ISL78600 [RENESAS]
Multi-Cell Li-Ion Battery Manager;型号: | ISL78600 |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | Multi-Cell Li-Ion Battery Manager 电池 |
文件: | 总105页 (文件大小:4093K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATASHEET
ISL78600
Multi-Cell Li-Ion Battery Manager
FN7672
Rev.10.00
May 10, 2018
The ISL78600 Li-ion battery manager IC supervises up to
12 series-connected cells. The part provides accurate
monitoring, cell balancing, and extensive system diagnostics
functions. Three cell balancing modes are incorporated:
Manual Balance mode, Timed Balance mode, and Auto
Balance mode. The Auto Balance mode terminates balancing
functions when a charge transfer value specified by the host
microcontroller has been met.
Features
• Up to 12-cell voltage monitors with support forLi-ion CoO ,
2
Li-ion Mn O , and Li-ion FePO4 chemistries
2
4
• Board level cell voltage measurement accuracy ±1.5mV
• 13-bit cell voltage measurement
• Pack voltage measurement accuracy ±100mV
• 14-bit pack voltage and temperature measurements
The ISL78600 communicates to a host microcontroller
through an SPI interface and to other ISL78600 devices using
a robust, proprietary, two-wire daisy chain system.
• Cell voltage scan rate of 19.5µs per cell (234µs to scan
12 cells)
• Internal and external temperature monitoring
• Up to four external temperature inputs
The ISL78600 is offered in a 64 Ld TQFP package and is
specified for operation at a temperature range of -40°C to
+105°C.
• Robust daisy chain communications system
• Integrated system diagnostics for all key internal functions
• Hardwired and communications based fault notification
Applications
• Hybrid Electric Vehicle (HEV), Plug-in Hybrid Electric Vehicle
(PHEV), and Electric Vehicle (EV) battery packs
• Integrated watchdog shuts down device if communication is
lost
• Electric motorcycle battery packs
• Backup battery and energy storage systems requiring high
accuracy management and monitoring
• 2Mbps SPI
• AEC-Q100 qualified
• Portable and semiportable equipment
Related Literature
For a full list of related documents, visit our website
• ISL78600 product page
TO OTHER DEVICES (OPTIONAL)
ISL78600
ISL78600
VG1 VG1
VG2 VG2
DHi2
DLo2
DHi2
DLo2
DHi1
DLo1
SCLK
DOUT
DIN
HOST
CS
MICRO
DATA READY
FAULT
EN
VG1
VG1
VG2
MONITOR BOARD (DAISY CHAIN - OPTIONAL)
MONITOR BOARD (MASTER OR STANDALONE)
FIGURE 1. TYPICAL APPLICATION
FN7672 Rev.10.00
May 10, 2018
Page 1 of 105
ISL78600
Table of Contents
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Cell/V
BAT
Reading Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Cell Voltage Reading Error (Cell Chemistry Ranges) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Device Description and Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
System Hardware Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Battery and Cell Balance Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Power Supplies and Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Communications Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Daisy Chain Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
External Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Typical Application Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Operating with Reduced Cell Counts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Notes on Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Component Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Board Level Calibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
System Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Device Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Address All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Read and Write Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Scan Voltages Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Scan Temperatures Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Scan Mixed Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Scan Wires Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Scan All Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Scan Continuous Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Scan Inhibit Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Measure Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Scan Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Temperature Monitoring Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Sleep Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Wake Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Balance Enable Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Balance Inhibit Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Cell Balancing Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Manual Balance Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Timed Balance Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Auto Balance Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Daisy Chain Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Identify Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
ACK (Acknowledge) Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
NAK (Not Acknowledge) Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
SPI Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Non-Daisy Chain Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Daisy Chain Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Communications Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
FN7672 Rev.10.00
May 10, 2018
Page 2 of 105
ISL78600
CRC Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Daisy Chain Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Communication Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Measurement Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Command Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Response Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
System Timing Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Command Timing Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Measurement Timing Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Response Timing Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
System Diagnostics Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Hardware Fault Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
System Out of Limit Detection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Diagnostic Activity Settling Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Memory Checksum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Communication Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Communication Failure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Daisy Chain Communications Conflicts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Loss of Signal From Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Alarm Response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Fault Diagnostics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Worked Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Voltage Reference Check Calculation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Cell Balancing – Manual Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Cell Balancing – Timed Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Cell Balancing – Auto Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
System Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Cell Voltage Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Temperature Data, Secondary Voltage Reference Data, Scan Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Fault Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Setup Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Cell Balance Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Reference Coefficient Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Cells In Balance Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Device Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Nonvolatile Memory (EEPROM) Checksum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
FN7672 Rev.10.00
May 10, 2018
Page 3 of 105
ISL78600
Ordering Information
PACKAGE
(RoHS
COMPLIANT)
PART NUMBER
(Notes 2, 3)
PART
MARKING
TRIM VOLTAGE,
TEMP. RANGE
(°C)
TAPE AND REEL
(UNITS) (Note 1)
PKG.
DWG. #
V
(V)
NOM
ISL78600ANZ
ISL78600ANZ
ISL78600ANZ
Evaluation Kit
3.3
-40 to +105
-40 to +105
-
64 Ld TQFP
64 Ld TQFP
Q64.10x10D
Q64.10x10D
ISL78600ANZ-T
ISL78600EVKIT1Z
NOTES:
3.3
1k
1. Refer to TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate
plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see the ISL78600 product information page. For more information about handling and processing moisture
sensitive devices, see TB363.
TABLE 1. KEY DIFFERENCE BETWEEN FAMILY OF PARTS
INITIAL CELL MONITOR VOLTAGE ERROR
PART NUMBER
(mV) (Note 4)
ISL78600
ISL78610
NOTE:
2.0 (maximum)
10.0 (maximum)
4. Conditions: Temperature = -20°C to +60°C, V
= 2.6V to 4.0V, limits applied to a ±3 sigma distribution.
CELL
FN7672 Rev.10.00
May 10, 2018
Page 4 of 105
ISL78600
Pin Configuration
ISL78600
(64 LD 10x10 TQFP)
TOP VIEW
1
CB10
VC9
CB9
VC8
CB8
VC7
CB7
VC6
CB6
VC5
CB5
VC4
CB4
VC3
CB3
VC2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
DNC
2
EN
3
DATA READY
FAULT
4
5
DGND
6
COMMS RATE 0
COMMS RATE 1
COMMS SELECT 1
COMMS SELECT 2
DNC
7
8
9
10
11
12
13
14
15
16
BASE
DNC
V3P3
V2P5
VCC
REF
FN7672 Rev.10.00
May 10, 2018
Page 5 of 105
ISL78600
Pin Descriptions
PIN NAME
PIN NUMBER
DESCRIPTION
VC0, VC1, VC2, VC3,
20, 18, 16, Battery cell voltage inputs. VCn connects to the positive terminal of CELLn and the negative terminal of CELLn+1.
VC4, VC5, VC6, VC7, 14, 12, 10, 8, (VC12 connects only to the positive terminal of CELL12 and VC0 only connects with the negative terminal of
VC8, VC9, VC10, VC11, 6, 4, 2, 64, 62, CELL1.)
VC12
60
CB1, CB2, CB3, CB4,
19, 17, 15, Cell Balancing FET control outputs. Each output controls an external FET, which provides a current path around
CB5, CB6, CB7, CB8, 13, 11, 9, 7, 5, the cell for balancing.
CB9, CB10, CB11,
CB12
3, 1, 63, 61
VBAT
VSS
58, 59
21, 22
Main IC supply pins. Connect to the most positive terminal in the battery string.
Ground. These pins connect to the most negative terminal in the battery string.
ExT1, ExT2, ExT3, ExT4 24, 26, 28, 30 External temperature monitor or general purpose inputs. The temperature inputs are intended for use with
external resistor networks using NTC type thermistor sense elements but can also be used as general purpose
analog inputs at the user’s discretion. 0V to 2.5V input range.
TEMPREG
VDDEXT
REF
29
32
33
Temperature monitor voltage regulator output. This switched 2.5V output supplies a reference voltage to external
NTC thermistor circuits to provide ratiometric ADC inputs for temperature measurement.
External V3P3 supply input/output. Connected to the V3P3 pin through a switch, this pin can be used to power
external circuits from the V3P3 supply. The switch is open when the ISL78600 is placed in Sleep mode.
2.5V voltage reference decoupling pin. Connect a 2.0µF to 2.5µF X7R capacitor to VSS. Do not connect any
additional external load to this pin.
VCC
34
35
36
Analog supply voltage input. Connect to V3P3 through a 33Ω resistor. Connect a 1µF capacitor to ground.
V2P5
V3P3
Internal 2.5V digital supply decoupling pin. Connect a 1µF capacitor to DGND.
3.3V digital supply voltage input. Connect the emitter of the external NPN regulator transistor to this pin. Connect
a 1µF capacitor to DGND.
BASE
DNC
38
Regulator control pin. Connect the external NPN transistor’s base. Do not let this pin float.
37, 39, 48 Do not connect. Leave pins floating.
COMMS SELECT 1
41
Communications Port 1 mode select pin. Connect to V3P3 through a 1kΩ resistor for daisy chain
communications on Port 1 or to DGND for SPI operation on Port 1.
COMMS SELECT 2
40
Communications Port 2 mode select pin. Connect to V3P3 through a 1kΩ resistor to enable Port 2 or to DGND to
disable this port.
COMMS RATE 0,
COMMS RATE 1
43, 42
Daisy chain communications data rate setting. Connect to DGND (‘0’) or to V3P3 (‘1’) through a 1kΩ resistor to
select between various communication data rates.
DGND
FAULT
44
45
46
47
49
50
52
53
56
55
Digital ground.
Logic fault output. Asserted low if a fault condition exists.
SPI data ready. Asserted low when the device is ready to transmit data to the host microcontroller.
Enable input. Tie to V3P3 to enable the part. Tie to DGND to disable (all IC functions are turned off).
Serial data output (SPI) or NC (daisy chain). 0V to 3.3V push-pull output.
Serial data input (SPI) or NC (daisy chain). 0V to 3.3V input.
Chip-Select, active low 3.3V input (SPI) or daisy chain Port 1 Low connection.
Serial-clock input (SPI) or daisy chain Port 1 High connection.
Daisy chain Port 2 High connection.
DATA READY
EN
DOUT/NC
DIN/NC
CS/DLo1
SCLK/DHi1
DHi2
DLo2
Daisy chain Port 2 Low connection.
NC
23, 25, 27, No internal connection.
31, 51, 54, 57
FN7672 Rev.10.00
May 10, 2018
Page 6 of 105
ISL78600
Block Diagram
DHI 2
DLO 2
VBAT
SCLK/DHI 1
CS/DLO 1
DIN
DAISY
CHAIN
AND
VC12
CB12
DOUT
SPI
COMMS
DATA READY
COMMS RATE 1
COMMS RATE 0
COMMS SELECT 2
COMMS SELECT 1
DGND
VC11
CB11
VC10
CB10
FAULT
EN
VC9
CB9
VC8
CB8
BASE
V3P3
VREG
V2P5
VC7
CB7
VDDEXT
V2P5
VCC
VC6
CB6
VC5
CB5
VREF
REF
VC4
CB4
VC3
CB3
ADC
TEMPREG
VC2
CB2
TEMP MUX
VC1
CB1
ExT1
ExT2
ExT3
ExT4
VC0
VSS
FIGURE 2. BLOCK DIAGRAM
FN7672 Rev.10.00
May 10, 2018
Page 7 of 105
ISL78600
Absolute Maximum Ratings
Thermal Information
Unless otherwise specified. With respect to VSS.
BASE, DIN, SCLK, CS, DOUT, DATA READY, COMMS SELECT n,
TEMPREG, REF, V3P3, VCC, FAULT, COMMS RATE n,
Thermal Resistance (Typical)
64 Ld TQFP Package (Notes 5, 6) . . . . . . .
θ
(C/W)
42
θ
(C/W)
9
JA
JC
EN, VDDEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 5.5V
ExTn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.2V to 4.1V
V2P5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 2.9V
VBAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 63V
Maximum Continuous Package Power Dissipation . . . . . . . . . . . . .400mW
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . . . . . .+125°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Dhi1, DLo1, DHi2, DLo2 . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V
+ 0.5V)
BAT
VC0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +9.0V
VC1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to +18V
VC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to +18V
VC3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +27V
VC4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +27V
VC5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +36V
VC6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +36V
VC7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +45V
VC8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +45V
VC9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to +54V
VC10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +63V
VC11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +63V
VC12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +63V
VCn (for n = 0 to 12). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VBAT +0.5V
Recommended Operating Conditions
T , Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-40°C to +105°C
A
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V to 60V
(Daisy Chain Operation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10V to 60V
BAT
BAT
V
VCn (for n = 1 to 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . V(VCn-1) to V(VCn-1) +5V
VC0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.1V to 0.1V
CBn (for n = 1 to 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V(VCn-1) to V(VCn-1) +9V
CBn (for n = 10 to 12). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V(VCn) - 9V to V(VCn)
DIN, SCLK, CS, COMMS SELECT 1, COMMS SELECT 2, V3P3, VCC,
COMMS RATE 0, COMMS RATE 1, EN. . . . . . . . . . . . . . . . . . . . . .0V to 3.6V
ExT1, ExT2, ExT3, ExT4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to 2.5V
CBn (for n = 1 to 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to V
+0.5V
BAT
CBn (for n = 1 to 9) . . . . . . . . . . . . . . . . . . . . . . . . V(VCn-1) -0.5V to V(VCn-1) +9V
CBn (for n = 10 to 12). . . . . . . . . . . . . . . . . . . . . . . . . V(VCn) -9V to V(VCn) +0.5V
Current into VCn, VBAT, VSS (Latch-Up Test) . . . . . . . . . . . . . . . . . . ±100mA
ESD Rating
Human Body Model (Tested per AECQ100-002) . . . . . . . . . . . . . . . . 2kV
Capacitive Discharge Model (Tested per AECQ100-011) . . . . . . . . . 2kV
Latch-Up (Tested per AEC-Q100-004; Class 2, Level A) . . . . . . . . . . 100mA
NOTE: DOUT, DATA READY, and FAULT are digital outputs and should not
be driven from external sources. V2P5, REF, TEMPREG and BASE are
analog outputs and should not be driven from external sources.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for details.
JA
6. For , the “case temp” location is taken at the package top center.
JC
FN7672 Rev.10.00
May 10, 2018
Page 8 of 105
ISL78600
Electrical Specifications
V
= 6 to 60V, T = -20°C to +60°C, unless otherwise specified. Biasing setup as in
A
BAT
Figure 46 on page 29 or equivalent.
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 7)
TYP
(Note 7)
UNIT
Measurement Specifications
Cell Voltage Input Measurement Range
Cell Monitor Voltage Resolution
V
VC(n) - VC(n-1), for design reference.
- 0.3
5
V
CELL
V
[VC(n) - VC(n-1)] LSB step size (13-bit signed
number), 5V full scale value
0.61
mV
CELLRES
ISL78600 Initial Cell Monitor Voltage
Error
(Note 9)
V
V
V
= V
= V
- 0.3V < V
- 0.7V < V
< V
< V
+ 0.3V
+ 0.7V
-2.5
-3.5
-9.5
-26.5
-10
2.5
3.5
9.0
26.5
10
mV
mV
mV
mV
mV
mV
mV
mV
mV
mV
CELL
CELL
NOM
NOM
CELL
NOM
NOM
CELL
CELL
-40°C to +85°C (Note 8)
-40°C to +105°C (Note 8)
V
= Nominal calibration voltage
NOM
Note: Cell measurement accuracy
figures assume a fixed 1kΩ resistor is
placed in series with each VCn pin (n = 0
to 12).
V
= 4.95
CELL
-40°C to +85°C (Note 8)
-40°C to +105°C (Note 8)
-11
11
-26.5
-15
26.5
15
V = 0.5
CELL
See “Performance Characteristics” on
page 17
-40°C to +85°C (Note 8)
-40°C to +105°C (Note 8)
-18
18
-37
37
Cell Input Current
I
VC0 Input
VCELL
VC0 ≥ 0.5 and VC0 ≤ 4.0V
VC0 > 4.0V
-1.5
-1.75
-2.0
-1
-1
-2
-2
0
-0.5
-0.50
-0.5
µA
µA
µA
Note: Cell accuracy figures assume a
fixed 1kΩ resistor is placed in series with
each VCn pin (n = 0 to 12)
-40°C to +105°C (Note 8)
VC1, VC2, VC3 Inputs
VCn - VC(n-1) ≥ 0.5 and VCn - VC(n-1) ≤ 4.0V
VCn - VC(n-1) > 4.0V
-2.7
-2.85
-3.0
-1.3
-1.00
-1.0
µA
µA
µA
-40°C to +105°C (Note 8)
VC4 Input
VCn - VC(n-1) ≥ 0.5 and VCn - VC(n-1) ≤ 4.0V
VCn - VC(n-1) > 4.0V
-0.6
-0.7
- 0.8
0.6
0.7
0.8
µA
µA
µA
-40°C to +105°C (Note 8)
VC5, VC6, VC7, VC8, VC9, VC10, VC11 inputs
VCn - VC(n-1) < 2.6V
0
0.5
1.5
2
2
2
2
2.7
2.7
µA
µA
µA
µA
VCn - VC(n-1) ≥ 2.6V and VCn - VC(n-1) ≤ 4.0V
VCn - VC(n-1) > 4.0V
1.50
0.5
2.85
3.0
-40°C to +105°C (Note 8)
VC12 Input
VC12 - VC11 ≥ 0.5 and VC12 - C11 ≤ 4.0V
VC12 - VC11 > 4.0V
0.6
0.60
0.6
1
1.7
1.75
2.0
µA
µA
µA
mV
-40°C to +105°C (Note 8)
1
V
Monitor Voltage Resolution
VBAT
RES
ADC resolution referred to input (V ) level. 14-bit
BAT
4.863
BAT
unsigned number. Full scale value = 79.67V.
Initial V
BAT
(Note 9)
monitor Voltage Error
V
Measured at V
Measured at V
Measured at V
Measured at V
= 36V to 43.2V
= 31.2V to 48V
= 6V to 59.4V
= 6V to 59.4V
-100
-125
-320
-490
100
125
322
490
mV
mV
mV
mV
BAT
BAT
BAT
BAT
BAT
-40°C to +105°C (Note 8)
External Temperature Monitoring
Regulator
V
Voltage on TEMPREG output. (0 to 2mA load)
2.475
2.500
2.525
V
TEMP
FN7672 Rev.10.00
May 10, 2018
Page 9 of 105
ISL78600
Electrical Specifications
V
= 6 to 60V, T = -20°C to +60°C, unless otherwise specified. Biasing setup as in
A
BAT
Figure 46 on page 29 or equivalent. (Continued)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 7)
TYP
0.1
(Note 7)
UNIT
External Temperature Output
Impedance
R
Output Impedance at TEMPREG pin. (Note 8)
0
0.2
Ω
TEMP
External Temperature Input Range
V
Effective ExTn input voltage range. For design
reference. This is the input voltage range that does
not trigger an open input condition.
0
2344
mV
EXT
External Temperature Input Pull-Up
External Temperature Input Offset
R
Pull-up resistor to V
applied to each input
10
MΩ
EXTTEMP
TEMPREG
during measurement
V
V
V
= 39.6V
-7.0
-10
7.0
10
mV
mV
EXTOFF
BAT
BAT
= 39.6V, -40°C to +105°C (Note 8)
External Temperature Input INL
V
(Note 8)
±0.61
mV
EXTINL
External Temperature Input Gain Error
V
Error at 2.5V input
-40°C to +105°C (Note 8)
-7.5
-8
11
mV
EXTG
18.5
mV
Internal Temperature Monitor Error
InternalTemperatureMonitorResolution
Internal Temperature Monitor Output
Power-Up Specifications
V
±10
31.9
9180
°C
INTMON
T
Output resolution (LSB/°C), 14-bit number
Output count at +25°C
LSB/°C
Decimal
INTRES
T
INT25
Power-Up Condition Threshold
Power-Up Condition Hysteresis
Initial Power-Up Delay
V
V
voltage (rising)
BAT
4.8
5.1
5.6
V
POR
V
460
mV
ms
PORhys
t
Time after VPOR condition
from 0V to 0.95 x V
27.125
POR
PUD
V
(nominal)
REF
REF
(EN tied to V3P3) Device can now communicate
Enable Pin Power-Up Delay
t
Delay after EN = 1 to V from 0V to
27.125
ms
REF
0.95 x V
(V
(nominal)
REF
= 39.6V) - Device can now communicate
BAT
FN7672 Rev.10.00
May 10, 2018
Page 10 of 105
ISL78600
Electrical Specifications
V
= 6 to 60V, T = -20°C to +60°C, unless otherwise specified. Biasing setup as in
A
BAT
Figure 46 on page 29 or equivalent. (Continued)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 7)
TYP
(Note 7)
UNIT
Supply Current Specifications
V
Supply Current
I
Non-daisy chain configuration. Device enabled. No communications, ADC, measurement,
balancing, or open-wire detection activity.
BAT
VBAT
6V
70
73
73
90
95
µA
µA
µA
µA
39.6V
60V
96
-40°C to +105°C (Note 8)
105
I
Daisy chain configuration – master device. Enabled. No communications, ADC, measurement,
balancing, or open-wire detection activity.
VBATMASTER
6V
400
500
550
550
650
710
660
900
µA
µA
µA
µA
mA
39.6V
60V
1000
1150
-40°C to +105°C (Note 8)
Peak current when daisy chain transmitting
18
I
Daisy chain configuration – Middle stack device. Enabled. No communications, ADC,
measurement, balancing, or open-wire detection activity.
VBATMID
6V
700
900
1020
1210
1340
1210
1560
1700
1850
µA
µA
µA
µA
mA
39.6V
60V
1000
-40°C to +105°C (Note 8)
Peak current when daisy chain transmitting
18
I
VBATTOP
Daisy chain configuration – top device. Enabled. No communications, ADC, measurement,
balancing, or open-wire detection activity.
6V
400
500
550
550
650
710
660
900
µA
µA
µA
µA
mA
39.6V
60V
1000
1150
-40°C to +105°C (Note 8)
Peak current when daisy chain transmitting
18
I
Sleep mode (EN = 1, daisy chain configuration)
VBATSLEEP1
(Note 8)
6V
13
18
20
28
33
35
44
48
µA
µA
µA
µA
µA
µA
39.6V
60V
50
-40°C to +105°C
120
34.1
109
I
Sleep mode (EN = 1, stand-alone, non-daisy chain)
-40°C to +105°C
13.2
13.5
19
VBATSLEEP2
(Note 8)
I
Shutdown. device “off” (EN = 0) (Daisy chain and non-daisy chain configurations)
VBATSHDN
(Note 8)
6V
6
7
7
13
15
16
28
29
µA
µA
µA
µA
µA
39.6V
60V
30
-40°C to +105°C
101
18
V
Supply Current Tracking, Sleep
I
EN = 1, daisy chain sleep mode configuration. V
current difference between any two devices
operating at the same temperature and supply
voltage.
0
0
BAT
VBATΔSLEEP
(Note 8)
BAT
Mode
-40°C to +105°C
56
µA
FN7672 Rev.10.00
May 10, 2018
Page 11 of 105
ISL78600
Electrical Specifications
V
= 6 to 60V, T = -20°C to +60°C, unless otherwise specified. Biasing setup as in
A
BAT
Figure 46 on page 29 or equivalent. (Continued)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 7)
TYP
300
(Note 7)
UNIT
µA
V
Incremental Supply Current,
I
All balancing circuits on. Incremental current:
250
350
BAT
VBATBAL
Balancing
Add to non-balancing V
current. V = 39.6V
BAT
BAT
-40°C to +105°C (Note 8)
200
3.25
3.2
300
400
3.45
3.5
µA
V
V3P3 Regulator Voltage (Normal)
V
EN = 1, Load current range 0 to 5mA. V
= 39.6V
BAT
3.35
3P3N
-40°C to +105°C (Note 8)
V
V3P3 Regulator Voltage (Sleep)
V3P3 Regulator Control Current
V
EN = 1, Load current range. No load. (SLEEP).
= 39.6V
2.8
1
V
3P3S
V
BAT
I
I
Current sourced from BASE output. V
-40°C to +105°C (Note 8)
Device enabled
= 6V
1
1
mA
mA
mA
BASE
BAT
V3P3 Supply Current
0.8
1.2
1.3
V3P3
No measurement activity, Normal mode
-40°C to +105°C (Note 8)
0.8
mA
V
V
Reference Voltage
V
EN = 1, no load, normal mode
2.5
12
REF
REF
VDDEXT Switch Resistance
R
Switch “ON” resistance, V
BAT
= 39.6V
Ω
VDDEXT
-40°C to +105°C (Note 8)
5
22
Ω
VCC Supply Current
I
Device enabled (EN = 1). Stand-alone or daisy
configuration. No ADC or daisy chain
communications active.
2.00
3.25
4.50
mA
VCC
-40°C to +105°C (Note 8)
2.0
5.0
mA
mA
I
Device enabled (EN = 1). Stand-alone or daisy
configuration. average current during 16ms scan
6.0
VCCACTIVE1
continuous operation. V
= 39.6V
BAT
I
Device enabled (EN = 1). Sleep mode. V
= 39.6V
BAT
0.5
0.5
µA
µA
µA
VCCSLEEP
I
Device disabled (EN = 0). Shutdown mode.
-40°C to +105°C (Note 8)
0
3.5
9.0
VCCSHDN
Over-Temperature Protection Specifications
Internal Temperature Limit Threshold
T
Balance stops and auto scan stops.
Temperature rising or falling.
150
°C
INTSD
External Temperature Limit Threshold
T
Corresponding to 0V (minimum) and V
(maximum)
0
16383
Decimal
XT
TEMPREG
External temperature input voltages higher than
15/16 V
faults.
are registered as open input
TEMPREG
Fault Detection System Specifications
Undervoltage Threshold
V
Programmable. Corresponding to 0V (minimum)
and 5V (maximum)
0
0
8191
8191
3.99
Decimal
Decimal
V
UV
Overvoltage Threshold
V
Programmable. Corresponding to 0V (minimum)
and 5V (maximum)
OV
V3P3 Power-Good Window
V
3.3V power-good window high threshold.
3.79
3.89
2.64
3PH
V
= 39.6V
BAT
-40°C to +105°C (Note 8)
3.3V power-good window low threshold.
= 39.6V
3.70
2.54
4.05
2.71
V
V
V
3PL
V
BAT
-40°C to +105°C (Note 8)
2.5
2.8
V
FN7672 Rev.10.00
May 10, 2018
Page 12 of 105
ISL78600
Electrical Specifications
V
= 6 to 60V, T = -20°C to +60°C, unless otherwise specified. Biasing setup as in
A
BAT
Figure 46 on page 29 or equivalent. (Continued)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 7)
TYP
(Note 7)
UNIT
V
V2P5 Power-Good Window
V
2.5V power-good window high threshold.
2.65
2.70
2.90
2PH
V
= 39.6V
BAT
-40°C to +105°C (Note 8)
2.5V power-good window low threshold.
= 39.6V
2.53
1.85
2.90
2.24
V
V
V
2.03
3.74
2PL
(Note 8)
V
BAT
-40°C to +105°C
VCC power-good window high threshold.
= 39.6V
1.76
3.60
2.28
3.90
V
V
VCC Power-Good Window
V
VCCH
V
BAT
-40°C to +105°C (Note 8)
VCC power-good window low threshold.
3.6
2.6
4.0
2.8
V
V
V
2.7
VCCL
V
= 39.6V
BAT
-40°C to +105°C (Note 8)
2.55
2.85
V
V
V
Power-Good Window
V
V
V
power-good window high threshold.
= 39.6V
2.525
2.700
2.300
2.500
2.900
REF
RPH
REF
BAT
-40°C to +105°C (Note 8)
2.525
2.150
2.900
2.465
V
V
V
V
V
power-good window low threshold.
= 39.6V
RPL
REF
BAT
-40°C to +105°C (Note 8)
2.0
2.4
V
V
V
Test
Secondary Reference Accuracy
V
V
V
value calculated using stored coefficients.
= 39.6V
2.488
2.512
REF
RACC
REF
BAT
(See “Voltage Reference Check Calculation” on
page 83.)
Voltage Reference Check Timeout
Oscillator Check Timeout
t
Time to check voltage reference value from
power-on, enable, or wakeup
20
20
ms
ms
ms
VREF
t
Time to check main oscillator frequency from
power-on, enable, or wakeup
OSC
Oscillator Check Filter Time
t
Minimum duration of fault required for detection
100
OSCF
Cell Open-Wire Detection (See “Scan Wires Command” on page 44 and “Open-Wire Test” on page 75.)
Open-Wire Current
I
ISCN bit = 0; V
ISCN bit = 1; V
= 39.6V
= 39.6V
0.125
0.85
0.150
1.00
4.6
0.185
1.15
mA
mA
ms
V
OW
BAT
BAT
Open-Wire Detection Time
t
Open-wire current source “on” time
OW
Open VC0 Detection Threshold
V
CELL1 negative terminal (with respect to VSS)
1.2
0.6
1.5
1.8
0.8
-0.9
10
VC0
V
= 39.6V (Note 8)
BAT
CELL1 positive terminal (with respect to VSS)
= 39.6V (Note 8)
Open VC1 Detection Threshold
V
0.7
-1.2
-39
V
V
VC1
V
BAT
V(VC(n - 1)) - V(VCn), n = 2 to 12
= 39.6V (Note 8)
Primary Detection Threshold, VC2 to
VC12
V
V
--1.5
-100
VC2_12P
VC2_12S
V
BAT
Through ADC. VC2 to VC12 only
= 39.6V (Note 8)
Secondary Detection Threshold, VC2 to
VC12
mV
V
BAT
VC12 - V
BAT
Open V
Fault Detection Threshold
V
200
250
mV
mV
BAT
VBO
Open VSS Fault Detection Threshold
Cell Balance Output Specifications
Cell Balance Pin Output Impedance
V
VSS - VC0
VSSO
R
CBn output off impedance
2
4
5
MΩ
CBL
between CB(n) to VC(n-1): cells 1 to 9 and
between CB(n) to VC(n): cells 10 to 12
Cell Balance Output Current
I
I
CBn output on. (CB1-CB9); V
device sinking current
= 39.6V;
BAT
-28
21
-25
25
-21
28
μA
μA
CBH1
CBH2
CBn output on. (CB10-CB12); V
device sourcing current
= 39.6V;
BAT
FN7672 Rev.10.00
May 10, 2018
Page 13 of 105
ISL78600
Electrical Specifications
V
= 6 to 60V, T = -20°C to +60°C, unless otherwise specified. Biasing setup as in
A
BAT
Figure 46 on page 29 or equivalent. (Continued)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
= 39.6V
(Note 7)
TYP
10
(Note 7)
UNIT
nA
Cell Balance Output Leakage in
Shutdown
I
EN = GND. V
-500
700
CBSD
BAT
External Cell Balance FET Gate Voltage
VGS
CBn Output on;
7.04
8.94
8.00
8.96
V
External 320kΩ between VCn and CBn
(n = 10 to 12) and between CBn and VCn-1
(n = 1 to 9)
Internal Cell Balance Output Clamp
Logic Inputs: SCLK, CS, DIN
Low-Level Input Voltage
High-Level Input Voltage
Input Hysteresis
VCBCL
I
= 100µA
V
CB
V
0.8
V
V
IL
V
1.75
100
-1
IH
V
(Note 8)
0V < V < V3P3
mV
µA
pF
HYS
Input Current
I
+1
10
IN
IN
Input Capacitance (Note 8)
C
IN
Logic Inputs: EN, COMMS Select1, COMMS Select2, COMMS Rate 0, COMMS Rate 1
Low-Level Input Voltage
High-Level Input Voltage
Input Hysteresis
V
0.3*V3P3
V
V
IL
V
0.7*V3P3
0.05*V3P3
-1
IH
V
(Note 8)
V
HYS
Input Current
I
0V < V < V3P3
IN
+1
10
µA
pF
IN
Input Capacitance (Note 8)
Logic Outputs: DOUT, Fault, Data Ready
Low-Level Output Voltage
C
IN
V
V
At 3mA sink current
At 6mA sink current
At 3mA source current
At 6mA source current
0
0.4
0.6
V
V
V
V
OL1
OL2
OH1
OH2
0
High-Level Output Voltage
V
V
V3P3 – 0.4
V3P3 – 0.6
V3P3
V3P3
SPI Interface Timing (See Figures 3 and 4)
SCLK Clock Frequency
Pulse Width of Input Spikes Suppressed
Enable Lead Time
f
t
2
MHz
ns
SCLK
t
50
200
IN1
LEAD
Chip select low to ready to receive clock data
200
200
200
250
ns
Clock High Time
t
(Note 8)
(Note 8)
ns
HIGH
Clock Low Time
t
ns
LOW
Enable Lag Time
t
Last data read clock edge to chip select high
(Note 8)
ns
LAG
CHIP SELECT High Time
Slave Access Time
t
Minimum high time for CS between bytes
Chip Select low to DOUT active. (Note 8)
Clock low to DOUT valid
200
ns
ns
ns
ns
ns
ns
ns
CS:WAIT
t
200
350
A
Data Valid Time
t
V
Data Output Hold Time (Note 8)
DOUT Disable Time
Data Setup Time
t
Data hold time after falling edge of SCLK
DOUT disabled following rising edge of CS (Note 8)
Data input valid prior to rising edge of SCLK
0
HO
t
240
DIS
t
100
80
SU
Data Input Hold Time
t
Data input to remain valid following rising edge of
SCLK
HI
DATA READY Stop Delay Time
DATA READY High Time
t
Chip select high to DATA READY high
Time between bytes
750
1.0
ns
µs
µs
DR:SP
t
DR:WAIT
SPI Communications Timeout
t
Time the CS remains high before SPI
communications time out - requiring the start of a
new command
100
SPI:TO
DOUT Rise Time
t
Up to 50pF load
30
ns
R
FN7672 Rev.10.00
May 10, 2018
Page 14 of 105
ISL78600
Electrical Specifications
V
= 6 to 60V, T = -20°C to +60°C, unless otherwise specified. Biasing setup as in
A
BAT
Figure 46 on page 29 or equivalent. (Continued)
MIN
MAX
PARAMETER
DOUT Fall Time
Daisy Chain Communications Interface: DHi1, DLo1, DHi2, DLo2
SYMBOL
TEST CONDITIONS
(Note 7)
TYP
(Note 7)
UNIT
ns
t
Up to 50pF load
30
F
Daisy Chain Clock Frequency
Comms Rate (0, 1) = 11
Comms Rate (0, 1) = 10
450
225
500
250
125
62.5
550
275
kHz
kHz
kHz
kHz
V
Comms Rate (0, 1) = 01
Comms Rate (0, 1) = 00
112.5
56.25
137.5
68.75
Common-Mode Reference Voltage
NOTES:
V
/2
BAT
7. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design.
8. These MIN and/or MAX values are based on characterization data and are not 100% tested.
9. Stresses may be induced in the ISL78600 during soldering or other high temperature events that affect measurement accuracy. Initial accuracy does
not include effects due to this. See Figure 8 on page 19 for cell reading accuracy obtained after soldering to Renesas evaluation boards. When
soldering the ISL78600 to a customized circuit board with a layout or construction significantly differing from the Renesas evaluation board, design
verification tests should be applied to determine drift due to soldering and over lifetime.
Timing Diagrams
CS
(FROM µC)
t
SPI:TO
t
CS:WAIT
t
t
t
LOW
t
LEAD
HIGH
LAG
SCLK
(FROM µC)
t
t
DIS
t
HO
F
t
V
t
A
DOUT
(TO µC)
t
R
t
t
HI
SU
DIN
(FROM µC)
CLOCK DATA INTO
ISL78600
CLOCK DATA OUT OF
ISL78600
FIGURE 3. SPI FULL DUPLEX (4-WIRE) INTERFACE TIMING
FN7672 Rev.10.00
May 10, 2018
Page 15 of 105
ISL78600
Timing Diagrams
t
CS:WAIT
CS
(FROM µC)
t
SPI:TO
t
t
DR:WAIT
DR:SP
DATA READY
(TO µC)
SCLK
(FROM µC)
t
t
A
DIS
DOUT
(TO µC)
CLOCK DATA OUT OF
ISL78600
SIGNALS ON DIN IGNORED
WHILE DATA READY IS LOW
DIN
(FROM µC)
CLOCK DATA INTO
ISL78600
FIGURE 4. SPI HALF DUPLEX (3-WIRE) INTERFACE TIMING
FN7672 Rev.10.00
May 10, 2018
Page 16 of 105
ISL78600
Performance Characteristics
Cell/V
Reading Error
BAT
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 10)
TYP
(Note 10)
UNIT
mV
ISL78600 Initial Cell Reading V
Error (Absolute)
Temperature = +25°C
V = 3.3V
CELL
CELLA
Limits applied to a ±3 sigma distribution
Limits applied to a ±5 sigma distribution
-1.5
-2.5
1.5
2.5
Temperature = -20°C to +60°C
= 2.6V to 4.0V
V
CELL
Limits applied to a ±3 sigma distribution
Limits applied to a ±5 sigma distribution
-2.0
-3.25
2.0
3.25
mV
mV
mV
mV
mV
mV
Temperature = -40°C to -20°C
= 2.6V to 4.0V
V
CELL
Limits applied to a ±3 sigma distribution
Limits applied to a ±5 sigma distribution
-3.5
-5.5
3.5
5.5
Temperature = +60°C to +85°C
= 2.6V to 4.0V
V
CELL
Limits applied to a ±3 sigma distribution
Limits applied to a ±5 sigma distribution
-3.85
-6.25
3.85
6.25
Temperature = +85°C to +105°C
= 2.6V to 4.0V
V
CELL
Limits applied to a ±3 sigma distribution
Limits applied to a ±5 sigma distribution
-9.0
-15.0
9.0
15.0
ISL78600 Initial V
BAT
V
BAT
Temperature = -20°C to +60°C
V = 31.2V to 48V
BAT
Reading Error (Absolute)
Limits applied to a ±3 sigma distribution
Limits applied to a ±5 sigma distribution
-95
-140
95
140
Temperature = -40°C to +105°C
= 31.2V to 48V
V
BAT
Limits applied to a ±3 sigma distribution
Limits applied to a ±5 sigma distribution
-140
-230
140
230
Voltage Reference Long Term
Drift
-0.31
mV/log
(days)
NOTE:
10. These distribution values are based on characterization of devices mounted on evaluation boards and are not 100% tested.
