ISL83078EIUZA-T13 [RENESAS]
LINE TRANSCEIVER;
| 型号： | ISL83078EIUZA-T13 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | LINE TRANSCEIVER 接口集成电路 |
| 文件： | 总18页 (文件大小：762K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISL83070E, ISL83071E, ISL83072E, ISL83073E,
ISL83075E, ISL83076E, ISL83077E, ISL83078E
Data Sheet
October 5, 2012
FN6115.5
±15kV ESD Protected, 3.3V, Full Fail-safe,
Low Power, High Speed or Slew Rate
Limited, RS-485/RS-422 Transceivers
Features
• Pb-Free (RoHS Compliant)
• RS-485 I/O Pin ESD Protection . . . . . . . . . . . . . ±15kV HBM
The Intersil ISL8307XE are BiCMOS 3.3V powered, single
transceivers that meet both the RS-485 and RS-422
standards for balanced communication. These devices have
very low bus currents (+125mA/-100mA), so they present a
true “1/8 unit load” to the RS-485 bus. This allows up to 256
transceivers on the network without violating the RS-485
specification’s 32 unit load maximum, and without using
repeaters. For example, in a remote utility meter reading
system, individual meter readings are routed to a
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
• Full Fail-safe (Open, Short, Terminated/Floating)
Receivers
• Hot Plug - Tx and Rx Outputs Remain Three-state During
Power-up (Only Versions with Output Enable Pins)
• True 1/8 Unit Load Allows up to 256 Devices on the Bus
• Single 3.3V Supply
concentrator via an RS-485 network, so the high allowed
node count minimizes the number of repeaters required.
• High Data Rates. . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
• Low Quiescent Supply Current . . . . . . . . . . .800μA (Max)
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven.
- Ultra Low Shutdown Supply Current . . . . . . . . . . .10nA
• -7V to +12V Common Mode Input/Output Voltage Range
• Half and Full Duplex Pinouts
Hot Plug circuitry ensures that the Tx and Rx outputs remain
in a high impedance state while the power supply stabilizes.
• Three State Rx and Tx Outputs Available
The ISL83070E through ISL83075E utilize slew rate limited
drivers which reduce EMI, and minimize reflections from
improperly terminated transmission lines, or unterminated
stubs in multidrop and multipoint applications. Slew rate limited
versions also include receiver input filtering to enhance noise
immunity in the presence of slow input signals.
• Current Limiting and Thermal Shutdown for driver
Overload Protection
• Tiny MSOP package offering saves 50% board space
Applications
• Automated Utility Meter Reading Systems
• High Node Count Systems
The ISL83070E, ISL83071E, ISL83073E, ISL83076E,
ISL83077E are configured for full duplex (separate Rx input
and Tx output pins) applications. The half duplex versions
multiplex the Rx inputs and Tx outputs to allow transceivers
with output disable functions in 8 lead packages.
• Field Bus Networks
• Security Camera Networks
• Building Environmental Control/ Lighting Systems
• Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
HALF/FULL DATA RATE SLEW-RATE
HOT
PLUG?
#DEVICES
ON BUS
RX/TX
ENABLE?
QUIESCENT
(μA)
LOW POWER
SHUTDOWN? COUNT
PIN
DUPLEX
FULL
FULL
HALF
FULL
HALF
FULL
FULL
HALF
(Mbps)
0.25
0.25
0.25
0.5
LIMITED?
YES
YES
YES
YES
YES
NO
I
CC
510
ISL83070E
ISL83071E
ISL83072E
ISL83073E
ISL83075E
ISL83076E
ISL83077E
ISL83078E
YES
NO
256
256
256
256
256
256
256
256
YES
NO
YES
NO
14
8
510
510
510
510
510
510
510
YES
YES
YES
YES
NO
YES
YES
YES
YES
NO
YES
YES
YES
YES
NO
8
14
8
0.5
20
14
8
20
NO
20
NO
YES
YES
YES
8
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2005-2007, 2012. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Pinouts
ISL83072E, ISL83075E, ISL83078E
ISL83071E, ISL83077E
ISL83070E, ISL83073E, ISL83076E
(8 LD MSOP, SOIC)
(8 LD SOIC)
(14 LD SOIC)
TOP VIEW
TOP VIEW
TOP VIEW
NC
RO
1
2
3
4
5
6
7
14 V
CC
RO
RE
DE
DI
1
2
3
4
8
7
6
5
V
CC
V
1
2
3
4
8
7
6
5
A
B
Z
CC
R
D
R
D
13 NC
12 A
11 B
10 Z
B/Z
RO
DI
R
D
RE
A/Y
DE
GND
GND
Y
DI
GND
GND
9
8
Y
NC
Ordering Information
Truth Tables
TEMP.
PART NUMBER
PART
RANGE PACKAGE
PKG.
