HS3002 [RENESAS]
High Performance Relative Humidity and Temperature Sensor;
| 型号： | HS3002 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | High Performance Relative Humidity and Temperature Sensor |
| 文件： | 总21页 (文件大小：733K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Performance Relative
HS300x
Humidity and Temperature Sensor
Datasheet
Description
Features
The HS300x series is a highly accurate, fully calibrated relative
humidity and temperature sensor. The MEMS sensor features a
proprietary sensor-level protection, ensuring high reliability and
long-term stability.
.
RH accuracy: ±1.5%RH, typical (HS3001, 10 to 90%RH,
25°C)
.
.
14-bit resolution: 0.01%RH, typical
Independent programmable resolution settings: 8, 10, 12, 14-
bits
Integrated calibration and temperature-compensation logic pro-
vides fully corrected RH and temperature values via a standard I2C
output. No user calibration of the output data is required.
.
.
Fast RH response time: 4 seconds time constant, typical
Temperature sensor accuracy: ±0.2°C, typical (HS3001,
HS3002, -10 to +80°C)
The high accuracy, fast measurement response time, and long-
term stability combined with the small package size makes the
HS300x series ideal for a wide number of applications ranging from
portable devices to products designed for harsh environments.
.
Low current consumption: 1.0µA average (8-bit resolution,
1.8V supply), 24.4µA average (14-bit resolution, 3.3V
supply), one RH and temperature measurement per second
The HS300x series digital sensor accurately measures relative
humidity and temperature levels. The measured data is internally
corrected and compensated for accurate operation over a wide
range of temperature and humidity levels – user calibration is not
required.
.
.
Excellent stability against aging
Highly robust protection from harsh environmental conditions
and mechanical shock
.
Very low power consumption
Physical Characteristics
Typical Applications
.
.
.
.
Supply voltage: 2.3V to 5.5V
.
.
.
.
.
.
Climate control systems
Home appliances
Extended supply voltage: 1.8V (-20°C to +125°C)
Operating temperature: -40°C to +125°C
3.0 × 2.41 × 0.8 mm DFN-style 6-LGA package
Weather stations
Industrial automation
Medical equipment
Automotive cabin climate control
Product Image
© 2020 Renesas Electronics Corporation
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April 22, 2020
HS300x Datasheet
Contents
1. Pin Assignments...........................................................................................................................................................................................4
2. Pin Descriptions............................................................................................................................................................................................4
3. Absolute Maximum Ratings..........................................................................................................................................................................5
4. Recommended Operating Conditions...........................................................................................................................................................5
5. Humidity and Temperature Sensor Performance.........................................................................................................................................6
5.1 Humidity Sensor Specification.............................................................................................................................................................6
5.2 Temperature Sensor Specification ......................................................................................................................................................7
5.3 Sleep Current ......................................................................................................................................................................................7
5.4 Humidity Sensor Accuracy Graphs......................................................................................................................................................8
5.5 Temperature Sensor Accuracy Graphs...............................................................................................................................................9
6. Sensor Interface.........................................................................................................................................................................................10
6.1 I2C Features and Timing...................................................................................................................................................................10
6.2 Sensor Slave Address.......................................................................................................................................................................10
6.3 I2C Communication...........................................................................................................................................................................11
6.4 Measurement Mode...........................................................................................................................................................................11
6.5 Measurement Requests (MR) ...........................................................................................................................................................11
6.6 Data Fetch (DF).................................................................................................................................................................................12
6.7 Status Bits .........................................................................................................................................................................................13
6.8 Accessing the Non-volatile Memory ..................................................................................................................................................13
6.9 Setting the Measurement Resolution.................................................................................................................................................14
6.10 Reading the HS300x ID Number.......................................................................................................................................................14
7. Calculating Humidity and Temperature Output...........................................................................................................................................15
8. Application Circuit.......................................................................................................................................................................................15
9. Package Outline Drawings and Land Pattern.............................................................................................................................................16
10. Soldering Information .................................................................................................................................................................................16
11. PCB Layout Guide......................................................................................................................................................................................17
12. Storage and Handling.................................................................................................................................................................................17
13. Quality and Reliability.................................................................................................................................................................................17
