R8C/11 [RENESAS]

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER; 单芯片16位CMOS微机
R8C/11
型号: R8C/11
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
单芯片16位CMOS微机

计算机
文件: 总30页 (文件大小:328K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
R8C/11 Group  
REJ03B0034-0160  
Rev.1.60  
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER  
Jan 27, 2006  
1. Overview  
This MCU is built using the high-performance silicon gate CMOS process using a R8C/Tiny Series CPU  
core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions  
featuring a high level of instruction efficiency. With 1M bytes of address space, it is capable of executing  
instructions at high speed.  
1.1 Applications  
Electric household appliance, office equipment, housing equipment (sensor, security), general industrial  
equipment, audio, etc.  
Rev.1.60 Jan 27, 2006 page 1 of 26  
REJ03B0034-0160  
R8C/11 Group  
1. Overview  
1.2 Performance Overview  
Table 1.1. lists the performance outline of this MCU.  
Table 1.1 Performance outline  
Item  
Performance  
CPU  
Number of basic instructions 89 instructions  
Minimum instruction execution time 50 ns (f(XIN) = 20 MHZ, VCC = 3.0 to 5.5 V)  
100 ns (f(XIN) = 10 MHZ, VCC = 2.7 to 5.5 V)  
Operating mode  
Address space  
Memory capacity  
Port  
LED drive port  
Timer  
Single-chip  
1M bytes  
See Table 1.2.  
Input/Output: 22 (including LED drive port), Input: 2  
I/O port: 8  
Timer X: 8 bits x 1 channel, Timer Y: 8 bits x 1 channel,  
Timer Z: 8 bits x 1 channel  
Peripheral  
function  
(Each timer equipped with 8-bit prescaler)  
Timer C: 16 bits x 1 channel  
(Circuits of input capture and output compare)  
•1 channel  
Serial Interface  
Clock synchronous, UART  
•1 channel  
UART  
A/D converter  
Watchdog timer  
Interrupt  
10-bit A/D converter: 1 circuit, 12 channels  
15 bits x 1 (with prescaler)  
Internal: 11 factors, External: 5 factors,  
Software: 4 factors, Priority level: 7 levels  
2 circuits  
Clock generation circuit  
•Main clock generation circuit (Equipped with a built-in  
feedback resistor)  
•On-chip oscillator (high speed, low speed)  
On High-speed on-chip oscillator the frequency adjust-  
ment function is usable.  
Oscillation stop detection function Main clock oscillation stop detection function  
Voltage detection circuit  
Power on reset circuit  
Supply voltage  
Included  
Included  
Electrical  
characteristics  
VCC = 3.0 to 5.5 V (f(XIN) = 20 MHZ)  
VCC = 2.7 to 5.5 V (f(XIN) = 10 MHZ)  
Typ. 9 mA (VCC = 5.0 V, (f(XIN) = 20 MHZ)  
Typ. 5 mA (VCC = 3.0 V, (f(XIN) = 10 MHZ)  
Typ. 35 µA (VCC = 3.0 V, Wait mode, Peripheral clock off)  
Typ. 0.7 µA (VCC = 3.0 V, Stop mode)  
Power consumption  
Flash memory Program/erase supply voltage VCC = 2.7 to 5.5 V  
Program/erase endurance  
Operating ambient temperature  
100 times  
-20 to 85 °C  
-40 to 85 °C (D-version)  
32-pin plastic mold LQFP  
Package  
Rev.1.60 Jan 27, 2006 page 2 of 26  
REJ03B0034-0160  
R8C/11 Group  
1. Overview  
1.3 Block Diagram  
Figure 1.1 shows this MCU block diagram.  
1
2
8
5
8
Port P4  
Port P3  
I/O port  
Port P0  
Port P1  
Peripheral functions  
Timer  
A/D converter  
(10 bits 12 channels)  
System clock generator  
Timer X (8 bits)  
Timer Y (8 bits)  
Timer Z (8 bits)  
Timer C (16 bits)  
UART or Clock synchronous  
serial I/O  
X
IN-XOUT  
High-speed on-chip oscillator  
Low-speed on-chip oscillator  
(8 bits 1 channel)  
UART  
(8 bits 1 channel)  
R8C/Tiny Series CPU core  
Memory  
SB  
ROM(1)  
R0H  
R1H  
R0L  
R1L  
Watchdog timer  
(15 bits)  
USP  
ISP  
R2  
R3  
RAM(2)  
INTB  
PC  
FLG  
A0  
A1  
FB  
Multiplier  
NOTES:  
1. ROM size depends on MCU type.  
2. RAM size depends on MCU type.  
Figure 1.1 Block Diagram  
Rev.1.60 Jan 27, 2006 page 3 of 26  
REJ03B0034-0160  
R8C/11 Group  
1. Overview  
1.4 Product Information  
Table 1.2 lists the product information.  
Table 1.2 Product Information  
As of January 2006  
RAM capacity  
512 bytes PLQP0032GB-A  
Remarks  
Type No.  
R5F21112FP  
ROM capacity  
8K bytes  
Package type  
Flash memory version  
R5F21113FP  
R5F21114FP  
768 bytes  
1K bytes  
12K bytes  
16K bytes  
PLQP0032GB-A  
PLQP0032GB-A  
R5F21112DFP  
R5F21113DFP  
R5F21114DFP  
512 bytes  
768 bytes  
1K bytes  
D version  
8K bytes  
12K bytes  
16K bytes  
PLQP0032GB-A  
PLQP0032GB-A  
PLQP0032GB-A  
Type No. R 5 F 21 11 4 D FP  
Package type:  
FP : PLQP0032GB-A  
Classification:  
D: Operating ambient temperature 40 °C to 85 °C  
No symbol: Operating ambient temperature 20 °C to 85 °C  
ROM capacity:  
2 : 8 KBytes.  
3 : 12 KBytes.  
4 : 16 KBytes.  
R8C/11 group  
R8C/Tiny series  
Memory type:  
F: Flash memory version  
Renesas MCU  
Renesas semiconductors  
Figure 1.2 Type No., Memory Size, and Package  
Rev.1.60 Jan 27, 2006 page 4 of 26  
REJ03B0034-0160  
R8C/11 Group  
1. Overview  
1.5 Pin Assignments  
Figure 1.3 shows the pin configuration (top view).  
PIN CONFIGURATION (top view)  
24 23 22 21 20 19 18 17  
25  
26  
27  
28  
29  
30  
31  
32  
P4  
P1  
P1  
P1  
P1  
P1  
P1  
P1  
5
0
1
2
3
4
5
6
/INT0  
P0  
P0  
P0  
6
/AN  
/AN  
/AN  
1
16  
15  
14  
13  
12  
11  
10  
9
/KI  
/KI  
/KI  
/KI  
0
1
2
3
/AN  
8
9
/CMP0  
0
1
5
4
2
3
/AN  
/CMP0  
MODE  
P0 /AN  
P0 /AN  
P0 /AN  
/AN /TxD11  
/AN10/CMP0  
/AN11  
2
R8C/11 Group  
3
4
/TxD  
0
2
5
/RxD  
/CLK  
0
0
1
6
P0  
0
7
1
2 3 4 5 6 7 8  
NOTES:  
1. P4 functions only as an input port.  
2. When using On-chip debugger, do not use pins P0  
and P3 /TxD10/RxD  
3. Do not connect IVcc to Vcc.  
7
0/AN7/TxD11  
7
1.  
Package: PLQP0032GB-A (32P6U-A)  
Figure 1.3 Pin Assignments (Top View)  
Rev.1.60 Jan 27, 2006 page 5 of 26  
REJ03B0034-0160  
R8C/11 Group  
1. Overview  
1.6 Pin Description  
Table 1.3 shows the pin description  
Table 1.3 Pin description  
Signal name  
Power supply  
input  
Pin name  
Vcc,  
Vss  
I/O type  
Function  
I
Apply 2.7 V to 5.5 V to the Vcc pin. Apply 0 V to the  
Vss pin.  
IVcc  
IVcc  
O
This pin is to stabilize internal power supply.  
Connect this pin to Vss via a capacitor (0.1 µF).  
Do not connect to Vcc.  
Analog power  
supply input  
AVcc, AVss  
I
Power supply input pins for A/D converter. Connect the  
AVcc pin to Vcc. Connect the AVss pin to Vss. Connect a  
capacitor between pins AVcc and AVss.  
___________  
Reset input  
CNVss  
MODE  
RESET  
CNVss  
MODE  
I
I
I
I
Input Lon this pin resets the MCU.  
Connect this pin to Vss via a resistor.  
Connect this pin to Vcc via a resistor.  
These pins are provided for the main clock generat-  
