HD74AC368P [RENESAS]
AC SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDIP16, DP-16;
| 型号： | HD74AC368P |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | AC SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDIP16, DP-16 驱动 光电二极管 输出元件 |
| 文件： | 总8页 (文件大小：69K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HD74AC365/HD74ACT365
Hex Buffer/Driver with 3-State Output
ADE-205-390 (Z)
1st. Edition
Sep. 2000
Features
•
•
•
3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
Outputs Source/Sink 24 mA
HD74ACT365 has TTL-Compatible Inputs
Pin Arrangement
16
15 OE2
OE1
1
2
3
4
5
6
7
8
VCC
I
14
13
12
11
10
9
I
O
I
O
O
I
O
I
I
O
GND
O
(Top view)
HD74AC365/HD74ACT365
Logic Symbol
OE1
OE2
I
O
Pin Names
OE1, OE2
3-State Output: Enable Input (Active Low)
I
Inputs
O
Outputs
Truth Table
Inputs
Output
OE1
L
OE2
L
I
O
L
L
H
X
X
L
L
H
Z
Z
X
H
H
X
H :
High Voltage Level
Low Voltage Level
L
X
Z
:
:
:
Immaterial
High Impedance
DC Characteristics (unless otherwise specified)
Item
Symbol Max
Unit
Condition
Maximum quiescent supply current
ICC
ICC
ICCT
80
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = Worst case
Maximum quiescent supply current
Maximum ICC/input (HD74ACT365)
8.0
1.5
µA
VIN = VCC or ground, VCC = 5.5 V,
Ta = 25°C
mA
VIN = VCC – 2.1 V, VCC = 5.5 V,
Ta = Worst case
2
HD74AC365/HD74ACT365
AC Characteristics: HD74AC365
Ta = +25°C
Ta = –40°C to +85°C
CL = 50 pF
CL = 50 pF
Item
Symbol VCC (V)*1
Min
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Typ
Max
9.0
Min
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Max
10.0
7.5
Unit
Propagation delay
tPLH
tPHL
tZH
tZL
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
7.0
5.0
7.0
5.0
9.0
7.0
10.0
8.0
9.5
7.5
9.0
7.0
ns
7.0
Propagation delay
Enable time
9.0
10.0
7.5
ns
ns
ns
ns
ns
7.0
12.5
9.0
13.0
9.5
Enable time
12.5
10.0
12.0
10.0
12.5
10.0
13.5
10.5
12.5
10.5
13.5
10.5
Disable time
Disable time
tHZ
tLZ
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
AC Characteristics: HD74ACT365
Ta = +25°C
Ta = –40°C to +85°C
CL = 50 pF
CL = 50 pF
Item
Symbol VCC (V)*1
Min
1.0
1.0
1.0
1.0
1.0
1.0
Typ
Max
9.0
Min
1.0
1.0
1.0
1.0
1.0
1.0
Max
10.0
10.0
11.0
13.0
13.0
11.5
Unit
ns
Propagation delay
Propagation delay
Enable time
Enable time
Disable time
Disable time
tPLH
tPHL
tZH
tZL
5.0
5.0
5.0
5.0
5.0
5.0
6.5
6.5
8.0
9.5
9.5
8.0
9.0
ns
10.5
12.0
12.0
10.5
ns
ns
tHZ
tLZ
ns
ns
Note: 1. Voltage Range 5.0 is 5.0 V ± 0.5 V
Capacitance
Item
Symbol
CIN
Typ
Unit
Condition
VCC = 5.5 V
VCC = 5.0 V
Input capacitance
Power dissipation capacitance
4.5
pF
pF
CPD
45.0
3
HD74AC365/HD74ACT365
Package Dimensions
Unit: mm
19.20
20.00 Max
16
9
8
1
1.3
1.11 Max
7.62
+ 0.13
– 0.05
0.25
2.54 ± 0.25
0.48 ± 0.10
0° – 15°
Hitachi Code
DP-16
JEDEC
EIAJ
Mass (reference value)
Conforms
Conforms
1.07 g
Unit: mm
10.06
10.5 Max
9
8
16
1
+ 0.20
7.80
– 0.30
0.80 Max
1.15
0° – 8°
1.27
0.70 ± 0.20
*0.42 ± 0.08
0.40 ± 0.06
0.15
M
0.12
Hitachi Code
JEDEC
FP-16DA
—
EIAJ
Conforms
0.24 g
*Dimension including the plating thickness
Base material dimension
Mass (reference value)
4
HD74AC365/HD74ACT365
Unit: mm
9.9
10.3 Max
9
16
1
8
1.27
+ 0.10
6.10
– 0.30
1.08
0.635 Max
0° – 8°
+ 0.67
0.60
– 0.20
*0.42 ± 0.08
0.40 ± 0.06
0.15
0.25
M
Hitachi Code
JEDEC
EIAJ
FP-16DN
Conforms
Conforms
0.15 g
*Dimension including the plating thickness
Base material dimension
Mass (reference value)
Unit: mm
5.00
5.30 Max
16
9
1
8
0.65
0.13 M
0.65 Max
1.0
+ 0.08
– 0.07
*0.22
0.20 ± 0.06
6.40 ± 0.20
0° – 8°
0.50 ± 0.10
0.10
Hitachi Code
JEDEC
TTP-16DA
—
EIAJ
—
0.05 g
*Dimension including the plating thickness
Base material dimension
Mass (reference value)
5
HD74AC365/HD74ACT365
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
Asia
: http://semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
: http://sicapac.hitachi-asia.com
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive, Dornacher Straβe 3
Hitachi Europe GmbH
Electronic Components Group
Hitachi Asia Ltd.
Hitachi Tower
16 Collyer Quay #20-00,
Singapore 049318
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower,
San Jose,CA 95134
D-85622 Feldkirchen, Munich
World Finance Centre,
Tel: <1> (408) 433-1990 Germany
Fax: <1>(408) 433-0223 Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Tel : <65>-538-6533/538-8577
Fax : <65>-538-6933/538-3877
URL : http://www.hitachi.com.sg
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon,
Hong Kong
Tel : <852>-(2)-735-9218
Fax : <852>-(2)-730-0281
URL : http://www.hitachi.com.hk
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road,
Hung-Kuo Building,
Taipei (105), Taiwan
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 585160
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Colophon 2.0
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