NV4V31MF_12 [RENESAS]

Blue-Violet Laser Diode 405 nm Blue-Violet Laser Light Source; 蓝紫色激光二极管405nm的蓝紫色激光光源
NV4V31MF_12
型号: NV4V31MF_12
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Blue-Violet Laser Diode 405 nm Blue-Violet Laser Light Source
蓝紫色激光二极管405nm的蓝紫色激光光源

二极管 激光二极管
文件: 总9页 (文件大小:249K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Preliminary Data Sheet  
NV4V31MF  
Blue-Violet Laser Diode  
R08DS0045EJ0100  
Rev.1.00  
Mar 05, 2012  
405 nm Blue-Violet Laser Light Source  
DESCRIPTION  
The NV4V31MF is a blue-violet laser diode with a wavelength of 405 nm. A newly developed LD chip structure  
achieves a high optical power output of 175 mW (CW) at up to 85°C. The NV4V31MF can provide excellent linearity  
from low to high output at high temperatures, and reduces the unevenness of beam divergence.  
FEATURES  
High optical output power  
Peak emission wavelength  
Wide operating temperature range  
φ 3.8 mm small CAN package  
Po = 175 mW @CW  
λp = 405 nm TYP.  
TC = 5 to +85°C  
APPLICATIONS  
Blue-violet laser light source  
The mark <R> shows major revised points.  
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.  
R08DS0045EJ0100 Rev.1.00  
Mar 05, 2012  
Page 1 of 7  
NV4V31MF  
Chapter Title  
PACKAGE DIMENSIONS (UNIT: mm)  
X
WITH GLASS  
90° 2°  
φ
EFFECTIVE  
DIAMETER  
Y
φ
0.65 MIN.  
0.25 0.07  
+0.0  
φ
3.8–0.025  
φ
φ
3.1 MAX.  
2.42 0.1  
LD CHIP  
0.2 MIN.  
Z
STEM  
REFERENCE  
PLAIN  
3–  
φ
0.3 0.05  
P.C.D.  
1.43 0.15  
φ
1
1
2
3
LD  
3 (Stem GND)  
0.2 0.1  
2
PIN CONNECTIONS  
BOTTOM VIEW  
Remarks 1. Cap glass thickness: 0.25 0.03 mm  
Cap glass refractive index:1.53 (λ = 405 nm)  
2. Position accuracy of the LD chip based on the center of stem  
Δ
Δ
Δ
x = 80  
μ
μ
m
m
y = 80  
μ
z = 80 m (*1)  
R08DS0045EJ0100 Rev.1.00  
Mar 05, 2012  
Page 2 of 7  
NV4V31MF  
Chapter Title  
<R>  
ORDERING INFORMATION  
Part Number  
Order Number  
Rank  
GV  
Package  
NV4V31MF  
NV4V31MF-A  
Tray Packaging (250 p/Tray)  
KV  
Individual Packaging (for small samples)  
ABSOLUTE MAXIMUM RATINGS (TC = 25°C, unless otherwise specified)  
Parameter  
Symbol  
Po  
Ratings  
180  
Unit  
mW  
mW  
V
Optical Output Power (CW)  
Optical Output Power (pulse) *1  
Reverse Voltage of LD  
Pp  
360  
VR  
2
Operating Case Temperature  
Storage Temperature  
TC  
5 to +85  
40 to +85  
°C  
°C  
Tstg  
Note: *1. Pulse condition: PW 50 ns, Duty 50%  
RECOMMENDED OPERATING CONDITIONS  
(TC = 25°C, unless otherwise specified)  
Parameter  
Symbol  
MAX.  
Unit  
Optical Output Power (CW)  
Po  
175  
mW  
ELECTRO-OPTICAL CHARACTERISTICS  
(TC = 25°C, unless otherwise specified)  
Parameter  
Threshold Current  
Symbol  
Ith  
Conditions  
MIN.  
TYP.  
35  
MAX.  
Unit  
mA  
mA  
V
CW  
55  
200  
6.5  
Operating Current  
Iop  
CW, Po = 175 mW  
CW, Po = 175 mW  
CW, Po = 20 mW, 175 mW  
CW, Po = 175 mW  
CW, Po = 175 mW  
150  
5.0  
1.55  
405  
9
Optical Voltage  
Vop  
ηd  
λp  
θ//  
θ⊥  
Slope Efficiency  
1.1  
400  
6
W/A  
nm  
Peak Wavelength  
415  
12  
25  
3
Beam Divergence (lateral)  
Beam Divergence (vertical)  
deg.  
15  
3  
20  
Position Accuracy Angle  
(lateral)  
Δθ//  
CW, Po = 175 mW  
0
deg.  
Position Accuracy Angle  
(vertical)  
Δθ⊥  
3  
0
3
R08DS0045EJ0100 Rev.1.00  
Mar 05, 2012  
Page 3 of 7  
NV4V31MF  
Chapter Title  
<R>  
TYPICAL CHARACTERISTICS (TC = 25°C, unless otherwise specified)  
OPTICAL OUTPUT POWER  
vs. FORWARD CURRENT  
FORWARD VOLTAGE vs.  
FORWARD CURRENT  
200  
180  
160  
140  
120  
100  
80  
10  
8
20°C  
60°C  
70°C  
80°C  
90°C  
25°C  
30°C  
40°C  
50°C  
20°C  
25°C  
30°C  
40°C  
50°C  
60°C  
70°C  
80°C  
90°C  
6
4
60  
40  
2
20  
0
0
0
50  
100  
150  