ing circuit I/O. Connect a ceramic resonator or a crys-  
tal oscillator between the XIN and XOUT pins. To use  
an externally derived clock, input it to the XIN pin and  
Main clock input XIN  
Main clock output XOUT  
O
leave the XOUT pin open.  
_____  
_______  
_______  
______  
INT interrupt input INT0 to INT3  
Key input interrupt KI0 to KI3  
I
I
INT interrupt input pins.  
Key input interrupt pins.  
Timer X I/O pin  
Timer X output pin  
Timer Y I/O pin  
Timer Z output pin  
Timer C input pin  
Timer C output pins  
_____  
_____  
Timer X  
CNTR0  
I/O  
O
I/O  
O
I
O
____________  
CNTR0  
Timer Y  
Timer Z  
Timer C  
CNTR1  
TZOUT  
TCIN  
CMP00 to CMP02,  
CMP10 to CMP12  
CLK0  
Serial interface  
I/O  
I
O
Transfer clock I/O pin.  
Serial data input pins.  
Serial data output pins.  
RxD0, RxD1  
TxD0, TxD10,  
TxD11  
Reference voltage VREF  
input  
I
Reference voltage input pin for A/D converter. Con-  
nect the VREF pin to Vcc.  
A/D converter  
I/O port  
AN0 to AN11  
I
Analog input pins for A/D converter  
P00 to P07,  
P10 to P17,  
P30 to P33, P37,  
P45  
I/O  
These are 8-bit CMOS I/O ports. Each port has an I/O  
select direction register, allowing each pin in that port  
to be directed for input or output individually.  
Any port set to input can select whether to use a pull-  
up resistor or not by program.  
P10 to P17 also function as LED drive ports.  
Port for input-only  
Input port  
P46, P47  
I
Rev.1.60 Jan 27, 2006 page 6 of 26  
REJ03B0034-0160  
R8C/11 Group  
2. Central Processing Unit (CPU)  
2. Central Processing Unit (CPU)  
Figure 2.1 shows the CPU registers. The CPU has 13 registers. Of these, R0, R1, R2, R3, A0, A1 and FB  
comprise a register bank. Two sets of register banks are provided.  
b31  
b15  
b8b7  
b0  
R0L (low-order of R0)  
R1L (low-order of R1)  
R2  
R3  
R0H (high-order of R0)  
R1H (high-order of R1)  
(1)  
Data registers  
R2  
R3  
A0  
A1  
FB  
(1)  
Address registers  
(1)  
Frame base registers  
b19  
b15  
b0  
INTBH  
INTBL  
Interrupt table register  
Program counter  
The 4-high order bits of INTB are INTBH and  
the 16-low bits of INTB are INTBL.  
b19  
b0  
b0  
PC  
b15  
USP  
ISP  
SB  
User stack pointer  
Interrupt stack pointer  
Static base register  
b15  
b0  
b0  
FLG  
Flag register  
b15  
b8 b7  
IPL  
U
I
O B S Z D C  
Carry flag  
Debug flag  
Zero flag  
Sign flag  
Register bank select flag  
Overflow flag  
Interrupt enable flag  
Stack pointer select flag  
Reserved bit  
Processor interrupt priority level  
Reserved bit  
NOTES:  
1. A register bank comprises these registers. Two sets of register banks are provided  
Figure 2.1 CPU Register  
2.1 Data Registers (R0, R1, R2 and R3)  
R0 is a 16-bit register for transfer, arithmetic and logic operations. The same applies to R1 to R3. The R0  
can be split into high-order bit (R0H) and low-order bit (R0L) to be used separately as 8-bit data registers.  
The same applies to R1H and R1L as R0H and R0L. R2 can be combined with R0 to be used as a 32-bit  
data register (R2R0). The same applies to R3R1 as R2R0.  
Rev.1.60 Jan 27, 2006 page 7 of 26  
REJ03B0034-0160  
R8C/11 Group  
2. Central Processing Unit (CPU)  
2.2 Address Registers (A0 and A1)  
A0 is a 16-bit register for address register indirect addressing and address register relative addressing.  
They also are used for transfer, arithmetic and logic operations. The same applies to A1 as A0. A0 can be  
combined with A0 to be used as a 32-bit address register (A1A0).  
2.3 Frame Base Register (FB)  
FB is a 16-bit register for FB relative addressing.  
2.4 Interrupt Table Register (INTB)  
INTB is a 20-bit register indicates the start address of an interrupt vector table.  
2.5 Program Counter (PC)  
PC, 20 bits wide, indicates the address of an instruction to be executed.  
2.6 User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)  
The stack pointer (SP), USP and ISP, are 16 bits wide each.  
The U flag of FLG is used to switch between USP and ISP.  
2.7 Static Base Register (SB)  
SB is a 16-bit register for SB relative addressing.  
2.8 Flag Register (FLG)  
FLG is a 11-bit register indicating the CPU state.  
2.8.1 Carry Flag (C)  
The C flag retains a carry, borrow, or shift-out bit that has occurred in the arithmetic logic unit.  
2.8.2 Debug Flag (D)  
The D flag is for debug only. Set to 0.  
2.8.3 Zero Flag (Z)  
The Z flag is set to 1when an arithmetic operation resulted in 0; otherwise, 0.  
2.8.4 Sign Flag (S)  
The S flag is set to 1when an arithmetic operation resulted in a negative value; otherwise, 0.  
2.8.5 Register Bank Select Flag (B)  
The register bank 0 is selected when the B flag is 0. The register bank 1 is selected when this flag is  
set to 1.  
2.8.6 Overflow Flag (O)  
The O flag is set to 1when the operation resulted in an overflow; otherwise, 0.  
2.8.7 Interrupt Enable Flag (I)  
The I flag enables a maskable interrupt.  
An interrupt is disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The  
I flag is set to 0when an interrupt request is acknowledged.  
2.8.8 Stack Pointer Select Flag (U)  
ISP is selected when the U flag is set to 0, USP is selected when the U flag is set to 1.  
The U flag is set to 0when a hardware interrupt request is acknowledged or the INT instruction of  
software interrupt numbers 0 to 31 is executed.  
2.8.9 Processor Interrupt Priority Level (IPL)  
IPL, 3 bits wide, assigns processor interrupt priority levels from level 0 to level 7.  
If a requested interrupt has greater priority than IPL, the interrupt is enabled.  
2.8.10 Reserved Bit  
When write to this bit, set to 0. When read, its content is indeterminate.  
Rev.1.60 Jan 27, 2006 page 8 of 26  
REJ03B0034-0160  
R8C/11 Group  
3. Memory  
3. Memory  
Figure 3.1 is a memory map of this MCU. This MCU provides 1-Mbyte address space from addresses  
0000016 to FFFFF16.  
The internal ROM is allocated lower addresses beginning with address 0FFFF16. For example, a 16-Kbyte  
internal ROM is allocated addresses from 0C00016 to 0FFFF16.  
The fixed interrupt vector table is allocated addresses 0FFDC16 to 0FFFF16. They store the starting  
address of each interrupt routine.  
The internal RAM is allocated higher addresses beginning with address 0040016. For example, a 1-Kbyte  
internal RAM is allocated addresses 0040016 to 007FF16. The internal RAM is used not only for storing  
data, but for calling subroutines and stacks when interrupt request is acknowledged.  
Special function registers (SFR) are allocated addresses 0000016 to 002FF16. The peripheral function  