FN7672 Rev.10.00
May 10, 2018
Page 17 of 105
ISL78600
Cell Voltage Reading Error (Cell Chemistry Ranges)
MIN
MAX
PARAMETER
SYMBOL
V
TEST CONDITIONS
(Note 11)
TYP
(Note 11)
UNIT
mV
ISL78600 Initial Cell Monitor
Voltage Error (Absolute)
VCELL = 1.8V to 2.85V (+/- 3 sigma)
CELLA
-20°C to +60°C
-40°C to +85°C
-40°C to +105°C
-4.0
-6.7
-15.9
3.5
4.9
13.0
VCELL = 1.8V to 2.85V (+/- 6 sigma)
VCELL = 2.5V to 3.65V (+/- 3 sigma)
VCELL = 2.5V to 3.65V (+/- 6 sigma)
VCELL = 2.5V to 4.3V (+/- 3 sigma)
VCELL = 2.5V to 4.3V (+/- 6 sigma)
-20°C to +60°C
-40°C to +85°C
-40°C to +105°C
-7.6
-12.4
-30.3
7.0
10.7
27.3
mV
mV
mV
mV
mV
-20°C to +60°C
-40°C to +85°C
-40°C to +105°C
-2.7
-6.0
-15.7
2.5
5.4
14.3
-20°C to +60°C
-40°C to +85°C
-40°C to +105°C
-4.4
-11.7
-30.6
4.2
11.1
29.3
-20°C to +60°C
-40°C to +85°C
-40°C to +105°C
-4.0
-6.4
-16.1
3.4
6.3
15.5
-20°C to +60°C
-40°C to +85°C
-40°C to +105°C
-7.6
-12.8
-31.9
7.0
12.6
31.2
NOTE:
11. These distribution values are based on characterization of devices mounted on evaluation boards and are not 100% tested.
FN7672 Rev.10.00
May 10, 2018
Page 18 of 105
ISL78600
Performance Curves These performance curves are based on characterization of devices mounted on evaluation boards.
20
5
4
3
15
10
5
+ 2.5mV LIMIT
2
DATASHEET + LIMIT
DATASHEET - LIMIT
1
0
0
-1
-2
-3
-4
-5
-5
-10
-15
-20
- 2.5mV LIMIT
-20
-10
0
10
20
30
40
50
60
0
1
2
3
4
5
CELL VOLTAGE (V)
TEMPERATURE ( °C )
FIGURE 5. CELL VOLTAGE READING ERROR FROM -20°C TO +60°C
FIGURE 6. CELL VOLTAGE READING ERROR 3.0V TO 3.6V PER CELL
35
20
18
16
14
12
10
8
30
25
20
15
10
5
6
4
2
0
0
-2.5 -2.0 -1.5 -1.0 -0.5
0
0.5 1.0 1.5 2.0
2.5
-2.5 -2.0 -1.5 -1.0 -0.5
0
0.5 1.0 1.5 2.0 2.5
READING ERROR (mV)
READING ERROR (mV)
FIGURE 7. INITIAL CELL VOLTAGE ACCURACY FROM EVALUATION
BOARDS AT 3.3V, +25°C HISTOGRAM
FIGURE 8. CELL READING ERROR FROM EVALUATION BOARDS AT
CELL VOLTAGE FROM 2.6V TO 4.0V, AND -20°C TO
+60°C HISTOGRAM
60
40
350
300
250
200
150
100
50
20
0
-20
-40
-60
-80
-100
-120
0
-50
-100
-150
0
10
20
30
40
50
60
-40
-20
0
20
40
60
80
100
120
CELL VOLTAGE (V)
TEMPERATURE ( °C )
FIGURE 9. PACK VOLTAGE READING ERROR FROM -20°C TO +60°C
FIGURE 10. PACK VOLTAGE READING ERROR AT 39.6V PACK VOLTAGE
FN7672 Rev.10.00
May 10, 2018
Page 19 of 105
ISL78600
Performance Curves These performance curves are based on characterization of devices mounted on evaluation boards. (Continued)
35
2.0
V
=
BAT
1.5
1.0
0.5
0
30
25
20
15
10
5
54V
48V
43.2V
39.6V
36V
31.2V
6V
-0.5
-1.0
-1.5
-2.0
0
-40
-20
0
20
40
60
80
100
120
-50 -40 -30 -20 -10
0
10 20 30 40 50
TEMPERATURE (°C)
READING ERROR (mV)
FIGURE 11. INITIAL PACK VOLTAGE ACCURACY AT 39.6V, +25°C
HISTOGRAM
FIGURE 12. IC TEMPERATURE ERROR vs TEMPERATURE
7.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
-0
+105°C
6.0
5.0
4.0
3.0
2.0
1.0
0
+85°C
-40°C
+25°C
-20°C
+60°C
-1.0
-1.0
0
5
10 15 20 25 30 35 40 45 50 55 60
(V)
-40
-20
0
20
40
60
80
100
120
V
BAT
TEMPERATURE (°C)
FIGURE 13. VOLTAGE REFERENCE CHECK FUNCTION vs PACK
VOLTAGE AND TEMPERATURE
FIGURE 14. VOLTAGE REFERENCE CHECK FUNCTION vs
TEMPERATURE (V
= 6V TO 54V)
BAT
25.6
25.4
25.2
25.0
24.8
24.6
24.4
24.2
25.60
25.55
25.50
25.45
25.40
V
= 3.3V
CELL
-40
-20
0
20
40
60
80
100
0
10
20
30
40
50
60
PACK VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 15. BALANCE CURRENT vs PACK VOLTAGE
FIGURE 16. BALANCE CURRENT vs TEMPERATURE
FN7672 Rev.10.00
May 10, 2018
Page 20 of 105
ISL78600
Performance Curves These performance curves are based on characterization of devices mounted on evaluation boards. (Continued)
975
1000
V
= 3.3V
TEMPERATURE = +25°C
CELL
980
960
940
920
900
880
860
840
820
800
970
965
960
955
950
-40
-20
0
20
40
60
80
100
120
120
120
0
10
20
30
40
50
60
TEMPERATURE (°C)
PACK VOLTAGE (V)
FIGURE 17. OPEN-WIRE TEST CURRENT vs TEMPERATURE
(1mA SETTING)
FIGURE 18. OPEN-WIRE TEST CURRENT vs PACK VOLTAGE
(1mA SETTING)
160
158.6
V
= 3.3V
CELL
TEMPERATURE = +25°C
158.4
159
158
157
156
155
154
153
152
158.2
158.0
157.8
157.6
157.4
157.2
157.0
-40
-20
0
20
40
60
80
100
0
10
20
30
40
50
60
TEMPERATURE (°C)
PACK VOLTAGE (V)
FIGURE 19. OPEN-WIRE TEST CURRENT vs TEMPERATURE
(150µA SETTING)
FIGURE 20. OPEN-WIRE TEST CURRENT vs PACK VOLTAGE
(150µA SETTING)
4.05
4.045
V = 39.6V
BAT
V
= 39.6V
BAT
4.040
4.035
4.030
4.025
4.020
4.015
4.010
4.005
4.000
4.00
3.95
3.90
3.85
3.80
3.75
3.70
-40
-20
0
20
40
60
80
100
2.5
2.7
2.9
3.1
3.3
(V)
3.5
3.7
3.9
V
TEMPERATURE (°C)
CC
FIGURE 21. 4MHz OSCILLATOR FREQUENCY vs TEMPERATURE
FIGURE 22. 4MHz OSCILLATOR FREQUENCY vs V
CC
FN7672 Rev.10.00
May 10, 2018
Page 21 of 105
ISL78600
Performance Curves These performance curves are based on characterization of devices mounted on evaluation boards. (Continued)
31.35
31.30
31.25
31.20
31.15
31.10
31.05
31.00
31.6
31.4
31.2
31.0
30.8
30.6
30.4
30.2
30.0
29.8
V
= 39.6V
V
= 39.6V
BAT
BAT
2.5
2.7
2.9
3.1
3.3
(V)
3.5
3.7
3.9
-40
-20
0
20
40
60
80
100
120
V
TEMPERATURE (°C)
CC
FIGURE 24. 32kHz OSCILLATOR FREQUENCY vs V
FIGURE 23. 32kHz OSCILLATOR FREQUENCY vs TEMPERATURE
CC
60
50
80
70
60
50
40
30
20
10
0
V
= 60V
BAT
V
= 60V
BAT
40
30
20
10
0
V
= 39.6V
BAT
V
= 39.6V
BAT
V
= 6V
BAT
V
= 6V
BAT
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 25. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (STAND-ALONE MODE)
FIGURE 26. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (DAISY CHAIN MASTER)
80
70
60
80
70
60
V
= 60V
BAT
V
= 60V
BAT
50
40
30
20
10
0
50
40
30
20
10
0
V
= 39.6V
BAT
V
= 39.6V
BAT
V
= 6V
BAT
V
= 6V
100
BAT
-40
-20
0
20
40
60
80
120
-40
-20
0
20
40
60
80
100
120
TEMPERATURE ( °C )
TEMPERATURE ( °C )
FIGURE 27. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (DAISY CHAIN MIDDLE)
FIGURE 28. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (DAISY CHAIN TOP)
FN7672 Rev.10.00
May 10, 2018
Page 22 of 105
ISL78600
Performance Curves These performance curves are based on characterization of devices mounted on evaluation boards. (Continued)
750
100
V
= 60V
BAT
95
90
85
80
75
70
65
60
55
50
700
650
600
550
500
450
V
= 39.6V
V
= 60V
BAT
BAT
V
= 6V
80
BAT
V
= 6V
BAT
V
= 39.6V
20
BAT
-40
-20
0
20
40
60
80
100
120
-40
-20
0
40
60
100
120
TEMPERATURE ( °C )
TEMPERATURE ( °C )
FIGURE 29. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (STAND-ALONE MODE)
FIGURE 30. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (DAISY CHAIN MASTER)
750
1450
V
= 60V
BAT
V
= 60V
BAT
700
650
600
550
500
450
1350
1250
1150
1050
950
V
= 39.6V
BAT
V
= 39.6V
BAT
V
= 6V
80
BAT
V
= 6V
80
BAT
850
-40
-20
0
20
40
60
100
120
-40
-20
0
20
40
60
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 31. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (DAISY CHAIN MIDDLE)
FIGURE 32. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT
6V, 39.6V, 60V (DAISY CHAIN TOP)
3.45
3.40
3.35
3.25
3.20
3.15
3.10
3.05
3.00
2.95
2.90
60
50
40
30
V
= 39.6V
V
= 60V
BAT
BAT
20
10
0
V
= 6V
BAT
-60 -40 -20
0
20
40
60
80
100 120
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 33. PACK VOLTAGE SHUTDOWN CURRENT vs TEMPERATURE
(EN = 0) AT 6V, 39.6V, 60V
FIGURE 34. V SUPPLY CURRENT vs TEMPERATURE AT 6V, 39.6V,
CC
60V
FN7672 Rev.10.00
May 10, 2018
Page 23 of 105
ISL78600
Performance Curves These performance curves are based on characterization of devices mounted on evaluation boards. (Continued)
1.06
1.05
1.04
1.03
1.02
1.01
1.00
0.99
2.5
2.0
1.5
1.0
0.5
0
VCELL = 3.3V
VC5
VC8
VC6
VC11
VC10
VC7
VC9
39.6V
VC12
VC4
VC0
60V
-0.5
-1.0
-1.5
-2.0
-2.5
6V
VC3
-20
VC2
0
VC1
-40
-20
0
20
40
60
80
100
-40
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 35. V
SUPPLY CURRENT vs TEMPERATURE
FIGURE 36. CELL INPUT CURRENT vs TEMPERATURE
3P3
0
2.5
VC11
2.0
VC10
-0.2
VC9
1.5
1.0
VC8
VC7
VC6
VC5
VC12
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4
0.5
VC4
VC0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
VC3
VC2
VC1
0.001
0.01
0.1
1.0
10.0
0
10
20
30
40
50
60
PACK VOLTAGE (V)
YEARS
FIGURE 37. CELL INPUT CURRENT vs PACK VOLTAGE (+25°C)
FIGURE 38. LONG TERM DRIFT
FN7672 Rev.10.00
May 10, 2018
Page 24 of 105
ISL78600
The ISL78600 incorporates extensive fault diagnostics functions,
which include cell overvoltage and undervoltage, regulator and
oscillator operation, open cell input detection, and
communication faults. The current status of most faults is
accessible using the ISL78600 registers. Some communication
faults are reported by special responses to system commands
and some as “unprompted” responses from the device detecting
the fault to the host microcontroller through the daisy chain.
Device Description and
Operation
The ISL78600 is a Li-ion battery manager IC that supervises up
to 12 series-connected cells. Up to 14 ISL78600 devices can be
connected in series to support systems with up to 168 cells. The
ISL78600 provides accurate monitoring, cell balance control,
and diagnostic functions. The ISL78600 includes a voltage
reference, 14-bit A/D converter, and registers for control and
data.
To conserve power, the ISL78600 has three main power modes:
Normal mode, Sleep mode, and “off” (Shutdown mode).
When multiple ISL78600 devices are connected to a series of
cells, their power supply domains are normally nonoverlapping.
The lower (VSS) supply of each ISL78600 nominally connects to
The device enters Sleep mode in response to a Sleep command
or after a watchdog timeout (see “Watchdog Function” on
page 78.) Only the communications input circuits, low speed
oscillator and internal registers are active in Sleep mode,
allowing the part to perform timed scan and balancing activity
and to wake up in response to communications.
the same potential as the upper (V ) supply of the ISL78600
BAT
device below.
Within each device, the cell voltage monitoring system has two
basic elements: a level shift to eliminate the cell common-mode
voltage, and an analog-to-digital conversion of the cell voltage.
The device is in Shutdown mode when the Enable pin is low. In
this mode, the internal bias for most of the IC is powered down
except digital core, sleep mode regulators, and digital input
buffers. When exiting, the device powers up and does not reload
the factory programmed configuration data from the EEPROM.
Each ISL78600 is calibrated at a specific cell input voltage value,
V
. Cell voltage measurement error data is given in
NOM
“Measurement Specifications” on page 9 for various voltage and
temperature ranges with voltage ranges defined with respect to
Normal mode consists of an active state and a standby state. In
the standby state, all systems are powered and the device is
ready to perform an operation in response to commands from
the host microcontroller. In the Active state, the device is
performing an operation, such as ADC conversion, open-wire
detection, etc.
V
. Plots showing the typical error distribution over the full
NOM
input range are included in the “Performance Curves” section
beginning on page 19.
To collect cell voltage and temperature measurements, the
ISL78600 provides two multiple parameter measurement
“scanning” modes in addition to single parameter direct
measurement capability. The scanning modes provide
pseudo-simultaneous measurement of all cell voltages in the
stack.
System Hardware Connection
Battery and Cell Balance Connection
The first consideration in designing a battery system around the
ISL78600 is the connection of the cells to the IC.
The ISL78600 does not measure current. The system performs
this separately using other measurement systems.
The battery connection elements are split between the cell
monitor connections (VCn) and the cell balance connections (CBn).
The only filtering applied to the ADC measurements is that
resulting from external protection circuits and the limited
bandwidth of the measurement path. No additional filtering is
performed within the part. This arrangement is typically needed
to maintain timing integrity between the cell voltage and pack
current measurements. However, the ISL78600 does apply
filtering to the fault detection systems.
BATTERY CONNECTION
All inputs to the ISL78600 VCn pins are protected against battery
voltage transients by external RC filters. The basic input filter
structure, with capacitors to the local ground, provides protection
against transients and EMI for the cell inputs. They carry the loop
currents produced by EMI and should be placed as close to the
battery connector as possible. The ground terminals of the
capacitors must be connected directly to a solid ground plane. Do
not use vias to connect these capacitors to the input signal path
or to ground. Any vias should be placed in line to the signal inputs
so that the inductance of these forms a low pass filter with the
grounded capacitors.
Cell balancing is an important function in a battery pack
consisting of a stack of multiple Li-ion cells. As the cells charge
and discharge, differences in each cell’s ability to take on and
give up charge, typically leads to cells with different states of
charge. The problem with a stack of cells having different states
of charge is that Li-ion cells have a maximum voltage, above
which it should not be charged, and a minimum voltage, below
which it should not be discharged. The extreme case, where one
cell in the stack is at the maximum voltage and one cell is at the
minimum voltage, results in a nonfunctional battery stack,
because the battery stack cannot be charged or discharged.
The resistors on the input filter provide a current limit function
during hot plug events. The ISL78600 is calibrated for use with
1kΩ series protection resistors at the VCn inputs. The V
BAT
connection uses a lower value input resistor to accommodate the
supply current of the ISL78600. As much as possible, the time
constant produced by the filtering applied to VBAT should be
matched to that applied to the VCn monitoring inputs (see
Figure 39).
The ISL78600 provides multiple cell balance modes: Manual
Balance mode, Timed Balance mode, and Auto Balance mode.
These are described in more detail in “Alarm Response” on
page 78.
FN7672 Rev.10.00
May 10, 2018
Page 25 of 105
ISL78600
the accuracy of the cell voltage readings. Second, if the single
wire breaks, it is very difficult for the system to tell specifically
what happened through normal diagnostic methods.
LOCATE CLOSE
TO INPUT CONNECTOR
ISL78600
27
B14b
VBAT
C
58V*
VSS
1
An alternative circuit in Figure 41 shows the connection of one
(or two) wires with additional Schottky diodes to provide supply
current paths to allow the device to detect a connection fault and
to minimize the effects on cell voltage measurements when
there is an open connection to the battery.
*EXAMPLE DIODE:
PTVS58VS1UTR
180
820
B12
VC12
22nF
180
180
820
B11
B10
VC11
VC10
ISL78600
22nF
820
100
100
100
820
22nF
VC2
22nF
VSS2
VSS2
820
VC1
180
820
22nF
820
VC9
B9
22nF
VC0
22nF
VSS2
180
180
820
22nF
820
B3
B2
VC3
VC2
ISL78600
VBAT
27
C
1
VSS
100
VSS
VSS
22nF
820
180
180
820
VC12
B1
VC1
22nF
820
22nF
22nF
100
820
VC11
VSS
B0
VC0
VSS
22nF
B0b
= “QUIET” GROUND
= “NOISY” GROUND
FIGURE 40. BATTERY CONNECTION BETWEEN STACKED DEVICES
(OPTION 1)
CELL BALANCE CIRCUITS NOT SHOWN IN THIS FIGURE
FIGURE 39. TYPICAL INPUT FILTER CIRCUITS
ISL78600
180
180
180
820
22nF
The filtered battery voltage connects to the internal cell voltage
monitoring system. The monitoring system is made up of three
basic elements: a level shifter to eliminate the cell common-
mode voltage, a multiplexer to select a specific input, and an
analog-to-digital conversion of the cell voltage.
VC2
VSS2
VSS2
820
VC1
22nF
820
Each ISL78600 is calibrated at a specific cell input voltage value,
VC0
V
with an expected input series resistance of 1kΩ. Cell voltage
22nF
NOM
VSS2
measurement error data is given in “Measurement Specifications”
on page 9 for various voltage and temperature ranges with voltage
ranges defined with respect to V
error distribution over the full input range are included in the
“Performance Curves” section beginning on page 19.
ISL78600
VBAT
27
. Plots showing the typical
NOM
C
1
VSS
180
VSS
820
VC12
VC11
Another important consideration is the connection of cells in a
stacked (non-overlapping) configuration. Mainly, this involves
how to connect the supply and ground pins at the junction of two
devices. The diagram in Figure 40 shows the recommended
minimum connection to the pack. It is preferred that there be
four connection wires at the intersection of two devices, but this
does pose a cost constraint. To minimize the connections, the
power and monitor pins are connected separately, as shown in
Figure 40. It is not recommended that all four wires connect
together with a single wire to the pack. There are two reasons for
this. First, the power supply current for the devices might affect
22nF
VSS
VSS
180
820
22nF
FIGURE 41. BATTERY CONNECTION BETWEEN STACKED DEVICES
(OPTION 2)
FN7672 Rev.10.00
May 10, 2018
Page 26 of 105
ISL78600
Figures 42 and 43 show the circuit detail for the recommended
balancing and cell voltage monitoring system. In this
CELL BALANCE CONNECTION
The ISL78600 uses external MOSFETs for cell balancing. The
gate drive for these is derived from on-chip current sources on
the ISL78600, which are 25µA nominally. The current sources
are turned on and off as needed to control the external MOSFET
devices. The current sources are turned off when the device is in
Shutdown mode or Sleep mode. The ISL78600 uses a mix of N-
channel and P-channel MOSFETs for the external balancing
function. The top three cell locations, Cells 10, 11, and 12 are
configured to use P-channel MOSFETs while the remaining cell
locations, Cells 1 through 9 use N-channel MOSFETs. The mix of
N-channel and P-channel devices are used for the external FETs in
order to remove the need for a charge pump, while providing a
balance FET gate voltage that is sufficient to drive the FET on,
regardless of the cell voltages.
configuration, the cell voltage is monitored after the cell balance
resistor. This allows the system to monitor the operation of the
external balance circuits and is part of the fault detection
system. However, this connection prevents monitoring the cell
voltage while cell balance is enabled for that cell.
Figure 42 shows the connection for VC12 to VC9. This connection
for the upper 3 cells uses P-channel FETs, while VC9 and below
use N-channel FETs. Similarly, Figure 43 shows the connection
for VC1 to VC3, using an N-channel FETs, with the connections for
VC3 through VC9 being similar. See Figure 53 on page 35 for a
more complete example.
R2
R5
VC12
22nF
C3
4MΩ
R5
R3
C1
C2
R1
9V
VC3
CB3
100Ω
22nF
C3
Q1
C2
C1
CB12
10kΩ
R3
25µA
25µA
100Ω
R5
Q2
VC11
10kΩ
R1
22nF
C3
4MΩ
4MΩ
C1
C2
R1
9V
R5
R3
Q1
100Ω
CB11
10kΩ
R3
VC2
CB2
25µA
100Ω
22nF
C3
R5
VC10
C2
C1
25µA
22nF
C3
4MΩ
Q2
C1
C2
10kΩ
R1
R1
9V
Q1
100Ω
4MΩ
CB10
10kΩ
25µA
9V
R4
R6
R6
R3
R5
VC9
VC1
CB1
100Ω
22nF
C3
C2
C1
100Ω
Q2
R4
25µA
C2
C1
22nF
22nF
C3
25µA
Q2
CB9
10kΩ
10kΩ
R1
R1
R2
4MΩ
9V
R5
4MΩ
9V
VC0
VSS
R3
R5
22nF
VC8
100Ω
22nF
ISL78600
ISL78600
FIGURE 43. CELL MONITOR AND BALANCE CIRCUIT ARRANGEMENT
(VC0 TO VC3)
FIGURE 42. CELL MONITOR AND BALANCE CIRCUIT ARRANGEMENT
(VC8 TO VC12)
TABLE 2. ISL78600 INPUT FILTER COMPONENT OPTIONS
Q1 (P-channel)
with examples
Q2 (N-channel)
C1
C2
C3
R1
R2
R3
R4
R5
R6
with examples
30V A&O Semi AO3402
30V A&O Semi AO3402
60V Diodes DMN6140L-7
60V Diodes DMN6140L-7
30V A&O Semi AO3401
30V A&O Semi AO3401
60V Fairchild FDN5618
60V Fairchild FDN5618
Note: Q1 and Q2 should have low r
10nF
10nF
1nF
1nF
Not populated 100k 820 720 1.54k 180 360
100nF 100k 100 910 1900
0
0
10nF Not needed Not populated 330k 820 720 1.54k 180 360
10nF Not needed 100nF 330k 100 910 1900
0
0
specifications (<100mΩ) to function properly in this fault diagnostic configuration.
DS(ON)
FN7672 Rev.10.00
May 10, 2018
Page 27 of 105
ISL78600
Figures 44 and 45 show an alternative balancing and cell voltage
monitoring arrangement. The diagram in Figure 44 shows the
connection for VC9 through VC12, using P-channel FETs for the
upper three inputs. Figure 45 shows the connection for VC1
through VC3 using N-channel FETs. With this alternative circuit it
is possible to monitor the cell voltages during cell balancing
(even though the voltage will likely drop a little when measuring
a cell that is being balanced). However, this circuit connection
does not allow the system to check for all potential external
component failures. See Figure 56 on page 38 for a more
complete example.
capacitances. These momentarily turn on the FET in the event of
a large transient, thus limiting the Vgs values to reasonable
levels. A 10nF capacitor is included between the MOSFET gate
and source terminals to protect against EMI effects. This
capacitor provides a low impedance path to ground at high
frequencies and prevents the MOSFET turning on in response to
high frequency interference.
The 10k and 330k resistors are chosen to prevent the 9V clamp
at the output from the ISL78600 from activating.
Reduced cell counts for fewer than 12 cells are accommodated
by removing connections to the cells in the middle of the stack
first. The top and bottom cell locations are always occupied. See
“Operating with Reduced Cell Counts” on page 33 for suggested
cell configurations when using fewer than 12 cells.
The gate of the N-channel MOSFET (cell locations 1 through 9)
and P-channel MOSFETs (Cells 10 through 12) are normally
protected against excessive voltages during cell voltage
transients by the action of the parasitic Cgs and Cgd
R2
R5
VC12
22nF
C3
4MΩ
C1
R1
R5
9V
VC3
R4
Q1
100Ω
22nF
CB12
10kΩ
R2
100Ω
C2
25µA
25µA
C2
C1
C3
R5
CB3
VC11
Q2
10kΩ
R1
22nF
C3
4MΩ
R1
C1
C2
4MΩ
9V
R5
Q1
100Ω
CB12
10kΩ
R2
VC2
CB2
R4
22nF
C3
25µA
100Ω
C2
C1
R5
VC10
25µA
22nF
C3
Q2
4MΩ
10kΩ
R1
9V
R1
C1
C2
4MΩ
Q1
100Ω
9V
R5
CB12
10kΩ
R2
25µA
C2
C2
VC1
R5
R4
VC9
CB9
22nF
C3
100Ω
25µA
22nF
C3
100Ω
CB1
25µA
Q2
10kΩ
Q2
C1
R1
R3
4MΩ
10kΩ
9V
4MΩ
R5
C1
R1
R2
9V
R5
VC0
VSS
22nF
VC8
22nF
ISL78600
ISL78600
FIGURE 44. ALTERNATE CELL MONITOR AND BALANCE CIRCUIT
ARRANGEMENT (VC8 to VC12)
FIGURE 45. ALTERNATE CELL MONITOR AND BALANCE CIRCUIT
ARRANGEMENT (VC1 TO VC3)
TABLE 3. ISL78600 INPUT FILTER COMPONENT OPTIONS
Q1 (P-channel)
with examples
Q2 (N-channel)
C1
C2
C3
R1
R2
R3
R4
R5
R6
with examples
30V Diodes DMN63D8L-7
30V Diodes DMN63D8L-7
60V Fairchild NDS7002
60V Fairchild NDS7002
30V Diodes DMP32D4S-13
30V Diodes DMP32D4S-13
60V Fairchild NDS0605
60V Fairchild NDS0605
10nF
10nF
1nF
1nF
Not populated 100k 820 720 1.54k 180 360
100nF 100k 100 910 1900
0
0
10nF Not needed Not populated 330k 820 720 1.54k 180 360
10nF Not needed 100nF 330k 100 910 1900
0
0
Note: Q1 and Q2 r
DS(ON)
specification is not critical, since fault diagnostics are not performed in this configuration.
FN7672 Rev.10.00
May 10, 2018
Page 28 of 105
ISL78600
CELL VOLTAGE MEASUREMENTS DURING BALANCING
Power Supplies and Reference
The standard cell balancing circuit (Figures 42, 43, and 53) is
configured so the cell measurement is taken from the drain
connection of the balancing MOSFET. When balancing is enabled
for a cell, the resulting cell measurement is then the voltage
across the balancing MOSFET (VGS voltage). This system
provides a diagnostic function for the cell balancing circuit. The
input voltage of the cell adjacent to the MOSFET drain connection
is also affected by this mechanism: the input voltage for this cell
increases by the same amount that the voltage of the balance
cell decreases.
VOLTAGE REGULATORS
The two VBAT pins, along with V3P3, VCC, and VDDEXT are used
to supply power to the ISL78600. Power for the high voltage
circuits and Sleep mode internal regulators is provided through
the VBAT pins. V3P3 supplies the logic circuits and VCC is
similarly used to supply the low voltage analog circuits. The V3P3
and VCC pins must not be connected to external circuits other
than those associated with the ISL78600 main voltage regulator.
The VDDEXT pin is provided for use with external circuits.
For example, if Cells 2 and 3 are both at 3.6V and balancing is
enabled for Cell 2, the voltage across the balancing MOSFET may
be only 50mV. In this case, the input voltage on the VC2 pin
would be VC1 + 50mV and Cell 3 would be VC2 + 7.15V. Thus, the
VC3 value is outside the measurement range of the cell input.
The VC3 would then read full scale voltage, which is 4.9994V.
This full scale voltage reading will occur if the sum of the
voltages on the two adjacent cells is greater than the total of 5V
plus the “balancing on” voltage of the balanced cell. Table 4
shows the cell affected when each cell is balanced.
The ISL78600 main low voltage regulator uses an external NPN
pass transistor to supply 3.3V power for the V3P3 and VCC pins.
This regulator is enabled whenever the ISL78600 is in Normal
mode and can also be used to power external circuits through the
VDDEXT pin. An internal switch connects the VDDEXT pin to the
V3P3 pin. Both the main regulator and the switch are off when the
part is placed in Sleep mode or Shutdown mode (EN pin Low.) The
pass transistor’s base is connected to the ISL78600 BASE pin. A
suitable configuration for the external components associated
with the V3P3, VCC, and VDDEXT pins is shown in Figure 46 on
page 29.
The cell voltage measurement is affected by impedances in the
cell connectors and any associated wiring. The balance current
passes through the connections at the top and bottom of the
balanced cell. This effect further reduces the voltage measured
on the balanced cell and increases the voltage measured on cells
above and below the balanced cell. For example, if Cell 4 is
balanced with 100mA, and the total impedance of the connector
and wiring for each cell connection is 0.1Ω, then Cell 4 would
read low by an additional 20mV (10mV due to each pin) while
Cells 3 and 5 would both read high by 10mV.
The external pass transistor is required. Do not allow the BASE
pin to float.
VOLTAGE REFERENCE
A bypass capacitor is required between REF (Pin 33) and the
analog ground VSS. The total value of this capacitor should be in
the range of 2.0µF to 2.5µF. Use X7R type dielectric capacitors
for this function. The ISL78600 continuously performs a
power-good check on the REF pin voltage starting at 20ms after
a power-up, enable, or wakeup condition. If the REF capacitor is
too large, then the reference voltage may not reach its target
voltage range before the power-good check starts and can result
in a REF Fault. If the capacitor is too small, it may lead to
inaccurate voltage readings.
TABLE 4. CELL READINGS DURING BALANCING
CELL
CELL WITH
CELL WITH
BALANCED
LOW READING
HIGH READING
1
2
1
2
2
3
PACK
VOLTAGE
3
3
4
ISL78600
R
1
4
4
5
VBAT
R
3
5
5
6
Q
1
C
BASE
V3P3
1
6
6
7
D
1
7
7
8
C
7
R
2
8
8
9
VCC
C
9
9*
10*
11
12
10*
9*
10
11
2
VREF
10
11
12
C
6
V2P5
C
5
NOTE: *Cells 9 and 10 produce a different result from the other cells.
Cell 9 uses an N-channel MOSFET while Cell 10 uses a P-channel MOSFET.
The circuit arrangement used with these devices produces approximately
half the normal cell voltage when balancing is enabled. The adjacent cell
then sees an increase of half the voltage of the balanced cell.
VSS
VDDEXT
TO EXTERNAL
CIRCUITS
C
4
FIGURE 46. ISL78600 REGULATOR AND EXTERNAL CIRCUIT SUPPLY
ARRANGEMENT
FN7672 Rev.10.00
May 10, 2018
Page 29 of 105
ISL78600
chain. See Figures 47, 48, and Table 6. This configuration also
specifies the use of SPI or daisy chain on the communication
ports.
TABLE 5. COMPONENT SELECTION FOR CRICUIT IN Figure 46
COMPONENT
VALUE
R
Sized to pass the maximum supply current at the
minimum specified battery pack voltage.
1
TABLE 6. COMMUNICATIONS MODE CONTROL
COMMS COMMS
SELECT 1 SELECT 2
PORT 1
COMM
PORT 2
COMM
COMMUNICATIONS
CONFIGURATION
R
R
33Ω
27Ω
2
3
1
0
0
1
1
0
1
0
1
SPI
(Full Duplex)
Disabled Stand-Alone
C
Selected to produce a time constant with R of a few
milliseconds. C and R provide transient protection for
the collector of Q . Component values and voltage ratings
should be obtained through simulation of measurement
of the worst case transient expected on VBAT.
1
1
1
SPI
(Half Duplex)
Enabled Daisy Chain,
1
Master Device Setting
Daisy Chain Disabled Daisy Chain,
Top Device Setting
C , C , C , C 1μF
2
3
4
5
Daisy Chain Enabled Daisy Chain
Middle Device Setting
C
2.2μF
6
C
220nF/100V
PTVS54VS1UTR
7
D
1
1
ISL78600
Q
Selected for power dissipation at the maximum specified
battery voltage and load current. The load current includes
the V
and V currents for the ISL78600 and the
3P3
CC
COMMS SELECT2
COMMS SELECT1
SPI
maximum current drawn by external circuits supplied
through VDDEXT. The voltage rating should be determined
by the worst case transient expected on VBAT.
VSS
Communications Circuits
FIGURE 47. NON-DAISY CHAIN COMMUNICATIONS CONNECTIONS
AND SELECT
The ISL78600 operates as a stand-alone monitor for up to 12
series-connected cells or in a daisy chain configuration for
multiple series connected ISL78600 monitoring devices. For
stand-alone (non-daisy chain) systems, only a synchronous SPI is
needed for communications between a host microcontroller and
the ISL78600.
.
V3P3
ISL78600
DAISY DOWN
COMMS SELECT2
COMMS SELECT1
Both the SPI port and daisy chain ports are needed for
communication in systems where there is more than one
ISL78600.
VSS
V3P3
ISL78600
A daisy chain consists of a bottom device, a top device, and up to
12 middle devices. The ISL78600 device located at the bottom of
the stack is called the master and communicates to the host
microcontroller using SPI communications and to other
ISL78600 devices using the daisy chain port. Each middle device
provides two daisy chain ports: one is connected to the ISL78600
above in the stack and the other to the ISL78600 below.
Communications between the SPI and daisy chain interfaces are
buffered by the master device to accommodate timing
differences between the two systems.
DAISY UP
DAISY DOWN
COMMS SELECT2
COMMS SELECT1
VSS
V3P3
ISL78600
DAISY UP
The daisy chain ports are fully differential, DC balanced,
bidirectional, and AC coupled to provide maximum immunity to
EMI and other system transients while requiring only two wires
for each port.
COMMS SELECT2
COMMS SELECT1
SPI
VSS
The addressed device, top device, and bottom device act as
master devices for controlling command and response
communications. All other devices are repeaters, passing data
up or down the chain.
FIGURE 48. DAISY CHAIN COMMUNICATIONS CONNECTIONS AND
SELECTION
Four daisy chain data rates are available and are configurable by
pin selection using the COMMS RATE 0 and COMMS RATE 1 pins
(see Table 7 on page 31).
The communications setup is controlled by the COMMS SELECT 1
and COMMS SELECT 2 pins on each device. These pins specify
whether the ISL78600 is a stand-alone device, the daisy chain
master, the daisy chain top, or a middle position in the daisy
FN7672 Rev.10.00
May 10, 2018
Page 30 of 105
ISL78600
cable capacitance values from 0pF to 50pF when operating at
the 500kHz data rate. Higher cable capacitance values can be
TABLE 7. DAISY CHAIN COMMUNICATIONS DATA RATE SELECTION
DATA RATE
(kHz)
accommodated by either reducing the value of C or operating at
2
COMMS RATE 0
COMMS RATE 1
lower data rates.
0
0
1
1
0
1
0
1
62
The values of components in Figure 49 are given in Table 8 for
various daisy chain operating data rates.
125
250
500
The circuit and component values of Figure 49 and Table 8 will
accommodate cables with differential capacitance values in the
ranges given. This allows a range of cable lengths to be
accommodated through careful selection of cable properties.
Daisy Chain Circuits
The circuit of Figure 49 provides full isolation when used with off
board wiring. The daisy chain external circuit can be simplified in
cases where the daisy chain system is contained within a single
board. Figure 50 on page 32 and Table 9 on page 32 show the
circuit arrangement and component values for single board use.
The ISL78600 daisy chain communications system external
circuit arrangement is symmetrical to provide the bidirectional
communications function. The performance of the system under
transient voltage and EMI conditions is enhanced by the use of a
capacitive load. A schematic of the daisy chain circuit for
board-to-board connection is shown in Figure 49.
In this case, the AC coupling capacitors C need only be rated for
1
the maximum transient voltage expected from device to device.
The basic circuit elements are the series resistor and capacitor
elements, R and C , which provide the transient current limit
The value for C in Table 8 is ideally 220pF. This creates a 3:1
2
1
1
ratio in the transmit vs received signal. However, additional
capacitance on the board due to device pin, board layout, and
connector capacitance forces the use of a lower value capacitor.
In practical terms, using the “ideal” capacitor and ignoring real
additional capacitance on the board reduces the signal level at
the receiver. It is recommended that the board layout minimize
distance on daisy chain traces and isolate them as much as
possible from each other and from ground planes. Expect at least
50pF to 90pF of additional board capacitance, depending on
layout and connectors.
and AC coupling functions, and the line termination components
C , which provide the capacitive load. Capacitors C and C
should be located as closely as possible to the board connector.
2
1
2
The AC coupling capacitors C need to be rated for the maximum
1
voltage, including transients, that will be applied to the interface.
Specific component values are needed for correct operation with
each daisy chain data rate and are given in Table 8.
The daisy chain operates with standard unshielded twisted pair
wiring. The component values given in Table 8 accommodate
CONNECTOR
CONNECTOR
ISL78600
R
R
C
C
R
R
ISL78600
2
1
1
1
1
2
C
C
C
2
2
2
2
DGND1
DGND2
C
2
R
R
R
R
1
1
2
C
C
1
1
FIGURE 49. ISL78600 DAISY CHAIN CIRCUIT IMPLEMENTATION
TABLE 8. COMPONENT VALUES IN FIGURE 49 FOR VARIOUS DAISY CHAIN DATA RATES
DAISY CHAIN CLOCK RATES
COMPONENT
QUANTITY (ea.)
4
500kHz
220pF
250kHz
470pF
125kHz
1nF
62.5kHz
2.2nF
COMMENTS
C
NPO dielectric type capacitors are
recommended. Please consult Renesas if
Y type or “open mode” devices are
required for your application.
1
C
4
4
150pF (Note)
470Ω
400pF
470Ω
100Ω
960pF
470Ω
100Ω
2nF
Use same dielectric type as C
1
2
R
R
470Ω
100Ω
1
2
4
100Ω
Cable Capacitance Range
N/A
0 to 50pF
0 to 100pF 0 to 200pF 0 to 400pF
NOTE: See text for a discussion on the value for C .
2
FN7672 Rev.10.00
May 10, 2018
Page 31 of 105
ISL78600
.