(mA)  
200  
0
50  
100  
150  
(mA)  
200  
Forward Current I  
F
Forward Current I  
F
POWER DEPENDENCE OF  
DIFFERENTIAL EFFICIENCY  
TEMPERATURE DEPENDENCE OF  
DIFFERENTIAL EFFICIENCY  
410  
408  
406  
404  
402  
400  
412  
410  
408  
406  
404  
402  
400  
175 mW  
N = 5  
N = 5  
0.011 nm/mW  
0.064 nm/°C  
0
50  
100  
150  
200  
0
20  
40  
60  
80  
100  
Optical Output Power P  
O
(mW)  
Temperature (°C)  
FFP (LATERAL)  
FFP (VERTICAL)  
175 mW  
120 mW  
80 mW  
40 mW  
175 mW  
120 mW  
80 mW  
40 mW  
30  
20  
10  
0
10  
20  
30  
30  
20  
10  
0
10  
20  
30  
Angle (degrees)  
Angle (degrees)  
Remark The graphs indicate nominal characteristics.  
R08DS0045EJ0100 Rev.1.00  
Mar 05, 2012  
Page 4 of 7  
NV4V31MF  
Chapter Title  
Wavelength Spectrum (100 mW)  
Wavelength Spectrum (175 mW)  
1.2  
1
1.2  
1
0.8  
0.6  
0.4  
0.2  
0.8  
0.6  
0.4  
0.2  
0
0
400  
402  
404  
406  
408  
410  
400  
402  
404  
406  
408  
410  
Wavelength λ (nm)  
Wavelength λ (nm)  
Remark The graphs indicate nominal characteristics.  
R08DS0045EJ0100 Rev.1.00  
Mar 05, 2012  
Page 5 of 7  
NV4V31MF  
Chapter Title  
NOTES ON HANDLING (UNIT: mm)  
1. Recommended soldering conditions  
Peak Temperature  
Time  
350°C or below  
3 seconds or less  
Soldering of leads should be made at the point 2.0 mm from the root of the lead  
This device cannot be mounted using reflow soldering.  
2. Usage cautions  
(1) Take the following steps to ensure that the device is not damaged by static electricity.  
Wear an antistatic wrist strap when soldering the device.  
We recommend a strap with a 1 MΩ resistor.  
Make sure that the work table and soldering iron are grounded.  
Make sure that the soldering iron does not leak.  
(2) Do not subject the package to undue stress.  
The package has a tensile strength of 1N.  
Do not exceed this rating. Also, avoid bending the leads as much as possible.  
If the leads must be bent, bend them only once, making sure to anchor the base of the lead.  
(3) Do not allow the glass window of the package to become scratched or dirty.  
Also, do not subject the glass window to external force.  
(4) Be sure to attach a heat sink to sufficiently dissipate heat.  
(5) Use the device as soon as possible after opening the aluminum moisture barrier bag.  
R08DS0045EJ0100 Rev.1.00  
Mar 05, 2012  
Page 6 of 7  
NV4V31MF  
Chapter Title  
SAFETY INFORMATION ON THIS PRODUCT  
SEMICONDUCTOR LASER  
DANGER  
VISIBLE LASER RADIATION  
AVOID DIRECT EXPOSURE TO BEAM  
AVOID EXPOSURE-Visible  
OUTPUT POWER 450 mW MAX  
Laser Radiation is emitted from  
this aperture  
WAVELENGTH 400 to 420 nm  
CLASS lllb LASER PRODUCT  
A laser beam is emitted from this diode during operation.  
If the laser beam or its reflection enters your eye, it may cause injury to the eye or loss of eyesight.  
(Note that, depending on the wavelength of the beam, the laser beam might not be visible.)  
Warning Laser Beam  
• Do not look directly into the laser beam.  
• Avoid exposure to the laser beam, any reflected or collimated beam.  
R08DS0045EJ0100 Rev.1.00  
Mar 05, 2012  
Page 7 of 7  
Revision History  
NV4V31MF Data Sheet  
Description  
Summary  
Rev.  
Date  
Page  
0.01  
1.00  
Sep 08, 2011  
Mar 05, 2012  
First edition issued  
Throughout Preliminary Data Sheet -> Data Sheet  
p.3  
Modification of ORDERING INFORMATION  
Addition of TYPICAL CHARACTERISTICS  
p.4, 5  
All trademarks and registered trademarks are the property of their respective owners.  
C - 1  
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© 2012 Renesas Electronics Corporation. All rights reserved.  
Colophon 1.1  

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