TRANSMITTING
(Notes 1, 2, 3) MARKING
(°C)
(Pb-Free)
DWG. #
INPUTS
OUTPUTS
ISL83070EIBZA 83070EIBZ -40 to 85 14 Ld SOIC M14.15
ISL83071EIBZA 83071 EIBZ -40 to 85 8 Ld SOIC M8.15
ISL83072EIBZA 83072 EIBZ -40 to 85 8 Ld SOIC M8.15
RE
X
DE
1
DI
1
Z
0
1
Y
1
X
1
0
0
ISL83072EIUZA 3072Z
-40 to 85 8 Ld MSOP M8.118
0
0
X
X
High-Z
High-Z
High-Z*
ISL83073EIBZA 83073EIBZ -40 to 85 14 Ld SOIC M14.15
ISL83075EIBZA 83075 EIBZ -40 to 85 8 Ld SOIC M8.15
1
0
High-Z*
NOTE: *Shutdown Mode (See Note 10), except for ISL83071E/77E
ISL83075EIUZA 3075Z
-40 to 85 8 Ld MSOP M8.118
ISL83076EIBZA 83076EIBZ -40 to 85 14 Ld SOIC M14.15
ISL83077EIBZA 83077 EIBZ -40 to 85 8 Ld SOIC M8.15
ISL83078EIBZA 83078 EIBZ -40 to 85 8 Ld SOIC M8.15
RECEIVING
INPUTS
DE
OUTPUT
ISL83078EIUZA 3078Z
NOTES:
-40 to 85 8 Ld MSOP M8.118
RE
DE
Half Duplex Full Duplex
A-B
RO
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details
on reel specifications.
0
0
0
0
0
0
X
X
X
≥ -0.05V
≤ -0.2V
1
0
1
2. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets, molding compounds/die attach materials,
and 100% matte tin plate plus anneal (e3 termination finish,
which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations). Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Inputs
Open/Shorted
1
1
0
1
0
1
X
X
High-Z*
High-Z
3. For Moisture Sensitivity Level (MSL), please see device
information page for ISL83070E, ISL83071E, ISL83072E,
ISL83073E, ISL83075E, ISL83076E, ISL83077E, ISL83078E.
For more information on MSL please see tech brief TB363.
NOTE: *Shutdown Mode (See Note 10), except for ISL83071E/77E
FN6115.5
October 5, 2012
2
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Pin Descriptions
PIN
RO
RE
FUNCTION
Receiver output: If A - B ≥ -50mV, RO is high; If A - B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted.
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t
required, connect RE directly to GND or through a 1kΩ to 3kΩ resistor to GND.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the
Tx enable function isn’t required, connect DE to V
through a 1kΩ to 3kΩ resistor.
CC
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
Ground connection.
GND
A/Y
±15kV HBM ESD Protected RS-485/RS-422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE =
0; pin is an output if DE = 1.
B/Z
±15kV HBM ESD Protected RS-485/RS-422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is
an output if DE = 1.
A
B
Y
Z
±15kV HBM ESD Protected RS-485/RS-422 level, noninverting receiver input.
±15kV HBM ESD Protected RS-485/RS-422 level, inverting receiver input.
±15kV HBM ESD Protected RS-485/RS-422 level, noninverting driver output.
±15kV HBM ESD Protected RS-485/RS-422 level, inverting driver output.
System power supply input (3.0V to 3.6V).
V
CC
NC
No Connection.
FN6115.5
October 5, 2012
3
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Typical Operating Circuits
+3.3V
+3.3V
+
+
0.1µF
0.1µF
8
8
V
V
CC
CC
RO
1
2
4
DI
R
D
RE
DE
R
T
R
T
3
2
7
6
7
6
B/Z
A/Y
DE
RE
B/Z
A/Y
3
4
DI
1
RO
R
D
GND
5
GND
5
ISL83072E, ISL83075E, ISL83078E
+3.3V
+3.3V
+
+
0.1µF
0.1µF
1
1
V
V
CC
CC
R
T
A
B
8
7
Y
Z
5
6
2
3
RO
DI
3
2
DI
R
D
R
6
5
Z
Y
B
A
T
7
8
RO
R
D
GND
4
GND
4
ISL83071E, ISL83077E
+3.3V
+3.3V
+
+
0.1µF
0.1µF
14
R
14
CC
V
V
CC
R
T
A
B
12
11
Y
Z
9
DI
2
5
RO
D
10
3
4
RE
DE
DE 4
3
RE
R
10
9
Z
Y
T
B
A
11
12
5
DI
RO
2
R
D
GND
GND
6, 7
6, 7
ISL83070E, ISL83073E, ISL83076E
FN6115.5
October 5, 2012
4
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Absolute Maximum Ratings
Thermal Information
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Thermal Resistance (Typical, Note 4)
θJA (°C/W)
CC
Input Voltages
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
105
140
128
DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
DE, RE (Note 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V
Short Circuit Duration
+0.3V)
CC
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
4. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
= 3.3V, T = +25°C
CC
CC A
(Note 5).
