ISL32704EIAZ [RENESAS]
Ultra-Low EMI, Smallest Package Isolated RS-485 Transceiver;
| 型号： | ISL32704EIAZ |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | Ultra-Low EMI, Smallest Package Isolated RS-485 Transceiver |
| 文件： | 总14页 (文件大小：743K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATASHEET
ISL32704E
FN8860
Rev.4.00
Feb 12, 2018
Ultra-Low EMI, Smallest Package Isolated RS-485 Transceiver
The ISL32704E is a galvanically isolated, differential bus
Features
transceiver designed for bidirectional data transmission and
meeting the RS-485 and RS-422 standards for balanced
communication. Each of the bus terminals, A and B, is
protected against ±15kV ESD strikes without latch-up.
• 4Mbps data rate
• 2.5kV
isolation per UL 1577
RMS
• 600V
working voltage per VDE 0884
RMS
The device uses Giant Magnetoresistance (GMR) as isolation
technology. A unique ceramic/polymer composite barrier
provides excellent isolation and virtually unlimited barrier life.
• 3V to 5V power supplies
• Single unit load receiver input
• Driver drives up to 150 unit loads
The part is available in a 16 Ld QSOP package offering
unprecedented miniaturization, and in a 16 Ld wide-body SOIC
package providing true 8 millimeter creepage distance.
• 50kV/µs (typical), 30kV/µs (minimum) common-mode
transient immunity
• 44000 years barrier life
The ISL32704E delivers a minimum differential output voltage
of 1.5V into a 54Ω differential load for excellent data integrity
over long cable lengths.
• 15kV ESD bus-pin protection
• Thermal shutdown protection
• -40°C to +85°C temperature range
• Meets or exceeds ANSI RS-485
• 16 Ld QSOP and 0.3” true 8mm 16 Ld SOIC packages
• UL 1577 recognized
The device is compatible with 3V and 5V input supplies,
allowing interface to standard microcontrollers without
additional level shifting.
Current limiting and thermal shutdown features protect
against output short circuits and bus contention that may
cause excessive power dissipation. Receiver inputs feature a
“fail-safe if open” design, ensuring a logic high R-output if A/B
are floating.
• VDE V0884-10 certified
Applications
• Factory automation
Related Literature
For a full list of related documents, visit our website
• ISL32704E product page
• Security networks
• Building environmental control systems
• Industrial/process control networks
• Level translators (i.e., RS-232 to RS-485)
Isolation
Barrier
Isolation
3.3V
5V
5V
3.3V
Barrier
100n
100n
100n
100n
1
16
16
1
VDD1
VDD2
VDD2
VDD1
11
15
12
9
11
15
12
9
VDD2X
ISODE
XDE
A
VDD2X
ISODE
XDE
A
2
4
5
6
2
4
5
6
542R
135R
542R
R
R
RE
DE
D
RE
DE
D
120R
10
13
10
13
B
B
ISOR
GND2
14
ISOR
GND2
14
GND1
GND1
3
3
ISL32704EIAZ
ISL32704EIAZ
Isolation
Barrier
Isolation
3.3V
5V
5V
3.3V
Barrier
100n
100n
100n
100n
1
16
VDD2
16
VDD2
1
542R
135R
VDD1
VDD1
3
4
5
6
3
4
5
6
R
R
12
13
10
12
13
10
A
A
120R
RE
DE
D
RE
DE
D
B
B
ISODE
ISODE
542R
GND1
2,8
GND2
GND2
GND1
2,8
9,15
9,15
ISL32704EIBZ
ISL32704EIBZ
FIGURE 1. TYPICAL ISOLATED HIGH-SPEED RS-485 APPLICATIONS
FN8860 Rev.4.00
Feb 12, 2018
Page 1 of 14
ISL32704E
Ordering Information
PART NUMBER
TEMP. RANGE
(°C)
PACKAGE
(RoHS COMPLIANT)
(Notes 3, 4)
ISL32704EIAZ (Note 1)
ISL32704EIBZ (Note 2)
ISL32704EVAL1Z
ISL32704EVAL2Z
NOTES:
PART MARKING
PKG. DWG. #
M16.15B
M16.3A
32704EIAZ
-40 to +85
-40 to +85
16 Ld QSOP
16 Ld SOIC
32704EIBZ
Evaluation board for ISL32704EIAZ
Evaluation board for ISL32704EIBZ
1. Add “-T7A” suffix for 250 unit or “-T” suffix for 2500 unit tape and reel options. Refer to TB347 for details about reel specifications.
2. Add “-T7A” suffix for 250 unit or “-T” suffix for 1000 unit tape and reel options. Refer to TB347 for details about reel specifications.
3. These Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified
at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), see the ISL32704E product information page. For more information about MSL, see TB363.
