HD74AC123ARPEL [RENESAS]

Dual Retriggerable Resettable Multivibrator; 双可重触发复位多谐振荡器
HD74AC123ARPEL
型号: HD74AC123ARPEL
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Dual Retriggerable Resettable Multivibrator
双可重触发复位多谐振荡器

振荡器 预分频器 多谐振动器 逻辑集成电路 光电二极管 时钟
文件: 总7页 (文件大小:244K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HD74AC123A  
Dual Retriggerable Resettable Multivibrator  
REJ03D02450200Z  
(Previous ADE-205-365 (Z))  
Rev.2.00  
Jul.16.2004  
Description  
Each half of the HD74AC123A features retriggerable capability, complementary dc level triggering and overriding  
Direct Clear. When a circuit is in the quasi-stable (delay) state, another trigger applied to the inputs (per the Truth  
Table) will cause the delay period to start again, without disturbing the outputs. By repeating this process, the output  
pulse period (Q High, Q Low) can be made as long as desired. Alternatively, a delay period can be terminated at any  
time by a Low signal on CD, which also inhibits triggering. An internal connection from CD to the input gate makes it  
possible to trigger the circuit by a positive-going signal on CD, as shown in the Truth Table. For timing capacitor values  
greater than 1000 pF, the output pulse width is defined as follows.  
Where tw is in ns, RX is in kand CX is in pF.  
tw = RXCX  
Features  
Outputs Source/Sink 24 mA  
Ordering Information  
Part Name  
HD74AC123AP  
Package Type  
DIP-16 pin  
Pacation Taping Abbreviation (Quantity)  
D
HD74AC123AFPEL SOP-16 pin (JEITA) 
HD74AC123ARPEL SOP-16 pin (JEDE
EL (2,000 pcs/reel)  
EL (2,500 pcs/reel)  
Notes: 1. Please consult the sales ailability.  
2. The packages with leom the conventional products by adding V at the end of  
the package code.  
Pin Arrangemen
B1  
1
2
3
4
5
6
7
8
16 VCC  
15 RX1CX1  
14 CX1  
13 Q1  
CD1  
Q1  
Q2  
12 Q2  
CX2  
11 CD2  
10 B2  
RX2CX2  
GND  
9
A2  
(Top view)  
Rev.2.00, Jul.16.2004, page 1 of 6  
HD74AC123A  
Logic Symbol  
7 6  
(15) (14)  
RXCX  
CX  
Q
5(13)  
12(4)  
A
B
9(1)  
10(2)  
Q
CD  
11  
(3)  
VCC = Pin16  
GND = Pin8  
Pin Names  
A1, A 2  
B1, B2  
CD1, CD2  
Q1, Q2  
Q1, Q 2  
Trigger Inputs (Active Falling Edge)  
Trigger Inputs (Active Rising Edge)  
Direct Clear Inputs (Active Low)  
Positive Pulse Outputs  
Negative Pulse Outputs  
Triggering Truth Table  
Inputs  
A
CD  
Response  
No trigger  
No trigger  
Trigger  
No trigger  
Trigger  
X
L
X
H
X
H
H
L
L
H
Trigger  
H : High Voltage Level  
L
X
:
:
:
Low Voltage Level  
Immaterial  
Low-to-High Transition  
:
High-to-Low Transition  
Rev.2.00, Jul.16.2004, page 2 of 6  
HD74AC123A  
Absolute Maximum Ratings  
Item  
Supply voltage  
DC input diode current  
Symbol  
VCC  
IIK  
Ratings  
–0.5 to 7  
–20  
Unit  
Condition  
VI = –0.5V  
V
mA  
mA  
V
20  
VI = Vcc+0.5V  
DC input voltage  
VI  
–0.5 to Vcc+0.5  
DC output diode current  
IOK  
–50  
50  
mA  
mA  
V
mA  
mA  
°C  
VO = –0.5V  
VO = Vcc+0.5V  
DC output voltage  
VO  
IO  
ICC, IGND  
Tstg  
–0.5 to Vcc+0.5  
±50  
±50  
DC output source or sink current  
DC VCC or ground current per output pin  
Storage temperature  
–65 to +150  
Recommended Operating Conditions  
Item  
Symbol  
Ratings  
2 to 6  
Unit  
Condition  
Supply voltage  
VCC  
Input and output voltage  
Operating temperature  
VI, VO  
Ta  
tr, tf  
0 to VCC  
–40 to +85  
8
Input rise and fall time  
(except Schmitt inputs)  
VCC = 3.0V  
CC = 4.5 V  
VCC = 5.5 V  
VIN 30% to 70% VCC  
DC Characteristics  
Item  
Sym-  
bol  
Vcc  
(V)  
Ta = 2
nit  
Condition  
min.  
2.1  
85  
x.  
Input Voltage  
VIH  
VIL  
3.0  
V
VOUT = 0.1 V or VCC –0.1 V  
VOUT = 0.1 V or VCC –0.1 V  
4.5  
5.5  
3.
4.
