ISL8483EIPZ-T [RENESAS]
LINE TRANSCEIVER, PDIP8, ROHS COMPLIANT, PLASTIC, MS-001BA, 8 PIN;
| 型号： | ISL8483EIPZ-T |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | LINE TRANSCEIVER, PDIP8, ROHS COMPLIANT, PLASTIC, MS-001BA, 8 PIN 光电二极管 |
| 文件： | 总14页 (文件大小：454K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISL8483E, ISL8485E
®
Data Sheet
September 9, 2008
FN6048.9
ESD Protected to ±15kV, 5V, Low Power,
High Speed or Slew Rate Limited,
RS-485/RS-422 Transceivers
Features
• Pb-Free Available (RoHS Compliant)
• Military and Extended Industrial Temperature Options
(+125°C)
These Intersil RS-485, RS-422 devices are ESD protected,
BiCMOS 5V powered, single transceivers that meet both the
RS-485 and RS-422 standards for balanced communication.
Each driver output/receiver input is protected against ±15kV
ESD strikes, without latch-up. Unlike competitive devices,
this Intersil family is specified for 10% tolerance supplies
(4.5V to 5.5V).
• RS-485 I/O Pin ESD Protection . . . . . . . . . . . . . ±15kV HBM
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
• Specified for 10% Tolerance Supplies
• High Data Rate Version (ISL8485E) . . . . . up to 10Mbps
• Slew Rate Limited Version for Error Free Data
Transmission (ISL8483E) . . . . . . . . . . . . . up to 250kbps
The ISL8483E utilizes slew rate limited drivers which reduce
EMI, and minimize reflections from improperly terminated
transmission lines, or un-terminated stubs in multidrop and
multipoint applications.
• Single Unit Load Allows up to 32 Devices on the Bus
• 1nA Low Current Shutdown Mode (ISL8483E)
Data rates up to 10Mbps are achievable by using the
ISL8485E which features higher slew rates.
• Low Quiescent Current:
- 160µA (ISL8483E)
- 500µA (ISL8485E)
Both devices present a “single unit load” to the RS-485 bus,
which allows up to 32 transceivers on the network.
• -7V to +12V Common Mode Input Voltage Range
• Three State Rx and Tx Outputs
Receiver (Rx) inputs feature a “fail-safe if open” design,
which ensures a logic high Rx output, if Rx inputs are
floating.
• 30ns Propagation Delays, 5ns Skew (ISL8485E)
• Operate from a Single +5V Supply (10% Tolerance)
Driver (Tx) outputs are short circuit protected, even for
voltages exceeding the power supply voltage. Additionally,
on-chip thermal shutdown circuitry disables the Tx outputs to
prevent damage if power dissipation becomes excessive.
• Current Limiting and Thermal Shutdown for driver
Overload Protection
Applications
These half duplex configurations multiplex the Rx inputs and
Tx outputs to allow transceivers with Rx and Tx disable
functions in 8 lead packages.
• Factory Automation
• Security Networks
• Building Environmental Control Systems
• Industrial/Process Control Networks
• Level Translators (e.g., RS-232 to RS-422)
• RS-232 “Extension Cords”
TABLE 1. SUMMARY OF FEATURES
NO. OF
DEVICES
PART
HALF/FULL
MIL
ALLOWED DATA RATE SLEW-RATE RECEIVER/DRIVER QUIESCENT LOW POWER
PIN
NUMBER
DUPLEX TEMP? ON BUS
(Mbps)
0.25
10
LIMITED?
ENABLE?
I
(µA)
SHUTDOWN? COUNT
CC
160
500
ISL8483E
ISL8485E
Half
Half
No
32
32
Yes
Yes
Yes
No
8
8
Yes
No
Yes
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2003, 2004, 2005, 2008. All Rights Reserved.
1
All other trademarks mentioned are the property of their respective owners.
ISL8483E, ISL8485E
Ordering Information
Pinout
ISL8483E, ISL8485E
(8 LD PDIP, SOIC)
TOP VIEW
TEMP.
RANGE
(°C)
PART
PKG.
