NE5550979A-T1A-A [RENESAS]

Silicon Power LDMOS FET; 硅功率LDMOS FET
NE5550979A-T1A-A
型号: NE5550979A-T1A-A
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Silicon Power LDMOS FET
硅功率LDMOS FET

文件: 总13页 (文件大小:790K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data Sheet  
NE5550979A  
Silicon Power LDMOS FET  
FEATURES  
R09DS0031EJ0300  
Rev.3.00  
Mar 12, 2013  
High Output Power  
: Pout = 39.5 dBm TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm)  
High power added efficiency : ηadd = 66% TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm)  
High Linear gain  
High ESD tolerance  
Suitable for VHF to UHF-BAND Class-AB power amplifier.  
: GL = 22 dB TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 10 dBm)  
: ESD tolerance > 8 kV (IEC61000-4-2, Contact discharge)  
APPLICATIONS  
150 MHz Band Radio System  
460 MHz Band Radio System  
900 MHz Band Radio System  
ORDERING INFORMATION  
Part Number  
Order Number  
Package Marking  
Supplying Form  
NE5550979A  
NE5550979A-A  
79A  
W6  
12 mm wide embossed taping  
Gate pin faces the perforation side of the tape  
(Pb Free)  
NE5550979A-T1  
NE5550979A-T1-A  
12 mm wide embossed taping  
Gate pin faces the perforation side of the tape  
Qty 1 kpcs/reel  
NE5550979A-T1A NE5550979A-T1A-A  
12 mm wide embossed taping  
Gate pin faces the perforation side of the tape  
Qty 5 kpcs/reel  
Remark To order evaluation samples, please contact your nearby sales office.  
Part number for sample order: NE5550979A  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)  
Operation in excess of any one of these parameters may result in permanent damage.  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
Symbol  
VDS  
Ratings  
Unit  
V
30  
6.0  
VGS  
IDS  
V
3.0  
A
Total Power Dissipation Note  
Channel Temperature  
Storage Temperature  
Note: Value at TC = 25°C  
Ptot  
25  
W
°C  
°C  
Tch  
150  
Tstg  
55 to +150  
CAUTION  
Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
The mark <R> shows major revised points.  
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 1 of 11  
NE5550979A  
RECOMMENDED OPERATING RANGE (TA = 25°C)  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
Symbol  
VDS  
Test Conditions  
MIN.  
1.65  
TYP.  
7.5  
MAX.  
9.0  
2.85  
Unit  
V
VGS  
2.20  
1.7  
V
IDS  
A
Input Power  
Pin  
f = 460 MHz, VDS = 7.5 V  
25  
30  
dBm  
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)  
Parameter  
DC Characteristics  
Symbol  
Test Conditions  
MIN.  
TYP.  
MAX.  
Unit  
Gate to Source Leakage Current  
Drain to Source Leakage Current  
(Zero Gate Voltage Drain Current)  
Gate Threshold Voltage  
Drain to Source Breakdown Voltage  
Transconductance  
IGSS  
IDSS  
VGS = 6.0 V  
100  
10  
nA  
VDS = 25 V  
μA  
Vth  
BVDSS  
Gm  
VDS = 7.5 V, IDS = 1.0 mA  
IDS = 10 μA  
1.15  
25  
1.65  
37  
2.25  
2.9  
V
V
VDS = 7.5 V, IDS = 700 100 mA  
Channel to Case  
1.8  
2.2  
5.0  
S
Thermal Resistance  
RF Characteristics  
Rth  
°C/W  
Output Power  
Pout  
IDS  
f = 460 MHz, VDS = 7.5 V,  
Pin = 25 dBm,  
38.5  
39.5  
1.70  
68  
dBm  
A
Drain Current  
Power Drain Efficiency  
Power Added Efficiency  
Linear Gain  
ηd  
IDset = 200 mA (RF OFF)  
%
ηadd  
66  
%
Note 1  
GL  
22.0  
39.6  
1.60  
75  
dB  
dBm  
A
Output Power  
Pout  
IDS  
f = 157 MHz, VDS = 7.5 V,  
Pin = 23 dBm,  
Drain Current  
Power Drain Efficiency  
Power Added Efficiency  
Linear Gain  
ηd  
IDset = 200 mA (RF OFF)  
%
ηadd  
73  
%
Note 2  
GL  
25.0  
38.6  
1.76  
55  
dB  
dBm  
A
Output Power  
Pout  
IDS  
f = 900 MHz, VDS = 7.5 V,  
Pin = 27 dBm,  
Drain Current  
Power Drain Efficiency  
Power Added Efficiency  
Linear Gain  
ηd  
IDset = 200 mA (RF OFF)  
%
ηadd  
52  
%
Note 1  
GL  
16.0  
dB  
Note 1 : Pin = 10 dBm  
Note 2 : Pin = 5 dBm  
Remark DC performance is 100% testing. RF performance is testing several samples per wafer.  
