2SC4227R34 [RENESAS]
UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, SUPER MINIMOLD PACKAGE-3;
| 型号： | 2SC4227R34 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, SUPER MINIMOLD PACKAGE-3 射频 小信号双极晶体管 射频小信号双极晶体管 |
| 文件： | 总9页 (文件大小：195K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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April 1st, 2010
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DATA SHEET
NPN SILICON RF TRANSISTOR
2SC4227
NPN EPITAXIAL SILICON RF TRANSISTOR
FOR HIGH-FREQUENCY LOW-NOISE AMPLIFICATION
3-PIN SUPER MINIMOLD
DESCRIPTION
The 2SC4227 is a low supply voltage transistor designed for VHF, UHF low noise amplifier.
It is suitable for a high density surface mount assembly since the transistor has been applied 3-pin super minimold
package.
FEATURES
•
•
•
Low noise : NF = 1.4 dB TYP. @ VCE = 3 V, IC = 7 mA, f = 1 GHz
High gain : S21e2 = 12 dB TYP. @ VCE = 3 V, IC = 7 mA, f = 1 GHz
3-pin super minimold package
ORDERING INFORMATION
Part Number
Quantity
Supplying Form
2SC4227
50 pcs (Non reel)
3 kpcs/reel
• 8 mm wide embossed taping
• Pin 3 (Collector) face the perforation side of the tape
2SC4227-T1
Remark To order evaluation samples, contact your nearby sales office.
The unit sample quantity is 50 pcs.
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameter
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current
Symbol
VCBO
VCEO
VEBO
IC
Ratings
Unit
V
20
10
V
1.5
V
65
mA
mW
°C
°C
Note
Total Power Dissipation
Junction Temperature
Storage Temperature
Ptot
150
Tj
150
Tstg
−65 to +150
Note Free air
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PU10451EJ01V0DS (1st edition)
(Previous No. P10371EJ2V0DS00)
The mark shows major revised points.
Date Published December 2003 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 1993, 2003
2SC4227
ELECTRICAL CHARACTERISTICS (TA = +25°C)
Parameter
DC Characteristics
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Collector Cut-off Current
Emitter Cut-off Current
DC Current Gain
ICBO
IEBO
VCB = 10 V, IE = 0 mA
−
−
−
−
−
0.8
0.8
240
µA
µA
−
VEB = 1 V, IC = 0 mA
VCE = 3 V, IC = 7 mA
Note 1
hFE
40
RF Characteristics
Gain Bandwidth Product
Insertion Power Gain
Noise Figure
fT
VCE = 3 V, IC = 7 mA
4.5
10
−
7.0
12
–
GHz
dB
S21e2 VCE = 3 V, IC = 7 mA, f = 1 GHz
−
NF
VCE = 3 V, IC = 7 mA, f = 1 GHz
VCB = 3 V, IE = 0 mA, f = 1 MHz
1.4
0.45
2.7
0.9
dB
Note 2
Reverse Transfer Capacitance
Cre
−
pF
Notes 1. Pulse measurement: PW ≤ 350 µs, Duty Cycle ≤ 2%
2. Collector to base capacitance when the emitter grounded
hFE CLASSIFICATION
Rank
R33
R33
R34
R34
R35
R35
Marking
hFE Value
40 to 90
70 to 150
110 to 240
2
Data Sheet PU10451EJ01V0DS
2SC4227
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
REVERSE TRANSFER CAPACITANCE
vs. COLLECTOR TO BASE VOLTAGE
5
250
200
150
100
50
f = 1 MHz
Free Air
2
1
0.5
0.2
0.1
0
25
50
75
100
125
(˚C)
150
1
2
5
10
20
50
Ambient Temperature T
A
Collector to Base Voltage VCB (V)
COLLECTOR CURRENT vs.
BASE TO EMITTER VOLTAGE
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
20
25
20
15
10
5
VCE = 3 V
µ
µ
µ
µ
10
µ
µ
µ
µ
0
0.5
1
0
0.5
1
Base to Emitter Voltage VBE (V)
Collector to Emitter Voltage VCE (V)
DC CURRENT GAIN vs.
COLLECTOR CURRENT
GAIN BANDWIDTH PRODUCT
vs. COLLECTOR CURRENT
200
100
50
10
8
VCE = 3 V
V
CE = 3 V
f = 1 GHz
6
4
2
0
20
10
0.5
1
5
10
(mA)
50
0.5
1
5
10
50
Collector Current I
C
Collector Current I (mA)
C
Remark The graphs indicate nominal characteristics.
3
Data Sheet PU10451EJ01V0DS
2SC4227
INSERTION POWER GAIN
vs. FREQUENCY
INSERTION POWER GAIN
vs. COLLECTOR CURRENT
25
20
15
10
15
10
5
V
CE = 3 V
V
CE = 3 V
f = 1 GHz
IC = 7 mA
5
0
0
0.5
0.1
0.2
0.5
1
2
5
1
5
10
50
Frequency f (GHz)
Collector Current I (mA)
C
NOISE FIGURE vs.
COLLECTOR CURRENT
5
4
3
2
1
V
CE = 3 V
f = 1 GHz
0
0.5
1
5
10
(mA)
50
Collector Current I
C
Remark The graphs indicate nominal characteristics.
S-PARAMETERS
S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form
(S2P) that enables direct import to a microwave circuit simulator without keyboard input.
Click here to download S-parameters.
[RF and Microwave] → [Device Parameters]
URL http://www.ncsd.necel.com/
4
Data Sheet PU10451EJ01V0DS
2SC4227
PACKAGE DIMENSIONS
3-PIN SUPER MINIMOLD (UNIT: mm)
2.1 0.1
1.25 0.1
2
1
3
Marking
PIN CONNECTIONS
1. Emitter
2. Base
3. Collector
(EIAJ : SC-70)
5
Data Sheet PU10451EJ01V0DS
2SC4227
•
The information in this document is current as of December, 2003. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
6
Data Sheet PU10451EJ01V0DS
2SC4227
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-01 FAX: +49-211-6503-487
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0310
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