TEMP
(°C)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 19) TYP (Note 19) UNITS
DC CHARACTERISTICS
Driver Differential V
V
R
R
= 100Ω (RS-422) (Figure 1A, Note 16)
= 54Ω (RS-485) (Figure 1A)
Full
Full
2
1.5
-
2.3
2
-
V
V
OUT
OD
L
V
V
L
CC
No Load
-
CC
-
R
R
= 60Ω, -7V ≤ V
≤ 12V (Figure 1B)
CM
Full
Full
1.5
-
2.2
0.01
V
V
L
Change in Magnitude of Driver
Differential V for
ΔV
= 54Ω or 100Ω (Figure 1A)
0.2
OD
L
OUT
Complementary Output States
Driver Common-Mode V
V
R
R
= 54Ω or 100Ω (Figure 1A)
= 54Ω or 100Ω (Figure 1A)
Full
Full
-
-
2
3
V
V
OUT
Change in Magnitude of Driver
Common-Mode V for
OC
L
ΔV
0.01
0.2
OC
L
OUT
Complementary Output States
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Hysteresis
V
DI, DE, RE
Full
Full
25
2
-
-
0.8
-
V
IH
V
DI, DE, RE
-
-
-
V
IL
V
DE, RE, (Note 15)
100
-
mV
μA
μA
μA
μA
μA
μA
μA
HYS
Logic Input Current
I
DI = DE = RE = 0V or V , (Note 18)
CC
Full
Full
Full
Full
Full
Full
Full
-2
-
2
IN1
IN2
Input Current (A, B, A/Y, B/Z)
I
I
I
DE = 0V, V
3.6V
= 0V or
V
V
V
V
V
V
= 12V
= -7V
= 12V
= -7V
= 12V
= -7V
80
-50
10
-10
10
-10
125
-
CC
IN
IN
IN
IN
IN
IN
-100
-
Output Leakage Current (Y, Z) (Full
Duplex Versions Only, Note 13)
RE = 0V, DE = 0V,
= 0V or 3.6V
40
-
IN3
IN4
V
CC
-40
-
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex,
Note 13)
RE = V , DE = 0V,
CC
40
-
V
= 0V or 3.6V
CC
-40
Driver Short-Circuit Current,
I
DE = V , -7V ≤ V or V ≤ 12V (Note 7)
CC
Full
Full
25
-
-200
-
-
±250
-50
-
mA
mV
mV
OSD1
Y
Z
V
= High or Low
O
Receiver Differential Threshold
Voltage
V
-7V ≤ V
≤ 12V
-125
15
TH
CM
Receiver Input Hysteresis
ΔV
V
= 0V
CM
TH
FN6115.5
October 5, 2012
5
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Electrical Specifications Test Conditions: V = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
= 3.3V, T = +25°C
CC
CC A
(Note 5). (Continued)
TEMP
(°C)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 19) TYP (Note 19) UNITS
Receiver Output High Voltage
Receiver Output Low Voltage
V
I
I
= -4mA, V = -50mV
Full
Full
Full
V - 0.6
CC
-
-
0.4
1
V
V
OH
O
O
ID
V
= -4mA, V = -200mV
-
0.17
0.015
OL
ID
Three-State (high impedance)
I
0.4V ≤ V ≤ 2.4V
-1
μA
OZR
O
Receiver Output Current (Note 13)
Receiver Input Resistance
Receiver Short-Circuit Current
Thermal Shutdown Threshold
SUPPLY CURRENT
R
-7V ≤ V
≤ 12V
CM
Full
Full
Full
96
±7
-
150
30
-
±60
-
kΩ
mA
°C
IN
I
0V ≤ V ≤ V
OSR
O
CC
T
150
SD
No-Load Supply Current (Note 6)
I
DI = 0V or V
DE = V
,
Full
-
510
800
μA
CC
CC
CC
RE = 0V or V
CC
DE = 0V, RE = 0V
DE = 0V, RE = V , DI = 0V or V
Full
Full
-
-
480
700
1
μA
μA
Shutdown Supply Current
(Note 13)
I
0.01
SHDN
CC
CC
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z)
All Other Pins
Human Body Model (HBM), Pin to GND
HBM, per MIL-STD-883 Method 3015
25
25
-
±15
>±7
-
-
kV
kV
−
DRIVER SWITCHING CHARACTERISTICS (ISL83070E, ISL83071E, ISL83072E, 250kbps)
Maximum Data Rate
f
V
= ±1.5V, C = 820pF (Figure 4, Note 17)
Full
Full
Full
Full
Full
250
250
-
800
1100
6
-
kbps
ns
MAX
OD
D
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
t
R
R
R
R
= 54Ω, C = 50pF (Figure 2)
1500
100
1600
600
DD
DIFF
DIFF
DIFF
D
t
= 54Ω, C = 50pF (Figure 2)
ns
SKEW
t , t
D
= 54Ω, C = 50pF (Figure 2)
350
-
960
26
ns
R
F
D
t
t
= 500Ω, C = 50pF, SW = GND (Figure 3),
ns
ZH
L
L
(Notes 8, 13)
= 500Ω, C = 50pF, SW = V (Figure 3),
CC