14. Ordering Information...................................................................................................................................................................................18
15. Revision History..........................................................................................................................................................................................18
List of Figures
Figure 1. Pin Assignments for 3mm × 2.41mm 6-LGA Package (Top View) .....................................................................................................4
Figure 2. Sleep Current Variation over Temperature, VDD at 3.3V......................................................................................................................7
Figure 3. HS3001 RH Accuracy Tolerance at 25°C ...........................................................................................................................................8
Figure 4. HS3001 RH Accuracy over Temperature............................................................................................................................................8
Figure 5. HS3002 RH Accuracy Tolerance at 25°C ...........................................................................................................................................8
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
Figure 6. HS3002 RH Accuracy over Temperature............................................................................................................................................8
Figure 7. HS3003 RH Accuracy Tolerance at 25°C ...........................................................................................................................................8
Figure 8. HS3003 RH Accuracy over Temperature............................................................................................................................................8
Figure 9. HS3004 RH Accuracy Tolerance at 25°C ...........................................................................................................................................9
Figure 10. HS3004 RH Accuracy over Temperature.............................................................................................................................................9
Figure 11. HS3001/HS3002 Temperature Sensor Accuracy Tolerance...............................................................................................................9
Figure 12. HS3003 Temperature Sensor Accuracy Tolerance.............................................................................................................................9
Figure 13. HS3004 Temperature Sensor Accuracy Tolerance.............................................................................................................................9
Figure 14. Timing Diagram.................................................................................................................................................................................10
Figure 15. START and STOP Condition Waveform............................................................................................................................................11
Figure 16. Measurement Request......................................................................................................................................................................11
Figure 17. Data Fetch........................................................................................................................................................................................12
Figure 18. Sequence of Commands to Enter Programming Mode.....................................................................................................................13
Figure 19. Sequence of Commands to Change the Relative Humidity Resolution..............................................................................................14
Figure 20. HS300x Application Circuit (Top View)..............................................................................................................................................15
Figure 21. Recommended Soldering Profile.......................................................................................................................................................16
Figure 22. Milled PCB Openings for Thermal Isolation.......................................................................................................................................17
List of Tables
Table 1. Pin Descriptions...................................................................................................................................................................................4
Table 2. Absolute Maximum Ratings.................................................................................................................................................................5
Table 3. Operating Conditions...........................................................................................................................................................................5
Table 4. Humidity Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V.........................................................................................................6
Table 5. Temperature Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V ..................................................................................................7
Table 6. I2C Timing Parameters......................................................................................................................................................................10
Table 7. Status Bits .........................................................................................................................................................................................13
Table 8. Non-volatile Memory Registers .........................................................................................................................................................13
Table 9. Register Values for Different Resolution Settings..............................................................................................................................14
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
1. Pin Assignments
Figure 1. Pin Assignments for 3mm × 2.41mm 6-LGA Package (Top View)
VC SDA SCL
3
2
1
Pin 1 marker
on bottom side
4
5
6
VDD NC VSS
2. Pin Descriptions
Table 1.
Pin Descriptions
Pin Number
Name
SCL
SDA
VC
Type
In/out
In/out
―
Description
1
Serial clock.
Serial data.
2
3
4
5
6
Connect a 0.1µF decoupling capacitor from VC to ground.
VDD
NC
In
Supply voltage.
Do not connect.
Ground.
―
VSS
In
[a] “NC” stands for not connected / no connection required / not bonded.
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
3. Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device.
Functional operation of the HS300x at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions might affect
device reliability.
Table 2.
Symbol
Absolute Maximum Ratings
Parameter
Analog Supply Voltage
Conditions
Minimum
-0.3
Maximum
6.0
Units
V
Storage Temperature Range
-55
150
°C
4. Recommended Operating Conditions
Important note: The HS300x series sensors are optimized to perform best in the more common temperature and humidity ranges of 10°C to
50°C and 20% RH to 80% RH, respectively. If operated outside of these conditions for extended periods, especially at high humidity levels, the
sensors may exhibit an offset. In most cases, this offset is temporary and will gradually disappear once the sensor is returned to normal
temperature and humidity conditions. The amount of the shift and the duration of the offset vary depending on the duration of exposure and the
severity of the relative humidity and temperature conditions. The time needed for the offset to disappear can also be decreased by using the
procedures described in sections 10 and 12.
Table 3.
