F2950NEGK [RENESAS]
High Linearity SP2T Wi-Fi RF Switch 100MHz to 8GHz;
| 型号： | F2950NEGK |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | High Linearity SP2T Wi-Fi RF Switch 100MHz to 8GHz |
| 文件： | 总19页 (文件大小：4369K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Linearity SP2T Wi-Fi RF Switch
100MHz to 8GHz
F2950
Datasheet
Description
Features
.
.
.
Low insertion loss: 0.58dB at 2.5GHz
The F2950 is a high power, reflective 50Ω, single-pole double-
throw (SP2T) RF switch. This device covers a 100MHz to 8GHz
frequency range to support a wide variety of applications including
WLAN 802.11.
High isolation: 44dB at 2.5GHz
Excellent linearity:
.
.
.
IIP3 +69dBm at 2.4GHz and 5.9GHz
IIP2 +115dBm at 2.4GHz
IIP2 +117dBm at 5.9GHz
The F2950 uses a single positive supply voltage and is
compatible with both 1.8V and 3.3V control logic.
.
.
.
.
.
.
.
Second Harmonic: -93dBc at 5.9GHz
Third Harmonic: -85dBc at 5.9GHz
Typical switching speed: 170ns
Supply voltage: +2.7V to +5.5V
1.8V and 3.3V compatible control logic
Competitive Advantage
The F2950 provides extremely low insertion loss across a very
broad bandwidth while providing high linearity performance
across its operating range.
-40°C to +105°C operating temperature range
1.5mm x 1.5mm, 6-pin DFN package
.
.
.
.
.
.
.
.
Optimized for Wi-Fi applications
Wide bandwidth
Low insertion loss
Excellent linearity
High power handling for large peak-to-average applications
Fast switching
Block Diagram
Figure 1. Block Diagram
No external matching required
Minimal footprint
RFC
Typical Applications
.
.
.
.
.
802.11 Wi-Fi
RF1
RF2
Wireless Access Points, Gateways and Router Applications
LTE and 4G Communication Systems
2-Way Radios
General Purpose
VCC
VCTL
1
Rev O Aug 8, 2017
Pin Assignments
Figure 2. Pin Assignments for 1.5mm x 1.5mm x 0.55mm DFN, NEG6 – Top View
RF1
VCTL
1
6
EP
F2950
GND
RF2
RFC
VCC
5
4
2
3
Pin Descriptions
Table 1.
Pin Descriptions
Pin
Name
Function
Logic control pin. See Table 7 for logic control states.
1
VCTL
RF common port. Matched to 50Ω in the insertion loss state only. If this pin is not 0V DC, then an external
coupling capacitor must be used.
Power supply. Bypass to GND with capacitors as close as possible to the pin.
RF2 port. Matched to 50Ω in the insertion loss state only. If this pin is not 0V DC, then an external coupling
capacitor must be used.
Ground. Ground this pin as close to the device as possible.
RF1 port. Matched to 50Ω in the insertion loss state only. If this pin is not 0V DC, then an external coupling
capacitor must be used.
2
3
4
5
6
RFC
VCC
RF2
GND
RF1
Exposed pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the specified RF performance.
EP
2
Rev O August 8, 2017
Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other
conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Table 2.
Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VCC to GND
VCTL to GND
VCC
-0.3
+6.0
V
Lower of
(VCC + 0.3, 3.9)
VLOGIC
-0.3
-0.3
V
V
RF1, RF2, RFC to GND
VRF
+0.3
28
100MHz ≤ fRF ≤ 200MHz
200MHz < fRF ≤ 500MHz
500MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 6GHz
fRF > 6GHz
PABSCW1
PABSCW2
PABSCW3
PABSCW4
PABSCW5
PABSPK1
PABSPK2
PABSPK3
PABSPK4
PABSPK5
TJMAX
Maximum Input CW Power,
ZS = ZL = 50Ω,
TEP = 25°C, VCC = 5.25V
(any port, insertion loss state) [a]
29
30
dBm
dBm
31
30
100MHz ≤ fRF ≤ 200MHz
200MHz < fRF ≤ 500MHz
500MHz < fRF ≤ 1GHz
1GHz < fRF ≤ 6GHz
fRF > 6GHz
35
Maximum Peak Power,
ZS = ZL = 50Ω,
TEP = 25°C, VCC = 5.25V
(any port, insertion loss state) [a], [b]
36
37
38
37
Maximum Junction Temperature
Storage Temperature Range
+140
+150
+260
°C
°C
°C
TSTOR
-65
Lead Temperature (soldering, 10s)
TLEAD
Electrostatic Discharge – HBM
(JEDEC/ESDA JS-001-2012)
2000
(Class C2)
VESDHBM
VESDCDM
V
V
Electrostatic Discharge – CDM
(JEDEC 22-C101F)
500
(Class C2)
[a] TEP is the temperature of the exposed paddle.