Driver Enable to Output Low
Driver Disable from Output High
Driver Disable from Output Low
Time to Shutdown
t
R
Full
Full
Full
-
-
-
200
28
600
55
ns
ns
ns
ZL
L
L
(Notes 8, 13)
R
= 500Ω, C = 50pF, SW = GND (Figure 3),
HZ
L
L
(Note 13)
= 500Ω, C = 50pF, SW = V (Figure 3),
CC
t
R
30
55
LZ
L
L
(Note 13)
t
(Notes 10, 13)
Full
Full
50
-
200
180
600
700
ns
ns
SHDN
Driver Enable from Shutdown to
Output High
t
R = 500Ω, C = 50pF, SW = GND (Figure 3),
L L
ZH(SHDN)
(Notes 10, 11, 13)
= 500Ω, C = 50pF, SW = V (Figure 3),
CC
Driver Enable from Shutdown to
Output Low
t
R
Full
-
100
700
ns
ZL(SHDN)
L
L
(Notes 10, 11, 13)
DRIVER SWITCHING CHARACTERISTICS (ISL83073E, ISL83075E, 500kbps)
Maximum Data Rate
f
V
= ±1.5V, C = 820pF (Figure 4, Note 17)
Full
Full
Full
Full
Full
500
180
-
1600
350
1
-
kbps
ns
MAX
OD
D
Driver Differential Output Delay
Driver Differential Output Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
t
R
R
R
R
= 54Ω, C = 50pF (Figure 2)
800
30
DD
DIFF
DIFF
DIFF
D
t
= 54Ω, C = 50pF (Figure 2)
ns
SKEW
t , t
D
= 54Ω, C = 50pF (Figure 2)
200
-
380
26
800
350
ns
R
F
D
t
= 500Ω, C = 50pF, SW = GND (Figure 3),
ns
ZH
L
L
(Notes 8, 13)
= 500Ω, C = 50pF, SW = V (Figure 3),
CC
Driver Enable to Output Low
t
R
Full
-
100
350
ns
ZL
L
L
(Notes 8, 13)
FN6115.5
October 5, 2012
6
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Electrical Specifications Test Conditions: V = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
= 3.3V, T = +25°C
CC
CC A
(Note 5). (Continued)
TEMP
(°C)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
= 500Ω, C = 50pF, SW = GND (Figure 3),
(Note 19) TYP (Note 19) UNITS
Driver Disable from Output High
t
R
Full
-
-
28
55
55
ns
HZ
L
L
(Note 13)
Driver Disable from Output Low
Time to Shutdown
t
R
= 500Ω, C = 50pF, SW = V
(Figure 3),
CC
Full
30
ns
LZ
L
L
(Note 13)
t
(Notes 10, 13)
Full
Full
50
-
200
180
600
700
ns
ns
SHDN
Driver Enable from Shutdown to
Output High
t
R = 500Ω, C = 50pF, SW = GND (Figure 3),
L L
ZH(SHDN)
(Notes 10, 11, 13)
= 500Ω, C = 50pF, SW = V (Figure 3),
CC
Driver Enable from Shutdown to
Output Low
t
R
Full
-
100
700
ns
ZL(SHDN)
L
L
(Notes 10, 11, 13)
DRIVER SWITCHING CHARACTERISTICS (ISL83076E, ISL83077E, ISL83078E, 20Mbps)
Maximum Data Rate
f
V
= ±1.5V, C = 350pF (Figure 4, Note 17)
Full
Full
Full
Full
Full
Full
20
-
28
27
1
-
Mbps
ns
MAX
OD
D
Driver Differential Output Delay
Driver Differential Output Skew
Driver Output Skew, Part-to-Part
Driver Differential Rise or Fall Time
Driver Enable to Output High
t
R
R
R
R
R
= 54Ω, C = 50pF (Figure 2)
40
3
DD
DIFF
DIFF
DIFF
DIFF
D
t
= 54Ω, C = 50pF (Figure 2)
-
ns
SKEW
D
Δt
= 54Ω, C = 50pF (Figure 2, Note 14)
-
-
11
15
50
ns
DSKEW
D
t , t
= 54Ω, C = 50pF (Figure 2)
-
9
ns
R
F
D
t
= 500Ω, C = 50pF, SW = GND (Figure 3),
-
17
ns
ZH
L
L
(Notes 8, 13)
= 500Ω, C = 50pF, SW = V (Figure 3),
CC
Driver Enable to Output Low
Driver Disable from Output High
Driver Disable from Output Low
Time to Shutdown
t
R
Full
Full
Full
-
-
-
16
25
28
40
40
50
ns
ns
ns
ZL
L
L
(Notes 8, 13)
t
R
= 500Ω, C = 50pF, SW = GND (Figure 3),
HZ
L
L
(Note 13)
t
R
= 500Ω, C = 50pF, SW = V
(Figure 3),
CC
LZ
L
L
(Note 13)
t
(Notes 10, 13)
Full
Full
50
-
200
180
600
700
ns
ns
SHDN
Driver Enable from Shutdown to
Output High
t
R = 500Ω, C = 50pF, SW = GND (Figure 3),
L L
ZH(SHDN)
(Notes 10, 11, 13)
= 500Ω, C = 50pF, SW = V (Figure 3),
