HD74AC123AFP-E [RENESAS]

AC SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, FP-16DA;
HD74AC123AFP-E
型号: HD74AC123AFP-E
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

AC SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, FP-16DA

时钟 ISM频段 光电二极管 逻辑集成电路
文件: 总10页 (文件大小:65K)
中文:  中文翻译
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To all our customers  
Regarding the change of names mentioned in the document, such as Hitachi  
Electric and Hitachi XX, to Renesas Technology Corp.  
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas  
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog  
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)  
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand  
names are mentioned in the document, these names have in fact all been changed to Renesas  
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and  
corporate statement, no changes whatsoever have been made to the contents of the document, and  
these changes do not constitute any alteration to the contents of the document itself.  
Renesas Technology Home Page: http://www.renesas.com  
Renesas Technology Corp.  
Customer Support Dept.  
April 1, 2003  
Cautions  
Keep safety first in your circuit designs!  
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better  
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with  
semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate  
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or  
(iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas  
Technology Corporation product best suited to the customer's application; they do not convey any  
license under any intellectual property rights, or any other rights, belonging to Renesas Technology  
Corporation or a third party.  
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any  
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or  
circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and  
algorithms represents information on products at the time of publication of these materials, and are  
subject to change by Renesas Technology Corporation without notice due to product improvements or  
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation  
or an authorized Renesas Technology Corporation product distributor for the latest product information  
before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss  
rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corporation by various  
means, including the Renesas Technology Corporation Semiconductor home page  
(http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams,  
charts, programs, and algorithms, please be sure to evaluate all information as a total system before  
making a final decision on the applicability of the information and products. Renesas Technology  
Corporation assumes no responsibility for any damage, liability or other loss resulting from the  
information contained herein.  
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device  
or system that is used under circumstances in which human life is potentially at stake. Please contact  
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor  
when considering the use of a product contained herein for any specific purposes, such as apparatus or  
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.  
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in  
whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must be  
exported under a license from the Japanese government and cannot be imported into a country other  
than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the  
country of destination is prohibited.  
8. Please contact Renesas Technology Corporation for further details on these materials or the products  
contained therein.  
HD74AC123A  
Dual Retriggerable Resettable Multivibrator  
ADE-205-365 (Z)  
1st. Edition  
Sep. 2000  
Description  
Each half of the HD74AC123A features retriggerable capability, complementary dc level triggering and  
overriding Direct Clear. When a circuit is in the quasi-stable (delay) state, another trigger applied to the  
inputs (per the Truth Table) will cause the delay period to start again, without disturbing the outputs. By  
repeating this process, the output pulse period (Q High, Q Low) can be made as long as desired.  
Alternatively, a delay period can be terminated at any time by a Low signal on CD, which also inhibits  
triggering. An internal connection from CD to the input gate makes it possible to trigger the circuit by a  
positive-going signal on CD, as shown in the Truth Table. For timing capacitor values greater than 1000  
pF, the output pulse width is defined as follows.  
Where tw is in ns, RX is in kand CX is in pF.  
tw = RXCX  
Feature  
Outputs Source/Sink 24 mA  
HD74AC123A  
Pin Arrangement  
A1  
B1  
1
2
3
4
5
6
7
8
16 VCC  
15 RX1CX1  
14 CX1  
13 Q1  
CD1  
Q1  
Q2  
12 Q2  
CX2  
11 CD2  
10 B2  
RX2CX2  
GND  
9
A2  
(Top view)  
Logic Symbol  
7