Operating Conditions
Parameter
Condition
Minimum
Typical
Maximum
Units
Operating Supply Voltage
Extended Operating Supply Voltage
Sleep Current
3.3
5.5
5.5
1
V
V
Operating temperature from -20°C to 125°C
1.8
-40°C to 85°C
Sleep Mode
0.6
1
µA
-40°C to 125°C
3
8-bit resolution
1.0
2.0
1.5
1.7
2.8
7.1
24.4
10-bit resolution
2.6
One RH + temperature
measurement/second
Average Current[a]
µA
12-bit resolution
5.5
7.0
14-bit resolution
20.1
24.4
0.10
0.55
1.31
4.50
16.90
Wake-up
8-bit resolution
Humidity or temperature
including the digital
compensation
Measurement Time
10-bit resolution
12-bit resolution
14-bit resolution
ms
°C
Operating Temperature Range
-40
125
[a] Minimum, typical and maximum average currents are given at 1.8V, 3.3V and 5.5V VDD respectively.
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
5. Humidity and Temperature Sensor Performance
5.1 Humidity Sensor Specification
Table 4.
Humidity Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V
Parameter
Condition
Minimum
Typical
Maximum
Units
Range
0
100
±1.8
±2.0
±3.5
±4.5
1.0
%RH
HS3001
HS3002
HS3003
HS3004
8-bit
±1.5
±1.8
±2.5
±3.5
0.7
10% to 90%RH
Accuracy[a]
%RH
20% to 80%RH
Resolution
Hysteresis
%RH
14-bit
0.01
0.015
±1.0
%RH
%RH
Noise in Humidity (RMS)
14-bit
0.014
±0.15
HS3001
HS3002
HS3003
HS3004
10% to 90%RH
20% to 80%RH
Non-Linearity from Response Curve
±0.25
%RH
Long-Term Stability
±0.1
4.0
±0.25
6.0
%RH/Yr
sec
20% to 80% RH Still Air
3.0
Response Time Constant[b] (τH)
[a] Monotonic increases from 10 to 90%RH after sensor has been stabilized at 50%RH.
[b] Initial value to 63% of total variation.
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
5.2 Temperature Sensor Specification
Table 5.
Temperature Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V
Parameter
Condition
Minimum
Typical
Maximum
Units
Range
-40
125
°C
HS3001
HS3002
HS3003
HS3004
8- bit
-10°C to 80°C
±0.2
±0.3
Accuracy
°C
±0.25
±0.3
0.9
±0.35
±0.5
1.5
0°C to 70°C
0.6
0.01
2..0
Resolution
°C
14-bit
0.015
0.025
Sec.
Response Time Constant[a] (τT)
Long-Term Stability
0.02
0.1
°C/Yr
°C/V
°C/V
VDD ≥ 2.8V
0.03
1.25
Supply Voltage Dependency[b]
1.8V < VDD < 2.8V
2.25
[a] Response time depends on system thermal mass and air flow.
[b] Temperature accuracy can be optimized for specified supply voltages upon request.
5.3 Sleep Current
The sleep current of the HS300x series depends on the operating temperature, as shown in the following figure. Note that there is no significant
dependence of the sleep current on the supply voltage.
Figure 2. Sleep Current Variation over Temperature, VDD at 3.3V
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
5.4 Humidity Sensor Accuracy Graphs
The typical and maximum relative humidity sensor accuracy tolerances are shown in the following figures.
Figure 3. HS3001 RH Accuracy Tolerance at 25°C
Figure 4. HS3001 RH Accuracy over Temperature
90
±2.0 ±2.5
±3.0
±2.0
70
50
30
10
±1.5
±2.0
±2.0
0
10
20
40
30
50
60
70
Temperature (°C)
Figure 5. HS3002 RH Accuracy Tolerance at 25°C
Figure 6. HS3002 RH Accuracy over Temperature
90
±2.5
±3.0
70
50
30
10
±1.8
±2.5
±2.5
0
10
20
40
30
50
60
70
Temperature (°C)
Figure 7. HS3003 RH Accuracy Tolerance at 25°C
Figure 8. HS3003 RH Accuracy over Temperature
90
±3.5
±4.0
70
50
30
10
±3.0
±2.5
±3.5
0
10
20
40
30
50
60
70
Temperature (°C)
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
Figure 9. HS3004 RH Accuracy Tolerance at 25°C
Figure 10. HS3004 RH Accuracy over Temperature
90
±4.5
70
50
30
10
±3.5
±4.5
0
10
20
40
30
50
60
70
Temperature (°C)
5.5 Temperature Sensor Accuracy Graphs
The typical and maximum temperature sensor accuracy tolerances are shown in the following figures.
