ZSSC3224BI3R [RENESAS]
High End 24-Bit Sensor Signal Conditioner IC;
| 型号： | ZSSC3224BI3R |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | High End 24-Bit Sensor Signal Conditioner IC |
| 文件： | 总48页 (文件大小：1162K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High End 24-Bit Sensor Signal
Conditioner IC
ZSSC3224
Datasheet
Brief Description
Features
The ZSSC3224 is a sensor signal conditioner (SSC) IC for high-
accuracy amplification and analog-to-digital conversion of a differ-
ential or pseudo-differential input signal. Designed for high resolu-
tion sensor module applications, the ZSSC3224 can perform offset,
span, and 1st and 2nd order temperature compensation of the
measured signal. Developed for correction of resistive bridge or
absolute voltage sensors, it can also provide a corrected tempera-
ture output measured with an internal sensor.
.
Flexible, programmable analog front-end design; up to 24-bit
analog-to-digital converter (ADC)
.
Fully programmable gain amplifier for optimizing sensor
signals: gain range 6.6 to 216 (linear)
.
.
Internal auto-compensated 18-bit temperature sensor
Digital compensation of individual sensor offset; 1st and 2nd
order digital compensation of sensor gain as well as 1st and
2nd order temperature gain and offset drift
The measured and corrected sensor values are provided at the
digital output pins, which can be configured as I2C (≤3.4MHz) or
SPI (≤20MHz). Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via a 26-bit internal
digital signal processor (DSP) running a correction algorithm.
Calibration coefficients are stored on-chip in a highly reliable, non-
volatile, multiple-time programmable (MTP) memory. Programming
the ZSSC3224 is simple via the serial interface. The interface is
used for the PC-controlled calibration procedure, which programs
the set of calibration coefficients in memory. The ZSSC3224
provides accelerated signal processing, increased resolution, and
improved noise immunity in order to support high-speed control,
safety, and real-time sensing applications with the highest
requirements for energy efficiency.
.
.
Programmable interrupt operation
High-speed sensing: e.g., 18-bit conditioned sensor
signal measurement rate >200s-1
.
.
Typical sensor elements can achieve an accuracy of better
than ±0.10% full scale output (FSO) at -40 to 85°C
Integrated 26-bit calibration math digital signal
processor (DSP)
.
.
Fully corrected signal at digital output
Layout customized for die-die bonding with sensor for high-
density chip-on-board assembly
.
.
.
.
.
.
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components required
Highly integrated CMOS design
Applications
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery applications
.
Barometric altitude measurement for portable navigation or
emergency call systems; altitude measurement for car
navigation
Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute voltage (e.g.,
thermopile) sensor modules
.
.
.
.
.
Weather forecast
Fan control
.
.
.
.
.
Supply voltage range: 1.68V to 3.6V
Operating mode current: ~1.0mA (typical)
Sleep Mode current: 20nA (typical)
Temperature resolution: <0.7mK/LSB
Industrial, pneumatic, and liquid pressure
High-resolution temperature measurements
Object-temperature radiation (via thermopile)
Excellent energy-efficiency:
ZSSC3224 Application Example
with 18-bit resolution: <100pJ/step
with 24-bit resolution: <150nJ/step
VSS
VDD
VDD
.
.
.
Small die size
Stacked-Die Sensor Module
Operation temperature: –40°C to +85°C
VDD
ZSSC3224
SS
Delivery options: 4.0mm x 4.0mm 24-PQFN and die for wafer
bonding
VSS
VSS
VDDB
INP(+)
SS
MOSI
SDA
RES
RES
INP
sensor element
SCLK
SCL
VDDB
INN
Microcontroller
VSSB
EOC
EOC
MOSI
SDA
INN(-)
VSSB
MISO
MISO
SCLK
SCL
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November 12, 2018
ZSSC3224 Block Diagram
VDDB
Vreg int
VDD
VTP
Temperature
Reference
Sensor
AGND / CM
Generator
BiasCurrent
Generator
Voltage Regulator
VTN
Power Ctr.
