HN58X2402ST [RENESAS]

I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8;
HN58X2402ST
型号: HN58X2402ST
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8

内存集成电路 光电二极管 双倍数据速率 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总18页 (文件大小:129K)
中文:  中文翻译
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HN58X2402SFPIAG  
HN58X2404SFPIAG  
Two-wire serial interface  
2k EEPROM (256-word × 8-bit)  
4k EEPROM (512-word × 8-bit)  
REJ03C0133-0400  
Rev.4.00  
Jul.13.2005  
Description  
HN58X24xxSFPIAG series are two-wire serial interface EEPROM (Electrically Erasable and Programmable ROM).  
They realize high speed, low power consumption and a high level of reliability by employing advanced MNOS memory  
technology and CMOS process and low voltage circuitry technology. They also have a 8-byte page programming  
function to make their write operation faster.  
Features  
Single supply: 1.8 V to 5.5 V  
Two-wire serial interface (I2CTM serial bus*1)  
Clock frequency: 400 kHz  
Power dissipation:  
Standby: 3 µA (max)  
Active (Read): 1 mA (max)  
Active (Write): 3 mA (max)  
Automatic page write: 8-byte/page  
Write cycle time: 10 ms (2.7 V to 5.5 V)/15ms (1.8 V to 2.7 V)  
Endurance: 105 Cycles (Page write mode)  
Data retention: 10 Years  
Small size packages: SOP 8-pin  
Shipping tape and reel: 2,500 IC/reel  
Lead free products.  
Note: 1. I2C is a trademark of Philips Corporation.  
Ordering Information  
Type No.  
Internal organization  
Operating voltage Frequency  
1.8 V to 5.5 V 400 kHz  
Package  
HN58X2402SFPIAGE  
2k bit (256 × 8-bit)  
150 mil 8-pin plastic SOP  
PRSP0008DF-B (FP-8DBV)  
Lead free  
HN58X2404SFPIAGE  
4k bit (512 × 8-bit)  
Rev.4.00, Jul.13.2005, page 1 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Pin Arrangement  
8-pin SOP  
1
2
3
4
A0  
A1  
8
VCC  
WP  
7
6
5
A2  
SCL  
SDA  
VSS  
(Top view)  
Pin Description  
Pin name  
Function  
A0 to A2  
SCL  
SDA  
WP  
Device address  
Serial clock input  
Serial data input/output  
Write protect  
VCC  
Power supply  
VSS  
Ground  
Block Diagram  
High voltage generator  
Memory array  
VCC  
VSS  
WP  
A0, A1, A2  
SCL  
Control  
logic  
Y-select & Sense amp.  
Serial-parallel converter  
SDA  
Absolute Maximum Ratings  
Parameter  
Supply voltage relative to VSS  
Input voltage relative to VSS  
Operating temperature range*1  
Storage temperature range  
Symbol  
VCC  
Value  
Unit  
V
0.6 to +7.0  
0.5*2 to +7.0*3  
40 to +85  
Vin  
V
Topr  
Tstg  
°C  
°C  
65 to +125  
Notes: 1. Including electrical characteristics and data retention.  
2. Vin (min): 3.0 V for pulse width 50 ns.  
3. Should not exceed VCC + 1.0 V.  
Rev.4.00, Jul.13.2005, page 2 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
DC Operating Conditions  
Parameter  
Symbol  
VCC  
Min  
1.8  
Typ  
0
Max  
5.5  
Unit  
V
Supply voltage  
VSS  
0
0
V
Input high voltage  
Input low voltage  
VIH  
VCC × 0.7  
0.3*1  
40  
VCC + 1.0  
VCC × 0.3  
+85  
V
VIL  
V
Operating temperature  
Topr  
°C  
Note: 1. VIL (min): 1.0 V for pulse width 50 ns.  