Wafer rejection criteria for standard devices is 1 reject for several samples.  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 2 of 11  
NE5550979A  
TEST CIRCUIT SCHEMATIC FOR 460 MHz  
V
GS  
V
DS  
R1  
C1  
L1  
C1  
IN  
OUT  
50 Ω  
50 Ω  
C10  
C22  
C11  
C12  
C20  
C21  
FET  
NE5550979A (WS)  
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS  
Symbol  
C1  
Value  
1 μ F  
100 pF  
24 pF  
Type  
GRM31CR72A105KA01B  
Maker  
Murata  
Murata  
C10  
GRM1882C1H101JA01  
ATC100A240JW  
C11  
American Technical  
Ceramics  
C12  
C20  
C21  
C22  
R1  
2.4 pF  
27 pF  
ATC100A2R4BW  
ATC100A270JW  
ATC100A1R8BW  
ATC100A101JW  
American Technical  
Ceramics  
American Technical  
Ceramics  
1.8 pF  
100 pF  
4.7 kΩ  
American Technical  
Ceramics  
American Technical  
Ceramics  
1/10 W Chip Resistor  
SSM  
SSM_RG1608PB472  
L1  
PCB  
123 nH  
φ 0.5 mm, φ D = 3 mm, 10 Turns  
R1766, t = 0.4 mm, εr = 4.5, size = 30 × 48 mm  
WAKA 01K0790-20  
Ohesangyou  
Panasonic  
WAKA  
<R>  
SMA Connecter  
COMPONENT LAYOUT OF TEST CIRCUIT FOR 460 MHz  
VGS  
GND  
VDS  
C1  
C1  
L1  
C12  
C11  
C20 C21  
R1  
C22  
C10  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 3 of 11  
NE5550979A  
TYPICAL CHARACTERISTICS 1 (TA = 25°C)  
R: f = 460MHz, VDS = 3.6/4.5/6/7.5/8.4/9 V, IDset = 200 mA, Pin = 0 to 32 dBm  
IM: f1 = 460MHz, f2 = 461 MHz, VDS = 3.6/4.5/6/7.5/8.4/9 V, IDset = 200mA, Pout (2 tone) = 12 to 38 dBm  
POWER GAIN, POWER ADDED  
EFFICIENCY vs. INPUT POWER  
OUTPUT POWER, DRAIN CURRENT  
vs. INPUT POWER  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
40  
35  
30  
25  
20  
15  
10  
5
80  
70  
60  
50  
40  
30  
20  
10  
0
P
P
P
P
P
out - 3.6 V  
out - 4.5 V  
out - 6.0 V  
out - 7.5 V  
out - 9 V  
G
G
G
G
G
p
p
p
p
p
- 3.6 V  
- 4.5 V  
- 6 V  
- 7.5 V  
- 9 V  
I
I
I
I
I
DS - 3.6 V  
DS - 4.5 V  
DS - 6.0 V  
DS - 7.5 V  
DS - 9 V  
add - 3.6 V  
add - 4.5 V  
add - 6.0 V  
add - 7.5 V  
add - 9 V  
η
η
η
η
η
η
0
0
5  
0
5
10  
15 20  
25  
30 35  
5  
0
5
10  
15 20  
25  
30 35  
Input Power Pin (dBm)  
Input Power Pin (dBm)  
IM3/IM5  
vs. 2 TONES OUTPUT POWER  
2f  
0
, 3f vs. OUTPUT POWER  
0
0
10  
20  
30  
40  
50  
60  
70  
0
2f  
2f  
2f  
2f  
3f  
3f  
3f  
3f  
2f  
3f  
0
0
0
0
0
0
0
0
0
0
- 3.6 V  
- 4.5 V  
- 6.0 V  
- 7.5 V  
- 3.6 V  
- 4.5 V  
- 6.0 V  
- 7.5 V  
- 9 V  
IM  
IM  
IM  
IM  
IM  
IM  
IM  
IM  
IM  
IM  
3
3
3
3
5
5
5
5
3
5
- 3.6 V  
- 4.5 V  
- 6 V  
- 7.5 V  
- 3.6 V  
- 4.5 V  
- 6.0 V  
- 7.5 V  
- 9 V  
10  
20  
30  
40  
50  
60  
70  
- 9 V  
- 9 V  
10  