control registers are located them. All addresses, which have nothing allocated within the SFR, are re-  
served area and cannot be accessed by users.  
0000016  
SFR  
(See Chapter 4 for details.)  
002FF16  
0040016  
Internal RAM  
0XXXX16  
0FFDC16  
Undefined instruction  
Overflow  
BRK instruction  
Address match  
Single step  
Watchdog timer,Oscillation stop detection,Voltage detection  
0YYYY16  
0FFFF16  
(Reserved)  
(Reserved)  
Reset  
Internal ROM  
0FFFF16  
Expansion area  
FFFFF16  
NOTES :  
1. Blank spaces are reserved. No access is allowed.  
Internal ROM  
Internal RAM  
Type name  
Address 0YYYY16  
Address 0XXXX16  
Size  
Size  
16K bytes  
12K bytes  
8K bytes  
0C00016  
0D00016  
0E00016  
R5F21114FP, R5F21114DFP  
R5F21113FP, R5F21113DFP  
R5F21112FP, R5F21112DFP  
1K bytes  
007FF16  
768 bytes  
512 bytes  
006FF16  
005FF16  
Figure 3.1 Memory Map  
Rev.1.60 Jan 27, 2006 page 9 of 26  
REJ03B0034-0160  
R8C/11 Group  
4. Special Function Register (SFR)  
4. Special Function Register (SFR)  
SFR(Special Function Register) is the control register of peripheral functions. Tables 4.1 to 4.4 list the SFR  
information  
(1)  
Table 4.1 SFR Information(1)  
Address  
Register  
Symbol  
After reset  
000016  
000116  
000216  
000316  
000416 Processor mode register 0  
PM0  
PM1  
CM0  
CM1  
HR0  
AIER  
PRCR  
HR1  
OCD  
0016  
0016  
01101000  
00100000  
0016  
XXXXXX00  
00XXX000  
4016  
00000100  
XX16  
XX16  
00011111  
0016  
0016  
X016  
000516  
Processor mode register 1  
000616  
System clock control register 0  
2
2
000716  
000816  
000916  
000A16  
000B16  
000C16  
000D16  
000E16  
000F16  
001016  
001116  
001216  
001316  
001416  
001516  
001616  
001716  
001816  
001916  
001A16  
System clock control register 1  
High-speed on-chip oscillator control register 0  
Address match interrupt enable register  
2
Protect register  
2
High-speed on-chip oscillator control register 1  
Oscillation stop detection register  
Watchdog timer reset register  
Watchdog timer start register  
Watchdog timer control register  
Address match interrupt register 0  
2
WDTR  
WDTS  
WDC  
2
RMAD0  
Address match interrupt register 1  
RMAD1  
0016  
0016  
X016  
Voltage detection register 1(2)  
Voltage detection register 2(2)  
VCR1  
VCR2  
00001000  
0016(3)  
2
100000002(4)  
001B16  
001C16  
001D16  
001E16  
001F16  
INT0 input filter select register  
INT0F  
D4INT  
XXXXX000  
2
Voltage detection interrupt register(2)  
0016(3)  
010000012(4)  
002016  
002116  
002216  
002316  
002416  
002516  
002616  
002716  
002816  
002916  
002A16  
002B16  
002C16  
002D16  
002E16  
002F16  
003016  
003116  
003216  
003316  
003416  
003516  
003616  
003716  
003816  
003916  
003A16  
003B16  
003C16  
003D16  
003E16  
003F16  
X : Undefined  
NOTES:  
1. Blank spaces are reserved. No access is allowed.  
2. Software reset or the watchdog timer reset does not affect this register.  
3. Owing to Reset input.  
4. In the case of RESET pin = H retaining.  
Rev.1.60 Jan 27, 2006 page 10 of 26  
REJ03B0034-0160  
R8C/11 Group  
4. Special Function Register (SFR)  
(1)  
Table 4.2 SFR Information(2)  
Address  
004016  
004116  
004216  
004316  
004416  
004516  
004616  
004716  
004816  
004916  
004A16  
004B16  
004C16  
004D16  
004E16  
004F16  
005016  
005116  
005216  
005316  
005416  
005516  
005616  
005716  
005816  
005916  
005A16  
005B16  
005C16  
005D16  
005E16  
005F16  
Register  
Symbol  
After reset  
Key input interrupt control register  
AD conversion interrupt control register  
KUPIC  
ADIC  
XXXXX000  
XXXXX000  
2
2
Compare 1 interrupt control register  
UART0 transmit interrupt control register  
CMP1IC  
S0TIC  
S0RIC  
S1TIC  
S1RIC  
INT2IC  
TXIC  
TYIC  
TZIC  
XXXXX000  
XXXXX000  
XXXXX000  
2
2
2
UART0 receive interrupt control register  
UART1 transmit interrupt control register  
UART1 receive interrupt control register  
INT2 interrupt control register  
Timer X interrupt control register  
Timer Y interrupt control register  
Timer Z interrupt control register  
INT1 interrupt control register  
INT3 interrupt control register  
Timer C interrupt control register  
Compare 0 interrupt control register  
XXXXX000  
2
XXXXX000  
XXXXX000  
XXXXX000  
XXXXX000  
XXXXX000  
XXXXX000  
XXXXX000  
XXXXX000  
XXXXX000  
2
2
2
2
2
2
2
2
2
INT1IC  
INT3IC  
TCIC  
CMP0IC  
INT0 interrupt control register  
INT0IC  
XX00X0002  
006016  
006116  
006216  
006316  
006416  
006516  
006616  
006716  
006816  
006916  
006A16  
006B16  
006C16  
006D16  
006E16  
006F16  
007016  
007116  
007216  
007316  
007416  
007516  
007616  
007716  
007816  
007916  
007A16  
007B16  
007C16  
007D16  
007E16  
007F16  
X : Undefined  
NOTES:  
1. Blank spaces are reserved. No access is allowed.  
Rev.1.60 Jan 27, 2006 page 11 of 26  
REJ03B0034-0160  
R8C/11 Group  
4. Special Function Register (SFR)  
(1)  
Table 4.3 SFR Information(3)  
Address  
Register  
Symbol  
After reset  
008016 Timer Y, Z mode register  
008116 Prescaler Y register  
008216 Timer Y secondary register  
TYZMR  
PREY  
TYSC  
TYPR  
PUM  
PREZ  
TZSC  
TZPR  
0016  
FF16  
FF16  
FF16  
0016  
FF16  
FF16  
FF16  
Timer Y primary register  
Timer Y, Z waveform output control register  
Prescaler Z register  
Timer Z secondary register  
Timer Z primary register  
008316  
008416  
008516  
008616  
008716  
008816  
008916  
008A16  
008B16  
Timer Y, Z output control register  
Timer X mode register  
TYZOC  
TXMR  
PREX  
TX  
0016  
0016  
FF16  
FF16  
0016  
008C16 Prescaler X register  
Timer X register  
Timer count source set register  
008D16  
008E16  
008F16  
009016  
009116  
009216  
009316  
009416  
009516  
009616  
009716  
009816  
009916  
009A16  
TCSS  
Timer C register  
TC  
0016  
0016  
External input enable register  
Key input enable register  
INTEN  
KIEN  
0016  
0016  
Timer C control register 0  
TCC0  
TCC1  
TM0  
0016  
0016  
0016  
009B16 Timer C control register 1  
009C16 Capture, compare 0 register  
009D16  
0016(2)  
FF16  
009E16  
Compare 1 register  
TM1  
009F16  
00A016  
FF16  
0016  
XX16  
XX16  
XX16  
00001000  
00000010  
XX16  
XX16  
0016  
XX16  
XX16  
XX16  
00001000  
00000010  
UART0 transmit/receive mode register  
UART0 bit rate register  
UART0 transmit buffer register  
U0MR  
U0BRG  
U0TB  
00A116  
00A216  
00A316  
00A416  
UART0 transmit/receive control register 0  
UART0 transmit/receive control register 1  