DC Characteristics (Ta = 40 to +85°C, VCC = 1.8 V to 5.5 V)  
Parameter  
Symbol Min  
Typ  
1.0  
Max  
2.0  
20  
Unit  
Test conditions  
Input leakage current  
ILI  
µA VCC = 5.5 V, Vin = 0 to 5.5 V (SCL, SDA)  
µA VCC = 5.5 V, Vin = 0 to 5.5 V (A0 to A2, WP)  
µA VCC = 5.5 V, Vout = 0 to 5.5 V  
µA Vin = VSS or VCC  
mA VCC = 5.5 V, Read at 400 kHz  
mA VCC = 5.5 V, Write at 400 kHz  
Output leakage current  
Standby VCC current  
Read VCC current  
ILO  
ISB  
2.0  
3.0  
1.0  
3.0  
0.4  
ICC1  
ICC2  
VOL2  
Write VCC current  
Output low voltage  
V
VCC = 4.5 to 5.5 V, IOL = 1.6 mA  
V
V
CC = 2.7 to 4.5 V, IOL = 0.8 mA  
CC = 1.8 to 2.7 V, IOL = 0.4 mA  
VOL1  
0.2  
V
VCC = 1.8 to 2.7 V, IOL = 0.2 mA  
Capacitance (Ta = +25°C, f = 1 MHz)  
Test  
Parameter  
Symbol  
Min  
Typ  
Max  
6.0  
Unit  
pF  
conditions  
Input capacitance (A0 to A2, SCL, WP)  
Output capacitance (SDA)  
Cin*1  
Vin = 0 V  
1
CI/O  
*
6.0  
pF  
Vout = 0 V  
Note: 1. This parameter is sampled and not 100% tested.  
Rev.4.00, Jul.13.2005, page 3 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
AC Characteristics (Ta = 40 to +85°C, VCC = 1.8 to 5.5 V)  
Test Conditions  
Input pules levels:  
VIL = 0.2 × VCC  
VIH = 0.8 × VCC  
Input rise and fall time: 20 ns  
Input and output timing reference levels: 0.5 × VCC  
Output load: TTL Gate + 100 pF  
Parameter  
Symbol  
Min  
1200  
600  
100  
1200  
600  
600  
0
Typ  
Max  
400  
Unit  
kHz  
ns  
Notes  
Clock frequency  
fSCL  
tLOW  
tHIGH  
tI  
Clock pulse width low  
Clock pulse width high  
Noise suppression time  
Access time  
ns  
50  
900  
300  
300  
10  
15  
ns  
1
tAA  
ns  
Bus free time for next mode  
Start hold time  
tBUF  
ns  
tHD.STA  
tSU.STA  
tHD.DAT  
tSU.DAT  
tR  
ns  
Start setup time  
ns  
Data in hold time  
ns  
Data in setup time  
Input rise time  
100  
600  
50  
ns  
ns  
1
1
Input fall time  
tF  
ns  
Stop setup time  
tSU.STO  
tDH  
ns  
Data out hold time  
Write protect hold time  
Write protect setup time  
ns  
tHD.WP  
tSU.WP  
tWC  
1200  
0
ns  
ns  
Write cycle time  
VCC = 2.7 V to 5.5 V  
VCC = 1.8 V to 2.7 V  
ms  
ms  
2
2
tWC  
Notes: 1. This parameter is sampled and not 100% tested.  
2. tWC is the time from a stop condition to the end of internally controlled write cycle.  
Rev.4.00, Jul.13.2005, page 4 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Timing Waveforms  
Bus Timing  
1/fSCL  
tLOW  
tR  
tF  
tHIGH  
SCL  
tSU.STA  
tHD.DAT  
tSU.DAT  
tHD.STA  
tSU.STO  
SDA  
(in)  
tBUF  
tAA  
tDH  
SDA  
(out)  
tSU.WP  
tHD.WP  
WP  
Write Cycle Timing  
Stop condition  
Start condition  
SCL  
D0 in  
SDA  
tWC  
(Internally controlled)  
Write data  
(Address (n))  
ACK  
Rev.4.00, Jul.13.2005, page 5 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Pin Function  
Serial Clock (SCL)  
The SCL pin is used to control serial input/output data timing. The SCL input is used to positive edge clock data into  
EEPROM device and negative edge clock data out of each device. Maximum clock rate is 400 kHz.  