[b] 5% duty cycle of 4.6ms period in a 50Ω environment.
3
Rev O August 8, 2017
Recommended Operating Conditions
Table 3.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Operating Temperature Range
RF Frequency Range
Symbol
Conditions
Exposed paddle
Min
2.7 [a]
-40
0.1
Typ
Max
Units
VCC
TEP
fRF
3.3
+25
5.5
+105
8
V
°C
GHz
PRF_CW
CW, insertion loss state
5% duty cycle of 4.6ms period,
insertion loss state
See Figure 3
See Figure 3
50
RF Input Power [b]
dBm
PRF_PULSE
RFC, RF1, RF2 Port Impedance
ZRF
Ω
[a] Functional with reduced performance for 2.3V ≤ VCC < 2.7V.
[b] Levels based on: VCC = 2.7V to 5.5V, 100MHz ≤ fRF ≤ 8GHz, ZS = ZL = 50Ω. See Figure 3 for power handling derating
vs. RF frequency.
Figure 3. Maximum RF Input Operating Power vs. RF Frequency (ZS = ZL = 50Ω)
4
Rev O August 8, 2017
Electrical Characteristics
Table 4.
Electrical Characteristics
See F2950 Typical Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, PIN = 0dBm, ZS = ZL = 50Ω, single
tone and two tone signals applied at RF1 or RF2 and measured at RFC when in the ON state, PCB board trace and connector losses are de-
embedded, unless otherwise noted.
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Lower of
(VCC, 3.6)
Logic Input High Threshold
VIH
VCTL pin
1.1 [b]
V
Logic Input Low Threshold
VIL
VCTL pin
VCTL pin
-0.3
0.6
V
Logic Current
DC Current
IIH, IIL
ICC
-1
+1
250 [a]
0.74
0.79
0.83
0.88
0.90
µA
µA
170
0.54
0.58
0.61
0.64
0.67
0.73
53
44
40
37
34
31
54
44
40
37
34
30
25
fRF = 100MHz to 900MHz
fRF = 900MHz to 2500MHz [c]
fRF = 2500MHz to 3700MHz
fRF = 3700MHz to 4900MHz
fRF = 4900MHz to 6000MHz
fRF = 6000MHz to 8000MHz
fRF = 100MHz to 900MHz
fRF = 900MHz to 2500MHz
fRF = 2500MHz to 3700MHz
fRF = 3700MHz to 4900MHz
fRF = 4900MHz to 6000MHz
fRF = 6000MHz to 8000MHz
fRF = 100MHz to 900MHz
fRF = 900MHz to 2500MHz
fRF = 2500MHz to 3700MHz
fRF = 3700MHz to 4900MHz
fRF = 4900MHz to 6000MHz
fRF = 6000MHz to 8000MHz
fRF = 100MHz to 900MHz
fRF = 900MHz to 2500MHz
fRF = 2500MHz to 3700MHz
fRF = 3700MHz to 4900MHz
fRF = 4900MHz to 6000MHz
fRF = 6000MHz to 8000MHz
Insertion Loss (RF1 or RF2 to RFC)
Isolation (RF1 or RF2 to RFC)
Isolation (RF1 to RF2, RF2 to RF1)
Return Loss (RFC, RF1, RF2)
IL
dB
dB
dB
dB
48
39
35
32
ISO1
ISO2
RL
50
40
35
32
23
22
21
20
20
[a] Items in min/max columns in bold italics are guaranteed by test.
[b] Items in min/max columns that are not bold italics are guaranteed by design characterization.
[c] Minimum or maximum specification guaranteed by test at 2.5GHz and by design characterization over the whole frequency
range.
5
Rev O August 8, 2017
Electrical Characteristics
Table 5.
Electrical Characteristics
See F2950 Typical Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, PIN = 0dBm, ZS = ZL = 50Ω, single
tone and two tone signals applied at RF1 or RF2 and measured at RFC when in the ON state, PCB board trace and connector losses are de-
embedded, unless otherwise noted.