Pin Configurations
ISL32704E
(16 LD QSOP)
TOP VIEW
ISL32704E
(16 LD WB-SOIC)
TOP VIEW
VDD1
GND1
R
1
16 VDD2
15 GND2
14 NC
VDD1
R
1
2
3
4
5
6
7
8
16 VDD2
2
3
4
5
6
7
8
15 ISODE
14 GND2
13 ISOR
12 XDE
GND1
RE
RE
13 B
DE
DE
12 A
D
11 VDD2X
D
11 NC
NC
NC
10
9
B
A
NC
10 ISODE
GND1
9
GND2
D
ISODE
XDE
DE
D
ISODE
DE
B
A
B
A
R
R
RE
ISOR
RE
Truth Table
Truth Table
TRANSMITTING
RECEIVING
INPUTS
OUTPUTS
INPUTS
DE
OUTPUT
RE
X
DE
1
D
1
0
X
X
ISODE
B
0
A
1
RE
0
A-B
R
1
1
1
0
0
0
0
0
1
0
≥0.2V
X
1
1
0
0
≤-0.2V
0
0
0
High-Z
High-Z
High-Z
High-Z
0
Inputs Open/Shorted
1
1
0
1
X
X
High-Z
High-Z
1
FN8860 Rev.4.00
Feb 12, 2018
Page 2 of 14
ISL32704E
Pin Descriptions
PIN NUMBER
16 Ld
SOIC
16 Ld
QSOP
PIN
NAME
FUNCTION
1
3
1
2
3
4
VDD1 Input power supply.
R
Receiver output. R is high when A-B ≥ 200mV, and when A and B are floating. R is low when A-B ≤ -200mV.
2, 8
4
GND1 Input power supply ground return. Dual ground pins are connected internally.
RE
DE
Receiver output enable. R is enabled when RE is low. R is high impedance when RE is high. If the Rx enable function is
not required, connect RE directly to GND1.
5
5
Driver output enable. The driver outputs, A and B, are enabled when DE is high. They are high impedance when DE is low.
If the Tx enable function is not required, connect DE to VDD1 (Pin 1) through a 1kΩ or greater resistor.
6
7, 11, 14
12
6
7, 8
9
D
NC
A
Driver input. A low on D forces output A low and output B high. A high on D forces output A high and output B low.
No internal connection.
±15kV ESD protected, noninverting bus terminal. This pin is the noninverting receiver input when DE = 0 and the
noninverting driver output when DE = 1.
13
10
B
±15kV ESD protected, inverting bus terminal. This pin is the inverting receiver input when DE = 0 and the inverting driver
output when DE = 1.
-
-
11
12
VDD2X Transceiver power supply. Connect to VDD2 (Pin 16).
XDE
External driver enable. Allows for enabling the driver from the bus side. Connect this pin to ISODE to control the driver
from the controller side. This pin must not be left floating.
-
13
14
15
16
ISOR Isolated receiver output for test purpose only. This pin is used for testing and should be left unconnected.
GND2 Output power supply ground return. Dual ground pins are connected internally.
ISODE Isolated DE output.
9, 15
10
16
VDD2 Isolator output power supply.
Typical Operating Circuits
3.3V
5V
3.3V
5V
ISOLATION
BARRIER
ISOLATION
BARRIER
100n
100n
100n
100n
1
11
16
1
16
VDD2
VDD1
DE
VDD2X VDD2
VDD1
5
6
ISODE 15
XDE 12
5
6
DE
ISODE 10
1.09k
127R
1.09k
1.09k
127R
1.09k
A
9
A
B
12
13
D
D
2
4
R
3
4
R
B 10
RE
ISOR 13
RE
GND1
GND2
14
GND1
2,8
GND2
9,15
3
ISL32704EIAZ
ISL32704EIBZ
FIGURE 2. TYPICAL OPERATING CIRCUITS
FN8860 Rev.4.00
Feb 12, 2018
Page 3 of 14
ISL32704E
Absolute Maximum Ratings (Note 17)
Thermal Information
Supply Voltages (Note 7)
VDD1 to GND1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V
VDD2 to GND2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Thermal Resistance (Typical)
16 Ld WB-SOIC Package (Notes 5, 6) . . . .
16 Ld QSOP Package (Notes 5, 6) . . . . . . .
(°C/W)
34
63
(°C/W)
17
35
JA
JC
Input Voltages, D, DE, RE. . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V
Input/Output Voltages
A, B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V +1V)
Short-Circuit Duration, A, B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . See “ESD PERFORMANCE” on page 5
+0.5V)
Maximum Junction Temperature (Plastic Package) . . . .-55°C to +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-55°C to +150°C
Maximum Power Dissipation (WB-SOIC) . . . . . . . . . . . . . . . . . . . . . .800mW
Maximum Power Dissipation (QSOP). . . . . . . . . . . . . . . . . . . . . . . . .675mW
Solder Profile . . . . . . . . . . . . . . . . . . . . . . . . . Per JEDEC J-STD-020C, MSL1
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
DD1
DD1
Recommended Operating Conditions
Supply Voltages
V
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0V to 5.5V
DD1
, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
DD2 DD2X
High-Level Digital Input Voltage, V
IH
V
V
= 3.3V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V to V
= 5.0V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0V to V
DD1
DD1
DD1
DD1
Low-Level Digital Input Voltage, V . . . . . . . . . . . . . . . . . . . . . . . .0V to 0.8V
IL
Input Voltage at any Bus Terminal
(separately or common-mode), V V . . . . . . . . . . . . . . . . . . . .-7V to 12V
I, IC
Differential Input Voltage (Note 8), V . . . . . . . . . . . . . . . . . . . . .-7V to 12V
ID
High-Level Output Current (Driver), I . . . . . . . . . . . . . . . . . . . . . . . . 60mA
OH
High-Level Digital Output Current (Receiver), I . . . . . . . . . . . . . . . . . 8mA
OH
Low-Level Output Current (Driver), I . . . . . . . . . . . . . . . . . . . . . . . . . -60mA
OL
Low-Level Digital Output Current (Receiver), I . . . . . . . . . . . . . . . . . -8mA
OL
Junction Temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +100°C
J
Ambient Operating Temperature, T . . . . . . . . . . . . . . . . . .-40°C to +85°C
A
Digital Input Signal Rise and Fall Times, t , t . . . . . . . . . . . . . . DC Stable
IR IF
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. is measured in free air with the component soldered to a double-sided board.