CC
Driver Enable from Shutdown to
Output Low
t
R
Full
-
90
700
ns
ZL(SHDN)
L
L
(Notes 10, 11, 13)
RECEIVER SWITCHING CHARACTERISTICS (All Versions)
Maximum Data Rate
f
V
= ±1.5V (Note 17)
ID
ISL83070E-75E
ISL83076E-78E
ISL83070E-75E
ISL83076E-78E
Full
Full
Full
Full
Full
Full
Full
Full
12
20
25
25
-
20
35
70
33
1.5
-
-
-
Mbps
Mbps
ns
MAX
Receiver Input to Output Delay
t
, t
PLH PHL
(Figure 5)
120
60
4
ns
Receiver Skew | t
- t
Receiver Skew, Part-to-Part
|
t
(Figure 5)
ns
PLH PHL
SKD
Δt
(Figure 5, Note 14)
-
15
20
17
ns
RSKEW
Receiver Enable to Output High
Receiver Enable to Output Low
Receiver Disable from Output High
t
R
= 1kΩ, C = 15pF,
ISL83070E-75E
ISL83076E-78E
5
15
11
ns
ZH
L
L
SW = GND (Figure 6),
(Notes 9, 13)
5
ns
t
R
= 1kΩ, C = 15pF,
ISL83070E-75E
ISL83076E-78E
Full
Full
5
5
15
11
20
17
ns
ns
ZL
L
L
SW = V
(Figure 6),
CC
(Notes 9, 13)
t
R
= 1kΩ, C = 15pF,
ISL83070E-75E
ISL83076E-78E
Full
Full
5
4
12
7
20
15
ns
ns
HZ
L
L
SW = GND (Figure 6),
(Note 13)
FN6115.5
October 5, 2012
7
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Electrical Specifications Test Conditions: V = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at V
= 3.3V, T = +25°C
CC
CC A
(Note 5). (Continued)
TEMP
(°C)
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(Note 19) TYP (Note 19) UNITS
Receiver Disable from Output Low
t
R
= 1kΩ, C = 15pF,
ISL83070E-75E
ISL83076E-78E
Full
Full
5
4
13
7
20
15
ns
ns
LZ
L
L
SW = V
(Figure 6),
CC
(Note 13)
Time to Shutdown
t
(Notes 10, 13)
R = 1kΩ, C = 15pF, SW = GND (Figure 6),
L
Full
Full
50
-
180
240
600
500
ns
ns
SHDN
Receiver Enable from Shutdown to
Output High
t
ZH(SHDN)
L
(Notes 10, 12, 13)
= 1kΩ, C = 15pF, SW = V (Figure 6),
CC
Receiver Enable from Shutdown to
Output Low
t
R
Full
-
240
500
ns
ZL(SHDN)
L
L
(Notes 10, 12, 13)
NOTES:
5. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
6. Supply current specification is valid for loaded drivers when DE = 0V.
7. Applies to peak current. See “Typical Performance Curves” for more information.
8. When testing devices with the shutdown feature, keep RE = 0 to prevent the device from entering SHDN.
9. When testing devices with the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from
entering SHDN.
10. Versions with a shutdown feature are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts
are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See
“Low Power Shutdown Mode” on page 11.
11. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
12. Set the RE signal high time >600ns to ensure that the device enters SHDN.
13. Does not apply to the ISL83071E and ISL83077E.
14. Δt
is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (V
,
CC
SKEW
temperature, etc.). Only applies to the ISL83076E - 78E.
15. ISL83070E - ISL83075E only.
16. V
≥ 3.15V
CC
17. Limits established by characterization and are not production tested.
18. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” table) through a 1kΩ to 3kΩ
resistor.
19. Parts are 100% tested at +25°C. Full temperature limits are guaranteed by bench and tester characterization.
20. If the DE or RE input voltage exceeds the V
voltage by more than 500mV, then current will flow into the logic pin. The current is limited by a
CC
340Ω resistor (so ≈13mA with V = 5V and V
= 0V) so no damage will occur if V
≤ V ≤ 7V for short periods of time.