PACKAGE DWG. #
PART NUMBER
MARKING
ISL8483ECPZ
(Note)
ISL8483ECPZ -0 to +70 8 Ld PDIP* E8.3
(Pb-free)
RO
RE
DE
DI
1
2
3
4
8
7
6
5
V
CC
R
D
B/Z
ISL8483EIB**
8483EIB
-40 to +85 8 Ld SOIC M8.15
A/Y
ISL8483EIBZ** 8483EIBZ
(Note)
-40 to +85 8 Ld SOIC M8.15
(Pb-free)
GND
ISL8483EIP
ISL8483EIP
-40 to +85 8 Ld PDIP E8.3
ISL8483EIPZ
(Note)
ISL8483EIPZ -40 to +85 8 Ld PDIP* E8.3
(Pb-free)
Truth Tables
ISL8485EABZ** 8485EABZ
(Note)
-40 to +125 8 Ld SOIC M8.15
(Pb-free)
TRANSMITTING
INPUTS
OUTPUTS
ISL8485ECB**
8485ECB
0 to +70 8 Ld SOIC M8.15
RE
X
DE
1
DI
1
Z
0
Y
1
ISL8485ECBZ** 8485ECBZ
(Note)
0 to +70 8 Ld SOIC M8.15
(Pb-free)
X
1
0
1
0
ISL8485ECP
ISL8485ECP
0 to +70 8 Ld PDIP E8.3
0
0
X
X
High-Z
High-Z *
High-Z
High-Z *
ISL8485ECPZ
(Note)
ISL8485ECPZ 0 to +70 8 Ld PDIP* E8.3
(Pb-free)
1
0
ISL8485EIB**
8485EIB
-40 to +85 8 Ld SOIC M8.15
*Shutdown Mode for ISL8483E (see Note 7)
ISL8485EIBZ** 8485EIBZ
(Note)
-40 to +85 8 Ld SOIC M8.15
(Pb-free)
RECEIVING
INPUTS
ISL8485EIP
ISL8485EIP
-40 to +85 8 Ld PDIP E8.3
OUTPUT
ISL8485EIPZ
(Note)
ISL8485EIPZ -40 to +85 8 Ld PDIP* E8.3
(Pb-free)
RE
0
DE
0
A-B
≥ +0.2V
≤ -0.2V
Inputs Open
X
RO
1
0
ISL8485EMPZ
(Note)
ISL8485EMPZ -55 to +125 8 Ld PDIP* E8.3
(Pb-free)
0
0
0
0
1
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
1
0
High-Z*
High-Z
1
1
X
**Add “-T” suffix for tape and reel. Please refer to TB347 for details
on reel specifications
*Shutdown Mode for ISL8483E (see Note 7)
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach
materials and 100% matte tin plate plus anneal- (e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations). Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
FN6048.9
September 9, 2008
2
ISL8483E, ISL8485E
Pin Descriptions
PIN
FUNCTION
RO
RE
Receiver output: If A > B by at least 0.2V, RO is high; If A < B by 0.2V or more, RO is low; RO = High if A and B are unconnected (floating).
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low.
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
Ground connection.
DE
DI
GND
A/Y
±15kV HBM ESD Protected, RS485, RS4-422 level noninverting receiver input and noninverting driver output. Pin is an input (A) if
DE = 0; pin is an output (Y) if DE = 1.
B/Z
±15kV HBM ESD Protected, RS485, RS4-422 level inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0;
pin is an output (Z) if DE = 1.
V
System power supply input (4.5V to 5.5V).
CC
Typical Operating Circuits
ISL8483E, ISL8485E
+5V
+5V
+
+
0.1µF
0.1µF
8
8
V
CC
V
CC
RO
1
2
4
DI
R
D
RE
DE
R
R
3
2
T
T
7
6
B/Z
A/Y
DE
RE
7
6
B/Z
A/Y
3
4
DI
1
RO
R
D
GND
GND
5
5
FN6048.9
September 9, 2008
3
ISL8483E, ISL8485E
Absolute Maximum Ratings
Thermal Information
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
CC
Input Voltages
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
170
140
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V
Input/Output Voltages
+0.5V)
CC
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V
Short Circuit Duration
+0.5V)
CC
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in reflow solder processing
applications.
Operating Conditions
Temperature Range
ISL8485ECx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL848xEIx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
ISL8485EAx . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
ISL8485EMx. . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified.