VSS
ZSSC3224
DSP Core
(Calculations,
Communication)
A
EOC
INP
INN
D
Sensor
Bridge
24 Bit
Pre-amplifier
VSSB
SCLK/SCL
SS
MOSI/SDA
MISO
SPI
I2C
System
Control
Unit
Clock
Generator
MTP
Power-ON
Reset
RES
Oscillator
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November 12, 2018
Contents
1. Pin and Pad Assignments and Descriptions.................................................................................................................................................6
1.1 ZSSC3224 Die Pad Assignments and Descriptions............................................................................................................................6
1.2 ZSSC3224 24-PQFN Pin Assignments and Pin Descriptions .............................................................................................................7
2. Absolute Maximum Ratings..........................................................................................................................................................................8
3. Recommended Operating Conditions ..........................................................................................................................................................9
4. Electrical Characteristics ............................................................................................................................................................................10
4.1 Power Supply Rejection Ratio (PSRR) versus Frequency ................................................................................................................11
5. Circuit Description ......................................................................................................................................................................................12
5.1 Brief Description ................................................................................................................................................................................12
5.2 Signal Flow and Block Diagram.........................................................................................................................................................12
5.3 Analog Front End...............................................................................................................................................................................13
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.3.6
Amplifier..............................................................................................................................................................................13
Analog-to-Digital Converter ................................................................................................................................................15
Selection of Gain and Offset – Sensor System Dimensioning............................................................................................17
Temperature Measurement................................................................................................................................................18
External Sensor Supply: Bridge Sensors............................................................................................................................18
External Sensor: Absolute Voltage Source Sensors ..........................................................................................................18
5.4 Digital Section....................................................................................................................................................................................19
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
Digital Signal Processor (DSP) Core..................................................................................................................................19
MTP Memory......................................................................................................................................................................19
Clock Generator .................................................................................................................................................................19
Power Supervision..............................................................................................................................................................19
Interface..............................................................................................................................................................................19
6. Functional Description................................................................................................................................................................................20
6.1 Power Up...........................................................................................................................................................................................20
6.2 Measurements...................................................................................................................................................................................20
6.3 Interrupt (EOC Pin)............................................................................................................................................................................20
6.4 Operational Modes ............................................................................................................................................................................21
6.4.1
SPI/I2C Commands............................................................................................................................................................24
6.5 Communication Interface...................................................................................................................................................................26
6.5.1
6.5.2
6.5.3
Common Functionality........................................................................................................................................................26
SPI......................................................................................................................................................................................27
I2C......................................................................................................................................................................................30
6.6 Multiple Time Programmable (MTP) Memory....................................................................................................................................31
6.6.1
6.6.2
Programming Memory........................................................................................................................................................31
Memory Contents ...............................................................................................................................................................32
6.7 Calibration Sequence ........................................................................................................................................................................37
6.7.1
6.7.2
Calibration Step 1 – Assigning Unique Identification..........................................................................................................37
Calibration Step 2 – Data Collection...................................................................................................................................37
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6.7.3
6.7.4
6.7.5
Calibration Step 3a) – Coefficient Calculations ..................................................................................................................38
Calibration Step 3b) – Post-Calibration Offset Correction ..................................................................................................38
SSC Measurements ...........................................................................................................................................................39
6.8 The Calibration Math .........................................................................................................................................................................39
6.8.1
6.8.2
6.8.3
Bridge Signal Compensation..............................................................................................................................................39
Temperature Signal Compensation....................................................................................................................................41
Measurement Output Data Format.....................................................................................................................................42
7. Package Outline Drawings .........................................................................................................................................................................43
7.1 ZSSD3224 Die Dimensional Drawings..............................................................................................................................................43
7.2 24-PQFN Package Dimensions.........................................................................................................................................................44
8. Quality and Reliability.................................................................................................................................................................................45
9. Related Documents....................................................................................................................................................................................45
10. Glossary .....................................................................................................................................................................................................45
11. Marking Diagram ........................................................................................................................................................................................46
12. Ordering Information...................................................................................................................................................................................46
13. Document Revision History ........................................................................................................................................................................47
List of Figures
Figure 1.1 ZSSC3224 Die Pad Assignments.....................................................................................................................................................6
Figure 1.2 Pin Assignments: 4.0 4.0 0.85 mm 24-PQFN Package.............................................................................................................7
Figure 5.1 ZSSC3224 Functional Block Diagram with Resistive-Bridge Sensor .............................................................................................12
Figure 5.2 ZSSC3224 Functional Block Diagram with Voltage-Source Sensor...............................................................................................13
Figure 5.3 ADC Gain and Offset Setup ...........................................................................................................................................................18
Figure 6.1 Interrupt Functionality.....................................................................................................................................................................21
Figure 6.2 Operational Flow Chart: Power Up.................................................................................................................................................22
Figure 6.3 Operational Flow Chart: Command Mode and Normal Mode (Sleep and Cyclic) ..........................................................................23
Figure 6.4 SPI Configuration CPHA=0 ............................................................................................................................................................28
Figure 6.5 SPI Configuration CPHA=1 ............................................................................................................................................................28
Figure 6.6 SPI Command Request..................................................................................................................................................................29
Figure 6.7 SPI Read Status.............................................................................................................................................................................29
Figure 6.8 SPI Read Data................................................................................................................................................................................29
Figure 6.9 I2C Command Request..................................................................................................................................................................30
Figure 6.10 I2C Read Status .............................................................................................................................................................................30
Figure 6.11 I2C Read Data................................................................................................................................................................................30
Figure 7.1 Approximate ZSSC3224 Pad Layout..............................................................................................................................................43
Figure 7.2 General 24-PQFN Package Dimensions........................................................................................................................................44
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November 12, 2018
List of Tables
Table 1.1 ZSSC3224 Die Pad Assignments.....................................................................................................................................................6
Table 1.2 ZSSC3224 Pin Descriptions: 24-PQFN Package.............................................................................................................................7
Table 2.1 Absolute Maximum Ratings..............................................................................................................................................................8
Table 3.1 Recommended Operating Conditions ..............................................................................................................................................9
Table 3.2 Requirements for VDD Power-on Reset...........................................................................................................................................9
Table 4.1 Electrical Characteristics ................................................................................................................................................................10
Table 5.1 Amplifier Gain: Stage 1...................................................................................................................................................................14
Table 5.2 Amplifier Gain: Stage 2...................................................................................................................................................................14
Table 5.3 Gain Polarity...................................................................................................................................................................................14
Table 5.4 ADC Conversion Times for a Single Analog-to-Digital Conversion ................................................................................................15
Table 5.5 ADC Offset Shift .............................................................................................................................................................................16
Table 5.6 Typical Conversion Times versus Noise Performance with Full Sensor Signal Conditioning for Measurement including AZSM,
SM, AZTM, and TM (Bridge-Type Sensor).....................................................................................................................................16
Table 6.1 SPI/I2C Commands........................................................................................................................................................................24
Table 6.2 Get_Raw Commands .....................................................................................................................................................................26
Table 6.3 General Status Byte .......................................................................................................................................................................27
Table 6.4 Mode Status ...................................................................................................................................................................................27
Table 6.5 MTP Memory Content Assignments...............................................................................................................................................32
Table 6.6 Measurement Results of ADC Raw Measurement Request (Two’s Complement) ........................................................................42
Table 6.7 Calibration Coefficients (Factors and Summands) in Memory (Sign Magnitude) ...........................................................................42
Table 6.8 Output Results from SSC-Correction Math or DSP—Sensor and Temperature ............................................................................42
Table 6.9 Interrupt Thresholds TRSH1 and TRSH2—Format as for SSC-Correction Math Output ...............................................................42
Table 7.1 Physical Package Dimensions .......................................................................................................................................................44
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November 12, 2018
1. Pin and Pad Assignments and Descriptions
The ZSSC3224 is available in die form or in the 24-PQFN package.