JA
6. For , the “case temp” location is the center of the package top side.
JC
Electrical Specifications Test Conditions: T
to T
, V
MAX DD1
= V
= 4.5V to 5.5V; unless otherwise stated
DD2
MIN
(see (Note 7).
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP MAX UNIT
DC CHARACTERISTICS
Driver Line Output Voltage (V , V ) (Note 7)
V
No load
No load
V
V
V
V
V
V
V
V
V
A
B
O
DD2
DD2
DD2
Driver Differential Output Voltage (Note 8)
Driver Differential Output Voltage (Note 8)
V
V
OD1
OD2
R
R
R
R
= 54Ω
1.5
2.3
L
L
L
L
Change in Magnitude of Differential Output Voltage (Note 13)
Driver Common-Mode Output Voltage
V
= 54Ω or 100Ω
= 54Ω or 100Ω
= 54Ω or 100Ω
0.01 0.2
3
OD
V
OC
Change in Magnitude of Driver Common-Mode Output Voltage
(Note 13)
V
OC
0.01 0.20
Bus Input Current (A, B) (Notes 10, 14)
I
DE = 0V
V
V
= 12V
= -7V
1
mA
mA
µA
IN2
IN
IN
-0.8
-10
High-Level Input Current (D, DE, RE)
Low-Level Input Current (D, DE, RE)
Absolute Short-Circuit Output Current
Supply Current
I
V = 3.5V
10
IH
I
I
V = 0.4V
µA
IL
I
I
DE = V
, -7V ≤ V or V ≤ 12V
±250 mA
OS
DD1
A
B
I
V
V
= 5V
4
3
6
4
mA
mA
mV
mV
DD1
DD1
DD1
= 3.3V
Positive-Going Input Threshold Voltage
Negative-Going Input Threshold Voltage
V
-7V ≤ V ≤ 12V
CM
200
TH+
V
-7V ≤ V ≤ 12V
CM
-200
TH-
FN8860 Rev.4.00
Feb 12, 2018
Page 4 of 14
ISL32704E
Electrical Specifications Test Conditions: T
to T
, V
MAX DD1
= V
= 4.5V to 5.5V; unless otherwise stated
DD2
MIN
(see (Note 7). (Continued)
PARAMETER
Receiver Input Hysteresis
Differential Bus Input Capacitance
Receiver Output High Voltage
Receiver Output Low Voltage
High impedance Output Current
Receiver Input Resistance
Supply Current
SYMBOL
TEST CONDITIONS
MIN
TYP MAX UNIT
V
V
= 0V
70
9
mV
pF
V
HYS
CM
C
12
D
V
I
I
= -20µA, V = -50mV
ID
V
- 0.2 V
DD1 DD1
OH
O
O
V
= +20µA, V = -200mV
ID
0.2
1
V
OL
OZ
I
0.4V ≤ V ≤ (V
- 0.5)
-1
µA
kΩ
mA
O
DD2
R
-7V ≤ V ≤ 12V
12
IN
CM
I
DE = V
, no load
DD1
5
16
DD2
ESD PERFORMANCE
RS-485 Bus Pins (A, B)
Human body model discharge to GND2
Human body model discharge to GND1
±15
±2
kV
kV
All Pins (R, RE, D, DE)
SWITCHING CHARACTERISTICS
V
= 5V, V
= 5V
DD2
DD1
Data Rate
DR
R
= 54Ω, C = 50pF
4
Mbps
ns
L
O
O
L
Propagation Delay (Notes 8, 15)
Pulse Skew (Notes 8, 16)
t
V
V
= -1.5V to 1.5V, C = 15pF
48
6
150
15
50
50
50
50
PD
(P)
L
t
= -1.5V to 1.5V, C = 15pF
L
ns
SK
Output Enable Time to High Level
Output Enable Time to Low Level
Output Disable Time from High Level
Output Disable Time from Low Level
Common-Mode Transient Immunity
t
C
C
C
C
= 15pF
= 15pF
= 15pF
= 15pF
33
33
33
33
50
ns
PZH
L
t
ns
PZL
L
t
ns
PHZ
L
t
ns
PLZ
L
CMTI
V
= 1500 V , t
DC TRANSIENT
= 25ns
30
4
kV/µs
CM
V
= 3.3V, V
= 5V
DD2
DD1
Data Rate
DR
R
= 54Ω, C = 50pF
Mbps
ns
L
O
O
L
Propagation Delay (Notes 9, 15)
Pulse Skew (Notes 9, 16)
t
V
V
= -1.5V to 1.5V, C = 15pF
48
6
150
20
50
50
50
50
PD
(P)
L
t
= -1.5V to 1.5V, C = 15pF
L
ns
SK
Output Enable Time to High Level
Output Enable Time to Low Level
Output Disable Time from High Level
Output Disable Time from Low Level
Common-Mode Transient Immunity
NOTES: (applies to both driver and receiver sections)
t
C
C
C
C
= 15pF
= 15pF
= 15pF
= 15pF
33
33
33
33
50
ns
PZH
L
t
ns
PZL
L
t
ns
PHZ
L
t
ns
PLZ
CMTI
L
V
= 1500 V , t
DC TRANSIENT
= 25ns
30
kV/µs
CM
7. All voltages on the isolator primary side are with respect to GND1. All line voltages and common-mode voltages on the isolator secondary or bus side
are with respect to GND2.
