ISL31493EIUZ-T [RENESAS]
±60V Fault Protected, 5V, RS-485/RS-422 Transceivers with ±25V Common Mode Range; MSOP10, SOIC14; Temp Range: -40° to 85°C;型号: | ISL31493EIUZ-T |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | ±60V Fault Protected, 5V, RS-485/RS-422 Transceivers with ±25V Common Mode Range; MSOP10, SOIC14; Temp Range: -40° to 85°C 驱动 信息通信管理 光电二极管 接口集成电路 驱动器 |
文件: | 总26页 (文件大小:1312K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
±60V Fault Protected, 5V, RS-485/RS-422 Transceivers
with ±25V Common Mode Range
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
ISL31496E, ISL31498E
The ISL31490E, ISL31491E, ISL31492E, ISL31493E,
ISL31495E, ISL31496E, ISL31498E are fault protected, 5V
Features
• Fault Protected RS-485 Bus Pins. . . . . . . . . . . . . . Up to ±60V
powered, differential transceivers that exceed the RS-485 and
RS-422 standards for balanced communication. The RS-485
transceiver pins (driver outputs and receiver inputs) are
protected against faults up to ±60V. Additionally, the extended
common mode range allows these transceivers to operate in
environments with common mode voltages up to ±25V (>2x the
RS-485 requirement), making this RS-485 family one of the
most robust on the market.
• Extended Common Mode Range . . . . . . . . . . . . . . . . . . . ±25V
More than Twice the Range Required for RS-485
• 1/4 Unit Load for up to 128 Devices on the Bus
• High Transient Overvoltage Tolerance. . . . . . . . . . . . . . . ±80V
• Full Fail-safe (Open, Short, Terminated) RS-485 Receivers
• High Rx I for Opto-Couplers in Isolated Designs
OL
Transmitters deliver an exceptional 2.5V (typical) differential
output voltage into the RS-485 specified 54Ω load. This yields
better noise immunity than standard RS-485 ICs, or allows up
to six 120Ω terminations in star network topologies.
• Hot Plug Circuitry - Tx and Rx Outputs Remain Three-State
During Power-up/Power-down
• Choice of RS-485 Data Rates. . . . . . . . . 250kbps to 15Mbps
• Low Quiescent Supply Current . . . . . . . . . . . . . . . . . . . 2.3mA
• Ultra Low Shutdown Supply Current . . . . . . . . . . . . . . . . 10µA
• Pb-Free (RoHS Compliant)
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating, shorted,
or on a terminated but undriven (idle) bus. Rx outputs have high
drive levels - typically 15mA @ V = 1V (for opto-coupled,
OL
isolated applications).
Applications
Half duplex (Rx inputs and Tx outputs multiplexed together)
and full duplex pinouts are available. See Table 1 on page 2 for
key features and configurations by device number.
• Utility Meters/Automated Meter Reading Systems
• High Node Count Systems
• PROFIBUS™ and Field Bus Networks, and Factory
Automation
For fault protected or wide common mode range devices with
cable invert (polarity reversal) or logic supply (V ) pins, please
L
• Security Camera Networks
see the ISL31480E data sheet.
• Building Lighting and Environmental Control Systems
• Industrial/Process Control Networks
30
25
VID = ±1V
B
25
A
12
0
20
15
10
-7
-12
5
RO
-20
-25
0
-5
STANDARD RS-485
TRANSCEIVER
CLOSEST
COMPETITOR
ISL3149xE
TIME (20ns/DIV)
FIGURE 1. EXCEPTIONAL Rx OPERATES AT >15Mbps EVEN WITH A
±25V COMMON MODE VOLTAGE
FIGURE 2. ISL3149XE DELIVERS SUPERIOR COMMON MODE
RANGE vs STANDARD RS-485 DEVICES
December 22, 2011
FN7637.1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2010, 2011. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
TABLE 1. SUMMARY OF FEATURES
HALF/FULL
DUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
QUIESCENT I
(mA)
LOW POWER
SHDN?
PIN
COUNT
CC
PART NUMBER
ISL31490E
EN PINS?
Yes
Full
Full
Half
Full
Half
Full
Half
0.25
0.25
0.25
1
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
2.3
2.3
2.3
2.3
2.3
2.3
2.3
Yes
No
10, 14
ISL31491E
ISL31492E
ISL31493E
ISL31495E
ISL31496E
ISL31498E
No
8
Yes
Yes
Yes
Yes
Yes
Yes
8
10, 14
8
Yes
1
Yes
15
Yes
10, 14
8
15
No
Yes
Ordering Information
PART NUMBER
(Notes 3, 4)
PART
MARKING
TEMP. RANGE
PACKAGE
(Pb-Free)
PKG.
DWG. #
(°C)
ISL31490EIBZ (Note 1)
ISL31490 EIBZ
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
14 Ld SOIC
M14.15
ISL31490EIUZ (Note 1)
ISL31490EIRTZ (Note 1)
ISL31491EIBZ (Note 1)
ISL31492EIBZ (Note 1)
ISL31492EIUZ (Note 1)
ISL31492EIPZ (Note 2)
ISL31492EIRTZ (Note 1)
ISL31493EIBZ (Note 1)
ISL31493EIUZ (Note 1)
ISL31495EIBZ (Note 1)
ISL31495EIUZ (Note 1)
ISL31496EIBZ (Note 1)
ISL31496EIUZ (Note 1)
ISL31498EIBZ (Note 1)
ISL31498EIUZ (Note 1)
NOTES:
1490E
10 Ld MSOP
10 Ld TDFN
8 Ld SOIC
M10.118
L10.3x3A
M8.15
490E
31491 EIBZ
31492 EIBZ
1492E
8 Ld SOIC
M8.15
8 Ld MSOP
8 Ld PDIP
M8.118
E8.3
31492 EIPZ
492E
8 Ld TDFN
14 Ld SOIC
10 Ld MSOP
8 Ld SOIC
L8.3x3K
M14.15
M10.118
M8.15
ISL31493 EIBZ
1493E
31495 EIBZ
1495E
8 Ld MSOP
14 Ld SOIC
10 Ld MSOP
8 Ld SOIC
M8.118
M14.15
M10.118
M8.15
ISL31496 EIBZ
1496E
31498 EIBZ
1498E
8 Ld MSOP
M8.118
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see device information pages for ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E,
ISL31498E. For more information on MSL please see techbrief TB363.
FN7637.1
December 22, 2011
2
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Pin Configurations
ISL31492E, ISL31495E, ISL31498E
ISL31490E, ISL31493E, ISL31496E
(10 LD MSOP, 10 LD TDFN)
TOP VIEW
ISL31490E, ISL31493E, ISL31496E
(14 LD SOIC)
(8 LD MSOP, 8 LD SOIC,
8 LD PDIP, 8 LD TDFN)
TOP VIEW
TOP VIEW
RO
RE
1
2
3
4
5
V
CC
10
9
NC
RO
1
2
3
4
5
6
7
14 V
13 V
12 A
11 B
10 Z
CC
R
D
RO
RE
DE
DI
1
2
3
4
8
7
6
5
V
CC
A
B
Z
R
CC
R
D
B/Z
8
DE
RE
A/Y
7
DI
DE
D
GND
6
GND
Y
DI
GND
GND
9
8
Y
NC
ISL31491E
(8 LD SOIC)
TOP VIEW
V
A
B
Z
CC
1
2
3
4
8
7
6
5
R
D
RO
DI
Y
GND
NOTE: Evaluate creepage and clearance requirements at your maximum fault voltage before using small pitch packages (e.g., MSOP and TDFN).