15  
20  
25  
30  
35  
40  
45  
10  
15  
20  
25  
30  
35  
40  
Output Power Pout (dBm)  
2 Tones Output Power Pout (2 tone) (dBm)  
Remark The graphs indicate nominal characteristics.  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 4 of 11  
NE5550979A  
<R>  
TEST CIRCUIT SCHEMATIC FOR 157 MHz  
VGS  
V
DS  
R1  
C1  
L1  
C1  
IN  
OUT  
50 Ω  
50 Ω  
C10  
C24  
L11  
L20  
C11  
C12  
C20  
C21  
C22  
C23  
FET  
NE5550979A  
<R>  
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS  
Symbol  
C1  
Value  
1 μ F  
100 pF  
4.7 pF  
Type  
GRM31CR72A105KA01B  
Maker  
Murata  
Murata  
C10  
GRM1882C1H101JA01  
ATC100A4R7CT  
C11  
American Technical  
Ceramics  
C12  
C20  
C21  
C22  
C23  
C24  
R1  
39 pF  
2.0 pF  
22 pF  
68 pF  
12 pF  
100 pF  
4.7 kΩ  
ATC100A390JT  
ATC100A2R0CT  
ATC100A220JT  
ATC100A680JT  
ATC100A120JT  
ATC100A101JT  
American Technical  
Ceramics  
American Technical  
Ceramics  
American Technical  
Ceramics  
American Technical  
Ceramics  
American Technical  
Ceramics  
American Technical  
Ceramics  
1/10 W Chip Resistor  
SSM  
SSM_RG1608PB472  
L1  
L11  
123 nH  
27 nH  
35 nH  
φ 0.5 mm, φ D = 3 mm, 10 Turns  
LLQ2012-F27N  
Ohesangyou  
TOKO  
L20  
φ 0.5 mm, φ D = 2.4 mm, 5 Turns  
R1766, t = 0.4 mm, εr = 4.5, size = 30 × 48 mm  
WAKA 01K0790-20  
Ohesangyou  
Panasonic  
WAKA  
PCB  
SMA Connecter  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 5 of 11  
NE5550979A  
COMPONENT LAYOUT OF TEST CIRCUIT FOR 157 MHz  
VGS  
GND  
VDS  
C1  
C1  
L1  
L11  
C12  
C11  
C20  
C21  
C22  
C10  
L20  
R1  
C23 C24  
TYPICAL CHARACTERISTICS 2 (TA = 25°C)  
R: f = 157 MHz, VDS = 3.6/4.5/6/7.5/9 V, IDset = 200 mA, Pin = 0 to 27 dBm  
POWER GAIN, POWER ADDED  
EFFICIENCY vs. INPUT POWER  
OUTPUT POWER, DRAIN CURRENT  
vs. INPUT POWER  
45  
40  
35  
30  
25  
20  
15  
10  
5
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
40  
35  
30  
25  
20  
15  
10  
5
80  
70  
60  
50  
40  
30  
20  
10  
0
P
P
P
P
P
out - 3.6 V  
out - 4.5 V  
out - 6.0 V  
out - 7.5 V  
out - 9 V  
G
G
G
G
G
p
p
p
p
- 3.6 V  
- 4.5 V  
- 6 V  
- 7.5 V  
- 9 V  
η p - 3.6 V  
ηadd - 4.5 V  
ηadd - 6 V  
ηadd - 7.5 V  
ηadd - 9 V  
η
I
I
DS - 3.6 V  
- 4.5 V  
I
I
I
DDSS - 6 V  
DS - 7.5 V  
DS - 9 V  
0
0
5  
0
5
10  
15  
20  
25  
30  
5  
0
5
10  
15  
20  
25  
30  
Input Power Pin (dBm)  
Input Power Pin (dBm)  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 6 of 11  
NE5550979A  
TEST CIRCUIT SCHEMATIC FOR 900 MHz  
VGS  
V
DS  
R1  
C1  
L1  
C1  
IN  
OUT  
50 Ω  
50 Ω  
C10  
C23  