8. Differential I/O voltage is measured at the noninverting bus terminal A with respect to the inverting terminal B.
9. Skew limit is the maximum propagation delay difference between any two devices at +25°C.
10. The power-off measurement in ANSI Standard EIA/TIA-422-B applies to disabled outputs only and is not applied to combined inputs and outputs.
11. All typical values are at V
, V
= 5V or V
= 3.3V and T = +25°C.
DD1 A
DD1 DD2
12. -7V < V < 12V; 4.5 < V < 5.5V.
CM DD
13. V and V are the changes in magnitude of V and V respectively, that occur when the input is changed from one logic state to the other.
OD OC OD OC
14. This applies for both power-on and power-off; refer to ANSI standard RS-485 for exact condition. The EIA/TIA-422 -B limit does not apply for a
combined driver and receiver terminal.
15. Includes 10ns read enable time. Maximum propagation delay is 25ns after read assertion.
16. Pulse skew is defined as |t
- t | of each channel.
PLH PHL
17. The relevant test and measurement methods are given in the “Electromagnetic Compatibility” on page 7.
18. External magnetic field immunity is improved by this factor if the field direction is “end-to-end” rather than “pin-to-pin” (see diagram in
“Electromagnetic Compatibility” on page 7).
FN8860 Rev.4.00
Feb 12, 2018
Page 5 of 14
ISL32704E
Insulation Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP MAX UNIT
Creepage Distance (External)
Per IEC 60601
WB-SOIC 8.03
8.3
mm
mm
µm
Ω
QSOP
3.2
12
Total Barrier Thickness (Internal)
Barrier Resistance
13
14
R
C
500V
>10
IO
Barrier Capacitance
f = 1MHz
7
pF
IO
Leakage Current
240V
, 60Hz
RMS
0.2
µA
RMS
RMS
RMS
Comparative Tracking Index
CTI
Per IEC 60112
At maximum operating temperature
≥175
1000
1500
V
V
High Voltage Endurance
(Maximum Barrier Voltage for Indefinite Life)
V
IO
V
DC
Barrier Life
100°C, 1000V
, 60% CL activation energy
44000
TYP
Years
RMS
Magnetic Field Immunity (Note 17)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX UNIT
V
= 5V, V = 5V
DD2
DD1
Power Frequency Magnetic Immunity
Pulse Magnetic Field Immunity
H
50Hz/60Hz
t = 8µs
P
2800 3500
4000 4500
4000 4500
2.5
A/m
A/m
A/m
PF
H
PM
Damped Oscillatory Magnetic Field
Cross-Axis Immunity Multiplier (Note 18)
H
0.1Hz to 1MHz
OSC
K
X
V
= 3.3V, V = 5V
DD2
DD1
Power Frequency Magnetic Immunity
Pulse Magnetic Field Immunity
H
50Hz/60Hz
1000 1500
1800 2000
1800 2000
2.5
A/m
A/m
A/m
PF
H
t = 8µs
P
PM
Damped Oscillatory Magnetic Field
Cross-Axis Immunity Multiplier (Note 18)
H
0.1Hz to 1MHz
OSC
K
X
FN8860 Rev.4.00
Feb 12, 2018
Page 6 of 14
ISL32704E
Safety and Approvals
VDE V 0884-10
Application Information
The ISL32704E is an isolated RS-485 transceiver designed for
high-speed data transmission of up to 4Mbps.
Basic Isolation; VDE File Number 5016933-4880-0001/229067
RS-485 and Isolation
• Working voltage (V ) 600V
IORM
(848V ); basic insulation,
PK
RMS
pollution degree 2
RS-485 is a differential (balanced) data transmission standard for
use in long haul network or noisy environments. It is a true
multipoint standard, which allows up to 32 one-unit load devices
(any combination of drivers and receivers) on a bus. To allow for
multipoint operation, the RS-485 specification requires that
drivers must handle bus contention without sustaining any
damage.