Figure 11. HS3001/HS3002 Temperature
Sensor Accuracy Tolerance
Figure 12. HS3003 Temperature Sensor
Accuracy Tolerance
Figure 13. HS3004 Temperature Sensor
Accuracy Tolerance
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
6. Sensor Interface
The HS300x series sensor uses a digital I2C-compatible communication protocol. To accommodate multiple devices, the protocol uses two
bi-directional open-drain lines: the Serial Data Line (SDA) and the Serial Clock Line (SCL). Pull-up resistors to VDD are required. Several slave
devices can share the bus; however only one master device can be present on the line.
6.1 I2C Features and Timing
The HS300x series sensor operates as a slave device on the I2C bus with support for 100kHz and 400kHz bit rates. Each transmission is
initiated when the master sends a 0 START bit (S), and the transmission is terminated when the master sends a 1 STOP bit (P). These bits are
only transmitted while the SCL line is HIGH.
Figure 14. Timing Diagram
SDA
tSUDAT
tHDSTA
tBUS
tLOW
SCL
tHDSTA
tHDDAT
tHIGH
tSUSTA
tSUSTO
Table 6.
I2C Timing Parameters
Parameter
Symbol
Minimum
Typical
Maximum
Units
SCL Clock Frequency[a]
fSCL
tHDSTA
tLOW
20
0.1
0.6
0.6
0.1
0
400
kHz
µs
µs
µs
µs
µs
µs
µs
µs
START Condition Hold Time Relative to SCL Edge
Minimum SCL Clock LOW Width[b]
Minimum SCL Clock HIGH Width[b]
tHIGH
START Condition Setup Time Relative to SCL Edge
Data Hold Time on SDA Relative to SCL Edge
Data Setup Time on SDA Relative to SCL Edge
STOP Condition Setup Time on SCL
tSUSTA
tHDDAT
tSUDAT
tSUSTO
tBUS
0.5
0.1
0.1
1
Bus Free Time Between STOP Condition and START Condition
[a] The minimum frequency of 20kHz applies to test only; no minimum under normal operations.
[b] Combined LOW and HIGH widths must equal or exceed the minimum SCL period.
6.2 Sensor Slave Address
The HS300x series default I2C address is 44HEX. The device will respond only to this 7-bit address. See section 6.3 for further information.
Custom I2C address can be provided upon request.
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
6.3 I2C Communication
The sensor transmission is initiated when the master sends a 0 START bit (S). The transmission is terminated when the master sends a 1 STOP
bit (P). These bits are only transmitted while the SCL line is HIGH (see Figure 155 for waveforms).
Once the START condition has been set, the SCL line is toggled at the prescribed data rate, clocking subsequent data transfers. Data on the
SDA line is always sampled on the rising edge of the SCL line and must remain stable while SCL is HIGH to prevent false START or STOP
conditions.
Figure 15. START and STOP Condition Waveform
START Condition
STOP Condition
SCL
SCL
START
STOP
SDA
SDA
After the START bit, the master device sends the 7-bit slave address (see section 6.2) to the HS300x, followed by the read/write bit, which
indicates the transfer direction of any subsequent data. This bit is set to 1 to indicate a read from slave to master or set to 0 to indicate a write
from master to slave.
All transfers consist of 8 bits and a response bit: 0 for Acknowledge (ACK) or 1 for Not Acknowledge (NACK). After the ACK is received, another
data byte can be transferred or the communication can be stopped with a STOP bit.
6.4 Measurement Mode
The HS300x is factory-programmed to operate in Sleep Mode. In Sleep Mode, the sensor waits for commands from the master before taking
measurements. The digital core only performs conversions when it receives a Measurement Request command (MR); otherwise, it is always
powered down.
6.5 Measurement Requests (MR)
The MR command is required to wake up the HS300x from its Sleep Mode. Initiate the Measurement Request by sending the 7-bit slave address
followed by an eighth bit = 0 (WRITE).
A measurement cycle consists of a humidity and temperature conversion followed by the digital signal processor (DSP) correction calculations.
At the end of a measurement cycle, the digital output register will be updated before powering down.
The output is always scaled to 14 bits. The order of the bits is big-endian.
