product Parameters
Table 1-1 Electrical / Optical Characteristics at Tc=25°C
Value
Typ
Item
Symbol
Test Condition
Unit
Min.
Max.
Forward Voltage
Reverse Current
VF
IR
IF=1000mA
VR=65V
32
---
34
---
42
65
V
uA
Φ
Φ
Φ
Φ
Φ
Φ
IF=1000mA
IF=1000mA
IF=1000mA
IF=1000mA
IF=1000mA
IF=1000mA
5200
5390
5740
5740
5740
5920
5540
5740
6130
6130
6130
6340
5920
6130
6550
6550
6550
6760
lm
lm
lm
lm
lm
lm
A19A-W2SS3913-C7
A19A-W3SS3913-C7
A19A-W4SS3913-C7
A19A-W5SS3913-C7
A19A-W6KS3913-C7
A19A-W7SS3913-C7
Viewing Angle
2θ1/2
IF=1000mA
IF=1000mA
---
120
73
---
---
deg
/
Color Rendering Index
CRI
70
Table 1-2 Absolute Maximum Ratings at Tc=25°C
Symbol Rating
50
Parameter
Power Dissipation
Units
PD
W
Forward Current
1300
1400
65
IF
IFP
mA
mA
V
Peak Forward Current
Reverse Voltage
VR
Electrostatic Discharge
(HBM)
ESD
Tc
1000
90
V
Case Temperature
Storage Temperature
Junction Temperature
℃
℃
℃
TOPR
TJ
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TG-201804100927EP
Notes
1. 1.1/10 Duty cycle, pulse width 10ms.
2. The above forward voltage measurement allowance tolerance is ±0.3V.
3. The above color coordinates measurement allowance tolerance is ±0.005.
4. The above luminous intensity measurement allowance tolerance ±10%.
5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
6. All measurements were made under the standardized environment of Refond.
7.When the LEDs are in operation the maximum current should be decided after measuring the package
temperature，junction temperature should not exceed the maximum rate
8. ESD yield is over 90% at 2000V ESD (HBM). ESD protection during products handing is needed.
9. Tj refers to the highest temperature chip PN junction temperature in COB, which is usually the chip PN
junction temperature in the luminescence center.
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TG-201804100927EP
1.6 Bin Range Of Luminous Flux and The Chromaticity Diagram (IF=1000mA)
BIN
(IF=1000mA)
Table 1-3
VF（V）
Φ（lm）
SDCM
5200-5540-5920
5390-5740-6130
5740-6130-6550
5740-6130-6550
5740-6130-6550
5920-6340-6760
2S-3，2S-5
3S-3，3S-5
4S-3，4S-5
5S-3，5S-5
6K-3，6K-5
7S-3，7S-5
A19A-W2SS3913-C7
A19A-W3SS3913-C7
A19A-W4SS3913-C7
A19A-W5SS3913-C7
A19A-W6KS3913-C7
A19A-W7SS3913-C7
32-42
Y
0.45
0.43
0.41
0.39
0.37
0.35
0.33
0.31
0.29
2S-5
2S-3
3S-5
3S-3
4S-5
4S-3
5S-5
5S-3
6K-5
6K-3
7S-5
7S-3
X
0.40
0.28
0.30
0.32
0.34
0.36
0.38
0.4
8
0.50
Fig 1-4 The C.I.E Chromaticity Diag
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PAGE:7
TG-201804100927EP
Table 1-4
0.4578
2S-3
0.4101
a
57.28
0.4338
3S-3
0.4030
53.16
3-step
3-step
b
a
b
2700k
4000k
5700k
0.007733
0.004011
3000k
0.008346
0.004098
5-step
5-step
a
b
a
b
2S-5
0.012889
0.006685
3S-5
0.01391
0.006831
0.3818
4S-3
0.3797
54
0.3447
5S-3
0.3553
59.62
3-step
3-step
5-step
a
b
a
b
0.009386
0.004035
5000k
0.0082
0.0036
5-step
a
b
a
b
4S-5
0.015644
0.006725
5S-5
0.01365
0.006
0.3287
6K-3
0.3417
59.09
0.3123
7S-3
0.3282
a
58.38
3-step
3-step
a
b
b
0.00746
0.0032
6500k
0.006617
0.002855
5-step
5-step
a
b
b
6K-5
0.01243
0.00533
029
0.004758
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PAGE:8
TG-201804100927EP
1.7 Typical optical characteristics curves
Fig 1-5 Forward Voltage Vs. Forward Current.