Truth Tables
RECEIVING
INPUTS
TRANSMITTING
OUTPUT
RO
INPUTS
OUTPUTS
RE
DE
DE
Full Duplex
A-B
RE
X
DE
1
DI
1
Z
0
1
Y
1
Half Duplex
0
0
0
0
0
0
X
X
X
≥ -0.01V
≤ -0.2V
1
0
1
X
1
0
0
0
0
X
High-Z
High-Z
High-Z*
Inputs
Open/Shorted
1
0
X
High-Z*
NOTE: *Low Power Shutdown Mode (see Note 15 on page 10), except for
ISL31491E.
1
1
0
1
0
1
X
X
High-Z*
High-Z
NOTE: *Low Power Shutdown Mode (see Note 15 on page 10), except for
ISL31491E.
FN7637.1
December 22, 2011
3
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Pin Descriptions
8 LD
8 LD
PIN #
(EXCEPT
ISL31491E)
PIN #
(ISL31491E
ONLY)
PIN
10 LD 14 LD
NAME
PIN #
PIN #
FUNCTION
RO
1
2
1
2
Receiver output: If A-B ≥ -10mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and
B are unconnected (floating), shorted together, or connected to an undriven, terminated
bus.
RE
DE
DI
2
3
4
-
-
2
3
4
3
4
5
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE
is high. Internally pulled low.
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They
are high impedance when DE is low. Internally pulled high.
3
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI
forces output Y high and output Z low.
GND
A/Y
5
6
4
-
5
-
6, 7 Ground connection. This is also the potential of the TDFN EPAD.
-
±60V Fault Protected RS-485/RS-422 level, non-inverting receiver input and non
inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1.
B/Z
7
-
-
-
±60V Fault Protected RS-485/RS-422 level, inverting receiver input and inverting driver
output. Pin is an input if DE = 0; pin is an output if DE = 1.
A
B
Y
Z
-
-
8
7
5
6
1
-
9
8
12
11
9
±60V Fault Protected RS-485/RS-422 level, non-inverting receiver input.
±60V Fault Protected RS-485/RS-422 level, inverting receiver input.
±60V Fault Protected RS-485/RS-422 level, non-inverting driver output.
±60V Fault Protected RS-485/RS-422 level, inverting driver output.
-
6
-
7
10
V
8
-
10
13, 14 System power supply input (4.5V to 5.5V).
TDFN exposed thermal pad (EPAD). Connect to GND.
CC
PD
TDFN
ONLY
-
NC
-
-
-
1, 8 No Internal Connection.
FN7637.1
December 22, 2011
4
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Typical Operating Circuits
ISL31492E, ISL31495E, ISL31498E
+5V
+5V
+
+
0.1µF
0.1µF
8
8
V
V
CC
CC
RO
1
2
4
DI
R
D
RE
DE
R
T
R
3
2
B/Z
A/Y
7
6
7
6
B/Z
A/Y
DE
RE
T
3
4
DI
1
RO
R
D
GND
5
GND
5
ISL31490E, ISL31493E, ISL31496E (SOIC PIN NUMBERS SHOWN)
+5V
+5V
+
+
0.1µF
R
0.1µF
13, 14
13, 14
D
V
V
CC
CC
A
B
12
Y
Z
T
9
DI
2
5
RO
R
11
10
3
4
RE
DE
DE 4
3
2
RE
R
10
9
Z
Y
11
12
B
A
T
RO
5
DI
R
D
GND
GND
6, 7
6, 7
ISL31491E
+5V
+5V
+
+
0.1µF
R
0.1µF
1
1
V
V
CC
CC
A
B
8
7
Y
Z
T
5
6
DI
2
3
3
2
RO
DI
R
D
R
6
5
Z
Y
B
A
T
7
8
RO
R
D
GND
4
GND
4
FN7637.1
December 22, 2011
5
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Absolute Maximum Ratings
Thermal Information
V
to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Thermal Resistance (Typical)
θ
(°C/W)
140
105
116
50
135
58
88
θ
JC
(°C/W)
40
60
47
5
50
7
CC
JA
Input Voltages
8 Ld MSOP Package (Notes 5, 8) . . . . . . . .
8 Ld PDIP* Package (Note 6, 8). . . . . . . . .
8 Ld SOIC Package (Note 5, 8) . . . . . . . . . .
8 Ld TDFN Package (Note 7, 9) . . . . . . . . .
10 Ld MSOP Package (Note 5, 8). . . . . . . .
10 Ld TDFN Package (Notes 7, 9) . . . . . . .
14 Ld SOIC Package (Note 5, 8). . . . . . . . .
DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V + 0.3V)
CC
Input/Output Voltages
A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±60V
A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω,
(Note 19) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±80V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V +0.3V)
39
CC
Short Circuit Duration
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .*-see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see
Latch-up (Tested per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . +125°C
*Pb-free PDIPs can be used for through-hole wave solder processing only.
They are not intended for use in Reflow solder processing applications.
Recommended Operating Conditions
Supply Voltage (V ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
CC
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Bus Pin Common Mode Voltage Range. . . . . . . . . . . . . . . . . . -25V to +25V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
6. θ is measured with the component mounted on a low effective thermal conductivity test board in free air.
JA
7. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
JA
Brief TB379 for details.
8. For θ , the “case temp” location is taken at the package top center.
JC
9. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V = 5V, T = +25°C (Note 10).
CC
CC
A
Boldface limits apply over the operating temperature range, -40°C to +85°C.
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(°C) (Note 18) TYP (Note 18) UNITS
DC CHARACTERISTICS
Driver Differential VOUT (No load)
Driver Differential V (Loaded, Figure 3A)
V
V
Full
Full
Full
Full
Full
-
-
V
V
V
V
V
OD1
CC
R
R
R
R
= 100Ω (RS-422)
2.4
1.5
2.0
0.8
3.2
2.5
2.5
1.3
-
OUT
OD2
L
L
L
L
= 54Ω (RS-485)
CC
= 54Ω (PROFIBUS, V ≥ 5V)
CC
= 21Ω (Six 120Ω terminations for Star
-
V
V
V
Configurations, V ≥ 4.75V)
CC
Change in Magnitude of Driver Differential V
for Complementary Output States
ΔV
R
= 54Ω or 100Ω (Figure 3A)
Full
-
-
0.2
OUT
OD
L
Driver Differential V
Load (Figure 3B)
with Common Mode
V
R
R
R
R
R
R
= 60Ω, -7V ≤ V ≤ 12V
CM
Full
Full
Full
Full
Full
Full
1.5
1.7
0.8
-1
2.1
V
OUT
OD3
L
L
L
L
L
L
CC
= 60Ω, -25V ≤ V ≤ 25V (V ≥ 4.75V)
CM CC
2.3
= 21Ω, -15V ≤ V ≤ 15V (V ≥ 4.75V)
CM CC
1.1
-
V
V
V
V
Driver Common-Mode V
OUT
(Figure 3)
V
= 54Ω or 100Ω
-
-
-
3
5
OC
= 60Ω or 100Ω, -20V ≤ V ≤ 20V
-2.5
-
CM
Change in Magnitude of Driver Common-Mode
ΔV
OC
= 54Ω or 100Ω (Figure 3A)
0.2
V
for Complementary Output States
OUT
FN7637.1
December 22, 2011
6
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V = 5V, T = +25°C (Note 10).