Figure 16. Measurement Request
S
1
0
0
0
1
0
0
W A
(0)
S
Wait for
Device Slave Address [6:0]
Slave ACK
Start Condition
Stop Condition
Acknowledge (ACK)
Slave Address Bit
(MSB first)
Read/Write
(Example: Write = 0)
S
S
A
W
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HS300x Datasheet
6.6 Data Fetch (DF)
At the end of a measurement cycle, valid data can be fetched. The status bits of the DF results can be used to detect if the data is valid or stale
(see section 6.7); otherwise, wait for the measurements to complete before performing the DF.
The DF command starts with the 7-bit slave address followed by an eighth bit = 1 (READ). The HS300x as a slave sends an acknowledge
(ACK) indicating success.
The number of data bytes returned by the HS300x is determined by when the master sends the NACK and STOP condition. The full 14 bits of
the humidity data are fetched in the first two bytes. The two MSBs of the first byte are the status bits.
The 14 bits of temperature data follow the humidity data. The last two bits (LSBs) of the fourth data byte are undetermined and should be
masked off. In the event that the temperature data is not needed, the read can be terminated by sending a NACK after the second byte.
Alternatively, if only 8-bit resolution is desired for the temperature output, the read can be terminated after the 3rd byte by issuing a NACK
followed by a stop bit. The measurement time depends on the configured sensor resolution. The table below lists examples when the resolutions
for the relative humidity and temperature measurements are the same. For different relative humidity and temperature resolution settings, the
measurement times in 3 should be used, along with the 0.1 ms wake-up time.
For example, an 8-bit relative humidity measurement and a 12-bit temperature measurement results in a total measurement time of:
0.1 ms + 0.55 ms + 4.5 ms = 5.15 ms.
RH+T measurement times (including wake-up time) at different resolution settings.
Resolution1
(bits)
Measurement
time (ms)
8
1.20
2.72
9.10
10
12
14
33.90
1Same resolutions are assumed for both relative humidity and temperature.
Figure 17.
Data Fetch
S
1
0
0
0
1
0
0
R
(1)
A 15 14 13 12 11 10 9 8 A 7 6 5 4 3 2 1 0 N S
Device Slave Address [6:0]
Humidity Data [13:8]
Humidity Data [7:0]
Wait for
Slave ACK
Master ACK
Master ACK
Master NACK
S
1
0
0
0
1
0
0
R
(1)
A 15 14 13 12 11 10
9
8
A
7
6 5 4 3 2 1 0 A 15 14 13 12 11 10 9 8 A 7 6 5 4 3 2 1 0 N S
Device Slave Address [6:0]
Humidity Data [13:8]
Acknowledge (ACK)
Humidity Data [7:0]
Temp. Data [15:8]
Temp. Data [7:2] Mask [1:0]
Start Condition
Stop Condition
Not Acknowledge
(NACK)
Read/Write
(Read = 1)
S
S
A
2
N
R
Slave Address Bit (MSB first)
Command or Data Bit (Example: Bit 2)
Status Bit
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HS300x Datasheet
6.7 Status Bits
The status bits are used to indicate the current state of the fetched data. The two MSBs of the humidity data byte are the status bits (see the
following table).
Table 7.
Status Bits
Status Bits
Definition
00B
01B
Valid Data: Data that has not been fetched since the last measurement cycle.
Stale Data: Data that has already been fetched since the last measurement cycle.
Note: If a data fetch is performed before or during the first measurement after power-on reset, then the stale status will be
returned, but this data is actually invalid since the first measurement has not been completed.
6.8 Accessing the Non-volatile Memory
The HS300x series non-volatile memory stores its measurement resolution setting and its ID number. To change the sensor resolution or read
the ID number, the master must place the HS300x into programming mode while the chip is powering up. The figure below shows the sequence
of commands needed to enter the programming mode, which must be sent within 10ms after applying power to the sensor. The master must
send the I2C address and a Write bit followed by the command 0xA0|0x00|0x00.
Figure 18. Sequence of Commands to Enter Programming Mode
This command takes 120µs to process, after which the master has access to the non-volatile memory registers listed in the following table. All
of these registers are 16 bits wide.
To return to normal sensor operation and perform measurements, the master must send the I2C address and a Write bit, followed by the
command: 0x80|0x00|0x00.
Table 8.