CC
Typicals are at V
= 5V, T = +25°C, (Note 2)
CC
A
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(°C) (Note 12) TYP (Note 12) UNITS
DC CHARACTERISTICS
Driver Differential V
Driver Differential V
(no load)
V
V
Full
Full
Full
Full
-
2
-
3
V
V
V
V
V
OUT
OD1
OD2
CC
-
(with load)
R = 50Ω (RS-422), (Figure1)
R = 27Ω (RS-485), (Figure 1)
R = 27Ω or 50Ω, (Figure 1)
OUT
1.5
-
2.3
0.01
5
Change in Magnitude of Driver
Differential V for
ΔV
0.2
OD
OUT
Complementary Output States
Driver Common-Mode V
V
R = 27Ω or 50Ω, (Figure 1)
R = 27Ω or 50Ω, (Figure 1)
Full
Full
-
-
-
3
V
V
OUT
Change in Magnitude of Driver
Common-Mode V for
OC
ΔV
0.01
0.2
OC
OUT
Complementary Output States
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
V
DE, DI, RE
Full
Full
Full
Full
Full
Full
Full
Full
2
-
-
-
-
-
-
-
-
-
-
0.8
2
V
V
IH
V
DE, DI, RE
IL
I
DE, DI, RE (ISL8483E)
DI (ISL8485E)
-2
-2
-25
-
µA
µA
µA
mA
mA
V
IN1
IN1
IN1
IN2
I
I
I
2
DE, RE (ISL8485E)
25
1
Input Current (A, B), (Note 10)
DE = 0V, V
5.5V
= 0V or 4.5 to
V
V
= 12V
= -7V
CC
IN
IN
-
-0.8
0.2
Receiver Differential Threshold
Voltage
V
-7V ≤ V
≤ 12V
-0.2
TH
CM
Receiver Input Hysteresis
Receiver Output High Voltage
Receiver Output Low Voltage
ΔV
V
= 0V
25
-
3.5
-
70
-
-
-
mV
V
TH
CM
V
I
I
= -4mA, V = 200mV
ID
Full
Full
Full
OH
O
O
V
= -4mA, V = 200mV
ID
-
0.4
±1
V
OL
Three-State (high impedance)
Receiver Output Current
I
0.4V ≤ V ≤ 2.4V
-
-
µA
OZR
O
Receiver Input Resistance
R
-7V ≤ V
≤ 12V
CM
Full
12
-
-
kΩ
IN
FN6048.9
September 9, 2008
4
ISL8483E, ISL8485E
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified.
CC
Typicals are at V
= 5V, T = +25°C, (Note 2) (Continued)
CC
A
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(°C) (Note 12) TYP (Note 12) UNITS
No-Load Supply Current, (Note 3)
I
ISL8485E, DI, RE = 0V or V
DE = V
Full
Full
Full
Full
Full
Full
-
-
700
500
470
160
1
900
565
650
250
50
µA
µA
µA
µA
nA
mA
CC
CC
CC
DE = 0V
DE = V
ISL8483E, DI, RE = 0V or V
-
CC
CC
DE = 0V
ISL8483E, DE = 0V, RE = V , DI = 0V or V
-
Shutdown Supply Current
Driver Short-Circuit Current,
I
-
SHDN
CC
DE = V , -7V ≤ V or V ≤ 12V, (Note 4)
CC
I
35
-
250
OSD1
CC
Y
Z
V
= High or Low
O
Receiver Short-Circuit Current
I
0V ≤ V ≤ V
CC
Full
7
-
85
mA
OSR
O
SWITCHING CHARACTERISTICS (ISL8485E)
Driver Input to Output Delay
Driver Output Skew
t
, t
PLH PHL
R
R
R
C
C
C
C
= 54Ω, C = 100pF, (Figure 2)
Full
Full
Full
Full
Full
Full
Full
Full
25
18
-
30
2
50
10
25
70
70
70
70
150
-
ns
ns
DIFF
DIFF
DIFF
L
t
= 54Ω, C = 100pF, (Figure 2)
L
SKEW
t , t
Driver Differential Rise or Fall Time
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable from Output High
Driver Disable from Output Low
Receiver Input to Output Delay
= 54Ω, C = 100pF, (Figure 2)
3
-
11
17
14
19
13
40
5
ns
R
F
L
t
= 100pF, SW = GND, (Figure 3)
ns
ZH
L
L
L
L
t
= 100pF, SW = V , (Figure 3)
CC
-
ns
ZL
t
= 15pF, SW = GND, (Figure 3)
-
ns
HZ
t
= 15pF, SW = V , (Figure 3)
CC
-
ns
LZ
, t
t
(Figure 4)
(Figure 4)
30
-
ns
PLH PHL
Receiver Skew | t
- t
|
t
ns
PLH PHL
SKD
Receiver Enable to Output High