CC
CC
A
Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued)
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
DE = V , -25V ≤ V ≤ 25V (Note 12)
(°C) (Note 18) TYP (Note 18) UNITS
Driver Short-Circuit Current
I
Full
Full
Full
-250
-83
-
250
83
mA
mA
mA
OSD
CC
O
I
I
At First Fold-back, 22V ≤ V ≤ -22V
OSD1
OSD2
O
At Second Fold-back,
-13
13
35V ≤ V ≤ -35V
O
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
V
DE, DI, RE
DE, DI, RE
DI
Full
Full
Full
Full
Full
Full
Full
Full
2.5
-
-
-
-
0.8
1
V
IH
V
V
IL
I
-1
-
µA
µA
µA
µA
µA
mA
IN1
DE, RE
-15
-
6
15
250
-
Input/Output Current (A/Y, B/Z)
I
DE = 0V, V = 0V or
CC
5.5V
V
V
V
V
= 12V
= -7V
110
-75
±240
±0.5
IN2
IN
IN
IN
IN
-200
-800
-6
= ±25V
800
6
= ±60V
(Note 21)
Input Current (A, B)
(Full Duplex Versions Only)
I
V
= 0V or 5.5V
V
V
V
V
= 12V
= -7V
Full
Full
Full
Full
-
90
-70
125
-
µA
µA
µA
mA
IN3
CC
IN
IN
IN
IN
-100
-500
-3
= ±25V
±200
±0.4
500
3
= ±60V
(Note 21)
Output Leakage Current (Y, Z) (Full Duplex
Versions Only)
I
RE = 0V, DE = 0V,
= 0V or 5.5V
V
V
V
V
= 12V
= -7V
Full
Full
Full
Full
-
20
-5
200
-
µA
µA
µA
mA
OZD
IN
IN
IN
IN
V
CC
-100
-500
-3
= ±25V
±40
±0.1
500
3
= ±60V
(Note 21)
Receiver Differential Threshold Voltage
Receiver Input Hysteresis
V
-25V ≤ V ≤ 25V
CM
Full
+25
Full
Full
Full
Full
Full
-200
-
-100
25
-10
mV
mV
V
TH
ΔV
-25V ≤ V ≤ 25V
CM
-
TH
Receiver Output High Voltage
V
I
I
I
= -2mA, V = -10mV
ID
V
- 0.5 4.75
-
OH
O
O
O
CC
= -8mA, V = -10mV
ID
2.8
4.2
0.27
22
-
0.4
-
V
Receiver Output Low Voltage
Receiver Output Low Current
V
= 6mA, V = -200mV
ID
-
V
OL
I
V
= 1V, V = -200mV
ID
15
-1
mA
µA
OL
O
Three-State (High Impedance) Receiver Output
Current
I
0V ≤ V ≤ V
0.01
1
OZR
O
CC
Receiver Short-Circuit Current
SUPPLY CURRENT
I
0V ≤ V ≤ V
Full
±12
-
±110
mA
OSR
O
CC
No-Load Supply Current (Note 11)
Shutdown Supply Current
I
DE = V , RE = 0V or V , DI = 0V or V
CC CC CC
Full
Full
-
-
2.3
10
4.5
50
mA
µA
CC
I
DE = 0V, RE = V , DI = 0V or V
CC CC
SHDN
FN7637.1
December 22, 2011
7
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V = 5V, T = +25°C (Note 10).
CC
CC
A
Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued)
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(°C) (Note 18) TYP (Note 18) UNITS
ESD PERFORMANCE
All Pins
Human Body Model
(Tested per JESD22-A114E)
+25
+25
-
-
±2
-
-
kV
V
Machine Model
±700
(Tested per JESD22-A115-A)
DRIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL31490E through ISL31492E)
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
t
t
R
= 54Ω, C = 50pF No CM Load
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
-
320
450
1000
30
ns
ns
PLH, PHL
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
-
-
t
R
= 54Ω, C = 50pF No CM Load
-
6
ns
SKEW
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
-
-
50
ns
t , t
R
= 54Ω, C = 50pF No CM Load
400
650
1200
1200
-
ns
R
F
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
300
-
ns
Maximum Data Rate
f
C
= 820pF (Figure 6)
0.25
1.5
Mbps
ns
MAX
D
Driver Enable to Output High
Driver Enable to Output Low
t
SW = GND (Figure 5), (Notes 13, 20)
-
-
1200
1200
120
120
600
2500
2500
ZH
t
SW = V (Figure 5), (Notes 13, 20)
CC
-
-
ns
ZL
LZ
HZ
Driver Disable from Output Low
Driver Disable from Output High
Time to Shutdown
t
SW = V (Figure 5) (Note 20)
CC
-
-
ns
t
SW = GND (Figure 5) (Note 20)
(Note 15)
-
-
ns
t
60
160
ns
SHDN
Driver Enable from Shutdown to Output High
Driver Enable from Shutdown to Output Low
t
SW = GND (Figure 5), (Notes 15, 16)
-
-
-
-
ns
ZH(SHDN)
t
SW = V (Figure 5), (Notes 15, 16)
CC
ns
ZL(SHDN)
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL31493E, ISL31495E)
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
t
t
R
= 54Ω, C = 50pF No CM Load
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
-
70
125
350
15
ns
ns
PLH, PHL
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
-
-
t
R
= 54Ω, C = 50pF No CM Load
-
3
ns
SKEW
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
-
-
25
ns
t , t
R
= 54Ω, C = 50pF No CM Load
70
230
300
400
-
ns
R
F
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
70
-
ns
Maximum Data Rate
f
C
= 820pF (Figure 6)
1
4
Mbps
ns
MAX
D
Driver Enable to Output High
Driver Enable to Output Low
t
SW = GND (Figure 5), (Note 13)
SW = V (Figure 5), (Note 13)
-
-
350
300
120
120
600
2000
2000
ZH
t
-
-
ns
ZL
LZ
HZ
CC
Driver Disable from Output Low
Driver Disable from Output High
Time to Shutdown
t
SW = V (Figure 5)
CC
-
-
ns
t
SW = GND (Figure 5)
(Note 15)
-
-
ns
t
60
160
ns
SHDN
Driver Enable from Shutdown to Output High
Driver Enable from Shutdown to Output Low
t
SW = GND (Figure 5), (Notes 15, 16)
-
-
-
-
ns
ZH(SHDN)
t
SW = V (Figure 5), (Notes 15, 16)
CC
ns
ZL(SHDN)
FN7637.1
December 22, 2011
8
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V = 5V, T = +25°C (Note 10).