UART0 receive buffer register  
U0C0  
U0C1  
U0RB  
2
2
00A516  
00A616  
00A716  
00A816  
UART1 transmit/receive mode register  
UART1 bit rate register  
UART1 transmit buffer register  
U1MR  
U1BRG  
U1TB  
00A916  
00AA16  
00AB16  
00AC16  
UART1 transmit/receive control register 0  
UART1 transmit/receive control register 1  
U1C0  
U1C1  
2
2
00AD16  
00AE16  
UART1 receive buffer register  
U1RB  
XX16  
XX16  
0016  
00AF16  
00B016  
UART transmit/receive control register 2  
UCON  
00B116  
00B216  
00B316  
00B416  
00B516  
00B616  
00B716  
00B816  
00B916  
00BA16  
00BB16  
00BC16  
00BD16  
00BE16  
00BF16  
X : Undefined  
NOTES:  
1. Blank spaces are reserved. No access is allowed.  
2. When output compare mode (the TCC13 bit in the TCC1 register = 1) is selected, the value after reset is set to FFFF16.  
Rev.1.60 Jan 27, 2006 page 12 of 26  
REJ03B0034-0160  
R8C/11 Group  
4. Special Function Register (SFR)  
(1)  
Table 4.4 SFR Information(4)  
Address  
Register  
Symbol  
AD  
After reset  
XX16  
00C016  
00C116  
00C216  
00C316  
00C416  
00C516  
00C616  
00C716  
00C816  
00C916  
00CA16  
00CB16  
00CC16  
00CD16  
00CE16  
00CF16  
00D016  
00D116  
00D216  
00D316  
00D416  
00D516  
AD register  
XX16  
AD control register 2  
ADCON2  
0016  
00D616 AD control register 0  
ADCON0  
ADCON1  
00000XXX  
0016  
2
00D716  
AD control register 1  
00D816  
00D916  
00DA16  
00DB16  
00DC16  
00DD16  
00DE16  
00DF16  
00E016  
Port P0 register  
Port P1 register  
Port P0 direction register  
Port P1 direction register  
P0  
P1  
PD0  
PD1  
XX16  
XX16  
0016  
0016  
00E116  
00E216  
00E316  
00E416  
00E516  
Port P3 register  
P3  
XX16  
00E616  
00E716  
Port P3 direction register  
Port P4 register  
PD3  
P4  
0016  
XX16  
00E816  
00E916  
00EA16 Port P4 direction register  
PD4  
0016  
00EB16  
00EC16  
00ED16  
00EE16  
00EF16  
00F016  
00F116  
00F216  
00F316  
00F416  
00F516  
00F616  
00F716  
00F816  
00F916  
03FA16  
00FB16  
00FC16 Pull-up control register 0  
PUR0  
PUR1  
DRR  
00XX00002  
XXXXXX0X  
0016  
00FD16  
Pull-up control register 1  
2
00FE16  
Port P1 drive capacity control register  
Timer C output control register  
00FF16  
TCOUT  
0016  
01B316 Flash memory control register 4  
01B416  
FMR4  
FMR1  
FMR0  
01000000  
0100XX0X  
00000001  
2
01B516  
Flash memory control register 1  
2
01B616  
01B716  
Flash memory control register 0  
2
X : Undefined  
NOTES:  
1. Blank columns, 010016 to 01B216 and 01B816 to 02FF16 are all reserved. No access is allowed.  
Rev.1.60 Jan 27, 2006 page 13 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
5. Electrical Characteristics  
Table 5.1 Absolute Maximum Ratings  
Symbol  
Parameter  
Condition  
Rated value  
Unit  
V
V
CC  
Supply voltage  
V
CC=AVCC  
-0.3 to 6.5  
-0.3 to 6.5  
V
VCC=AVCC  
AVCC  
Analog supply voltage  
Input voltage  
V
I
V
V
-0.3 to VCC+0.3  
-0.3 to VCC+0.3  
Output voltage  
VO  
P
d
Power dissipation  
C
300  
Topr=25  
mW  
C
T
opr  
Operating ambient temperature  
Storage temperature  
-20 to 85 / -40 to 85 (D version)  
T
stg  
C
-65 to 150  
Table 5.2 Recommended Operating Conditions  
Standard  
Typ.  
Conditions  
Symbol  
Parameter  
Unit  
Min.  
Max.  
V
CC  
Supply voltage  
2.7  
5.5  
V
(3)  
AVcc  
Vss  
Analog supply voltage  
Supply voltage  
V
CC  
V
V
V
0
AVss  
Analog supply voltage  
"H" input voltage  
0
0.8VCC  
0
V
V
V
IH  
IL  
VCC  
0.2VCC  
-60.0  
V
"L" input voltage  
Sum of all pins' IOH  
(peak)  
"H" peak all  
output currents  
IOH (sum)  
mA  
IOH (peak)  
IOH (avg)  
IOL (sum)  
"H" peak output current  
-10.0  
-5.0  
mA  
mA  
"H" average output current  
Sum of all pins' IOL  
"L" peak all  
60  
mA  
(peak)  
output currents  
"L" peak output  
current  
Except P10 to P17  
10  
30  
mA  
mA  
mA  
mA  
IOL (peak)  
P10 to P17  
Drive capacity HIGH  
Drive capacity LOW  
10  
5
"L" average  
output current  
Except P1  
P1 to P1  
0 to P17  
IOL (avg)  
Drive capacity HIGH  
Drive capacity LOW  
3.0V Vcc 5.5V  
2.7V Vcc < 3.0V  
mA  
mA  
MHz  
MHz  
15  
0
7
5
20  
10  
0
0
f (XIN  
)
Main clock input oscillation frequency  
NOTES:  
1. VCC = AVCC = 2.7 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, unless otherwise specified.  
2. The typical values when average output current is 100ms.  
3. Hold Vcc=AVcc.  
Rev.1.60 Jan 27, 2006 page 14 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Table 5.3 A/D Conversion Characteristics  
Standard  
Unit  
Symbol  
Parameter  
Measuring condition  
Min. Typ. Max.  
Resolution  
V
ref =VCC  
10  
Bit  
Absolute  
accuracy  
øAD=10 MHz, Vref=Vcc=5.0V  
øAD=10 MHz, Vref=Vcc=5.0V  
10 bit mode  
LSB  
LSB  
LSB  
±3  
±2  
8 bit mode  
øAD=10 MHz, Vref=Vcc=3.3V(3)  
øAD=10 MHz, Vref=Vcc=3.3V(3)  
±5  
10 bit mode  
8 bit mode  
±2  
40  
LSB  
kΩ  
µs  
VREF=VCC  
R
LADDER  
Ladder resistance  
Conversion time  
10  
t
CONV  
øAD=10 MHz, Vref=Vcc=5.0V  
øAD=10 MHz, Vref=Vcc=5.0V  
3.3  
2.8  
10 bit mode  
8 bit mode  
µs  
(4)  
CC  
V
Reference voltage  
V
VREF  
Analog input voltage  
V
IA  
0
Vref  
V
A/D operating  
clock frequency  
0.25  
1.0  
Without sample & hold  
With sample & hold  
MHz  
MHz  
10  
10  
(2)  
NOTES:  
1. VCC=AVCC=2.7 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, unless otherwise specified.  
2. If fAD exceeds 10 MHz more, divide the fAD and hold A/D operating clock frequency (ØAD) 10 MHz or below.  
3. If the AVcc is less than 4.2V, divide the fAD and hold A/D operating clock frequency (ØAD) fAD/2 or below.  
4. Hold Vcc=Vref.  
P0  
30pF  
P1  
P2  
P3  
P4  
Figure 5.1 Port P0 to P4 measurement circuit  
Rev.1.60 Jan 27, 2006 page 15 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Table 5.4 Flash Memory Version Electrical Characteristics  
Standard  
Unit  
Symbol  
Measuring condition  
Parameter  
Min.  
100  
Typ.  
Max  
Program/erase endurance  
Byte program time  
times  
µs  
400  
9
50  
0.4  
Block erase time  
s
Time delay from suspend request until erase  
suspend  
td(SR-ES)  
8
ms  
ms  
Erase Suspend Request Interval  
10  
2.7  
2.7  
0
V
V
5.5  
5.5  
60  
Program, Erase voltage  
Read voltage  
Program, Erase temperature  
°C  
Ambient  
temperature=55 °C  
Data hold time(2)  
20  
year  
NOTES:  
1. Referenced to VCC1=AVcc=2.7 to 5.5V at Topr = 0 to 60 °C unless otherwise specified.  
2. The data hold time includes time that the power supply is off or the clock is not supplied.  
Table 5.5 Voltage Detection Circuit Electrical Characteristics  
Standard  