• Transient overvoltage (V
) 4000V
IOTM
PK
• Each part tested at 1590V for 1s, 5pC partial discharge limit
PK
• Samples tested at 4000V for 60s, then 1358V for 10s
with 5pC partial discharge limit
PK
PK
SYMBOL
SAFETY-LIMITING VALUES
VALUE UNIT
An important advantage of RS-485 is its wide common-mode
range, which specifies that the driver outputs and the receiver
inputs withstand signals ranging from +12V to -7V. This
T
Safety Rating Ambient Temperature
Safety Rating Power (180°C)
180
270
54
°C
mW
mA
S
P
S
common-mode range is the sum of the ground potential difference
between driver and receiver, V
, the driver output
I
Supply Current Safety Rating (total of
supplies)
GPD
S
common-mode offset, V , and the longitudinally coupled noise
OC
along the bus lines, V : V = V
CM GPD
+ V + V .
OC n
n
UL 1577
V
CC1
V
CC2
Component Recognition Program File Number: E483309
V
N
- Working voltage (V ) 600V (848V ); basic
insulation, pollution degree 2
IORM PK
RMS
D
R
R
T
R
T
D
R
- Transient overvoltage (V ) 4000V
IOTM
- Each part tested at 3000 V
PK
V
OC
(4243V ) for 1s
V
CM
RMS
- Each lot samples tested at 2500 V
PK
(3536V ) for 60s
RMS
PK
V
GPD
GND
GND
2
1
Electromagnetic Compatibility
FIGURE 3. COMMON-MODE VOLTAGES IN A NON-ISOLATED DATA LINK
The ISL32704E is fully compliant with generic EMC standards
EN50081, EN50082-1, and the umbrella line-voltage standard
for information technology equipment (ITE) EN61000. The
isolator’s Wheatstone bridge configuration and differential
magnetic field signaling ensure excellent EMC performance
against all relevant standards. Compliance tests have been
conducted in the following categories:
However, in networks using isolated transceivers, such as the
ISL32704E, the supply and signal paths of the driver and receiver
bus circuits are galvanically isolated from their local mains
supplies and signal sources.
V
V
V
CC2
CC1
CC2-ISO
TABLE 1. COMPLIANCE TEST CATEGORIES
V
N
ISO
EN50081-1
EN50082-2
EN50204
D
R
R
T
R
T
D
R
Residential,
Commercial,
and Light
Industrial:
Methods
Industrial Environment
EN61000-4-2 (ESD),
EN61000-4-3(ElectromagneticField telephones
Immunity)
Radiated field
from digital
V
= 0V
CM
R
ISO
V
OC
V
CM
EN61000-4-4 (EFT)
GND
2-ISO
EN55022,
EN55014
EN61000-4-6 (RFI Immunity)
EN61000-4-8 (Power Frequency
Magnetic Field immunity)
EN61000-4-9 (Pulsed Magnetic
Field)
V
GPD
GND
GND
2
1
FIGURE 4. COMMON-MODE VOLTAGES IN AN ISOLATED DATA LINK
Because the ground potentials of isolated bus nodes are isolated
from each other, the common-mode voltage of one node’s output
has no effect on the bus inputs of another node. This is because
the common-mode voltage is dropping across the
high-resistance isolation barrier of 1014Ω. Thus, galvanic
isolation extends the maximum allowable common-mode range
of a data link to the maximum working voltage of the isolation
EN61000-4-10 (Damped Oscillatory
Magnetic Field)
Immunity to external magnetic fields
is even higher if the field direction is
“end-to-end” rather than “pin-to-pin”
as shown on the right.
barrier, which for the ISL32704E is 600V
.
RMS
FN8860 Rev.4.00
Feb 12, 2018
Page 7 of 14
ISL32704E
Digital Isolator Principle
The ISL32704E utilizes a giant magneto-resistance (GMR)
isolation. Figure 5 shows the principle operation of a single
channel GMR isolator.
60
50
40
30
20
10
0
FCC-B < 1GHz 3m
EN55022 < 1GHz 3m
LABORATORY
EXTERNAL B-FIELD
V
DD2
NOISE FLOOR
INTERNAL
B-FIELD
Qp-
GMR1 GMR2
GMR3 GMR4
MEASUREMENTS
IN
OUT
10MHz
100MHz
1GHz
FIGURE 7. UNDETECTABLE EMISSIONS OF GMR ISOLATORS
GND
2
Low EMI Susceptibility
FIGURE 5. SINGLE CHANNEL GMR ISOLATOR
Because GMR isolators have no pulse trains or carriers to interfere
with, they also have very low EMI susceptibility.
The input signal is buffered and drives a primary coil, which
creates a magnetic field that changes the resistance of the GMR
resistors 1 to 4. GMR1 to GMR4 form a Wheatstone bridge in
order to create a bridge output voltage that only reacts to
magnetic field changes from the primary coil. Large external
magnetic fields, however, are treated as common-mode fields
and are therefore suppressed by the bridge configuration. The
bridge output is fed into a comparator whose output signal is
identical in phase and shape to the input signal.
