NE5550979A-T1A-A [RENESAS]
Silicon Power LDMOS FET; 硅功率LDMOS FET型号: | NE5550979A-T1A-A |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | Silicon Power LDMOS FET |
文件: | 总13页 (文件大小:790K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
NE5550979A
Silicon Power LDMOS FET
FEATURES
R09DS0031EJ0300
Rev.3.00
Mar 12, 2013
•
•
•
•
•
High Output Power
: Pout = 39.5 dBm TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm)
High power added efficiency : ηadd = 66% TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 25 dBm)
High Linear gain
High ESD tolerance
Suitable for VHF to UHF-BAND Class-AB power amplifier.
: GL = 22 dB TYP. (VDS = 7.5 V, IDset = 200 mA, f = 460 MHz, Pin = 10 dBm)
: ESD tolerance > 8 kV (IEC61000-4-2, Contact discharge)
APPLICATIONS
•
•
•
150 MHz Band Radio System
460 MHz Band Radio System
900 MHz Band Radio System
ORDERING INFORMATION
Part Number
Order Number
Package Marking
Supplying Form
NE5550979A
NE5550979A-A
79A
W6
• 12 mm wide embossed taping
• Gate pin faces the perforation side of the tape
(Pb Free)
NE5550979A-T1
NE5550979A-T1-A
• 12 mm wide embossed taping
• Gate pin faces the perforation side of the tape
• Qty 1 kpcs/reel
NE5550979A-T1A NE5550979A-T1A-A
• 12 mm wide embossed taping
• Gate pin faces the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: NE5550979A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Operation in excess of any one of these parameters may result in permanent damage.
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Symbol
VDS
Ratings
Unit
V
30
6.0
VGS
IDS
V
3.0
A
Total Power Dissipation Note
Channel Temperature
Storage Temperature
Note: Value at TC = 25°C
Ptot
25
W
°C
°C
Tch
150
Tstg
−55 to +150
CAUTION
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 1 of 11
NE5550979A
RECOMMENDED OPERATING RANGE (TA = 25°C)
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Symbol
VDS
Test Conditions
MIN.
−
1.65
−
TYP.
7.5
MAX.
9.0
2.85
−
Unit
V
VGS
2.20
1.7
V
IDS
A
Input Power
Pin
f = 460 MHz, VDS = 7.5 V
−
25
30
dBm
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Parameter
DC Characteristics
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Gate to Source Leakage Current
Drain to Source Leakage Current
(Zero Gate Voltage Drain Current)
Gate Threshold Voltage
Drain to Source Breakdown Voltage
Transconductance
IGSS
IDSS
VGS = 6.0 V
−
−
−
−
100
10
nA
VDS = 25 V
μA
Vth
BVDSS
Gm
VDS = 7.5 V, IDS = 1.0 mA
IDS = 10 μA
1.15
25
1.65
37
2.25
−
2.9
−
V
V
VDS = 7.5 V, IDS = 700 100 mA
Channel to Case
1.8
−
2.2
5.0
S
Thermal Resistance
RF Characteristics
Rth
°C/W
Output Power
Pout
IDS
f = 460 MHz, VDS = 7.5 V,
Pin = 25 dBm,
38.5
−
−
−
−
−
−
−
−
−
−
−
−
−
−
39.5
1.70
68
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
dBm
A
Drain Current
Power Drain Efficiency
Power Added Efficiency
Linear Gain
ηd
IDset = 200 mA (RF OFF)
%
ηadd
66
%
Note 1
GL
22.0
39.6
1.60
75
dB
dBm
A
Output Power
Pout
IDS
f = 157 MHz, VDS = 7.5 V,
Pin = 23 dBm,
Drain Current
Power Drain Efficiency
Power Added Efficiency
Linear Gain
ηd
IDset = 200 mA (RF OFF)
%
ηadd
73
%
Note 2
GL
25.0
38.6
1.76
55
dB
dBm
A
Output Power
Pout
IDS
f = 900 MHz, VDS = 7.5 V,
Pin = 27 dBm,
Drain Current
Power Drain Efficiency
Power Added Efficiency
Linear Gain
ηd
IDset = 200 mA (RF OFF)
%
ηadd
52
%
Note 1
GL
16.0
dB
Note 1 : Pin = 10 dBm
Note 2 : Pin = 5 dBm
Remark DC performance is 100% testing. RF performance is testing several samples per wafer.