1.1 ZSSC3224 Die Pad Assignments and Descriptions
Figure 1.1 ZSSC3224 Die Pad Assignments
VDD
VSS
ZMDI-test
ZMDI-test
SS
ZMDI-test
RES
ZMDI-test
INP
VDDB
INN
VSSB
EOC
MISO
MOSI/SDA
SCLK/SCL
ZMDI-test
Table 1.1 ZSSC3224 Die Pad Assignments
Name
VDD
Direction
Type
Supply
Supply
Digital
Analog
Description
IN
IN
Positive supply voltage for the ZSSC3224.
Ground reference voltage signal.
VSS
RES
IN
ZSSC3224 reset (low active, internal pull-up).
Positive external bridge-sensor supply.
VDDB
OUT
Negative sensor signal (or sensor-ground for absolute voltage-sources
sensors).
INN
IN
Analog
EOC
MISO
OUT
OUT
IN
Digital
Digital
Digital
Analog
Analog
Digital
Digital
–
End of conversion or interrupt output.
Data output for SPI.
SS
Slave select for SPI.
INP
IN
Positive sensor signal.
VSSB
OUT
IN/OUT
IN
Negative external bridge-sensor supply (sensor ground).
Data input for SPI; data in/out for I2C.
Clock input for SPI/I2C.
MOSI/SDA
SCLK/SCL
ZMDI-test
–
Do not connect to these pads.
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November 12, 2018
1.2 ZSSC3224 24-PQFN Pin Assignments and Pin Descriptions
Figure 1.2 Pin Assignments: 4.0 4.0 0.85 mm24-PQFN Package
Note: Drawing is not to scale. See section 7 for dimensions.
24
23
22
21
20
19
1
2
3
4
5
18
17
16
15
14
13
ZMDI-test
RES
ZMDI-test
SS
VDDB
INN
ZMDI-test
INP
24-PQFN
TOP VIEW
EOC
VSSB
6
MISO
MOSI/SDA
7
8
9
11
12
10
Table 1.2 ZSSC3224 Pin Descriptions: 24-PQFN Package
Note: In the following table, “n.c.” stands for not connected / no connection required / not bonded.
Pin No.
Name
ZMDI-test
RES
Direction
Type
–
Description
1
2
3
–
Do not connect.
IN
Digital
Analog
ZSSC3224 reset (low active, internal pull-up).
Positive external bridge-sensor supply.
VDDB
OUT
Negative sensor signal (or sensor ground for absolute voltage-
source sensors).
4
INN
IN
Analog
5
6
EOC
MISO
ZMDI-test
n.c.
OUT
Digital
End of conversion or interrupt output.
OUT
Digital
Data output for SPI.
7
–
–
–
–
–
–
–
–
–
–
Do not connect.
8
–
–
–
–
9
n.c.
10
11
n.c.
n.c.
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November 12, 2018
Pin No.
12
Name
SCLK/SCL
MOSI/SDA
VSSB
Direction
Type
Description
IN
Digital
Clock input for SPI/I2C.
Data input for SPI; data in/out for I2C.
13
IN/OUT
Digital
14
OUT
IN
–
Analog
Negative external bridge-sensor supply (sensor ground).
15
INP
Analog
Positive sensor signal.
16
ZMDI-test
SS
–
Do not connect.
17
IN
–
Digital
Slave select for SPI
18
ZMDI-test
ZMDI-test
n.c.
–
Do not connect.
19
–
–
Do not connect.
20
–
–
–
21
n.c.
–
–
Supply
–
–
22
VDD
IN
–
Positive supply voltage for the ZSSC3224.
–
23
n.c.
24
VSS
IN
–
Supply
–
Ground reference voltage signal.
Do not connect electrically.
25
Exposed Pad
2. Absolute Maximum Ratings
Note: The absolute maximum ratings are stress ratings only. The ZSSC3224 might not function or be operable above the recommended
operating conditions. Stresses exceeding the absolute maximum ratings might also damage the device. In addition, extended exposure to
stresses above the recommended operating conditions might affect device reliability. IDT does not recommend designing to the “Absolute
Maximum Ratings.”