IN
CC
CC
IN
Test Circuits and Waveforms
R /2
375Ω
L
DE
DI
DE
DI
V
V
CC
CC
Z
Y
Z
V
CM
R
= 60Ω
V
V
OD
L
D
D
OD
-7V TO +12V
Y
V
R /2
375Ω
OC
L
FIGURE 1B. V
WITH COMMON MODE LOAD
FIGURE 1A. V
AND V
OC
OD
OD
FIGURE 1. DC DRIVER TEST CIRCUITS
FN6115.5
October 5, 2012
8
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Test Circuits and Waveforms (Continued)
3V
DI
1.5V
PLH
1.5V
0V
t
t
PHL
DE
DI
V
CC
V
OH
OUT (Z)
OUT (Y)
Z
Y
R
C
DIFF
D
D
V
OL
SIGNAL
GENERATOR
+V
OD
90%
10%
90%
10%
DIFF OUT (Y - Z)
-V
OD
t
t
R
F
SKEW = |t
- t |
PLH PHL
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
DI
Z
Y
500Ω
V
CC
3V
0V
D
DE
1.5V
1.5V
HZ
GND
SW
SIGNAL
GENERATOR
NOTE 10
50pF
t
, t
ZH ZH(SHDN)
NOTE 10
t
OUTPUT HIGH
50%
V
OH
PARAMETER
OUTPUT
Y/Z
RE
X
DI
SW
V
- 0.25V
OH
OUT (Y, Z)
t
1/0
0/1
1/0
0/1
1/0
0/1
GND
HZ
0V
t
Y/Z
X
V
LZ
CC
GND
t
Y/Z
0 (Note 8)
0 (Note 8)
1 (Note 11)
1 (Note 11)
ZH
t
, t
ZL ZL(SHDN)
t
LZ
t
Y/Z
V
ZL
CC
GND
NOTE 10
V
CC
OL
t
Y/Z
ZH(SHDN)
OUT (Y, Z)
50%
t
Y/Z
V
CC
ZL(SHDN)
V
+ 0.25V
OL
V
OUTPUT LOW
FIGURE 3A. TEST CIRCUIT
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL83071E, ISL83077E)
DE
DI
3V
0V
V
CC
+
DI
Z
V
C
54Ω
OD
-
D
D
Y
SIGNAL
GENERATOR
+V
OD
DIFF OUT (Y - Z)
0V
-V
OD
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER DATA RATE
FN6115.5
October 5, 2012
9
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Test Circuits and Waveforms (Continued)
+1.5V
RE
A
15pF
0V
0V
B
A
GND
RO
-1.5V
R
t
t
PHL
PLH
V
CC
SIGNAL
GENERATOR
1.5V
1.5V
RO
0V
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY
RE
B
NOTE 10
1kΩ
V
GND
CC
RO
3V
0V
R
A
GND
RE
SW
SIGNAL
1.5V
1.5V
HZ
GENERATOR
15pF
t
, t
ZH ZH(SHDN)
NOTE 10
t
OUTPUT HIGH
1.5V
V
OH
V
- 0.25V
PARAMETER
DE
X
X
0
A
SW
GND
OH
RO
t
+1.5V
-1.5V
+1.5V
-1.5V
+1.5V
-1.5V
HZ
0V
t
V
LZ
CC
GND
t
(Note 9)
(Note 9)
t
, t
ZH
ZL ZL(SHDN)
t
LZ
t
0
V
NOTE 10
ZL
CC
V
CC
t
(Note 12)
(Note 12)
0
GND
ZH(SHDN)
RO
1.5V
t
0
V
V
+ 0.25V
V
ZL(SHDN)
CC
OL
OL
OUTPUT LOW
FIGURE 6A. TEST CIRCUIT
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL83071E, ISL83077E)
Receiver Features
Application Information
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is better than ±200mV, as required by the RS-422 and RS-485
specifications.
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a point-
to-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.
Receiver input resistance of 96kΩ surpasses the RS-422
spec of 4kΩ, and is eight times the RS-485 “Unit Load (UL)”
requirement of 12kΩ minimum. Thus, these products are
known as “one-eighth UL” transceivers, and there can be up
to 256 of these devices on a network while still complying
with the RS-485 loading spec.
Receiver inputs function with common mode voltages as great
as +9V/-7V outside the power supplies (i.e., +12V and -7V),
making them ideal for long networks where induced voltages,
and ground potential differences, are realistic concerns.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
All the receivers include a “full fail-safe” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating) or shorted. Fail-safe with shorted
inputs is achieved by setting the Rx upper switching point to
-50mV, thereby ensuring that the Rx sees 0V differential as a
high input level.
FN6115.5
October 5, 2012
10
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs (except on the
ISL83071E and ISL83077E) are tri-statable via the active
low RE input.
versions can operate at full data rates with lengths of several
thousand feet.