Parameter
Symbol
Conditions
Min
Typ
Max
Units
fRF = 2.4GHz at PIN = +24dBm/tone
100MHz tone spacing
fRF = 5.9GHz at PIN = +24dBm/tone
100MHz tone spacing
f1 = 700MHz, f2 = 1.7GHz
PIN = +24dBm/tone
Measure 2.4GHz product
f1 = 2.4GHz, f2 = 3.5GHz
PIN = +24dBm/tone
Measure 5.9GHz product
fRF = 2.4GHz, PIN = +30dBm
Measure 4.8GHz product
fRF = 5.9GHz, PIN = +30dBm
Measure 11.8GHz product
fRF = 2.4GHz, PIN = +30dBm
Measure 7.2GHz product
fRF = 5.9GHz, PIN = +30dBm
Measure 17.7GHz product
fRF = 2.4GHz
69
Input IP3
Input IP2
IIP3
dBm
69
115
IIP2
H2
dBm
dBc
117
104
93
Second Harmonic
85
Third Harmonic
H3
dBc
dBm
dBm
85
40
40
39
Input 1dB compression [c]
Spurious Output [d]
P1dB
fRF = 6GHz
fRF = 8GHz
fOUT > 5MHz
All ports terminated, RBW = 100Hz
Pspur1
Pspur2
-97
-125
10
fOUT ≤ 5MHz
All ports terminated, RBW = 100Hz
Peak transient during switching.
Measured with 20ns rise time,
0V to 3.3V (3.3V to 0V) control
Rise
Fall
Maximum Video Feed-Through
on RF Ports
VIDFT
mVpp
21
pulse applied to VCTL
50% VCTL to 90% RF
50% VCTL to 10% RF
50% VCTL to 99% RF
50% VCTL to 1% RF
.
170
170
190
190
125
230
230
270
270
Switching Time [e]
SWTIME
SWRATE
ns
Maximum Switching Rate
kHz
[a] Items in min/max columns in bold italics are guaranteed by test.
[b] Items in min/max columns that are not bold italics are guaranteed by design characterization.
[c] The input 1dB compression point is a linearity figure of merit. Refer to the “Absolute Maximum Ratings” section and Figure 3
for the maximum RF input power.
[d] Spurious due to on-chip negative voltage generator. Spurious fundamental is approximately 5.7MHz.
[e] fRF = 1GHz. Rise and fall time of VCTL = 20ns.
6
Rev O August 8, 2017
Thermal Characteristics
Table 6.
Package Thermal Characteristics
Parameter
Symbol
Value
Units
Junction to Ambient Thermal Resistance
θJA
200
°C/W
Junction to Case Thermal Resistance
(Case is defined as the exposed paddle)
θJC_BOT
132
°C/W
Moisture Sensitivity Rating (Per J-STD-020)
MSL 1
Typical Operating Conditions (TOCs)
Unless otherwise noted:
.
.
.
.
.
.
.
VCC = +3.3V
TEP = 25°C
ZS = ZL = 50Ω
fRF = 1GHz
Small signal tests done at 0dBm input power
All temperatures are referenced to the exposed paddle
Evaluation Kit traces and connector losses are de-embedded
7
Rev O August 8, 2017
Typical Performance Characteristics [1]
Figure 4. RF1 to RFC Insertion Loss vs.
Figure 5. RF2 to RFC Insertion Loss vs.
Frequency across Temperature
Frequency across Temperature
0
0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
-0.1
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
0
2000
4000
6000
8000
10000
0
2000
4000
6000
8000
10000
Frequency (MHz)
Frequency (MHz)
Figure 6. RF1 to RFC Isolation vs. Frequency
Figure 7. RF2 to RFC Isolation vs. Frequency
across Temperature
across Temperature
-20
-20
-30
-40
-50
-60
-70
-80
-30
-40
-50
-60
-70
-80
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-90
-90
-100
-100
0
2000
4000
6000
8000
10000
0
2000
4000
6000
8000
10000
Frequency (MHz)
Frequency (MHz)
Figure 8. RF1 to RF2 Isolation vs. Frequency
across Temperature [RF1 Selected]
Figure 9. RF2 to RF1 Isolation vs. Frequency
across Temperature [RF2 Selected]
-20
-30
-40
-50
-60
-70
-80
-20
-30
-40
-50
-60
-70
-80
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-90
-90
-100
-100
0
2000
4000
6000
8000
10000
0
2000
4000
6000
8000
10000
Frequency (MHz)
Frequency (MHz)
8
Rev O August 8, 2017
Typical Performance Characteristics [2]
Figure 10. RF1 Return Loss vs. Frequency
across Temperature [RF1 Selected]
Figure 11. RF2 Return Loss vs. Frequency
across Temperature [RF2 Selected]
0
0
-5
-5
-10
-15
-20
-25
-30
-35
-10
-15
-20
-25
-30
-35
-40
-45
-50
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-40
-45
-50
0
2000
4000
6000
8000
10000
0
2000
4000
6000
8000
10000
Frequency (MHz)
Frequency (MHz)
Figure 12. RFC Return Loss vs. Frequency
across Temperature [RF1 Selected]
Figure 13. RFC Return Loss vs. Frequency
across Temperature [RF2 Selected]
0
0
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-5
-5
-40C 5.5V
25C 5.5V
105C 5.5V
-40C 3.3V
25C 3.3V
105C 3.3V
-40C 2.7V
25C 2.7V
105C 2.7V
-40C 2.3V
25C 2.3V
105C 2.3V
-10
-15
-20
-25
-30
-35
-40
-10
-15
-20
-25
-30
-35
-40
0
2000
4000
6000
8000
10000
0
2000
4000
6000
8000
10000
Frequency (MHz)
Frequency (MHz)
Figure 14. EVKit PCB and Connector Thru Loss
vs. Frequency across Temperature
0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
-40C
25C
105C
0
2000
4000
6000
8000
10000
Frequency (MHz)
9
Rev O August 8, 2017
Typical Performance Characteristics [3]
Figure 15. Switching Time Isolation to Insertion
Loss State
Figure 16. Switching Time Insertion Loss to
Isolation State
10
Rev O August 8, 2017
Control Mode
Table 7.