Table 2.1 Absolute Maximum Ratings
PARAMETER
SYMBOL
VSS
Min
0
TYP
MAX
0
UNITS
Voltage Reference
V
V
Analog Supply Voltage
VDD
-0.4
-0.5
-100
±4000
-50
3.63
VDD+0.5
100
-
Voltage at all Analog and Digital IO Pins
VA_IO, VD_IO
IIN
V
Input Current into Any Pin except RES, ZMDI-test, SS [a], [b]
Electrostatic Discharge Tolerance – Human Body Model (HBM1) [c]
Storage Temperature
mA
V
VHBM1
TSTOR
150
°C
[a] Latch-up current limit for RES, ZMDI-test, and SS: ±70mA.
[b] Latch-up resistance; reference for pin is 0V.
[c] HBM1: C = 100pF charged to VHBM1 with resistor R = 1.5k in series based on MIL 883, Method 3015.7. ESD protection referenced to the
Human Body Model is tested with devices in ceramic dual in-line packages (CDIP) during product qualification.
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November 12, 2018
3. Recommended Operating Conditions
Note: The reference for all voltages is Vss.
Table 3.1 Recommended Operating Conditions
PARAMETER
Supply Voltage
SYMBOL
VDD
MIN
TYP
MAX
3.6
UNIT
V
1.68
–
VDD Rise Time
tVDD
200
1.8
μs
Bridge Current [a]
IVDDB
mA
16.5
85
Operation Temperature Range
TAMB
CL
-40
–
°C
nF
External (Parasitic) Capacitance between VDDB and VSS
0.01
50
[a] Power supply rejection is reduced if a current in the range of 16.5mA > IVDDB > 1.8mA is drawn out of VDDB.
A dynamic power-on-reset circuit is implemented in order to achieve minimum current consumption in Sleep Mode. The VDD low level and the
subsequent rise time and VDD rising slope must meet the requirements in Table 3.2 to guarantee an overall IC reset; lower VDD low levels
allow slower rising of the subsequent on-ramp of VDD. Other combinations might also be possible. For example, the reset trigger can be
influenced by increasing the power-down time and lowering the VDD rising slope requirement. Alternatively, the RES pin can be connected and
used to control safe resetting of the ZSSC3224. RES is active-low; a VDD-VSS-VDD transition at the RES pin leads to a complete ZSSC3224
reset.
Table 3.2 Requirements for VDD Power-on Reset
PARAMETER
Power-Down Time (duration of VDD Low Level)
VDD Low Level
SYMBOL
tSPIKE
MIN
3
TYP
MAX
–
UNIT
µs
–
–
–
VDDlow
SRVDD
0
0.2
–
V
VDD Rising Slope
10
V/ms
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November 12, 2018
4. Electrical Characteristics
All parameter values are valid only under the specified operating conditions. All voltages are referenced to Vss.
Table 4.1 Electrical Characteristics
Note: See important table notes at the end of the table.
Parameter
Symbol
Conditions/Comments
Min
Typ
Max
Unit
Supply
External Sensor Supply Voltage, ADC
Reference Voltage
VDDB
Internally generated
1.60
1.68
1.75
V
Active State, average
Sleep Mode, idle current, 85°C
VDD = 1.8V
1050
20
1500
250
88
µA
nA
dB
Current Consumption
IVDD
Power Supply Rejection
17
32
60
20·log10(VDD/VDDB
(see section 4.1)
)
PSRVDD
VDD = 2V
65
91
dB
Analog-to-Digital Converter (ADC, A2D)
Resolution
rADC
fADC
12
24
Bit
ADC Clock Frequency
Internal ADC clock
0.9
1
1.1
MHz
Conversions per second for single
24-bit external sensor A2D
conversion (without auto-zero
measurement AZ)
144
2.3
Hz
Conversion Rate
fS,raw
Conversions per second for single
16-bit temperature sensor A2D
conversion (without AZ)
kHz
Amplifier
Gain
Gamp
Gerr
64 steps
6.6
216
2.5
Gain Error
Referenced to nominal gain
-2.5
–
%
Sensor Signal Conditioning Performance
Accuracy error for sensor that is
ideally linear (in temperature and
measurand)
ZSSC3224 Accuracy Error [a]
ErrA,IC
0.01
60
%FSO
Hz
Conversion per second for fully
corrected 24-bit measurement
Conversion Rate
fS, SSC
58
10
Input
Input voltage range at INP and INN
pins
Input Voltage Range
VINP, VINN
0.65
1.05
V
Full power supply disturbance
rejection (PSRR) capabilities
1
50
kΩ
External Sensor Bridge Resistance
RBR
Reduced PSRR, but full functionality
100
999
Ω
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November 12, 2018
Parameter
Symbol
Conditions/Comments
Min
Typ
Max
Unit
Power-Up
VDD ramp up to interface
communication (see section 6.1)
tSTA1
tSTA2
tWUP1
1
ms
ms
ms
Start-up Time
VDD ramp up to analog operation
2.5
0.5
Sleep to Active State interface
communication
Wake-up Time
Sleep to Active State analog
operation
tWUP2
2
ms
Oscillator
Internal Oscillator Frequency
Internal Temperature Sensor
Temperature Resolution
Interface and Memory
fCLK
3.6
4
4.4
MHz
-40°C to +85°C
0.7
mK/LSB
Maximum capacitance at MISO line:
40pF at VDD=1.8V
SPI Clock Frequency
I2C Clock Frequency
Program Time
fC,SPI
fC,I2C
tprog
1
20
3.4
16
MHz
MHz
ms
MTP programming time per 16-bit
register
5
Endurance
nMTP
Number of reprogramming cycles
1000h at 125°C
1000
10
10000
Numeric
Years
Data Retention
tRET_MTP
[a] Percentage referred to maximum full-scale output (FSO); e.g. for 24-bit measurements:
ErrA,IC [%FSO] = 100 · MAX{ | ADCmeas – ADCideal | } / 224
.
