PS9513-AX [RENESAS]
1 Mbps, OPEN COLLECTOR OUTPUT, FOR INTELLIGENT POWER MODULE DRIVE 8-PIN DIP HIGH-SPEED PHOTOCOUPLER;
| 型号： | PS9513-AX |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | 1 Mbps, OPEN COLLECTOR OUTPUT, FOR INTELLIGENT POWER MODULE DRIVE 8-PIN DIP HIGH-SPEED PHOTOCOUPLER ISM频段 输出元件 光电 |
| 文件： | 总18页 (文件大小：5016K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet
PS9513, PS9513L1, PS9513L2, PS9513L3
R08DS0126EJ0203
1 Mbps, OPEN COLLECTOR OUTPUT, FOR INTELLIGENT POWER MODULE DRIVE
Rev.2.03
Oct 29, 2018
8-PIN DIP HIGH-SPEED PHOTOCOUPLER
DESCRIPTION
The PS9513, PS9513L1, PS9513L2 and PS9513L3 are optically coupled isolators containing an AlGaAs LED on the
input side and a photo diode and a signal processing circuit on the output side on one chip.
The PS9513 is designed specifically for high common mode transient immunity (CMR) and low pulse width distortion
with operating temperature. It is suitable for IPM drive.
The PS9513L1 is lead bending type for long creepage distance.
The PS9513L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS9513L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
Long creepage distance (8 mm MIN. : PS9513L1, PS9513L2)
High common mode transient immunity (CMH, CML = ±15 kV/µs MIN)
High-speed response (tPHL = 500 ns MAX., tPLH = 750 ns MAX.)
Propagation Delay Difference (tPLH – tPHL = 270 ns TYP.)
Pulse width distortion (|tPHL – tPLH| = 270 ns TYP.)
Open collector output
Ordering number of tape product : PS9513L2-E3 : 1 000 pcs/reel
: PS9513L3-E3 : 1 000 pcs/reel
Pb-Free product
PIN CONNECTIONS
(Top View)
1. NC
8
1
5
7
6
2. Anode
3. Cathode
4. NC
5. GND
6. V
O
7. NC
8. VCC
2
3
4
Safety standards
- UL approved: UL1577, Double protection
- CSA approved: CAN/CSA-C22.2 No.62368-1, Reinforced insulation
- BSI approved: BS EN 62368-1, Reinforced insulation
- SEMKO approved: EN 62368-1, IEC 62368-1, Reinforced insulation
- NEMKO approved: EN 62368-1, Reinforced insulation
- DEMKO approved: EN 62368-1, Reinforced insulation
- FIMKO approved: EN 62368-1, Reinforced insulation
- VDE approved: DIN EN 60747-5-5 (Option)
APPLICATIONS
IPM Driver
General purpose inverter
Start of mass production
Jun-2006
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 1 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
PACKAGE DIMENSIONS (UNIT: mm)
DIP Type
PS9513
+0.5
–0.25
9.25
7.62
+0.4
–0.2
1.01
+0.5
6.5
–0.1
0 to 15°
2.54
0.5±0.15
0.25
M
0.84±0.15
Weight: 0.55g (typ.)
Lead Bending Type (Gull-wing) For Surface Mount
PS9513L3
+0.5
–0.25
9.25
9.65±0.4
+0.4
–0.2
+0.5
–0.1
1.01
6.5
2.54
0.5±0.15
0.25
0.74±0.25
M
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 2 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
Lead Bending Type For Long Creepage Distance
PS9513L1
+0.5
–0.25
9.25
10.16
+0.4
–0.2
+0.5
–0.1
1.01
6.5
0 to 15°
2.54
0.84±0.15
0.5±0.15
0.25
M
Lead Bending Type For Long Creepage Distance (Gull-wing) For Surface Mount
PS9513L2
+0.5
9.25
–0.25
11.8±0.4
+0.4
–0.2
+0.5
–0.1
1.01
6.5
2.54
0.5±0.15
0.25
0.9±0.25
M
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 3 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance (MIN.)
PS9513, PS9513L3
7 mm
PS9513L1, PS9513L2
8 mm
8 mm
Creepage Distance (MIN.)
Isolation Distance (MIN.)