Typ.  
Symbol  
Measuring condition  
Parameter  
Unit  
Min.  
Max.  
Voltage detection level  
Vdet  
3.3  
3.8  
4.3  
V
(2)  
40  
µs  
nA  
µs  
Voltage detection interrupt request generating time  
Voltage detection circuit self consumption current  
VC27=1, VCC=5.0V  
600  
(3)  
td(E-A)  
Vccmin  
20  
Waiting time till voltage detection circuit operation starts  
Minimum value of microcomputer operation voltage  
V
2.7  
NOTES:  
1. The measuring condition is Vcc=AVcc=2.7V to 5.5V and Topr= -40°C to 85 °C.  
2. This shows the time until the voltage detection interrupt request is generated since the voltage passes Vdet.  
3. This shows the required time until the voltage detection circuit operates when setting to "1" again after setting the VC27 bit in  
the VCR2 register to 0.  
Erase-suspend request  
(interrupt request)  
FMR46  
t
d(SR-ES)  
Figure 5.2 Time delay from Suspend Request until Erase Suspend  
Rev.1.60 Jan 27, 2006 page 16 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
(1, 3)  
Table 5.6 Reset Circuit Electrical Characteristics (When Using Hardware Reset 2  
)
Standard  
Typ.  
Symbol  
Vpor2  
Measuring condition  
Parameter  
Unit  
Min.  
Max.  
Vdet  
Power-on reset valid voltage  
20°C  
20°C  
Topr < 85°C  
V
t
W
(Vpor2-  
Vdet)  
(2)  
Supply voltage rising time when power-on reset is canceled  
(4)  
Topr < 85°C, tW(por2) 0s  
ms  
100  
NOTES:  
1. The voltage detection circuit which is embedded in a microcomputer is a factor to generate the hardware reset 2. Refer to 5.1.2 Hardware  
Reset 2 of Hardware Manual for details.  
2. This condition is not applicable when using with Vcc  
1.0V.  
3. When turning power on after the external power has been held below the valid voltage (Vpor1) for greater than 10 seconds, refer to Table 5.7  
Reset Circuit Electrical Characteristics (When Not Using Hardware Reset 2).  
4. tw(por2) is time to hold the external power below effective voltage (Vpor2).  
Table 5.7 Reset Circuit Electrical Characteristics (When Not Using Hardware Reset 2)  
Standard  
Typ.  
Measuring condition  
Symbol  
Parameter  
Unit  
V
Min.  
Max.  
0.1  
Vpor1  
Power-on reset valid voltage  
20°C  
0°C  
Topr < 85°C  
tW(Vpor1-  
Vdet)  
Supply voltage rising time when power-on reset is canceled  
Supply voltage rising time when power-on reset is canceled  
100  
100  
ms  
Topr 85°C, tW(por1) 10s(2)  
tW(Vpor1-  
Vdet)  
30s(2)  
10s(2)  
ms  
20°C  
20°C  
Topr < 0°C, t  
Topr < 0°C, t  
W
(por1)  
(por1)  
tW(Vpor1-  
Vdet)  
Supply voltage rising time when power-on reset is canceled  
Supply voltage rising time when power-on reset is canceled  
1
ms  
ms  
W
tW(Vpor1-  
Vdet)  
0.5  
0°C  
Topr 85°C, tW(por1) 1s(2)  
NOTES:  
1. When not using hardware reset 2, use with Vcc  
2.7V.  
2. tw(por1) is time to hold the external power below effective voltage (Vpor1).  
(3)  
det  
(3)  
det  
V
V
V
V
cc min  
por2  
V
por1  
(1, 2)  
Sampling time  
tw(por2)  
tw(Vpor2 Vdet)  
tw(por1) tw(Vpor1Vdet)  
Internal reset signal  
(Leffective)  
1
1
X 32  
X 32  
f
RING-S  
f
RING-S  
NOTES:  
1. Hold the voltage of the microcomputer operation voltage range (Vccmin or above) within sampling time.  
2. A sampling clock is selectable. Refer to 5.4 Voltage Detection Circuitof Hardware Manual for details.  
3. Vdet shows the voltage detection level of the voltage detection circuit. Refer to 5.4 Voltage Detection Circuitfor details.  
4. Refer to Table 16.6 Reset Circuit Electrical Characteristicsfor electrical characteristics.  
Figure 5.3 Reset Circuit Electrical Characteristics  
Rev.1.60 Jan 27, 2006 page 17 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Table 5.8 High-speed On-Chip Oscillator Circuit Electrical Characteristics  
Standard  
Unit  
Symbol  
Measuring condition  
Parameter  
Min.  
6
Typ.  
8
Max.  
10  
VCC=5.0V, Topr=25 °C  
Set "4016" in the HR1 register  
High-speed on-chip oscillator frequency 1 / {td(HRoffset)+td(HR)} when the  
reset is released  
MHz  
ns  
td(HRoffset)  
td(HR)  
VCC=5.0V, Topr=25 °C  
Set "0016" in the HR1 register  
Settable high-speed on-chip oscillator minimum period  
61  
Differences when setting "0116" and "0016  
in the HR register  
"
High-speed on-chip oscillator period adjusted unit  
ns  
1
±5  
Frequency fluctuation in temperature range  
of -10 °C to 50 °C  
High-speed on-chip oscillator frequency temperature dependence(1)  
High-speed on-chip oscillator frequency temperature dependence(2)  
%
%
Frequency fluctuation in temperature range  
of -40 °C to 85 °C  
±10  
NOTES:  
1. The measuring condition is Vcc=AVcc=5.0 V and Topr=25 °C.  
Table 5.9 Power Circuit Timing Characteristics  
Standard  
Typ.  
Symbol  
Measuring condition  
Parameter  
Unit  
Min.  
1
Max.  
2000  
150  
µs  
µs  
(2)  
td(P-R)  
td(R-S)  
Time for internal power supply stabilization during powering-on  
(3)  
STOP release time  
NOTES:  
1. The measuring condition is Vcc=AVcc=2.7 to 5.5 V and Topr=25 °C.  
2. This shows the wait time until the internal power supply generating circuit is stabilized during power-on.  
3. This shows the time until BCLK starts from the interrupt acknowledgement to cancel stop mode.  
Table 5.10 Electrical Characteristics (1) [Vcc=5V]  
Standard  
Typ.  
Measuring condition  
Symbol  
Parameter  
Unit  
Min.  
CC-2.0  
CC-0.3  
CC-2.0  
Max.  
I
OH  
=-  
5mA  
V
V
Except XOUT  
V
V
CC  
"H" output voltage  
"L" output voltage  
I
OH  
=-200µA  
V
V
CC  
V
OH  
I
I
OH  
=
-
-
1 mA  
V
V
CC  
CC  
V
V
Drive ability HIGH  
Drive ability LOW  
XOUT  
OH=  
500µA  
V
V
CC-2.0  
Except P1  
0
to P1  
7
, XOUT  
2.0  
I
OL= 5 mA  
OL= 200 µA  
V
V
I
0.45  
V
OL  
I
OL= 15 mA  
OL= 5 mA  
OL= 200 µA  
2.0  
2.0  
P1  
0
to P1  
7
Drive capacity HIGH  
Drive capacity LOW  
V
V
I
I
0.45  
2.0  
2.0  
1.0  
Drive capacity LOW  
V
V
Drive capacity HIGH  
Drive capacity LOW  
I
OL= 1 mA  
XOUT  
I
OL=500 µA  
V
V
0.2  
0.2  
Hysteresis  
V
T+-  
V
T-  
INT  
KI , KI  
RxD , RxD  
o
, INT  
, CNTR  
, P45  
1
, INT  
2
, INT  
3
, KI  
0, KI1,  
2
3
0
, CNTR  
1
, TCIN,  
0
1
2.2  
5.0  
V
RESET  
I
IH  
"H" input current  
"L" input current  
Pull-up resistance  
V
I
=5V  
=0V  
µA  
µA  
kΩ  
I
IL  
V
I
-5.0  
R
PULLUP  
fXIN  
RING-S  
50  
1.0  
167  
V
I=0V  
30  
X
IN  
MΩ  
kHz  
V
R
Feedback resistance  
Low-speed on-chip oscillator frequency  
40  
f
125  
250  
At stop mode  
RAM retention voltage  
2.0  
V
RAM  
NOTES:  
1. Referenced to VCC = AVCC = 4.2 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, f(XIN)=20MHz unless otherwise specified.  