Non-volatile Memory Registers
Register Description
Address
0x06
0x46
0x11
0x51
0x1E
0x1F
Humidity Sensor Resolution – Read Register (bits [11:10])
Humidity Sensor Resolution – Write Register (bits [11:10])
Temperature Sensor Resolution – Read Register (bits [11:10])
Temperature Sensor Resolution – Write Register (bits [11:10])
Read Sensor ID – Upper 2 bytes
Read Sensor ID – Lower 2 bytes
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
6.9 Setting the Measurement Resolution
The HS300x series relative humidity and temperature measurement resolutions can be set independently to 8, 10, 12, or 14-bits by writing to
the non-volatile memory, and are initially set to 14-bits by default. The procedure to set the humidity sensor resolution is illustrated in Figure
19. The relative humidity and temperature resolution can be read in registers 0x06 and 0x11, respectively, or written in registers 0x46 or 0x51.
The resolution information is stored in bits [11:10] of these registers, as listed in the Table 9. All of the other bits in these registers must be left
unchanged. As such, before writing new resolution settings, the contents of the read registers must be read, and only bits [11:10] can be
changed in the write registers. Once bits [11:10] are changed to set the desired resolution, the entire register must be written back to the HS300x
sensor.
Figure 19. Sequence of Commands to Change the Relative Humidity Resolution
Table 9.
Register Values for Different Resolution Settings
Resolution register
bits [11:10]
Resolution
(bits)
00B
01B
10B
11B
8
10
12
14
The sensor non-volatile memory requires 120µs to load the data into the registers after step 1, and requires 14ms to write the data after step
4. Failure to comply with these processing times may result in data corruption and introduce errors in sensor measurements. The procedure to
change the temperature sensor resolution is the same as that depicted in Figure 19, except the register address in Step 1 must be set to 0x11
and the register address in Step 4 will be 0x51.
6.10Reading the HS300x ID Number
The sensor ID is a 32-bit number, and can be read in a similar fashion as illustrated in steps 1 and 2 of Figure 19, using the appropriate register
address values. The ID number is stored in two registers, with the upper and lower 16 bits stored in register addresses 0x1E and 0x1F,
respectively.
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
7. Calculating Humidity and Temperature Output
The entire output of the HS300x is 4 bytes. The relative humidity (in percent) and the temperature (in degrees Celsius) are calculated with
Equation 1 and Equation 2, respectively.
Humidity [13 : 0]
Humidity [%RH] =
∗100
Equation 1
2
14 −1
Temperature [15 : 2]
Temperature [ oC] =
∗165 − 40
Equation 2
2
14 −1
8. Application Circuit
Figure 20. HS300x Application Circuit (Top View)
VDD
RP
RP
1 SCL
2 SDA
3 VC
VSS 6
NC 5
VDD 4
0.1µF
0.1µF
RP = Pull-up resistor (2.2kΩ typical)
© 2020 Renesas Electronics Corporation
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HS300x Datasheet
9. Package Outline Drawings and Land Pattern
The package outline drawings are appended at the end of this document and are accessible from the link below. The package information is
the most current data available.
www.idt.com/document/psc/6-lga-package-outline-drawing-30-x-241-x-08-mm-body-10mm-pitch-lhg6d1
10. Soldering Information
This section discusses soldering considerations for the HS300x. When a relative humidity sensor is exposed to the high heat associated with
the soldering process, the sensor element tends to dry out. To avoid an offset in the relative humidity readings, the sensor element must be
rehydrated after the soldering process. Care must also be taken when selecting the temperatures and durations involved in the soldering
process to avoid irreversibly damaging the sensor element.
The recommended soldering profile for a lead-free (RoHS-compliant) process is shown below.
Figure 21. Recommended Soldering Profile
It is important to ensure this temperature profile is measured at the sensor itself. Measuring the profile at a larger component with a higher
thermal mass means the temperature at the small sensor will be higher than expected.
For manual soldering, the contact time must be limited to 5 seconds with a maximum iron temperature of 350°C.
In either case, a board wash after soldering is not recommended. Therefore, if a solder paste is used, it is strongly recommended that a
“no-clean” solder paste is used to avoid the need to wash the PCB.
After soldering, the recommended rehydration conditions are either:
.
.
A relative humidity of 75% RH at room temperature for at least 12 hours
A relative humidity of 40% to 50% RH at room temperature for 3 to 5 days
Otherwise, in the relative humidity readings, there might be an initial offset, which will slowly disappear as the sensor is exposed to ambient
conditions.