Wafer rejection criteria for standard devices is 1 reject for several samples.
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 2 of 11
NE5550979A
TEST CIRCUIT SCHEMATIC FOR 460 MHz
V
GS
V
DS
R1
C1
L1
C1
IN
OUT
50 Ω
50 Ω
C10
C22
C11
C12
C20
C21
FET
NE5550979A (WS)
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS
Symbol
C1
Value
1 μ F
100 pF
24 pF
Type
GRM31CR72A105KA01B
Maker
Murata
Murata
C10
GRM1882C1H101JA01
ATC100A240JW
C11
American Technical
Ceramics
C12
C20
C21
C22
R1
2.4 pF
27 pF
ATC100A2R4BW
ATC100A270JW
ATC100A1R8BW
ATC100A101JW
American Technical
Ceramics
American Technical
Ceramics
1.8 pF
100 pF
4.7 kΩ
American Technical
Ceramics
American Technical
Ceramics
1/10 W Chip Resistor
SSM
SSM_RG1608PB472
L1
PCB
123 nH
φ 0.5 mm, φ D = 3 mm, 10 Turns
R1766, t = 0.4 mm, εr = 4.5, size = 30 × 48 mm
WAKA 01K0790-20
Ohesangyou
Panasonic
WAKA
<R>
−
−
SMA Connecter
COMPONENT LAYOUT OF TEST CIRCUIT FOR 460 MHz
VGS
GND
VDS
C1
C1
L1
C12
C11
C20 C21
R1
C22
C10
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 3 of 11
NE5550979A
TYPICAL CHARACTERISTICS 1 (TA = 25°C)
R: f = 460MHz, VDS = 3.6/4.5/6/7.5/8.4/9 V, IDset = 200 mA, Pin = 0 to 32 dBm
IM: f1 = 460MHz, f2 = 461 MHz, VDS = 3.6/4.5/6/7.5/8.4/9 V, IDset = 200mA, Pout (2 tone) = 12 to 38 dBm
POWER GAIN, POWER ADDED
EFFICIENCY vs. INPUT POWER
OUTPUT POWER, DRAIN CURRENT
vs. INPUT POWER
50
45
40
35
30
25
20
15
10
5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
40
35
30
25
20
15
10
5
80
70
60
50
40
30
20
10
0
P
P
P
P
P
out - 3.6 V
out - 4.5 V
out - 6.0 V
out - 7.5 V
out - 9 V
G
G
G
G
G
p
p
p
p
p
- 3.6 V
- 4.5 V
- 6 V
- 7.5 V
- 9 V
I
I
I
I
I
DS - 3.6 V
DS - 4.5 V
DS - 6.0 V
DS - 7.5 V
DS - 9 V
add - 3.6 V
add - 4.5 V
add - 6.0 V
add - 7.5 V
add - 9 V
η
η
η
η
η
η
0
0
–5
0
5
10
15 20
25
30 35
–5
0
5
10
15 20
25
30 35
Input Power Pin (dBm)
Input Power Pin (dBm)
IM3/IM5
vs. 2 TONES OUTPUT POWER
2f
0
, 3f vs. OUTPUT POWER
0
0
–10
–20
–30
–40
–50
–60
–70
0
2f
2f
2f
2f
3f
3f
3f
3f
2f
3f
0
0
0
0
0
0
0
0
0
0
- 3.6 V
- 4.5 V
- 6.0 V
- 7.5 V
- 3.6 V
- 4.5 V
- 6.0 V
- 7.5 V
- 9 V
IM
IM
IM
IM
IM
IM
IM
IM
IM
IM
3
3
3
3
5
5
5
5
3
5
- 3.6 V
- 4.5 V
- 6 V
- 7.5 V
- 3.6 V
- 4.5 V
- 6.0 V
- 7.5 V
- 9 V
–10
–20
–30
–40
–50
–60
–70
- 9 V
- 9 V
10
15
20
25
30
35
40
45
10
15
20
25
30
35
40
Output Power Pout (dBm)
2 Tones Output Power Pout (2 tone) (dBm)
Remark The graphs indicate nominal characteristics.