Rev.1.60 Jan 27, 2006 page 18 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Table 5.11 Electrical Characteristics (2) [Vcc=5V]  
Standard  
Unit  
Symbol  
Measuring condition  
Parameter  
Min.  
Typ.  
9
Max.  
15  
X
IN=20 MHz (square wave)  
High-speed  
mode  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
No division  
mA  
X
IN=16 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
No division  
8
5
14  
mA  
mA  
X
IN=10 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
No division  
X
IN=20 MHz (square wave)  
Medium-speed  
mode  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
4
3
2
mA  
mA  
X
IN=16 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
Power supply current  
(VCC=3.3 to 5.5V)  
I
CC  
X
IN=10 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
mA  
In single-chip mode, the output  
pins are open and other pins  
are VSS  
Main clock off  
High-speed  
on-chip oscillator  
mode  
High-speed on-chip oscillator on=8 MHz  
Low-speed on-chip oscillator on=125 kHz  
No division  
mA  
mA  
4
8
Main clock off  
High-speed on-chip oscillator on=8 MHz  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
1.5  
Main clock off  
Low-speed  
on-chip oscillator  
mode  
High-speed on-chip oscillator off  
µA  
µA  
470  
40  
900  
80  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
Main clock off  
Wait mode  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
When a WAIT instruction is executed  
(1)  
Peripheral clock operation  
VC27=“0”  
Main clock off  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
When a WAIT instruction is executed  
Peripheral clock off  
VC27=“0”  
Wait mode  
Stop mode  
76  
38  
µA  
µA  
(1)  
Main clock off, Topr = 25 °C  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator off  
0.8  
3.0  
CM10="1"  
Peripheral clock off  
VC27="0"  
NOTES:  
1. Timer Y is operated with timer mode.  
2. Referenced to VCC = AVCC = 4.2 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, f(XIN)=20MHz unless otherwise specified.  
Rev.1.60 Jan 27, 2006 page 19 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Timing requirements (Unless otherwise noted: VCC = 5V, VSS = 0V at Topr = 25 °C) [VCC=5V]  
Table 5.12 XIN input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
Max.  
tC(XIN)  
tWH(XIN)  
tWL(XIN)  
ns  
ns  
ns  
XIN input cycle time  
XIN input HIGH pulse width  
XIN input LOW pulse width  
50  
25  
25  
________  
Table 5.13 CNTR0 input, CNTR1 input, INT2 input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
100  
40  
Max.  
tC(CNTR0)  
tWH(CNTR0)  
tWL(CNTR0)  
ns  
ns  
ns  
CNTR0 input cycle time  
CNTR0 input HIGH pulse width  
CNTR0 input LOW pulse width  
40  
________  
Table 5.14 TCIN input, INT3 input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
400(1)  
200(2)  
200(2)  
Max.  
tC(TCIN)  
tWH(TCIN)  
tWL(TCIN)  
ns  
ns  
ns  
TCIN input cycle time  
TCIN input HIGH pulse width  
TCIN input LOW pulse width  
NOTES:  
1. When using the Timer C input capture mode, adjust the cycle time above ( 1/ Timer C count source  
frequency x 3).  
2. When using the Timer C input capture mode, adjust the pulse width above ( 1/ Timer C count source  
frequency x 1.5).  
Table 5.15 Serial Interface  
Symbol  
Unit  
Standard  
Parameter  
Min.  
Max.  
80  
tC(CK)  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
200  
100  
100  
0
35  
90  
CLKi input cycle time  
tW(CKH)  
tW(CKL)  
td(C-Q)  
th(C-Q)  
tsu(D-C)  
th(C-D)  
CLKi input HIGH pulse width  
CLKi input LOW pulse width  
TxDi output delay time  
TxDi hold time  
RxDi input setup time  
RxDi input hold time  
________  
Table 5.16 External interrupt INT0 input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
250(1)  
250(2)  
Max.  
________  
tW(INH)  
tW(INL)  
ns  
ns  
INT0 input HIGH pulse width  
________  
INT0 input LOW pulse width  
NOTES:  
________  
________  
1. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input HIGH pulse width  
to the greater value,either ( 1/ digital fi_l_t_e__r__c_lock frequency x 3) or the minimum value of standard.  
________  
2. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input LOW pusle width  
to the greater value,either ( 1/ digital filter clock frequency x 3) or the minimum value of standard.  
Rev.1.60 Jan 27, 2006 page 20 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
VCC = 5V  
tc(CNTR0)  
tWH(CNTR0)  
CNTR0 input  
tWL(CNTR0)  
tc(TCIN)  
tWH(TCIN)  
TCIN input  
tWL(TCIN)  
tc(XIN)  
tWH(XIN)  
XIN input  
tWL(XIN)  
tc(CK)  
tW(CKH)  
CLKi  
tW(CKL)  
th(C-Q)  
TxDi  
RxDi  
td(C-Q)  
tsu(D-C)  
th(C-D)  
tW(INL)  
INTi  
tW(INH)  
Figure 5.4 Vcc=5V timing diagram  
Rev.1.60 Jan 27, 2006 page 21 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Table 5.17 Electrical Characteristics (3) [Vcc=3V]  
Standard  
Unit  
Measuring condition  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
I
OH=-1mA  
V
Except XOUT  
V
CC  
CC  
CC  
-
0.5  
0.5  
0.5  
V
CC  
CC  
CC  
"H" output voltage  
"L" output voltage  
V
Drive capacity HIGH  
Drive capacity LOW  
I
OH  
=
-
0.1 mA  
V
-
-
V
OH  
X
OUT  
V
V
V
V
I
OH  
=-50 µA  
I
OL= 1 mA  
Except P1  
P1 to P1  
0 to P17, XOUT  
V
0.5  
V
Drive capacity HIGH  
Drive capacity LOW  
Drive capacity HIGH  
Drive capacity LOW  
I
OL= 2 mA  
0.5  
0.5  
0
7
V
OL  
I
OL= 1 mA  
V
V
V
I
I
OL= 0.1 mA  
OL=50 µA  
0.5  
0.5  
0.8  
X
OUT  
0.2  
0.2  
Hysteresis  
V
T+-VT-  
V
INT  
KI , KI  
RxD , RxD  
o
, INT  
, CNTR  
, P45  
1
, INT  
2
, INT  
3
, KI  
0, KI1,  
2
3
0
, CNTR  
1
, TCIN,  
0
1
1.8  
4.0  
V
RESET  
"H" input current  
"L" input current  
I
IH  
VI=3V  
µA  
µA  
kΩ  
V
V
I=0V  
-
4.0  
I
IL  
66  
500  
160  
3.0  
RPULLUP  
I=0V  
Pull-up resistance  
Feedback resistance  
MΩ  
R
fXIN  
XIN  
kHz  
125  
250  
Low-speed on-chip oscillator frequency  
40  
f
RING-S  
2.0  
V
V
RAM  
RAM retention voltage  
At stop mode  
NOTES:  
1. Referenced to VCC = AVCC = 2.7 to 3.3V at Topr = -20 to 85 °C / -40 to 85 °C, f(XIN)=10MHz unless otherwise specified.  
Rev.1.60 Jan 27, 2006 page 22 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Table 5.18 Electrical Characteristics (4) [Vcc=3V]  
Standard  
Unit  
Symbol  
Measuring condition  
Parameter  
Min.  
Typ.  
8
Max.  
13  
X
IN=20 MHz (square wave)  
High-speed  
mode  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
No division  
mA  
X
IN=16 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
No division  
7
5
12  
mA  
mA  
X
IN=10 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