CC
CC
A
Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued)
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(°C) (Note 18) TYP (Note 18) UNITS
DRIVER SWITCHING CHARACTERISTICS (15Mbps Versions; ISL31496E, ISL31498E)
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
t
t
R
= 54Ω, C = 50pF No CM Load
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
-
21
45
80
ns
ns
PLH, PHL
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
-
-
t
R
= 54Ω, C = 50pF No CM Load
-
3
6
ns
SKEW
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
-
-
7
ns
t , t
R
= 54Ω, C = 50pF No CM Load
5
17
30
ns
R
F
D
D
(Figure 4)
-25V ≤ V ≤ 25V
CM
5
-
30
ns
Maximum Data Rate
f
C
= 470pF (Figure 6)
15
25
-
Mbps
ns
MAX
D
Driver Enable to Output High
Driver Enable to Output Low
t
SW = GND (Figure 5), (Note 13)
SW = V (Figure 5), (Note 13)
-
-
100
100
120
120
600
2000
2000
ZH
t
-
-
ns
ZL
LZ
HZ
CC
Driver Disable from Output Low
Driver Disable from Output High
Time to Shutdown
t
SW = V (Figure 5)
CC
-
-
ns
t
SW = GND (Figure 5)
(Note 15)
-
-
ns
t
60
160
ns
SHDN
Driver Enable from Shutdown to Output High
Driver Enable from Shutdown to Output Low
t
SW = GND (Figure 5), (Notes 15, 16)
-
-
-
-
ns
ZH(SHDN)
t
SW = V (Figure 5), (Notes 15, 16)
CC
ns
ZL(SHDN)
RECEIVER SWITCHING CHARACTERISTICS (250kbps Versions; ISL31490E through ISL31492E)
Maximum Data Rate
f
-25V ≤ V ≤ 25V (Figure 7)
CM
Full
Full
Full
Full
0.25
5
200
4
-
Mbps
ns
MAX
, t
Receiver Input to Output Delay
t
-25V ≤ V ≤ 25V (Figure 7)
-
-
-
280
10
50
PLH PHL
CM
Receiver Skew |t
- t
PLH PHL
|
t
(Figure 7)
ns
SKD
Receiver Enable to Output Low
Receiver Enable to Output High
Receiver Disable from Output Low
Receiver Disable from Output High
t
R
= 1kΩ, C = 15pF, SW = V (Figure 8),
CC
-
ns
ZL
L
L
(Notes 14, 20)
t
R
= 1kΩ, C = 15pF, SW = GND (Figure 8),
Full
Full
Full
-
-
-
-
-
-
50
50
50
ns
ns
ns
ZH
L
L
(Notes 14, 20)
t
R
= 1kΩ, C = 15pF, SW = V (Figure 8)
CC
LZ
L
L
(Note 20)
R = 1kΩ, C = 15pF, SW = GND (Figure 8)
L
t
HZ
L
(Note 20)
Time to Shutdown
t
(Notes 15)
Full
Full
60
-
160
-
600
ns
ns
SHDN
Receiver Enable from Shutdown to Output High
t
ZH(SHDN)
R
= 1kΩ, C = 15pF, SW = GND (Figure 8),
2000
L
L
(Notes 15, 17)
Receiver Enable from Shutdown to Output Low
t
R
= 1kΩ, C = 15pF, SW = V (Figure 8),
Full
-
-
2000
ns
ZL(SHDN)
L
L
CC
(Notes 15, 17)
RECEIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL31493E, ISL31495E)
Maximum Data Rate
f
-25V ≤ V ≤ 25V (Figure 7)
CM
Full
Full
Full
Full
1
-
15
90
4
-
Mbps
ns
MAX
, t
Receiver Input to Output Delay
t
-25V ≤ V ≤ 25V (Figure 7)
150
10
50
PLH PHL
CM
Receiver Skew |t
- t
PLH PHL
|
t
(Figure 7)
-
ns
SKD
Receiver Enable to Output Low
t
R
= 1kΩ, C = 15pF, SW = V (Figure 8),
CC
-
-
ns
ZL
L
L
(Note 14)
FN7637.1
December 22, 2011
9
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V = 5V, T = +25°C (Note 10).
CC
CC
A
Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued)
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
= 1kΩ, C = 15pF, SW = GND (Figure 8),
(°C) (Note 18) TYP (Note 18) UNITS
Receiver Enable to Output High
t
R
Full
-
-
50
ns
ZH
L
L
(Note 14)
Receiver Disable from Output Low
Receiver Disable from Output High
Time to Shutdown
t
R
R
= 1kΩ, C = 15pF, SW = V (Figure 8)
CC
Full
Full
Full
Full
-
-
50
50
ns
ns
ns
ns
LZ
L
L
L
t
= 1kΩ, C = 15pF, SW = GND (Figure 8)
-
60
-
-
160
-
HZ
L
t
(Note 15)
R = 1kΩ, C = 15pF, SW = GND (Figure 8),
L
600
2000
SHDN
Receiver Enable from Shutdown to Output High
t
ZH(SHDN)
L
(Notes 15, 17)
Receiver Enable from Shutdown to Output Low
t
R
= 1kΩ, C = 15pF, SW = V (Figure 8),
CC
Full
-
-
2000
ns
ZL(SHDN)
L
L
(Notes 15, 17)
RECEIVER SWITCHING CHARACTERISTICS (15Mbps Versions; ISL31496E, ISL31498E)
Maximum Data Rate
f
-25V ≤ V ≤ 25V (Figure 7)
CM
Full
Full
Full
Full
15
25
35
4
-
Mbps
ns
MAX
, t
Receiver Input to Output Delay
t
-25V ≤ V ≤ 25V (Figure 7)
-
-
-
70
10
50
PLH PHL
CM
Receiver Skew |t
- t
PLH PHL
|
t
(Figure 7)
ns
SKD
Receiver Enable to Output Low
t
R
= 1kΩ, C = 15pF, SW = V (Figure 8),
CC
-
ns
ZL
L
L
(Note 14)
Receiver Enable to Output High
t
R
= 1kΩ, C = 15pF, SW = GND (Figure 8),
Full
-
-
50
ns
ZH
L
L
(Note 14)
Receiver Disable from Output Low
Receiver Disable from Output High
Time to Shutdown
t
R
R
= 1kΩ, C = 15pF, SW = V (Figure 8)
CC
Full
Full
Full
Full
-
-
50
50
ns
ns
ns
ns
LZ
L
L
L
t
= 1kΩ, C = 15pF, SW = GND (Figure 8)
-
60
-
-
160
-
HZ
L
t
(Note 15)
R = 1kΩ, C = 15pF, SW = GND (Figure 8),
L
600
2000
SHDN
Receiver Enable from Shutdown to Output High
t
ZH(SHDN)
L
(Notes 15, 17)
Receiver Enable from Shutdown to Output Low
NOTES:
t
R
= 1kΩ, C = 15pF, SW = V (Figure 8),
Full
-
-
2000
ns
ZL(SHDN)
L
L
CC
(Notes 15, 17)
10. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
11. Supply current specification is valid for loaded drivers when DE = 0V.
12. Applies to peak current. See “Typical Performance Curves” beginning on page 15 for more information.
13. Keep RE = 0 to prevent the device from entering SHDN.
14. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
15. Transceivers (except on the ISL31491E) are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the
parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown.