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 4 of 11
NE5550979A
<R>
TEST CIRCUIT SCHEMATIC FOR 157 MHz
VGS
V
DS
R1
C1
L1
C1
IN
OUT
50 Ω
50 Ω
C10
C24
L11
L20
C11
C12
C20
C21
C22
C23
FET
NE5550979A
<R>
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS
Symbol
C1
Value
1 μ F
100 pF
4.7 pF
Type
GRM31CR72A105KA01B
Maker
Murata
Murata
C10
GRM1882C1H101JA01
ATC100A4R7CT
C11
American Technical
Ceramics
C12
C20
C21
C22
C23
C24
R1
39 pF
2.0 pF
22 pF
68 pF
12 pF
100 pF
4.7 kΩ
ATC100A390JT
ATC100A2R0CT
ATC100A220JT
ATC100A680JT
ATC100A120JT
ATC100A101JT
American Technical
Ceramics
American Technical
Ceramics
American Technical
Ceramics
American Technical
Ceramics
American Technical
Ceramics
American Technical
Ceramics
1/10 W Chip Resistor
SSM
SSM_RG1608PB472
L1
L11
123 nH
27 nH
35 nH
−
φ 0.5 mm, φ D = 3 mm, 10 Turns
LLQ2012-F27N
Ohesangyou
TOKO
L20
φ 0.5 mm, φ D = 2.4 mm, 5 Turns
R1766, t = 0.4 mm, εr = 4.5, size = 30 × 48 mm
WAKA 01K0790-20
Ohesangyou
Panasonic
WAKA
PCB
SMA Connecter
−
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 5 of 11
NE5550979A
COMPONENT LAYOUT OF TEST CIRCUIT FOR 157 MHz
VGS
GND
VDS
C1
C1
L1
L11
C12
C11
C20
C21
C22
C10
L20
R1
C23 C24
TYPICAL CHARACTERISTICS 2 (TA = 25°C)
R: f = 157 MHz, VDS = 3.6/4.5/6/7.5/9 V, IDset = 200 mA, Pin = 0 to 27 dBm
POWER GAIN, POWER ADDED
EFFICIENCY vs. INPUT POWER
OUTPUT POWER, DRAIN CURRENT
vs. INPUT POWER
45
40
35
30
25
20
15
10
5
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
40
35
30
25
20
15
10
5
80
70
60
50
40
30
20
10
0
P
P
P
P
P
out - 3.6 V
out - 4.5 V
out - 6.0 V
out - 7.5 V
out - 9 V
G
G
G
G
G
p
p
p
p
- 3.6 V
- 4.5 V
- 6 V
- 7.5 V
- 9 V
η p - 3.6 V
ηadd - 4.5 V
ηadd - 6 V
ηadd - 7.5 V
ηadd - 9 V
η
I
I
DS - 3.6 V
- 4.5 V
I
I
I
DDSS - 6 V
DS - 7.5 V
DS - 9 V
0
0
–5
0
5
10
15
20
25
30
–5
0
5
10
15
20
25
30
Input Power Pin (dBm)
Input Power Pin (dBm)
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 6 of 11
NE5550979A
TEST CIRCUIT SCHEMATIC FOR 900 MHz
VGS
V
DS
R1
C1
L1
C1
IN
OUT
50 Ω
50 Ω
C10
C23
C11
C20
C21
C22
FET
NE5550979A
<R>
COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS
Symbol
C1
Value
1 μ F
100 pF
15 pF
Type
GRM31CR72A105KA01B
Maker
Murata
Murata
C10
GRM1882C1H101JA01
ATC100A150JW
C11
American Technical
Ceramics
C20
C21
C22
C23
R1
3.3 pF
3.3 pF
12 pF
ATC100A3R3BW
ATC100A3R3BW
ATC100A120JT
ATC100A101JT
American Technical
Ceramics
American Technical
Ceramics
American Technical
Ceramics
100 pF
4.7 kΩ
American Technical
Ceramics
1/10 W Chip Resistor
SSM
SSM_RG1608PB472
L1
PCB
123 nH
φ 0.5 mm, φ D = 3 mm, 10 Turns
R1766, t = 0.4 mm, εr = 4.5, size = 30 × 48 mm
WAKA 01K0790-20
Ohesangyou
Panasonic
WAKA
−
−
SMA Connecter
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 7 of 11
NE5550979A
COMPONENT LAYOUT OF TEST CIRCUIT FOR 900 MHz
VGS
VDS
C1
C1
L1
R1
C22
C11
C10
C23
C21
C20
TYPICAL CHARACTERISTICS 3 (TA = 25°C)
RF: f = 900 MHz VDS = 3.6/4.5/6/7.5/9 V, IDset = 200 mA, Pin = 0 to 32 dBm
POWER GAIN, POWER ADDED
EFFICIENCY vs. INPUT POWER
OUTPUT POWER, DRAIN CURRENT
vs. INPUT POWER
50
45
40
35
30
25
20
15
10
5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
40
35
30
25
20
15
10
5
80
70
60
50
40
30
20
10
0
G
G
G
G
G
p
p
p
p
p
- 3.6 V
- 4.5 V
- 6 V
- 7.5 V
- 9 V
P
P
P
P
P
out - 3.6 V
out - 4.5 V
out - 6.0 V
out - 7.5 V
out - 9 V
I
I