R
C
C
1
1
1
TEMPREG
VCC
VREF
C
C
C
2
2
2
C
2
R2
10M
R1
10k
R
1
ISL78600
10k
ISL78600
DGND1
DGND2
ADC
EXT4
C1
10nF
ISOLATED GROUND PLANES ON THE SAME PCB
FIGURE 50. ISL78600 DAISY CHAIN – BOARD LEVEL
IMPLEMENTATION CIRCUIT
RT
ISL78600
TABLE 9. DAISY CHAIN COMPONENT VALUES FOR BOARD LEVEL
IMPLEMENTATION
FIGURE 51. CONNECTION OF NTC THERMISTOR TO INPUT EXT4
DAISY CHAIN DATA RATE (kHz)
QUANTITY
TABLE 10. COMPONENT FUNCTIONS AND DIAGNOSTIC RESULTS FOR
CIRCUIT OF FIGURE 51
COMPONENT
(ea.)
TOLERANCE 500
250
125
62.5
C
C
2
5%
5%
100pF 220pF 470pF 1nF
150pF 400pF 960pF 2nF
1
COMPONENT
FUNCTION
DIAGNOSTIC RESULT
4
2
R
Protectionfromwiring Open: Open-wire detection
shorts to external HV Short: No diagnostic result
connections.
1
R
2
1kΩ
1kΩ
1kΩ
1kΩ
1
R
Measurement
high-side resistor
Open: Low input level
2
External Inputs
The ISL78600 provides four external inputs for use either as
general purpose analog inputs or for NTC type thermistors.
(over-temperature indication)
Short: High input level (open-wire
indication).
Thermistor
Open: High input level (open-wire
indication).
Short: Low input level
The arrangement of the external inputs is shown in Figure 51
using the ExT4 input as an example. It is important that the
components are connected in the sequence. For example, C
(over-temperature indication)
1
must be connected so the trace from this capacitor’s positive
C
Noise Filter. Connects Open: No diagnostic result.
1
terminal connects to R before connecting to R . This
2
1
to measurement
ground VSS.
Short: Low input level
(over-temperature indication)
guarantees the correct operation of the various fault detection
functions.
Each of the external inputs has an internal pull-up resistor, which
is connected by a switch to the VCC pin whenever the TEMPREG
output is active. This arrangement results in an open input being
pulled up to the V voltage.
CC
Inputs above 15/16 of full scale are registered as open inputs
and cause the relevant bit in the Over-Temperature Fault register,
along with the OT bit in the Fault Status register to be set, on
condition of the respective temperature test enable bit in the
Fault Setup register. The user must then read the register value
associated with the faulty input to determine if the fault was due
to an open input (value above 15/16 full scale) or an
over-temperature condition (value below the external
temperature limit setting).
The function of each of the components in Figure 51 is listed in
Table 10 with the diagnostic result of an open or short fault in
each component.
FN7672 Rev.10.00
May 10, 2018
Page 32 of 105
ISL78600
Typical Application Circuits
Operating with Reduced Cell Counts
Typical application circuits are shown in Figures 52 through 58.
Table 11 on page 41 contains recommended component values.
All external (off-board) inputs to the ISL78600 are protected
against battery voltage transients by RC filters. They also provide
a current limit function during hot plug events. The ISL78600 is
calibrated for use with 1kΩ series protection resistors at the cell
When using the ISL78600 with fewer than 12 cells, ensure that
each used cell has a normal input circuit connection to the top
and bottom monitoring inputs for that cell. The simplest way to
use the ISL78600 with any number of cells is to always use the
full input circuit arrangement for all inputs, and short together
the unused inputs at the battery terminal. In this way each cell
input sees a normal source impedance independent of whether
or not it is monitoring a cell.
inputs. V
uses a lower value resistor to accommodate the
supply current of the ISL78600. A value of 27Ω is used for
BAT
V
BAT
this component. As much as possible, the time constant
produced by the filtering applied to V should be matched to
The cell balancing components associated with unconnected cell
inputs are not required and can be removed. Unused cell balance
outputs should be tied to the adjacent cell voltage monitoring
pin.
BAT
that applied to the Cell 12 monitoring input. Component values
given in Table 11 produce the required matching characteristics.
Figure 52 on page 34 shows the standard arrangement for
connecting the ISL78600 to a stack of 12 cells. The cell input
filter is designed to maximize EMI suppression. These
components should be placed close to the connector with a well
controlled ground to minimize noise for the measurement inputs.
The balance circuits shown in Figure 52 provide normal cell
monitoring when the balance circuit is turned off, and a near zero
cell voltage reading when the balance circuit is turned on. This is
part of the diagnostic function of the ISL78600.
The input circuit component count can be reduced in cases
where fewer than 10 cells are being monitored. It is important
that cell inputs that are being used are not connected to other
(unused) cell inputs as this would affect measurement accuracy.
Figures 56, 57, and 58 show examples of systems with 10 cells,
8 cells, and 6 cells, respectively.
The component notations and values used in Figures 56, 57, and
58 are the same as those used in Figures 52. But Figure 58, the
resistor associated with the input filter on VC9 is noted as R ,
5
Figure 53 on page 35 shows connections for the daisy chain
system, setup pins, power supply, and external voltage inputs for
daisy chain devices other than the master (stack bottom) device.
rather than R5U. This value change is needed to maintain the
correct input network impedance in the absence of the Cell 9
balance circuits.
Figure 54 on page 36 shows the daisy chain system, setup pins,
microcontroller interface, power supply, and external voltage
inputs for the daisy chain master device. Figure 54 is also
applicable to stand-alone (non-daisy chain) devices although in
this case the daisy chain components connected to DHi2 and
DLo2 would be omitted.
Figure 55 on page 37 shows an alternate arrangement for the
battery connections in which the cell input circuits are connected
directly to the battery terminal and not through the balance
resistor. In this condition the balance diagnostic function
capability is removed.
FN7672 Rev.10.00
May 10, 2018
Page 33 of 105
ISL78600
PLACE THESE
COMPONENTS
PACK
VOLTAGE
CLOSE TO CONNECTOR
R
B12b
B12
C
D
58
59
60
61
1
1
1
ISL78600
VBAT
VBAT
VC12
CB12
R
R
R
2A
3A
4A
R
C
2
2
3
4
R
28
Q
1
C
R
27
27
R
R
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
C
C
62
29
3
VC11
R
63
64
31
Q
CB11
VC10
2
C
R
28
30
R
R
4
32
R
Q
1
2
3
34
3
CB10
VC9
R
C
C
R
R
R
35
29
30
33
37
5U
R
5AU
R
R
5L
C
5L
36
Q
R
C
5AL
5U
CB9
4
R
38
R
6A
7A
8A
R
C
C
C
C
4
5
6
6
7
8
9
VC8
CB8
R
R
R
R
R
R
39
Q
R
R
R
R
C
C
R
R
41
31
32
40
43
5
R
R
R
6
7
7
VC7
CB7
42
Q
44
8
R
8
9
8
VC6
CB6
45
Q
C
C
C
C
C
R
R
R
R
R
33
34
35
36
37
46
49
52
55
58
47
8
R
R
9A
10
11
9
VC5
CB5
48
Q
50
8
R
R
R
R
R
R
R
10A
11A
C
12
13
10
53
10
11
VC4
CB4
51
Q
9
R
R
C
C
C
C
14
15
11
56
VC3
CB3
54
Q
10
R
R
16
17
12
59
12
13
39
12A
13A
71A
VC2
CB2
R
57
Q11
R
18
13
VC1
R
60
R
R
62
71
C
R
19
20
38
61
Q
CB1
VC0
12
B0
B0b
21
22
VSS
VSS
FIGURE 52. TYPICAL APPLICATIONS CIRCUIT – BATTERY CONNECTION CIRCUITS
FN7672 Rev.10.00
May 10, 2018
Page 34 of 105
ISL78600
PLACE THESE
COMPONENTS
CLOSE TO DEVICE
PLACE THESE
COMPONENTS
CLOSE TO CONNECTOR
C
R
R
44
65
DAISY UP HI
63
56
DHI2
C
C
ISL78600
42
43
C
C
R
R
R
R
45
51
66
69
DAISY UP LO
DAISY DN HI
64
67
55
53
DLO2
DHI1
C
C
49
50
R
C
R
70
52
DAISY DN LO
68
52
DLO1
43
42
41
40
COMMS RATE 0
COMMS RATE 1
CONNECT PINS 40 TO 43 TO V3P3 OR VSS
DEPENDING ON COMMS SELECTION
AND DAISY CHAIN CLOCK SPEED
COMMS SELECT 1
COMMS SELECT 2
CONNECT PIN 47 TO V3P3 TO ENABLE
CONNECT PIN 47 TO VSS TO DISABLE
47
EN
PACK
VOLTAGE
44
35
DGND
V2P5
R
81
C
53
V3P3
C
55
38
36
Q
BASE
V3P3
13
R
34
33
82
VCC
REF
C
C
54
56
C
57
R
R R R
84 85 86
29
83
TEMPREG
R
EXT IN 4
EXT IN 3
EXT IN 2
EXT IN 1
87
90
93
96
30
28
26
24
EXT4
EXT3
EXT2
EXT1
R
R
R
C
C
C C
59 60 61
58
FIGURE 53. TYPICAL APPLICATIONS CIRCUIT – NON-BATTERY CONNECTIONS, MIDDLE AND TOP DAISY CHAIN DEVICES
FN7672 Rev.10.00
May 10, 2018
Page 35 of 105
ISL78600
PLACE THESE
COMPONENTS
CLOSE TO DEVICE
PLACE THESE
COMPONENTS
CLOSE TO CONNECTOR
C
C
R
R
R
44
45
DAISY UP HI
DAISY UP LO
63
64
65
56
55
DHI2
ISL78600
C
42
R
66
C
43
DLO2
43
42
41
40
COMMS RATE 0
COMMS RATE 1
CONNECT PINS 40 TO 43 TO V3P3 OR VSS
DEPENDING ON COMMAS SELECTION
AND DAISY CHAIN CLOCK SPEED
COMMS SELECT 1
COMMS SELECT 2
CONNECT PIN 47 TO V3P3 TO ENABLE
CONNECT PIN 47 TO VSS TO DISABLE
53
52
50
49
47
46
45
SCLK
CS
DIN
MICROCONTROLLER
INTERFACE
DOUT
EN
DATA READY
FAULT
PACK
VOLTAGE
44
35
DGND
V2P5
R
81
C
53
V3P3
C
Q
55
38
36
BASE
V3P3
13
R
82
34
33
VCC
REF
C
C
54
56
C
57
R
R
R R
84 85 86
83
29
TEMPREG
R
EXT IN 4
EXT IN 3
EXT IN 2
EXT IN 1
87
90
93
96
30
28
26
24
EXT4
EXT3
EXT2
EXT1
R
R
R
C
C
C C
59 60 61
58
FIGURE 54. TYPICAL APPLICATIONS CIRCUIT – NON BATTERY CONNECTIONS, MASTER DAISY CHAIN DEVICE
FN7672 Rev.10.00
May 10, 2018
Page 36 of 105
ISL78600
PLACE THESE
COMPONENTS
PACK
CLOSE TO CONNECTOR
VOLTAGE
R
1
B12b
B12
C
D
58
59
60
61
1
1
ISL78600
VBAT
VBAT
VC12
CB12
C
R
R
R
R
R
R
R
R
R
R
27
27
2
2A
3A
4A
5A
6A
7A
8A
9A
C
2
3
R
28
Q
1
R
C
R
R
29
28
30
3
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
C
C
C
C
C
C
C
62
63
VC11
CB11
R
31
Q
2
R
C
R
R
32
29
33
4
64
1
4
VC10
CB10
R
34
Q
3
R
R
R
35
5
2
5
VC9
36
C
C
C
C
C
C
C
C
C
R
R
R
R
R
R
R
R
R
R
R
R
R
30
31
32
33
34
35
36
37
38
37
40
43
46
49
52
55
58
61
38
3
4
Q
CB9
VC8
4
R
6
6
R
R
R
R
R
39
41
5
6
Q
CB8
VC7
5
R
7
7
42
44
7
8
Q
CB7
VC6
6
R
8
8
45
47
9
Q
CB6
VC5
7
R 9
9
10
9
48
R
R
50
10
11
12
Q
CB5
VC4
8
R
R
R
R
R
10A
C
C
C
C
C
10
11
12
13
39
51
R
R
53
11
13
14
Q
CB4
VC3
9
11A
12A
13A
R
Q
54
R
R
56
12
15
16
CB3
VC2
10
R
57
R
R
59
13
17
18
Q
CB2
VC1
11
R
Q
60
R
R
62
71
19
20
CB1
VC0
12
71A
B0
21
22
B0b
VSS
VSS
FIGURE 55. TYPICAL APPLICATIONS CIRCUIT – BATTERY CONNECTION CIRCUITS ALTERNATIVE CONFIGURATION
FN7672 Rev.10.00
May 10, 2018
Page 37 of 105
ISL78600
PLACE THESE
COMPONENTS
PACK
VOLTAGE
CLOSE TO CONNECTOR
R
B12b
B12
C
D
58
59
60
61
1
1
1
ISL78600
VBAT
VBAT
VC12
CB12
R
R
R
R
C
2
2A
3A
4A
2
3
4
R
R
28
Q
1
C
R
27
27
R
29
R
B11
B10
B9
C
C
62
3
VC11
63
64
31
Q
CB11
VC10
2
C
R
28
30
R
R
4
32
R
R
Q
1
2
3
34
3
CB10
VC9
R
R
C
C
R
R
35
R
29
30
33
37
5U
C
R
5AU
C
5L
36
Q
5U
5L
R
5AL
CB9
4
R
38
R
R
B8
C
4
5
6
6A
6
7
8
9
VC8
CB8
R
39
Q
R
C
R
41
31
40
5
R
R
C
C
C
C
6
7
7A
7
8
9
VC7
CB7
R
R
8A
8
9
VC6
CB6
R
R
9A
B5
B4
B3
B2
B1
10
11
VC5
CB5
R
R
R
48
Q
C
C
C
C
R
R
R
R
R
34
35
36
37
49
52
55
58
50
8
R
R
R
12
13
10
53
10A
11A
12A
13A
71A
10
VC4
CB4
51
Q
9
R
R
C
C
C
C
R
14
15
11
56
11
VC3
CB3
54
Q
10
R
R
R
R
R
16
17
12
59
12
13
39
VC2
CB2
R
57
Q11
R
18
13
VC1
R
60
C
R
R
R
19
20
38
61
62
71
Q
CB1
VC0
12
B0
B0b
21
22
VSS
VSS
FIGURE 56. TYPICAL APPLICATIONS CIRCUIT – BATTERY CONNECTION CIRCUITS, SYSTEM WITH 10 CELLS
FN7672 Rev.10.00
May 10, 2018
Page 38 of 105
ISL78600
PLACE THESE
COMPONENTS
CLOSE TO CONNECTOR
V
BAT
R
C
D
1
1
B12b
B12
58
59
60
61
1
ISL78600
VBAT
VBAT
VC12
CB12
R
R
R
R
2A
3A
4A
2
C
C
C
2
3
4
R
R
28
Q
1
C
R
27
27
R
R
R
29
B11
B10
B9
3
62
VC11
31
63
64
Q
CB11
VC10
2
C
R
30
28
R
32
4
R
R
Q
34
1
2
3
3
CB10
VC9
R
R
35
36
Q
C
C
R
R
R
29
30
33
37
5U
5L C
R
5AU
C
5L
5U
R
5AL
CB9
4
R
38
6
R
R
6A
C
4
5
6
VC8
CB8
6
7
VC7
CB7
8
9
VC6
CB6
R
R
9A
9
C
10
11
9
VC5
CB5
R
R
R
R
R
R
R
C
C
C
C
C
10A
11A
12A
13A
71A
B4
B3
B2
B1
10
53
12
13
10
11
12
13
39
VC4
CB4
R
R
51
Q
C
C
C
R
R
R
35
36
37
52
55
58
9
R
R
11
56
14
15
VC3
CB3
54
Q
10
R
R
12
59
16
17
VC2
CB2
R
57
Q
11
R
13
18
VC1
R
60
R
R
C
R
62
71
19
20
38
61
Q
CB1
VC0
12
B0
21
22
B0b
VSS
VSS
FIGURE 57. TYPICAL APPLICATIONS CIRCUIT – BATTERY CONNECTION CIRCUITS, SYSTEM WITH 8 CELLS
FN7672 Rev.10.00
May 10, 2018
Page 39 of 105
ISL78600
PLACE THESE
COMPONENTS
PACK
VOLTAGE
CLOSE TO CONNECTOR
R
C
D
1
B12b
B12
1
58
59
60
61
ISL78600
1
VBAT
VBAT
VC12
CB12
R
R
R
R
R
2
C
C
C
C
2A
3A
4A
5A
2
3
4
5
R
28
Q
1
C
R
27
27
R
R
3
B11
B10
29
62
VC11
R
31
63
64
Q
CB11
VC10
2
C
C
R
R
28
29
30
33
R
R
R
4
32
R
34
Q
1
2
3
3
CB10
VC9
35
R
5
CB9
4
5
VC8
CB8
6
7
VC7
CB7
8
9
VC6
CB6
10
11
VC5
CB5
R
R
R
R
R
R
C
10A
11A
12A
13A
71A
12
13
10
10
11
12
13
39
VC4
CB4
R
R
C
C
C
C
B3
B2
B1
14
15
11
56
VC3
CB3
R
54
R
R
C
C
55
58
36
37
Q
10
R
R
12
59
16
17
VC2
CB2
R
57
Q
11
R
18
13
VC1
R
60
R
R
R
C
19
20
62
71
61
38
Q
CB1
VC0
12
B0
B0b
21
22
VSS
VSS
FIGURE 58. TYPICAL APPLICATIONS CIRCUIT – BATTERY CONNECTION CIRCUITS, SYSTEM WITH 6 CELLS
FN7672 Rev.10.00
May 10, 2018
Page 40 of 105
ISL78600
TABLE 11. RECOMMENDED COMPONENT VALUES FOR FIGURES (Figures 53 through 58)
COMPONENTS
VALUE
RESISTORS
0
R
R
R
101
1
27
33
82
820
R , R
2
71
R , R , R , R , R , R , R , R , R , R
10 11 12 13
720
Figure 52 on page 34,
Figure 56 on page 38,
Figure 57 on page 39
3
4
6
7
8
9
1.54k
180
R
R
R
, R
5U 5L
, R , R , R , R , R , R , R
, R
, R
, R
2A 3A 4A 6A 7A 8A 9A 10A 11A 12A 13A
360
, R
5AU 5AL
910
Figure 55 on page 37
1/2W (or larger)
R , R , R , R , R , R , R , R , R , R , R
10 11 12 13
3
4
5
6
7
8
9
180
R
R
R
, R , R , R , R , R , R , R , R
, R
, R
, R
2A 3A 4A 5A 6A 7A 8A 9A 10A 11A 12A 13A
100
, R , R , R , R , R , R , R , R , R , R , R
29 32 35 36 39 42 45 48 51 54 57 60
1.3k
(assumes minimum pack voltage of 12V and maximum supply current of 6.5mA. Higher current or
81
lower minimum pack voltage requires the use of a smaller resistor.)
100
1.4k
470
10k
R
R
R
, R , R , R
63 64 67 68
, R
5U 5L
, R , R , R
65 66 69 70
R
R
, R , R , R , R , R , R , R , R , R , R , R , R , R , R , R , R , R , R , R ,
28 31 34 38 41 44 47 50 53 56 59 62 83 84 85 86 87 90 93 96
, R , R , R
100a 100b 100c 100d
330k
CAPACITORS
VALUE
200p
R
, R , R , R , R , R , R , R , R , R , R , R
27 30 33 37 40 43 46 49 52 55 58 61
VOLTAGE
100
500
50
COMPONENTS
C
C
C
, C , C , C
42 43 49 50
220p
, C , C , C
44 45 51 52
10n
, C , C , C , C , C , C , C , C , C , C , C , C , C , C , C
27 28 29 30 31 32 33 34 35 36 37 38 58 59 60 61
22n
100
100
10
C , C , C , C , C , C , C , C , C , C , C , C , C
2
1
3
4
5
6
7
8
9
10 11 12 13 39
220n
C
C
C
C
1µ
, C , C
53 54 56
1µ
100
10
55
57
2.2µ
ZENER DIODES
VALUE
54V
EXAMPLE
COMPONENTS
- DIODE-TVS, SMD, 2P, SOD-123W, 54VWM, 87.1VC
PTVS54VS1UTR
D
1
FN7672 Rev.10.00
May 10, 2018
Page 41 of 105
ISL78600
with two devices in series, each with double the value of the
single capacitor.
Notes on Board Layout
Referring to Figure 53 on page 35 (battery connection circuits),
the basic input filter structure is composed of resistors R to R
,
A dual point failure in the balancing resistors (R , R , R ,
29 32 35
2
13
R
, and capacitors C to C and C . These components
etc.) of Figure 53 on page 35 and associated balancing MOSFET
(Q to Q ) could also give rise to a shorted cell condition. It is
recommended that the balancing resistor be replaced by two
resistors in series.
71
2
13 39
provide protection against transients and EMI for the cell inputs.
They carry the loop currents produced by EMI and should be
placed as close to the connector as possible. The ground
terminals of the capacitors must be connected directly to a solid
ground plane. Do not use vias to connect these capacitors to the
input signal path or to ground. Any vias should be placed in line
to the signal inputs so that the inductance of these forms a low
pass filter with the grounded capacitors.
1
12
Board Level Calibration
For best accuracy, the ISL78600 can be recalibrated after soldering
to a board using a simple resistor trim. The adjustment method
involves obtaining the average cell reading error for the cell inputs at
a single temperature and cell voltage value and applying a select on
test resistor to zero the average cell reading error.
Referring to Figure 54 on page 36, the daisy chain components
are shown to the top right of the drawing. These are split into two
sections. Components to the right of this section should be
placed close to the board connector with the ground terminals of
capacitors connected directly to a solid ground plane. This is the
same ground plane that serves the cell inputs. Components to
the left of this section should be placed as closely to the device
as possible.
The adjustment system uses a resistor placed either between
VDDEXT and V
or V
and VSS as shown in Figure 59. The value
of resistor R or R is then selected based on the average error
REF
REF
1
2
measured on all cells at 3.3V per cell and room temperature such
as, with 3.3V on each cell input scan the voltage values using the
ISL78600 and record the average reading error (ISL78600
reading – cell voltage value). Table 12 shows the value of R and R
required for various measured errors.
1
2
The battery connector and daisy chain connectors should be
placed closely to each other on the same edge of the board to
minimize any loop current area.
To use Table 12, find the measured error value closest to the
result obtained with measurements using the ISL78600 and
select the corresponding resistor value. Alternatively, if finer
adjustment resolution is required then this can be obtained by
interpolation using Table 12.
Two grounds are identified on the circuit diagram. These are
nominally referred to as noisy and quiet grounds. The noisy
ground, denoted by an “earth” symbol carries the EMI loop
currents and digital ground currents while the quiet ground is
used to define the decoupling voltage for voltage reference and
the analog power supply rail. The quiet and noisy grounds should
be joined at the VSS pin. Keep the quiet ground area as small as
possible.
VDDEXT
R
1
The circuits shown to the bottom right of Figure 54 on page 36
provide signal conditioning and EMI protection for the external
temperature inputs. These inputs are designed to operate with
external NTC thermistors.
VREF
R
2
C
1
Each of the external inputs has an internal pull-up resistor, which
is connected by a switch to the VCC pin whenever the TEMPREG
output is active. This arrangement results in an open input being
VSS
ISL78600
pulled up to the V voltage.
CC
FIGURE 59. CELL READING ACCURACY ADJUSTMENT SYSTEM
Component Selection
TABLE 12. COMPONENT VALUES FOR ACCURACY CALIBRATION
ADJUSTMENT of FIGURE 59
Certain failures associated with external components can lead to
unsafe conditions in electronic modules. A good example of this
is a component that is connected between high energy signal
sources failing short. Such a condition can easily lead to the
component overheating and damaging the board and other
components in its proximity.
MEASURED ERROR AT VC = 3.3V
R
R
2
1
V
- V
(mV)
(kΩ)
205
274
(kΩ)
DNP
DNP
DNP
DNP
DNP
2550
1270
866
78600 CELL
4
3
2
412
825
DNP
DNP
DNP
DNP
DNP
One area to consider with the external circuits on the ISL78600
is the capacitors connected to the cell monitoring inputs. These
capacitors are normally protected by the series protection
resistors but could present a safety hazard in the event of a dual
point fault where both the capacitor and associated series
resistor fail short. Also, a short in one of these capacitors would
dissipate the charge in the battery cell if left uncorrected for an
1
0
-1
-2
-3
-4
extended period of time. It is recommended that capacitors C to
649
1
C
be selected to be “fail safe” or “open mode” types. An
13
DNP = Do Not populate
alternative strategy would be to replace each of these capacitors
FN7672 Rev.10.00
May 10, 2018
Page 42 of 105
ISL78600
The host microcontroller should build in handlers for commands
that might be delayed within the communication structure and
look for a Communications Failure response if the wait time
expires. For more detail, see “Communication Faults” on
page 77.
System Commands
To control the operation of the ISL78600 system, to read and
write data to any individual device, and to check system status,
the ISL78600 has a series of commands available to the host
microcontroller. These commands are listed in along with
characteristics of the commands. Each command is individually
described in the following.
An Acknowledge (ACK) response indicates that the command
was successfully received by the target device. A Not
Acknowledge (NAK) indicates that there was an error in decoding
the command.
The attributes associated with each command are: the device
response, whether the command can address all devices with a
single command, and whether there is a response from the
target device.
Address All
The “Address All” command is used only in a daisy chain
configuration. To address a particular device, the host
microcontroller specifies the address of that device (1 through
14) for each of the maximum 14 devices. To address all devices
in a daisy chain stack, the host microcontroller uses an address
of 15 (Hex ‘1111’) to cause all stack devices to perform functions
simultaneously. Only some commands recognize Address All.
Device Response
In a stand-alone configuration, the host should only expect a
response when reading data from a register. In all other cases,
there is no response expected.
In a daisy chain configuration, all commands except any Scan,
Measure, Sleep, Wake, and Reset commands require a response
from either the stack Top device or the target device (see
Table 13). Each device in the stack waits for a response from the
stack device above. Correct receipt of a command is indicated by
the correct response. Failure to receive a response within a
timeout period indicates a communications fault. The timeout
value is stack position dependent. The device that detects the
fault then transmits the Communications Failure response,
which includes its stack address.
Read and Write Commands
Read and write commands are the primary communication
mechanisms in the ISL78600 system. All commands use the
read and write operations. Refer to “Communications” on
page 55 for a detailed description of these operations’ protocols,
timing, and interactions.
Table 13 describes the commands and how they control the
system.
TABLE 13. COMMAND ATTRIBUTES
VALID IN
STAND-ALONE OR
DAISY CHAIN
NORMAL DEVICE RESPONSE
DEVICE WAITS FOR A
RESPONSE?
(DAISY CHAIN ONLY)
“ADDRESS ALL”
COMPATIBLE
(DAISY CHAIN ONLY)
COMMAND
STAND-ALONE TOP TARGET
Read
Both
Both
Data
ACK
ACK
-
Data
ACK
-
Yes
Yes
No
No
Write
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
No
Scan Voltages
Both
Yes
Scan Temperatures
Scan Mixed
Both
-
-
No
Yes
Both
-
-
No
Yes
Scan Wires
Both
-
-
No
Yes
Scan All
Both
-
-
No
Yes
Scan Continuous
Scan Inhibit
Both
ACK
ACK
ACK
ACK
ACK
ACK
-
ACK
ACK
NAK
NAK
ACK
ACK
-
Yes
Yes
No
Yes
Both
Yes
Sleep
Both
Yes
Wakeup
Both
No
Yes
Balance Enable
Balance Inhibit
Measure
Both
Yes
Yes
No
Yes
Both
Yes
Both
No
Identify (special command)
NAK
Daisy chain only
Daisy chain only
Daisy chain only
Both
ACK
ACK
ACK
-
NAK
ACK
ACK
-
No
Special address
Yes
Yes
No
No
No
No
No
No
ACK
Reset
Calculate Register Checksum
Check Register Checksum
Both
ACK
ACK
ACK
ACK
Yes
Yes
Both
FN7672 Rev.10.00
May 10, 2018
Page 43 of 105
ISL78600
Scan Voltages Command
Scan Mixed Command
When a device receives the Scan Voltages command to its stack
address (or an Address All stack address), it increments the scan
counter (see “Scan Counter” on page 46) and begins a scan of
the cell voltage inputs. It sequences through the cell voltage
inputs in order from Cell 12 (top) to Cell 1 (bottom). This
operation is followed by a scan of the pack voltage.
When a device receives the Scan Mixed command to its stack
address (or an Address All stack address), it increments the scan
counter (see “Scan Counter” on page 46) and begins a Scan
Mixed operation.
The Scan Mixed command causes the addressed device (or all
devices with an Address All stack address) to scan through the
cell voltage inputs in order from Cell 12 (top) to Cell 7. Then the
external input ExT1 is measured, followed by a scan of Cell 6 to
Cell 1. These operations are followed by a scan of the pack
voltage and the IC temperature. The IC temperature is recorded
for use with the internal calibration routines.
The scan operation forces a sample and hold on each input, an
analog-to-digital conversion of the voltage, and the storage of the
value in its appropriate register. The IC temperature is also
recorded for use with the internal calibration routines.
The scan voltages command performs cell overvoltage and
undervoltage comparisons on each cell input and checks the
Scan Mixed also performs cell overvoltage and undervoltage
V
and VSS connections for open wire at the end of the scan. If
comparisons on each cell voltage sampled. The V and VSS
BAT
BAT
there is a fault condition (see “Fault Diagnostics” on page 80 for
what constitutes a fault condition), the device sets the specific
fault bit, sets the device FAULT pin active, and sends an
“unprompted fault response” to the host down the daisy chain
communication link. (A stand-alone device only sets the FAULT
pin). The unprompted response is identical to a “read status
register” command.
pins are also checked for open conditions at the end of the scan.
ExT1 is sampled in the middle of the cell voltage scan such that
half the cells are sampled before ExT1 and half after ExT1. This
mode allows ExT1 to be used for an external voltage
measurement, such as a current sensing, so it is performed
along with the cell voltage measurements, reducing the latency
between measurements.
Devices revert to the standby state on completion of the scan
activity.
The Scan Mixed command is intended for use in stand-alone
systems, or by the Master device in stacked applications, and
would typically measure a single system parameter, such as
battery current or pack voltage.
Cell voltage and Pack Voltage data, along with any fault
conditions are stored in local memory ready for reading by the
system host microcontroller.
Cell voltage, pack voltage and ExT1 data, along with any fault
conditions are stored in local memory ready for reading by the
system host microcontroller. Access the data from the ExT1
measurement by a direct Read ET1 Voltage command or by the
All Temperatures read command.
Scan Temperatures Command
When a device receives the Scan Temperatures command to its
stack address (or an Address All stack address), it increments
the Scan counter (see “Scan Counter” on page 46) and begins a
scan of the temperature inputs.
If there is a fault condition, (see “Fault Diagnostics” on page 80
for what constitutes a fault condition), the device sets the FAULT
pin active, and on completion of a scan sends an “unprompted
fault response” to the host down the daisy chain communication
link. (A stand-alone device only sets the FAULT pin). The
unprompted response is identical to a “Read Status Register”
command.
The Scan Temperatures command causes the addressed device
(or all devices with an Address All stack address) to scan through
the internal and four external temperature signals followed by
multiplexer loopback and reference measurements. The
loopback and reference measurements are part of the internal
diagnostics function. Over-temperature compares are performed
on each temperature measurement depending on the condition
of the appropriate bit in the Fault Setup register.
Devices revert to the standby state on completion of the scan
activity.
Temperature data and any fault conditions are stored in local
memory ready for reading by the system host microcontroller. If
there is a fault condition, the device sets its FAULT pin active and
on completion of a scan sends an “unprompted fault response”
to the host down the daisy chain communication link. (A stand-
alone device only sets the FAULT pin.) The unprompted response
is identical to a “Read Status Register” command.
Scan Wires Command
When a device receives the Scan Wires command to its stack
address (or an Address All stack address), it increments the Scan
counter (see “Scan Counter” on page 46) and begins a Scan
Wires operation.
The Scan Wires command causes the addressed device (or all
devices with an Address All stack address) to measure all the
VCn pin voltages, while applying load currents to each input pin in
turn. This is part of the fault detection system.
Devices revert to the standby state on completion of the scan
activity.
See “Temperature Monitoring Operation” on page 46.
If there is a fault condition, the device sets the FAULT pin and
returns a fault signal (sent down the stack) on completion of a
scan.
No cell voltage data is sent as a result of the Scan Wires
command. Devices revert to the standby state on completion of
this activity.
FN7672 Rev.10.00
May 10, 2018
Page 44 of 105
ISL78600
scan to be performed at the same rate as the temperature scan.
A bit value of ‘0’ causes the wire scan rate to track the voltage
scan rate for voltage scan intervals above 512ms while at and
below this value, the wire scan is performed at a fixed 512ms
rate. Table 14 shows the various scan rate combinations
available.
Scan All Command
When a device receives the Scan All command to its stack
address (or an Address All stack address), it increments the Scan
counter (see “Scan Counter” on page 46) and begins a Scan All
operation.
The Scan All command causes the addressed device (or all
devices with an Address All stack address) to execute the Scan
Voltages, Scan Wires, and Scan Temperatures commands in
sequence one time (see Figure 60 on page 47 for example
timing).
Data is not automatically returned while devices are in Scan
Continuous mode except when a fault condition is detected. The
results of voltage and temperature scans are stored in local
volatile memory and can be accessed at any time by the system
host microcontroller. However, because the scan continuous
operation is running asynchronously to any communications, it is
recommended that the continuous scan be stopped before
reading the registers.
Scan Continuous Command
Scan Continuous mode is used primarily for fault monitoring and
incorporates the Scan Voltages, Scan Temperatures, and Scan
Wires commands.
Devices can be operated in Scan Continuous mode while in
Normal mode or in Sleep mode. Devices revert to Sleep mode or
remain in Normal mode, as applicable on completion of each
scan.
See “Temperature Monitoring Operation” on page 46.
The Scan Continuous command causes the addressed device (or
all devices with an Address All stack address) to set the SCAN bit
in the Device Setup register and performs a succession of scans
at a predetermined scan rate. Each device operates
asynchronously on its own clock. This is similar to the Scan All
command except that the scans are repeated at intervals
determined by the SCN0-3 bits in the Fault Setup register.
The response to a detected fault condition is to send the Fault
signal, either immediately in the case of stand-alone devices or
daisy chain devices in Normal mode, or following transmission of
the Wakeup signal if the device is being used in a daisy chain
configuration and is in Sleep mode.
To operate the “Scan Continuous” function in Sleep mode the
host microcontroller configures the ISL78600, starts the Scan
Continuous mode, and then sends the Sleep command. The
ISL78600 then wakes itself up each time a scan is required. Note
that for the fastest scan settings (scan interval codes 0000,
0001, and 0010) the main measurement functions do not power
down between scans, because the ISL78600 remains in Normal
mode.
The ISL78600 provides an option that pauses cell balancing
activity while measuring cell voltages in Scan Continuous mode.
This is controlled by the BDDS bit in the Device Setup register. If
BDDS is set, then cell balancing is inhibited during cell voltage
measurement and for 10ms before the cell voltages are
scanned. Balancing is re-enabled at the end of the scan to allow
balancing to continue. This function applies during Scan
Continuous and while either the Timed or Auto Balance functions
are active. This “BDDS” action allows the implementation of a
circuit arrangement that can be used to diagnose the condition
of external balancing components. See “Cell Voltage
Measurements during Balancing” on page 29. During Manual
Balance this external circuit arrangement does not allow Scan
Continuous without generating a fault condition. It is also up to
the host microcontroller to stop balancing functions when
performing a Scan or Measure command, as BDDS only works in
conjunction with Scan Continuous.
TABLE 14. SCAN CONTINUOUS TIMING MODES
WIRE
SCAN
WIRE
SCAN
SCAN
INTERVAL
SCN3:0
SCAN
INTERVAL
(ms)
TEMP
SCAN
(ms)
WSCN = 0 WSCN = 1
(ms)
(ms)
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
16
32
512
512
512
512
512
512
64
512
512
512
The Scan Continuous scan interval is set using the SCN3:0 bits
(lower nibble of the Fault Setup register.) The temperature and
wire scans occur at slower rates and depend on the value of the
scan interval selected. The scan system is synchronized so that
the wire and temperature scans always follow a voltage scan.
The three scan sequences, depending on the scans required at a
particular instance, are as follows:
128
512
512
512
256
1024
2048
4096
8192
16384
32768
65536
131072
262144
512
1024
2048
4096
8192
16384
32768
65536
131072
262144
512
512
1024
2048
4096
8192
16384
32768
65536
1024
2048
4096
8192
16384
32768
65536
1. Scan voltages
2. Scan voltages, scan wires
3. Scan voltages, scan wires, scan temperatures.
The temperature and wire scans occur at 1/5 the voltage scan
rate for voltage scan intervals above 128ms. Below this value the
temperature scan interval is fixed at 512ms.
The behavior of the wire scan interval is determined by the WSCN
bit in the Fault Setup register. A bit value of ‘1’ causes the wire
FN7672 Rev.10.00
May 10, 2018
Page 45 of 105
ISL78600
counter located in the Scan Count register (page 1, address
6’h16). The counter increments each time a Scan or Measure
command is received. This allows the host microcontroller to
compare the counter value before and after the Scan or Measure
command was sent to verify receipt. The counter wraps to zero
when overflowed.
Scan Inhibit Command
The Scan Inhibit command stops a Continuous scan (that is,
receipt of the command by the target device resets the SCAN bit
and stops the Scan Continuous function).
Measure Command
The Scan Counter increments whenever the ISL78600 receives a
Scan or Measure command. The ISL78600 does not perform a
requested Scan or Measure function if a Scan or Measure
function is already in progress, but it still increments the Scan
Counter.
When a device receives the Measure command to its stack
address, it increments the Scan counter (see “Scan Counter” on
page 46) and begins a Measure operation.
This command initiates the voltage measurement of a single cell
voltage, internal temperature, any of the four external
temperature inputs, or the secondary voltage reference. The
command incorporates a 6-bit suffix that contains the address of
the required measurement element. See Table 15 on page 46
and Figure 62B on page 56.
Temperature Monitoring Operation
One internal and four external temperature inputs are provided
together with a switched bias voltage output (TEMPREG, pin 29).
The voltage at the TEMPREG output is nominally equal to the
ADC reference voltage such that the external voltage
measurements are ratiometric to the ADC reference (see
Figure 51 on page 32).
The device matching the target address responds by conducting
the single measurement and loading the result to local memory.
The host microcontroller then reads from the target device to
obtain the measurement result. All devices revert to the Standby
state on completion of this activity.
The temperature inputs are intended for use with external
resistor networks using NTC type thermistor sense elements but
can also be used as general purpose analog inputs. Each
temperature input is applied to the ADC through a multiplexer.