For the list of compliance tests conducted on GMR isolators, refer
to the “Electromagnetic Compatibility” on page 7.
Receiver (Rx) Features
This transceiver utilizes a differential input receiver for maximum
noise immunity and common-mode rejection. Input sensitivity is
±200mV, as required by the RS-485 specification.
The receiver input resistance meets the RS-485 Unit Load (UL)
requirement of 12kΩ minimum. The receiver includes a “fail-safe
if open” function that guarantees a high level receiver output if
the receiver inputs are unconnected (floating). The receiver
output is tri-statable via the active low RE input.
GMR Resistor in Detail
Figure 6 shows a GMR resistor consisting of ferromagnetic alloy
layers, B1, B2, sandwiched around an ultra thin, nonmagnetic
conducting middle layer A, typically copper. The GMR structure is
designed so that, in the absence of a magnetic field, the
magnetic moments in B1 and B2 face opposite directions, thus
causing heavy electron scattering across layer A, which increases
its resistance for current C drastically. When a magnetic field D is
applied, the magnetic moments in B1 and B2 are aligned and
electron scattering is reduced. This lowers the resistance of layer
A and increases current C.
Driver (Tx) Features
The RS-485 driver is a differential output device that delivers at
least 1.5V across a 54Ω purely differential load. The driver
features low propagation delay skew to maximize bit width and
to minimize EMI.
The driver in the ISL32704E is tri-statable via the active high DE
input. The outputs of the ISL32704E driver are not slew rate
limited, so faster output transition times allow data rates of at
least 4Mbps.
HIGH
LOW
RESISTANCE
RESISTANCE
B1
A
B1
A
Built-In Driver Overload Protection
C
C
C
C
As stated previously, the RS-485 specification requires that
drivers survive worst-case bus contentions undamaged. The
ISL32704E transmitters meet this requirement via driver output
short-circuit current limits and on-chip thermal shutdown circuitry.
B2
B2
D
APPLIED
MAGNETIC FIELD
The driver output stage incorporates short-circuit current limiting
circuitry, which ensures that the output current never exceeds the
RS-485 specification. In the event of a major short-circuit
condition, the device also includes a thermal shutdown feature
that disables the driver whenever the die temperature becomes
excessive. This eliminates the power dissipation, allowing the die
to cool. The driver automatically re-enables after the die
temperature drops about 15°C. If the contention persists, the
thermal shutdown/re-enable cycle repeats until the fault is
cleared. The receiver stays operational during thermal shutdown.
FIGURE 6. MULTI-LAYER GMR RESISTOR
Low Emissions
Because GMR isolators do not use fancy encoding schemes, such
as RF carriers or high-frequency clocks, and do not include power
transfer coils or transformers, their radiated emission spectrum
is virtually undetectable.
FN8860 Rev.4.00
Feb 12, 2018
Page 8 of 14
ISL32704E
where:
• L is the stub length (ft)
Dynamic Power Consumption
The isolator within the ISL32704E achieves its low power
consumption from the way it transmits data across the barrier.
By detecting the edge transitions of the input logic signal and
converting these to narrow current pulses, a magnetic field is
created around the GMR Wheatstone bridge. Depending on the
direction of the magnetic field, the bridge causes the output
comparator to switch following the input signal. Since the current
pulses are narrow, about 2.5ns, the power consumption is
independent of the mark-to-space ratio and solely depends on
frequency.
S
• t is the driver rise time (s)
r
• c is the speed of light (9.8 x 108 ft/s)
• v is the signal velocity as a percentage of c.
To ensure the receiver output of the ISL32704E is high when the
bus is not actively driven, fail-safe biasing of the bus lines is
recommended. Figure 8 shows the proper termination of a
high-speed data link with fail-safe biasing.
TABLE 2. SUPPLY CURRENT INCREASE WITH DATA RATE
VS
DATA RATE
(Mbps)
I
I
DD2
DD1
(mA)
0.15
0.6
(mA)
0.15
0.6
RB
RT2
RB
542R
135R
542R
1
4
RT1
120R
Power Supply Decoupling
Both supplies, V
and V , must be bypassed with 100nF
DD1
DD2
ceramic capacitors. These should be placed as close as possible
to the supply pins for proper operation.
FIGURE 8. FAIL-SAFE BIASING FOR HIGH-SPEED DATA LINKS
DC CORRECTNESS
Here the termination resistor value at the cable end without
fail-safe biasing equals the characteristic cable impedance:
The ISL32704E incorporates a patented refresh circuit to maintain
the correct output state with respect to data input. At power-up,
the bus outputs follow the truth tables on page 2. The DE input
should be held low during power-up to prevent false drive data
pulses on the bus. This can be accomplished by connecting a
10kΩ pull-down resistor between DE and GND1.
R
= Z . The values for R and R are calculated using
T1
0
B
T2
Equations 2 and 3.