Receiver Enable to Output Low
Receiver Disable from Output High
Receiver Disable from Output Low
Maximum Data Rate
t
C
C
C
C
= 15pF, SW = GND, (Figure 5)
Full
Full
Full
Full
Full
-
9
50
50
50
50
-
ns
ZH
L
L
L
L
t
= 15pF, SW = V , (Figure 5)
CC
-
9
ns
ZL
t
= 15pF, SW = GND, (Figure 5)
-
9
ns
HZ
t
= 15pF, SW = V , (Figure 5)
CC
-
9
ns
LZ
f
(Note 11)
10
-
Mbps
MAX
SWITCHING CHARACTERISTICS (ISL8483E)
Driver Input to Output Delay
Driver Output Skew
t
, t
PLH PHL
R
R
R
C
C
C
C
= 54Ω, C = 100pF, (Figure 2)
Full
Full
Full
Full
Full
Full
Full
Full
25
250
-
800
160
800
-
2000
800
2000
2000
2000
3000
3000
2000
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
kbps
ns
ns
DIFF
DIFF
DIFF
L
t
= 54Ω, C = 100pF, (Figure 2)
L
SKEW
t , t
Driver Differential Rise or Fall Time
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable from Output High
Driver Disable from Output Low
Receiver Input to Output Delay
= 54Ω, C = 100pF, (Figure 2)
250
250
250
300
300
250
-
R
F
L
t
= 100pF, SW = GND, (Figure 3), (Note 5)
ZH
L
L
L
L
t
= 100pF, SW = V , (Figure 3), (Note 5)
CC
-
ZL
t
= 15pF, SW = GND, (Figure 3)
-
HZ
t
= 15pF, SW = V , (Figure 3)
CC
-
LZ
, t
t
(Figure 4)
(Figure 4)
350
25
10
10
10
10
-
PLH PHL
Receiver Skew | t
- t
|
t
SKD
PLH PHL
Receiver Enable to Output High
Receiver Enable to Output Low
Receiver Disable from Output High
Receiver Disable from Output Low
Maximum Data Rate
t
C
C
C
C
= 15pF, SW = GND, (Figure 5), (Note 6)
Full
Full
Full
Full
Full
Full
-
50
ZH
L
L
L
L
t
= 15pF, SW = V , (Figure 5), (Note 6)
CC
-
50
ZL
t
= 15pF, SW = GND, (Figure 5)
-
50
HZ
t
= 15pF, SW = V , (Figure 5)
CC
-
50
LZ
f
(Note 11)
(Note 7)
250
50
-
-
MAX
Time to Shutdown
t
200
-
600
2000
SHDN
Driver Enable from Shutdown to
Output High
t
C = 100pF, SW = GND, (Figure 3), (Notes 7, 8) Full
ZH(SHDN) L
FN6048.9
September 9, 2008
5
ISL8483E, ISL8485E
Electrical Specifications Test Conditions: V = 4.5V to 5.5V; Unless Otherwise Specified.
CC
Typicals are at V
= 5V, T = +25°C, (Note 2) (Continued)
CC
A
TEMP
MIN
MAX
PARAMETER
SYMBOL
TEST CONDITIONS
(°C) (Note 12) TYP (Note 12) UNITS
Driver Enable from Shutdown to
Output Low
t
C = 100pF, SW = V , (Figure 5), (Notes 7, 8) Full
-
-
-
-
-
-
2000
2500
2500
ns
ns
ns
ZL(SHDN)
L
L
L
CC
Receiver Enable from Shutdown to
Output High
t
C
C
= 15pF, SW = GND, (Figure 5), (Notes 7, 9) Full
ZH(SHDN)
Receiver Enable from Shutdown to
Output Low
t
= 15pF, SW = V , (Figure 5), (Notes 7, 9)
CC
Full
ZL(SHDN)
ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z)
All Other Pins
Human Body Model
25
25
-
-
±15
>±7
-
-
kV
kV
NOTES:
2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
3. Supply current specification is valid for loaded drivers when DE = 0V.
4. Applies to peak current. See “Typical Performance Curves” on page 10 for more information.
5. When testing the ISL8483E, keep RE = 0 to prevent the device from entering SHDN.
6. When testing the ISL8483E, the RE signal high time must be short enough (typically <200ns) to prevent the device from entering SHDN.
