2SK2328-E [RENESAS]

Silicon N Channel MOS FET; 硅N沟道MOS FET
2SK2328-E
型号: 2SK2328-E
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Silicon N Channel MOS FET
硅N沟道MOS FET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总7页 (文件大小:175K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SK2328  
Silicon N Channel MOS FET  
REJ03G1007-0200  
(Previous: ADE-208-1355)  
Rev.2.00  
Sep 07, 2005  
Application  
High speed power switching  
Features  
Low on-resistance  
High speed switching  
Low drive current  
No secondary breakdown  
Suitable for switching rconverter  
Outline  
RENESAS A  
(Package na
D
1. Gate  
2. Drain  
(Flange)  
3. Source  
1
2
3
Rev.2.00 Sep 07, 2005 page 1 of 6  
2SK2328  
Absolute Maximum Ratings  
(Ta = 25°C)  
Item  
Drain to source voltage  
Gate to source voltage  
Drain current  
Symbol  
VDSS  
Ratings  
Unit  
V
650  
VGSS  
±30  
V
ID  
7
A
1
Drain peak current  
ID(pulse)  
*
28  
A
Body to drain diode reverse drain current  
Channel dissipation  
IDR  
7
75  
A
Pch*2  
Tch  
W
°C  
°C  
Channel temperature  
150  
Storage temperature  
Tstg  
–55 to +150  
Notes: 1. PW 10 µs, duty cycle 1 %  
2. Value at Tc = 25°C  
Electrical Characteristics  
(Ta = 25°C)  
Item  
ol  
Min  
650  
±30  
Typ  
Max  
Unit  
V
Test Conditions  
Drain to source breakdo
Gate to source break
Gate to source leak cur
Zero gate voltage drain cu
Gate to source cutoff voltage  
ID = 10 mA, VGS = 0  
IG = ±100 µA, VDS = 0  
VGS = ±25 V, VDS = 0  
VDS = 550 V, VGS = 0  
ID = 1 mA, VDS = 10 V  
ID = 4A, VGS = 10 V*3  
V
±10  
250  
3.0  
1.4  
µA  
µA  
V
Static drain to source on state  
resistance  
Forward transfer admittance  
Input capacitance  
Ci
Coss  
Crss  
td(on)  
tr  
S
ID = 4 A, VDS = 10 V*3  
pF  
pF  
pF  
s  
VDS = 10 V, VGS = 0,  
f = 1 MHz  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
ID = 4 A, VGS = 10 V,  
RL = 7.5 Ω  
Turn-off delay time  
Fall time  
td(off)  
tf  
4
Body-drain diode forward voltage  
VDF  
trr  
0.95  
420  
, VGS = 0  
Body-drain diode reverse recovery  
time  
VGS = 0,  
t = 100 A / µs  
Note: 3. Pulse test  
Rev.2.00 Sep 07, 2005 page 2 of 6  
2SK2328  
Main Characteristics  
Power vs. Temperature Derating  
Maximum Safe Operation Area  
50  
100  
75  
20  
10  
5
100  
µ
s
2
1
50  
Operation in  
this area is  
limited by R  
0.5  
DS(on)  
25  
0.2  
0.1  
Ta = 25°C  
0.05  
1
3
10  
30  
100 300 1000  
0
50  
100  
150  
200  
Case TempeTC (°C)  
Drain to Source Voltage VDS (V)  
Ty
Typical Transfer Characteristics  
10  
10  
10 V  
VDS = 20 V  
Pulse Test  
8
6
4
2
8
6
TC = 75°C  
25°C  
4 V  
–25°C  
VGS = 3.5 V  
40 50  
0
10  
20  
30  
6
8
10  
Drain to Source Voltage VDS (V)  
tage VGS (V)  
Drain to Source Saturation Voltage  
vs. Gate to Source Voltage  
rce on State  
Drain Current  
20  
16  
12  
8
5
Puls
VGS = 10 V  
Pulse Test  
ID = 10 A  
2
1
15 V  
0.5  
0.2  
0.1  
5 A  
2 A  
4
0.05  
0
4
8
12  
16  
20  
0.5  
1
2
5
10 20  
50  
Gate to Source Voltage VGS (V)  
Drain Current ID (A)  
Rev.2.00 Sep 07, 2005 page 3 of 6  
2SK2328  
Static Drain to Source on State  
Resistance vs. Temperature  
Forward Transfer Admittance  
vs. Drain Current  
50  
5
4
3
2
1
VDS = 20 V  
Pulse Test  
VGS = 10 V  
Pulse Test  
20  
10  
5
TC = 75°C  
25°C  
–25°C  
ID = 10 A  
5 A  
2 A  
2
1
0.5  
0
0.1 0.2  
0.5  
1
2
5
10  
–40  
0
40  
80  
120  
160  
Case Temperature TC (°C)  
Drain Current ID (A)  
Body to everse  
Typical Capacitance vs.  