The ISL78600 converts the voltage at each input and loads the
14-bit result to the appropriate register.
TABLE 15. MEASURE COMMAND TARGET ELEMENT ADDRESSES
MEASURE COMMAND
(SUFFIX)
6’h00
6’h01
6’h02
6’h03
6’h04
6’h05
6’h06
6’h07
6’h08
6’h09
6’h0A
6’h0B
6’h0C
6’h10
6’h11
6’h12
6’h13
6’h14
6’h15
DESCRIPTION
V
voltage
BAT
The TEMPREG output is turned “on” in response to a Scan
Temperatures or Measure temperature command. A dwell time
of 2.5ms is provided to allow external circuits to settle, after
which the ADC measures each external input in turn. The
TEMPREG output turns “off” after measurements are completed.
Cell 1 voltage
Cell 2 voltage
Cell 3 voltage
Cell 4 voltage
Cell 5 voltage
Cell 6 voltage
Cell 7 voltage
Cell 8 voltage
Cell 9 voltage
Cell 10 voltage
Cell 11 voltage
Cell 12 voltage
Figure 60 on page 47 shows an example temperature scan with
the ISL78600 operating in Scan Continuous mode with a scan
interval of 512ms. The preceding voltage and wire scans are
shown for comparison.
The external temperature inputs are designed such that an open
connection results in the input being pulled up to the full scale
input level. This function is provided by a switched 10MΩ pull-up
from each input to VCC. This feature is part of the fault detection
system and is used to detect open pins.
The internal IC temperature, Auxiliary Reference Voltage, and
multiplexer loopback signals are sampled in sequence with the
external signals using the Scan Temperatures command.
Internal temperature reading.
The converted value from each temperature input is also
compared to the external over-temperature limit and open
connection threshold values on condition of the [TST4:1] bits in
the Fault Setup register (see “Fault Setup” on page 89.) If a TSTn
bit is set to “1”, then the temperature value is compared to the
External Temperature threshold and a Fault occurs if the
measured value is lower than the threshold value. If a TSTn bit is
set to “0”, then the temperature measurement is not compared
to the threshold value and no fault occurs. The [TST4:1] bits are
“0” by default.
External temperature Input 1 reading.
External temperature Input 2 reading.
External temperature Input 3 reading.
External temperature Input 4 reading.
Reference voltage (raw ADC) value. Use this value
to calculate corrected reference voltage using
reference coefficient data.
Scan Counter
Because the Scan and Measure commands do not have a
response, the scan counter is provided to allow confirmation of
receipt of the Scan and Measure commands. This is a 4-bit
FN7672 Rev.10.00
May 10, 2018
Page 46 of 105
ISL78600
512ms
VOLTAGE SCAN
765µs
WIRE SCAN
59.4ms
TEMPERATURE SCAN
2.69ms
2.5ms
2.5V
TEMPREG PIN
Hi-Z
Hi-Z
Hi-Z
ADC SAMPLING
FIGURE 60. SCAN TIMING EXAMPLE DURING SCAN CONTINUOUS MODE AND SCAN ALL MODE
TABLE 16. MAXIMUM WAIT TIME FOR DEVICES ENTERING SLEEP MODE
Sleep Command
Sleep mode is entered in response to a Sleep command. Only the
communications input circuits, low speed oscillator, and internal
registers are active in Sleep mode, allowing the part to perform
timed scan and balancing activity and to wake up in response to
communications.
MAXIMUM WAIT TIME FROM
TRANSMISSION OF SLEEP COMMAND
(DAISY CHAIN ONLY)
DAISY CHAIN DATA RATE (kHz)
Time to Enter Sleep Mode (µs)
500
500
250
125
62.5
1000
2000
4000
Using a Sleep command does not require that the devices in a
daisy chain stack be identified first. They do not need to know
their position in the stack.
Wakeup Command
The communications pins are monitored when the device is in
Sleep mode, allowing the part to respond to communications.
In a daisy chain system, the Sleep command must be written
using the Address All stack address. The command is not
recognized if sent with an individual device address and causes
the addressed device to respond NAK. The Top stack device
responds ACK on receiving a valid Sleep command.
The host microcontroller wakes up a sleeping device, or a stack
of sleeping devices, by sending the Wakeup command to a
Stand-alone or a master stack device. In a daisy chain
configuration, the Wakeup command must be written using the
Address All stack address. The command is not recognized if
sent with an individual device address and causes the master
device to respond NAK.
After receiving a valid Sleep command, devices wait before
entering Sleep mode. This is to allow time for the top stack
device in a daisy chain to respond ACK, or for all devices that do
not recognize the command to respond NAK, and for the host
microcontroller to respond with another command. Receipt of
any valid communications on Port 1 of the ISL78600 before the
wait period expires cancels the Sleep command. Receipt of
another Sleep command restarts the wait timers. Table 16
provides the maximum wait time for various daisy chain data
rates. The communications fault checking timeout is not applied
to the Sleep command. A problem with the communications is
indicated by a lack of response to the host microcontroller. The
host microcontroller may choose to do nothing if no response is
received in which case devices that received the Sleep command
go to sleep when the wait time expires. Devices that do not
receive the message go to sleep when their watchdog timer
expires (if this is enabled).
Using a Wakeup command does not require that the devices in a
stack be identified first. They do not need to know their position
in the stack.
The master exits Sleep mode on receipt of a valid Wakeup
command and proceeds to transmit the Wakeup signal to the
next device in the stack. The Wakeup signal is a few cycles of a
4kHz clock. Each device in the chain wakes up on receipt of the
Wakeup signal and proceeds to send the signal on to the next
device.
Any communications received on Port 1 by a device, which is
transmitting the Wakeup signal on Port 2 are ignored.
The Top stack device, after waking up, waits for some time
before sending an ACK response to the master. This wait time is
necessary to allow receipt of the Wakeup signal being originated
by a stack device other than the master. See “Fault Response in
Sleep Mode” on page 79 for more information.
Devices exit Sleep mode on receipt of a valid Wakeup command.
FN7672 Rev.10.00
May 10, 2018
Page 47 of 105
ISL78600
The master device passes the ACK on to the host microcontroller
to complete the Wakeup sequence. The total time required to
wake up a complete stack of devices is dependent on the
number of devices in the stack. Table 17 gives the maximum
time from Wakeup command transmission to receipt of an ACK
response (DATA READY asserted low) for stacks of 8 devices and
14 devices at various daisy chain data rates (interpolate linearly
for different number of devices).
The three cell balance modes are Manual, Timed, and Auto.
TABLE 18. REGISTERS CONTROLLING BALANCE
REGISTER
Balance Setup
Balance Status
BALANCE MODE
REFERENCE
Manual, Timed, Auto Table 19 on page 49
Manual, Timed, Auto Table 19 on page 49
Watchdog/Balance Time Timed, Auto
Table 21 on page 51
TABLE 17. MAXIMUM WAKEUP TIMES FOR STACKS OF 8 DEVICES AND
14 DEVICES (WAKEUP COMMAND TO ACK RESPONSE)
Device Setup
Timed, Auto
“Setup Registers” on
page 91
MAXIMUM WAKEUP TIMES
Balance Value
Auto only
Table 22 on page 52
DAISY CHAIN DATA RATE (kHz)
Stack of 8 Devices (ms)
500
63
250
63
125
63
62.5
63
BALANCE MODE
Set the Balance mode with the BMD1 and BMD0 bits in the
Balance Setup Register. See Table 19.
Stack of 14 Devices (ms)
100
100
100
100
In Manual mode, the host microcontroller directly controls the
state of each MOSFET output.
There is no additional checking for communications faults while
devices are waking up. A communications fault is indicated by
the host microcontroller not receiving an ACK response within
the expected time.
In Timed mode, the host microcontroller programs a balance
duration value and selects which cells are to be balanced, then
starts the balance operation. The ISL78600 turns all the FETs off
when the balance duration has been reached.
Reset Command
All digital registers can be reset to their power-up condition using
the Reset Command.
In Auto Balance mode, the host microcontroller programs the
ISL78600 to control the balance MOSFETs to remove a
programmed “charge delta” value from each cell. The ISL78600
does this by controlling the amount of charge removed from each
cell over a number of cycles, rather than trying to balance all
cells to a specific voltage.
Daisy chain devices must be reset in sequence from top stack
device to stack bottom (master) device. Sending the Reset
command to all devices using the Address All stack address has
no effect. There is no response from the stack when sending a
Reset command.
BALANCE WAIT TIME
All stack address and stack size information is set to zero in
response to a Reset command. When all devices have been reset
it is necessary to reprogram the stack address and stack size
information using the Identify command.
The balance wait time is the interval between balancing
operations in Auto Balance mode. See Table 19.
BALANCE ENABLE
A Reset command should be issued following a “hard reset” in
which the EN pin is toggled.
When all of the other balance control bits are properly set,
setting the balance enable bit to “1” starts the balance
operation. The BEN bit can be set by writing directly to the
Balance Setup register or by sending a Balance Enable
command. See Table 19 on page 49.
Balance Enable Command
The Balance Enable Command sets the BEN bit, which starts the
balancing operation. However, before this command becomes
operational and before balancing can commence, the balance
operation needs to be specified. See “Cell Balancing Functions”
BALANCE STATUS POINTER
The Balance Status register is a “multiple instance” register. See
“Balance Status Register” on page 50. There are 13 locations
within this register and only one location can be accessed at a
time. The balance status pointer points to one of these 13
locations (see Table 19).
The Balance Enable command can be sent to all devices with one
command using Address All addressing.
Balance Inhibit Command
Manual Balance mode and Timed Balance mode require a
balance status pointer value of ‘0’. In this case, the bits in the
balance status register directly select the cells to be balanced.
The Balance Inhibit Command clears the BEN bit, which stops the
balancing operation. The Balance Inhibit command can be sent
to all devices with one command using Address All addressing.
The Auto Balance mode uses Balance Status register locations 1
to 12 (see Table 19). In Auto Balance mode, the ISL78600
increments the Balance status pointer on each auto balance
cycle to step through Balance Status register locations 1 to 12.
This allows the programming of up to twelve different balance
profiles for each Auto Balance operation. When the operation
encounters a zero value at a pointer location, the auto balance
Cell Balancing Functions
Cell balancing is performed using external MOSFETs and external
current balancing resistors (see Figure 53 on page 35). Each
MOSFET is controlled independently by the CB1 to CB12 pins of
the ISL78600. The CB1 to CB12 outputs are controlled either
directly, or indirectly by an external microcontroller through bits
in various control registers.
FN7672 Rev.10.00
May 10, 2018
Page 48 of 105
ISL78600
operation returns to the pattern at location 1 and resumes
balancing with that pattern.
More information about the auto balance mode is provided in
“Auto Balance Mode” on page 51. Example balancing setup
information is provided in “Auto Balance Mode Cell Balancing
Example” on page 84.
TABLE 19. BALANCE SETUP REGISTER
REGISTER BITS
9
8
7
6
5
4
3
2
1
0
BEN BALANCE BSP3 BSP2 BSP1 BSP0
POINT TO REGISTER
BWT2 BWT1 BWT0
SECONDS
BETWEENBALANCE
CYCLES
BMD1 BMD0 BALANCE
MODE
0
1
Off
On
0
0
0
0
Balance Status 0
0
0
0
0
0
0
Off
12 1110 9 8 7 6 5 4 3 2 1
Set bit to 1 to enable
balance
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
Balance Status 1
Balance Status 2
Balance Status 3
Balance Status 4
Balance Status 5
Balance Status 6
Balance Status 7
Balance Status 8
Balance Status 9
Balance Status 10
Balance Status 11
Balance Status 12
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
1
2
0
1
1
1
0
1
Manual
Timed
Auto
4
8
16
32
64
FN7672 Rev.10.00
May 10, 2018
Page 49 of 105
ISL78600
Manual Balance mode cannot operate while the ISL78600 is in
Sleep mode. If the watchdog timer is off and the Sleep command
is received during Manual balance, then balancing stops
immediately and the device goes into Sleep mode.
BALANCE STATUS REGISTER
The Balance Status register contents control which external
balance FET is turned on during a balance event. Each of the 12
bits in the Balance Status register controls one external
balancing FET, such that Bit 0 [BAL1] controls the FET for Cell 1
and Bit 11 [BAL12] controls the FET for Cell 12. Bits are set to ‘1’
to enable the balancing for that cell and cleared to ‘0’ to disable
balancing.
If the watchdog timer is active during Manual balance and the
device receives the Sleep command, then balancing stops
immediately and the device goes into Sleep mode, but the WDTM
bit is set when the watchdog timer expires (see Table 20).
Manual Balance Mode
Timed Balance Mode
In Manual Balance mode, the host microcontroller specifies
which cell is balanced and controls when balancing starts and
stops.
In Timed Balance mode, the host microcontroller specifies which
cells are to be balanced and sets a balance time out period.
Balancing starts by control of the microcontroller and stops at
the end of a time out period (or by command from the
microcontroller.)
To manually control the cells to be balanced, do the following:
• Set the Balance mode bits to ‘01’ for “Manual”.
• Set the Balance Status Pointer to zero.
To set up a timed balance operation, do the following:
• Set the Balance mode bits to ‘10’ for “Timed”
• Set the Balance Status Pointer to zero
• Set bits in the Balance Status register to program the cells to
be balanced (such as, to balance Cell 5, set the BAL5 bit to 1).
• Set bits in the Balance Status register to program the cells to
be balanced. (For example, to balance Cells 7 and 10, set
BAL7 and BAL10 bits to 1.)
• Enable balancing, either by setting the BEN bit in the Balance
Setup register or by sending a Balance Enable command.
• Disable balancing either by resetting the BEN bit or by sending
a Balance Inhibit command.
• Set the balance on time. The balance on time is
programmable in 20 second intervals from 20 seconds to 42.5
minutes using BTM[6:0] bits (see Table 21 on page 51).
The Balance Enable and Balance Inhibit commands can be used
with the “Address All” device address to control all devices in a
stack simultaneously.
• Enable balancing, either by setting the BEN bit in the Balance
Setup register or by sending a Balance Enable command.
When BEN is reasserted, or when a new Balance Enable
command is received, balancing resumes, using the full time
specified by the BTM[6:0] bits.
The ISL78600 has a watchdog timer function that protects the
battery from excess discharge due to balancing. In the event that
communications is lost, the watchdog begins a countdown. If the
timeout value is exceeded while the part is in Manual Balance
mode all balancing ceases and the device goes into Sleep mode
(see Table 20).
• Disable balancing either by resetting the BEN bit or by sending
a Balance Inhibit command. Resetting BEN stops the
balancing functions and resets the timer values.
If the device was performing a manual balance operation prior to
a Sleep Command, then receiving a Wake command resumes
balancing.
• When the balance timeout period is met, the End Of Balance
(EOB) bit in the Device Setup register is set and BEN is reset.
TABLE 20. BALANCE, SLEEP, WAKE, WATCHDOG TIMER OPERATION
RECEIVE WAKE COMMAND
OPERATING WATCHDOG RECEIVE SLEEP COMMAND
WATCHDOG TIMES OUT
ALL BALANCE MODES
IN
TIMER
ALL BALANCE MODES
MANUAL BALANCE TIMED BALANCE
AUTO BALANCE
N/A
Normal
Mode
Off
Stop balancing
Device enters Sleep mode.
N/A
N/A
N/A
On
Stop balancing.
Stop balancing.
N/A
N/A
N/A
Device enters Sleep mode.
Set the WDTM bit when the
watchdog timer expires.
Device enters Sleep mode.
Set the WDTM bit.
Sleep Mode
N/A
N/A
N/A
Resume balancing Resume balancing, Resume balancing
balance time
reduced by the
with auto balance
settings suspended
time spent in sleep during sleep
FN7672 Rev.10.00
May 10, 2018
Page 50 of 105
ISL78600
When Auto Balancing is complete, the End Of Balance (EOB) bit
in the Device Setup register is set and BEN bit is reset.
TABLE 21. WATCHDOG/BALANCE TIME REGISTER
REGISTER BITS
To set up an auto balance operation, do the following:
• Set the Balance mode bits to ‘11’ for Auto.
• Set the Balance Status Pointer to ‘1’.
13
12
11
10
9
8
7
BALANCE TIME
(MINUTES)
BTM6 BTM5 BTM4 BTM3 BTM2 BTM1 BTM0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
Disabled
0.33
0.67
1.00
-
• Set bits in the Balance Status register to program the cells to
be balanced in the first cycle
(such as, to balance odd cells, set Bits 1, 3, 5, 7, 9, and 11).
• Set the Balance Status Pointer to ‘2’.
• Set bits in the Balance Status register to program the cells to
be balanced in the second cycle
(such as, to balance even cells, set Bits 2, 4, 6, 8, 10, and 12).
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
0
1
41.67
42.00
42.33
• Set the Balance Status Pointer to ‘3’.
• Set bits in the Balance Status register at this location to zero to
terminate the sequence. The next cycle will go back to balance
at status pointer = 1.
Timed Balance mode cannot operate while the ISL78600 is in
Sleep mode. If the watchdog timer is off and the Sleep command
is received during Manual balance, then balancing stops
immediately and the device goes into Sleep mode.
• Write the B values into the Balance Value Registers for each
cell to be balanced.
• Enable balancing, either by setting the BEN bit in the Balance
Setup register or by sending a Balance Enable command.
When enabled, the ISL78600 cycles through each instance of
the Balance Status register for the duration given by the
balance timeout. Between each Balance Status register
instance, the device does a Scan All operation and inserts a
delay equal to the balance wait time. The process continues
with the balance status pointer wrapping back to 1, until all
the Balance Value registers equal zero. If one cell Balance
Value register reaches zero before the others, balancing for
that cell stops, but the others continue.
If the watchdog timer is active during Timed balance and the
device receives the Sleep command, then balancing stops
immediately and the device goes into Sleep mode, but the WDTM
bit is set when the watchdog timer expires, (see Table 20 on
page 50).
If the watchdog timeout value is exceeded while the part is in
Manual Balance mode all balancing ceases and the device goes
into Sleep mode (see Table 20).
If the device was performing a Timed balance operation before a
Sleep Command, then receiving a Wake command resumes
balancing. However, the balance timer continues during Sleep
mode, so if the Balance timer expires before a Wake command,
then Balance will not resume until the host microcontroller starts
another balance cycle.
• Disable balancing either by resetting the BEN bit or by sending
a Balance Inhibit command. Resetting BEN, either directly or
by using the Balance Inhibit command, stops the balancing
functions but maintains the current Balance Value register
contents. Auto Balancing continues from Balance Status
register location 1 when BEN is reasserted.
Auto Balance Mode
AUTO BALANCE SEQUENCING
In Auto Balance mode, the host microcontroller specifies an
amount of charge to be removed from each cell to be balanced.
Balancing starts by control of the microcontroller and stops when
all cells have had the specified charge removed (or by command
from the microcontroller.)
The first cycle of the Auto Balance operation begins with the
balance status pointer at location 1, specifying the first Balance
Status register instance. For the next auto balance cycle, the
balance status pointer increments to location 2. For each
subsequent cycle, the pointer increments to the next Balance
Status register instance, until a zero value instance is
encountered. At this point the sequence repeats from the
Balance Status register instance at balance status pointer
location 1.
Auto Balance mode performs balancing autonomously and in an
intelligent manner. Thermal issues are accommodated by the
provision of auto balance sequencing (see “Auto Balance
Sequencing” on page 51), a multiple instance Balance Status
register, and a balance wait time.
For example, using two Balance Status registers, the ISL78600
can balance odd numbered cells during the first cycle and even
numbered cells on the second cycle.
During Auto Balance mode the ISL78600 cycles through each
Balance Status register instance, which turns on the balancing
outputs corresponding to the bits set in each Balance Status
register instance. While each cell is being balanced, the amount
of charge withdrawn is calculated. Balancing stops for a cell
when the specified amount of charge has been removed. See
“Auto Balance SOC Adjustment value” on page 52.
There is a delay time between each cycle. This delay is set by the
Balance Wait time bits. See Table 19 on page 49.
FN7672 Rev.10.00
May 10, 2018
Page 51 of 105
ISL78600
Cells are balanced with periodic measurements being performed
during the balance time interval (see Table 21). These
measurements are used to calculate the reduction in State of
Charge (SOC) with each balancing cycle.
balance cycle on time, and accumulate over the total balance
time period, to equal the programmed delta capacity.
Twelve 28-bit registers are provided for the balance value for
each cell. The balance values are programmed for all cells as
needed using Balance Value registers 6’h20 to 6’h37. (See
Table 22 for the contents of the Cell 1 and Cell 2 Balance Values
Registers.)
As individual cells reach their programmed SOC adjustment, that
cell balance terminates, but the balance operation continues
cycling through all instances until all cells have met their SOC
adjustment value.
TABLE 22. BALANCE VALUES REGISTER CELL 1 AND CELL 2
AUTO BALANCE SOC ADJUSTMENT VALUE
ADDR 13 12 11 10
6’20
9
8
7
6
5
4
3
2
1
0
The balance value (delta SOC) is the difference between the
present charge in a cell and the desired charge for that cell.
Cell 1 Balance Value bits [13:0]
6’21
6’22
6’23
Cell 1 Balance Value bits [27:14]
Cell 2 Balance Value bits [13:0]
Cell 2 Balance Value bits [27:14]
The method for calculating the state of charge for a cell is left to
the system designer. Typically, determining the state of charge is
dependent on the chosen cell type and manufacturer, cell
voltage, charge and discharge rates, temperature, age of the cell,
number of cycles, and other factors. Tables for determining SOC
are often available from the battery cell manufacturer.
At the end of each balance cycle on time interval the ISL78600
measures the voltage on each of the cells that were balanced
during that interval. The measured values are then subtracted
from the balance values for those cells. This process continues
until the balance value for each cell is zero, at which time the
auto balancing process is complete.
The balance value itself is a function of the current SOC, required
SOC, balancing leg impedance, and sample interval. This value is
calculated by the host microcontroller for each cell. The
balancing leg impedance is made up of the external balance FET
and balancing resistor. The sample interval is equal to the
balance cycle on time period (such as, each cell voltage is
sampled at the end of the balance on time).
Auto Balance mode cannot operate while the ISL78600 is in
Sleep mode. If the Sleep command is received while the device is
auto balancing (and the watchdog timer is off) then balancing
continues until it is finished, and then the device enters Sleep
mode. If the watchdog timer is active during the Auto Balance
mode and the device receives the Sleep command, then
balancing stops immediately, the device enters Sleep mode
immediately. The WDTM bit is set when the watchdog timer
expires (see Table 20).
The balancing value B for each cell is calculated using the
formula shown in Equation 1. See also “Balance Value
Calculation Example” on page 84:
8191
5
Z
dt
------------
----
B =
CurrentSOC – TargetSOC
(EQ. 1)
where:
B = the balance register value
CurrentSOC = the present SOC of the cell (Coulombs)
TargetSOC = the required SOC value (Coulombs)
Z = the balancing leg impedance (ohms)
dt = the sampling time interval (Balance cycle on time in
seconds)
If the device was performing an auto balance operation prior to a
Sleep Command, then receiving a Wake command resumes
balancing with the same SOC calculations that were in place
when the device entered Sleep Mode.
BALANCING IN SCAN CONTINUOUS MODE
Cell balancing may be active while the ISL78600 is operating in
Scan Continuous mode. This is especially important to maintain
error detection while the host is busy with other tasks during a
Timed or Auto Balance operation. In Scan Continuous mode the
ISL78600 scans cell voltages, temperatures, and open-wire
conditions at a rate determined by the Scan Interval bits in the
Fault Setup register (see Table 14 on page 45). The behavior of
the balancing functions while operating in Scan Continuous
mode is controlled by the BDDS bit in the Device Setup register. If
BDDS is set, then cell balancing is inhibited during cell voltage
measurements and for 10ms before the cell voltage scan to
allow the balance devices to turn off. Balancing is re-enabled
automatically at the end of the scan. Scan Continuous and the
BDDS function are available during both Timed and Auto Balance
modes, but not during Manual Balance.
8191/5 = a voltage to Hex conversion value
The balancing leg impedance is normally the sum of the balance
FET r and the balance resistor.
DS(ON)
The balancing value (B) can also be defined as in the set of
equations following. Auto balance is guided by Equations 2
and 3:
V
(EQ. 2)
---
SOC = I t = t
Z
Z
dt
V
Z
Z
dt
V
dt
(EQ. 3)
----
---
----
----
B = SOC
=
t
=
t
where:
MONITORING CELL BALANCE
dt = Balance cycle on time
t = Total balance time
To facilitate the system monitoring of the cell balance operation,
the ISL78600 has a Cells Balanced Enabled register that shows
the present state of the balance drivers. A “1” indicates that the
CBn output is enabled. A “0” indicates that the CBn output is
Equations 2 and 3 shows that the impedance drops out of the
equation, leaving only voltage and time elements. So, “B”
becomes a collection of voltages that integrate during the
FN7672 Rev.10.00
May 10, 2018
Page 52 of 105
ISL78600
disabled. This register is valid only in a Stand-Alone
configuration. Reading this register in any other mode results in a
NAK response.
After receiving the ACK response the host microcontroller then
sends the Identify command with stack address 6’h2 (such as,
24’h0000 0011 0010 0100 0010 0110). The stack address is
bolded. The last four bits are the corresponding CRC value. The
Master passes the command onto the stack. The device at stack
position 2 responds by setting the stack address bits (ADDR[3:0])
and stack size bits (SIZE[3:0]) in the Comms Setup register to
4’h2 and returns the identify response with CRC and an address
of 6’h32 (such as, 32’b0000 0011 0010 0111 0010 0000 0000
1111). The address bits are bolded. The address bits contains the
normal stack address (2’h0010) and the state of the COMMS
Select pins (2’b11). Note that the in an identify response the data
LSBs are always zero.
TABLE 23. CELLS BEING BALANCED REGISTER
11 10
9
8
7
6
5
4
3
2
1
0
Daisy Chain Commands
Daisy chain devices require some special commands that are not
needed by a stand-alone device. These commands are Identify,
ACK, and NAK. Identify is needed to enumerate the devices in the
stack. ACK is used as a command to check the communications
hardware and to indicate proper communications status. A NAK
response indicates that there was some problem with the
addressed device recognizing the command.
The host microcontroller then sends the Identify command with
stack address 6’h3. Device 3 responds by setting its stack
address and stack size information to 4’h3 and returning the
identify response with address 6’h33. Devices 1 and 2 set their
stack size information to 4’h3.
The process continues with the host microcontroller
incrementing the stack address until all devices in the stack have
received their stack address. Identified devices update their
stack size information with each new transmission. The stack
Top device (identified by the state of the COMMS Select
pins = 10) loads the stack address and stack size information
and returns the Identify response with address 6’h2x, where x
corresponds to the stack position of the top device. The host
microcontroller recognizes the top stack response and loads the
total number of stack devices to local memory. The host
microcontroller then sends the Identify command with data set
to 6’h3F. Devices exit Identify mode on receipt of this command.
The stack top device responds ACK. An example Identify transmit
and receive sequence for a stack of three devices is shown in
Figure 61.
Identify Command
Identify mode is a special case mode that must be executed
before any other communications to daisy chained devices,
except for the Sleep command and Wakeup command. The
Identify command initiates address assignments to the devices
in the daisy chain stack.
Devices determine their stack position while in Identify mode.
Identify mode is entered on receipt of the “base” Identify
command (this is the Identify command with the device address
set to 6’h00). The top stack device responds ACK on receiving the
base identify command and then enters the Identify mode. Other
stack devices wait to allow the ACK response to be relayed to the
host microcontroller then they enter Identify mode. When in
Identify mode all stack devices except the master load address
4’h0 to their stack address register. The master (identified by the
state of the COMMS Select pins = 2’b01) loads 4’h1 to its stack
address.
When in Normal mode, only the base Identify command is
recognized by devices. Any other Identify command variant or an
Identify command sent with a nonzero stack address causes a
NAK response from the addressed device(s).
Send Identify Command
Tx
03 24 04
0 0 0 0 0 0 1 1 0 0 1 0 0 1 0 0 0 0 0 0 0 1 0 0
Rx
03 30 00 0C
0 0 0 0 0 0 1 1 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0
Send Identify Device 2
Send Identify Device 3
Send Identify Complete
Tx
Rx
Tx
03 24 26
03 27 20 0F
03 24 37
0 0 0 0 0 0 1 1 0 0 1 0 0 1 0 0 0 0 1 0 0 1 1 0
0 0 0 0 0 0 1 1 0 0 1 0 0 1 1 1 0 0 1 0 0 0 0 0 0 0 0 0 1 1 1 1
0 0 0 0 0 0 1 1 0 0 1 0 0 1 0 0 0 0 1 1 0 1 1 1
Rx
Tx
03 26 30 05
03 27 FE
0 0 0 0 0 0 1 1 0 0 1 0 0 1 1 0 0 0 1 1 0 0 0 0 0 0 0 0 0 1 0 1
0 0 0 0 0 0 1 1 0 0 1 0 0 1 1 1 1 1 1 1 1 1 1 0
Rx
33 30 00 01
0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1
FIGURE 61. IDENTIFY EXAMPLE. STACK OF 3 DEVICES
FN7672 Rev.10.00
May 10, 2018
Page 53 of 105
ISL78600
When the device receives the Identify command, it adds a delay
time before sending the response back to the master. Then, on
receiving the daisy response, the master sends the response to
the host through the SPI port.
IDENTIFY TIMING
To determine the time required to complete an Identify
operation, refer to Table 24. In the table are two SPI command
columns showing the time required to send the Identify
command and receive the response (with an SPI clock of 1MHz.)
In the case of the Master, there are no daisy chain clocks, so all
three bytes of the send and four bytes of the receive are
accumulated. For the daisy chain devices, the daisy
communication overlaps with two of the SPI send bytes and with
three of the SPI receive bytes, so there is no extra time needed
for these bits.
The “Time for Each Device” column shows the time for the
Identify commands to be sent and propagate through each
numbered device. The “Identify Total Time” column shows the
total accumulated time required for Identify commands to be
sent and propagate through all devices in the battery stack
configuration. The “Identify + Identify Complete Time” column
adds the identify complete timing to the total. The Identify
Complete command takes the same number of clock cycles as
the last Identify command..
TABLE 24. IDENTIFY TIMING WITH DAISY CHAIN OPERATING AT 500kHz
DAISY
TRANSMIT
TIME
IDENTIFY +
NUMBER OF SPI COMMAND
RESPONSE
DELAY
(µs)
DAISY RECEIVE SPI COMMAND TIME FOR EACH
IDENTIFY
COMPLETE
TIME (µs)
DEVICES
SEND TIME
TIME
(µs)
RECEIVE TIME
(µs)
DEVICE
(µs)
IDENTIFYTOTAL
TIME (µs)
(2 MINIMUM)
(μs)
(μs)
1 (Master)
24
8
8
8
8
8
8
8
8
8
8
8
8
8
0
0
0
32
8
8
8
8
8
8
8
8
8
8
8
8
8
56
56
56
2
3
50
52
54
56
58
60
62
64
66
68
70
72
74
18
18
18
18
18
18
18
18
18
18
18
18
18
66
68
70
72
74
76
78
80
82
84
86
88
90
150
154
158
162
166
170
174
178
182
186
190
194
198
206
356
360
514
4
518
676
5
680
842
6
846
1012
1186
1364
1546
1732
1922
2116
2314
2516
7
1016
1190
1368
1550
1736
1926
2120
2318
8
9
10
11
12
13
14
.
TABLE 25. IDENTIFY TIMING WITH DAISY CHAIN OPERATING AT 250kHz
DAISY
IDENTIFY +
IDENTIFY
COMPLETE
TIME (µs)
NUMBER OF SPI COMMAND
TRANSMIT
TIME
RESPONSE
DELAY
(μs)
DAISY RECEIVE SPI COMMAND TIME FOR EACH
DEVICES
(2 MINIMUM)
SEND TIME
(µs)
TIME
(µs)
RECEIVE TIME
(µs)
DEVICE
(µs)
IDENTIFYTOTAL
TIME (µs)
(μs)
1 (Master)
24
8
8
8
8
8
8
8
8
8
8
8
8
8
0
0
0
32
8
8
8
8
8
8
8
8
8
8
8
8
8
56
56
56
2
3
100
104
108
112
116
120
124
128
132
136
140
144
148
34
34
34
34
34
34
34
34
34
34
34
34
34
132
136
140
144
148
152
156
160
164
168
172
176
180
282
290
298
306
314
322
330
338
346
354
362
370
378
338
620
628
918
4
926
1224
1538
1860
2190
2528
2874
3228
3590
3960
4338
4724
5
1232
1546
1868
2198
2536
2882
3236
3598
3968
4346
6
7
8
9
10
11
12
13
14
FN7672 Rev.10.00
May 10, 2018
Page 54 of 105
ISL78600
(such as, read bit instead of write bit), would cause the port to
lose synchronization.
ACK (Acknowledge) Command
Daisy chain devices use ACK to acknowledge receipt of a valid
command. ACK is also useful as a communications test
command: the stack Top device returns ACK in response to
successful receipt of the ACK command. No other action is
performed in response to an ACK.
There is a timeout period associated with the CS inactive (high)
condition, which resets all the communications counters. This
effectively resets the SPI port to a known starting condition. If CS
stays high for more than 100µs, then the SPI state machine
resets.
NAK (Not Acknowledge) Command
A pending device response from a previous command is sent by
the ISL78600 during the first 2 bytes of the 3-byte Write
transaction. The third byte from the ISL78600 is then discarded
by the host microcontroller. This maintains sequencing during
3-byte (Write) transactions.
The target device and top stack device return a NAK if they
receive an unrecognized command. If a command addressed to
all devices using the Address All stack address 1111 or the
Identify stack address 0000 is not recognized by any devices
then all devices not recognizing the command respond NAK. In
this case, the host microcontroller receives the NAK response
from the lowest stack device that failed to recognize the
command. An incomplete command (such as one that is less
than the length required) also causes a NAK to be returned.
Interface timing for full duplex SPI transfers are shown in
Figure 3 on page 15.
HALF DUPLEX (DAISY CHAIN) OPERATION
The SPI operates in half duplex mode when configured as a daisy
chain application (see Table 6 on page 30). Data flow is
controlled by a handshake system using the DATA READY and CS
signals. DATA READY is controlled by the ISL78600. CS is
controlled by the host microcontroller. This handshake
accommodates the delay between command receipt and device
response due to the latency of the daisy chain communications
system.
Communications
All communications are conducted through the SPI port in single
8-bit byte increments. The MSB is transmitted first and the LSB is
transmitted last.
Maximum operating data rates is 2Mbps for the SPI interface.
When using the daisy chain communications system it is
recommended that the synchronous communications data rate
be at least twice that of the daisy chain system (see Table 7 on
page 31).
A timeout period associated with the CS inactive (high) condition
resets all the communications counters. This effectively resets
the SPI port to a known starting condition. If CS stays high for
more than 100µs, then the SPI state machine resets.
In stand-alone applications (non-daisy chain) data is sent without
additional address information. This maximizes the throughput
for full duplex SPI operation.
Responses from stack devices are received by the stack Master
(stack bottom device). The stack Master then asserts its
DATA READY output once the first full data byte is available. The
host microcontroller responds by asserting CS and clocking the
data out of the DOUT port. The DATA READY line is then cleared
and DOUT is tri-stated in response to CS being taken high. In this
mode the DIN and DOUT lines can be connected externally.
In daisy chain applications all measurement data is sent with the
corresponding device stack address (the position within the daisy
chain), parameter identifier, and data address. Daisy chain
communication throughput is maximized by allowing streamed
data (accessed by a “read all data” address).
Half duplex communications are conducted using the DATA
READY/CS handshake as follows:
SPI Interface
The ISL78600 operates as an SPI slave capable of bus speeds up
to 2Mbps. Four lines make up the SPI interface: SCLK, DIN, DOUT,
and CS. The SPI interface operates in either full duplex or half
duplex mode depending on the daisy chain status of the part.
1. The host microcontroller sends a command to the ISL78600
using the CS line to select the ISL78600 and clocking data
into the ISL78600 DIN pin.
2. The ISL78600 asserts DATA READY low when it is ready to
send data to the host microcontroller. When DATA READY is
low, the ISL78600 is in transmit mode and will ignore any
data on DIN.
The DOUT line is normally tri-stated (high impedance) to allow
use in a multidrop bus. DOUT is only active when CS is low.
An additional output DATA READY is used in the daisy chain
configuration to notify the host microcontroller that responses
have been received from a device in the chain.
3. The host microcontroller asserts CS low and clocks 8 bits of
data out of DOUT using SCLK.
4. The host microcontroller then raises CS. The ISL78600
responds by raising DATA READY and tri-stating DOUT.
FULL DUPLEX (STAND-ALONE) SPI OPERATION
In non-daisy chain applications, the SPI bus operates as a
standard, full duplex, SPI port. Read and write commands are
sent to the ISL78600 in 8-bit blocks. CS is taken high between
each block.
5. The ISL78600 reasserts DATA READY for the next byte, and so
on.
Data flow is controlled by interpreting the first bit of each
transaction and counting the requisite number of bytes. It is the
responsibility of the host microcontroller to ensure that
commands are correctly formulated, as an incorrect formulation,
FN7672 Rev.10.00
May 10, 2018
Page 55 of 105
ISL78600
The host microcontroller must service the ISL78600 if DATA
READY is low before sending further commands. The ISL78600
ignores any data sent to DIN while DATA READY is low.
EXAMPLE OF NON-DAISY COMMUNICATIONS
An example Device Read (Cell 7), with response, is shown in
Figure 65 on page 57.
The DATA READY output from the ISL78600 is not asserted if CS
is already asserted. The microcontroller can interrupt a
sequential data transfer by asserting CS before the ISL78600
asserts DATA READY. This causes a conflict with the
communications and is not recommended. A conflict created in
this manner would be recognized by the microcontroller either
not receiving the expected response or receiving a
Examples of the various command structures for non-daisy chain
installations are shown in Figures 62A through 62E.
DATA
ADDRESS
(11, 6)
TRAILING
ZEROS
(5, 0)
PAGE
(14, 12)
communications failure notification.
0
0
1
1
0
0
1
0
1
0
0
0
0
0
0
0
Interface timing for half duplex SPI transfers are shown in
Figure 4 on page 16.
MSB
BYTE 1
BYTE 0
LSB
FIGURE 62A. DEVICE LEVEL COMMAND: SLEEP
Non-Daisy Chain Communications
In non-daisy chain (stand-alone) systems, all communications
sent from the master are 2 or 3 bytes in length. Data read and
action commands are 2 bytes. Data writes are 3 bytes. Device
responses are 2 bytes in length and contain data only.
TRAILING
ZEROS
(5, 0)
DATA
ADDRESS
(11, 6)
PAGE
(14, 12)
0
0
1
1
0
0
1
1
1
1
0
0
0
0
0
0
Write commands in non-daisy chain systems are composed of a
read/write bit, page address (3 bits), data address (6 bits), and
data (14 bits) - Three bytes.