Serial Input/Output data (SDA)  
The SDA pin is bidirectional for serial data transfer. The SDA pin needs to be pulled up by resistor as that pin is open-  
drain driven structure. Use proper resistor value for your system by considering VOL, IOL and the SDA pin capacitance.  
Except for a start condition and a stop condition which will be discussed later, the SDA transition needs to be  
completed during the SCL low period.  
Data Validity (SDA data change timing waveform)  
SCL  
SDA  
Data  
Data  
change  
change  
Note: High-to-low and low-to-high change of SDA should be done during the SCL low period.  
Rev.4.00, Jul.13.2005, page 6 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Device Address (A0, A1, A2)  
UP to eight devices for 2k, four devices for 4k, can be addressed on the same bus by setting the levels on these pins to  
different combinations. The levels on these pins are compared with the device address code which are input through  
the SDA pin. The device is selected if the compare is successfully done. These pins are internally pulled-down to VSS.  
The device read these pins as Low if unconnected. As for 4k, it is unnecessary for the A0 pin to be connected because  
the corresponding device address code is used as memory address a8.  
Pin Connections for A0 to A2  
Pin connection  
Memory size  
Max connect  
number  
A2  
A1  
A0  
Notes  
1
2k bit  
4k bit  
8
4
VCC/VSS  
*
VCC/VSS VCC/VSS  
×*2  
VCC/VSS VCC/VSS  
Use A0 for memory address a8  
Notes: 1. “VCC/VSS” means that the device address pins are connected to VCC or VSS. These pins are VSS if  
unconnected.  
2. × = Don’t care (Open is also approval.)  
Write Protect (WP)  
When the Write Protect pin (WP) is high, the write protections feature is enabled and operates as shown in the  
following table. When the WP is low, write operations for all memory array are allowed. The read operation is always  
activated irrespective of the WP pin status. The WP pin is internally pull-down to VSS. Write operations for all  
memory array are allowed if unconnected.  
Write Protect Area  
Write protect area  
WP pin status  
2k bit  
4k bit  
VIH  
VIL  
Entire (2k bit)  
Entire (4k bit)  
Normal read/write operation  
Rev.4.00, Jul.13.2005, page 7 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Functional Description  
Start Condition  
A high-to-low transition of the SDA with the SCL high is needed in order to start read, write operation. (See start  
condition and stop condition)  
Stop Condition  
A low-to-high transition of the SDA with the SCL high is a stop condition. The stand-by operation starts after a read  
sequence by a stop condition. In the case of write operation, a stop condition terminates the write data inputs and place  
the device in a internally-timed write cycle to the memories. After the internally-timed write cycle which is specified  
as tWC, the device enters a standby mode. (See write cycle timing)  
Start Condition and Stop Condition  
SCL  
SDA  
(in)  
Start condition  
Stop condition  
Rev.4.00, Jul.13.2005, page 8 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Acknowledge  
All addresses and data words are serially transmitted to and from in 8-bit words. The receiver sends a zero to  
acknowledge that it has received each word. This happens during ninth clock cycle. The transmitter keeps bus open to  
receive acknowledgment from the receiver at the ninth clock. In the write operation, EEPROM sends a zero to  
acknowledge after receiving every 8-bit words. In the read operation, EEPROM sends a zero to acknowledge after  
receiving the device address word. After sending read data, the EEPROM waits acknowledgment by keeping bus open.  
If the EEPROM receives zero as an acknowledge, it sends read data of next address. If the EEPROM receives  
acknowledgment "1" (no acknowledgment) and a following stop condition, it stops the read operation and enters a  
stand-by mode. If the EEPROM receives neither acknowledgment "0" nor a stop condition, the EEPROM keeps bus  
open without sending read data.  
Acknowledge Timing Waveform  
1
2
8
9
SCL  
SDA IN  
Acknowledge  
out  
SDA OUT  
Rev.4.00, Jul.13.2005, page 9 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Device Addressing  
The EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a read or a  
write operation. The device address word consists of 4-bit device code, 3-bit device address code and 1-bit  
read/write(R/W) code. The most significant 4-bit of the device address word are used to distinguish device type and  
this EEPROM uses “1010” fixed code. The device address word is followed by the 3-bit device address code in the  
order of A2, A1, A0. The device address code selects one device out of all devices which are connected to the bus.  