Drain to Source Voltage  
500  
5,000  
1,000  
VGS = 0  
f = 1 MHz  
Ciss  
200  
100  
50  
Coss  
100  
20  
10  
di/dt = 100 A/µs, VGS = 0  
Ta = 25°C  
Crss  
40  
5
20  
30  
50  
0.1 0.2  
0.5  
1
2
5
10  
Reverse Drain Current IDR (A)  
ce Voltage VDS (V)  
Dynamic Input Characteristics  
VDD = 100 V  
acteristics  
20  
1,000  
800  
600  
400  
200  
5
200  
GS = 10 V, PW = 2 µs  
.
=
duty < 1%, VDD 30 V  
.
16  
12  
8
250 V  
400 V  
td (off)  
100  
50  
VGS  
tf  
VDS  
ID = 8 A  
tr  
20  
10  
td (on)  
VDD = 400 V  
250 V  
100 V  
4
0
5
0.2  
20  
40  
60  
80  
100  
0
0.5  
1
2
5
10  
20  
Gate Charge Qg (nc)  
Drain Current ID (A)  
Rev.2.00 Sep 07, 2005 page 4 of 6  
2SK2328  
Reverse Drain Current vs.  
Source to Drain Voltage  
10  
8
Pulse Test  
6
4
2
5, 10 V  
0.4  
VGS = 0, –5 V  
0.8 1.2  
0
1.6  
2.0  
Source to Drain Voltage VSD (V)  
malized Transient Thermal Impedance vs. Pulse Width  
3
Tc = 25°C  
0.3  
0.1  
θ
γ
θ
ch – c(t) = s (t) • ch – c  
h – c = 1.67°C/W, Tc = 25°C  
PW  
T
D =  
0.03  
0.01  
10 µ  
100 µ  
1 m  
10  
Pulse Widt
Switching Time Test Circuit  
Vin Monitor  
ms  
90%  
Vout Monitor  
D.U.T.  
Vin  
10%  
10%  
10%  
10%  
RL  
Vout  
Vin  
10 V  
50 Ω  
VDD  
.
90%  
tr  
90%  
td (off)  
=
30 V  
.
td (on)  
tf  
Rev.2.00 Sep 07, 2005 page 5 of 6  
2SK2328  
Package Dimensions  
JEITA Package Code  
SC-46  
RENESAS Code  
PRSS0004AC-A  
Package Name  
MASS[Typ.]  
1.8g  
Unit: mm  
TO-220AB / TO-220ABV  
11.5 Max  
10.16 0.2  
4.44 0.2  
9.5  
8.0  
+0.1  
–0.08  
1.26 0.15  
φ 3.6  
2.7 Max  
1.5 Max  
0.76 0.1  
0.5  
0.5 0.1  
Ordering Information  
Part Name  
Quantity  
ping Container  
2SK2328-E  
500 pcs  
Note: For some grades, production may be terminated. Ploffice to check the state of  
production before ordering the product.  
Rev.2.00 Sep 07, 2005 page 6 of 6  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
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therefore recommended ogy Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
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Please also pay attention to y Corp. by various means, including the Renesas Technology Corp. Semiconductor  
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RENESAS SALES OFFICES  
http://www.renesas.com  
Refer to "http://www.renesas.com/en/network" for the latest and detai
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© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.  
Colophon .3.0  

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