I
I
I
DS - 3.6 V
DS - 4.5 V
DS - 6.0 V
DS - 7.5 V
DS - 9 V
η
add - 3.6 V
ηadd
- 4.5 V
η
η
η
add - 6.0 V
add - 7.5 V
add - 9 V
η
0
0
–5
0
5
10
15 20
25
30 35
–5
0
5
10
15 20
25
30 35
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 8 of 11
NE5550979A
S-PARAMETERS
S-parameters and noise parameters are provided on our web site in a form (S2P) that enables direct import of the
parameters to microwave circuit simulators without the need for keyboard inputs.
Click here to download S-parameters.
[Products] → [RF Devices] → [Device Parameters]
URL http://www.renesas.com/products/microwave/
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 9 of 11
NE5550979A
PACKAGE DIMENSIONS
79A (UNIT: mm)
(Bottom View)
4.2 MAX.
Source
1.5±0.2
Source
Gate
Drain
Gate
Drain
0.4±0.15
5.7 MAX.
0.8 MAX.
3.6±0.2
79A PACKAGE RECOMMENDED P.C.B. LAYOUT (UNIT: mm)
4.0
1.7
Source
Stop up the hole with a rosin or
something to avoid solder flow.
Drain
Gate
φ
Through Hole: 0.2 × 33
0.5 0.5
6.1
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 10 of 11
NE5550979A
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260°C or below
IR260
Time at peak temperature
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
WS260
HS350
Preheating temperature (package surface temperature)
: 120°C or below
: 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Maximum number of flow processes
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350°C or below
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 11 of 11
Revision History
NE5550979A Data Sheet
Description
Summary
Rev.
Date
Page
−
1.00
2.00
Nov 25, 2011
Jul 04, 2012
First edition issued
p.1
p.5
p.6
p.7
p.8
p.9
Modification of ORDERING INFORMATION
Addition of TEST CIRCUIT SCHEMATIC FOR 157 MHz
Addition of COMPONENT LAYOUT OF TEST CIRCUIT FOR 157 MHz
Addition of TEST CIRCUIT SCHEMATIC FOR 900 MHz
Addition of COMPONENT LAYOUT OF TEST CIRCUIT FOR 900 MHz
Modification of S-PARAMETERS
Modification of COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
3.00
Mar 12, 2013
P3
P5
Modification of TEST CIRCUIT SCHEMATIC FOR 157 MHz
Modification of COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Modification of COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
P7
All trademarks and registered trademarks are the property of their respective owners.
C - 1
SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/" for the latest and detailed information.
California Eastern Laboratories, Inc.
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Tel: +1-408-919-2500, Fax: +1-408-988-0279
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Tel: +49-211-65030, Fax: +49-211-6503-1327
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Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898
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Tel: +852-2886-9318, Fax: +852 2886-9022/9044
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Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
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Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
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Tel: +82-2-558-3737, Fax: +82-2-558-5141
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[Colophon 2.2]
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