4.1 Power Supply Rejection Ratio (PSRR) versus Frequency
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November 12, 2018
5. Circuit Description
5.1 Brief Description
The ZSSC3224 provides a highly accurate amplification of bridge sensor signals. The compensation of sensor offset, sensitivity, temperature
drift, and non-linearity is accomplished via a 26-bit DSP core running a correction algorithm with calibration coefficients stored in a non-volatile
memory. The ZSSC3224 can be configured for a wide range of resistive bridge sensor types and for absolute voltage source sensors. A digital
interface (SPI or I2C) enables communication. The ZSSC3224 supports two operational modes: Normal Mode and Command Mode. Normal
Mode is the standard operating mode. Typically in Normal Mode, the ZSSC3224 wakes up from Sleep Mode (low power), runs a measurement
in Active State, and automatically returns to the Sleep Mode. (See section 6.4 for details on operational modes.)
5.2 Signal Flow and Block Diagram
See Figure 5.1 and Figure 5.2 for the ZSSC3224 block diagram for different input sensors. The sensor bridge supply VDDB and the power supply
for analog circuitry are provided by a voltage regulator, which is optimized for power supply disturbance rejection (PSRR). See section 4.1 for
a graph of PSRR versus frequency. To improve noise suppression, the digital blocks are powered by a separate voltage regulator. A power
supervision circuit monitors all supply voltages and generates appropriate reset signals for initializing the digital blocks.
The System Control Unit controls the analog circuitry to perform the three measurement types: external sensor, temperature, and offset
measurement. The multiplexer selects the signal input to the amplifier, which can be the external signals from the input pins INP and INN or the
internal temperature reference sensor signals. A full measurement request will trigger an automatic sequence of all measurement types and all
input signals.
Figure 5.1 ZSSC3224 Functional Block Diagram with Resistive-Bridge Sensor
VDDB
Vreg int
VDD
VSS
VTP
VTN
Temperature
Reference
Sensor
AGND / CM
Generator
BiasCurrent
Generator
Voltage Regulator
Power Ctr.
ZSSC3224
DSP Core
(Calculations,
Communication)
A
EOC
INP
INN
D
24 Bit
Sensor
Bridge
Pre-amplifier
VSSB
SCLK/SCL
SS
MOSI/SDA
MISO
SPI
I2C
System
Control
Unit
Clock
Generator
MTP
Power-ON
Reset
RES
Oscillator
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November 12, 2018
Figure 5.2 ZSSC3224 Functional Block Diagram with Voltage-Source Sensor
VDDB
Vreg int
VDD
VSS
VTP
VTN
Temperature
Reference
Sensor
AGND / CM
Generator
BiasCurrent
Generator
Voltage Regulator
Power Ctr.
ZSSC3224
DSP Core
(Calculations,
Communication)
A
EOC
INP
INN
D
24-Bit
Pre-amplifier
VSSB
SCLK/SCL
SS
MOSI/SDA
MISO
SPI
I2C
System
Control
Unit
Clock
Generator
MTP
Power-On
Reset (POR)
RES
Oscillator
The amplifier consists of two stages with programmable gain values.
The ZSSC3224 employs a programmable analog-to-digital converter (ADC) optimized for conversion speed and noise suppression. The
programmable resolution from 12 to 24 bits provides flexibility for adapting the conversion characteristics. To improve power supply noise
suppression, the ADC uses the bridge supply VDDB as its reference voltage leading to a ratiometric measurement topology if the external sensor
is a bridge-type element.
The remaining ZSSC3224-internal offset and the sensor element offset, i.e., the overall system offset for the amplifier and ADC, can be canceled
by means of an offset and auto-zero measurement, respectively.
The DSP accomplishes the auto-zero, span, and 1st and 2nd order temperature compensation of the measured external sensor signal. The
correction coefficients are stored in the MTP memory.
The ZSSC3224 supports SPI and I2C interface communication for controlling the ZSSC3224, configuration, and measurement result output.
5.3 Analog Front End
5.3.1 Amplifier
The amplifier has a fully differential architecture and consists of two stages. The amplification of each stage and the external sensor gain polarity
are programmable via settings in the Measurement Configuration Register SM_config1 and SM_config2 (addresses 12HEX and 16HEX; see
section 6.6.2) in the MTP memory (for details, see section 5.4.2).
Note: Only one of these two possible configurations is used for the measurement. The default configuration is SM_config1. Alternately,
SM_config2 can be implemented by sending a command to select this configuration for the measurement (see section 6.5.1). The term
SM_config is used in explanations for general register content and functionality for both SM_config1 and SM_config2, as the registers’ bit
assignments are exactly the same for both registers.