MSB
BYTE 1
BYTE 0
LSB
FIGURE 62B. DEVICE LEVEL COMMAND: WAKEUP
Read commands in non-daisy chain systems are composed of a
read/write bit, page address (3 bits), data address (6 bits), fill
(6 bits), and 16 bits of returned data (ignore the first most
significant bits of data returned) - Four bytes.
TRAILING
ZEROS
(5, 0)
DATA
ADDRESS
(11, 6)
PAGE
(14, 12)
The ISL78600 responds to read commands by loading the
requested data to its output buffer. The output buffer contents
are then loaded to the shift register when CS goes low and are
shifted out on the DOUT line on the falling edges of SCLK. This
sequence continues until all the requested data has been sent.
0
0
1
1
0
0
0
0
0
1
0
0
0
0
0
0
MSB
BYTE 1
BYTE 0
LSB
FIGURE 62C. DEVICE LEVEL COMMAND: SCAN VOLTAGES
Commands and data are memory mapped to 14-bit data
locations. The memory map is arranged in pages. Pages 1 and 2
are used for volatile data. Page 3 contains the action and
communications administration commands. Page 4 accesses
nonvolatile memory. Page 5 is used for factory test.
DATA
ADDRESS
(11, 6)
ELEMENT
ADDRESS
(5, 0)
PAGE
(14, 12)
0
0
1
1
0
0
1
0
0
0
0
0
0
1
0
1
Action commands, such as scan and communications
administration operations, are treated as reads.
MSB
BYTE 1
BYTE 0
LSB
FIGURE 62D. DEVICE LEVEL COMMAND: MEASURE CELL 5 VOLTAGE
Non-daisy chain devices do not generate a response to write or
system level commands. Data integrity can be verified by reading
register contents after writing. The ISL78600 does nothing in
response to a write or administration command that is not
recognized. An unrecognized read command returns 16’h0000.
An incomplete command, such as may occur if communications
are interrupted, is registered as an unrecognized command
either when CS is taken high or after a timeout period. The
communications interface is reset after the timeout period.
DATA
DATA
(13, 0)
ADDRESS
(19, 14)
PAGE
1
0
1
0
0
1 0 0 1 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1
MSB
BYTE 2
BYTE 1
BYTE 0
LSB
FIGURE 62E. DEVICE WRITE: WRITE EXTERNAL TEMPERATURE
LIMIT = 14’h0FFF
Non-daisy chain communications are conducted without CRC
(Cyclical Redundancy Check) error detection. The following
commands have no meaning in non-daisy chain systems:
Identify, ACK, NAK.
FIGURE 62. NON-DAISY CHAIN DEVICE COMMAND AND WRITE
EXAMPLES
The rules for non-daisy chain installations are shown in Table 26.
Examples of full duplex SPI read and write sequences are shown
in Figures 63 through 6565 on page 57.
FN7672 Rev.10.00
May 10, 2018
Page 56 of 105
ISL78600
TABLE 26. ISL78600 DATA INTERPRETATION RULES FOR NON DAISY CHAIN INSTALLATIONS
DATA
FIRST BIT IN PAGE
SEQUENCE ADDR ADDRESS
INTERPRETATION
0
0
1
011
Any
Any
001000 Measure command. Last six bits of transmission contain element address.
All other Device read or action command. Last six bits of transmission are zero.
Any
Device write command.
CS
SCLK
DOUT
DIN
Note 12
MSB
Note 12
HIGH IMPEDANCE
NOT DETERMINED
ACTIVE
1
0
1
1
0
0
0
0
1
0
0
0
0
0
0
0
R
W
PAGE
ADDR
DATA
ADDRESS
FILL WITH 0
FIGURE 63. SPI FULL DUPLEX (STAND-ALONE) MEASURE COMMAND EXAMPLE: EXT4 VOLTAGE
CS
SCLK
DOUT
DIN
Note 12
Note 12
Note 13
LSB
0
MSB
1
0
1
0
0
1
0
0
0
1
0
0
1
1
1
0
0
1
1
0
0
1
1
R
W
HIGH IMPEDANCE
NOT DETERMINED
ACTIVE
PAGE
ADDR
DATA
ADDRESS
CELL UNDERVOLTAGE THRESHOLD DATA
NOTES:
12. Last data byte pair from previous command.
13. Not defined.
FIGURE 64. SPI FULL DUPLEX (STAND-ALONE) WRITE COMMAND EXAMPLE: WRITE UNDERVOLTAGE THRESHOLD DATA
CS
SCLK
DOUT
Note 14
Note 14
0
0
0
1
0
1
1
1
0
0
0
0
1 0 1 0
MSB
0
LEADING
ZEROS
CELL7 DATA
RESPONSE
COMMAND
Note 15
Note 15
DIN
0
0
1
0 0 0 1
1
1
0
0
0 0 0 0
R
W
PAGE
ADDR
DATA
ADDRESS
HIGH IMPEDANCE
NOT DETERMINED
ACTIVE
NOTES:
14. Last data byte pair from previous command.
15. Next command (or 8’h00 if no command).
16. Host should start to clock data out within 30µs of CS going low.
FIGURE 65. SPI FULL DUPLEX (STAND-ALONE) READ COMMAND EXAMPLE: READ CELL 7 DATA
FN7672 Rev.10.00
May 10, 2018
Page 57 of 105
ISL78600
or the identification of a communications fault condition. The host
microcontroller should not transmit further data until either a
response has been received from the target stack device or a
communications fault condition has been identified. Figure 67 on
page 59 shows a typical communication sequence to “Read
Device 4, Cell 7” data from a stack of 10 devices. The maximum
response time: time from the rising edge of CS at the end of the
first byte of a read/write command, sent by the host
Daisy Chain Communications
Commands in daisy chain systems are transmitted and received
through the SPI port and are composed of a device address
(4 bits), a read/write bit, page address (3 bits), data address
(6 bits), data (6 bits), and CRC (4 bits).
Device commands and data are memory mapped to 14-bit data
locations. The memory map is arranged in pages. Pages 1 and 2
are used for volatile data. Page 3 contains the action and
communications administration commands. Page 4 accesses
nonvolatile memory. Page 5 is used for factory test.
microcontroller, to the assertion of DATA READY by the master
device, is given in Table 27 for various daisy chain data rates.
TABLE 27. MAXIMUM RESPONSE TIMES FOR DAISY CHAIN READ AND
WRITE COMMANDS. STACK OF 10 DEVICES
The daisy chain communication is intended for use with large
stacks of battery cells where a number of ISL78600 devices are
used.
MAXIMUM TIME TO ASSERTION
OF DATA READY
UNIT
kHz
µs
DAISY CHAIN DATA RATE
RESPONSE TIME
500
240
250
480
125
960
62.5
Communications Protocol
1920
All daisy chain communications are passed from device to device
such that all devices in the stack receive the same information.
Each device then decodes the message and responds as needed.
The originating device (master in the case of commands,
addressed device or Top stack device in the case of responses)
generates the system clock and data stream. Each device delays
the data stream by one clock cycle. Each device knows its stack
location (see the Identify command on page 53) and the total
number of devices in the stack. Each originating device adds a
number of clock pulses to the daisy chain data stream to allow
transmission through the stack.
DAISY CHAIN RECEIVE BUFFER
A 4-byte data buffer is provided between the Daisy Chain and SPI
communications. This accommodates all single transaction
responses. Multiple byte responses, such as Identify, Read All
Voltages, Read All Temperatures, Read All Faults, and responses
that may include a fault response from a device detecting an
error, would overflow this buffer. It is important therefore that the
host microcontroller completes a read of the first byte of data
before a fifth byte arrives on the Master device’s daisy chain port
and to clock data out from the SPI port faster than data is
clocked in through the Daisy port so as not to risk losing data.
All communications from the host microcontroller are passed
from device to device to the last device in the chain (top device).
The Top device responds to read and write messages with an
“ACK” (or with the requested data if this is the addressed device
and the message was a read command). The addressed device
then waits to receive the “ACK” before responding, either with
data in the case of a read, or with an “ACK” in the case of a write.
Action commands such as the Scan commands do not require a
response.
For example, when performing the first step in an IDENTIFY
operation (see “Identify Command” on page 53) the daisy chain
top device returns a 4-byte response plus 14 extra zeros (because
it does not yet know how many devices are in the stack.) If the
Host does not read the first byte from the Master before the 32nd
daisy clock, the extra zeros will overwrite the first byte of the
response. In another example, a “Read All Faults” returns 22
bytes. It is important for the Host to read data from the ISL78600
faster than 4 bytes every 31.5 Daisy clocks. (see Figure 66).
A read or write communications transmission is only considered to
be complete following receipt of a response from the target device
DIN
CS
RECEIVE IDENTIFY RESPONSE
SCK
≤ 31.5 t
≤ 31.5 t
D
D
DATA READY
Daisy Clocks
MASTER
DAISY PORT
DHI2/DLO2
8* t
8* t
8* t
8* t
8* t
8* t
8* t
8* t
8* t
8* t
8* t
8* t
D
D
D
D
D
D
D
D
D
D
D
D
Extra Bytes during “Read All” responses, fault responses, and first Identify response.
A fault response may precede command response increasing number of returned bytes.
First Identify Response has 14 extra clocks, because stack size is not yet known.
SPI must clock out 4 bytes before the Daisy can clock in 4 bytes to prevent buffer overflow
FIGURE 66. EXAMPLE WORST CASE TIMING TO AVOID DAISY BUFFER OVERFLOW
FN7672 Rev.10.00
May 10, 2018
Page 58 of 105
ISL78600
SCLK
DIN
A
A
A
DOUT
B
B
B
B
SPI
CS
DATA READY
10 EXTRA
CLOCKS
PACKET A
MASTER Tx
MASTER Rx
DEVICE 4 Tx
DEVICE 4 Rx
NO EXTRA
CLOCKS
PACKET B
4 EXTRA
CLOCKS
4 DAISY CLOCK PULSES
PACKET A
PACKET B
6 EXTRA
CLOCKS
DAISY
CHAIN
ACK
5 EXTRA
CLOCKS
10 EXTRA
CLOCKS
DEVICE 10 Tx
DEVICE 10 Rx
ACK
PACKET A
NO EXTRA CLOCKS
10 DAISY CLOCK PULSES
• The Host microcontroller sends “Read device 4,
Cell 7” = Packet A
• Device 4 receives and decodes an ACK.
• Device 4 transmits the Cell 7 data = Packet B. Device 4
subtracts one clock cycle to synchronize timing for lower
stack devices to relay the message.
• The Master begins relaying Packet A following receipt of the
first byte of A. Master adds 10 extra clock cycles to allow all
stack devices to relay the message.
• The Master asserts DATA READY after receiving the first byte
• Device 4 receives and decodes “Read device 4, Cell 7” and
waits for a response from top stack device.
of Packet B.
• The Host responds by asserting CS and clocking out eight bits
of data from DOUT. CS is taken high following the 8th bit. The
master responds by taking DATA READY high and tri-stating
DOUT. Master asserts DATA READY after receiving the next
byte and so on.
• Top of stack (Device 10) receives and decodes Packet A.
• Device 10 responds “ACK”. Device 10 adds 10 clock cycles to
allow all stack devices to relay the message.
FIGURE 67. DAISY CHAIN READ EXAMPLE “READ DEVICE 4, CELL 7”. STACK OF 10 DEVICES
TABLE 28. ISL78600 DATA INTERPRETATION RULES FOR DAISY CHAIN INSTALLATIONS
5th BIT
FIRST 4 BITS IN SEQUENCE
Stack Address [3:0] (Nonzero)
0000
(R/W)
PAGE
011
011
Any
DATA ADDRESS
001000
001001
All other
Any
INTERPRETATION
0
0
0
1
Measure command. Data address is followed by 6-bit element address.
Identify command. Data address is followed by device count data.
Device Read command. Data address is followed by 6 zeros.
Device Write command.
Stack Address [3:0] (Nonzero)
Stack Address [3:0] (Nonzero)
Any
Daisy chain devices require device stack address information to
be added to the basic command set. Daisy chain writes are
4-byte sequences. Daisy chain reads are three bytes. Action
commands, such as scan and communications administration
commands, are treated as reads. Daisy chain communications
employ a 4-bit CRC (Cyclic Redundancy Check) using a
COMMUNICATION SEQUENCES
All daisy chain device responses are 4-byte sequences, except for
the responses to the Read All command. All responses start with
the device stack address and use a 4-bit CRC. The response to
the “Read All Commands” is to send a normal 4-byte data
response for the first data segment and continue sending the
remaining data segments in 3-byte sections composed of data
address, data, and CRC. This creates an anomaly with the normal
CRC usage in that the first four bytes have a 4-bit CRC at the end
(operating on 3.5 bytes of data) while the remaining bytes have a
CRC, which only operates on 2.5 bytes. The host microcontroller,
having requested the data, must be prepared for this.
4
polynomial of the form 1 + X + X . The first four bits of each daisy
chain transmission contain the stack address, which can be any
number from 0001 to 1110. All devices respond to the Address
All (1111) and Identify (0000) stack addresses. The fifth bit is set
to ‘1’ for write and ‘0’ for read. The rules for daisy chain
installations are shown in Table 28.
FN7672 Rev.10.00
May 10, 2018
Page 59 of 105
ISL78600
the CRC when responding with data (device reads). The host
microcontroller then repeats the calculation and checks for
compliance.
CRC Calculation
Daisy chain communications employ a 4-bit CRC using a
polynomial of the form 1 + X + X . The polynomial is
4
implemented as a 4-stage internal XOR standard linear feedback
shift register as shown in Figure 68. The CRC value is calculated
using the base command data only. The CRC value is not
included in the calculation.
DIN
+
+
FF0
FF1
FF2
FF3
The host microcontroller calculates the CRC when sending
commands or writing data. The calculation is repeated in the
ISL78600 and checked for compliance. The ISL78600 calculates
FIGURE 68. 4-BIT CRC CALCULATION
$WWULEXWHꢀ9%B1DPHꢀ ꢀꢁLVOꢂꢃꢄꢅꢅHYEBFUFꢆBOLEꢁ
ꢁ
ꢀꢁ)LOHꢁꢂꢁLVOꢃꢄꢅꢆꢆHYEBFUFꢇBOLEꢈEDV
ꢀLQLWLDOL]HꢁELWV
ꢁELWꢆꢁ ꢁ)DOVH
ꢁELWꢌꢁ ꢁ)DOVH
ꢁELWꢋꢁ ꢁ)DOVH
ꢁELWꢑꢁ ꢁ)DOVH
ꢁ
ꢀꢁ&RS\ULJKWꢁꢉFꢊꢁꢋꢆꢌꢆꢁ,QWHUVLO
ꢀꢁꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂꢂ
2SWLRQꢁ([SOLFLW
ꢀꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍ
ꢀꢁ&5&ꢇꢁ5RXWLQHV
ꢀꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍꢍ
ꢀVLPSOHꢁLPSOHPHQWDWLRQꢁRIꢁ&5&ꢇꢁꢉXVLQJꢁSRO\QRPLDOꢁꢌꢁꢒꢁ;ꢁꢒꢁ;Aꢇꢊ
ꢁ)RUꢁLꢁ ꢁ/%RXQGꢉDUUD\FRS\ꢊꢁ7Rꢁ8%RXQGꢉDUUD\FRS\ꢊ
3XEOLFꢁ)XQFWLRQꢁ&KHFN&5&ꢇꢉP\$UUD\ꢉꢊꢁ$Vꢁ%\WHꢊꢁ$Vꢁ%RROHDQ
ꢁꢀUHWXUQVꢁ7UXHꢁLIꢁ&5&ꢇꢁFKHFNVXPꢁꢉORZꢁQLEEOHꢁRIꢁODVWꢁE\WHꢁLQꢁP\DUUD\ꢊ
ꢁ
ꢁꢀLVꢁJRRGꢈꢁ$UUD\ꢁFDQꢁEHꢁDQ\ꢁOHQJWK
ꢀODVWꢁQLEEOHꢁLVꢁLJQRUHGꢁIRUꢁ&5&ꢇꢁFDOFXODWLRQV
ꢁ
ꢁ,IꢁLꢁ ꢁ8%RXQGꢉDUUD\FRS\ꢊꢁ7KHQ
'LPꢁFUFꢇꢁ$Vꢁ%\WH
ꢁNꢁ ꢁꢇ
ꢁ 'LPꢁODVWQLEEOHꢁ$Vꢁ%\WH
ꢁ
ꢁ(OVH
ꢁNꢁ ꢁꢄ
ODVWQLEEOHꢁ ꢁP\$UUD\ꢉ8%RXQGꢉP\$UUD\ꢊꢊꢁ$QGꢁꢎ+)
ꢁFUFꢇꢁ ꢁ&DOFXODWH&5&ꢇꢉP\$UUD\ꢊ
ꢁ(QGꢁ,I
ꢁ
ꢁ
)RUꢁMꢁ ꢁꢌꢁ7RꢁN
,IꢁODVWQLEEOHꢁ ꢁFUFꢇꢁ7KHQ
ꢁꢀVKLIWꢁOHIWꢁRQHꢁELW
ꢁ&KHFN&5&ꢇꢁ ꢁ7UXH
ꢁFDUU\ꢁ ꢁꢉDUUD\FRS\ꢉLꢊꢁ$QGꢁꢎ+ꢄꢆꢊꢁ!ꢁꢆ
ꢁ(OVH
ꢁDUUD\FRS\ꢉLꢊꢁ ꢁꢉDUUD\FRS\ꢉLꢊꢁ$QGꢁꢎ+ꢃ)ꢊꢁꢍꢁꢋ
ꢁ&KHFN&5&ꢇꢁ ꢁ)DOVH
ꢁ
ꢁ(QGꢁ,I
ꢀVHHꢁ,6/ꢃꢄꢅꢆꢆꢁGDWDVKHHWꢐꢁ)LJꢁꢌꢌꢓꢁꢇꢂELWꢁ&5&ꢁFDOFXODWLRQ
ꢁ
ꢁIIꢆꢁ ꢁFDUU\ꢁ;RUꢁELWꢑ
ꢁIIꢌꢁ ꢁELWꢆꢁ;RUꢁELWꢑ
ꢁIIꢋꢁ ꢁELWꢌ
(QGꢁ)XQFWLRQ
3XEOLFꢁ6XEꢁ$GG&5&ꢇꢉP\$UUD\ꢉꢊꢁ$Vꢁ%\WHꢊ
ꢁIIꢑꢁ ꢁELWꢋ
ꢁꢀDGGVꢁ&5&ꢇꢁFKHFNVXPꢁꢉORZꢁQLEEOHꢁLQꢁODVWꢁE\WHꢁLQꢁDUUD\ꢊ
ꢁELWꢆꢁ ꢁIIꢆ
ꢁꢀDUUD\ꢁFDQꢁEHꢁDQ\ꢁOHQJWK
ꢁELWꢌꢁ ꢁIIꢌ
ꢁ
ꢁ
ELWꢋꢁ ꢁIIꢋ
ꢁELWꢑꢁ ꢁIIꢑ
'LPꢁFUFꢇꢁ$Vꢁ%\WH
ꢁ
ꢁ1H[WꢁM
1H[WꢁL
FUFꢇꢁ ꢁ&DOFXODWH&5&ꢇꢉP\$UUD\ꢊ
ꢁP\$UUD\ꢉ8%RXQGꢉP\$UUD\ꢊꢊꢁ ꢁꢉP\$UUD\ꢉ8%RXQGꢉP\$UUD\ꢊꢊꢁ$QGꢁꢎ+)ꢆꢊꢁ2Uꢁ
ꢁ
FUFꢇ
ꢀFRPELQHꢁELWVꢁWRꢁREWDLQꢁ&5&ꢇꢁUHVXOW
ꢁ
ꢁUHVXOWꢁ ꢁꢆ
ꢁ,IꢁELWꢆꢁ7KHQ
ꢁUHVXOWꢁ ꢁUHVXOWꢁꢒꢁꢌ
ꢁ(QGꢁ,I
ꢁ,IꢁELWꢌꢁ7KHQ
ꢁUHVXOWꢁ ꢁUHVXOWꢁꢒꢁꢋ
ꢁ(QGꢁ,I
ꢁ,IꢁELWꢋꢁ7KHQ
ꢁUHVXOWꢁ ꢁUHVXOWꢁꢒꢁꢇ
ꢁ(QGꢁ,I
ꢁ,IꢁELWꢑꢁ7KHQ
ꢁUHVXOWꢁ ꢁUHVXOWꢁꢒꢁꢄ
ꢁ(QGꢁ,I
(QGꢁ6XE
3XEOLFꢁ)XQFWLRQꢁ&DOFXODWH&5&ꢇꢉ%\5HIꢁP\$UUD\ꢉꢊꢁ$Vꢁ%\WHꢊꢁ$Vꢁ%\WH
ꢁꢀFDOFXODWHVꢏUHWXUQVꢁWKHꢁ&5&ꢇꢁFKHFNVXPꢁRIꢁDUUD\ꢁFRQWHQWVꢁH[FOXGLQJꢁ
ꢁꢀODVWꢁORZꢁQLEEOHꢈꢁ$UUD\ꢁFDQꢁEHꢁDQ\ꢁOHQJWK
ꢁ'LPꢁVL]Hꢁ$Vꢁ,QWHJHU
ꢁ'LPꢁLꢁ$Vꢁ,QWHJHU
ꢁ'LPꢁMꢁ$Vꢁ,QWHJHU
ꢁ'LPꢁNꢁ$Vꢁ,QWHJHU
ꢁ'LPꢁELWꢆꢁ$Vꢁ%RROHDQꢐꢁELWꢌꢁ$Vꢁ%RROHDQꢐꢁELWꢋꢁ$Vꢁ%RROHDQꢐꢁELWꢑꢁ$Vꢁ%RROHDQ
ꢁ'LPꢁIIꢆꢁ$Vꢁ%RROHDQꢐꢁIIꢌꢁ$Vꢁ%RROHDQꢐꢁIIꢋꢁ$Vꢁ%RROHDQꢐꢁIIꢑꢁ$Vꢁ%RROHDQ
ꢁ'LPꢁFDUU\ꢁ$Vꢁ%RROHDQ
ꢁ
ꢁ'LPꢁDUUD\FRS\ꢉꢊꢁ$Vꢁ%\WH
&DOFXODWH&5&ꢇꢁ ꢁUHVXOW
ꢁ
End Function
ꢁ'LPꢁUHVXOWꢁ$Vꢁ%\WH
ꢁ
ꢀFRS\ꢁGDWDꢁVRꢁZHꢁGRꢁQRWꢁFOREEHUꢁVRXUFHꢁDUUD\
ꢁ5H'LPꢁDUUD\FRS\ꢉ/%RXQGꢉP\$UUD\ꢊꢁ7Rꢁ8%RXQGꢉP\$UUD\ꢊꢊꢁ$Vꢁ%\WH
ꢁ)RUꢁLꢁ ꢁ/%RXQGꢉP\$UUD\ꢊꢁ7Rꢁ8%RXQGꢉP\$UUD\ꢊ
ꢁDUUD\FRS\ꢉLꢊꢁ ꢁP\$UUD\ꢉLꢊ
ꢁ1H[W
FIGURE 69. EXAMPLE CRC CALCULATION ROUTINE (VISUAL BASIC)
FN7672 Rev.10.00
May 10, 2018
Page 60 of 105
ISL78600
The state of the COMMS SELECT 1, COMMS SELECT 2, COMMS
RATE 0, and COMMS RATE 1 pins can be checked by reading the
CSEL[2:1] and CRAT[1:0] bits in the Comms Setup register (see
Table 29). The SIZE[3:0] bits show the number of devices in the
daisy chain and the ADDR[3:0] bits indicate the location of a
device within the daisy chain.
Daisy Chain Addressing
When used in a daisy chain system each individual device
dynamically assigns itself a unique address (see “Identify
Command” on page 53). In addition, all daisy chain devices
respond to a common address allowing them to be controlled
simultaneously. (For example, when using the Scan Voltages and
Balance Enable commands.) See “Communication Timing” on
page 63.
Examples of the various read and write command structures for
daisy chain installations are shown in Figures 71C through 71G.
The MSB is transmitted first and the LSB is transmitted last.
TABLE 29. COMMS SETUP REGISTER (ADDRESS 6’h18)
11
10
9
8
7
6
5
4
3
2
1
0
CRAT1
CRAT0
CSEL2
CSEL1
SIZE3
SIZE2
SIZE1
SIZE0
ADDR3
ADDR2
ADDR1
ADDR0
These bits show the status These bits show the status These bits show the daisy chain stack size These bits show this devices position within
of the COMMS RATE 1 and of the COMMS SEL 2 and
(i.e. the total number of stacked devices)
the daisy chain stack
COMMS RATE 0 pins
COMMS SEL 1 pins
CS
SCLK
DOUT
DIN
TRISTATE
COMMAND
0
0
0
1
1 0 1 0
1
0
0
1
0
1
0
0
1
1
0
0
0
0
0
0
1
1
0
0
0 0 0 0
R
W
DATA TO WRITE
DEVICE
ADDR
PAGE
ADDR
DATA
ADDRESS
CRC
FIGURE 70. SPI HALF DUPLEX (DAISY CHAIN) WRITE REGISTER COMMAND EXAMPLE: WRITE DEVICE 1, DEVICE SETUP REGISTER
DEVICE
ADDRESS
(23, 20)
DATA
ADDRESS
(15, 10)
CRC
(3, 0)
ZERO
(9, 4)
PAGE
(18, 16)
1
1
1
1
0
0
1
1
0
0
1
0
1
0
0
0
0
0
0
0
1
1
1
0
LSB
MSB
BYTE 2
BYTE 1
BYTE 0
FIGURE 71A. DEVICE LEVEL COMMAND: SLEEP
DATA
DEVICE
ADDRESS
(23, 20)
ZERO
(9, 4)
ADDRESS
(15, 10)
CRC
(3, 0)
PAGE
(18, 16)
1
1
1
1
0
0
1
1
0
0
1
1
1
1
0
0
0
0
0
0
0
1
1
1
LSB
MSB
BYTE 2
BYTE 1
BYTE 0
FIGURE 71B. DEVICE LEVEL COMMAND: WAKEUP
FN7672 Rev.10.00
May 10, 2018
Page 61 of 105
ISL78600
DATA
ADDRESS
(15, 10)
DEVICE
ADDRESS
(23, 20)
ZERO
(9, 4)
CRC
(3, 0)
PAGE
(18, 16)
1
0
0
1
0
0
1
1
0
0
0
0
0
1
0
0
0
0
0
0
1
1
1
1
LSB
MSB
BYTE 2
BYTE 1
BYTE 0
FIGURE 71C. DEVICE LEVEL COMMAND: DEVICE 9, SCAN VOLTAGES
DEVICE
ADDRESS
(23, 20)
DATA
ADDRESS
(15, 10)
CRC
(3, 0)
PAGE
(18, 16)
ZERO
(9, 4)
1
0
0
1
0
0
0
1
0
0
0
1
1
1
0
0
0
0
0
0
1
1
0
0
LSB
MSB
BYTE 2
BYTE 1
BYTE 0
FIGURE 71D. DEVICE READ: DEVICE 9, GET CELL 7 DATA
DEVICE
ADDRESS
(23, 20)
DATA
ADDRESS
(15, 10)
ELEMENT
ADDRESS
(9, 4)
PAGE
(18, 16)
CRC
(3, 0)
0
1
0
0
0
0
1
1
0
0
1
0
0
0
0
0
0
1
0
1
0
1
0
1
LSB
MSB
BYTE 2
BYTE 1
BYTE 0
FIGURE 71E. ELEMENT LEVEL COMMAND: DEVICE 4, MEASURE CELL 5 VOLTAGE
DEVICE
ADDRESS
(23, 20)
DATA
ADDRESS
(15, 10)
DEVICE
COUNT
(9, 4)
PAGE
(18, 16)
CRC
(3, 0)
0
0
0
0
0
0
1
1
0
0
1
0
0
1
0
0
0
0
0
0
0
1
0
0
LSB
MSB
BYTE 2
BYTE 1
BYTE 0
FIGURE 71F. IDENTIFY COMMAND
DEVICE
ADDRESS
(31, 28)
DATA
ADDRESS
(23, 18)
PAGE
(26, 24)
DATA
CRC
(3, 0)
(17, 4)
0
1
1
1
1
0
1
0
0
1
0
0
1
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
LSB
MSB
BYTE 3
BYTE 2
BYTE 1
BYTE 0
FIGURE 71G. DEVICE WRITE: DEVICE 7, WRITE EXTERNAL TEMPERATURE LIMIT = 14’h0FFF
FIGURE 71. DAISY CHAIN DEVICE READ AND WRITE EXAMPLES
FN7672 Rev.10.00
May 10, 2018
Page 62 of 105
ISL78600
Response examples are shown in Figures 72A through 72D.
DEVICE
ADDRESS
(31, 28)
DATA
ADDRESS
(23, 18)
PAGE
(26, 24)
DATA
CRC
(3, 0)
(17, 4)
1
0
0
1
0
0
0
1
0
0
0
1
1
1
0
1
0
1
1
1
0
0
0
0
1
0
1
0
0
1
0
0
LSB
MSB
BYTE 3
BYTE 2
BYTE 1
BYTE 0
FIGURE 72A. DEVICE DATA RESPONSE: DEVICE 9, CELL 7 VOLTAGE = 14’h170A (3.6V)
DEVICE
ADDRESS
(31, 28)
DATA
PAGE
(26, 24)
ADDRESS
(23, 18)
ZEROS
(17, 4)
CRC
(3, 0)
1
0
1
0
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
LSB
MSB
BYTE 3
BYTE 2
BYTE 1
BYTE 0
FIGURE 72B. DEVICE COMMUNICATIONS ADMINISTRATION RESPONSE: DEVICE 10, ACK
DEVICE
ADDRESS
(31, 28)
DATA
ADDRESS
(23, 18)
DEVICE TYPE/
ADDRESS
(17, 4)
PAGE
CRC
(3, 0)
(26, 24)
0
0
0
0
0
0
1
1
0
0
1
0
0
1
0
0
0
0
0
0
0
0
1
1
0
1
0
0
0
1
1
0
LSB
MSB
BYTE 3
BYTE 2
BYTE 1
BYTE 0
FIGURE 72C. DEVICE COMMUNICATIONS ADMINISTRATION RESPONSE: IDENTIFY, DEVICE 4, MIDDLE STACK DEVICE
CELL 12
DATA
(305, 292)
DATA
ADDRESS 0BH
(287, 282)
CELL 11
DATA
(281, 268)
DEVICE
ADDRESS
(319,316)
DATA
ADDRESS 0CH
(311, 306)
PAGE
(314,
312)
CRC
(287, 264)
CRC
(291,288)
1 0 0 1 0 0 0 1 0 0 1 1 0 0 1 0 1 1 1
0
0
0 0 1 0 1 0 0 1 1 0
0
0 0 1 0 1 1 0 1 0 1 1 1 0 0 0 0 1 0 1 0 0 0 0 1
MSB
BYTE 39
BYTE 38
BYTE 37 BYTE 36
BYTE 35
BYTE 34
BYTE 33
DATA
ADDRESS 00H
(23, 18)
DATA
ADDRESS 0AH
(263, 258)
CELL 10
DATA
(257, 244)
PACK VOLTAGE
DATA
CRC
(243, 240)
CRC
(3, 0)
(17, 4)
0
0 0 1 1 1 0 1 1 1 1 0 0 0 0 1 0 1 0 0 0 0 0 1
BYTE 32 BYTE 31 BYTE 30
0 0 0 0 0 0 0 1 0 0 1
0
1
0 0 0 1 1 1 1 0 0 0
1
LSB
BYTE 2 BYTE 1
BYTE 0
FIGURE 72D. DEVICE DATA RESPONSE: DEVICE 9, READ ALL CELL VOLTAGE DATA
FIGURE 72. DAISY CHAIN DEVICE RESPONSE EXAMPLES
the ISL78600 internal clock. This clock has the same variations
(and is related to) as the daisy chain clock.
Communication Timing
Collecting voltage and temperature data from daisy chained
ISL78600 devices consists of three separate types of operations:
A command to initiate measurement, the Measurement itself,
and a command and response to retrieve data.
Responses have different timing calculations, based on the
position of the addressed device in the daisy chain stack and the
daisy chain and SPI clock rates.
Commands are the same for all types of operations, but the
timing is dependent on the number of devices in the stack, the
daisy chain clock rate, and the SPI clock rate.
Actual measurement operations occur within the device and
start with the last bit of the command byte and end with data
being placed in a register. Measurement times are dependent on
FN7672 Rev.10.00
May 10, 2018
Page 63 of 105
ISL78600
port at the end of the first byte of data. Then, for each device,
there is an additional delay of one daisy chain clock cycle.
Measurement Timing Diagrams
All measurement timing is derived from the ISL78600’s internal
oscillators. The figures shown in the following as typical are those
obtained with the oscillators operating at their nominal
frequencies and with any synchronization timing also at nominal
value. Maximum figures are those obtained with the oscillators
operating at their minimum frequencies and with the maximum
time for any synchronization timing.
On receiving the Start Scan signal, the device initializes
measurement circuits and proceeds to perform the requested
measurement(s). When the measurements are made, some
devices perform additional operations, such as checking for
overvoltage conditions. The measurement command ends when
registers are updated. At this time the registers can be read
using a separate command. A detailed timing breakdown is
provided for each measurement type as follows.
Measurement timing begins with a Start Scan signal. This signal
is generated internally by the ISL78600 at the last clock falling
edge of the Scan or Measure command. (This is the last falling
edge of the SPI clock in the case of a stand-alone or master
device, or the last falling edge of the daisy chain clock, in the
case of a daisy chain device). Daisy chain middle or top devices
impose additional synchronization delays. Communications sent
on the SPI port are passed on to the master device’s daisy chain
See Figure 73 for the measurement timing for a stand-alone
device. See Figure 74 for the measurement timing for daisy chain
devices.
Tables 33 through 38 give the typical and maximum timing for
the critical elements of measurement process. Each table shows
the timing from the last edge of the Scan command clock.
SCAN COMMAND
READ REGISTER COMMAND
DIN
SCK
DOUT
DIN
INTERNAL SCAN
MEASURE
INTERNAL OPERATION
UPDATE REGISTERS
See Tables 33 through 38
FIGURE 73. SCAN/MEASURE COMMAND TIMING WITH RESPONSE (STAND-ALONE)
SPI SCAN COMMAND
DIN
SCK
SCAN/MEASURE
INTERNAL
OPERATION (MASTER)
UPDATE REGISTERS
See Tables 33 through 38
See Figure 75 on page 65, Table 30 and Table 31 on page 69
DAISY CHAIN SCAN COMMAND
UNIT 2
UNIT 6
4 DAISY CHAIN CLOCKS
SCAN/MEASURE
INTERNAL OPERATION
(DAISY CHAIN UNIT 6)
UPDATE REGISTERS
See Tables 33 through 38
FIGURE 74. MEASUREMENT TIMING (6 DEVICE DAISY CHAIN)
FN7672 Rev.10.00
May 10, 2018
Page 64 of 105
ISL78600
Command Timing Diagram
SPI COMMAND
DOUT
t
CS:WAIT
CS
SCK
LEAD
t
t
LAG
t
SPI
t
D
t
1A
DAISY CLOCK
(P2 TRANSMIT)
8* t
8* t
8* t
8* t
8* t
8* t
12 * t
D
D
D
D
D
(Note 17) (Note 18)
2 * t
D
8* t
8* t
D
12 * t
(P1 RECEIVE)
D
D
D
D
SCAN
2µs
2 * t
D
4 * t
D
8* t
8* t
8* t
8* t
D
8 * t
(P1 RECEIVE)
D
D
D
D
(FROM DEVICE 5)
SCAN
2µs
2 * t
D
8 * t
D
D
(P1 RECEIVE)
(FROM DEVICE 13)
8* t
8* t
8* t
8* t
D
D
D
SCAN
2µs
2 * t
D
t
t
1B
1C
To Start of Scan (Master)
COMMANDS:
t
= t
8 + t
+ t
3 + 2 t
CSWAIT
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Scan Voltages
Scan Temperatures
Scan Mixed
Scan Wires
Scan All
1A
SPI
LEAD
LAG
To Start of Scan (Top/Middle)
t
= t
8 + t
+ t
+ t
+ t 28 + n – 2 + 2s
1B
SPI
LEAD
LAG
D
Measure
To End of Command
Read
Write
t
= t
8 + t
+ t 34 + N – 2
1C
SPI
LEAD
LAG
D
Scan Continuous
Scan Inhibit
Sleep
where:
t
t
t
t
t
= SPI clock period
NAK
SPI
D
= Daisy chain clock period
= CS High time
ACK
Balance Inhibit
Calc Checksum
Check Checksum
CS:WAIT
= CS Low to first SPI Clock
LEAD
= Last SPI Clock CS High
LAG
n = Stack position of target device
N = Stack position of TOP device
NOTES:
17. Master adds extra byte of zeros as part of daisy protocol
18. Master adds N-2 clocks to allow communication to the end of the chain.
FIGURE 75. COMMAND TIMING
FN7672 Rev.10.00
May 10, 2018
Page 65 of 105
ISL78600
Response Timing Diagrams Responses are different for Master, Middle, and Top devices. The response timings are shown in
Figures 76, 77, and 78.
DIN
CS
SCK
t
LAG
t
LEAD
t
t
CS
DR:SP
DATA READY
(P2 RECEIVE)
t
DR:WAIT
2µs
2µs
8* t
8* t
D
8* t
8* t
8* t
8* t
8* t
D
D
D
D
D
D
8* t
8* t
(P1 TRANSMIT)
(P1 TRANSMIT)
(P1 TRANSMIT)
D
D
4 * t
D
4*t
D
8* t
8* t
8* t
8* t
D
D
D
D
2*t
8 * t
D
D
D
8* t
8* t
8* t
8* t
12 * t
D
D
D
D
DAISY CHAIN ACK RESPONSE
8 * t
D
2µs
t2
t2 = 8 t
+ t
+ t
+ t
+ t
+ t
D – t
+ t 42 + N – 2 + 8 + 4s
DRSP D
SPI
DRSP
DRWAIT
CS
LEAD
LAG
where:
t
t
t
t
t
t
t
= SPI clock period
= Daisy chain clock period
= Host delay from DATA READY Low to the CS Low
SPI
D
CS
= CS High to DATA READY High
DRSP
DRWAIT
= DATA READY High time
= CS Low to first SPI Clock
LEAD
= Last SPI Clock CS High
LAG
N = Stack position of TOP device
D = Number of data bytes
D = 4 for one register read (or ACK/NAK response)
D = 40 for read all voltages
D = 22 for read all temperatures
D = 22 for read all faults
D = 43 for read all setup
FIGURE 76. RESPONSE TIMING (MASTER DEVICE)
FN7672 Rev.10.00
May 10, 2018
Page 66 of 105
ISL78600
Response Timing Diagrams Responses are different for Master, Middle, and Top devices. The response timings are shown in
Figures 76, 77, and 78. (Continued)
t
CS
DIN
CS
t
LEAD
t
LAG
SCK
t
DR:SP
DATA READY
2µs
8* t
2µs
8* t
(P2 RECEIVE)
(P1 TRANSMIT)
(P1 TRANSMIT)
8* t
8* t
8* t
8* t
D
D
D
D
D
D
8* t
8* t
D
D
4* t
D
4*t
8* t
8* t
8* t
8* t
D
D
D
D
D
Note 19
n
DAISY CHAIN READ DATA RESPONSE
2µs
8* t
8* t
D
(P2 RECEIVE)
(FROM DEVICE 7)
8* t
8* t
8* t
D
D
D
D
2*t
7*t (= N - n - 1)
D
D
8* t
8* t
8* t
8* t
7* t
D
(P1 TRANSMIT)
COMMAND
D
D
D
D
N
8 * t
D
DAISY CHAIN ACK RESPONSE
Note 20
2µs
RESPONSE
t3
t4
t3 = t 50 + N – n – 1 + 4s
D
t4 = t
8 + t
+ t
+ t
+ t
+ t D 8 + n – 2 + 2s
SPI
CS
LEAD
LAG
DRSP
D
where:
t
t
= Daisy Chain clock period
D
= SPI Clock Period
SPI
N = Stack position of TOP device
n = Stack position of middle stack device
= Delay imposed by host from DATA READY to the first SPI clock cycle
t
CS
D = Number of bytes in the Middle stack device response e.g. read all cell data = 40 bytes, Register or ACK response = 4 bytes.
