NDL5561P2 [RENESAS]

FIBER OPTIC AVELANCHE PHOTODIODE DETECTOR, 1000-1600nm, PANEL MOUNT, THROUGH HOLE MOUNT;


型号：	NDL5561P2
厂家：	RENESAS TECHNOLOGY CORP
描述：	FIBER OPTIC AVELANCHE PHOTODIODE DETECTOR, 1000-1600nm, PANEL MOUNT, THROUGH HOLE MOUNT 局域网光纤
文件：	总10页 (文件大小：194K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

To our customers,

Old Company Name in Catalogs and Other Documents

On April 1^st, 2010, NEC Electronics Corporation merged with Renesas Technology

Corporation, and Renesas Electronics Corporation took over all the business of both

companies. Therefore, although the old company name remains in this document, it is a valid

Renesas Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1^st, 2010

Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation (http://www.renesas.com)

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DATA SHEET

PHOTO DIODE

NDL5561P Series

1 000 to 1 600 nm OPTICAL FIBER COMMUNICATIONS

φ 80 µm InGaAs AVALANCHE PHOTO DIODE MODULE

DESCRIPTION

The NDL5561P Series is an InGaAs avalanche photo diode module with GI-62.5/125 multimode fiber. It is

designed for detectors of long wavelength transmission systems and covers the wavelength range between 1 000

and 1 600 nm. It features high quantum efficiency and high speed response.

FEATURES

•

Small dark current

I^D= 8 nA

High quantum efficiency

η = 90 % @ λ = 1 300 nm, M = 1

η = 77 % @ λ = 1 550 nm, M = 1

f^C= 1.2 GHz @ M = 20

φ 80 µm

•

High speed response

Detecting area size

Coaxial module with multimode fiber (GI-62.5/125)

PACKAGE DIMENSIONS

in millimeters

NDL5561P

NDL5561P1

NDL5561P2

Optical Fiber:

GI-62.5/125

Optical Fiber:

GI-62.5/125

Optical Fiber:

GI-62.5/125

Length: 1 m MIN.

Shrunk tube

2.5

14.0±0.1

+0.0

φ2.5

2.5

6.0

–0.1

+0.0

6.0

–0.1

6.0

–0.1

2– 2.2

0.45

2–φ2.5

2.0

18.0±0.1

12.0±0.1

16.0±0.2

PIN CONNECTIONS

1 Anode (Negative)

2 Cathode (Positive)

3 Case

The information in this document is subject to change without notice.

Document No. P11348EJ3V0DS00 (3rd edition)

(Previous No. LD-2372)

The mark • shows major revised points.

Date Published February 1997 NS

Printed in Japan

1996

NDL5561P Series

ORDERING INFORMATION

Part Number

NDL5561P

Available Connector

Flange Type

No Flange

Without Connector

NDL5561PC

NDL5561PD

NDL5561P1

NDL5561P1C

NDL5561P1D

NDL5561P2

NDL5561P2C

NDL5561P2D

With FC-PC Connector

With SC-PC Connector

Without Connector

Flat Mount Flange

Vertical Flange

With FC-PC Connector

With SC-PC Connector

Without Connector

With FC-PC Connector

With SC-PC Connector

ABSOLUTE MAXIMUM RATINGS (T^C= 25 °C, unless otherwise specified)

Parameter

Forward Current

Symbol

I^F

Ratings

Unit

°C

Reverse Current

I^R

0.5

Operating Case Temperature

Storage Temperature

T^C

–40 to +85

260

T^stg

T^sld

°C

Lead Soldering Temperature (10 s)

°C

NDL5561P Series

ELECTRO-OPTICAL CHARACTERISTICS (T^C= 25 °C)

Parameter

Symbol

V^(BR)R

δ^*1

Conditions

MIN.

TYP.

MAX.

100

Unit

Reverse Breakdown Voltage

I^D= 100 µA

Temperature Coefficient of

Reverse Breakdown Voltage

0.2

%/°C

Dark Current

I^D

I^DM

C^t

f^C

V^R= V^(BR)R× 0.9

Multiplied Dark Current

Terminal Capacitance

Cut-off Frequency

M = 2 to 10

V^R= V^(BR)R× 0.9, f = 1 MHz

M = 10

1.0

2.0

1.0

GHz

M = 20

1.2

Quantum Efficiency

Sensitivity

λ = 1 300 nm, M = 1

λ = 1 550 nm, M = 1

λ = 1 300 nm, M = 1

λ = 1 550 nm, M = 1

λ = 1 550 nm, I^po= 1.0 µA,

V^R= V (@ I^D= 1 µA)

= 1 300 nm, 1 500 nm, I^po= 1.0 A,

0.80

0.81

0.94

0.96

A/W

Multiplication Factor

Excess Noise Factor^*2

0.7

M = 10, f = 35 MHz, B = 1 MHz

V^R= V^(BR)R< 25 °C + ∆T °C > – V^(BR)R< 25 °C >

∆T °C V^(BR)R< 25 °C >

*1 δ =

*2 F = M^X

NDL5561P Series

TYPICAL CHARACTERISTICS (T^C= 25 °C, unless otherwise specified)

QUANTUM EFFICIENCY vs.

WAVELENGTH

EXCESS NOISE FACTOR vs.