The first 6 bits of SM_config are the programmable gain settings Gain_stage1 and Gain_stage2. The options for the programmable gain settings
are listed in Table 5.1 and Table 5.2.
13
November 12, 2018
Table 5.1 Amplifier Gain: Stage 1
Gain_stage1
SM_config Bit 1
SM_config Bit 2
SM_config Bit 0
Gainamp1
6
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
12
20
30
40
60
80
120
Table 5.2 Amplifier Gain: Stage 2
Gain_stage2
SM_config Bit 4 SM_config Bit 3
SM_config Bit 5
Gainamp2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
If needed, the polarity of the sensor bridge gain can be reversed by setting the Gain_polarity bit, which is bit 6 in the SM_config register (see
section 6.6.2). Changing the gain polarity is achieved by inverting the chopper clock. Table 5.3 gives the settings for the Gain_polarity bit. This
feature enables applying a sensor to the ZSSC3224 with swapped input signals at INN and INP; e.g., to avoid crossing wires for the final sensor
module’s assembly.
Table 5.3 Gain Polarity
Gain_polarity (SM_config Bit 6)
Gain
+1
Setting Description
No polarity change.
Gain polarity is inverted.
0
1
-1
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November 12, 2018
5.3.2 Analog-to-Digital Converter
An analog-to-digital converter (ADC) is used to digitize the amplifier signal. To allow optimizing the trade-off between conversion time and
resolution, the resolution can be programmed in a range from 12-bit to 24-bit (Adc_bits bit field in the SM_config register; section 6.6.2). The
ADC processes differential input signals.
Table 5.4 ADC Conversion Times for a Single Analog-to-Digital Conversion
Resolution (Bits)
Conversion Time in µs (typical)
12
13
14
15
16
17
18
19
20
21
22
23
24
140
185
250
335
470
640
890
1250
1760
2460
3480
4890
6940
The ADC can perform an offset shift in order to adapt input signals with offsets to the ADC input range. The shift feature is enabled by setting
the SM_config register’s bit 15 = 1 (Shift_method = 1). The respective analog offset shift can be set up with bits [14:12], the Offset bit field in
SM_config. The offset shift causes the ADC to perform an additional amplification of the ADC’s input signal by a factor of 2. This must be taken
into consideration for a correct analog sensor setup via configuration of the pre-amplifier’s gain, the ADC offset shift, and the potential ADC
gain.
The overall analog amplification Gaintotal = Gainamp1 ∗ Gainamp2 ∗ GainADC can be determined for the following options:
If no offset shift is selected, i.e., Shift_method = 0 and Offset = 000 in SM_config,
Gaintotal = Gainamp1 ∗ Gainamp2 ∗ 1
If ADC offset shift is selected, i.e., Shift_method = 1 and Offset 000 in SM_config,
Gaintotal = Gainamp1 ∗ Gainamp2 ∗ 2
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November 12, 2018
Table 5.5 ADC Offset Shift
Offset Shift in ADC
Offset:
SM_config Bit 15
(Shift_method)
Offset:
Offset:
ADC Offset Shift of Input Signal as a
Percent of Full Scale
SM_config Bit 14 SM_config Bit 13 SM_config Bit 12
GainADC
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
1
2
2
2
2
2
2
2
2
0%
0%
6.75%
12.50%
19.25%
25.00%
31.75%
38.50%
43.25%
Important note: If the required configuration is no offset shift and no additional gain factor (and therefore GainADC = 1), then the only valid
settings are Shift_method = 0 and Offset = 000 in SM_config. Any other setup using Shift_method = 0 combined with Offset ≠ 000 leads to
erroneous analog setups.
The setting for ADC resolution for the external sensor (bridge or voltage-source sensor) affects the typical measurement duration and noise
performance as shown in Table 5.6 for the example of a bridge sensor measurement using the “Measure” command (AAHEX; see section 6.4.1).
See section 6.2 for definitions of measurement types AZSM, SM, AZTM, and TM.
Table 5.6 Typical Conversion Times versus Noise Performance with Full Sensor Signal Conditioning for
Measurement including AZSM, SM, AZTM, and TM (Bridge-Type Sensor)
Note: See important notes at the end of the table.
ADC Resolution: Internal
Temperature Sensor
Typical ADC Resolution:
External Sensor Setting
Typical Measurement Duration [a],
MEASURE, (AAHEX) (ms)
Typical 3-Sigma Noise for SSC-
Corrected Output [b] (counts)
18
18
18
18
18
18
18
16
17
18
19
20
21
22
4.1
4.4
4.9
5.6
6.6
8.1
10.1
4.9
8.3
16.1
33.5
65.0
118.1
233.9
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November 12, 2018
ADC Resolution: Internal
Temperature Sensor
Typical ADC Resolution:
External Sensor Setting
Typical Measurement Duration [a],
MEASURE, (AAHEX) (ms)
Typical 3-Sigma Noise for SSC-
Corrected Output [b] (counts)
18
18
23
24
12.9
17.0
466.3
922.0
[a] Measurement duration is defined as the time from the high/low transition at the EOC pin at the beginning of the measurement until the next
low/high transition of the EOC signal at the end of a single measurement in Sleep Mode.