See “Low Power Shutdown Mode” on page 14.
16. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
17. Set the RE signal high time >600ns to ensure that the device enters SHDN.
18. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
19. Tested according to TIA/EIA-485-A, Section 4.2.6 (±80V for 15µs at a 1% duty cycle).
20. Does not apply to the ISL31491E.
21. See “Caution” statement below the “Recommended Operating Conditions” section on page 6.
FN7637.1
December 22, 2011
10
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Test Circuits and Waveforms
R /2
375Ω
R /2
L
L
DE
DI
DE
DI
V
V
CC
CC
Z
Y
V
Z
Y
CM
V
D
V
OD
D
OD
V
OC
R /2
375Ω
V
R /2
L
L
OC
FIGURE 3B. V AND V WITH COMMON MODE LOAD
FIGURE 3A. V AND V
OD
OD
OC
OC
FIGURE 3. DC DRIVER TEST CIRCUITS
3V
0V
DI
1.5V
PLH
1.5V
PHL
t
t
V
OH
OUT (Z)
37Ω*
V
OUT (Y)
OL
DE
DI
V
CC
Z
+V
OD
C
R
D
D
90%
10%
90%
10%
D
DIFF OUT (Y - Z)
V
CM
Y
375Ω*
-V
OD
SIGNAL
GENERATOR
t
t
R
F
*USED ONLY FOR COMMON
MODE LOAD TESTS
SKEW = |t
- t |
PLH PHL
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
Y
110Ω
V
DI
CC
D
GND
SW
SIGNAL
GENERATOR
C
L
3V
0V
DE
1.5V
1.5V
(Note 15)
PARAMETER
OUTPUT
Y/Z
RE
X
DI
SW
C (pF)
L
t
, t
ZH ZH(SHDN)
t
HZ
t
1/0
0/1
1/0
0/1
1/0
0/1
GND
50
HZ
(Note 15)
OUTPUT HIGH
V
OH
V
- 0.5V
OH
t
t
Y/Z
X
V
50
LZ
CC
OUT (Y, Z)
2.3V
Y/Z
0 (Note 13)
0 (Note 13)
1 (Note 16)
1 (Note 16)
GND
100
100
100
100
0V
ZH
t
Y/Z
V
ZL
CC
t
, t
ZL ZL(SHDN)
t
LZ
(Note 15)
t
Y/Z
GND
V
ZH(SHDN)
CC
OL
OUT (Y, Z)
2.3V
OUTPUT LOW
t
Y/Z
V
CC
ZL(SHDN)
V
+ 0.5V
OL
V
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. DRIVER ENABLE AND DISABLE TIMES
FN7637.1
December 22, 2011
11
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Test Circuits and Waveforms(Continued)
DE
V
CC
+
3V
0V
Z
Y
DI
DI
V
54Ω
OD
C
D
D
-
SIGNAL
GENERATOR
+V
OD
DIFF OUT (Y - Z)
0V
-V
OD
FIGURE 6A. TEST CIRCUIT
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER DATA RATE
RE
B
V
+ 750mV
- 750mV
CM
15pF
B
V
V
CM
CM
RO
R
A
V
A
CM
t
t
PLH
PHL
SIGNAL
GENERATOR
SIGNAL
GENERATOR
V
CC
50%
50%
RO
V
CM
0V
FIGURE 7A. TEST CIRCUIT
FIGURE 7B. MEASUREMENT POINTS
FIGURE 7. RECEIVER PROPAGATION DELAY AND DATA RATE
RE
B
A
1kΩ
V
CC
RO
R
(Note 15)
GND
SW
SIGNAL
GENERATOR
3V
15pF
RE
1.5V
1.5V
0V
PARAMETER
DE
0
A
SW
GND
t
, t
ZH ZH(SHDN)
t
HZ
OUTPUT HIGH
(Note 15)
t
+1.5V
-1.5V
+1.5V
-1.5V
+1.5V
-1.5V
V
HZ
OH
V
- 0.5V
OH
1.5V
RO
t
0
V
LZ
CC
0V
t
(Note 14)
(Note 14)
0
GND
ZH
t
, t
ZL ZL(SHDN)
t
LZ
t
0
V
CC
ZL
(Note 15)
V
CC
t
(Note 17)
0
GND
ZH(SHDN)
RO
1.5V
OUTPUT LOW
V
+ 0.5V
OL
t
(Note 17)
0
V
V
ZL(SHDN)
CC
OL
FIGURE 8A. TEST CIRCUIT
FIGURE 8B. MEASUREMENT POINTS
FIGURE 8. RECEIVER ENABLE AND DISABLE TIMES
FN7637.1
December 22, 2011
12
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Driver (Tx) Features
The RS-485/RS-422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485), and at least
2.4V across a 100Ω load (RS-422). The drivers feature low
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards used for long haul or noisy environments.
RS-422 is a subset of RS-485, so RS-485 transceivers are also
RS-422 compliant. RS-422 is a point-to-multipoint (multidrop)
propagation delay skew to maximize bit width, and to minimize
EMI, and all drivers are three-statable via the active high DE
standard, which allows only one driver and up to 10 (assuming
input.
one unit load devices) receivers on each bus. RS-485 is a true
multipoint standard, which allows up to 32 one unit load devices
The 250kbps and 1Mbps driver outputs are slew rate limited to
(any combination of drivers and receivers) on each bus. To allow
minimize EMI, and to minimize reflections in unterminated or
for multipoint operation, the RS-485 specification requires that
improperly terminated networks. Outputs of the ISL31496E and
drivers must handle bus contention without sustaining any
ISL31498E drivers are not limited, thus faster output transition
damage.
times allow data rates of at least 15Mbps.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
High Overvoltage (Fault) Protection
Increases ruggedness
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long as
Note: The available smaller pitch packages (e.g., MSOP and
4000’, thus the wide CMR is necessary to handle ground
TDFN) may not meet the creepage and clearance (C&C)
potential differences, as well as voltages induced in the cable by
requirements for ±60V levels. The user is advised to determine
external fields.
his C&C requirements before selecting a package type.