© 2020 Renesas Electronics Corporation
16
April 22, 2020
HS300x Datasheet
11. PCB Layout Guide
When designing the PCB, undesired heat transfer paths to the HS300x series must be minimized. Excessive heat from other components on
the PCB will result in inaccurate temperature and relative humidity measurements. As such, solid metal planes for power supplies should
be avoided in the vicinity of the sensor since these will act as thermal conductors. To further reduce the heat transfer from other components
on the board, openings can be milled into the PCB as shown in Figure 22.
Figure 22. Milled PCB Openings for Thermal Isolation
12. Storage and Handling
Recommendation: Once the sensors are removed from their original packaging, store them in metal-in antistatic bags.
Avoid using polyethylene antistatic bags as they may affect sensor accuracy.
The nominal storage conditions are 10 to 50°C and humidity levels within 20% to 60%RH. If stored outside of these conditions for extended
periods of time, the sensor readings may exhibit an offset. The sensor can be reconditioned and brought back to its calibration state by applying
the following procedure:
1. Bake at a temperature of 100°C with a humidity < 10%RH for 10 to 12 hours.
2. Rehydrate the sensor at a humidity of 75%RH and a temperature between 20 to 30°C for 12 to 14 hours.
13. Quality and Reliability
The HS300x series is available as a qualified product for consumer and industrial market applications. All data specified parameters are
guaranteed if not stated otherwise.
© 2020 Renesas Electronics Corporation
17
April 22, 2020
HS300x Datasheet
14. Ordering Information
Orderable Part Number
Description and Package
Carrier Type
Temperature
HS3001
HS3002
HS3003
HS3004
Digital Relative Humidity and Temperature Sensor.
Cut Tape
-40°C to +125°C
±1.5%RH (Typical), 3.0 × 2.41 × 0.8 mm, 6-LGA (LHG6D1)
Digital Relative Humidity and Temperature Sensor.
Cut Tape
Cut Tape
Cut Tape
-40°C to +125°C
-40°C to +125°C
-40°C to +125°C
±1.8%RH (Typical), 3.0 × 2.41 × 0.8 mm, 6-LGA (LHG6D1)
Digital Relative Humidity and Temperature Sensor.
±2.5%RH (Typical), 3.0 × 2.41 × 0.8 mm, 6-LGA (LHG6D1)
Digital Relative Humidity and Temperature Sensor.
±3.5%RH (Typical), 3.0 × 2.41 × 0.8 mm, 6-LGA (LHG6D1)
15. Revision History
Revision Date
Description of Change
April 22, 2020
.
.
.
.
Updated Table 3, 4, 5 specifications.
Added non-volatile memory programming instruction.
Added measurement resolution programming and reading sensor ID instructions.
Added PCB layout guide.
August 6, 2018
April 24, 2018
.
Updated temperature sensor response time in Table 5.
.
.
.
.
Clarified Figure 16 and Figure 17.
Update for Equation 2.
Edits for section 6.6.
Template updates for section 9.
February 14, 2018
November 8, 2017
Changed operating voltage and added recommended operating conditions.
Initial release.
© 2020 Renesas Electronics Corporation
18
April 22, 2020
6-LGA Package Outline Drawing
3.0 x 2.41 x 0.8 mm Body, 1.0mm Pitch
LHG6D1, PSC-4719-01, Rev 01, Page 1
2
3
1
6
5
4
6-LGA Package Outline Drawing
3.0 x 2.41 x 0.8 mm Body, 1.0mm Pitch
LHG6D1, PSC-4719-01, Rev 01, Page 2
6
5
4
1
2
3
Package Revision History
Description
Date Created Rev No.
June 25, 2018 Rev 01 Revise Lead Length
Initial Release
Sept 25, 2017 Rev 00
IMPORTANT NOTICE AND DISCLAIMER
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL
SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING
REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND
OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED,
INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible
for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3)
ensuring your application meets applicable standards, and any other safety, security, or other requirements. These
resources are subject to change without notice. Renesas grants you permission to use these resources only for
development of an application that uses Renesas products. Other reproduction or use of these resources is strictly
prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property.
Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims,
damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject
to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources
expands or otherwise alters any applicable warranties or warranty disclaimers for these products.
(Rev.1.0 Mar 2020)
Corporate Headquarters
Contact Information
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
For further information on a product, technology, the most
up-to-date version of a document, or your nearest sales
office, please visit:
www.renesas.com/contact/
Trademarks
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Electronics Corporation. All trademarks and registered
trademarks are the property of their respective owners.
© 2020 Renesas Electronics Corporation. All rights reserved.
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