NOTES:
19. Top device adds (N - n - 1) Daisy clocks to allow communications to the targeted middle stack device.
20. Middle stack device adds (n - 2) Daisy clocks to allow communications to the master device.
FIGURE 77. RESPONSE TIMING (MIDDLE STACK DEVICE)
FN7672 Rev.10.00
May 10, 2018
Page 67 of 105
ISL78600
Response Timing Diagrams Responses are different for Master, Middle, and Top devices. The response timings are shown in
Figures 76, 77, and 78. (Continued)
t
CS
DIN
CS
t
LEAD
t
LAG
SCK
t
DR:SP
DATA READY
2µs
8* t
2µs
8* t
(P2 RECEIVE)
8* t
8* t
8* t
8* t
D
D
D
D
D
D
D
8* t
8* t
(P1 TRANSMIT)
D
4 * t
D
4*t
D
8* t
8* t
8* t
8* t
D
D
D
D
(P1 TRANSMIT)
(P1 TRANSMIT)
2*t
2µs
8 * t
D
D
8* t
8* t
8* t
8* t
12 * t
D
D
D
D
D
8 * t
DAISY CHAIN DATA RESPONSE
T5
D
t5 = t
8 + t
+ t
+ t
+ t
+ t D 8 + 10 + N – 2 + 4s
SPI
LEAD
LAG
DRSP
CS
D
where:
t
t
t
t
t
t
= SPI clock period
= Daisy chain clock period
= Host delay from DATA READY to the first SPI clock
SPI
D
CS
= CS High to DATA READY High
= CS Low to first SPI Clock
DRSP
LEAD
= Last SPI Clock CS High
LAG
N = stack position of TOP device
D = Number of bytes in response
FIGURE 78. RESPONSE TIMING (TOP DEVICE)
FN7672 Rev.10.00
May 10, 2018
Page 68 of 105
ISL78600
TABLE 31. COMMAND TIMING
TIME TO END OF COMMAND FOR NUMBER OF DEVICES (µs)
SPI CLOCK = 2MHz
System Timing Tables
Command Timing Tables
The command timing Table 30 includes the time from the start
of the command to the start of an internal operation for each
device in a stack. Table 31 shows the time required for the
command to complete. For a stand-alone device the two values
are the same, because the internal operation starts at the end of
the command. For a daisy chain operation, the internal operation
begins before the end of the command.
NUMBER OF
DEVICES
DAISY CLOCK = 500kHz
DAISY CLOCK = 250kHz
17.5
1
2
17.5
82.0
84.2
86.5
88.7
90.9
93.1
95.3
97.6
157.6
3
162.0
4
166.5
When calculating overall timing for a command, start with the
time from start of the command to the start of the internal
operation for the Target device. Add to this the time for the
internal operation, see one of the “Measurement Timing Tables”
on page 70. Add to this the time it takes to read back the data.
See times shown in “Response Timing Tables” on page 72. Also
needed is a wait time between sending each command (see
Table 32).
5
170.9
6
175.3
7
179.8
8
184.2
9
188.7
10
11
12
13
14
99.8
102.0
104.2
106.5
108.7
193.1
When using the Address All option, the command timing for the
Top device in the stack determines when the command ends, but
use the Time to Start of Scan for each device to determine when
that device begins its internal operation. For example, in a stack
of six devices, it takes 90.9µs for the command to complete, but
internal operations start at 13.8µs for the Master, 68.7µs for
Device 2, 70.9µs for Device 3, etc.
197.6
202.0
206.5
210.9
SEQUENTIAL DAISY CHAIN COMMUNICATIONS
In Tables 30 and 31, the calculation assumes a daisy chain (and
internal) clock that is 10% slower than the nominal and an SPI
clock that is running at the nominal speed (because the SPI clock
is normally crystal controlled.) For the 500kHz daisy setting,
timing assumes a 450kHz clock.
When sending a sequence of commands to the master device,
the host must allow time, after each response and before
sending the next command, for the daisy chain ports of all stack
devices (other than the master) to switch to receive mode. This
wait time is equal to eight daisy chain clock cycles and is
imposed from the time of the last edge on the Master’s input
daisy chain port to the last edge of the first byte of the
subsequent command on the SPI (see Figure 79). The minimum
recommended wait time, between the host receiving the last
edge of a response and sending the first edge of the next
command, is given for the various daisy chain data rates in
Table 32.
TABLE 30. TIME TO START OF INTERNAL OPERATION
TIME TO START OF INTERNAL OPERATION FOR TARGET DEVICE
(µs)
SPI CLOCK = 2MHz
TARGET
DEVICE
DAISY CLOCK = 500kHz
DAISY CLOCK = 250kHz
1
2
17.5
68.7
70.9
73.2
75.4
77.6
79.8
82.1
84.3
86.5
88.7
90.9
93.2
95.4
17.5
TABLE 32. MINIMUM RECOMMENDED COMMUNICATIONS WAIT TIME
130.9
MAXIMUM TIME FOR DAISY CHAIN
3
135.4
PORTS TO CLEAR
UNIT
kHz
4
139.8
DAISY CHAIN
DATA RATE
500
18
250
125
62.5
144
5
144.3
6
148.7
COMMUNICATIONS
WAIT TIME
36
72
µs
7
153.2
8
157.6
9
162.1
10
11
12
13
14
166.5
170.9
175.4
179.8
184.3
FN7672 Rev.10.00
May 10, 2018
Page 69 of 105
ISL78600
SPI
NEXT SPI
SPI RESPONSE
COMMAND
COMMAND
DIN
SCK
DATA READY
Minimum Wait time
between commands.
See Table 32
UNIT 2
UNIT n
FIGURE 79. MINIMUM WAIT BETWEEN COMMANDS (DAISY CHAIN RESPONSE - TOP DEVICE)
SCAN TEMPERATURES
Measurement Timing Tables
The Scan Temperatures command turns on the TEMPREG output
and, after a 2.5ms settling interval, samples the ExT1 to ExT4
inputs. TEMPREG turns off on completion of the ExT4
measurement. The Reference Voltage, IC Temperature, and
Multiplexer loopback function are also measured. The sequence
is completed with respective registers being loaded.
SCAN VOLTAGES
The Scan Voltages command initiates a sequence of
measurements starting with a scan of each cell input from
Cell 12 to Cell 1, followed by a measurement of pack voltage.
Additional measurements are then performed for the internal
temperature and to check the connection integrity test of the VSS
and VBAT inputs. The process completes with the application of
calibration parameters and the loading of registers. Table 33
shows the times after the start of scan that the cell voltage
inputs are sampled. The voltages are held until the ADC
completes its conversion.
TABLE 34. SCAN TEMPERATURES FUNCTION TIMING– DAISY CHAIN
MASTER OR STAND-ALONE DEVICE
ELAPSED TIME (µs)
EVENT
Turn On TEMPREG
Sample ExT1
TYP
2
MAX
2
TABLE 33. SCAN VOLTAGES FUNCTION TIMING - DAISY CHAIN MASTER
OR STAND-ALONE DEVICE
2518
2770
~
EVENT
TYP (µs)
17
MAX (µs)
19
Sample ExT4
2564
2584
2689
2689
2820
2842
2958
2958
Sample Cell 12
Sample Cell 11
Sample Cell 10
Sample Cell 9
Sample Cell 8
Sample Cell 7
Sample Cell 6
Sample Cell 5
Sample Cell 4
Sample Cell 3
Sample Cell 2
Sample Cell 1
38
42
Sample Reference
Measure Internal Temperature
Load Registers
59
65
81
89
102
123
144
166
187
208
229
251
304
112
135
159
182
206
229
252
276
334
Complete Cell Voltage Capture (ADC
complete)
Sample V
BAT
Complete V
Voltage Capture
318
423
550
726
766
349
465
605
799
842
BAT
Measure Internal Temperature
Complete VSS Test
Complete V
Test
BAT
Load Registers
FN7672 Rev.10.00
May 10, 2018
Page 70 of 105
ISL78600
SCAN MIXED
TABLE 36. SCAN WIRES FUNCTION TIMING – DAISY CHAIN MASTER
OR STAND-ALONE DEVICE
The Scan Mixed command performs all the functions of the Scan
Voltages command but interposes a measurement of the ExT1
input between the Cell 7 and Cell 6 measurements.
ELAPSED TIME
(ms)
EVENT
Turn On VC0 Current
Test VC0
TYP
0.03
4.5
MAX
0.05
5.0
TABLE 35. SCAN MIXED FUNCTION TIMING – DAISY CHAIN MASTER
OR STAND-ALONE DEVICE
TYP
(µs)
MAX
(µs)
EVENT
Turn On VC1 Current
Test VC1
4.6
5.1
Sample Cell 12
Sample Cell 11
Sample Cell 10
Sample Cell 9
Sample Cell 8
Sample Cell 7
17
38
19
42
9.1
10.0
~
Turn On VC12 Current
Test VC12
54.9
59.4
59.4
60.3
65.3
65.3
59
65
80
88
Load Registers
101
122
176
111
134
194
SCAN ALL
The Scan All command combines the Scan Voltages, Scan Wires,
and Scan Temperatures commands into a single scan function.
Complete Cell Voltage Capture 12-7
Sample Ext1
TABLE 37. SCAN ALL FUNCTION TIMING – DAISY CHAIN MASTER OR
STAND-ALONE DEVICE
Complete Ext1 Capture
Sample Cell 6
192
207
228
249
270
291
312
367
211
228
251
274
297
321
344
404
ELAPSED TIME
(ms)
Sample Cell 5
EVENT
Start Scan Voltages
TYP
0
MAX
0
Sample Cell 4
Sample Cell 3
Start Scan Wires
0.8
0.9
Sample Cell 2
Start Scan Temperatures
Complete sequence
60.1
62.8
66.2
69.1
Sample Cell 1
Complete Cell Voltage Capture 6-1
Sample V
BAT
MEASURE COMMAND
Complete V
Voltage Capture
381
829
419
911
BAT
Single parameter measurements of the cell voltages, Pack
Voltage, ExT1 to ExT4 inputs, IC temperature, and Reference
voltage are performed using the Measure command.
Load Registers
SCAN WIRES
TABLE 38. VARIOUS MEASURE FUNCTION TIMINGS – DAISY CHAIN
MASTER OR STAND-ALONE DEVICE
The Scan Wires command initiates a sequence in which each
input is loaded in turn with a test current for a duration of 4.5ms
(default). At the end of this time the input voltage is checked and
the test current is turned off. The result of each test is recorded
and the Open-Wire Fault and Fault Status registers are updated
(data latched) at the conclusion of the tests.
ELAPSED TIME
(µs)
EVENT
Measure Cell Voltage
Measure Pack Voltage
Measure ExT Input
TYP
178
122
2517
106
106
MAX
196
134
2768
116
116
Measure IC Temperature
Measure Reference Voltage
FN7672 Rev.10.00
May 10, 2018
Page 71 of 105
ISL78600
In the following tables, internal and daisy clocks are assumed to
be slow by 10% and the SPI clock is assumed to be at the stated
speed.
Response Timing Tables
Response Timing depends on the number of devices in the
Stack, the position of the device in the stack, and how many
bytes are read back. There are four “sizes” of read responses.
There are the following four types of responses:
For an example, consider a stack of six devices. To get the full
scan time with a daisy clock of 500kHz and SPI clock of 2MHz, it
takes 77.6µs from the start of the Scan All command to the start
of the internal scan of the Top device (see Table 30), 842µs to
complete an internal scan of all voltages (see Table 33 on
page 70), 5.337ms to read all cell voltages from all devices (see
Table 41 on page 73), and 18µs delay before issuing another
command. In this case, all cell voltages in the host controller can
be updated every 6.28ms.
• Single register read or ACK/NAK responses, where four bytes
are returned by the Read Command
• Read All Voltage response, which returns 40 bytes
• Read all Temps or Read All Faults responses, which returns 22
bytes
• Read All Setup Registers response, which returns 43 bytes
4-BYTE RESPONSE
In the following tables, the Master, Middle, and Top device
response times for any number of daisy chain devices are
included with the command timing for that configuration. The
right hand column shows the total time to complete the read
operation. This is calculated in Equation 4:
Tables 39 and 40 show the calculated timing for read operations
for 4 byte responses. This is the timing for an ACK or NAK, as well
as Read Register command.
40-BYTE RESPONSE
(EQ. 4)
N T
+ N – 2 T
+ T
+ T
TOP MASTER
COMMAND
MID
Tables 41 and 42 on page 73 show the calculated timing for read
operations for 40-byte responses. Specifically, this is the timing
for a Read All Voltages command.
where N = Number of devices in the stack.
TABLE 39. READ TIMING (MAX): 4-BYTE RESPONSE, DAISY CLOCK = 500kHz, SPI CLOCK = 2MHz
COMMAND TIME TO TIME TO COMPLETE RESPONSE (DAISY CHAIN)
START OF RESPONSE
STACK (EACH DAISY DEVICE)
COMMAND +
RESPONSE ALL
DEVICES
TOP
MASTER DEVICE
MIDDLE DEVICE
TOP DEVICE
ALL DEVICES
DEVICE
(µs)
(µs)
(µs)
(µs)
(µs)
(µs)
2
3
80
139
142
144
146
148
151
153
155
157
159
162
164
166
110
113
115
117
119
121
124
126
128
130
133
135
137
250
455
410
82
201
203
206
208
210
212
215
217
219
221
223
226
702
4
85
666
1004
1314
1633
1961
2298
2643
2998
3361
3734
4115
4505
5
87
880
6
89
1099
1323
1550
1783
2020
2261
2506
2757
3011
7
91
8
93
9
96
10
11
12
13
14
98
100
102
105
107
TABLE 40. READ TIMING (MAX): 4-BYTE RESPONSE, DAISY CLOCK = 250kHz, SPI CLOCK = 2MHz
COMMAND TIME TO
START OF RESPONSE
STACK (EACH DAISY DEVICE)
TIME TO COMPLETE RESPONSE (DAISY CHAIN)
COMMAND +
RESPONSE ALL
DEVICES
TOP
MASTER DEVICE
MIDDLE DEVICE
TOP DEVICE
ALL DEVICES
DEVICE
(µs)
156
160
165
169
173
178
182
(µs)
(µs)
(µs)
(µs)
(µs)
2
3
4
5
6
7
8
228
233
237
242
246
251
255
204
208
213
217
221
226
230
432
824
743
383
388
392
397
401
406
1304
1884
2480
3095
3727
4378
1226
1636
2055
2483
2919
FN7672 Rev.10.00
May 10, 2018
Page 72 of 105
ISL78600
TABLE 40. READ TIMING (MAX): 4-BYTE RESPONSE, DAISY CLOCK = 250kHz, SPI CLOCK = 2MHz (Continued)
COMMAND TIME TO TIME TO COMPLETE RESPONSE (DAISY CHAIN)
START OF RESPONSE
COMMAND +
RESPONSE ALL
DEVICES
TOP
STACK (EACH DAISY DEVICE)
MASTER DEVICE
MIDDLE DEVICE
TOP DEVICE
ALL DEVICES
DEVICE
(µs)
187
191
196
200
205
209
(µs)
(µs)
(µs)
(µs)
(µs)
9
259
264
268
273
277
282
410
415
419
423
428
432
235
239
244
248
253
257
3365
3820
4283
4755
5237
5727
5045
5731
6435
7156
7895
8652
10
11
12
13
14
TABLE 41. READ TIMING (MAX): 40-BYTE RESPONSE, DAISY CLOCK = 500kHz, SPI CLOCK = 2MHz
COMMAND TIME TO
START OF RESPONSE
STACK (EACH DAISY DEVICE)
TIME TO COMPLETE RESPONSE (DAISY CHAIN)
COMMAND +
RESPONSE ALL
DEVICES
TOP
MASTER DEVICE
MIDDLE DEVICE
TOP DEVICE
ALL DEVICES
DEVICE
(µs)
(µs)
(µs)
(µs)
(µs)
(µs)
2
3
80
643
646
648
650
652
655
657
659
661
663
666
668
670
750
753
755
757
759
761
764
766
768
770
773
775
777
1394
2239
3090
3944
4803
5667
6534
7407
1554
2486
3428
4378
5337
6305
7282
8267
9262
10265
11278
12299
13329
82
841
843
846
848
850
852
855
857
859
861
863
866
4
85
5
87
6
89
7
91
8
93
9
96
10
11
12
13
14
98
8284
9165
10050
10941
11835
100
102
105
107
TABLE 42. READ TIMING (MAX): 40-BYTE RESPONSE, DAISY CLOCK = 250kHz, SPI CLOCK = 2MHz
COMMAND TIME TO
START OF RESPONSE
STACK (EACH DAISY DEVICE)
TIME TO COMPLETE RESPONSE (DAISY CHAIN)
COMMAND +
RESPONSE ALL
DEVICES
TOP
MASTER DEVICE
MIDDLE DEVICE
TOP DEVICE
ALL DEVICES
DEVICE
(µs)
156
160
165
169
173
178
182
187
191
196
200
205
209
(µs)
(µs)
(µs)
(µs)
(µs)
2
3
732
737
741
746
750
755
759
763
768
772
777
781
786
1484
1488
1493
1497
1501
1506
1510
1515
1519
1524
1528
1533
1537
2216
3888
2527
4368
1663
1668
1672
1677
1681
1686
1690
1695
1699
1703
1708
1712
4
5570
6228
5
7260
8104
6
8959
9999
7
10667
12383
14109
15844
17587
19339
21101
22871
11911
13842
15789
17755
19739
21740
23759
25796
8
9
10
11
12
13
14
FN7672 Rev.10.00
May 10, 2018
Page 73 of 105
ISL78600
22-BYTE RESPONSE
Tables 43 and 44 show the calculated timing of read operations
for 22-byte responses. This is the timing for Read All
Temperature or Read All Faults command.
TABLE 43. READ TIMING (MAX): 22-BYTE RESPONSE, DAISY CLOCK = 500kHz, SPI CLOCK = 2MHz
COMMAND TIME TO
START OF RESPONSE
STACK (EACH DAISY DEVICE)
TIME TO COMPLETE RESPONSE (DAISY CHAIN)
COMMAND +
RESPONSE ALL
DEVICES
TOP
MASTER DEVICE
MIDDLE DEVICE
TOP DEVICE
ALL DEVICES
DEVICE
(µs)
(µs)
(µs)
(µs)
(µs)
(µs)
2
3
80
391
394
396
398
400
403
405
407
409
411
414
416
418
430
433
435
437
439
441
444
446
448
450
453
455
457
822
982
82
521
523
526
528
530
532
535
537
539
541
543
546
1347
1878
2412
2951
3495
4042
4595
5152
5713
6278
6849
7423
1594
2216
2846
3485
4133
4790
5455
6130
6813
7506
8207
8917
4
85
5
87
6
89
7
91
8
93
9
96
10
11
12
13
14
98
100
102
105
107
TABLE 44. READ TIMING (MAX): 22-BYTE RESPONSE, DAISY CLOCK = 250kHz, SPI CLOCK = 2MHz
COMMAND TIME TO
START OF RESPONSE
STACK (EACH DAISY DEVICE)
TIME TO COMPLETE RESPONSE (DAISY CHAIN)
COMMAND +
RESPONSE ALL
DEVICES
TOP
MASTER DEVICE
MIDDLE DEVICE
TOP DEVICE
ALL DEVICES
DEVICE
(µs)
156
160
165
169
173
178
182
187
191
196
200
205
209
(µs)
(µs)
(µs)
(µs)
(µs)
2
3
480
485
489
494
498
503
507
511
516
520
525
529
534
844
848
853
857
861
866
870
875
879
884
888
893
897
1324
2356
3398
4448
5507
6575
7651
1635
2836
1023
1028
1032
1037
1041
1046
1050
1055
1059
1063
1068
1072
4
4056
5
5292
6
6547
7
7819
8
9110
9
8737
10417
11743
13087
14448
15827
17224
10
11
12
13
14
9832
10935
12047
13169
14299
FN7672 Rev.10.00
May 10, 2018
Page 74 of 105
ISL78600
totalizing method in which an unbroken sequence of positive
results is required to validate a fault condition. The sequence
length (number of sequential positive samples) is set by the
[TOT2:0] bits in the Fault Setup register (see Table 46).
System Diagnostics Functions
The system uses the following four types of faults to determine
the overall health of the system. These are:
• Automatic Fault detection within the IC.
If the host sends a Scan Continuous command, then the Scan
Interval and the totalizer value set the Fault Detection time (see
Table 45 on page 76).
• Fault detection that is automatic, but requires the host
microcontroller to initiate an operation.
Each cell input, V , and VSS open circuits has separate filter
BAT
• Faults that are detected by the host microcontroller during
normal communication. This includes lack of response or
responses that indicate a fault condition.
functions. The filter is reset whenever a test results in a negative
result (no fault). All filters are reset when the Fault Status register
bits are changed. When a fault is detected, the bits must be
rewritten.
• Faults that are detected by the host microcontroller following a
series of commands and responses that check various internal
and external circuits.
Any out of limit condition generates an Alarm response. See
“Alarm Response” on page 78.
Hardware Fault Detection
Diagnostic Activity Settling Time
The ISL78600 is always checking the internal V3P3, V2P5, and
VREF power supplies using window comparators. If any of these
voltages exceed a programmed limit (either too high or too low),
then a REG fault exists. This immediately starts an alarm
response. See “Alarm Response” on page 78.
The majority of diagnostic functions within the ISL78600 do not
affect other system activity and there is no requirement to wait
before conducting further measurements. The exceptions to this
are the open-wire test and cell balancing functions.
OPEN-WIRE TEST
The ISL78600 also checks the two oscillators continually. The
high speed and low speed oscillators are compared against
limits and against each other. If there is a deviation greater than
programmed, then an OSC fault exists. This immediately starts
an alarm response. See “Alarm Response” on page 78.
The open-wire test loads each VCn pin in turn with 150µA or 1mA
current. This disturbs the cell voltage measurement while the
test is being applied such as, a 1mA test current applied with an
input path resistance of 1kΩ reduces the pin voltage by 1V. The
time required for the cell voltage to settle following the open-wire
test is dependent on the time constant of components used in
the cell input circuit. The standard input circuit (Figure 53 on
page 35) with the components given in Table 11 on page 41
provide settling to within 0.1mV in approximately 2.8ms. This
time should be added at the end of each open-wire scan to allow
the cell voltages to settle.
System Out of Limit Detection
Bits are set in the fault data registers for detection of:
• Overvoltage
• Undervoltage
• Open wires
CELL BALANCING
• Over-temperature
The standard applications circuit (Figure 53 on page 35)
configures the balancing circuits so that the cell input
measurement reads close to zero volts when balancing is
activated. There are time constants associated with the turn-on
and turn-off characteristics of the cell balancing system that
must be allowed for when conducting cell voltage
measurements.
• Open V
BAT
• Open VSS
The overvoltage, undervoltage, over-temperature, and open-wire
conditions have individual fault bits for each cell input. These bits
are OR’d and reflected to bits in the Fault Status register (one bit
per data register). The Open V
and Open VSS have one bit
BAT
each in the Fault Status register.
The turn-on time of the balancing circuit is primarily a function of
the 25µA drive current of the cell balancing output and the gate
charge characteristic of the MOSFET and needs to be determined
for a particular setup. Turn-on settling times to within 2mV of
final “on” value are typically less than 5ms.
These conditions are not detected unless the host initiates a scan
operation. The cell overvoltage, cell undervoltage, V open, and
BAT
VSS open faults are sampled at the same time at the end of a
Scan Voltages command. The cell undervoltage and cell
overvoltage signals are also checked following a Measure cell
voltage command. These conditions are also checked during a
scan continuous operation. If the host initiates a scan continuous
operation, then the status is checked automatically every scan
cycle, without further host involvement. For any other scan
command, the host needs to periodically send the command to
perform another check of the system.
The turn-off time is a function of the MOSFET gate charge and
the VGS connected resistor and capacitor values (for example
R
and C in Figure 53 on page 35) and is generally longer
27
27
than the turn-on time. As with the turn-on case, the turn-off time
needs to be determined for the particular components used.
Turn-off settling times in the range 10ms to 15ms are typical for
settling to within 0.1mV of final value.
FAULT SIGNAL FILTERING
Filtering is provided for the cell overvoltage, cell undervoltage,
V
open, and VSS open tests. These fault signals use a
BAT
FN7672 Rev.10.00
May 10, 2018
Page 75 of 105
ISL78600
TABLE 45. FAULT DETECTION TIME AS A FUNCTION OF SCAN INTERVAL AND NUMBER OF TOTALIZED SAMPLES
FAULT DETECTION TIME
SCAN
INTERVAL INTERVAL
SCAN
000
1
001
2
010
4
011
8
100
16
101
32
110
64
111
128
FAULT SETUP REGISTER
TOTALIZER VALUE
CODE
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
(ms)
16
16
32
64
128
256
512
1024
2048
32
32
64
128
256
512
1024
2048
4096
64
64
128
256
512
1024
2048
4096
8192
128
128
256
512
1024
2048
4096
8192
16384
32768
65536
131072
262144
524288
2048
4096
8192
16384
32768
65536
131072
262144
524288
1048576
2097152
4194304
8388608
256
256
512
1024
2048
4096
8192
16384
32768
65536
131072
262144
4096
8192
16384
32768
65536
131072
262144
524288
1048576
2097152
4194304
512
512
1024
2048
4096
8192
16384
32768
65536
131072
8192
16384
32768
65536
131072
262144
524288
1048576
2097152
1024
2048
4096
8192
16384
32768
65536
1024
2048
4096
8192
16384
32768
65536
16384
32768
65536
131072
262144
524288
1048576
TABLE 46. FAULT SETUP REGISTER
REGISTER BITS
12
11
10
9
8
7
6
5
4
3
2
1
0
TST4 TST3 TST2 TST1 ENABLE TST0 INTERNAL TOT2 TOT1 TOT0 TOTALIZER WSCN
SCAN WIRES
SCN1 SCN0 SCN1 SCN0
SCAN
TEMP
COUNT
INTERVAL
TIME (ms)
0
x
0
x
0
x
0
1
x
None
ExT1
ExT2
ExT3
ExT4
0
1
Disable
Enable
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
2
0
1
Track Voltage Scan
Track Temp Scan
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
16
32
x
x
1
x
4
64
x
1
x
x
8
128
1
x
x
16
32
64
128
256
512
1024
2048
4096
8192
16384
32768
65536
FN7672 Rev.10.00
May 10, 2018
Page 76 of 105
ISL78600
If the target device receives a Communications Failure response
from the device above then the target device relays the
Memory Checksum
Two checksum operations are available to the host
microcontroller for checking memory integrity, one for the
EEPROM and one for the Page 2 registers.
Communications Failure followed by the requested data (in the
case of a read) or simply relays the Communications Failure only
(in the case of a Write, Balance command, etc). The maximum
time required to return the Communications Failure response to
the host microcontroller (the time from the falling edge of the
24th clock pulse of an SPI command to receiving a DATA READY
low signal) is given for various data rates in Table 47.
Two registers are provided to verify the contents of EEPROM
memory. One (Page 4, address 6’h3F) contains the correct
checksum value, which is calculated during factory testing. The
other (Page 5, address 6’h00) contains the checksum value
calculated each time the nonvolatile memory is loaded to
shadow registers, either after a power cycle or after a device
reset. An inequality between these two numbers indicates
corruption of the shadow register contents (and possible
corruption of EEPROM data). The external microcontroller needs
to compare the two registers, because it is not automatic.
Resetting the device (using the Reset command) reloads the
shadow registers. A persistent difference between these two
register values indicates EEPROM corruption.
TABLE 47. MAXIMUM TIME TO COMMUNICATIONS FAILURE RESPONSE
MAXIMUM TIME TO ASSERTION
OF DATA READY
UNIT
kHz
ms
DAISY CHAIN DATA RATE
500
250
125
62.5
46.4
COMMUNICATIONS FAILURE 5.8
RESPONSE
11.6
23.2
A communications fault can be caused by one of three
circumstances:
All Page 2 registers (device configuration registers) are subject to
a checksum calculation. A Calculate Register Checksum
command calculates the Page 2 checksum and saves the value
internally (it is not accessible). The Calculate Register Checksum
command can be run any time, but should be sent whenever a
Page 2 register is changed.
1. The communications system has been compromised
2. The device causing the fault is in Sleep mode
3. A daisy chain input port is in the wrong idle state
This latter condition is unlikely but could arise in response to
external influence, such as a large transient event. The daisy
chain ports are forced to the correct idle condition at the end of
each communication. An external event would have the potential
to “flip” the input such that the port settles in the inverse state.
A Check Register Checksum command recalculates the Page 2
checksum and compares it to the internal value. The occurrence
of a Page 2 checksum error sets the PAR bit in the Fault Status
register and causes a Fault response accordingly. The normal
response to a PAR error is for the host microcontroller to rewrite
the Page 2 register contents. A PAR fault also causes the device
to cease any scanning or cell balancing activity.
A flipped input condition recovers during the normal course of
communications. If a flipped input is suspected, having received
notification of a communications fault condition for example, the
user can send a sequence of all 1s (such as, FF FF FF FF) to clear
the fault. Wait for the resulting NAK response and then send an
ACK to the device that reported the fault. The “all 1” sequence
allows a device to correct a flipped condition through the normal
end of the communication process. The command FB FF FF FF
also works and contains the correct CRC value (should this be a
consideration in the way the control software is set up).
See items 42 through 49 in Table 50 on page 80.
Communication Faults
There is no specific flag to indicate a communications fault. A
fault is indicated by receiving an abnormal communications
response or by an absence of all communications.
Non-daisy chain device commands and responses use CRC
(Cyclical Redundancy Check) error detection. Stand-alone
systems do not use the CRC. If a CRC is not recognized by a
target device, a command includes an Address All when it is not
allowed, or if there are too few bits in the sequence there is a
NAK response. The host can tell where this fault occurred by
reading the Device address.
If the process above results in a Communications Failure
response, the next step is for the host microcontroller to send a
Sleep command, wait for all stack devices to go to sleep, then
send a Wakeup command. If successful, then the host
microcontroller receives an ACK once all devices are awake. In
the case where a single stack device was asleep, the devices
above the sleeping device would not have received the Sleep
command and would respond to the Wakeup sequence with a
NAK due to incomplete communications. The host
If there is no response, then there is a communications failure.
Communication Failure
microcontroller would then send a command (such as, ACK) to
check that all devices are awake. This process can be repeated
as often as needed to wake up sleeping devices.
All commands except the Scan, Measure, and Reset commands
require a response from either the stack Top device or the target
device (see Table 13 on page 43), each device in the stack waits
for a response from the stack device above. Correct receipt of a
command is indicated by the correct response. Failure to receive
a response within a timeout period indicates a communications
failure. The timeout value is stack position dependent. The
device that detects the fault then transmits the Communications
Failure response, which includes its stack address.
If the Wakeup command does not generate a response, this is a
likely indication that the communications have been
compromised. The host microcontroller may send a Sleep
command to all units. If the communications watchdog is
enabled, then all parts go to Sleep mode automatically when the
watchdog period expires so long as there are no valid
communications activity. Table 13 on page 43 provides a
summary of the normal responses and an indication if the device
FN7672 Rev.10.00
May 10, 2018
Page 77 of 105
ISL78600
waits for a response from the various communications
commands.
TABLE 48. WATCHDOG/BALANCE TIME REGISTER
REGISTER BITS
Daisy Chain Communications Conflicts
6
5
4
3
2
1
0
Conflicts in the daisy chain system can occur if both a stack
device and the host microcontroller are transmitting at the same
time, or if more than one stack device transmits at the same
time. Conflicts caused by a stack device transmitting at the same
time as the host microcontroller are recognized by the absence
of the required response (such as, an ACK response to a write
command), or by the scan counter not being incremented in the
case of Scan and Measure commands.
WATCHDOG
TIMEOUT
WDG6 WDG5 WDG4 WDG3 WDG2 WDG1 WDG0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
Disabled
1s
2s
-
Conflicts which arise from more than one device transmitting
simultaneously can occur if two devices detect faults at the same
time. This can occur when the stack is operating normally (such
as, if two devices register an undervoltage fault in response to a
Scan Voltages command sent to all devices). It is recommended
that the host microcontroller checks the Fault Status register
contents of all devices whenever a Fault response is received
from one device.
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
0
1
62s
63s
2 min
4 min
-
1
1
1
1
1
1
1
1
1
1
1
1
0
1
126 min
128 min
Loss of Signal From Host
A watchdog timer is provided as part of the daisy chain
communications fault detection system. The watchdog has no
effect in non-daisy chain systems.
A zero setting (7’b0000000) disables the watchdog function. A
watchdog password function is provided to guard against
accidental disabling of the watchdog function. The upper 6 bits of
the Device Setup register must be set to 6’h3A (111010) to allow
the watchdog to be set to zero. The watchdog is disabled by first
writing the password to the Device Setup register (see “Setup
Registers” on page 91) and then writing zero to the lower bits of
the Watchdog/Balance time register. The password function
does not prevent changing the watchdog timeout setting to a
different nonzero value.
Each device must receive a valid communications sequence
before its watchdog timeout period is exceeded. A valid
communications sequence is one that requires an action or
response from the device. Address All commands, such as the
Scan and Balance commands provide a simple way to reset the
watchdog timers on all devices with a single communication.
Single device communications (such as ACK) must be sent
individually to each device to reset the watchdog timer in that
device. A read of the Fault Status register of each device is also a
good way to reset the watchdog timer on each device. This
functionality guards against situations where a runaway host
microcontroller might continually send data.
The watchdog continues to function when the ISL78600 is in
Sleep mode. Parts in Sleep mode assert the FAULT output when
the watchdog timer expires.
WATCHDOG PASSWORD
Failure to receive valid communications within the required time
causes the WDGF bit to be set in the Fault Status register and the
device to be placed in Sleep mode, with all measurement and
balancing functions disabled. Daisy chain devices assert the
FAULT output in response to a watchdog fault and maintain this
asserted state while in Sleep mode. Notice that no watchdog
fault response is automatically sent on the daisy chain interface.
Before writing a zero to the watchdog timer, which turns off the
timer, it is necessary to write a password to the [WP5:0] bits. The
password value is 6’h3A.
Alarm Response
If any of the fault bits are set, the FAULT logic output is asserted
low in response to the fault condition. The output then remains
low until the bits of the Fault Status register are reset. Individual
bits in the fault data registers must first be cleared before the
associated bits in the Fault Status register can be cleared.
WATCHDOG FUNCTION
The watchdog timeout is settable in two ranges using the lower 7
bits of the Watchdog/Balance time register (see Table 48). The
low range (7’b0000001 to 7’b0111111) provides timeout
settings in 1 second increments from 1 second to 63 seconds.
The high range (7’b1000000 to 7’b1111111) provides timeout
settings in 2 minute intervals from 2 minutes to 128 minutes
(see Table 48 for details).
If the device is in a daisy chain, the Fault logic also sends an
“unprompted” response down the daisy chain to the Master,
which notifies the Host microcontroller that a problem exists.
The daisy chain fault response is immediate, so long as there is
no communications activity on the device ports, and comprises
the normal Fault Status register read response. As such, it
includes the contents of the Status Register and includes the
device address that is reporting the fault.
FN7672 Rev.10.00
May 10, 2018
Page 78 of 105
ISL78600
The Fault response is only sent for the first fault occurrence.
Subsequent faults do not activate the Fault response until after
the Fault Status register has been cleared. If multiple devices
report a fault, the response shows the results from the lowest
stack device.
Fault Response in Sleep Mode
When a stand-alone device is in Sleep mode, the device may still
detect faults if operating in Scan Continuous mode. If an error
occurs, the FAULT output pin is asserted low.
Devices may detect faults if operating in Scan Continuous mode
while also in Sleep mode.
If a fault occurs while the device ports are active, then the device
waits until communications activity ceases before sending the
Fault response. The host microcontroller has the option to wait
for this response before sending the next message. Alternately
the host microcontroller may send the next message
immediately (after allowing the daisy chain ports to clear (see
“Sequential Daisy Chain communications” on page 69). Any
conflicts resulting from additional transmissions from the stack
are recognized by the lack of response from the stack.
Daisy chain devices registering a fault in Sleep mode proceed to
wake up the other devices in the stack (such as, Middle devices
send the Wakeup signal on both ports). Any communications
received by a device on one port while it is transmitting the
Wakeup signal on its other port are ignored. After receiving the
Wakeup signal, the Top stack device waits before sending an
ACK response on Port 1. This is to allow other stack devices to
wake up. The total wait time is dependent on the number of
devices in the stack. The time from a device detecting a fault to
receipt of the ACK response is also dependent on the stack
position of the device. See Table 16 for maximum response
times for stacks of 8 and 14 devices.
Table 49 provides the maximum time from DATA READY going
low for the last byte of the normal response to DATA READY going
low for the first byte of the Fault response in the case where a
Fault response is held up by active communications.
TABLE 49. MAXIMUM TIME BETWEEN DATA READY SIGNALS DELAYED
FAULT RESPONSE
The normal host microcontroller response to receiving an ACK
while the stack is in Sleep mode is to read the Fault Status
register contents of each device in the stack to determine, which
device (or devices) has a fault.
MAXIMUM TIME BETWEEN
DATA READY ASSERTIONS
UNIT
kHz
µs
DAISY CHAIN DATA RATE
FAULT RESPONSE
500
68
250
136
125
272
62.5
544
Further read communications to the device return the Fault
response followed by the requested data. Write communications
return only the fault response. Action commands return nothing.
The host microcontroller resets the register bits corresponding to
the fault by writing 14’h0000 to the Fault Status register, having
first cleared the bits in the fault data register(s) if these are set.