Fig 1-6 Forward Current Vs. Relative Intensity.
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TG-201804100927EP
Fig 1-7 Case Temperature Vs. Relative Intensity Tc
1500
1200
900
600
300
0
20
40
60
80
100
Tc(℃)
Fig 1-8 Case Temperature Vs. Forward Current. Tc
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TG-201804100927EP
Fig 1-9 Forward Voltage Vs. Case Temperature.
Tc
120
110
100
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angle(º)
Fig 1-10 Radiation diagram
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PAGE:11
TG-201804100927EP
Forward Current VS Chromaticity
0.407
0.405
0.403
0.401
0.399
240mA
480mA
720mA
960mA
1200mA
0.435
0.437
0.439
0.441
0.443
0.445
X
Fig 1-11 Forward Current. VS Chromaticity
Case Temperature VS Chromaticity Coordinate
20℃
40℃
60℃
80℃
90℃
Fig 1-12 Case Temperature VS Chromaticity Coordinate
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TG-201804100927EP
Fig 1-13 Spectrum Distribution
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TG-201804100927EP
2. Packaging
2.1 Packaging Specification
Package:70pcs/box.
70pcs
2.1.1 Suction box Dimension
底
面
Fig.2-1 Suction box Dimension
Notes
The tolerances unless mentioned ±0.1mm. Unit : mm 注：未注公差毫米
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TG-201804100927EP
2.1.2 Label Form Specification
Table 2-2 label
PART NO.
Part Number
SPEC NO.
LOT NO.
BIN CODE
Ф
Spec Number
Lot Number
Bin Code
Luminous flux
Chromaticity Bin
Forward Voltage
Wavelength
XY
VF
WLD
QTY
Packing Quantity
Made Date
DATE
Fig 2-2 label
2.2 Moisture Resistant Packing
Label
标签
Moisture Barrier Bag
防潮袋
Label
标签
ATTENTION
OBSERVE
PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE DEVICES
Suction box
吸塑盒
Fig.2-3 Moisture Resistant Packin
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PAGE:15
TG-201804100927EP
2.3 Cardboard Box
深圳市瑞丰光电子股份有限公司
SHENZHEN REFOND OPTOELECTRONICS CO.LTO.
Fig.2-4 Cardboard Box
2.4 Reliability Test Items And Conditions
Table 2-3 Reliability Test Items And Conditions
Test Items
Ref.Standard
Test Condition
Time
Quantity
Ac/Re
/
-40 15min
↑↓10sec
Thermal Shock
JESD22-A106
100 cycle
10pcs.
0/1
100 15min
High Temperature Storage
Low Temperature Storage
JESD22-A103
JESD22-A119
1000hrs.
1000hrs.
10pcs.
10pcs.
0/1
0/1
Temp:100
Temp:-40
Tc=65
Life Test
JESD22-A108
0/1
Ta=25
IF=1000mA
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TG-201804100927EP
High Temperature
60 / 90%RH
High Humidity Life Test
JESD22-A101
1000hrs.
1000hrs.
10pcs.
10pcs.
0/1
Tc=85
IF=1000mA
Temperature
Ta=85
JEITA ED-4701
100 103
Humidity Storage
0/1
RH=85%
2.5 Criteria For Judging Damage
Table 2-4 Criteria For Judging Damage
Criteria For Judgement
Test Items
Symbol
Test Condition
Min.
Max.