Switch Control Truth Table
VCTL
LOW
HIGH
RFC to RF1
OFF
RFC to RF2
ON
ON
OFF
Application Information
Default Start-up
The VCTL control pin includes no internal pull-down resistors to logic LOW or pull-up resistors to logic HIGH.
Power Supplies
A common VCC power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to
minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail.
Supply voltage change or transients should have a slew rate slower than 1V / 20µs. In addition, all control pins should remain at 0V (± 0.3V)
while the supply voltage ramps up or while it returns to zero.
Control Pin Interface
If a clean control signal cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit at the input of the control pin is
recommended.
Figure 17. Control Pin Signal Integrity Improvement Circuit
5kΩ
VCTL
2pF
RF1
VCTL
1
6
EP
GND
RF2
RFC
VCC
5
4
2
3
F2950
11
Rev O August 8, 2017
Evaluation Kit Picture
Figure 18. Top View
Figure 19. Bottom View
12
Rev O August 8, 2017
Evaluation Kit / Applications Circuit
Figure 20. Electrical Schematic
Table 8.
Bill of Material (BOM)
Part Reference
C1
QTY
Description
Manufacturer Part #
Manufacturer
1
0
2
5
1
1
1
0.1µF ±10%, 16V, X7R, Ceramic Capacitor (0402)
Not Installed (0402)
GRM155R71C104K
Murata
C2 – C8
R1, R2
J1 – J5
J6
0Ω, 1/10W, Jumper (0402)
ERJ-2GE0R00X
142-0761-881
67997-108HLF
F2950NEGK6
F2950 EVKit
Panasonic
Cinch Connectivity
Amphenol FCI
IDT
50Ω Edge SMA Connector
Conn Header Vert 4x2 Pos Gold
SP2T Switch 1.5mm x 1.5mm 6-pin NEG6 DFN
Printed Circuit Board
U1
IDT
13
Rev O August 8, 2017
Evaluation Kit (EVKit) Operation
External Supply Setup
Set up a VCC power supply in the voltage range of 2.7V to 5.5V with the power supply output disabled.
Connect the disabled VCC supply connection to J6 pin 3 or 5 and GND to J6 pin 2, 4, 6, or 8.
Logic Control Setup
With the logic control line disabled, set the logic HIGH and LOW levels to satisfy the levels stated in the electrical specifications table.
Connect the disabled logic control line to VCTL (pin 1 of J6) and GND to J6 pin 2, 4, 6, or 8.
Turn On Procedure
Set up the supplies and EVKit as noted in the “External Supply Setup” and “Logic Control Setup” sections above.
Enable the VCC supply.
Enable the logic control signal.
Set the VCTL logic setting to achieve the desired Table 7 configuration. Note that the VCTL control logic should not be applied without VCC
being present.
Enable any RF signal.
Turn Off Procedure
Disable any applied RF signal.
Set VCTL to GND.
Disable the VCC supply.
14
Rev O August 8, 2017
Package Drawings
Figure 21. Package Outline Drawing – NEG6 Package
15
Rev O August 8, 2017
Recommended Land Pattern
Figure 22. Recommended Land Pattern – NEG6 Package
16
Rev O August 8, 2017
Marking Diagram
1. Line 1: Y = last digit of the year, BA = sequential letters for traceability purposes
2. Line 2: Pin 1 dot, 2 = F2950 part number code
YBA
2
Ordering Information
Orderable Part Number
Package
MSL Rating
Shipping Packaging
Temperature
F2950NEGK
F2950NEGK8
F2950EVBI
1.5mm x 1.5mm x 0.55mm NEG6 DFN
1.5mm x 1.5mm x 0.55mm NEG6 DFN
Evaluation Board
MSL1
MSL1
Cut Tape
Reel
-40°C to +105°C
-40°C to +105°C
17
Rev O August 8, 2017
Revision History
Revision
Revision Date
Description of Change
Rev O
August 8, 2017
Initial Release
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