The device then responds ACK as with a normal write response
because the fault status bits are now cleared. This also prevents
further Fault responses unless the fault reappears, in which case
the Fault response is repeated.
Additionally, the fault status of each part can be obtained at any
time by reading the Fault Status register.
The FAULT logic output is asserted in Sleep mode, if a fault has
been detected and has not been cleared.
FN7672 Rev.10.00
May 10, 2018
Page 79 of 105
ISL78600
Fault Diagnostics
Table 50 shows a summary of commands and responses for the
various fault diagnostics functions.
TABLE 50. SUMMARY OF FAULT DIAGNOSTICS COMMANDS AND RESPONSES
DIAGNOSTIC
FUNCTION
ITEM
1
ACTION REQUIRED
REGISTER READ/WRITE
COMMENTS
Static Fault
Detection
Functions
Check fault status (or look Read Fault Status
for normal fault response) Register
The main internal functions of the ISL78600 are monitored
continuously. Bits are set in the Fault Status register in response to
faults being detected in these functions.
2
Oscillator Check Check for device in Sleep
Oscillator faults are detected as part of the Static Fault detection
functions. The response to an oscillator fault detection is to set the
OSC bit in the Fault Status register and then to enter Sleep mode. A
sleeping device does not respond to normal communications,
producing a Communications Failure notification from the next device
down the stack. The normal recovery procedure is send repeated
Sleep and Wakeup commands ensure all devices are awake.
Function
mode if stack returns a
communications failure
response.
3
4
5
Cell Overvoltage Set cell overvoltage limit
Write Overvoltage Limit Full scale value 14'h1FFF = 5V
Register
Set fault filter sample value Write TOT bits in Fault
Setup Register
Default is 3'b011 (eight samples) - (see “Fault Setup” on page 89)
Identify which inputs have Write Cell Setup Register A '0' bit value indicates cell is connected. A '1' bit value indicates no
cells connected
cell connected to this input. The overvoltage test is not applied to
unconnected cells.
6
7
Scan cell voltages
Send Scan Voltages
Command
A cell overvoltage condition is flagged after a number of sequential
overvoltage conditions are recorded for a single cell. The number is
programmed above in item 4.
Check fault status
Read Fault Status
Register
The device sends the Fault Status register contents automatically if a
fault is detected, if the register value is zero before the fault is
detected.
8
9
Check overvoltage fault
register
Read Overvoltage Fault
Register
Only required if the Fault Status register returns a fault condition.
Reset fault bits
Reset bits in the Overvoltage Fault register followed and bits in the
Fault Status register.
10
Reset fault filter
Change the value of the [TOT2:0] bits in the Fault Setup register and
then change back to the required value. This resets the filter. The filter
is also reset if a false overvoltage test is encountered.
11 Cell Undervoltage Set cell undervoltage limit Write Undervoltage Limit Full scale value 14'h1FFF = 5V
Register
12
Set fault filter sample value Write TOT Bits in Fault
Setup Register
Default is 3'b011 (eight samples)
13
Identify which inputs have Write Cell Setup Register A '0' bit value indicates cell is connected. A '1' bit value indicates no
cells connected
cell connected to this input. The undervoltage test is not applied to
unconnected cells.
14
15
Scan cell voltages
Send Scan Voltages
Command
A cell undervoltage condition is flagged after a number of sequential
undervoltage conditions are recorded for a single cell. The number is
programmed above in item 12.
Check fault status
Read Fault Status
Register
The device sends the Fault Status register contents automatically if a
fault is detected, if the register value is zero before the fault is
detected.
16
17
Check undervoltage fault
register
Read Undervoltage Fault Only required if the Fault Status register returns a fault condition.
Register
Reset fault bits
Reset bits in the Undervoltage Fault register followed by bits in the
Fault Status register.
FN7672 Rev.10.00
May 10, 2018
Page 80 of 105
ISL78600
TABLE 50. SUMMARY OF FAULT DIAGNOSTICS COMMANDS AND RESPONSES (Continued)
DIAGNOSTIC
FUNCTION
ITEM
18
ACTION REQUIRED
Reset fault filter
REGISTER READ/WRITE
COMMENTS
Change the value of the [TOT2:0] bits in the Fault Setup register and
then change back to the required value. This resets the filter. The filter
is also reset if a false undervoltage test is encountered.
19
20
V
or VSS
Set fault filter sample value Write TOT bits in Fault
Setup Register
Default is 3'b011 (eight samples)
BAT
Connection Test
Scan cell voltages
Send Scan Voltages
Command
A open condition on V
or VSS is flagged after a number of
BAT
sequential open conditions are recorded for a single cell. The number
is programmed above in item 19.
21
Check fault status
Read Fault Status
Register
The device sends the Fault Status register contents automatically if a
fault is detected, if the register value is zero before the fault is
detected.
22
23
Reset fault bits
Reset fault filter
Reset bits in the Fault Status register.
Change the value of the [TOT2:0] bits in the Fault Setup register and
then change back to the required value. This resets the filter. The filter
is also reset if a false open test is encountered.
24 Open Wire Test
25
Set scan current value
Write Device Setup
Register: ISCN = 1 or 0
Sets scan current to 1mA (recommended) by setting ISCN = 1. Or, set
the scan current to 150µA by setting ISCN = 0.
Identify which inputs have Write Cell Setup Register A '0' bit value indicates cell is connected. A '1' bit value indicates no
cells connected
cell connected to this input. Cell inputs VC2 to VC12: the open-wire
detection system is disabled for cell inputs with a '1' setting in the Cell
Setup register. Cell inputs VC0 and VC1 are not affected by the Cell
Setup register.
26
27
Activate scan wires function Send Scan Wires
Command
Wait for Scan Wires to complete.
Check fault status
Read Fault Status
Register
The device sends the Fault Status register contents automatically if a
fault is detected, if the register value is zero before the fault is
detected.
28
29
Check open-wire fault
register
Read Open-Wire Fault
Register
Only required if the Fault Status register returns a fault condition.
Reset fault bits
Reset bits in the open-wire fault register followed by bits in the Fault
Status register.
30 Over-Temperature Set external temperature
Write External
Temperature Limit
Register
Full scale value 14'h3FFF = 2.5V
Indication
limit
31
Identify which inputs are
required to be tested
Write Fault Setup
Register Bits TST1 to
TST4
A '1' bit value indicates input is tested. A '0' bit value indicates input
is not tested.
32
33
Scan temperature inputs
Check fault status
Send Scan Temperatures An over-temperature condition is flagged immediately if the input
Command
voltage is below the limit value.
Read Fault Status
Register
The device sends the Fault Status register contents automatically if a
fault is detected, if the register value is zero before the fault is
detected.
34
35
Check over-temperature
fault register
Read Over-Temperature Only required if the Fault Status register returns a fault condition.
Fault Register
Reset fault bits
Reset bits in the Over-temperature Fault register followed by bits in
the Fault Status register.
36 Reference Check Read reference coefficient A Read Reference
Function Coefficient A Register
37
Read reference coefficient B Read Reference
Coefficient B Register
FN7672 Rev.10.00
May 10, 2018
Page 81 of 105
ISL78600
TABLE 50. SUMMARY OF FAULT DIAGNOSTICS COMMANDS AND RESPONSES (Continued)
DIAGNOSTIC
FUNCTION
ITEM
38
ACTION REQUIRED
REGISTER READ/WRITE
COMMENTS
Read reference coefficient C Read Reference
Coefficient C Register
39
40
41
Scan temperature inputs
Send Scan Temperatures
Command
Read reference voltage
value
Read Reference Voltage
Register
Calculate voltage reference
value
See Voltage Reference Check Calculation in the Worked Examples
section of this data sheet (see “Voltage Reference Check Calculation”
on page 83).
42 Register
Checksum
Calculateregister checksum Send Calculate Register This causes the ISL78600 to calculate a checksum based on the
value
Checksum Command
current contents of the page 2 registers. This action must be
performed each time a change is made to the register contents. The
checksum value is stored for later comparison.
43
44
45
46
Check register checksum
value
Send Check Register
Checksum Command
The checksum value is recalculated and compared to the value stored
by the previous Calc Register Checksum command. The PAR bit in the
Fault Status register is set if these two numbers are not the same.
Check fault status
Rewrite registers
Reset fault bits
Read Fault Status
Register
The device sends the Fault Status register contents automatically if a
fault is detected, if the register value is zero before the fault is
detected.
Load all page 2 Registers This is only required if a PAR fault is registered. It is recommended
With Their Correct Values. that the host reads back the register contents to verify values prior to
sending a Calculate Register Checksum command.
Reset bits in the Fault Status register.
47 EEPROM MISR
Checksum
Read checksum value
stored in EEPROM
Read the EEPROM MISR
Register
48
49
Read checksum value
calculated by ISL78600
Read the MISR
Checksum Register
The checksum value is calculated each time the EEPROM contents
are loaded to registers, either following the application of power,
cycling the EN pin followed by a host initiated Reset command, or
simply the host issuing a Reset command.
Compare checksum values
Correct function is indicated by the two values being equal. Memory
corruption is indicated by an unequal comparison. In this event the
host should send a Reset command and repeat the check process.
FN7672 Rev.10.00
May 10, 2018
Page 82 of 105
ISL78600
EXAMPLE: ACTIVATE BALANCING ON CELLS 1, 5, 7
AND 11
Worked Examples
The following worked examples are provided to assist with the
setup and calculations associated with various functions.
Step 1. Write Balance Setup register: Set Manual Balance mode,
Balance Status pointer, and turn off balance.
Voltage Reference Check Calculation
BMD = 01 (Manual Balance mode)
BWT = XXX
BSP = 0000 (Balance status pointer location 0)
BEN = 0 (Balancing disabled)
TABLE 51. EXAMPLE REGISTER DATA
VALUE
R/W PAGE ADDRESS
PARAMETER
IC Temperature
Reference Voltage
Coefficient C
(HEX)
DECIMAL
9253
8359
164
Note: Blue text indicates a register change.
TABLE 52. BALANCE SETUP REGISTER
0
0
0
0
0
001
001
010
010
010
010000
010101
111000
111001
111010
14’h2425
14’h20A7
14’h00A4
14’h3FCD
9’h006
R/W PAGE
010
X = Do not care
ADDRESS
010011
DATA
1
XX XX00 000X XX01
Coefficient B
-51
Coefficient A
6
Step 2. Write Balance Status register: Set Bits 0, 4, 6, and 10
BAL12:1 = 0100 0101 0001
Coefficients A, B, and C are two’s complement numbers. B and C
have a range +8191 to -8192. A has a range +255 to -256.
TABLE 53. BALANCE STATUS REGISTER
Coefficient B above is a negative number (Hex value > 1FFF).
The value for B is 14’h3FCD - 14h3FFF- 1 or
R/W
1
PAGE
010
ADDRESS
010100
DATA
(16333 - 16383 - 1) = -51.
10 10
XX 0100 0101 0001
Coefficient A occupies the upper nine bits of register 6’b111010
(6'h3A). One way to extract the coefficient data from this register
is to divide the complete register value by 32 and rounding the
result down to the nearest integer. With 9'h006 in the upper nine
bits, and assuming the lower five bits are 0, the complete register
value will be 14'h0C0 = 192 decimal. Divide this by 32 to
obtain 6.
Step 3. Enable balancing using Balance Enable command
TABLE 54. BALANCE ENABLE COMMAND
R/W
0
PAGE
011
ADDRESS
010000
DATA
00 0000
Coefficients A, B, and C are used with the IC temperature reading
to calibrate the Reference Voltage reading. The calibration is
applied by subtracting an adjustment of the form:
or enable balancing by setting BEN directly in the Balance Setup
register:
2
A
B
8192
BEN = 1
-----------------------------
------------
Adjustment =
dT
+
dT + C
(EQ. 5)
256 8192
TABLE 55. BALANCE SETUP REGISTER
from the Reference Voltage reading.
R/W
1
PAGE
010
ADDRESS
010011
DATA
An example calculation using the data of Table 51 is given in
Equation 6.
XX XX1X XXXX XXXX
9253 – 9180
--------------------------------
dT =
= 36.5
(EQ. 6)
The balance FETs attached to Cells 1, 5, 7, and 11 turn on.
2
Turn balancing off by resetting BEN or by sending the Balance
Inhibit command (Page 3, address 6’h11).
where 9180 is the Internal Temperature Monitor reading at +25°C
(see the “Electrical Specifications” table, T on page 10).
INT25
2
6
51
8192
Cell Balancing – Timed Mode
Refer to “Timed Balance Mode” on page 50.
-----------------------------
------------
36.5 + 164 = 163.8
Adjustment =
36.5
–
256 8192
(EQ. 7)
(EQ. 8)
(EQ. 9)
Corrected V
= 8359 – 163.8 = 8195.2
EXAMPLE: ACTIVATE BALANCING ON CELLS 2 AND 8
FOR 1 MINUTE
REF
8195.2
-----------------
5 = 2.5010
Step 1. Write Balance Setup register: Set Timed Balance mode,
Balance Status pointer, and turn off balance.
V
value =
REF
16384
Cell Balancing – Manual Mode
Refer to “Manual Balance Mode” on page 50.
BMD = 10 (Timed Balance mode)
BWT = XXX
BSP = 0000 (Balance status pointer location 0)
BEN = 0 (BALANCING disabled)
FN7672 Rev.10.00
May 10, 2018
Page 83 of 105
ISL78600
The value 8191/5 is the scaling factor of the cell voltage
measurement.
TABLE 56. BALANCE SETUP REGISTER
R/W
1
PAGE
010
ADDRESS
010011
DATA
The value of 28’h00136CA is loaded to the required Cell Balance
Register and the value 7’b0001111 (5 minutes) is loaded to the
Balance Time bits in the Watchdog/Balance time register.
XX XX00 000X XX10
X = Do not care
In this example, the total coulomb difference to be balanced is:
470 coulomb (9360 - 8890). At 3.3V/31Ω * 300s = 31.9
coulomb per cycle it takes about 15 cycles for the balancing to
terminate.
Step 2. Write Balance Status register: Set Bits 1 and 7
BAL12:1 = 0000 1000 0010
TABLE 57. BALANCE STATUS REGISTER
AUTO BALANCE MODE CELL BALANCING EXAMPLE
R/W
1
PAGE
010
ADDRESS
010100
DATA
The following describes a simple setup to demonstrate the Auto
Balance mode cell balancing function of the ISL78600. Note that
this balancing setup is not related to the balance value
calculation in Equation 10.
XX 0000 1000 0010
Step 3. Write balance timeout setting to the Watchdog/Balance
Time register (Page 2, address 6’h15, Bits [13:7])
Auto balance cells using the following criteria:
• Balance time = 20 seconds
BTM6:1 = 0000011 (1 minute)
TABLE 58. WATCHDOG/BALANCE TIME REGISTER
• Balance wait time (dead time between balancing
cycles) = 8 seconds
R/W
1
PAGE
010
ADDRESS
010101
DATA
00 0001 1XXX XXXX
• Balancing disabled during cell measurements.
• Balance Values: See Table 61
X = Do not care – the lower bits are the watchdog timeout value and
should be set to a time longer than the balance time. A value of 111
1111 is suggested.
TABLE 61. CELL BALANCE VALUES (HEX) FOR EACH CELL
CELL CELL CELL CELL CELL CELL CELL CELL CELL CELL CELL CELL
Step 4. Enable balancing using Balance Enable command
TABLE 59. BALANCE ENABLE COMMAND
1
2
3
4
5
6
7
8
9
10
11 12
28’h 28’h 28’h 28’h 28’h 28’h 28’h 28’h 28’h 28’h 28’h 28’h
406A 3E4D 292F 3E00 2903 3D06 151E 502 6D6
0
0
0
R/W
0
PAGE
011
ADDRESS
010000
DATA
00 0000
• Balance Status Register: Set up balance:
Cells 1, 4, 7, and 10 on 1st cycle.
Cells 3, 6, 9, and 12 on 2nd cycle.
Cells 2, 5, 8, and 11 on 3rd cycle
(See Table 62)
Or enable balancing by setting BEN directly in the Balance Setup
register:
BEN = 1
TABLE 62. BALANCE STATUS SETUP
CELL
TABLE 60. BALANCE SETUP REGISTER
R/W
1
PAGE
010
ADDRESS
010011
DATA
BPS
[3:0]
1
2
3
4
5
6
7
8
9
10 11 12
XX XX1X XXXX XXXX
0000 Reserved for Manual Balance mode and Timed Balance mode
The balance FETs attached to Cells 2 and 8 turn on. The FETs turn
off after 1 minute. Balancing can be stopped by resetting BEN or
by sending the Balance Inhibit command.
0001
0010
0011
1
0
0
0
0
1
0
1
0
1
0
0
0
0
1
0
1
0
1
0
0
0
0
1
0
1
0
1
0
0
0
0
1
0
1
0
Cell Balancing – Auto Mode
Refer to “Auto Balance Mode” on page 51.
BALANCE VALUE CALCULATION EXAMPLE
This example is based on a cell State of Charge (SOC) of 9360
coulombs, a target SOC of 8890 coulombs, a balancing leg
impedance of 31Ω (30Ω resistor plus 1Ω FET on resistance) and a
sampling time interval of 5 minutes (300 seconds).
The Balance Value is calculated using Equation 10.
8191
5
31
300
------------
---------
= 79562 = 28h00136CA
B =
9360 – 8890
(EQ. 10)
FN7672 Rev.10.00
May 10, 2018
Page 84 of 105
ISL78600
Step 1. Write Balance Value registers
TABLE 65. DEVICE SETUP REGISTER
TABLE 63. BALANCE VALUE REGISTERS
R/W
1
PAGE
010
ADDRESS
011001
DATA
R/W
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
PAGE
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
010
ADDRESS
100000
100001
100010
100011
100100
100101
100110
100111
101000
101001
101010
101011
101100
101101
101110
101111
110000
110001
110010
110011
110100
110101
110110
110111
DATA (HEX)
14’h006A
14’h0001
14’h3E4D
14’h0000
14’h0000
14’h0000
14’h292F
14’h0000
14’h3E00
14’h0000
14’h0000
14’h0000
14’h2903
14’h0000
14’h3D06
14’h0000
14’h0000
14’h0000
14’h151E
14’h0000
14’h0502
14’h0000
14’h06D6
14’h0000
CELL
1
XX XXXX 1XXX XXXX
X = Do not care
Step 3. Write balance timeout setting to the Watchdog/Balance
Time register: Balance timeout code = 0000001 (20 seconds)
2
3
BTM6:0 = 000 0001
TABLE 66. BALANCE TIMEOUT REGISTER
R/W
1
PAGE
010
ADDRESS
010101
DATA
00 0000 1XXX XXXX
4
X = Do not care – the lower bits are the watchdog timeout value and
should be set to a time longer than the balance time. A value 111 1111
is suggested.
5
Step 4. Set up Balance Status register (from Table 62 on
page 84)
6
Step 4A. Write Balance Setup register: Set Auto Balance mode,
set 8 second Balance wait time, and set balance off:
7
BMD = 11 (Auto Balance mode)
BWT = 100 (8 seconds)
BEN = 0 (Balancing disabled)
8
TABLE 67. BALANCE SETUP REGISTER
9
R/W
1
PAGE
010
ADDRESS
010011
DATA
XX XX0X XXX1 0011
10
11
12
X = Do not care
Step 4B. Write Balance Setup register: Set Balance Status
Pointer = 1
BSP = 0001 (Balance status pointer = 1)
TABLE 68. BALANCE SETUP REGISTER
R/W
1
PAGE
010
ADDRESS
010011
DATA
TABLE 64. BALANCE VALUE REGISTERS (CELL1) - VALUE 28’h406A
6’20 B0107 B0106 B0105 B0104 B0103 B0102 B0101 B0100
XX XXX0 001X XXXX
X = Do not care
0
1
1
0
1
0
1
0
Step 4C. Write Balance Status register: Set Bits 1, 4, 7, and 10
BAL12:1 = 0010 0100 1001
B0113 B0112 B1011 B0110 B0109 B0108
0
0
0
0
0
0
TABLE 69. BALANCE STATUS REGISTER
6’21 B0121 B0120 B0119 B0118 B0117 B0116 B0115 B0114
R/W
1
PAGE
010
ADDRESS
010100
DATA
0
0
0
0
0
0
0
1
XX 0010 0100 1001
B0127 B0126 B0125 B0124 B0123 B0122
0
0
0
0
0
0
Step 2. Write BDDS bit in Device Setup register (turn balancing
functions off during measurement)
BDDS = 1
FN7672 Rev.10.00
May 10, 2018
Page 85 of 105
ISL78600
Step 4D. Write Balance Setup register: Set Balance Status
Pointer = 2
Step 5. Enable balancing using Balance Enable command
TABLE 76. BALANCE ENABLE COMMAND
BSP = 0010 (Balance status pointer = 2)
R/W
0
PAGE
011
ADDRESS
010000
DATA
TABLE 70. BALANCE SETUP REGISTER
00 0000
R/W
1
PAGE
010
ADDRESS
010011
DATA
or enable balancing by setting BEN directly in the Balance Setup
register:
XX XXX0 010X XXXX
X = Do not care
BEN = 1
Step 4E. Write Balance Status register: Set Bits 3, 6, 9, and 12
BAL12:1 = 1001 0010 0100
TABLE 77. BALANCE SETUP REGISTER
R/W
1
PAGE
010
ADDRESS
010011
DATA
XX XX1X XXXX XXXX
TABLE 71. BALANCE STATUS REGISTER
R/W
1
PAGE
010
ADDRESS
010100
DATA
The balance FETs cycle through each instance of the Balance
Status register in a loop, interposing the balance wait time
between each instance. The measured voltage of each cell being
balanced is subtracted from the balance value for that cell at the
end of each Balance Status instance. The process continues until
the Balance Value register for each cell contains zero.
XX 1001 0010 0100
Step 4F. Write Balance Setup register: Set Balance Status
Pointer = 3
BSP = 0011 (Balance status pointer = 3)
TABLE 72. BALANCE SETUP REGISTER
System Registers
R/W
1
PAGE
010
ADDRESS
010011
DATA
System registers contain 14-bits each. All register locations are
memory mapped using a 9-bit address. The MSBs of the address
form a 3-bit page address. Page 1 (3’b001) registers are the
measurement result registers for cell voltages and temperatures.
Page 3 (3’b011) is used for commands. Pages 1 and 3 are not
subject to the checksum calculations. Page addresses 4 and 5
(3’b100 and 3b’101), with the exception of the EEPROM
checksum registers, are reserved for internal functions.
XX XXX0 011X XXXX
X = Do not care
Step 4G. Write Balance Status register: Set Bits 2, 5, 8, and 11
BAL12:1 = 0100 1001 0010
TABLE 73. BALANCE STATUS REGISTER
All Page 2 registers (device configuration registers) and EEPROM
checksum registers are subject to a checksum calculation. The
checksum is calculated in response to the CRC command using a
Multiple Input Shift Register (MISR) error detection technique.
The checksum is tested in response to a Check Register
Checksum command. The occurrence of a checksum error sets
the PAR bit in the Fault Status register and causes a Fault
response accordingly. The normal response to a PAR error is for
the host microcontroller to rewrite the Page 2 register contents. A
PAR fault also causes the device to cease any scanning or cell
balancing activity.
R/W
1
PAGE
010
ADDRESS
010100
DATA
XX 0100 1001 0010
Step 4H. Write Balance Setup register: Set Balance Status
Pointer = 4
BSP = 0100 (Balance status pointer = 4)
TABLE 74. BALANCE SETUP REGISTER
R/W
1
PAGE
010
ADDRESS
010011
DATA
A description of each register is included in “Register
Descriptions” and includes a depiction of the register with bit
names and initialization values at power up, when the EN pin is
toggled and the device receives a Reset Command, or when the
device is reset. Bits which reflect the state of external pins are
notated “Pin” in the initialization space. Bits which reflect the
state of nonvolatile memory bits (EEPROM) are notated “NV” in
the initialization space. Initialization values are shown below
each bit name.
XX XXX0 100X XXXX
X = Do not care
Step 4I. Write Balance Status register: Set bits to all zero to set
the end point for the instances.
BAL12:1 = 0000 0000 0000
TABLE 75. BALANCE STATUS REGISTER
R/W
1
PAGE
010
ADDRESS
010100
DATA
Reserved bits (indicated by gray areas) should be ignored when
reading and should be set to “0” when writing to them.
XX 0000 0000 0000
FN7672 Rev.10.00
May 10, 2018
Page 86 of 105
ISL78600
Register Descriptions
Cell Voltage Data
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
3’b001
Read Only 6’h00 - 6’h0C Measured cell voltage and pack voltage values. Address 001111 accesses all cell and Pack Voltage data
and 6’h0F
with one read operation. See Figure 72D on page 63.
Cell values are output as 13-bit signed integers with the 14th bit (MSB) denoting the sign, (for example,
positive full scale is 14’h1FFF, 8191 decimal, negative full scale is 14’h2000, 8192 decimal). V
14-bit unsigned integer.
is a
BAT
PAGE
REGISTER
ACCESS
ADDR
ADDRESS
6’h00
6’h01
6’h02
6’h03
6’h04
6’h05
6’h06
6’h07
6’h08
6’h09
6’h0A
6’h0B
6’h0C
6’h0F
DESCRIPTION
Read Only 3’b001
VBAT Voltage
HEXvalue – 16384 2 2.5
10
Cell 1 Voltage
Cell 2 Voltage
Cell 3 Voltage
Cell 4 Voltage
Cell 5 Voltage
Cell 6 Voltage
Cell 7 Voltage
Cell 8 Voltage
Cell 9 Voltage
Cell 10 Voltage
Cell 11 Voltage
Cell 12 Voltage
Read all cell voltages
---------------------------------------------------------------------------------------------------
VCx =
VCx =
ifHEXvalue 8191
10
8192
HEXvalue 2 2.5
10
----------------------------------------------------
ifHEXvalue 8191
10
8192
HEXvalue 15.9350784 2.5
10
--------------------------------------------------------------------------------------------------------------------------
=
V
BAT
8192
HEXvalue = Hex to Decimal conversion of the register contents.
10
Temperature Data, Secondary Voltage Reference Data, Scan Count
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
3’b001
See
6’h10 - 6’h16 Measured temperature, Secondary reference, Scan Count. Address 011111 accesses all these data in a
individual
register
and 6’h1F
continuous read (see Figure 72D on page 63.) Temperature and reference values are output as 14-bit
unsigned integers, (such as, full scale is 14’h3FFF (16383 decimal)).
FN7672 Rev.10.00
May 10, 2018
Page 87 of 105
ISL78600
PAGE
ADDR
REGISTER
ADDRESS
ACCESS
DESCRIPTION
Read Only 3’b001
6’h10
Internal temperature reading.
HEXvalue – 9180
10
------------------------------------------------
+ 25
T
C =
INTERNAL
31.9
HEXvalue = Hex to Decimal conversion of the register contents.
10
6’h11
6’h12
6’h13
6’h14
External temperature Input 1 reading.
External temperature Input 2 reading.
External temperature Input 3 reading.
External temperature Input 4 reading.
HEXvalue 2.5
10
--------------------------------------------
=
V
TEMP
16384
T
C = VTEMP R
DIVIDER
EXTERNAL
where R
depends on the external resistor divider circuit that
DIVIDER
includes an NTC thermistor (see Figure 51 on page 32 for an example
external circuit.)
6’h15
6’h16
Reference voltage (raw ADC) value. Use to calculate corrected reference value using reference coefficient data.
See Page 2 data, address 6’h38 – 6’h3A.
Read/
Write
3’h001
Scan Count: Current scan instruction count. Count is incremented each time a scan command is received and
wraps to zero when overflowed. Register can be compared to previous value to confirm scan command receipt.
Bit Designations:
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESERVED
SCN3 SCN2 SCN1 SCN0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read Only 3’h001
6’h1F
Read all: Temperature Data, Secondary Voltage Reference Data, Scan Count (locations 6’h10 - 6’h16)
Fault Registers
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
6’h00 - 6’h05 Fault registers. Fault setup and status information. Address 6’h0F accesses all fault data in a continuous
3’h010
Read/
Write
and 6’h0F
read (daisy chain configuration only). See Figure 72D on page 63.
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION
Read/
Write
3’h010
6’h00
Overvoltage Fault:
Overvoltage fault on cells 12 to 1 correspond with bits OF12 to OF1, respectively.
Default values are all zero.
Bits are set to 1 when faults are detected.
The contents of this register can be reset through a register write (14’h0000).
13
12
11
10
9
8
7
OF8
0
6
OF7
0
5
OF6
0
4
OF5
0
3
OF4
0
2
OF3
0
1
OF2
0
0
OF1
0
RESERVED
0
OF12 OF11 OF10 OF9
0
0
0
0
0
FN7672 Rev.10.00
May 10, 2018
Page 88 of 105
ISL78600
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION (Continued)
Read/
Write
3’h010
3’h010
3’h010
6’h01
6’h02
6’h03
Undervoltage Fault:
Undervoltage fault on cells 12 to 1 correspond with bits UF12 to UF1, respectively.
Default values are all zero.
Bits are set to 1 when faults are detected.
The contents of this register can be reset through a register write (14’h0000).
13
12
11
10
9
8
7
UF8
0
6
UF7
0
5
UF6
0
4
UF5
0
3
UF4
0
2
UF3
0
1
UF2
0
0
UF1
0
RESERVED
0
UF12 UF11 UF10 UF9
0
0
0
0
0
Read/
Write
Open-Wire Fault:
Open Wire fault on Pins VC12 to VC0 correspond with bits OC12 to OC0, respectively.
Default values are all zero.
Bits are set to 1 when faults are detected.
The contents of this register can be reset through a register write (14’h0000).
13
12
11
10
9
8
OC8
0
7
OC7
0
6
OC6
0
5
OC5
0
4
OC4
0
3
OC3
0
2
OC2
0
1
OC1
0
0
OC0
0
RESERVED OC12 OC11 OC10 OC9
0
0
0
0
0
Read/
Write
Fault Setup
These bits control various Fault configurations.
Default values are shown below, as are descriptions of each bit.
13 12 11 10
9
8
7
6
5
4
3
2
1
0
RESERVED TST4 TST3 TST2 TST1 TST0 TOT2 TOT1 TOT0 WSCN SCN3 SCN2 SCN1 SCN0
0
0
0
0
1
0
0
1
1
1
0
0
0
0
SCN0, 1, 2, 3
Scan interval code. Decoded to provide the scan interval setup for the auto scan function.
Initialized to 0000 (16ms scan interval). See Table 14 on page 45.
WSCN
Scan wires timing control. Set to 1 for tracking of the temperature scan interval. Set to 0
for tracking of the cell voltage scan interval above 512ms. Interval is fixed at 512ms for
faster cell scan rates. See Table 14 on page 45.
TOT0, 1, 2
Fault Totalizer code bits. Decoded to provide the required fault totalization. An unbroken
sequence of positive fault results equal to the totalize amount is needed to verify a fault
condition. Initialized to 011 (8 sample totalizing.) See Table 45 on page 76.
This register must be rewritten following an error detection resulting from totalizer
overflow.
TST0
Controls temperature testing of internal IC temperature. Set bit to 1 to enable internal
temperature test. Set to 0 to disable (not recommended). Initialized to 1 (on).
TST1 to TST4
Controls temperature testing on the external temperature inputs 1 to 4, respectively. Set
bit to 1 to enable the corresponding temperature test. Set to 0 to disable. Allows external
inputs to be used for general voltage monitoring without imposing a limit value.
TST1 to TST4 are initialized to 0 (off).
FN7672 Rev.10.00
May 10, 2018
Page 89 of 105
ISL78600
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION (Continued)
Read/
Write
3’h010
6’h04
Fault Status:
The FAULT logic output is an OR function of the bits in this register: the output will be asserted low if any bits in the
Fault Status register are set.
13
MUX
0
12
REG
0
11
REF
0
10
9
8
7
OW
0
6
UV
0
5
OV
0
4
OT
0
3
2
1
0
PAR OVSS OV
WDGF OSC
RESERVED
BAT
0
0
0
0
0
0
0
OSC
Oscillator fault bit. Bit is set in response to a fault on either the 4MHz or 32kHz oscillators.
Note that communications functions can be disrupted by a fault in the 4MHz oscillator.
WDGF
OT
Watchdog timeout fault. Bit is set in response to a watchdog timeout.
Over-temperature fault. ‘OR’ of over-temperature fault bits: TFLT0 to TFLT4. This bit is
latched. The bits in the over-temperature fault register must first be reset before this bit
can be reset. Reset by writing 14’h0000 to this register.
OV
UV
Overvoltage fault. ‘OR’ of overvoltage fault bits: OF1 to OF12. This bit is latched. The bits
in the Overvoltage Fault register must be reset before this bit can be reset. Reset by
writing 14’h0000 to this register.
Undervoltage fault. ‘OR’ of undervoltage fault bits: UF1 to UF12. This bit is latched. The
bits in the Undervoltage Fault register must be reset before this bit can be reset. Reset
by writing 14’h0000 to this register.
OW
Open-wire fault. ‘OR’ of open-wire fault bits: OC0 to OC12. This bit is latched. The bits in
the open-wire fault register must be reset before this bit can be reset. Reset by writing
14’h0000 to this register.
OV
Open-wire fault on VBAT connection. Bit set to 1 when a fault is detected. Can be reset
through a register write (14’h0000).
BAT
OVSS
PAR
Open wire fault on VSS connection. Bit set to 1 when a fault is detected. Can be reset
through a register write (14’h0000).
Register checksum (Parity) error. This bit is set in response to a register checksum error.
The checksum is calculated and stored in response to a Calc Register Checksum
command and acts on the contents of all Page 2 registers. The Check Register
Checksum command is used to repeat the calculation and compare the results to the
stored value. The PAR bit is then set if the two results are not equal. This bit is not set in
response to a nonvolatile EEPROM memory checksum error. See table on page 97.
REF
Voltage reference fault. This bit is set if the voltage reference value is outside its
“power-good” range.
REG
Voltage regulator fault. This bit is set if a voltage regulator value (V3P3, VCC or V2P5) is
outside its “power-good” range.
MUX
Temperature multiplexer error. This bit is set if the VCC loopback check returns a fault.
The VCC loopback check is performed at the end of each temperature scan.
Read/
Write
3’h010
6’h05
Cell Setup:
Default values are shown below, as are descriptions of each bit.
13
FFSN
0
12
11
10
C11
0
9
C10
0
8
C9
0
7
C8
0
6
C7
0
5
C6
0
4
C5
0
3
C4
0
2
C3
0
1
C2
0
0
C1
0
FFSP C12
0
0
C1 to C12
Enable/disable cell overvoltage, undervoltage and open-wire detection on Cell 1 to 12,
respectively. Set to 1 to disable OV/UV and open wire tests.
FFSP
FFSN
Force ADC input to Full Scale Positive. All cell scan readings forced to 14'h1FFF. All
temperature scan readings forced to 14'h3FFF.
Force ADC input to Full Scale Negative. All cell scan readings forced to 14'h2000. All
temperature scan readings forced to 14'h0000.
NOTE: The ADC input functions normally if both FFSN and FFSP are set to '1' but this setting is not supported.
FN7672 Rev.10.00
May 10, 2018
Page 90 of 105
ISL78600
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION (Continued)
Read/
Write
3’h010
6’h06
Over-temperature Fault:
Over-temperature fault on Cells 12 to 1 correspond with bits OF12 to OF1, respectively.
Default values are all zero.
Bits are set to 1 when fault are detected.
The contents of this register can be reset through a register write (14’h0000).
13
12
0
11
0
10
9
8
7
6
5
4
3
2
1
0
RESERVED
TFLT4 TFLT3 TFLT2 TFLT1 TFLT0
0
0
0
0
0
0
0
0
0
0
0
0
TFLT0
TFLT1 - TFLT4
Internal over-temperature fault. Bit set to 1 when a fault is detected. Can be reset through
a register write (14’h0000).
External over-temperature inputs 1 to 4 (respectively.) Bit set to 1 when a fault is
detected. Can be reset through a register write (14’h0000).
Read Only 3’h010
6’h0F
Read all Fault and Cell Setup data from locations: 6’h00 - 6’h06. See Figure 72D on page 63.
Setup Registers
BASE ADDR
ADDRESS
(PAGE)
ACCESS
RANGE
DESCRIPTION
3’b010
6’h10 - 6’h1D Device Setup registers. All device setup data.
and 6’h1F
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION
Read/
Write
3’b010
3’b010
3’b010
6’h10
6’h11
6’h12
Overvoltage Limit:
Overvoltage Limit Value
Overvoltage limit is compared to the measured values for Cells 1 to 12 to test for an Overvoltage condition at any of
the cells.
Bit 0 is the LSB, Bit 12 is the MSB. Bit 13 is not used and must be set to 0.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESER OV12 OV11 OV10
VED
OV9
OV8
OV7
OV6
OV5
OV4
OV3
OV2
OV1
OV0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/
Write
Undervoltage Limit:
Undervoltage Limit Value
Undervoltage limit is compared to the measured values for Cells 1 to 12 to test for an undervoltage condition at any
of the cells.
Bit 0 is the LSB, Bit 12 is the MSB. Bit 13 is not used and must be set to 0.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESER UV12 UV11 UV10
VED
UV9
UV8
UV7
UV6
UV5
UV4
UV3
UV2
UV1
UV0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/
Write
External Temperature Limit:
Over-temperature Limit Value
Over-temperature limit is compared to the measured values for external temperatures 1 to 4 to test for an
over-temperature condition at any input. The temperature limit assumes NTC temperature measurement devices
(i.e., an over-temperature condition is indicated by a temperature reading below the limit value).
Bit 0 is the LSB, Bit 13 is the MSB.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
ETL13 ETL12 ETL11 ETL10 ETL9 ETL8 ETL7 ETL6 ETL5 ETL4 ETL3 ETL2 ETL1 ETL0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FN7672 Rev.10.00
May 10, 2018
Page 91 of 105
ISL78600
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION (Continued)
Read/
Write
3’b010
6’h13
Balance Setup:
Default values are shown below, as are descriptions of each bit.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESERVED
BEN BSP3 BSP2 BSP1 BSP0 BWT2 BWT1 BWT0 BMD1 BMD0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
BMD0, 1
Balance mode. These bits set balance mode.
BMD1 BMD0
Mode
OFF
0
0
1
1
0
1
0
1
Manual
Timed
Auto
BWT0, 1, 2
Balance wait time. Register contents are decoded to provide the required wait time
between device balancing. This is to assist with thermal management and is used with the
Auto Balance mode. See Table 19 on page 49.
BSP0, 1, 2, 3
Balance Status register pointer. Points to one of the 13 incidents of the Balance Status
register. Balance Status register 0 is used for Manual Balance mode and Timed Balance
mode. Balance status registers 1 to 12 are used for Auto Balance mode. Reads and writes
to the Balance Status register are accomplished by first configuring the Balance Status
register pointer (such as, to read (write) Balance Status register 5, load 0101 to the Balance
Status register pointer, then read (write) to the Balance Status register). See Table 19 on
page 49.