5.5  
3.0  
4.5  
5.5  
3.0  
4.5  
5.5  
5.5  
49  
5.49  
1.65  
0.9  
1.35  
1.65  
0.1  
0.1  
0.1  
0.37  
0.37  
0.37  
±1.0  
Output voltage  
.94  
4.94  
2.9  
4.4  
5.4  
2.48  
3.80  
4.80  
V
VIN = VIL or VIH  
IOUT = –50 µA  
VIN = VIL or VIH  
IOH = –12 mA  
IOH = –24 mA  
IOH = –24 mA  
VOL  
0.002 0.1  
0.001 0.1  
0.001 0.1  
VIN = VIL or VIH  
IOUT = 50 µA  
0.32  
VIN = VIL or VIH  
IOL = 12 mA  
IOL = 24 mA  
IOL = 24 mA  
0.32  
0.32  
±0.1  
Input leakage  
current  
IIN  
µA  
VIN = VCC or GND  
Dynamic output  
IOLD  
IOHD  
ICC  
5.5  
5.5  
5.5  
130  
86  
–75  
220  
mA  
mA  
µA  
VOLD = 1.1 V  
VOHD = 3.85 V  
VIN = VCC or ground  
current*  
Quiescent supply  
current  
*Maximum test duration 2.0 ms, one output loaded at a time.  
Rev.2.00, Jul.16.2004, page 3 of 6  
HD74AC123A  
AC Characteristics: HD74AC123A  
Ta = –40°C  
to +85°C  
CL = 50 pF  
Ta = +25°C  
CL = 50 pF  
Item  
Symbol VCC (V)*1 Min  
Typ  
Max  
19.0  
15.0  
19.0  
15.0  
15.0  
12.0  
15.0  
12.0  
Min  
1.0  
Max  
22.0  
Unit  
ns  
Condition  
Cext = 0 pF  
Rest = 5 kΩ  
Propagation delay  
A or B to Q  
Propagation delay  
A or B to Q  
tPLH  
tPHL  
tPLH  
tPHL  
3.3  
5.0  
3.3  
5.0  
3.3  
5.0  
3.3  
5.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
17.0  
22.0  
17.0  
18.0  
13.5  
18.0  
13.5  
ns  
ns  
ns  
Propagation delay  
C
Dn to Q  
Propagation delay  
Dn to Q  
C
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V  
Voltage Range 5.0 is 5.0 V ± 0.5 V  
AC Operating Requirements: HD74AC123A  
T
Ta = +25°C  
CL = 50 pF  
Item  
Pulse width  
A or B or CDn  
Symbol VCC (V)*1  
Typ  
Guara
Condition  
tw  
3.3  
5.0  
3.3  
5.0  
5.0  
ext = 0 pF  
Rext = 5 kΩ  
4.
Recovery time  
trec  
s  
CDn to A or B  
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V  
Voltage Range 5.0 is 5.0 V ± 0.5 V  
Ta = –40°C  
to +85°C  
CL = 50 pF  
Item  
Output pulse width TWQ  
Symbo
Max  
Min  
Max  
Unit  
ms  
Condition  
1.10  
350  
300  
Cext = 0.1 µF  
Rext = 10 kΩ  
Cext = 28 pF  
Rext = 2 k  
0.85  
170  
140  
1.15  
380  
330  
Minimum output  
pulse width  
ns  
Note: 1. Voltage Range V  
Voltage Range 5.0 0.5 V  
Cext and Rext should be connectes close to the IC terminals as possible, in order to prevent malfunction.  
Rev.2.00, Jul.16.2004, page 4 of 6  
HD74AC123A  
Package Dimensions  
As of January, 2003  
Unit: mm  
19.2  
20.32 Max  
16  
9
1
8
1.3  
0.89  
7.62  
0.48 ± 0.1  
2.54 ± 0.25  
ms  
orms  
05 g  
Unit: mm  
19
20.
16  
8
7.62  
*0.25 ± 0.06  
*0.48 ± 0.08  
2.54 ± 0.25  
0˚ 15˚  
Package Code  
JEDEC  
JEITA  
DP-16FV  
Conforms  
Conforms  
1.05 g  
*NI/Pd/AU Plating  
Mass (reference value)  
Rev.2.00, Jul.16.2004, page 5 of 6  
HD74AC123A  
As of January, 2003  
Unit: mm  
10.06  
10.5 Max  
9
16  
1
8
+ 0.20  
7.80  
0.30  
0.80 Max  
1.15  
0˚ 8˚  
1.27  
0.70 ± 0.20  
*0.40 ± 0.06  
0.15  
M
0.12  
Packag
JED
6DAV  
JE
*Ni/Pd/Au plating  
As of January, 2003  
Unit: mm  
9.9  
10.
16  
+ 0.10  
6.10  
0.30  
1.08  
0˚ 8˚  
+ 0.67  
0.60  
0.20  
*0.4
0.15  
0.25  
M
Package Code  
JEDEC  
JEITA  
FP-16DNV  
Conforms  
Conforms  
0.15 g  
*Ni/Pd/Au plating  
Mass (reference value)  
Rev.2.00, Jul.16.2004, page 6 of 6  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technolproduct best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belons Technology Corp. or a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party'in the use of any product data,  
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and mation on products at the time of  
publication of these materials, and are subject to change by Renesas Technology Corp. without nots or other reasons. It is  
therefore recommended that customers contact Renesas Technology Corp. or an authorized Retributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other lo
Please also pay attention to information published by Renesas Technology Corp. by vary Corp. Semiconductor  
home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including prodorithms, please be sure to  
evaluate all information as a total system before making a final decision on the apnesas Technology Corp. assumes  
no responsibility for any damage, liability or other loss resulting from the informa
5. Renesas Technology Corp. semiconductors are not designed or manufactureder circumstances in which human life  
is potentially at stake. Please contact Renesas Technology Corp. or an autstributor when considering the use of a  
product contained herein for any specific purposes, such as apparatus or aerospace, nuclear, or undersea repeater  
use.  
6. The prior written approval of Renesas Technology Corp. is necessary se materials.  
7. If these products or technologies are subject to the Japanese expornder a license from the Japanese government and  
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8. Please contact Renesas Technology Corp. for further detaild therein.  
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