7 mm
0.4 mm
0.4 mm
FUNCTIONAL DIAGRAM
8
6
2
3
5
Shield
LED
ON
Output
L
OFF
H
MARKING EXAMPLE
No. 1 pin
Mark
R
Type Number
9513
N 931
Assembly Lot
N
9 31
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
(L or T)
Rank Code
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 4 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
ORDERING INFORMATION
Part Number
Order Number
Solder
Plating
Packing Style
Safety Standard
Approval
Application Part
Number*1
Specification
PS9513
PS9513-AX
Pb-Free
Magazine case 50 pcs
Standard products
(UL, CSA, BSI,
PS9513
PS9513L1
PS9513L1-AX
(Ni/Pd/Au)
PS9513L1
PS9513L2
PS9513L3
PS9513L2
PS9513L3
PS9513
PS9513L2
PS9513L2-AX
SEMKO, NEMKO,
DEMKO, FIMKO
PS9513L3
PS9513L3-AX
PS9513L2-E3
PS9513L3-E3
PS9513-V
PS9513L2-E3-AX
PS9513L3-E3-AX
PS9513-V-AX
Embossed Tape 1 000 pcs/reel approved)
Magazine case 50 pcs
UL, CSA, BSI,
SEMKO, NEMKO,
DEMKO, FIMKO,
DIN EN 60747-5-5
approved
PS9513L1-V
PS9513L2-V
PS9513L3-V
PS9513L2-V-E3
PS9513L3-V-E3
PS9513L1-V-AX
PS9513L2-V-AX
PS9513L3-V-AX
PS9513L2-V-E3-AX
PS9513L3-V-E3-AX
PS9513L1
PS9513L2
PS9513L3
PS9513L2
PS9513L3
Embossed Tape 1 000 pcs/reel
Notes*: 1. For the application of the Safety Standard, following part number should be used.
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 5 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Forward Current *1
Reverse Voltage
Supply Voltage
Output Voltage
Symbol
Ratings
25
Unit
mA
V
Diode
I
F
V
R
5.0
Detector
V
CC
0.5 to +25
0.5 to +25
15
V
V
O
V
Output Current
Power Dissipation *2
Isolation Voltage *3
IO
mA
mW
Vr.m.s.
°C
P
C
100
BV
5 000
Operating Ambient Temperature
Storage Temperature
TA
40 to +100
55 to +125
T
stg
°C
Notes*: 1. Reduced to 0.33 mA/°C at TA = 70°C or more.
2. Reduced to 2.0 mW/°C at TA = 70°C or more.
3. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
10
0
TYP.
MAX.
20
Unit
mA
V
Forward Current
Output Voltage
Supply Voltage
Input Voltage
I
F
V
O
20
V
CC
4.5
0
15
20
V
V
F
0.8
V
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 6 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
ELECTRICAL CHARACTERISTICS (TA = –40 to +100°C, VCC = 15 V, unless otherwise specified)
Parameter
Symbol
Conditions
MIN.
TYP.*1 MAX.
Unit
V
Diode
Forward Voltage
Reverse Current
Terminal Capacitance
V
F
I
F
= 10 mA
= 3 V
V = 0 V, f = 1 MHz, T
= 10 mA, IOL = 2.4 mA
1.3
1.65
2.1
I
R
V
R
200
A
pF
V
Ct
A
= 25°C
30
0.13
1.0
0.6
Detector Low Level Output Voltage
High Level Output Current
V
OL
OH
CCH
CCL
I
F
0.6
50
I
V
V
V
V
CC = 20 V, V
F
= 0.8 V
A
mA
mA
High Level Supply Current
Low Level Supply Current
I
CC = 20 V, V
F
= 0.8 V, V
O
= open
= open
1.3
1.3
I
CC = 20 V, I
F
= 10 mA, V
O
0.6
Coupled Threshold Input Current
O
= 0.8 V, I
O
= 0.75 mA
I
FHL
0.86
110
5.0
mA
%
(H L)
Current Transfer Ratio
/IF)
I
F
= 10 mA, V = 0.6 V
O
CTR
44
(I
C
Isolation Resistance
V
I-O = 1 kVDC, RH = 40 to 60%,
= 25°C
V = 0 V, f = 1 MHz, T
= 10 mA, R = 20 k, C
R
I-O
I-O
1011
pF
ns
TA
Isolation Capacitance
C
A
= 25°C
= 100
0.7
Propagation Delay Time
(H L)*2
I
F
L
L
t
t
PHL
PLH
250
500
750
650
650
pF, VTHHL = 1.5 V, VTHLH = 2.0 V
Propagation Delay Time
(L H)*2
520
270
270
Propagation Delay
Difference
t
PLHtPHL
200
Pulse Width Distortion
(PWD)*2
|tPHLtPLH
|
Common Mode
TA
= 25°C, I
F
= 0 mA, V
O
> 3.0 V,
Transient Immunity at
High Level Output*3
CM
H
V
C
CM = 1.5 kV, R
L
= 20 k,
15
kV/s
kV/s
L
= 100 pF
= 25°C, I
CM = 1.5 kV, R
Common Mode
Transient Immunity at
Low Level Output*3
TA
F
= 10 mA, V
O
< 1.0 V,
CM
L
V
C
L
= 20 k,
-15
L
= 100 pF
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 7 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
Notes*: 1. Typical values at TA = 25°C.