No division  
X
IN=20 MHz (square wave)  
Medium-speed  
mode  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
3
mA  
mA  
X
IN=16 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
2.5  
1.6  
Power supply current  
(VCC=2.7 to 3.3V)  
I
CC  
X
IN=10 MHz (square wave)  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
mA  
In single-chip mode, the output  
pins are open and other pins  
are VSS  
Main clock off  
High-speed  
on-chip oscillator  
mode  
High-speed on-chip oscillator on=8 MHz  
Low-speed on-chip oscillator on=125 kHz  
No division  
mA  
mA  
3.5  
1.5  
7.5  
Main clock off  
High-speed on-chip oscillator on=8 MHz  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
Main clock off  
Low-speed  
on-chip oscillator  
mode  
High-speed on-chip oscillator off  
µA  
µA  
800  
74  
420  
37  
Low-speed on-chip oscillator on=125 kHz  
Division by 8  
Main clock off  
Wait mode  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
When a WAIT instruction is executed  
(1)  
Peripheral clock operation  
VC27=“0”  
Main clock off  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator on=125 kHz  
Wait mode  
µA  
µA  
35  
70  
(1)  
When a WAIT instruction is executed  
Peripheral clock off  
VC27=“0”  
Main clock off, Topr = 25 °C  
High-speed on-chip oscillator off  
Low-speed on-chip oscillator off  
CM10="1"  
Peripheral clock off  
Stop mode  
0.7  
3.0  
VC27="0"  
NOTES:  
1. Timer Y is operated with timer mode.  
2. Referenced to VCC = AVCC = 2.7 to 3.3V at Topr = -20 to 85 °C / -40 to 85 °C, f(XIN)=10MHz unless otherwise specified.  
Rev.1.60 Jan 27, 2006 page 23 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
Timing requirements (Unless otherwise noted: VCC = 3V, VSS = 0V at Topr = 25 °C) [VCC=3V]  
Table 5.19 XIN input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
100  
40  
Max.  
tC(XIN)  
tWH(XIN)  
tWL(XIN)  
ns  
ns  
ns  
XIN input cycle time  
XIN input HIGH pulse width  
XIN input LOW pulse width  
40  
________  
Table 5.20 CNTR0 input, CNTR1 input, INT2 input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
300  
120  
120  
Max.  
tC(CNTR0)  
tWH(CNTR0)  
tWL(CNTR0)  
ns  
ns  
ns  
CNTR0 input cycle time  
CNTR0 input HIGH pulse width  
CNTR0 input LOW pulse width  
________  
Table 5.21 TCIN input, INT3 input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
1200(1)  
600(2)  
600(2)  
Max.  
tC(TCIN)  
tWH(TCIN)  
tWL(TCIN)  
ns  
ns  
ns  
TCIN input cycle time  
TCIN input HIGH pulse width  
TCIN input LOW pulse width  
NOTES:  
1. When using the Timer C input capture mode, adjust the cycle time above ( 1/ Timer C count source  
frequency x 3).  
2. When using the Timer C input capture mode, adjust the pulse width above ( 1/ Timer C count source  
frequency x 1.5).  
Table 5.22 Serial Interface  
Symbol  
Unit  
Standard  
Parameter  
Min.  
Max.  
160  
tC(CK)  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
300  
150  
150  
0
55  
90  
CLKi input cycle time  
tW(CKH)  
tW(CKL)  
td(C-Q)  
th(C-Q)  
tsu(D-C)  
th(C-D)  
CLKi input HIGH pulse width  
CLKi input LOW pulse width  
TxDi output delay time  
TxDi hold time  
RxDi input setup time  
RxDi input hold time  
________  
Table 5.23 External interrupt INT0 input  
Standard  
Symbol  
Unit  
Parameter  
Min.  
380(1)  
380(2)  
Max.  
________  
tW(INH)  
tW(INL)  
ns  
ns  
INT0 input HIGH pulse width  
________  
INT0 input LOW pulse width  
NOTES:  
________  
________  
1. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input HIGH pulse width  
to the greater value,either ( 1/ digital fi_l_t_e__r__c_lock frequency x 3) or the minimum value of standard.  
________  
2. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input LOW pusle width  
to the greater value,either ( 1/ digital filter clock frequency x 3) or the minimum value of standard.  
Rev.1.60 Jan 27, 2006 page 24 of 26  
REJ03B0034-0160  
R8C/11 Group  
5. Electrical Characteristics  
VCC = 3V  
tc(CNTR0)  
tWH(CNTR0)  
CNTR0 input  
tWL(CNTR0)  
tc(TCIN)  
tWH(TCIN)  
TCIN input  
tWL(TCIN)  
tc(XIN)  
tWH(XIN)  
X
IN input  
tWL(XIN)  
tc(CK)  
tW(CKH)  
CLK  
i
tW(CKL)  
th(C-Q)  
TxD  
i
td(C-Q)  
tsu(D-C)  
th(C-D)  
RxD  
i
tW(INL)  
INT  
i
tW(INH)  
Figure 5.5 Vcc=3V timing diagram  
Rev.1.60 Jan 27, 2006 page 25 of 26  
REJ03B0034-0160  
R8C/11 Group  
Package Dimensions  
Package Dimensions  
JEITA Package Code  
P-LQFP32-7x7-0.80  
RENESAS Code  
Previous Code  
32P6U-A  
MASS[Typ.]  
0.2g  
PLQP0032GB-A  
HD  
*1  
D
24  
17  
NOTE)  
1. DIMENSIONS "*1" AND "*2"  
DO NOT INCLUDE MOLD FLASH.  
2. DIMENSION "*3" DOES NOT  
INCLUDE TRIM OFFSET.  
16  
25  
bp  
b1  
Dimension in Millimeters  
Reference  
Symbol  
Min Nom Max  
D
E
6.9 7.0 7.1  
6.9 7.0 7.1  
1.4  
Terminal cross section  
32  
9
A2  
HD  
HE  
A
8.8 9.0 9.2  
8.8 9.0 9.2  
1.7  
1
8
ZD  
Index mark  
A1  
bp  
b1  
c
0.1 0.2  
0
0.32 0.37 0.42  
0.35  
F
0.09  
0.20  
0.145  
0.125  
c1  
L
L1  
0°  
8°  
e
0.8  
Detail F  
y
x
0.20  
0.10  
*3  
bp  
x
e
y
ZD  
ZE  
L
0.7  
0.7  
0.3 0.5 0.7  
1.0  
L1  
Rev.1.60 Jan 27, 2006 page 26 of 26  
REJ03B0034-0160  
REVISION HISTORY  
R8C/11 Group Datasheet  
Rev.  
Date  
Description  
Summary  
Page  
1.00 Jun. 19, 2003  
1.10 Sep. 08, 2003  
First edition issued  
2
Table 1.1: Shortest instruction execution time _a__n__d___f_(_X__IN) changed  
5
Figure 1.3: Pin name changed from TXOUT to CNTR0  
____________  
6
Table 1.3: Pin name changed from TXOUT to CNTR0  
The value of HR1 register after reset changed  
The value of TC register after reset changed  
Chapter “5. Electrical Characteristics” added  
10  
12  
14  
1.20 Oct. 31, 2003  
2
Table 1.1: Power consumption values added  
6
11  
Table 1.3: Resistor value for CNVss and MODE deleted  
Register name of address 005016 modified from CMP2IC to CMP1IC, register name  
of address 005C16 modified from CMP1IC to CMP0IC  
Table 5.2: Note 3 and Note 4 deleted  
tsamp in Table 5.3 deleted  
Figure 5.1 added  
Table 5.10: Vcc changed from “4.2 to 5.5V” to “3.3V to 5.5V”, low-power on-chip  
oscillator changed from “on 100kHz” to “125kHz”, XIN=5MHz deleted and  
XIN=10MHz added in high-speed mode and medium-speed mode, VC27=”0” added  
in stop mode measuring condition, data added and modified  
Table 11 to Table 15 added  
14  
15  
17  
19  
20  
21  
22  
23  
Figure 5.2 added  
Table 5.16: Note 1, f(BCLK)=5 MHz changed to 10 MHz  
Table 5.17: low-power ring oscillator changed from “on 100kHz” to “125kHz”,  
XIN=5MHz deleted and XIN=10MHz added in high-speed mode and medium-speed  