The ISL3149xE is a family of ruggedized RS-485 transceivers
The ±60V (referenced to the IC GND) fault protection on the
that improves on the RS-485 basic requirements, and therefore
RS-485 pins, makes these transceivers some of the most rugged
increases system reliability. The CMR increases to ±25V, while
on the market. This level of protection makes the ISL3149xE
the RS-485 bus pins (receiver inputs and driver outputs) include
perfect for applications where power (e.g., 24V and 48V supplies)
fault protection against voltages and transients up to ±60V.
must be routed in the conduit with the data lines, or for outdoor
Additionally, larger than required differential output voltages
applications where large transients are likely to occur. When
(V ) increase noise immunity.
OD
power is routed with the data lines, even a momentary short
between the supply and data lines will destroy an unprotected
device. The ±60V fault levels of this family are at least five times
higher than the levels specified for standard RS-485 ICs. The
ISL3149xE protection is active whether the Tx is enabled or
disabled, and even if the IC is powered down.
Receiver (Rx) Features
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity is
better than ±200mV, as required by the RS-422 and RS-485
specifications.
If transients or voltages (including overshoots and ringing)
greater than ±60V are possible, then additional external
protection is required.
Receiver input (load) current surpasses the RS-422 specification
of 3mA, and is four times lower than the RS-485 “Unit Load (UL)”
requirement of 1mA maximum. Thus, these products are known
as “one-quarter UL” transceivers, and there can be up to 128 of
these devices on a network while still complying with the RS-485
loading specification.
Widest Common Mode Voltage (CMV)
Tolerance Improves Operating Range
RS-485 networks operating in industrial complexes, or over long
distances, are susceptible to large CMV variations. Either of these
operating environments may suffer from large node-to-node
ground potential differences, or CMV pickup from external
electromagnetic sources, and devices with only the minimum
required +12V to -7V CMR may malfunction. The ISL3149xE’s
extended ±25V CMR is the widest available, allowing operation in
environments that would overwhelm lesser transceivers.
Additionally, the Rx will not phase invert (erroneously change
state) even with CMVs of ±40V, or differential voltages as large
as 40V.
The Rx functions with common mode voltages as great as ±25V,
making them ideal for industrial, or long networks where induced
voltages are a realistic concern.
All the receivers include a “full fail-safe” function that guarantees
a high level receiver output if the receiver inputs are unconnected
(floating), shorted together, or connected to a terminated bus
with all the transmitters disabled (i.e., an idle bus).
Rx outputs feature high drive levels (typically 22mA @ V = 1V) to
OL
ease the design of optically coupled isolated interfaces.
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs are three-statable
via the active low RE input (except on the ISL31491E).
High V Improves Noise Immunity and
OD
Flexibility
The ISL3149xE driver design delivers larger differential output
The Rx in the 250kbps and 1Mbps versions include noise filtering
circuitry to reject high frequency signals. The 1Mbps version
typically rejects pulses narrower than 50ns (equivalent to
20Mbps), while the 250kbps Rx rejects pulses below 150ns
(6.7Mbps).
voltages (V ) than the RS-485 standard requires, or than most
OD
RS-485 transmitters can deliver. The typical ±2.5V V provides
OD
more noise immunity than networks built using many other
transceivers.
FN7637.1
December 22, 2011
13
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Another advantage of the large V is the ability to drive more
OD
than two bus terminations, which allows for utilizing the
ISL3149xE in “star” and other multi-terminated, nonstandard
better quality cables (e.g., 22 AWG) may allow increased
transmission distance.
Twisted pair is the cable of choice for RS-485/RS-422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode signals,
which are effectively rejected by the differential receivers in
these ICs.
network topologies. Figure 10 details the transmitter’s V vs
OD
I
characteristic, and includes load lines for four (30Ω) and six
OUT
(20Ω) 120Ω terminations. Figure 10 shows that the driver
typically delivers ±1.3V into six terminations, and the “Electrical
Specification” table guarantees a V of ±0.8V at 21Ω over the
OD
Proper termination is imperative, when using the 15Mbps devices,
to minimize reflections. Short networks using the 250kbps versions
need not be terminated, however, terminations are recommended
unless power dissipation is an overriding concern.
full temperature range. The RS-485 standard requires a
minimum 1.5V V into two terminations, but the ISL3149xE
OD
deliver RS-485 voltage levels with 2x to 3x the number of
terminations.
In point-to-point, or point-to-multipoint (single driver on bus like
RS-422) networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs connecting
receivers to the main cable should be kept as short as possible.
Multipoint (multi-driver) systems require that the main cable be
terminated in its characteristic impedance at both ends. Stubs
connecting a transceiver to the main cable should be kept as
short as possible.
Hot Plug Function
When a piece of equipment powers up, there is a period of time
where the processor or ASIC driving the RS-485 control lines (DE,
RE) is unable to ensure that the RS-485 Tx and Rx outputs are
kept disabled. If the equipment is connected to the bus, a driver
activating prematurely during power-up may crash the bus. To
avoid this scenario, the ISL3149xE devices incorporate a “Hot
Plug” function. Circuitry monitoring V ensures that, during power-
up and power-down, the Tx and Rx outputs remain disabled,
CC
regardless of the state of DE and RE, if V is less than ≈3.5V. This
Built-In Driver Overload Protection
CC
gives the processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states. Figure 9 illustrates the power-up
and power-down performance of the ISL3149xE compared to an RS-
485 IC without the Hot Plug feature.
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged. These
transceivers meet this requirement via driver output short circuit
current limits, and on-chip thermal shutdown circuitry.
DE, DI = V
RE = GND
CC
The driver output stages incorporate a double foldback short
circuit current limiting scheme which ensures that the output
current never exceeds the RS-485 specification, even at the
common mode and fault condition voltage range extremes. The
first foldback current level (≈70mA) is set to ensure that the
driver never folds back when driving loads with common mode
voltages up to ±25V. The very low second foldback current
setting (≈9mA) minimizes power dissipation if the Tx is enabled
when a fault occurs.
5.0
2.5
3.5V
2.8V
VCC
A/Y
0
5.0
2.5
0
R
R
= 1kΩ
= 1kΩ
L
L
ISL3149xE
ISL83088E
In the event of a major short circuit condition, devices also include
a thermal shutdown feature that disables the drivers whenever the
die temperature becomes excessive. This eliminates the power
dissipation, allowing the die to cool. The drivers automatically
re-enable after the die temperature drops about +15°C. If the
contention persists, the thermal shutdown/re-enable cycle repeats
until the fault is cleared. Receivers stay operational during thermal
shutdown.
5.0
2.5
0
RO
ISL3149xE
TIME (40µs/DIV)
FIGURE 9. HOT PLUG PERFORMANCE (ISL3149xE) vs ISL83088E
WITHOUT HOT PLUG CIRCUITRY
Data Rate, Cables, and Terminations
Low Power Shutdown Mode
RS-485/RS-422 are intended for network lengths up to 4000’,
but the maximum system data rate decreases as the
These CMOS transceivers all use a fraction of the power required
by competitive devices, but they also include a shutdown feature
transmission length increases. Devices operating at 15Mbps
may be used at lengths up to 150’ (46m), but the distance can be
increased to 328’ (100m) by operating at 10Mbps. The 1Mbps
versions can operate at full data rates with lengths up to 800’
(244m). Jitter is the limiting parameter at these faster data rates,
so employing encoded data streams (e.g., Manchester coded or
Return-to-Zero) may allow increased transmission distances. The
slow versions can operate at 115kbps, or less, at the full 4000’
(1220m) distance, or at 250kbps for lengths up to 3000’
(915m). DC cable attenuation is the limiting parameter, so using
that reduces the already low quiescent I to a 10µA trickle.