C11  
C20  
C21  
C22  
FET  
NE5550979A  
<R>  
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS  
Symbol  
C1  
Value  
1 μ F  
100 pF  
15 pF  
Type  
GRM31CR72A105KA01B  
Maker  
Murata  
Murata  
C10  
GRM1882C1H101JA01  
ATC100A150JW  
C11  
American Technical  
Ceramics  
C20  
C21  
C22  
C23  
R1  
3.3 pF  
3.3 pF  
12 pF  
ATC100A3R3BW  
ATC100A3R3BW  
ATC100A120JT  
ATC100A101JT  
American Technical  
Ceramics  
American Technical  
Ceramics  
American Technical  
Ceramics  
100 pF  
4.7 kΩ  
American Technical  
Ceramics  
1/10 W Chip Resistor  
SSM  
SSM_RG1608PB472  
L1  
PCB  
123 nH  
φ 0.5 mm, φ D = 3 mm, 10 Turns  
R1766, t = 0.4 mm, εr = 4.5, size = 30 × 48 mm  
WAKA 01K0790-20  
Ohesangyou  
Panasonic  
WAKA  
SMA Connecter  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 7 of 11  
NE5550979A  
COMPONENT LAYOUT OF TEST CIRCUIT FOR 900 MHz  
VGS  
VDS  
C1  
C1  
L1  
R1  
C22  
C11  
C10  
C23  
C21  
C20  
TYPICAL CHARACTERISTICS 3 (TA = 25°C)  
RF: f = 900 MHz VDS = 3.6/4.5/6/7.5/9 V, IDset = 200 mA, Pin = 0 to 32 dBm  
POWER GAIN, POWER ADDED  
EFFICIENCY vs. INPUT POWER  
OUTPUT POWER, DRAIN CURRENT  
vs. INPUT POWER  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
40  
35  
30  
25  
20  
15  
10  
5
80  
70  
60  
50  
40  
30  
20  
10  
0
G
G
G
G
G
p
p
p
p
p
- 3.6 V  
- 4.5 V  
- 6 V  
- 7.5 V  
- 9 V  
P
P
P
P
P
out - 3.6 V  
out - 4.5 V  
out - 6.0 V  
out - 7.5 V  
out - 9 V  
I
I
I
I
I
DS - 3.6 V  
DS - 4.5 V  
DS - 6.0 V  
DS - 7.5 V  
DS - 9 V  
η
add - 3.6 V  
ηadd  
- 4.5 V  
η
η
η
add - 6.0 V  
add - 7.5 V  
add - 9 V  
η
0
0
5  
0
5
10  
15 20  
25  
30 35  
5  
0
5
10  
15 20  
25  
30 35  
Input Power Pin (dBm)  
Input Power Pin (dBm)  
Remark The graphs indicate nominal characteristics.  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 8 of 11  
NE5550979A  
S-PARAMETERS  
S-parameters and noise parameters are provided on our web site in a form (S2P) that enables direct import of the  
parameters to microwave circuit simulators without the need for keyboard inputs.  
Click here to download S-parameters.  
[Products] [RF Devices] [Device Parameters]  
URL http://www.renesas.com/products/microwave/  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 9 of 11  
NE5550979A  
PACKAGE DIMENSIONS  
79A (UNIT: mm)  
(Bottom View)  
4.2 MAX.  
Source  
1.5±0.2  
Source  
Gate  
Drain  
Gate  
Drain  
0.4±0.15  
5.7 MAX.  
0.8 MAX.  
3.6±0.2  
79A PACKAGE RECOMMENDED P.C.B. LAYOUT (UNIT: mm)  
4.0  
1.7  
Source  
Stop up the hole with a rosin or  
something to avoid solder flow.  