This means that the device is selected if the inputted 3-bit device address code is equal to the corresponding hard-wired  
A2-A0 pin status. As for the 4kbit EEPROMs, some bits of their device address code may be used as the memory  
address bits. For example, A0 is used as a8 of memory address for the 4kbit. The eighth bit of the device address word  
is the read/write(R/W) bit. A write operation is initiated if this bit is low and a read operation is initiated if this bit is  
high. Upon a compare of the device address word, the EEPROM enters the read or write operation after outputting the  
zero as an acknowledge. The EEPROM turns to a stand-by state if the device code is not “1010” or device address  
code doesn’t coincide with status of the correspond hard-wired device address pins A0 to A2.  
Device Address Word  
Device address word (8-bit)  
Device code (fixed)  
Device address code*1  
R/W code*2  
R/W  
2k  
4k  
1
1
0
0
1
1
0
0
A2  
A2  
A1  
A1  
A0  
a8  
R/W  
Notes: 1. A2 to A0 are device address and a8 are memory address.  
2. R/W=“1” is read and R/W = “0” is write.  
Rev.4.00, Jul.13.2005, page 10 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Write Operations  
Byte Write:  
A write operation requires an 8-bit device address word with R/W = “0”. Then the EEPROM sends acknowledgment  
"0" at the ninth clock cycle. After these, EEPROMs receive 8-bit memory address word. Upon receipt of this memory  
address, the EEPROM outputs acknowledgment "0" and receives a following 8-bit write data. After receipt of write  
data, the EEPROM outputs acknowledgment "0". If the EEPROM receives a stop condition, the EEPROM enters an  
internally-timed write cycle and terminates receipt of SCL, SDA inputs until completion of the write cycle. The  
EEPROM returns to a standby mode after completion of the write cycle.  
Byte Write Operation  
Device  
Memory  
address  
address (n)  
Write data (n)  
2k, 4k  
Start  
1 0 1 0  
W
ACK  
R/W  
ACK  
ACK  
Stop  
Page Write:  
The EEPROM is capable of the page write operation which allows any number of bytes up to 8 bytes to be written in a  
single write cycle. The page write is the same sequence as the byte write except for inputting the more write data. The  
page write is initiated by a start condition, device address word, memory address(n) and write data(Dn) with every  
ninth bit acknowledgment. The EEPROM enters the page write operation if the EEPROM receives more write  
data(Dn+1) instead of receiving a stop condition. The a0 to a2 address bits are automatically incremented upon  
receiving write data(Dn+1). The EEPROM can continue to receive write data up to 8 bytes. If the a0 to a2 address bits  
reaches the last address of the page, the a0 to a2 address bits will roll over to the first address of the same page and  
previous write data will be overwritten. Upon receiving a stop condition, the EEPROM stops receiving write data and  
enters internally-timed write cycle.  
Page Write Operation  
Device  
Memory  
address  
address (n)  
Write data (n)  
Write data (n+m)  
2k, 4k  
Start  
W
1 0 1 0  
Stop  
ACK  
ACK  
R/W  
ACK  
ACK  
Rev.4.00, Jul.13.2005, page 11 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Acknowledge Polling:  
Acknowledge polling feature is used to show if the EEPROM is in a internally-timed write cycle or not. This feature is  
initiated by the stop condition after inputting write data. This requires the 8-bit device address word following the start  
condition during a internally-timed write cycle. Acknowledge polling will operate when the R/W code = “0”.  
Acknowledgment “1” (no acknowledgment) shows the EEPROM is in a internally-timed write cycle and  
acknowledgment “0” shows that the internally-timed write cycle has completed. See Write Cycle Polling using ACK.  