2. Test circuit for propagation delay time
VCC = 15 V
Pulse input (I = 10 mA)
F
I
F
(ON)
Input
50% I
F
(ON)
(PW = 10
Duty cycle= 1/10)
s ,
0.1 F
RL = 20 k
15 V
V (monitor)
O
Input
(monitor)
Output
C = 100 pF
L
V
THLH = 2.0 V
V
THHL = 1.5 V
47
GND
VOL
tPHL
tPLH
Remark C includes probe and stray wiring capacitance.
L
3. Test circuit for common mode transient immunity
VCC = 15 V
1.5 kV
0 V
V
CM 90%
SW I
F
10%
RL = 20 k
0.1 F
t
r
tf
B
A
VO
(monitor)
15 V
V
O
CL = 100 pF
> 3.0 V
(Switch A: I
F
= 0 mA)
GND
<1.0 V
VO
V
OL
(Switch B: I
F
= 10 mA)
Remark C includes probe and stray wiring capacitance.
L
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against
static electricity when handling.
2. By-pass capacitor of more than 0.1 µF is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
3. Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left
open. Also, Pin 7 (which is an NC*1 pin) can either be connected directly to the GND pin on the detector
side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because
this may degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
4. Avoid storage at a high temperature and high humidity.
5. Do not use adhesives or coating materials including halogens to fix this device.
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 8 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
TYPICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
SUPPLY CURRENT vs. AMBIENT TEMPERATURE
1200
5
Vcc = 15V
Vo = 0.8V
ICCL
1000
4
3
2
1
0
Io = 0.75mA
ICCH
800
600
400
Vcc = 20V
Vo = Open
ICCH : VF = 0.8V
ICCL : IF = 10mA
200
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
100
100
Ambient Temperature TA (°C)
Ambient Temperature TA (°C)
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CURRENT vs. FORWARD CURRENT
14
0.6
Vcc = 15V
IF = 10mA
Io = 2.4mA
100°C
12
10
8
0.5
25°C
0.4
0.3
0.2
0.1
0
T = –40°C
A
6
4
2
0
Vo=0.6V
15
0
5
10
20
-50
-25
0
25
50
75
Ambient Temperature TA (°C)
Forward Current IF (mA)
PROPAGATION DELAY TIME,
PROPAGATION DELAY DIFFERENCE
vs. FORWARD CURRENT
OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
450
400
1.1
1.0
IF = 10mA
Vo = 0.6V
350
tPLH
tPHL
300
250
0.9
0.8
0.7
0.6
200
150
100
50
Vcc = 15V
CL = 100pF
RL = 20KΩ
tPLH-tPHL
10
0
-50
-25
0
25
50
75
0
5
15
20
25
Ambient Temperature TA (°C)
Forward Current IF (mA)
Remark The graphs indicate nominal characteristics.