mode, VC27=”0” added in stop mode measuring condition, data added and modi-  
fied  
24  
25  
Table 5.18 to Table 5.22 added  
Figure 5.3 added  
4
15  
Table 1.2 : ** deleted  
Table 5.4 revised  
1.30 Dec 05, 2003  
1.40 Sep 30, 2004  
all pages Words standardized (on-chip oscillator, serial interface, A/D)  
2
5
Table 1.1 revised  
Figure 1.3, NOTES 3 added  
6
Table 1.3 revised  
9
Figure 3.1, NOTES added  
10-13  
12  
14  
15  
16  
17  
18  
One body sentence in chapter 4 added ; Title of Table 4.1 to 4.4 added  
Table 4.3 revised ; Table 4.4 revised  
Table 5.2 revised  
Table 5.3 revised  
Table 5.4 revised ; Table 16.5 revised  
Table 5.6, 5.7 adn 5.8 revised ; Figure 5.3 revised  
Table 5.9 revised ; Table 5.10 revised  
A-1  
REVISION HISTORY  
R8C/11 Group Datasheet  
Rev.  
Date  
Description  
Summary  
Table 5.12 revised ; Table 5.16 revised  
Table 16.17 revised  
Table 16.19 revised  
Page  
20  
22  
24  
1.40 Sep 30, 2004  
1.50 Apr.27.2005  
4
5
Table 1.2, Figure 1.2 package name revised  
Figure 1.3 package name revised  
Table 4.1 revised  
Table 4.3 revised  
Table 5.3 partly revised  
10  
12  
15  
16  
17  
18  
22  
26  
Table 5.4 partly added  
Table 5.6, Table 5.7 revised  
Table 5.9, Table 10 partly revised  
Table 5.17 partly revised  
Package Dimensions revised  
1.60 Jan.27.2006  
2
3
4
Table 1.1 Performance outline revised  
Figure 1.1 Block diagram partly revised  
1.4 Product Information, title of Table 1.2 “Product List”  
“Product Informaton” revised  
Figure 1.2 Type No., Memory Size, and Package partly revised  
Table 1.3 Pin description revised  
6
7-8  
2 Central Processing Unit (CPU) revised  
Figure 2.1 CPU register revised  
10  
11  
12  
Table 4.1 SFR Information(1) NOTES:1 revised  
Table 4.2 SFR Information(2) NOTES:1 revised  
Table 4.3 SFR Information(3);  
008116: “Prescaler Y” “Prescaler Y Register”  
008216: “Timer Y Secondary” “Timer Y Secondary Register”  
008316: “Timer Y Primary” “Timer Y Primary Register”  
008516: “Prescaler Z” “Prescaler Z Register”  
008616: “Timer Z Secondary” “Timer Z Secondary Register”  
008716: “Timer Z Primary” “Timer Z Primary Register”  
008C16: “Prescaler X” “Prescaler X Register” revised  
NOTES:1, 2 revised  
13  
14  
15  
Table 4.4 SFR Information(4) NOTES:1 revised  
Table 5.2 Recommended Operating Conditions; NOTES: 1, 2, 3 revised  
Table 5.3 A/D Conversion Characteristics;  
“A/D operation clock frequency” “A/D operating clock frequency” revised  
NOTES: 1, 2, 3, 4 revised  
16  
Table 5.4 Flash Memory (Program ROM) Electrical Characteristics;  
Topr” “Ambient temperature” revised  
Measuring condition of byte program time and block erase time deleted  
Table 5.6 Reset Circuit Electrical Characteristics (When Using Hardware Reset 2)  
NOTES: 3 revised  
17  
18  
Table 5.8 High-speed On-Chip Oscillator Circuit Electrical Characteristics;  
“High-speed on-chip oscillator temperature dependence”  
“High-speed on-chip oscillator frequency temperature dependence” revised  
Table 5.10 Electrical Characteristics (1) [VCC=5V];  
“P10 to P17 Except XOUT“Except P10 to P17, XOUT” revised  
A-2  
REVISION HISTORY  
R8C/11 Group Datasheet  
Rev.  
Date  
Description  
Page  
Summary  
1.60 Jan.27.2006  
19  
Table 5.11 Electrical Characteristics (2) [VCC=5V]  
NOTES: 1, 2 revised  
Measuring condition Stop mode: Topr = 25 °C”  
22  
23  
Table 5.17 Electrical Characteristics (3) [VCC=3V]  
“P10 to P17 Except XOUT“Except P10 to P17, XOUT” revised  
Table 5.18 Electrical Characteristics (4) [VCC=3V]  
NOTES: 1, 2 revised  
Measuring condition Stop mode: Topr = 25 °C”  
A-3  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,  
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of  
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is  
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor  
home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to  
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes  
no responsibility for any damage, liability or other loss resulting from the information contained herein.  
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life  
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a  
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater  
use.  
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and  
cannot be imported into a country other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.  
RENESAS SALES OFFICES  
http://www.renesas.com  
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
Renesas Technology America, Inc.  
450 Holger Way, San Jose, CA 95134-1368, U.S.A  
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501  
Renesas Technology Europe Limited  
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.  
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900  
Renesas Technology (Shanghai) Co., Ltd.  
Unit 205, AZIA Center, No.133 Yincheng Rd (n), Pudong District, Shanghai 200120, China  
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898  
Renesas Technology Hong Kong Ltd.  
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong  
Tel: <852> 2265-6688, Fax: <852> 2730-6071  
Renesas Technology Taiwan Co., Ltd.  
10th Floor, No.99, Fushing North Road, Taipei, Taiwan  
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999  
Renesas Technology Singapore Pte. Ltd.  
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632  
Tel: <65> 6213-0200, Fax: <65> 6278-8001  
Renesas Technology Korea Co., Ltd.  
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea  
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145  
Renesas Technology Malaysia Sdn. Bhd  
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia  
Tel: <603> 7955-9390, Fax: <603> 7955-9510  
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.  
Colophon .5.0  

相关型号:

R8C/12

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
RENESAS

R8C/13

SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
RENESAS

R8C/14

16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES
RENESAS

R8C/15

16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES
RENESAS

R8C/16

16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES
RENESAS

R8C/17

16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES
RENESAS

R8C/18

SINGLE-CHIP 16-BIT CMOS MCU
RENESAS

R8C/19

SINGLE-CHIP 16-BIT CMOS MCU
RENESAS

R8C/1A

RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER R8C FAMILY / R8C/1x SERIES
RENESAS

R8C/1B

RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER R8C FAMILY / R8C/1x SERIES
RENESAS
RENESAS
RENESAS