Write Cycle Polling using ACK  
Send  
write command  
Send  
stop condition  
to initiate write cycle  
Send  
start condition  
Send  
device address word  
with R/W = 0  
No  
No  
ACK  
returned  
Yes  
Next operation is  
addressing the memory  
Yes  
Send  
Send  
Send  
memory address  
start condition  
stop condition  
Send  
stop condition  
Proceed random address  
read operation  
Proceed write operation  
Rev.4.00, Jul.13.2005, page 12 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Read Operation  
There are three read operations: current address read, random read, and sequential read. Read operations are initiated  
the same way as write operations with the exception of R/W = “1”.  
Current Address Read:  
The internal address counter maintains the last address accessed during the last read or write operation, with  
incremented by one. Current address read accesses the address kept by the internal address counter. After receiving a  
start condition and the device address word(R/W is “1”), the EEPROM outputs the 8-bit current address data from the  
most significant bit following acknowledgment “0”. If the EEPROM receives acknowledgment “1” (no  
acknowledgment) and a following stop condition, the EEPROM stops the read operation and is turned to a standby  
state. In case the EEPROM has accessed the last address of the last page at previous read operation, the current  
address will roll over and returns to zero address. In case the EEPROM has accessed the last address of the page at  
previous write operation, the current address will roll over within page addressing and returns to the first address in the  
same page. The current address is valid while power is on. The current address after power on will be indefinite. The  
random read operation described below is necessary to define the memory address.  
Current Address Read Operation  
Device  
address  
Read data (n+1)  
ACK No ACK  
2k, 4k  
Start  
Note: 1. Don‘t care bit for 4k.  
1 0 1 0  
R
Stop  
R/W  
Rev.4.00, Jul.13.2005, page 13 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Random Read:  
This is a read operation with defined read address. A random read requires a dummy write to set read address. The  
EEPROM receives a start condition, device address word(R/W=0) and memory address sequentially. The EEPROM  
outputs acknowledgment “0” after receiving memory address then enters a current address read with receiving a start  
condition. The EEPROM outputs the read data of the address which was defined in the dummy write operation. After  
receiving acknowledgment “1”(no acknowledgment) and a following stop condition, the EEPROM stops the random  
read operation and returns to a standby state.  
Random Read Operation  
Device  
Memory  
Device  
address  
address (n)  
address  
Read data (n)  
ACK No ACK  
@@@  
# # #  
2k, 4k  
Start  
W
R
1 0 1 0  
1 0 1 0  
Start  
ACK  
R/W  
Stop  
R/W  
ACK  
Dummy write  
Currect address read  
Note: 1. 2nd device address code (#) should be same as 1st (@).  
Sequential Read:  
Sequential reads are initiated by either a current address read or a random read. If the EEPROM receives  
acknowledgment “0” after 8-bit read data, the read address is incremented and the next 8-bit read data are coming out.  
This operation can be continued as long as the EEPROM receives acknowledgment “0”. The address will roll over and  
returns address zero if it reaches the last address of the last page. The sequential read can be continued after roll over.  
The sequential read is terminated if the EEPROM receives acknowledgment “1” (no acknowledgment) and a following  
stop condition.  
Sequential Read Operation  
Device  
address  
Read data (n) Read data (n+1) Read data (n+2) Read data (n+m)  
2k, 4k  
Start  
R
1 0 1 0  
ACK  
ACK  
R/W  
ACK  
ACK  
No ACK  
Stop  
Rev.4.00, Jul.13.2005, page 14 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Notes  
Data protection at VCC On/Off  
When VCC is turned on or off, noise on the SCL and SDA inputs generated by external circuits (CPU, etc) may act as a  
trigger and turn the EEPROM to unintentional program mode. To prevent this unintentional programming, this  
EEPROM has a power on reset function. Be careful of the notices described below in order for the power on reset  
function to operate correctly.  
SCL and SDA should be fixed to VCC or VSS during VCC on/off. Low to high or high to low transition during VCC  
on/off may cause the trigger for the unintentional programming.  
V
CC should be turned off after the EEPROM is placed in a standby state.  
V
CC should be turned on from the ground level(VSS) in order for the EEPROM not to enter the unintentional  
programming mode.  
VCC turn on speed should be longer than 10 µs.  
Write/Erase Endurance and Data retention Time  
The endurance is 105 cycles in case of page programming and 104 cycles in case of byte programming (1% cumulative  
failure rate). The data retention time is more than 10 years when a device is page-programmed less than 104 cycles.  