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 9 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
PROPAGATION DELAY TIME,
PROPAGATION DELAY DIFFERENCE
vs. SUPPLY VOLTAGE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
1400
450
400
350
300
250
tPLH
IF = 10mA
1200
1000
800
CL
= 100pF
= 20KΩ
RL
t
PHL
200
150
100
50
600
t
PLH
PWD
400
t
PLH-tPHL
I
F
= 10mA
Vcc = 15V
C
R
200
0
L
L
= 100pF
= 20KΩ
t
PHL
0
-40 -20
0
20
40
60
(°C)
80
100
0
5
10
15
20
25
30
500
25
Supply Voltage Vcc (V)
Ambient Temperature T
A
PROPAGATION DELAY TIME,
PROPAGATION DELAY DIFFERENCE
vs. LOAD RESISTANCE
PROPAGATION DELAY TIME
vs. LOAD CAPACITANCE
1800
1600
1400
1200
900
800
700
600
500
400
300
200
100
50
I
F
= 10mA
Vcc = 15V
= 100pF
I
F
= 10mA
t
PLH
Vcc = 15V
= 20KΩ
C
L
RL
tPLH
1000
800
tPLH-tPHL
t
PHL
600
t
PHL
400
200
0
0
0
100
200
300
400
(pF)
0
10
20
30
40
50
Load Capacitance C
L
Load Resistance R
L
(KΩ)
PROPAGATION DELAY TIME,
PROPAGATION DELAY DIFFERENCE
vs. LOAD RESISTANCE
500
450
400
I
F
= 10mA
Vcc = 5V
= 15pF
t
PLH
C
L
350
300
250
200
150
tPLH-tPHL
tPHL
100
50
0
0
5
10
15
20
Load Resistance R
L
(KΩ)
Remark The graphs indicate nominal characteristics.
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 10 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
+0.1
–0
4.5 MAX.
1.5
4.1±0.1
0.3±0.05
2.05±0.05
12.0±0.1
10.7±0.1
Tape Direction
PS9513L2-E3
Pull-out direction
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
R 1.0
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 1 000 pcs/reel
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 11 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
+0.1
1.5
–0
5.3 MAX.
4.75±0.1
10.3±0.1
1.55±0.1
12.0±0.1
0.35±0.05
Tape Direction
PS9513L3-E3
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
R 1.0
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 12 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
D
A
Part Number
PS9513L2
Lead Bending
A
B
C
D
lead bending type (Gull-wing)
10.2
8.2
2.54
1.7
2.2
for long creepage distance (surface mount)
lead bending type (Gull-wing)
2.54
1.7
2.2
PS9513L3
for surface mount
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 13 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 12030 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of
0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times
• Flux
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum
chlorine content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine
(The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100C
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon - based and halogens - based (chlorine-based) cleaning
solvent .
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
VCC-GND at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 14 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Rating
Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1)
40/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 UIORM, Pd 5 pC
UIORM
Upr
1 130
1 808
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr
2 119
Vpeak
Vpeak
Upr = 1.875 UIORM, Pd 5 pC
Highest permissible overvoltage
UIOTM
8 000
2
Degree of pollution (DIN EN 60664-1 VDE 0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
Material group (DIN EN 60664-1 VDE 0110 Part 1)
Storage temperature range
CTI
175
III a
Tstg
TA
–55 to +125
–40 to +100
°C
°C
Operating temperature range
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
Ris MIN.
Ris MIN.
1012
1011
VIO = 500 V dc at TA MAX. at least 100°C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
Isi
175
400
700
°C
mA
mW
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
Psi
VIO = 500 V dc at TA = Tsi
Ris MIN.
109
Dependence of maximum safety ratings with package temperature
1000
900
800
700
600
Psi: Total Power Dissipation
500
400
300
Isi: Input Current
200
100
0
0
25
50
75 100 125 150 175 200
Package temp Tsi (°C)
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 15 of 16
PS9513, PS9513L1, PS9513L2, PS9513L3
Method a) Destructive Test, Type and Sample Test
UIOTM =8000V
V
Upr =1808V
UIORM =1130V
t3
tm
t4
t
tini
t2
t1
ttest
t1,t2 = 1 to 10 sec
t3,t4 = 1 sec
tm(PARTIAL DISCHARGE)= 10 sec
ttest = 12 sec
tini = 60 sec
Method b) Non-destructive Test, 100% Production Test
Upr =2119V
V
UIORM =1130V
ttest
t
t3
tm
t4
t3,t4 = 0.1 sec
tm(PARTIAL DISCHARGE)= 1.0 sec
ttest = 1.2 sec
R08DS0126EJ0203 Rev.2.03
Oct 29, 2018
Page 16 of 16
This product uses gallium arsenide (GaAs).
GaAs Products
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or i any way allow it to enter the mouth.
All trademarks and registered trademarks are the property of their respective owners.
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
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arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
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you or third parties arising from such alteration, modification, copying or reverse engineering.
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certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
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and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
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or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
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party in advance of the contents and conditions set forth in this document.
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12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
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