MULTIPLICATION FACTOR

100

1 300 nm ( ), 1 550 nm ( )

f = 35 MHz, B = 1 MHz

0.5

0.4

0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7

100

Wavelength λ ( µm)

Multiplication Factor M

DARK CURRENT AND PHOTO CURRENT

vs. REVERSE VOLTAGE

oduct

DARK CURRENT vs. REVERSE VOLTAGE

10²

10^–4

10^–5

10^–6

10^–7

10^–8

10^–9

10^–10

10^–11

10^–12

10^–5

λ = 1 300 nm

po = 1 µA

10^–6

10^–7

10^–8

_C= 100 ˚C

Photo Current

10^–9

+60 ˚C

10^–10

0 ˚C

ued Pr

10^–11

10^–12

(V)

Reverse Voltage V

FREQUENCY RESPONSE

Dark Current

λ = 1 300, 1 550 nm

= 50 Ω

M = 5

–2

–4

–6

–8

–10

Discontin

100

10²

10³

Frequency f (MHz)

Reverse Voltage V

(V)

NDL5561P Series

HANDLING PRECAUTION for PD/APD MODULE

The NEC PD/APD module has heat shrink tubing to protect the ferrule edge (*1) and the junction between the

ferrule and the module body (*2). In order to avoid breaking the fiber and/or optical coupling degradation, NEC

recommends the following handling precautions.

1. Do not make the fiber bend radius less than 30 mm (*3).

2. Do not bend the fiber within the 18 mm section from the module body (*4).

3. Do not stress the ferrule with a lateral force exceeding 500 g (*5).

fiber

oduct

(*1)

ferrule (*5)

ued Pr

(*2)

module body

Discontin

NDL5561P Series

InGaAs APD/PD FAMILY

Features

APD

PIN-PD

Remarks

φ 30 µm

φ 50 µm

φ 80 µm

φ 50 µm

φ 80 µm

φ 120 µm

Packages

(for 2.5 Gb/s) (for 2.5 Gb/s)

(for 2.5 Gb/s)

TO-18 type Can

Chip on Carrier

NDL5530

NDL5530C

–

NDL5520C

–

NDL5500

NDL5500C

–

NDL5510

NDL5510C

–

3 pins

–

Receptacle

Module

NDL5471RC 3 pins

NDL5471RD RC: FC receptacle

RD: SC receptacle

Coaxial Module

with MMF

–

NDL5521P

NDL5551P

NDL5561P^*2

NDL5561P1^*2NDL5421P1 NDL5461P1

NDL5561P2^*2NDL5421P2 NDL5461P2

NDL5421P

NDL5461P

–

P1, P2: With flange

NDL5590P Series: With

Pre-AMP

NDL5521P1 NDL5551P1

NDL5521P2 NDL5551P2

NDL5553P^*1

NDL5553P1^*1

NDL5553P2^*1

NDL5590P

NDL5590P1

NDL5590P2

Coaxial Module

with SMF

NDL5531P

NDL5531P1

NDL5531P2

–

NDL5553PS^*1

NDL5553P1S^*1

NDL5553P2S^*1

–

NDL5481P^*3

NDL5481P1^*3

NDL5481P2^*3

–

14-pin DIP

–

NDL5522P

–

NDL5506P

–

NDL5422P

–

∆T = 45 K (@ IC = 1.1 A)

Module with TEC

NDL5506PS

PS: With SMF

6-pin BFY Module

with MMF

–

With Pre-AMP

8-pin Mini-DIL

with SMF

NDL8800P

*1 For OTDR

*2 With GI-62.5/125

*3 For analog application (optical CATV)

Remark Modules are available FC-PC connector or optional SC-PC connector.

NDL5561P Series

REFERENCE

Document Name

Document No.

LEI-1201

NEC semiconductor device reliability/quality control system

Quality grades on NEC semiconductor devices

Semiconductor device mounting technology manual

Guide to quality assurance for semiconductor devices

Semiconductor selection guide

C11535E

C10535E

MEI-1202

X10679E

NDL5561P Series

CAUTION

Within this device there exists GaAs (Gallium Arsenide) material which is a

harmful substance if ingested. Please do not under any circumstances break the

hermetic seal.

The export of this product from Japan is prohibited without governmental license. To export or re-export this product from

a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales

representative.

No part of this document may be copied or reproduced in any form or by any means without the prior written

consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this

document.

NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from use of a device described herein or any other liability arising

from use of such device. No license, either express, implied or otherwise, is granted under any patents,

copyrights or other intellectual property rights of NEC Corporation or others.

While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,

the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or

property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety

measures in its design, such as redundancy, fire-containment, and anti-failure features.

NEC devices are classified into the following three quality grades:

"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on

a customer designated "quality assurance program" for a specific application. The recommended applications

of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each

device before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,

audio and visual equipment, home electronic appliances, machine tools, personal electronic

equipment and industrial robots

Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster

systems, anti-crime systems, safety equipment and medical equipment (not specifically designed

for life support)

Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life

support systems or medical equipment for life support, etc.

The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.

If customers intend to use NEC devices for applications other than those specified for Standard quality grade,

they should contact an NEC sales representative in advance.

Anti-radioactive design is not implemented in this product.

M4 96. 5

NDL5561P2 [RENESAS]

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