7. The ISL8483E is put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are guaranteed
not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See “Low Power
Shutdown Mode (ISL8483E Only)” on page 9.
8. Keep RE = V , and set the DE signal low time >600ns to ensure that the device enters SHDN.
CC
9. Set the RE signal high time >600ns to ensure that the device enters SHDN.
10. Devices meeting these limits are denoted as “single unit load (1 UL)” transceivers. The RS-485 standard allows up to 32 Unit Loads on the bus.
11. Limits established by characterization and are not production tested.
12. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
Test Circuits and Waveforms
R
DE
V
CC
Z
Y
DI
V
D
OD
V
R
OC
FIGURE 1. DRIVER V
AND V
OD
OC
FN6048.9
September 9, 2008
6
ISL8483E, ISL8485E
Test Circuits and Waveforms (Continued)
3V
0V
DI
1.5V
PLH
1.5V
PHL
t
t
t
V
OH
50%
50%
50%
C
= 100pF
= 100pF
OUT (Y)
L
DE
DI
V
V
OL
CC
Z
Y
t
PHL
PLH
R
DIFF
D
V
C
OH
L
OUT (Z)
50%
90%
SIGNAL
GENERATOR
V
OL
+V
OD
90%
10%
DIFF OUT (Y - Z)
10%
-V
OD
t
t
R
F
SKEW = |t
PLH
(Y or Z) - t
(Z or Y)|
PHL
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2A. TEST CIRCUIT
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
DI
Z
Y
500Ω
V
CC
D
GND
SW
SIGNAL
GENERATOR
C
3V
L
DE
1.5V
1.5V
NOTE 7
0V
(SHDN) FOR ISL8483E ONLY
PARAMETER OUTPUT
t
, t
ZH ZH(SHDN)
NOTE 7
t
HZ
RE
X
DI
SW
GND
C
(pF)
OUTPUT HIGH
2.3V
L
V
OH
V
- 0.5V
OH
t
Y/Z
Y/Z
Y/Z
Y/Z
Y/Z
Y/Z
1 / 0
0 / 1
15
HZ
OUT (Y, Z)
0V
t
X
V
15
LZ
CC
t
0 (Note 5) 1 / 0
0 (Note 5) 0 / 1
1 (Note 8) 1 / 0
1 (Note 8) 0 / 1
GND
100
100
100
100
t
, t
ZH
ZL ZL(SHDN)
t
LZ
NOTE 7
V
t
V
CC
OL
ZL
CC
OUT (Y, Z)
2.3V
t
GND
ZH(SHDN)
V
+ 0.5V
V
OL
OUTPUT LOW
t
V
CC
ZL(SHDN)
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3A. TEST CIRCUIT
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
3V
0V
RE
15pF
A
1.5V
PLH
1.5V
PHL
B
+1.5V
RO
R
A
t
t
V
CC
SIGNAL
GENERATOR
50%
50%
RO
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. RECEIVER PROPAGATION DELAY
FIGURE 4A. TEST CIRCUIT
FN6048.9
September 9, 2008
7
ISL8483E, ISL8485E
Test Circuits and Waveforms (Continued)
RE
B
1kΩ
V
CC
RO
R
GND
NOTE 7
SW
SIGNAL
A
3V
0V
GENERATOR
15pF
RE
1.5V
1.5V
HZ
(SHDN) FOR ISL8483E ONLY
PARAMETER
t
, t
ZH ZH(SHDN)
t
OUTPUT HIGH
1.5V
DE
A
SW
GND
V
OH
NOTE 7
RO
V
- 0.5V
OH
t
0
0
0
0
0
0
+1.5V
-1.5V
+1.5V
-1.5V
+1.5V
-1.5V
HZ
0V
t
V
LZ
CC
t
, t
ZL ZL(SHDN)
t
LZ
t
(Note 6)
(Note 6)
GND
ZH
V
CC
OL
NOTE 7
RO
t
V
ZL
CC
1.5V
V
+ 0.5V
V
t
(Note 9)
(Note 9)
GND
OL
ZH(SHDN)
OUTPUT LOW
t
V
CC
ZL(SHDN)
FIGURE 5A. TEST CIRCUIT
FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES
FIGURE 5B. MEASUREMENT POINTS
Receiver inputs function with common mode voltages as
great as ±7V outside the power supplies (i.e., +12V and
-7V), making them ideal for long networks where induced
voltages are a realistic concern.