Noise Suppression Time  
This EEPROM have a noise suppression function at SCL and SDA inputs, that cut noise of width less than 50 ns. Be  
careful not to allow noise of width more than 50 ns.  
Rev.4.00, Jul.13.2005, page 15 of 16  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Package Dimensions  
HN58X2402SFPIAGE / HN58X2404SFPIAGE (PRSP0008DF-B / Previous Code: FP-8DBV)  
JEITA Package Code  
P-SOP8-3.9x4.89-1.27  
RENESAS Code  
PRSP0008DF-B  
Previous Code  
FP-8DBV  
MASS[Typ.]  
0.08g  
NOTE)  
1. DIMENSIONS"*1 (Nom)"AND"*2"  
DO NOT INCLUDE MOLD FLASH.  
2. DIMENSION"*3"DOES NOT  
INCLUDE TRIM OFFSET.  
*1  
D
F
8
5
b
p
Dimension in Millimeters  
Reference  
Symbol  
Min  
Nom  
4.89  
3.90  
Max  
5.15  
Index mark  
Terminal cross section  
( Ni/Pd/Au plating )  
D
E
A 2  
A 1  
A
1
4
0.102  
0.35  
0.15  
0.14  
0.40  
0.20  
0.254  
1.73  
0.45  
*3  
e
bp  
Z
x
M
b p  
b 1  
c
L1  
0.25  
c
1
θ
H E  
e
0
°
8°  
5.84  
6.02  
1.27  
6.20  
x
0.25  
0.10  
L
y
y
Z
0.69  
Detail F  
L
0.406  
0.60  
1.06  
0.889  
L
1
Rev.4.00, Jul.13.2005, page 16 of 16  
Revision History  
HN58X2402SFPIAG/HN58X2404SFPIAG  
Data Sheet  
Rev.  
Date  
Contents of Modification  
Description  
Page  
1.0  
Mar. 30, 2001  
Oct. 24, 2003  
Initial issue  
2.00  
Change format issued by Renesas Technology Corp.  
Ordering Information  
2
Addition of HN58X2402SFPIAGE, HN58X2404SFPIAGE  
Package Dimensions  
17  
2
FP-8DB to FP-8DB, FP-8DBV  
3.00  
4.00  
Dec.14.2004  
Jul.13.2005  
Ordering Information  
Deletion of HN58X2402SFPIAG, HN58X2404SFPIAG  
Package Dimensions  
17  
Deletion of FP-8DB  
1
4
Ordering Information  
Addition of Renesas package codes  
AC Characteristics  
Addition of tHD.WP  
Addition of tSU.WP  
5
Timing Waveforms  
Addition of WP  
16  
Package Dimensions  
Addition of Renesas package codes  
Changed to Renesas formats  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,  
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of  
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is  
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor  
home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to  
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes  
no responsibility for any damage, liability or other loss resulting from the information contained herein.  
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life  
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a  
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater  
use.  
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and  
cannot be imported into a country other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.  
RENESAS SALES OFFICES  
http://www.renesas.com  
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
Renesas Technology America, Inc.  
450 Holger Way, San Jose, CA 95134-1368, U.S.A  
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501  
Renesas Technology Europe Limited  
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.  
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900  
Renesas Technology Hong Kong Ltd.  
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong  
Tel: <852> 2265-6688, Fax: <852> 2730-6071  
Renesas Technology Taiwan Co., Ltd.  
10th Floor, No.99, Fushing North Road, Taipei, Taiwan  
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999  
Renesas Technology (Shanghai) Co., Ltd.  
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China  
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952  
Renesas Technology Singapore Pte. Ltd.  
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Tel: <65> 6213-0200, Fax: <65> 6278-8001  
Renesas Technology Korea Co., Ltd.  
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Tel: <82> 2-796-3115, Fax: <82> 2-796-2145  
Renesas Technology Malaysia Sdn. Bhd.  
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia  
Tel: <603> 7955-9390, Fax: <603> 7955-9510  
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.  
Colophon .3.0  

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