Twisted pair is the cable of choice for RS-485, RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
differential receivers in these ICs.
Driver Features
The RS-485, RS-422 driver is a differential output device
that delivers at least 1.5V across a 54Ω load (RS-485), and
at least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
All drivers are tri-statable via the active high DE input, except
on the ISL83071E and ISL83077E.
The 250kbps and 500kbps driver outputs are slew rate
limited to minimize EMI, and to reduce reflections in
unterminated or improperly terminated networks. Outputs of
the ISL83076E through ISL83078E drivers are not limited,
so faster output transition times allow data rates of at least
20Mbps.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
lines (DE, RE) is unable to ensure that the RS-485 Tx and
Rx outputs are kept disabled. If the equipment is connected
to the bus, a driver activating prematurely during power up
may crash the bus. To avoid this scenario, the ISL8307XE
versions with output enable pins incorporate a “Hot Plug”
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. These
devices meet this requirement via driver output short circuit
current limits, and on-chip thermal shutdown circuitry.
function. During power up, circuitry monitoring V ensures
CC
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short circuit current, and
thus the power dissipation, whenever the contending voltage
exceeds either supply.
that the Tx and Rx outputs remain disabled for a period of time,
regardless of the state of DE and RE. This gives the
processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states.
ESD Protection
All pins on these devices include class 3 (>7kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs)
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops about +15°. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Receivers stay operational during thermal shutdown.
incorporate advanced structures allowing them to survive
ESD events in excess of ±15kV HBM. The RS-485 pins are
particularly vulnerable to ESD damage because they
typically connect to an exposed port on the exterior of the
finished product. Simply touching the port pins, or
connecting a cable, can cause an ESD event that might
destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
without degrading the RS-485 common mode range of -7V
to +12V. This built-in ESD protection eliminates the need
for board level protection structures (e.g., transient
suppression diodes), and the associated, undesirable
capacitive load they present.
Low Power Shutdown Mode
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but some also include a
shutdown feature that reduces the already low quiescent I to
CC
a 10nA trickle. These devices enter shutdown whenever the
receiver and driver are simultaneously disabled (RE = V
CC
and DE = GND) for a period of at least 600ns. Disabling both
the driver and the receiver for less than 50ns guarantees that
the transceiver will not enter shutdown.
Data Rate, Cables, and Terminations
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 8 through
12, at the end of the “Electrical Specifications” table on page 8
for more information.
RS-485, RS-422 are intended for network lengths up to
4000’, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 250kbps
FN6115.5
October 5, 2012
11
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Typical Performance Curves V = 3.3V, T = +25°C; Unless Otherwise Specified
CC
A
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
1.95
1.90
1.85
120
100
80
60
40
20
0
R
= 100Ω
DIFF
R
= 54Ω
DIFF
-40
0
50
85
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-25
25
75
DIFFERENTIAL OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
0.52
200
ISL83072/75/78E, DE = V , RE = X
CC
ISL83076E/77/78E
150
0.51
0.50
0.49
0.48
0.47
0.46
Y OR Z = LOW
ISL83070E THRU ISL83075E
100
50
0
ISL83070/73/76E, DE = X, RE = 0V; ISL83071/77E
-50
Y OR Z = HIGH
ISL83072/75/78E, DE = 0V, RE = 0V
-100
ISL8307XE
-150
-7 -6
-4
-2
0
2
4
6
8
10
12
-40
0
50
85
-25
25
75
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
1220
1200
1180
1160
1140
1120
8.0
7.5
7.0
6.5
6.0
5.5
t
PHL
1100
1080
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
t
PLH
-40
0
50
85
-25
25
TEMPERATURE (°C)
75
-40
0
50
85
-25
25
75
TEMPERATURE (°C)
FIGURE 11. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL83070E, ISL83071E,
ISL83072E)
FIGURE 12. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL83070E, ISL83071E,
ISL83072E)
FN6115.5
October 5, 2012
12