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows only
one driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 specification requires
that drivers must handle bus contention without sustaining
any damage.
All the receivers include a “fail-safe if open” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating).
Receivers easily meet the data rates supported by the
corresponding driver.
ISL8483E, ISL8485E receiver outputs are three-stat-able via
the active low RE input.
Driver Features
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000 feet, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
The RS485, RS-422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485), and at
least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI.
Drivers of the ISL8483E, ISL8485E are tri-stateable via the
active high DE input.
Receiver Features
The ISL8483E driver outputs are slew rate limited to
minimize EMI, and to minimize reflections in un-terminated
or improperly terminated networks. Data rate on these slew
rate limited versions is a maximum of 250kbps. Outputs of
the ISL8485E driver are not limited, so faster output
transition times allow data rates of at least 10Mbps.
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is ±200mV, as required by the RS422 and RS-485
specifications.
Receiver input impedance surpasses the RS-422 spec of
4kΩ, and meets the RS-485 “Unit Load” requirement of 12kΩ
minimum.
FN6048.9
September 9, 2008
8
ISL8483E, ISL8485E
Data Rate, Cables, and Terminations
Low Power Shutdown Mode (ISL8483E Only)
RS485, RS-422 are intended for network lengths up to 4000
feet, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 10Mbps
are limited to lengths less than 100 feet, while the 250kbps
versions can operate at full data rates with lengths in excess
of 1000 feet.
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but the ISL8483E
includes a shutdown feature that reduces the already low
quiescent I
to a 1nA trickle. The ISL8483E enters
CC
shutdown whenever the receiver and driver are
simultaneously disabled (RE = V and DE = GND) for a
CC
period of at least 600ns. Disabling both the driver and the
receiver for less than 50ns guarantees that the ISL8483E
will not enter shutdown.
Twisted pair is the cable of choice for RS485, RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
differential receivers in these ICs.
Note that receiver and driver enable times increase when
the ISL8483E enables from shutdown. Refer to Notes 5-8,
on page 6, at the end of the “Electrical Specifications” table,
for more information.
Proper termination is imperative, when using the 10Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
ESD Protection
All pins on these interface devices include class 3 Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs) incorporate
advanced structures allowing them to survive ESD events in
excess of ±15kV HBM. The RS-485 pins are particularly
vulnerable to ESD damage because they typically connect to
an exposed port on the exterior of the finished product.
Simply touching the port pins, or connecting a cable, can
cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not
it is powered up, protect without allowing any latchup
mechanism to activate, and without degrading the RS-485
common mode range of -7V to +12V. This built-in ESD
protection eliminates the need for board level protection
structures (e.g., transient suppression diodes), and the
associated, undesirable capacitive load they present.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. multipoint (multi-driver) systems require
that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged. The
ISL848xE devices meet this requirement via driver output
short circuit current limits, and on-chip thermal shutdown
circuitry.
Human Body Model Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge stored on a 100pF capacitor through a
1.5kΩ current limiting resistor into the pin under test. The
HBM method determines an IC’s ability to withstand the ESD
events typically present during handling and manufacturing.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 specification, even at the common
mode voltage range extremes. Additionally, these devices
utilize a foldback circuit which reduces the short circuit
current, and thus the power dissipation, whenever the
contending voltage exceeds either supply.
The RS-485 pin survivability on this high ESD family has
been characterized to be in excess of ±15kV, for discharges
to GND.
In the event of a major short circuit condition, ISL848xE
devices also include a thermal shutdown feature that
disables the drivers whenever the die temperature becomes
excessive. This eliminates the power dissipation, allowing
the die to cool. The drivers automatically re-enable after the
die temperature drops about 15°. If the contention persists,
the thermal shutdown/re-enable cycle repeats until the fault
is cleared. Receivers stay operational during thermal
shutdown.
FN6048.9
September 9, 2008
9
ISL8483E, ISL8485E
Typical Performance Curves V = 5V, T = +25°C, ISL8483E and ISL8485E; Unless Otherwise Specified.