These devices enter shutdown whenever the receiver and driver
CC
are simultaneously disabled (RE = V and DE = GND) for a
CC
period of at least 600ns. Disabling both the driver and the
receiver for less than 60ns guarantees that the transceiver will
not enter shutdown.
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 13, 14, 15,
16 and 17, at the end of the “Electrical Specification” table on
page 10, for more information.
FN7637.1
December 22, 2011
14
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Typical Performance Curves
V
= 5V, T = +25°C; Unless Otherwise Specified.
A
CC
3.6
3.4
3.2
3.0
2.8
90
R
= 20Ω
D
R
= 30Ω
D
80
70
60
50
40
30
20
10
0
+25°C
R
= 100Ω
D
R
= 54Ω
D
+85°C
R
= 100Ω
D
2.6
2.4
2.2
R
= 54Ω
D
0
1
2
3
4
5
-40
-25
0
25
50
75 85
DIFFERENTIAL OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 10. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT
VOLTAGE
FIGURE 11. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
70
60
2.45
2.40
V
, +25°C
OL
V
, +85°C
OL
50
40
30
20
10
0
DE = V , RE = X
CC
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
DE = GND, RE = GND
-10
-20
-30
V
, +85°C
1
OH
V
, +25°C
3
OH
0
2
4
5
-40
-25
0
25
50
75 85
RECEIVER OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 12. SUPPLY CURRENT vs TEMPERATURE
FIGURE 13. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT
VOLTAGE
800
600
400
200
0
340
R
= 54Ω, C = 50pF
D
D
335
330
325
320
315
310
305
300
t
PLH
Y OR Z
t
-200
-400
-600
PHL
A/Y OR B/Z
-70
-50
-30
-10
0
10
30
50
70
-40
-25
0
25
50
75 85
BUS PIN VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 14. BUS PIN CURRENT vs BUS PIN VOLTAGE
FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL31490E, ISL31491E, ISL31492E)
FN7637.1
December 22, 2011
15
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Typical Performance Curves
V
= 5V, T = +25°C; Unless Otherwise Specified. (Continued)
A
CC
8
85
R
= 54Ω, C = 50pF
D
D
R = 54Ω, C = 50pF
D D
7
6
5
4
3
2
1
0
80
75
70
65
60
55
50
t
PLH
t
PHL
|t
- t
|
PLH PHL
-40
0
50
85
-25
25
TEMPERATURE (°C)
75
-40
-25
0
25
50
75 85
TEMPERATURE (°C)
FIGURE 16. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL31490E, ISL31491E, ISL31492E)
FIGURE 17. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL31493E, ISL31495E)
27
4.0
R
= 54Ω, C = 50pF
D
D
R
= 54Ω, C = 50pF
D
D
25
23
21
19
17
15
3.5
3.0
2.5
2.0
t
PLH
t
PHL
|t
- t
|
PLH PHL
-40
-25
0
25
50
75 85
-40
0
50
85
-25
25
75
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 18. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
(ISL31493E, ISL31495E)
FIGURE 19. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE (ISL31496E, ISL31498E)
3.4
R
= 54Ω, C = 50pF
D
D
3.2
3.0
2.8
2.6
2.4
2.2
2.0
|t
- t
|
PLH PHL
-40
0
50
85
-25
25
75
TEMPERATURE (°C)
FIGURE 20. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE (ISL31496E, ISL31498E)
FN7637.1
December 22, 2011
16
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Typical Performance Curves
V
= 5V, T = +25°C; Unless Otherwise Specified. (Continued)
A
CC
A
A
25
25
B
B
VID = ±1V
VID = ±1V
20
15
10
5
20
15
10
5
RO
RO
RO
0
0
5
0
5
RO
0
-5
-5
-10
-15
-10
-15
-20
-25
-20
A
B
A
-25
B
TIME (1µs/DIV)
TIME (400ns/DIV)
FIGURE 21. ±25V RECEIVER PERFORMANCE (ISL31490E, ISL31491E,
ISL31492E)
FIGURE 22. ±25V RECEIVER PERFORMANCE (ISL31493E, ISL31495E)
A
R
= 54Ω, C = 50pF
D
25
D
B
5
0
VID = ±1V
20
15
10
5
DI
5
0
RO
RO
RO
0
5
0
-5
3
2
1
-10
-15
-20
-25
A/Y - B/Z
0
-1
-2
-3
A
B
TIME (20ns/DIV)
TIME (1µs/DIV)
FIGURE 23. ±25V RECEIVER PERFORMANCE (ISL31496E, ISL31498E)
FIGURE 24. DRIVER AND RECEIVER WAVEFORMS (ISL31490E,
ISL31491E, ISL31492E)
R
= 54Ω, C = 50pF
D
R
= 54Ω, C = 50pF
D
D
D
5
0
5
DI
DI
0
5
0
5
0
RO
RO
3
3
2
1
2
1
0
0
A/Y - B/Z
-1
-2
-3
-1
-2
-3
A/Y - B/Z
TIME (400ns/DIV)
TIME (20ns/DIV)
FIGURE 25. DRIVER AND RECEIVER WAVEFORMS (ISL31493E,
ISL31495E)
FIGURE 26. DRIVER AND RECEIVER WAVEFORMS (ISL31496E,
ISL31498E)
FN7637.1
December 22, 2011
17
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Typical Performance Curves
V
= 5V, T = +25°C; Unless Otherwise Specified. (Continued)
CC A
Die Characteristics
SUBSTRATE POTENTIAL (Powered Up) AND TDFN EPAD:
GND
PROCESS:
Si Gate BiCMOS
FN7637.1
December 22, 2011
18
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
REVISION
FN7637.1
CHANGE
December 15, 2011
In “Ordering Information” on page 2, changed Package Drawing Number for ISL31492EIRTZ, 8 Ld TDFN from
L8.3x3A to L8.3x3K . Updated Tape & Reel note from "Add “-T” suffix for tape and reel." to new standard "Add
“-T*” suffix for tape and reel." The "*" covers all possible tape and reel options
In “Thermal Information” on page 6, updated Theta JC for 14 Ld SOIC Package from 38 to 39.
Updated M8.118 on page 20. Corrected lead width dimension in side view 1 from "0.25 - 0.036" to "0.25 - 0.36"
Changed L8.3x3A to L8.3x3K on page 22. In the bottom view, lead height changed from "0.3±0.1" to
"0.4±0.05". Lead width changed from "0.3±0.05" to "0.25±0.05". In the land pattern, lead width changed from
"0.3" to "0.25". In Detail X, changed "0.2 REF" to "0.203 REF".