BEN
Balance enable. Set to ‘1’ to enable balancing. ‘0’ inhibits balancing. Setting or clearing this
bit does not affect any other register contents. Balance Enable and Balance Inhibit
commands are provided to allow control of this function without requiring a register write.
These commands have the same effect as setting this bit directly. This bit is cleared
automatically when balancing is complete and the EOB bit (see “6’h19” on page 93) is set.
Read/
Write
3’b010
6’h14
Balance Status
The Balance Status register is a multiple incidence register controlled by the BSP0-4 bits in the Balance setup
register. See Table 19 on page 49.
Bit 0 is the LSB, Bit 11 is the MSB.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESERVED
BAL
12
BAL
11
BAL
10
BAL
8
BAL
8
BAL
7
BAL
6
BAL
5
BAL
4
BAL
3
BAL
2
BAL
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
BAL1 to BAL12
Cell 1 to Cell 12 balance control, respectively. A bit set to 1 enables balance control (turns
FET on) of the corresponding cell. Writing this bit enables balance output for the current
incidence of the Balance Status register for the cells corresponding to the particular bits,
depending on the condition of BEN in the Balance Setup register. Read this bit to determine
the current status of each cell’s balance control.
Read/
Write
3’b010
6’h15
Watchdog/Balance Time
Defaults are shown below:
13 12 11
10
9
8
7
6
5
4
3
2
1
0
BTM6 BTM5 BTM4 BTM3 BTM2 BTM1 BTM0 WDG6 WDG5 WDG4 WDG3 WDG2 WDG1 WDG0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
WDG0 to WDG6
Watchdog timeout setting. Decoded to provide the time out value for the watchdog function.
See “Watchdog Function” on page 78 for details. The watchdog can only be disabled (set to
7’h00) if the watchdog password is set. The watchdog setting can be changed to a nonzero
value without writing to the watchdog password. Initialized to 7’h7F (128 minutes).
BTM0 to BTM6
Balance timeout setting. Decoded to provide the time out value for Timed Balance mode
and Auto Balance mode. Initialized to 7’00 (Disabled). See Table 21 on page 51.
FN7672 Rev.10.00
May 10, 2018
Page 92 of 105
ISL78600
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION (Continued)
Read/
Write
3’b010
6’h16
6’h17
User Register
28 bits of register space arranged as 2 x 14 bits available for user data. These registers have no effect on the
operation of the ISL78600. These registers are included in the register checksum function.
Read Only 3’b010
6’h18
Comms Setup
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESERVED
CRAT1 CRAT0 CSEL CSEL SIZE
SIZE
2
SIZE
1
SIZE ADDR ADDR ADDR ADDR
2
1
3
0
0
3
2
1
0
0
0
COMS COMS COMS COMS
RATE1 RATE0 SEL2 SEL1
0
0
0
0
0
0
0
pin
pin
pin
pin
ADDR0-3
Device stack address. The stack address (device position in the stack) is determined
automatically by the device in response to an “Identify” command. The resulting address is
stored in ADDR0-3 and is used internally for communications paring and sequencing. The
stack address can be read by the user but not written to.
SIZE0-3
Device stack size (top stack device address). Corresponds to the number of devices in the
stack. The stack size is determined automatically by the stack devices in response to an
“Identify” command. The resulting number is stored in SIZE0-3 and is used internally for
communications paring and sequencing. The stack size can be read by the user but not
written to.
CSEL1, 2
CRAT0, 1
Communications setup bits. These bits reflect the state of the COMMS SELECT 1, 2 pins and
determine the operating mode of the communications ports. See Table 6 on page 30.
Communications rate bits. These bits reflect the state of the COMMS RATE 0,1 pins and
determine the bit rate of the daisy chain communications system. Table 7 on page 31.
Read/
Write
3’b010
6’h19
Device Setup
13 12
WP5 WP4 WP3 WP2 WP1 WP0 BDDS RSVD ISCN SCAN EOB RSVD PIN37 PIN39
11
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
Pin
Pin
PIN37, PIN39
EOB
These bits indicate the signal level on pin 37 and pin 39 of the device.
End Of Balance. This bit is set by the device when balancing is complete. This function is
used in the Timed Balance mode and Auto Balance mode. The BEN bit is cleared as a result
of this bit being set. Initialized to 1.
SCAN
Scan Continuous mode. This bit is set in response to a Scan Continuous command and
cleared by a Scan Inhibit command.
ISCN
Set wire scan current source/sink values. Set to 0 for 150µA. Set to 1 for 1mA.
BDDS
Balance condition during measurement. Controls the balance condition in Scan Continuous
mode and Auto Balance mode. Set to 1 to have balancing functions turned off 10ms prior
to and during cell voltage measurement. Set to 0 for normal operation (balancing functions
not affected by measurement).
WP5:0
Watchdog disable password. These bits must be set to 6’h3A (111010) before the
watchdog can be disabled. Disable watchdog by writing 7’h00 to the watchdog bits.
Read Only 3’b010
Value set in
6’h1A
Internal Temperature Limit
Bit 0 is the LSB, Bit 13 is the MSB.
EEPROM
13
12
11
10
9
8
7
6
5
4
3
2
1
0
ITL
13
ITL
12
ITL
11
ITL
10
ITL
8
ITL
8
ITL
7
ITL
6
ITL
5
ITL
4
ITL
3
ITL
2
ITL
1
ITL
0
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
ITL1 to ITL12
IC over-temperature limit value. Over-temperature limit is compared to the measured
values for internal IC temperature to test for an over-temperature condition. The internal
temperature limit value is stored in nonvolatile memory during test and loaded to these
register bits at power up. The register contents can be read by the user but not written to.
Read Only 3’b010
6’h1B
6’h1C
Serial Number
The 28b serial number programmed in nonvolatile memory during factory test is mirrored to these 2 x 14 bit
registers. The serial number can be read at any time but can not be written.
FN7672 Rev.10.00
May 10, 2018
Page 93 of 105
ISL78600
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION (Continued)
Read Only 3’b010
Value set in
6’h1D
Trim Voltages
EEPROM
13
TV5
NV
12
TV4
NV
11
TV3
NV
10
TV2
NV
9
8
7
6
5
4
3
2
1
0
TV1
NV
TV0
NV
RESERVED
Ignore the contents of these bits
TV5:0
Trim voltage (VNOM). The nominal cell voltage is programmed to nonvolatile memory during
test and loaded to the Trim Voltage register at power up. The VNOM value is a 7-bit
representation of the 0V to 5V cell voltage input range with 50 (7’h32) representing 5V
(such as, LSB = 0.1V). The parts are additionally marked with the trim voltage by the
addition of a two digit code to the part number such as, 3.3V is denoted by the code 33. (1
bit per 0.1V of trim voltage, so 0 to 50 decimal covers the full range.)
Read Only 3’h010
6’h1F
Read all Setup data from locations: 6’h10 - 6’h1D. See Figure 72D on page 63.
Cell Balance Registers
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
3’b010
Read/
Write
6’h20 - 6’h37 Cell balance registers. These registers are loaded with data related to change in SOC desired for each cell.
This data is then used during Auto Balance mode. The data value is decremented with each successive ADC
sample until a zero value is reached. The register space is arranged as 2 x 14-bit per cell for 24 x 14-bit total.
The registers are cleared at device power up or by a Reset command. See “Auto Balance Mode” on page 51.
PAGE
REGISTER
ACCESS
ADDR
ADDRESS
6’h20
6’h21
~
DESCRIPTION
Read/
Write
3’b010
Cell 1 balance value Bits 0 to 13.
Cell 1 balance value Bits 14 to 27.
6’h36
6’h37
Cell 12 balance value Bits 0 to 13.
Cell 12 balance value Bits 14 to 27.
Reference Coefficient Registers
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
3’b010
Read Only 6’h38 - 6’h3A Reference Coefficients.
Bit 13 is the MSB, Bit 0 is the LSB
PAGE
ADDR
REGISTER
ADDRESS
ACCESS
DESCRIPTION
Read Only 3’b010
Value set in
EEPROM
6’h38
Reference Coefficient C
Reference calibration coefficient C LSB. Use with coefficients A and B and the measured reference value to obtain
the compensated reference measurement. This result can be compared to limits given in the “Electrical
Specifications” on page 9 table to check that the reference is within limits. The register contents can be read by the
user but not written to.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RCC
13
RCC
12
RCC
11
RCC
10
RCC
9
RCC
8
RCC
7
RCC
6
RCC
5
RCC
4
RCC
3
RCC
2
RCC
1
RCC
0
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
FN7672 Rev.10.00
May 10, 2018
Page 94 of 105
ISL78600
PAGE
ADDR
REGISTER
ADDRESS
ACCESS
DESCRIPTION
Read Only 3’b010
6’h39
Reference Coefficient B
Reference calibration coefficient B LSB. Use with coefficients A and C and the measured reference value to obtain
the compensated reference measurement. This result can be compared to limits given in the “Electrical
Specifications” on page 9 table to check that the reference is within limits. The register contents can be read by the
user but not written to.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RCB
13
RCB
12
RCB
11
RCB
10
RCB
9
RCB
8
RCB
7
RCB
6
RCB
5
RCB
4
RCB
3
RCB
2
RCB
1
RCB
0
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
NV
Read Only 3’b010
6’h3A
Reference Coefficient A
Reference calibration coefficient A LSB. Use with coefficients B and C and the measured reference value to obtain
the compensated reference measurement. This result can be compared to limits given in the “Electrical
Specifications” on page 9 table to check that the reference is within limits. The register contents can be read by the
user but not written to.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RCA
8
RCA
7
RCA
6
RCA
5
RCA
4
RCA
3
RCA
2
RCA
1
RCA
0
RESERVED
NV
NV
NV
NV
NV
NV
NV
NV
NV
Ignore the content of these bits
Cells In Balance Register
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
3’b010
Read Only
6’h3B
Cells In Balance
PAGE REGISTER
ADDR ADDRESS
ACCESS
DESCRIPTION
Cells Balance Enabled (Valid for non-daisy chain configuration only).
Read Only 3’b010
6’h3B
This register reports the current condition of the cell balance outputs.
Bit 0 is the LSB, Bit 11 is the MSB.
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESERVED
CBEN CBEN CBEN CBEN CBEN CBEN CBEN CBEN CBEN CBEN CBEN CBEN
12
0
11
0
10
0
8
0
8
0
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
BALI1 to BALI12
Indicates the current balancing status of Cell 1 to Cell 12 (respectively). “1” indicates
balancing is enabled for this cell. “0” indicates that balancing is turned off.
Device Commands
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
3’b011
Read Only 6’h01 - 6’h14 Device commands. Actions and communications administration. Not physical registers but memory
mapped device commands. Commands from host and device responses are all configured as reads (BASE
ADDR MSB = 0).
Write operations breaks the communication rules and produce NAK from the target device.
FN7672 Rev.10.00
May 10, 2018
Page 95 of 105
ISL78600
PAGE
ADDR
REGISTER
ADDRESS
DESCRIPTION
3’b011
6’h01
6’h02
Scan Voltages. Device responds by scanning V
and all 12 cell voltages and storing the results in local memory.
BAT
Scan Temperatures. Device responds by scanning external temperature inputs, internal temperature, and the secondary
voltage reference, and storing the results in local memory.
6’h03
Scan Mixed. Device responds by scanning V , cell and ExT1 voltages and storing the results in local memory. The ExT1
BAT
measurement is performed in the middle of the cell voltage scans to minimize measurement latency between the cell
voltages and the voltage on ExT1.
6’h04
6’h05
Scan Wires. Device responds by scanning for pin connection faults and stores the results in local memory.
Scan All. Device responds by performing the functions of the Scan Voltages, Scan Temperatures, and Scan Wires commands
in sequence. Results are stored in local memory.
6’h06
6’h07
6’h08
Scan Continuous. Places the device in Scan Continuous mode by setting the Device Setup register SCAN bit.
Scan Inhibit. Stops Scan Continuous mode by clearing the Device Setup register SCAN bit.
Measure. Device responds by measuring a targeted single parameter (cell voltage/V /external or internal temperatures
BAT
or secondary voltage reference).
6’h09
Identify. Special mode function used to determine device stack position and address. Devices record their own stack address
and the total number of devices in the stack. See “Identify Command” on page 53 for details.
6’h0A
6’h0B
Sleep. Places the part in Sleep mode (wakeup through daisy comms). See “Communication Timing” on page 63.
NAK. Device response if communications is not recognized. The device responds NAK down the daisy chain to the host
microcontroller. The host microcontroller typically retransmits on receiving a NAK.
6’h0C
6’h0E
ACK. Used by host microcontroller to verify communications without changing anything. Devices respond with ACK.
Comms Failure. Used in daisy chain implementations to communicate comms failure. If a communication is not
acknowledged by a stack device, the last stack device that did receive the communication responds with Comms Failure.
This is part of the communications integrity checking. Devices downstream of a communications fault are alerted to the fault
condition by the watchdog function.
6’h0F
Wakeup. Used in daisy chain implementations to wake up a sleeping stack of devices. The Wakeup command is sent to the
Bottom stack device (Master device) through SPI. The Master device then wakes up the rest of the stack by transmitting a
low frequency clock. The Top stack device responds ACK once it is awake. See “Wakeup Command” on page 47.
6’h10
6’h11
6’h12
Balance Enable. Enables cell balancing by setting BEN. Can be used to enable cell balancing on all devices simultaneously
using the address All Stack Address 1111.
Balance Inhibit. Disables cell balancing by clearing BEN. Can be used to disable cell balancing on all devices simultaneously
using the address All Stack Address 1111.
Reset. Resets all digital registers to its power-up state (i.e., reloads the factory programmed configuration data from
non-volatile memory. Stops all scan and balancing activity. Daisy chain devices must be reset in sequence starting with the
Top stack device and proceeding down the stack to the Bottom (Master) device. The Reset command must be followed by an
Identify command (daisy chain configuration) before volatile registers can be re-written.
6’h13
6’h14
Calculate register checksum. Calculates the checksum value for the current Page 2 register contents (registers with base
address 0010). See “System Hardware Connection” on page 25.
Check register checksum. Verifies the register contents are correct for the current checksum. An incorrect result sets the PAR
bit in the Fault status register which starts a standard fault response. See “System Hardware Connection” on page 25.
FN7672 Rev.10.00
May 10, 2018
Page 96 of 105
ISL78600
factory testing. The MISR Shadow register contains the
checksum value that is calculated each time the nonvolatile
memory is loaded to shadow registers, either after a power cycle
or after a device reset. See “Fault Diagnostics” on page 80.
Nonvolatile Memory (EEPROM) Checksum
A checksum is provided to verify the contents of EEPROM
memory. Two registers are provided. The MISR register (below)
contains the correct checksum value, which is calculated during
BASE ADDR
(PAGE)
ADDRESS
RANGE
ACCESS
DESCRIPTION
100
Read Only
6’h3F
Nonvolatile memory Multiple Input Shift Register (MISR) register. This checksum value for the nonvolatile
memory contents. It is programmed during factory testing.
101
Read Only
6’h00
MISR shadow register checksum value. This value is calculated when shadow registers are loaded from
nonvolatile memory either after a power cycle or a reset.
Register Map
R/W + PAGE
BIT 7
VB7
BIT 6
VB6
BIT 5
BIT 13
VB5
BIT 4
BIT 12
VB4
BIT 3
BIT 11
VB3
BIT 2
BIT 10
VB2
BIT 1
BIT 9
VB1
BIT 0
BIT 8
VB0
READ WRITE
0001
ADDRESS
000000
REGISTER NAME
Voltage
V
BAT
VB13
VB12
C1V4
VB11
VB10
VB9
VB8
0001
0001
0001
0001
0001
0001
0001
0001
0001
0001
0001
0001
0001
000001
000010
000011
000100
000101
000110
000111
001000
001001
001010
001011
001100
001111
Cell 1 Voltage
Cell 2 Voltage
Cell 3 Voltage
Cell 4 Voltage
Cell 5 Voltage
Cell 6 Voltage
Cell 7 Voltage
Cell 8 Voltage
Cell 9 Voltage
Cell 10 Voltage
Cell 11 Voltage
Cell 12 Voltage
All Cell Voltage Data
C1V7
C2V7
C3V7
C4V7
C5V7
C6V7
C7V7
C8V7
C9V7
C1V6
C2V6
C3V6
C4V6
C5V6
C6V6
C7V6
C8V6
C9V6
C1V5
C1V3
C1V2
C1V1
C1V9
C2V1
C2V9
C3V1
C3V9
C4V1
C4V9
C5V1
C5V9
C6V1
C6V9
C7V1
C7V9
C8V1
C8V9
C9V1
C9V9
C1V0
C1V8
C2V0
C2V8
C3V0
C3V8
C4V0
C4V8
C5V0
C5V8
C6V0
C6V8
C7V0
C7V8
C8V0
C8V8
C9V0
C9V8
C1V13
C2V5
C1V12
C2V4
C1V11
C2V3
C1V10
C2V2
C2V13
C3V5
C2V12
C3V4
C2V11
C3V3
C2V10
C3V2
C3V13
C4V5
C3V12
C4V4
C3V11
C4V3
C3V10
C4V2
C4V13
C5V5
C4V12
C5V4
C4V11
C5V3
C4V10
C5V2
C5V13
C6V5
C5V12
C6V4
C5V11
C6V3
C5V10
C6V2
C6V13
C7V5
C6V12
C7V4
C6V11
C7V3
C6V10
C7V2
C7V13
C8V5
C7V12
C8V4
C7V11
C8V3
C7V10
C8V2
C8V13
C9V5
C8V12
C9V4
C8V11
C9V3
C8V10
C9V2
C9V13
C10V5
C9V12
C10V4
C9V11
C10V3
C9V10
C10V2
C10V7 C10V6
C11V7 C11V6
C12V7 C12V6
C10V1 C10V0
C10V13 C10V12 C10V11 C10V10 C10V9 C10V8
C11V5 C11V4 C11V3 C11V2 C11V1 C11V0
C11V13 C11V12 C11V11 C11V10 C11V9 C11V8
C12V5 C12V4 C12V3 C12V2 C12V1 C12V0
C12V13 C12V12 C12V11 C12V10 C12V9 C12V8
Daisy chain configuration only. This command returns all Page 1 data from address
6’h00 through 6’h0C in a single data stream. See “Communication Sequences” on
page 59 and “System Out of Limit Detection” on page 75. See example in Figure
72D on page 63.
FN7672 Rev.10.00
May 10, 2018
Page 97 of 105
ISL78600
Register Map(Continued)
R/W + PAGE
BIT 7
ICT7
BIT 6
ICT6
BIT 5
BIT 13
ICT5
BIT 4
BIT 12
ICT4
BIT 3
BIT 11
ICT3
BIT 2
BIT 10
ICT2
BIT 1
BIT 9
BIT 0
BIT 8
ICT0
READ WRITE
0001
ADDRESS
010000
REGISTER NAME
IC Temperature
ICT1
ICT13
ET1V5
ICT12
ET1V4
ICT11
ET1V3
ICT10
ET1V2
ICT9
ICT8
0001
0001
0001
0001
0001
0001
0001
010001
010010
010011
010100
010101
010110
011111
External Temperature Input 1
Voltage (ExT1 pin)
ET1V7 ET1V6
ET2V7 ET2V6
ET3V7 ET3V6
ET4V7 ET4V6
ET1V1
ET1V9
ET2V1
ET2V9
ET3V1
ET3V9
ET4V1
ET4V9
RV1
ET1V0
ET1V8
ET2V0
ET2V8
ET3V0
ET3V8
ET4V0
ET4V8
RV0
ET1V13 ET1V12 ET1V11 ET1V10
ET2V5 ET2V4 ET2V3 ET2V2
ET2V13 ET2V12 ET2V11 ET2V10
ET3V5 ET3V4 ET3V3 ET3V2
ET3V13 ET3V12 ET3V11 ET3V10
ET4V5 ET4V4 ET4V3 ET4V2
ET4V13 ET4V12 ET4V11 ET4V10
External Temperature Input 2
Voltage (ExT2 pin)
External Temperature Input 3
Voltage (ExT3 pin)
External Temperature Input 4
Voltage (ExT4 pin)
Secondary Reference Voltage
Scan Count
RV7
RV6
RV5
RV4
RV3
RV11
SCN3
RV2
RV10
SCN2
RV13
RV12
RV9
RV8
SCN1
SCN0
All Temperature Data
Daisy chain configuration only. This command returns all Page 1 data from address
6’h10 through 6’h16 in a single data stream. See “Communication Sequences” on
page 59 and “System Out of Limit Detection” on page 75.
0010
0010
0010
0010
0010
0010
0010
0010
1010
1010
1010
1010
1010
1010
1010
000000
000001
000010
000011
000100
000101
000110
001111
Overvoltage Fault
Undervoltage Fault
Open-Wire Fault
Fault Setup
OF8
UF8
OC7
TOT2
OW
OF7
UF7
OC6
TOT1
UV
OF6
OF5
OF4
OF12
UF4
OF3
OF11
UF3
OF2
OF10
UF2
OF1
OF9
UF1
UF9
OC0
OC8
SCN0
TTST0
0
UF6
UF5
UF12
OC3
UF11
OC2
UF10
OC1
OC9
SCN1
TTST1
0
OC5
TOT0
OC4
OC12
WSCN
TTST4
OT
OC11
SCN3
TTST3
WDGF
REF
OC10
SCN2
TTST2
OSC
Fault Status
OV
MUX
C6
REG
PAR
OVSS
C2
OV
BAT
Cell Setup
C8
C7
C5
C4
C3
C1
FFSN
FFSP
TFLT4
C12
C11
C10
C9
Over-Temperature Fault
All Fault Data
TFLT3
TFLT2
TFLT1
TFLT0
Daisy chain configuration only. This command returns all Page 2 data from address
6’h00 through 6’h06 in a single data stream. See “Communication Sequences” on
page 59 and “System Out of Limit Detection” on page 75.
0010
0010
0010
1010
1010
1010
010000
010001
010010
Overvoltage Limit
Undervoltage Limit
External Temp Limit
OV7
OV6
OV5
OV13
UV5
OV4
OV12
UV4
OV3
OV11
UV3
OV2
OV10
UV2
OV1
OV9
UV1
UV9
ETL1
ETL9
OV0
OV8
UV0
UV8
ETL0
ETL8
UV7
UV6
UV13
ETL5
ETL13
UV12
ETL4
ETL12
UV11
ETL3
ETL11
UV10
ETL2
ETL10
ETL7
ETL6
FN7672 Rev.10.00
May 10, 2018
Page 98 of 105
ISL78600
Register Map(Continued)
R/W + PAGE
BIT 7
BSP2
BIT 6
BSP1
BAL7
BIT 5
BIT 13
BSP0
BIT 4
BIT 12
BWT2
BIT 3
BIT 11
BWT1
BIT 2
BIT 10
BWT0
BIT 1
BIT 9
BMD1
BEN
BIT 0
BIT 8
BMD0
BSP3
BAL1
BAL9
WDG0
BTM1
UR0
READ WRITE
ADDRESS
010011
REGISTER NAME
Balance Setup
0010
0010
0010
0010
0010
0010
0010
0010
0010
0010
0010
0010
1010
1010
1010
1010
1010
010100
010101
010110
010111
011000
011001
011010
011011
011100
011101
011111
Balance Status (Cells to Balance) BAL8
BAL6
BAL5
BAL4
BAL12
WDG3
BTM4
UR3
BAL3
BAL11
WDG2
BTM3
UR2
BAL2
BAL10
WDG1
BTM2
UR1
Watchdog/Balance Time
User Register
BTM0 WDG6
WDG5
BTM6
UR5
WDG4
BTM5
UR4
UR7
UR21
SIZE3
BDDS
ITL7
UR6
UR20
SIZE2
0
UR13
UR19
UR27
SIZE1
UR12
UR18
UR26
SIZE0
UR11
UR17
UR25
ADDR3
CRAT1
EOB
UR10
UR16
UR24
UR9
UR8
User Register
UR15
UR23
UR14
UR22
Comms Setup
ADDR2 ADDR1 ADDR0
CRAT0
0
CSEL2
Pin 37
WP1
ITL1
CSEL1
Pin 39
WP0
ITL0
1010
Device Setup
ISCN
WP5
ITL5
SCAN
WP4
ITL4
WP3
WP2
ITL2
Internal Temp Limit
Serial Number 0
Serial Number 1
Trim Voltage
ITL6
SN6
SN20
ITL3
ITL13
SN5
ITL12
SN4
ITL11
SN3
ITL10
SN2
ITL9
ITL8
SN7
SN1
SN0
SN13
SN19
SN27
SN12
SN18
SN26
SN11
SN17
SN25
SN10
SN16
SN24
SN9
SN8
SN21
SN15
SN23
SN14
SN22
RESERVED
TV5
TV4
TV3
TV2
TV1
TV0
All Setup Data
Daisy chain configuration only. This command returns all Page 2 data from address
6’h10 through 6’h1D in a single data stream. See “Communication Sequences” on
page 59 and “System Out of Limit Detection” on page 75.
0010
0010
0010
0010
1010
1010
1010
1010
100000
100001
100010
100011
Cell 1 Balance Value 0
Cell 1 Balance Value 1
Cell 2 Balance Value 0
Cell 2 Balance Value 1
B0107 B0106
B0105
B0113
B0104
B0112
B0118
B0126
B0204
B0212
B0218
B0226
B0103
B1011
B0117
B0125
B0203
B1011
B0217
B0225
B0102
B0110
B0116
B0124
B0202
B0210
B0216
B0224
B0101 B0100
B0109 B0108
B0115 B0114
B0123 B0122
B0201 B0200
B0209 B0208
B0215 B0214
B0223 B0222
B0121 B0120 B0119
B0127
B0207 B0206 B0205
B0213
B0221 B0220 B0219
B0227
~
~
~
0010
0010
1010
110111
Cell 12 Balance Value 1
B1221 B1220 B1219
B1227
B1218
B1226
RCC4
B1217
B1225
RCC3
B1216
B1224
RCC2
B1215 B1214
B1223 B1222
111000
Reference Coefficient C
RCC7
RCC6
RCC5
RCC1
RCC9
RCC0
RCC8
RCC13
RCC12
RCC11
RCC10
FN7672 Rev.10.00
May 10, 2018
Page 99 of 105
ISL78600
Register Map(Continued)
R/W + PAGE
BIT 7
RCB7
RCA2
BIT 6
RCB6
RCA1
BIT 5
BIT 13
RCB5
RCB13
RCA0
RCA8
BIT 4
BIT 12
RCB4
BIT 3
BIT 11
RCB3
BIT 2
BIT 10
BIT 1
BIT 9
RCB1
RCB9
BIT 0
BIT 8
RCB0
RCB8
READ WRITE
0010
ADDRESS
111001
REGISTER NAME
Reference Coefficient B
RCB2
RCB12
RCB11
RCB10
RESERVED
RCA5
0010
0010
111010
111011
Reference Coefficient A
RCA7
RCA6
RCA4
BAL2
RCA3
Cells Balance Enabled (Valid in
Stand-Alone Only. Register read
responds NAK otherwise.)
CBEN8 CBEN7 CBEN6
CBEN5
CBEN4
CBEN3
CBEN1
CBEN12 CBEN11 CBEN10 CBEN9
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
0011
000001
000010
000011
000100
000101
000110
000111
001000
001001
001010
001011
001100
001110
001111
010000
010001
010010
010011
010100
Scan Voltages
Scan Temperatures
Scan Mixed
Scan Wires
Scan All
Scan Continuous
Scan Inhibit
Measure
Identify
Sleep
NAK
ACK
Comms Failure
Wakeup
Balance Enable
Balance Inhibit
Reset
Calc Register Checksum
Check Register Checksum
0100
0101
111111
000000
EEPROM MISR Data Register
MISR Calculated Checksum
14-bit MISR EEPROM checksum value. Programmed during test.
14-bit shadow register MISR checksum value. Calculated when shadow registers are
loaded from nonvolatile memory
FN7672 Rev.10.00
May 10, 2018
Page 100 of 105
ISL78600
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision.
DATE
REVISION
CHANGE
May 10, 2018
FN7672.10
Updated the Ordering Information table (removed Note 4, added tape and reel quantity column, added
ISL78600EVKIT1Z, and updated Note 1).
Changed the following Abs Max values from 4.1V to 5.5V (BASE, DIN, SCLK, CS, DOUT, DATA READY, COMMS
SELECT n, TEMPREG, REF, V3P3, VCC, FAULT, COMMS RATE n, EN, VDDEXT).
Updated Figure 42 and Figure 43 on page 27, Figure 44 and Figure 45 on page 28, Figure 52 on page 34,
Figure 56 on page 38, and Figure 57 on page 39 to reflect new recommended input filter circuits.
Added Table 2 on page 27 and Table 3 on page 28 and updated Table 11 on page 41.
Added a paragraph in the “Daisy Chain Circuits” section page 31 that discusses board capacitance effect on
capacitor selection and changed Table 8 on page 31 and Table 9 on page 32 to match.
Re-arranged the specifications for V
to group like voltage ranges.
CELL
Re-arranged the specifications for VCELL/VBAT board level accuracy Table (page 17).
Added Board Level accuracy table for various cell chemistry voltages (page 18)
Updated Figure 46 and added Table 5 (No actual changes to content).
Updated Figure 49 and Table 8 (No actual changes to content).
Updated Figure 50 and Table 9 (No actual changes to content).
Updated Figure 51 and Table 10 (No actual changes to content).
Removed About Intersil section and updated the disclaimer.
May 23, 2017
Feb10, 2017
FN7672.9
FN7672.8
Added Section “Daisy Chain Receive Buffer” on page 58.
Added Figure 66 on page 58 and text to clarify Buffer over-flow.
In Figures 63 to 65 and Figure 70, removed a 30us time reference between CS and first SPI clock.
Clarified that “Cells in Balance” register is available only during Stand-Alone operation (page 52, page 95,
and page 100).
Clarified that Scan Continuous functions during Manual, Timed, and Auto Balance modes (page 45 and
page 52).
Clarified that the “BDDS” bit function in Timed and Auto Balance modes (page 52).
Clarified the calculation of internal and external temperature values (page 87).
Updated POD Q64.10x10D from rev 2 to rev 3. Changes:
Added land pattern back in (as in rev 1), but removed the exposed pad.
Apr 12, 2016
FN7672.7
Added AEC-Q100 to Features on page 1.
Updated Ordering Information table on page 4 by adding Tape and Reel option in note and removing
evaluation board FG until release.
Added Table 1 on page 4.
Added “Performance Characteristics” on page 17.
Pages 17-22: Updated Performance Curves.
Updated “Absolute Maximum Ratings” on page 8 ESD Ratings testing information from JESD to AEC-Q100
and changed CDM from 500V to 2kV.
Changed Thermal Information Tja from “49” to “42” and updated pb-free reflow profile to standard
Pages 7-13: Changed selected electrical specifications as follows:
Page 7: Changed Abs Max specs for the BASE pin changes from 4.1V to 5.5V.
Page 8: Changed I
Page 8: Updated I
and I
Typical and Max Current specifications.
VBAT
VBATSHDN
VBATSHDN
Minimum Current specifications.
Page 10: Deleted V
for 31.2V to 59.4V and changed Min and Max for two other voltage ranges.
parameter (not valid in system timing.)
BAT
Page 13: Deleted t
DR:ST
Page 13: Changed t
and t to typical values (timing is dependent on system variations.)
DR:SP
DR:WAIT
Removed Note 8 which read “Scan and Measurement start times...” from Electrical Spec Table due to not
being referenced.
Page 15: Removed t
from Figure 4.
DR:ST
Updated graphics (Figures 52 through 58) to Intersil standards.
Page 63: Changed the equation for calculating Pack voltage.
Changed the heading from "Communication Timing Tables" to “System Timing Tables” on page 69.
FN7672 Rev.10.00
May 10, 2018
Page 101 of 105
ISL78600
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision. (Continued)
DATE
REVISION
FN7672.6
CHANGE
Jan 20, 2015
Changed ground references in Application Diagram on Page 1.
Figure 4B, page 16: Deleted the word “Maximum” from the caption.
Page 7 - Capacitive Discharge Model: Changed 750V to 500V. Removed Machine Model specification.
Section , “Electrical Specifications,” on page 9, changed Recommended Operating Conditions for ExT1, ExT2,
ExT3, ExT4 from 3.6V to 2.5V and removed outputs FAULT, BASE, DOUT, DATA READY, TEMPREG and VREF.
Added to “BASE” Pin Description on page 6, “Do not let this pin float.”
Some changes to Electrical Specifications, pages 9-13.
On page 11, “V2P5 Power Good Window”, Changed V2PH Min from 2.55 to 2.62 and Max from 2.9 to 2.766V.
For the -40°C to 105°C line, change V2PH Min from 2.55 to 2.616 and Max from 2.9 to 2.77.
Table 15 on page 46, Changed “Cell0 Voltage” to “VBAT Voltage”.
Section , “CRC Calculation,” on page 60: Added example software CRC calculation code.
Added note: “A Reset command should be issued following a “hard reset” in which the EN pin is toggled.” to
Section , “Reset Command,” on page 48.
Changed “Fault Diagnostics” on page 80 to add the comment, “When a fault is detected, the [TOT2:0] bits
should be re-written.”
Table on page 82, “Read checksum value calculated by ISL78600”changed “cycling the EN pin or the host
issuing a Reset command.” to “cycling the EN pin followed by a host initiated Reset command, or simply the
host issuing a Reset command.”
Section, “Register Descriptions,” on page 87: Changed “VC0 Voltage” to “VBAT Voltage” and added voltage
calculation equations.
Changed Section, “System Hardware Connection,” on page 25. Changed “when the EN pin is low” to “when
the EN pin is toggled and the device receives a Reset Command”.
System Register description “TOT0, 1, 2” on page 89 added the comment, “This register must be re-written
following an error detection resulting from Totalizer overflow.”
Added Note to Figure 65 indicating max CS to SCK timing on SPI Read
Added to Description in Section, “Power Supplies and Reference,” on page 29, “The external pass transistor
is required. Do not allow this pin to float.”
Moved Note 10: “Biasing setup as in Figure 46 on page 29 or equivalent” to Electrical Table heading.
Changed all pin name references to all caps.
Feb 26, 2014
Oct25, 2013
FN7672.5
Changed Note on page 102 From: Initial accuracy does not include drift due to solder or heat effect.
To: Stresses may be induced in the ISL78600 during soldering or other high temperature events that affect
measurement accuracy. Initial accuracy does not include effects due to this. See Figure 8 for cell reading
accuracy obtained after soldering to Intersil evaluation boards. When soldering the ISL78600 to a
customized circuit board with a layout or construction significantly differing from the Intersil evaluation
board, design verification tests should be applied to determine drift due to soldering and over life time.
FN7672.4
FN7672.3
Updated bullet in Features AEC - Q100 Qualified to Qualified for Automotive applications.
Updated in Disclaimer Intersil products to Intersil Automotive Qualified Products and ISO9000 to TS16949.
Page 18 - removed “Note: Boards baked at +105°C for 12 hours to accelerate recovery from soldering” from
Figure 4B.
Sep26, 2013
Aug 15, 2013
Open Wire Current ISCN bit = 0 on page 13 changed MAX from 0.175 to 0.185
Updated Electrical Spec Table by adding/modifying Note, T Spec, and VCELL, VRACC, IVCELL, ICBSD
JA
Specs.
Added Typical Performance Curve: Maximum Cell Reading Error from 114 Evaluations Boards
At 3.3V, +25°C. Histogram
Updated Definitions for Shutdown Mode in “Alarm Response” on page 78 and “Reset Command” on page 48.
Page 31: Table 8, Updated recommendation for C1
Replaced “Measurement and Communication Timing” Section (pages 51 to 58 of previous document) with
new sections “Communication Timing” on page 63 and “System Timing Tables” on page 69 with new figures
and tables to offer more clarity and flexibility in communication and measurement timing calculations.
FN7672 Rev.10.00
May 10, 2018
Page 102 of 105
ISL78600
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision. (Continued)
DATE
REVISION
FN7672.2
CHANGE
Nov 30, 2012
Removed “BASE” from “Recommended Operating Conditions” on page 8.
Page 60, Updated Tables 42 and 43.
Page 90, changed “Enable/disable cell overvoltage and undervoltage detection on cell 1 to 12, respectively.
Set to 1 to disable OV/UV test” to “Enable/disable cell overvoltage, undervoltage and open wire detection on
cell 1 to 12, respectively. Set to 1 to disable OV/UV and open wire tests”.
Page 32- page 38: Modified and simplified typical application circuits to reflect single RC filters for cell inputs
and Ext Temp inputs, as well as the BOM list.
Figure 47 on page 36: Modified connections for cell balancing pins with 10 cells
Page 80 - page 81: Removed information regarding “ISL78600 Supplied through an external regulated 3.3V
Supply”.
Page 81: Removed comments: regarding an optional zener diode.
Table 8 on page 31: modified C2 values
Figure 51 on page 32: Simplified and removed RC filters for Ext Temp inputs 1-4, as well as the BOM list in
Table 54.
Sept 27, 2012
FN7672.1
Initial Release.
FN7672 Rev.10.00
May 10, 2018
Page 103 of 105
ISL78600
For the most recent package outline drawing, see Q64.10x10D.
Package Outline Drawing
Q64.10x10D
64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
Rev 3, 11/16
12.00
4
5
10.00
D
3
A
3
12.00
10.00
4
5
B
3
0.50
4X
0.20 C A-B D
4X
0.20 H A-B D
TOP VIEW
BOTTOM VIEW
11/13°
1.20 MAX
C
0.05
/ / 0.10 C
0° MIN.
0.08
SIDE VIEW
SEE DETAIL "A"
H
2
1.00 ±0.05
0.05/0.15
M C A-B D
0.08
7
0.08
WITH LEAD FINISH
0.25 GAUGE
PLANE
R. MIN.
0.22 ±0.05
0-7°
0.20 MIN.
0.60 ±0.15
0.09/0.20
0.09/0.16
(1.00)
DETAIL "A"
SCALE: NONE
0.20 ±0.03
BASE METAL
NOTES:
(10.00)
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
(0.28) TYP
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
3. Datums A-B and D to be determined at centerline between
leads where leads exit plastic body at datum plane H.
4. Dimensions do not include mold protrusion. Allowable mold
protrusion is 0.254mm.
10.00
5. These dimensions to be determined at datum plane H.
6. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
7. Does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm total at maximum material
condition. Dambar cannot be located on the lower radius
or the foot.
(1.50) TYP
8. Controlling dimension: millimeter.
9.
This outline conforms to JEDEC publication 95 registration
MS-026, variation ACD.
10. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
FN7672 Rev.10.00
May 10, 2018
Page 104 of 105
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
you or third parties arising from such alteration, modification, copying or reverse engineering.
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
product’s quality grade, as indicated below.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as
a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
http://www.renesas.com
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2018 Renesas Electronics Corporation. All rights reserved.
Colophon 7.0
相关型号:
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明