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Typical Performance Curves V = 3.3V, T = +25°C; Unless Otherwise Specified (Continued)
CC
A
370
365
360
355
350
345
340
1.4
1.2
1.0
0.8
0.6
0.4
0.2
t
PHL
t
PLH
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
-40
0
50
85
-40
0
50
85
-25
25
TEMPERATURE (°C)
75
-25
25
75
TEMPERATURE (°C)
FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL83073E, ISL83075E)
FIGURE 14. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL83073E, ISL83075E)
0.95
0.90
0.85
0.80
0.75
0.70
0.65
32
31
30
29
28
27
t
26
25
24
23
22
PHL
t
PLH
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
0.60
-40
0
50
85
-25
25
75
-40
0
50
85
-25
25
TEMPERATURE (°C)
75
TEMPERATURE (°C)
FIGURE 15. DRIVER DIFFERENTIAL PROPAGATION DELAY
vs TEMPERATURE (ISL83076E, ISL83077E,
ISL83078E)
FIGURE 16. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL83076E, ISL83077E,
ISL83078E)
R
= 54Ω, C = 50pF
D
R
= 54Ω, C = 50pF
D
DIFF
DIFF
5
0
5
0
DI
DI
5
0
5
0
RO
RO
3.0
2.5
2.0
1.5
1.0
0.5
0
3.0
2.5
2.0
1.5
1.0
0.5
0
A/Y
B/Z
B/Z
A/Y
TIME (400ns/DIV)
TIME (400ns/DIV)
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL83070E, ISL83071E,
ISL83072E)
FIGURE 18. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL83070E, ISL83071E,
ISL83072E)
FN6115.5
October 5, 2012
13
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Typical Performance Curves V = 3.3V, T = +25°C; Unless Otherwise Specified (Continued)
CC
A
R
= 54Ω, C = 50pF
D
R
= 54Ω, C = 50pF
DIFF
DIFF
D
5
0
5
0
DI
DI
5
0
5
0
RO
RO
3.0
2.5
2.0
1.5
1.0
0.5
0
3.0
2.5
2.0
1.5
1.0
0.5
0
A/Y
B/Z
B/Z
A/Y
TIME (200ns/DIV)
TIME (200ns/DIV)
FIGURE 19. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL83073E, ISL83075E)
FIGURE 20. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL83073E, ISL83075E)
R
= 54Ω, C = 50pF
R
= 54Ω, C = 50pF
D
DIFF
D
DIFF
5
0
5
0
DI
DI
5
0
5
0
RO
RO
3.0
2.5
2.0
1.5
1.0
0.5
0
3.0
2.5
2.0
1.5
1.0
0.5
0
A/Y
B/Z
B/Z
A/Y
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 21. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL83076E, ISL83077E,
ISL83078E)
FIGURE 22. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL83076E, ISL83077E,
ISL83078E)
FN6115.5
October 5, 2012
14
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Typical Performance Curves V = 3.3V, T = +25°C; Unless Otherwise Specified (Continued)
CC
A
35
30
25
20
15
10
5
V
, +25°C
OL
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
V
, +85°C
OL
V
, +25°C
GND
OH
TRANSISTOR COUNT:
V
, +85°C
OH
535
PROCESS:
Si Gate BiCMOS
0
0.5
1.5
2.5
0
1.0
2.0
3.0
3.5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 23. RECEIVER OUTPUT CURRENT vs RECEIVER
OUTPUT VOLTAGE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6115.5
October 5, 2012
15
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Package Outline Drawing
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.25
3°±3°
0.55 ± 0.15
DETAIL "X"
0.85±010
H
C
SEATING PLANE
0.10 C
0.25 - 0.36
0.10 ± 0.05
0.08
C A-B D
M
SIDE VIEW 1
(5.80)
NOTES:
1. Dimensions are in millimeters.
(4.40)
(3.00)
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
(0.65)
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.40)
(1.40)
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
FN6115.5
October 5, 2012
16
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
AREA
6.20 (0.244)
5.80 (0.228)
0.50 (0.20)
0.25 (0.01)
x 45°
4.00 (0.157)
3.80 (0.150)
8°
0°
1
2
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
1
8
SEATING PLANE
0.60 (0.023)
1.27 (0.050)
1.75 (0.069)
5.00 (0.197)
4.80 (0.189)
2
3
7
6
1.35 (0.053)
-C-
4
5
0.25(0.010)
0.10(0.004)
1.27 (0.050)
0.51(0.020)
0.33(0.013)
5.20(0.205)
SIDE VIEW “A
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN6115.5
October 5, 2012
17
ISL83070E,ISL83071E,ISL83072E,ISL83073E,ISL83075E,ISL83076E,ISL83077E,ISL83078E
Package Outline Drawing
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
4
0.10 C A-B 2X
8.65
A
3
6
DETAIL"A"
0.22±0.03
D
14
8
6.0
3.9
4
0.10 C D 2X
0.20 C 2X
7
PIN NO.1
ID MARK
(0.35) x 45°
4° ± 4°
5
0.31-0.51
0.25M C A-B D
B
3
6
TOP VIEW
0.10 C
H
1.75 MAX
1.25 MIN
0.25
GAUGE PLANE
SEATING PLANE
C
0.10-0.25
1.27
0.10 C
SIDE VIEW
DETAIL "A"
(1.27)
(0.6)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Datums A and B to be determined at Datum H.
(5.40)
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. The pin #1 indentifier may be either a mold or mark feature.
6. Does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm total in excess of lead width at maximum condition.
(1.50)
7. Reference to JEDEC MS-012-AB.
TYPICAL RECOMMENDED LAND PATTERN
FN6115.5
October 5, 2012
18
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