Drain  
Gate  
φ
Through Hole: 0.2 × 33  
0.5 0.5  
6.1  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 10 of 11  
NE5550979A  
RECOMMENDED SOLDERING CONDITIONS  
This product should be soldered and mounted under the following recommended conditions. For soldering methods and  
conditions other than those recommended below, contact your nearby sales office.  
Soldering Method  
Soldering Conditions  
Condition Symbol  
Infrared Reflow  
Peak temperature (package surface temperature) : 260°C or below  
IR260  
Time at peak temperature  
: 10 seconds or less  
: 60 seconds or less  
: 120 30 seconds  
: 3 times  
Time at temperature of 220°C or higher  
Preheating time at 120 to 180°C  
Maximum number of reflow processes  
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below  
Wave Soldering  
Partial Heating  
Peak temperature (molten solder temperature)  
Time at peak temperature  
: 260°C or below  
: 10 seconds or less  
WS260  
HS350  
Preheating temperature (package surface temperature)  
: 120°C or below  
: 1 time  
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below  
Maximum number of flow processes  
Peak temperature (terminal temperature)  
Soldering time (per side of device)  
: 350°C or below  
: 3 seconds or less  
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below  
CAUTION  
Do not use different soldering methods together (except for partial heating).  
R09DS0031EJ0300 Rev.3.00  
Mar 12, 2013  
Page 11 of 11  
Revision History  
NE5550979A Data Sheet  
Description  
Summary  
Rev.  
Date  
Page  
1.00  
2.00  
Nov 25, 2011  
Jul 04, 2012  
First edition issued  
p.1  
p.5  
p.6  
p.7  
p.8  
p.9  
Modification of ORDERING INFORMATION  
Addition of TEST CIRCUIT SCHEMATIC FOR 157 MHz  
Addition of COMPONENT LAYOUT OF TEST CIRCUIT FOR 157 MHz  
Addition of TEST CIRCUIT SCHEMATIC FOR 900 MHz  
Addition of COMPONENT LAYOUT OF TEST CIRCUIT FOR 900 MHz  
Modification of S-PARAMETERS  
Modification of COMPONENTS OF TEST CIRCUIT FOR MEASURING  
ELECTRICAL CHARACTERISTICS  
3.00  
Mar 12, 2013  
P3  
P5  
Modification of TEST CIRCUIT SCHEMATIC FOR 157 MHz  
Modification of COMPONENTS OF TEST CIRCUIT FOR MEASURING  
ELECTRICAL CHARACTERISTICS  
Modification of COMPONENTS OF TEST CIRCUIT FOR MEASURING  
ELECTRICAL CHARACTERISTICS  
P7  
All trademarks and registered trademarks are the property of their respective owners.  
C - 1  
SALES OFFICES  
http://www.renesas.com  
Refer to "http://www.renesas.com/" for the latest and detailed information.  
California Eastern Laboratories, Inc.  
4590 Patrick Henry Drive, Santa Clara, California 95054, U.S.A.  
Tel: +1-408-919-2500, Fax: +1-408-988-0279  
Renesas Electronics Europe Limited  
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K  
Tel: +44-1628-651-700, Fax: +44-1628-651-804  
Renesas Electronics Europe GmbH  
Arcadiastrasse 10, 40472 Düsseldorf, Germany  
Tel: +49-211-65030, Fax: +49-211-6503-1327  
Renesas Electronics (China) Co., Ltd.  
7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China  
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679  
Renesas Electronics (Shanghai) Co., Ltd.  
Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China  
Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898  
Renesas Electronics Hong Kong Limited  
Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong  
Tel: +852-2886-9318, Fax: +852 2886-9022/9044  
Renesas Electronics Taiwan Co., Ltd.  
13F, No. 363, Fu Shing North Road, Taipei, Taiwan  
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670  
Renesas Electronics Singapore Pte. Ltd.  
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre Singapore 339949  
Tel: +65-6213-0200, Fax: +65-6213-0300  
Renesas Electronics Malaysia Sdn.Bhd.  
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia  
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510  
Renesas Electronics Korea Co., Ltd.  
11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea  
Tel: +82-2-558-3737, Fax: +82-2-558-5141  
© 2013 Renesas Electronics Corporation. All rights reserved.  
[Colophon 2.2]  

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