Updated M8.15 on page 26. Updated to new POD format by removing table and moving dimensions onto
drawing and adding land pattern.
June 17, 2010
FN7637.0
Initial Release
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on
intersil.com: ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E, ISL31496E, ISL31498E
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7637.1
December 22, 2011
19
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Package Outline Drawing
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.25
3°±3°
0.55 ± 0.15
DETAIL "X"
0.85±010
H
C
SEATING PLANE
0.10 C
0.25 - 0.36
0.10 ± 0.05
0.08
C A-B D
M
SIDE VIEW 1
(5.80)
NOTES:
1. Dimensions are in millimeters.
(4.40)
(3.00)
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
(0.65)
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.40)
(1.40)
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
FN7637.1
December 22, 2011
20
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
E
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
0.94
0.05
0.75
0.18
0.09
2.95
2.95
MAX
1.10
0.15
0.95
0.27
0.20
3.05
3.05
NOTES
-B-
0.20 (0.008)
INDEX
AREA
A
A1
A2
b
0.037
0.002
0.030
0.007
0.004
0.116
0.116
0.043
0.006
0.037
0.011
0.008
0.120
0.120
-
1 2
A
B
C
-
TOP VIEW
-
4X θ
0.25
(0.010)
R1
9
R
GAUGE
PLANE
c
-
D
3
SEATING
PLANE
E1
e
4
L
-C-
4X θ
0.020 BSC
0.50 BSC
-
L1
A
A2
E
0.187
0.016
0.199
0.028
4.75
0.40
5.05
0.70
-
SEATING
PLANE
L
6
0.10 (0.004)
-A-
C
C
L1
N
0.037 REF
10
0.95 REF
10
-
b
-H-
A1
7
e
D
R
0.003
0.003
-
-
0.07
-
-
-
0.20 (0.008)
C
R1
θ
0.07
-
a
SIDE VIEW
o
o
o
o
C
L
5
15
5
15
-
o
o
o
o
E
1
0
6
0
6
-
α
-B-
0.20 (0.008)
C
D
END VIEW
Rev. 0 12/02
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
- H -
and are measured at Datum Plane.
Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
- B -
-A -
10. Datums
and
to be determined at Datum plane
.
- H -
11. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
FN7637.1
December 22, 2011
21
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Package Outline Drawing
L8.3x3K
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 9/11
2X 1.95
3.00
6X 0.65
A
B
1
PIN #1
INDEX AREA
6
6
1.50 ±0.10
PIN 1
INDEX AREA
(4X)
0.15
8
4
TOP VIEW
8X 0.25 ±0.05
0.10 M C A
0.40 ± 0.05
B
2.30 ±0.10
BOTTOM VIEW
SEE DETAIL "X"
5
C
0 . 203 REF
0.10 C
C
0.75 ±0.05
0 . 02 NOM.
0 . 05 MAX.
0.08 C
SIDE VIEW
DETAIL "X"
( 2.30)
( 1.95)
NOTES:
( 8X 0.50)
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
(1.50)
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
( 2.90 )
Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.20mm from the terminal tip.
PIN 1
Tiebar shown (if present) is a non-functional feature.
5.
6.
(6x 0.65)
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
( 8 X 0.25)
TYPICAL RECOMMENDED LAND PATTERN
Compliant to JEDEC MO-229 WEEC-2 except for the foot length.
7.
FN7637.1
December 22, 2011
22
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Package Outline Drawing
L10.3x3A
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 5, 3/10
2.0 REF
8X 0.50 BSC
6
3.00
A
PIN 1
INDEX AREA
B
1
5
6
10X 0 . 30
PIN 1
INDEX AREA
3.00
1.50
0.15
(4X)
C
C
A B
0.10
0.05
M
M
10
5
10 X 0.25
4
TOP VIEW
( 2.30 )
2.30
BOTTOM VIEW
0 .80 MAX
SEE DETAIL "X"
0.10 C
C
(2.90)
SEATING PLANE
0.08 C
(1.50)
SIDE VIEW
(10 X 0.50)
5
0 . 2 REF
C
( 8X 0 .50 )
( 10X 0.25 )
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
Angular ±2.50°
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
Tiebar shown (if present) is a non-functional feature.
5.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
Compliant to JEDEC MO-229-WEED-3 except exposed pad length (2.30mm).
7.
FN7637.1
December 22, 2011
23
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Package Outline Drawing
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
4
0.10 C A-B 2X
8.65
A
3
6
DETAIL"A"
0.22±0.03
D
14
8
6.0
3.9
4
0.10 C D 2X
0.20 C 2X
7
PIN NO.1
ID MARK
(0.35) x 45°
4° ± 4°
5
0.31-0.51
0.25M C A-B D
B
3
6
TOP VIEW
0.10 C
H
1.75 MAX
1.25 MIN
0.25
GAUGE PLANE
SEATING PLANE
C
0.10-0.25
1.27
0.10 C
SIDE VIEW
DETAIL "A"
(1.27)
(0.6)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Datums A and B to be determined at Datum H.
(5.40)
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. The pin #1 indentifier may be either a mold or mark feature.
6. Does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm total in excess of lead width at maximum condition.
(1.50)
7. Reference to JEDEC MS-012-AB.
TYPICAL RECOMMENDED LAND PATTERN
FN7637.1
December 22, 2011
24
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Dual-In-Line Plastic Packages (PDIP)
N
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1
2
3
N/2
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
A
A1
A2
B
-
4
-A-
D
E
0.015
0.115
0.014
0.045
0.008
0.355
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
9.01
0.13
7.62
6.10
4
BASE
PLANE
0.195
0.022
0.070
0.014
0.400
-
4.95
0.558
1.77
0.355
10.16
-
-
A2
A
-C-
-
SEATING
PLANE
L
C
L
B1
C
8, 10
D1
B1
eA
A
A
1
-
D1
e
eC
C
D
5
B
eB
D1
E
5
0.010 (0.25) M
C
B S
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
English and Metric dimensions, the inch dimensions control.
e
A
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
e
-
0.430
0.150
-
10.92
3.81
7
B
L
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated
N
8
8
in JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
e
6. E and
pendicular to datum
7. e and e are measured at the lead tips with the leads uncon-
are measured with the leads constrained to be per-
A
-C-
.
B
C
strained. e must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
FN7637.1
December 22, 2011
25
ISL31490E, ISL31491E, ISL31492E, ISL31493E, ISL31495E,
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 3, 3/11
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
AREA
6.20 (0.244)
5.80 (0.228)
0.50 (0.20)
0.25 (0.01)
x 45°
4.00 (0.157)
3.80 (0.150)
8°
0°
1
2
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
1
8
SEATING PLANE
0.60 (0.023)
1.27 (0.050)
1.75 (0.069)
5.00 (0.197)
4.80 (0.189)
2
3
7
6
1.35 (0.053)
-C-
4
5
0.25(0.010)
0.10(0.004)
1.27 (0.050)
0.51(0.020)
0.33(0.013)
5.20(0.205)
SIDE VIEW “A
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN7637.1
December 22, 2011
26
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