[b] Reference noise values normalized to the external sensor’s ADC resolution, obtained with the following setup:
40kΩ sensor bridge, 25°C operating temperature, Gain=52, ADC Offset=25%, VDD=1.79V.
5.3.3 Selection of Gain and Offset – Sensor System Dimensioning
The optimal gain (and offset) setup for a specific sensor element can be determined by the following steps:
1. Collect sensor element’s characteristic, statistical data (over temperature, ambient sensor parameter, and over production
tolerances):
a. Minimum differential output voltage: Vmin
b. Maximum differential output voltage: Vmax
Note: The best possible setup can only be determined if the absolute value of Vmax is larger than the absolute value of Vmin. If this is
not the case, the gain polarity should be reversed by means of the Gain_polarity bit in the MTP’s SM_config register.
2. Calculate:
a. Common mode level; i.e., differential offset of the sensor output: VCM = 0.5 ∗ (Vmax + Vmin
)
V
CM
[ ]
b. Relative or percentage offset of the sensor output: Offsetsensor % =
∗ 100%
min
V
– V
max
3. Determine which of the two following cases is valid:
a. If Offsetsensor[%] > 43% then select Offset = 111 (i.e., 43.25%)
b. If 0% < Offsetsensor[%] ≤ 43% then select Offset ≤ Offsetsensor[%]
(see Table 5.5 for possible ADC Offset setup values)
4. The totally required, optimum gain can be determined as
1.4V
Gaintotal, opt
=
Offset
sensor
100
V
max
∗ (1 –
)
Configure gain factors in the following step such that Gaintotal ≤ Gaintotal,opt (see section 5.3.1).
5. The gain setup can be separated into the three factors Gainamp1, Gainamp2 (for the 2-stage amplifier), and GainADC (1 for no shift or 2
for shift operation) according to
Gaintotal = Gainamp1 ∗ Gainamp2 ∗ GainADC
.
a. If no offset shift is performed (Shift_method = 0 and Offset = 000), the amplifier gain is Gaintotal
b. If an offset shift is performed (Shift_method = 1), the amplifier gain is 0.5 ∗ Gaintotal
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November 12, 2018
Figure 5.3 ADC Gain and Offset Setup
VDDB
INP
A
DSP
SPI
I2C
Gainamp1
Gainamp2
GainADC
Sensor
Bridge
INN
Pre-amplifier
D
VSSB
Vdifferential, IN
VAMP1, OUT
VAMP2, OUT
VADC, IN
Digital ADC Out, 24-bit
1.4V
8.389M
0V
Gainamp2
GainADC , -Offset
Gainamp1
digitize
0V
-1.4V
-8.389M
5.3.4 Temperature Measurement
The ZSSC3224 provides an internal temperature sensor measurement to allow compensation for temperature effects. See section 4 for the
temperature sensor resolution. The temperature output signal is a differential voltage that is adapted by the amplifier for the ADC input.
For temperature measurements, the respective settings are defined and programmed in the MTP by IDT.
5.3.5 External Sensor Supply: Bridge Sensors
The ZSSC3224 provides dedicated supply pins VDDB and VSSB for resistive bridge-type sensors (AbsV_enable bit 11 = 0 in SM_config, MTP
registers 12HEX or 16HEX). The ADC reference voltages for the sensor bridge measurement are derived from these internal voltages such that
bridge supply disturbances are suppressed. The current drive ability of VDDB is limited (see IVDDB in section 3).
5.3.6 External Sensor: Absolute Voltage Source Sensors
Alternatively, the ZSSC3224 can process signals from an absolute-voltage source sensor; e.g., a thermopile element. The respective input-
type selection can be done with the AbsV_enable bit 11 =1 in SM_config, MTP registers 12HEX or 16HEX. The respective sensor element must
be connected between the INP and INN pins; INN is internally connected to the ZSSC3224’s analog ground (important: this is not VSSB). Do
not connect VDDB and VSSB if an absolute-voltage source sensor is applied. The offset shift should be set to maximum in this case,
Shift_method = 1 and Offset = 111 in SM_config. The required gain can be determined according to the procedure described in section 5.3.3.
18
November 12, 2018
5.4 Digital Section
5.4.1 Digital Signal Processor (DSP) Core
The “DSP Core” block performs the algorithm for correcting the sensor signal. The required coefficients are stored in the MTP memory.
When the measurement results are available, the “end of conversion” signal is set at the EOC pin if no interrupt-threshold has been set up
(bits[8:7] = 00 in memory register 02HEX). The internal EOC information is valid only if both the measurement and calculation have been
completed. Alternatively, the EOC pin can indicate exceeding or underrunning of a certain threshold or leaving a valid-result range as described
in section 6.3.
5.4.2 MTP Memory
The ZSSC3224’s memory is designed with a true multiple time programmable (MTP) structure. The memory is organized in 16-bit registers that
can be re-written multiple times (at least 1000). The user has access to a 57 16-bit storage area for values such as calibration coefficients.
The required programming voltage is generated internally in the ZSSC3224. A checksum of the entire memory is evaluated be for integrity-
check purposes. The checksum can be generated with the command 90HEX (see section 6.4.1).
5.4.3 Clock Generator
The clock generator provides approximately 4MHz and 1MHz clock signals as the time base for ZSSC3224-internal signal processing. The
frequency is trimmed during production test.