Forward Voltage
VF
/
IF=1000mA
IF=1000mA
IF=1000mA
-
U.S.L*)x1.1
High Temperature
No open circuit, shortcircuit or
Flicke
High Humidity Life Test
,
Luminous Flux
Ф
L.S.L*)x0.7
-
Notes
1.U.S.L: Upper standard level
L.S.L: Lower standard level
2. The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental
platform, the reliability experiment was taken under good heat dissiustomers applies
the LED to the series and parallel circuit, should take consideration the current,
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TG-201804100927EP
voltage distribution, heat dissipation and others.
3.The technical information shown in the data sheets are limited to the typical characteristics and circuit
examples of the referenced products. It does not constitute the warranting of industrial property nor the granting
of any license.
3. Soldering Instructions
300 °C
3
350 °C
5
(1) The hand solder should be done only one time
(2) When soldering , do not put stress on the COBs’silicone
(3) When soldering , put COB on the Surface of a poor conductor of heat
(4) Don’t remove the protective film on the silicone until soldering end
Soldering Iron
(1) When hand soldering, keep the temperature of iron below less 350℃ less than 5 seconds.
The tip of the iron tip is the blade
Repairing
Repair should not be done after the COBs have been soldered. When repairing is unavoidable,a
double-head soldering iron should be used (as below figure). It should be confirmed in advance
whether the characteristics of COBs will or will not be damaged by repairing. When COBs are
repairing ,don’t use soldering iron scrape pad of COBs.
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TG-201804100927EP
Cautions
(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on
the top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use
the picking up nozzle, the pressure on the silicone resin should be proper. LED
(2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering,
do not warp the circuit board.LED
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering. Do not rapidly cool device after soldering.
4. Handling Precautions
4.1 Handling Precautions
(1) LED operating environment and sulfur element composition cannot be over 100PPM in the
LED mating usage material. This is provided for informational purposes only and is not a warranty
or endorsement.LED
(2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the
malfunction of LED, the single content of Bromine element is required to be less than
900PPM,the single content of Chlorine elementis required to be less than 900PPM,the total
content of Bromine element and Chlorine element in the external materials of the application
products is required to be less than 1500PPM. This is provided for informational purposes only
and is not a warranty or endorsement.
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TG-201804100927EP
(3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues. Refond advises against the use of any chemicals or materials that have been found
or are suspected to have an adverse affect on device performance or reliability. To verify
compatibility, Refond recommends that all chemicals and materials be tested in the specific
application and environment for which they are intended to be used. Attaching LEDs, do not use
adhesives that outgas organic vapor.
(4) Handle the component along the side surface by using forceps or appropriate tools; do not
directly touch or Handle the silicone lens surface, it may damage the internal circuitry.
(5) In designing a circuit, the current through each LED can not be exceed the absolute maximum
rating specified for each LED. In the mean while, resistors for protection should be applied,
otherwise slight voltage shift will cause big current change, burn out may happen. The driving
circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse
voltage is applied to LED, migration can be generated resulting in LED damage.
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TG-201804100927EP
(6) Thermal Design is paramount importance because heat generation may result in the
Characteristics decline, such as brightness decreased, Color change and so on. Please consider
the heat generation of the LEDs when making the system design.LED
(7) Compared to standard encapsulants, silicone is generally softer, and the surface is more likely
to attract dust，requiring special care during processing. In cases where a minimal level of dirt
and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the
surface after the soldering of components. Refond suggests using isopropyl alcohol for cleaning.
In case other solvents are used, it must be assured that these solvents do not dissolve the
package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause
damage to the LED.
(8) To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The
recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%
(9)Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and
Electrical Over Stress (EOS).
(10) Other points for attention, please refer to our relevant i
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TG-201804100927EP
Version History/
Date
Revisor
Version
Verifier
Remarks
2018-04-03
2019-05-30
E/0
E/1
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PAGE:22
TG-201804100927EP
www.refond.com
Declare
This specification is written both in English and in Chinese and the latter is formal.
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