CC
A
90
80
70
60
50
40
30
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
R
= 100Ω
DIFF
R
= 54Ω
20
10
0
DIFF
0
1
2
3
4
5
-40
0
50
85
-25
25
75
DIFFERENTIAL OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
160
140
120
700
ISL8485E, DE = V , RE = X
CC
650
Y OR Z = LOW
600
550
500
450
400
350
100
80
ISL8485E, DE = GND, RE = X,
60
40
20
0
ISL8483E, DE = V , RE = X
CC
-20
Y OR Z = HIGH
-40
300
250
200
150
-60
-80
-100
ISL8483E, DE = GND, RE = GND
-120
-40
0
50
85
-25
25
75
-7 -6
-4
-2
0
2
4
6
8
10
12
o
TEMPERATURE ( C)
OUTPUT VOLTAGE (V)
FIGURE 9. SUPPLY CURRENT vs TEMPERATURE
FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
1200
1100
400
t
t
PLHY
300
200
100
0
PLHZ
1000
900
800
700
600
500
|t
- t |
PHLY PLHZ
t
PHLY
|t
- t |
PLHY PHLZ
t
PHLZ
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓AND Z↑|
-40
0
50
85
-25
25
75
-40
0
50
85
-25
25
75
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 10. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL8483E)
FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL8483E)
FN6048.9
September 9, 2008
10
ISL8483E, ISL8485E
Typical Performance Curves V = 5V, T = +25°C, ISL8483E and ISL8485E; Unless Otherwise Specified. (Continued)
CC
A
40
3.0
35
2.5
|t |
- t
PHLY PLHZ
t
PHLY
t
PHLZ
30
25
20
|t
- t |
PLHY PHLZ
2.0
t
PLHZ
t
PLHY
1.5
|CROSSING PT. OF Y↑ AND Z↓ - CROSSING PT. OF Y↓ AND Z↑|
1
-40
0
50
85
-25
25
75
-40
0
50
85
-25
25
75
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 12. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL8485E)
FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL8485E)
R
= 54Ω, C = 100pF
L
R
= 54Ω, C = 100pF
L
DIFF
DIFF
5
0
5
0
DI
DI
5
0
5
0
RO
RO
4
3
2
4
B/Z
A/Y
B/Z
3
2
A/Y
1
0
1
0
TIME (400ns/DIV)
TIME (400ns/DIV)
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL8483E)
FIGURE 15. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL8483E)
R
= 54Ω, C = 100pF
L
R
= 54Ω, C = 100pF
L
DIFF
DIFF
5
0
5
0
DI
DI
5
0
5
0
RO
RO
4
3
2
4
B/Z
A/Y
A/Y
B/Z
3
2
1
0
1
0
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 16. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL8485E)
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL8485E)
FN6048.9
September 9, 2008
11
ISL8483E, ISL8485E
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
518
PROCESS:
Si Gate CMOS
FN6048.9
September 9, 2008
12
ISL8483E, ISL8485E
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
INCHES
MILLIMETERS
1
2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
A
A1
A2
B
-
4
-A-
D
E
0.015
0.115
0.014
0.045
0.008
0.355
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
9.01
0.13
7.62
6.10
4
BASE
PLANE
0.195
0.022
0.070
0.014
0.400
-
4.95
0.558
1.77
0.355
10.16
-
-
A2
A
-C-
-
SEATING
PLANE
L
C
L
B1
C
8, 10
D1
B1
eA
-
A
A
1
D1
e
D
5
eC
C
B
eB
D1
E
5
0.010 (0.25) M
C
B S
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
English and Metric dimensions, the inch dimensions control.
e
e
6
A
B
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
-
0.430
0.150
-
10.92
3.81
7
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
L
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated
N
8
8
in JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
e
6. E and
pendicular to datum
7. e and e are measured at the lead tips with the leads uncon-
are measured with the leads constrained to be per-
A
-C-
.
B
C
strained. e must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
FN6048.9
September 9, 2008
13
ISL8483E, ISL8485E
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
N
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
1.35
0.10
0.33
0.19
4.80
3.80
MAX
1.75
0.25
0.51
0.25
5.00
4.00
NOTES
-B-
A
A1
B
C
D
E
e
0.0532
0.0040
0.013
0.0688
0.0098
0.020
-
-
1
2
3
L
9
SEATING PLANE
A
0.0075
0.1890
0.1497
0.0098
0.1968
0.1574
-
-A-
3
h x 45°
D
4
-C-
0.050 BSC
1.27 BSC
-
α
H
h
0.2284
0.0099
0.016
0.2440
0.0196
0.050
5.80
0.25
0.40
6.20
0.50
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
α
8
8
7
NOTES:
0°
8°
0°
8°
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6048.9
September 9, 2008
14
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