6
(15) (14)  
RXCX  
CX  
Q
5(13)  
12(4)  
A
B
9(1)  
10(2)  
Q
CD  
11  
(3)  
V
CC = Pin16  
GND = Pin8  
2
HD74AC123A  
Pin Names  
A1, A2  
B1, B2  
Trigger Inputs (Active Falling Edge)  
Trigger Inputs (Active Rising Edge)  
CD1, CD2 Direct Clear Inputs (Active Low)  
Q1, Q2  
Positive Pulse Outputs  
Q1, Q2  
Negative Pulse Outputs  
Triggering Truth Table  
Inputs  
A
B
X
L
CD  
L
Response  
X
No trigger  
No trigger  
Trigger  
X
H
H
X
H
No trigger  
Trigger  
L
H
L
H
Trigger  
H :  
High Voltage Level  
L
:
:
Low Voltage Level  
Immaterial  
X
:
:
Low-to-High Transition  
High-to-Low Transition  
DC Characteristics (unless otherwise specified)  
Item  
Symbol Max  
Unit  
Condition  
Maximum quiescent supply current  
ICC  
220  
µA  
VIN = VCC or ground, VCC = 5.5 V,  
Ta = Worst case  
Maximum quiescent supply current  
ICC  
130  
µA  
VIN = VCC or ground, VCC = 5.5 V,  
Ta = 25°C  
3
HD74AC123A  
AC Characteristics: HD74AC123A  
Ta = –40°C  
to +85°C  
CL = 50 pF  
Ta = +25°C  
CL = 50 pF  
Item  
Symbol VCC (V)*1 Min  
Typ  
Max  
19.0  
15.0  
19.0  
15.0  
15.0  
12.0  
15.0  
12.0  
Min  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
Max  
Unit Condition  
Propagation delay  
A or B to Q  
tPLH  
tPHL  
tPLH  
tPHL  
3.3  
5.0  
3.3  
5.0  
3.3  
5.0  
3.3  
5.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
22.0  
17.0  
22.0  
17.0  
18.0  
13.5  
18.0  
13.5  
ns  
ns  
ns  
ns  
Cext = 0 pF  
Rest = 5 kΩ  
Propagation delay  
A or B to Q  
Propagation delay  
C
Dn to Q  
Propagation delay  
Dn to Q  
C
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V  
Voltage Range 5.0 is 5.0 V ± 0.5 V  
AC Operating Requirements: HD74AC123A  
Ta = –40  
Ta = +25°C  
to +85°C  
CL = 50 pF  
CL = 50 pF  
Item  
Symbol VCC (V)*1 Typ  
Guaranteed Minimum  
Unit Condition  
Pulse width  
A or B or CDn  
Recovery time  
tw  
3.3  
5.0  
3.3  
5.0  
5.0  
4.5  
2.0  
2.0  
7.0  
5.0  
2.0  
2.0  
ns  
Cext = 0 pF  
Rext = 5 kΩ  
trec  
ns  
C
Dn to A or B  
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V  
Voltage Range 5.0 is 5.0 V ± 0.5 V  
4
HD74AC123A  
Ta = –40°C  
to +85°C  
Ta = +25°C  
CL = 50 pF  
CL = 50 pF  
Item  
Output pulse width TWQ  
Symbol VCC (V)*1 Min  
Typ  
Max  
Min  
Max  
Unit Condition  
3.3  
5.0  
3.3  
5.0  
ms  
Cext = 0.1 µF  
Rext = 10 kΩ  
Cext = 28 pF  
Rext = 2 kΩ  
0.90  
190  
160  
1.10  
350  
300  
0.85  
170  
140  
1.15  
380  
330  
Minimum output  
pulse width  
TWQ(min)  
ns  
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V  
Voltage Range 5.0 is 5.0 V ± 0.5 V  
Cext and Rext should be connected as close to the IC terminals as possible, in order to prevent malfunction.  
5
HD74AC123A  
Package Dimensions  
Unit: mm  
19.20  
20.00 Max  
16  
1
9
8
1.3  
1.11 Max  
7.62  
+ 0.13  
– 0.05  
0.25  
2.54 ± 0.25  
0.48 ± 0.10  
0° – 15°  
Hitachi Code  
DP-16  
JEDEC  
EIAJ  
Mass (reference value)  
Conforms  
Conforms  
1.07 g  
Unit: mm  
10.06  
10.5 Max  
9
8
16  
1
+ 0.20  
7.80  
– 0.30  
0.80 Max  
1.15  
0° – 8°  
1.27  
0.70 ± 0.20  
*0.42 ± 0.08  
0.40 ± 0.06  
0.15  
M
0.12  
Hitachi Code  
JEDEC  
FP-16DA  
EIAJ  
Conforms  
0.24 g  
*Dimension including the plating thickness  
Base material dimension  
Mass (reference value)  
6
HD74AC123A  
Unit: mm  
9.9  
10.3 Max  
9
16  
1
8
1.27  
+ 0.10  
6.10  
– 0.30  
1.08  
0.635 Max  
0° – 8°  
+ 0.67  
0.60  
– 0.20  
*0.42 ± 0.08  
0.40 ± 0.06  
0.15  
0.25  
M
Hitachi Code  
JEDEC  
EIAJ  
FP-16DN  
Conforms  
Conforms  
0.15 g  
*Dimension including the plating thickness  
Base material dimension  
Mass (reference value)  
7
HD74AC123A  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
Asia  
: http://semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
: http://sicapac.hitachi-asia.com  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
179 East Tasman Drive, Dornacher Straβe 3  
Hitachi Europe GmbH  
Electronic Components Group  
Hitachi Asia Ltd.  
Hitachi Tower  
16 Collyer Quay #20-00,  
Singapore 049318  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower,  
San Jose,CA 95134  
D-85622 Feldkirchen, Munich  
World Finance Centre,  
Tel: <1> (408) 433-1990 Germany  
Fax: <1>(408) 433-0223 Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
Tel : <65>-538-6533/538-8577  
Fax : <65>-538-6933/538-3877  
URL : http://www.hitachi.com.sg  
Harbour City, Canton Road  
Tsim Sha Tsui, Kowloon,  
Hong Kong  
Tel : <852>-(2)-735-9218  
Fax : <852>-(2)-730-0281  
URL : http://www.hitachi.com.hk  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Hitachi Asia Ltd.  
(Taipei Branch Office)  
4/F, No. 167, Tun Hwa North Road,  
Hung-Kuo Building,  
Taipei (105), Taiwan  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 585160  
Tel : <886>-(2)-2718-3666  
Fax : <886>-(2)-2718-8180  
Telex : 23222 HAS-TP  
URL : http://www.hitachi.com.tw  
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.  
Colophon 2.0  
8

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