V
Z
0
4
S
----------- ------
R
(EQ. 2)
(EQ. 3)
B
V
AB
2R Z
Data Rate, Cables, and Terminations
B
0
------------------------
R
=
T2
2R – Z
B
0
RS-485 is intended for network lengths up to 4000 feet, but the
maximum system data rate decreases as the transmission
length increases. Devices operating at 4Mbps are typically
limited to lengths less than 100 feet, but are capable of driving
up to 350 feet of cable when allowing for some jitter of 5%.
where:
• R are the fail-safe biasing resistors
B
• R is the termination resistor in the fail-safe biasing network
T2
Twisted pair is the cable of choice for RS-485 networks. Twisted
pair cables tend to pick up noise and other electromagnetically
induced voltages as common-mode signals, which are effectively
rejected by the differential receivers in these ICs.
• V is the minimum transceiver supply voltage
S
• V is the minimum bus voltage of the undriven bus
AB
• Z is the characteristic cable impedance
0
To minimize reflections, proper termination is imperative when
using this high data rate transceiver. In point-to-point or
point-to-multipoint (single driver on bus) networks, the main
cable should be terminated in its characteristic impedance
(typically 120Ω for RS-485) at the end farthest from the driver. In
multireceiver applications, stubs connecting receivers to the
main cable should be kept as short as possible. Multipoint
(multidriver) systems require that the main cable be terminated
in its characteristic impedance at both ends. Stubs connecting a
transceiver to the main cable should be kept as short as possible.
A useful guideline for determining the maximum stub lengths is
given with Equation 1.
Note, the resistor values in Figure 8 have been calculated for
V = 4.5V, V = 0.25V, and Z = 120Ω.
S
AB
0
Transient Protection
Protecting the ISL32704E against transients exceeding the
device’s transient immunity requires the addition of an external
TVS. For this purpose, Semtech’s RClamp0512TQ was chosen
due to its high transient protection levels, low junction
capacitance, and small form factor.
TABLE 3. RCLAMP0512 TVS FEATURES
PARAMETER
ESD (IEC61000-4-2)
SYMBOL
VALUE
±30
±30
±4
UNIT
kV
t
r
Air
V
ESD
------
L
v c
(EQ. 1)
S
10
Contact
V
kV
ESD
EFT (IEC61000-4-4)
V
kV
EFT
FN8860 Rev.4.00
Feb 12, 2018
Page 9 of 14
ISL32704E
TABLE 3. RCLAMP0512 TVS FEATURES (Continued)
the GND2 pins between Pins 9 and 15. This allows for increased
layout flexibility.
PARAMETER
SYMBOL
VALUE
±1.3
3
UNIT
kV
The wide-body version also provides an isolated DE output,
ISODE, that can be used in PROFIBUS™ applications to monitor
the state of the isolated drive enable node.
Surge (IEC61000-4-5)
Junction Capacitance
Form Factor
V
SURGE
C
pF
J
-
1 x 0.6
mm
The QSOP version (ISL32704EIAZ) is designed for application
flexibility and maximum space saving in dense PCB designs. This
package provides an isolated DE output (ISODE) and a separate
DE input on the bus side (XDE). XDE can be used to enable the
driver from the bus side, or when connected to ISODE, enable the
driver from the DE input on the controller side.
The TVS is implemented between the bus lines and isolated
ground (GND2).
Since transient voltages on the bus lines are referenced to Earth
potential, aka Protective Earth (PE), a high-voltage capacitor (C
)
HV
is inserted between GND2 and PE, providing a low-impedance path
for high-frequency transients.
Two separate output supply pins are available, VDD2 for the
isolation module and VDD2X for the transceiver module. Both
pins should be connected externally for normal operation, or can
be used separately for testing and troubleshooting.
Note that the connection from the PE point on the isolated side
to the PE point on the non-isolated side (Earth) is usually made
via the metal chassis of the equipment, or via a short, thick wire
of low-inductance.
The QSOP version also has an “ISOR” output that is isolated from
the receiver output “R” on the controller side. This pin is used for
testing and usually left open, but it could be used for bus-side
monitoring purposes in special circumstances.
A high-voltage resistor (R ) is added in parallel to C to prevent
HV HV
the build-up of static charges on floating grounds (GND2) and
cable shields (typically used in Profibus). The bill of materials for
the circuit in Figure 9 is listed in Table 4.
Figures 10 and 11 show the typical device connections for both
package versions.
VS-ISO
3.3V
5V
ISOLATION
BARRIER
VS
100n
100n
1
16
VDD2
9
VDD1
A
ISL32704 10
MCU /
UART
B
5
6
DE
ISODE 10
1
2
SHIELD
1.09k
127R
1.09k
TVS
A
B
12
13
3
D
GND
PE
3
4
R
CHV
RHV
RE
PE
GND1
2,8
GND2
9,15
Non-isolated Ground
Isolated Ground, Floating RS-485 Common
Protective Earth Ground, Equipment Safety Ground
ISL32704EIBZ
FIGURE 10. TYPICAL WB-SOIC TRANSCEIVER CONNECTIONS
FIGURE 9. TRANSIENT PROTECTION FOR ISL32704E
3.3V
5V
ISOLATION
BARRIER
100n
100n
TABLE 4. BOM FOR CIRCUIT IN Figure 9
1
11
16
NAME
FUNCTION
ORDER NO.
VENDOR
SEMTECH
VDD1
VDD2X VDD2
TVS 170W (8µs, 20µs)
2-LINE PROTECTOR
RCLAMP0512TQ
6
5
D
ISODE 15
XDE 12
1.09k
127R
1.09k
C
4.7nF, 2kV, 10%
CAPACITOR
1812B472K202NT NOVACAP
HV
A
9
DE
R
1MΩ, 2kV, 5%
RESISTOR
HVC12061M0JT3
TT-ELECTRONICS
HV
2
4
R
B 10
Pinout Differences Between Packages
The wide-body version (ISL32704EIBZ) has a single output power
supply pin, VDD2, supplying the bus side of the isolation module
and the transceiver module.
RE
ISOR 13
GND1
GND2
14
3
ISL32704EIAZ
This package also provides two ground pins for each supply. The
GND1 pins are internally connected between Pins 2 and 8 and
FIGURE 11. TYPICAL QSOP TRANSCEIVER CONNECTIONS
FN8860 Rev.4.00
Feb 12, 2018
Page 10 of 14
ISL32704E
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision.
DATE
REVISION
CHANGE
Feb 12, 2018
FN8860.4 Updated Note 1 and added Note 2.
Updated VDE and UL certification file numbers.
Updated Thermal Information (Theta JA, JC values)
-Changed the 16ld WB-SOIC Package from 60, 12 to 34, 17.
-Changed the 16ld QSOP Package from 60, 10 to 63, 35.
POD M16.3A - updated from rev 0 to rev 1. Changes:
Updated Typical Recommended Land Pattern dimensions lead height from 2.2 to 1.7, lead width from 0.6 to 0.51,
and body center to center from 9.2 to 9.75.
Removed About Intersil section.
Mar 29, 2017
FN8860.3 Added WB-SOIC information throughout document.
Updated Feature bullets
Updated Notes 5 and 6.
Feb 10, 2017
Jan 19, 2017
FN8860.2 On page 2, Ordering Information, changed ISL32704EIAZ-EVALZ to ISL32704EVAL1Z.
FN8860.1 Updated Figure 1 on page 1 and Figure 2 on page 3. Changed from dual to single failsafe biasing.
On page 2, Ordering Information, added ISL32704EIAZ-EVALZ and Note 1 for tape and reel and quantity.
On page 7 in VDE V 0884-11 (Certification Pending) and UL 1577 sections, changed from “Standard” to “Basic”
isolation.
Dec 12, 2016
FN8860.0 Initial Release
FN8860 Rev.4.00
Feb 12, 2018
Page 11 of 14
ISL32704E
For the most recent package outline drawing, see M16.15B.
Package Outline Drawing
M16.15B
16 LEAD QUARTER-SIZE SMALL OUTLINE PLASTIC PACKAGE (QSOP)
Rev 0, 9/16
A
1
3
4.77
5.00
16
9
SEE DETAIL "X"
5.8
6.2
3.8
4.0
3
2
PIN #1
I.D. MARK
45° NOM
1
8
0.635
0.20
0.25
B
TOP VIEW
END VIEW
0.05
1.00 REF
H
1.52
1.75
C
1.27
1.42
GAUGE
PLANE
SEATING
PLANE
0.25
0.10
0.25
0.2
0.3
0.10 MIN
0.25 MAX
5
0.10
C
0° TO 8°
0.50
0.75
0.10 M C B A
SIDE VIEW
(0.38)
DETAIL X
(1.53)
NOTES:
1. Dimension does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
(5.30)
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion.
6. Dimension in ( ) are for reference only.
7. Pin spacing is a BASIC dimension; tolerances do not accumulate.
8. Dimensions are in mm.
(0.635)
TYPICAL RECOMMENDED LAND PATTERN
FN8860 Rev.4.00
Feb 12, 2018
Page 12 of 14
ISL32704E
For the most recent package outline drawing, see M16.3A.
Package Outline Drawing
M16.3A
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOICW)
Rev 1, 6/17
1
3
10.08
10.49
0.3
0.5
SEE DETAIL "X"
16
9
0.18
0.25
7.42
7.59
10.00
10.64
6.60
7.11
PIN #1
I.D. MARK
2
3
0.85
1.10
1
8
1.24
1.30
0.2
0.3
TOP VIEW
END VIEW
0.05
2.34
2.67
H
C
2.0
2.5
GAUGE
PLANE
SEATING
PLANE
0.25
0.1
0.3
0.3
0.5
5
0.1 MIN
0.40
0.10
C
0° TO 8°
0.3 MAX
1.30
0.1 M
C
B A
SIDE VIEW
DETAIL X
(1.7)
NOTES:
1. Dimension does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
(9.75)
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion.
6. Dimension in ( ) are for reference only.
7. Pin spacing is a BASIC dimension; tolerances do not accumulate.
8. Dimensions are in mm.
(0.51)
(1.27)
TYPICAL RECOMMENDED LAND PATTERN
FN8860 Rev.4.00
Feb 12, 2018
Page 13 of 14
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Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2018 Renesas Electronics Corporation. All rights reserved.
Colophon 7.0
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