5.4.4 Power Supervision
The power supervision block, which is a part of the voltage regulator combined with the digital section, monitors all power supplies to ensure a
defined reset of all digital blocks during power-up or power supply interruptions. “Brown-out” cases at the supply that do not meet the power-on
reset (POR) requirements (see Table 3.2), must be resolved with a reset pulse at the RES pin.
5.4.5 Interface
The ZSSC3224 can communicate with the user’s communication master or computer via an SPI or I2C interface. The interface type is selectable
with the first activity at the interface after power-up or reset:
.
.
If the first command is an I2C command and the SS pin has been inactive until receiving this command, the ZSSC3224 enters I2C Mode.
If the first interface action is the SS pin being set to active (HIGH-active or LOW-active depending on the SS_polarity bit[9] in memory
interface register 02HEX), then the ZSSC3224 enters SPI Mode.
During the initiation sequence (after power-up or reset), any potential transition on SS is ignored. Switching to the SPI Mode is only possible
after the power-up sequence. If SS is not connected, the SS pin internal pull-up keeps the ZSSC3224 in I2C Mode.
To also provide interface accessibility in Sleep Mode (all features inactive except for the digital interface logic), the interface circuitry is directly
supplied by VDD.
19
November 12, 2018
6. Functional Description
6.1 Power Up
Specifications for this section are given in sections 3 and 4. On power-up, the ZSSC3224 communication interface is able to receive the first
command after a time tSTA1 from when the VDD supply is within operating specifications. The ZSSC3224 can begin the first measurement after
a time of tSTA2, from when the VDD supply is operational. Alternatively, instead of a power-on reset, a reset and new power-up sequence can
be triggered by an IC-reset signal (high low) at the RES pin.
The wake up time from Sleep Mode to Active State (see section 6.4) after receiving the activating command is defined as tWUP1 and tWUP2. In
Command Mode, subsequent commands can be sent after tWUP1. The first measurement starts after tWUP2 if a measurement request was sent.
6.2 Measurements
Available measurement procedures are
.
.
.
.
AZSM: auto-zero (external) sensor measurement
SM: (external) sensor measurement
AZTM: auto-zero temperature measurement
TM: temperature measurement
AZSM: The configuration is loaded for measuring the external sensor; i.e., a resistive bridge or an absolute voltage source. The “Multiplexer”
block connects the amplifier input to the AGND analog ground reference. An analog-to-digital (A2D) conversion is performed so that the inherent
system offset for the configuration is converted by the ADC to a digital word with a resolution according to the respective MTP configuration.
SM: The configuration is loaded for measuring the external sensor; i.e., a resistive bridge or an absolute voltage source. The “Multiplexer” block
connects the amplifier input to the INP and INN pins. An A2D conversion is performed. The result is a digital word with a resolution according
to the MTP configuration.
AZTM: The configuration for temperature measurements is loaded. The “Multiplexer” block connects the amplifier input to AGND. An analog-
to-digital conversion is performed so that the inherent system offset for the temperature configuration is converted by the ADC with a resolution
according to the respective MTP configuration.
TM: The configuration for temperature measurements is loaded. The “Multiplexer” block connects the amplifier input to the internal temperature
sensor. An A2D conversion is performed. The result is a digital word with a resolution according to the MTP configuration.
The typical application’s measurement cycle is a complete SSC measurement (using one of the commands AAHEX to AFHEX; see section 6.4.1)
with AZSM, SM, AZTM, and TM followed by a signal correction calculation.
6.3 Interrupt (EOC Pin)
The EOC pin can be programmed to operate either as a pure “measurement busy” and end-of-conversion (EOC) indicator or as a configurable
interrupt indicator. The basic operation must be programmed to the INT_setup bits [8:7] in register 02HEX (see Table 6.5). One or two 24-bit-
quantized thresholds can be programmed (TRSH1 and TRSH2 in memory registers 13HEX, 14HEX, and 15HEX).
The thresholds are programmed left-aligned in the memory; i.e., they must be programmed with the threshold’s MSB in the memory register’s
MSB, etc. The number of LSB threshold bits that are used is equal to the number of bits for the selected ADC resolution (determined by the
Adc_bits field in registers 12HEX and 16HEX); unused LSB bits are ignored.
The interrupt functionality is only available for digital values from the SSC-calculation unit (i.e., after sensor signal conditioning); raw values
cannot be monitored by the interrupt feature. Figure 6.1 shows the different setup options and the respective response at the EOC pin. The use
of the interrupt functionality is recommended for cyclic operation (command ABHEX with the respective power-down setup in the Interface
Configuration memory register 02HEX). The EOC level continuously represents the respective SSC-measurement results only during cyclic
operation. For single or oversample measurement requests without cyclic operation, the EOC output signal is reset to logical zero at the
beginning of each new measurement, even though the interrupt thresholds are established correctly at the end of each measurement (setting
EOC to logical one or zero is dependent on the interrupt setup).
20
November 12, 2018
Figure 6.1 Interrupt Functionality
INT_setup=01:
INT_setup=10:
Measurement < threshold1
Measurement > threshold1
Measurement
Measurement
Result
Result
max.
max.
threshold 1
threshold 1
0
0
Time
Time
Time
EOC / INT
EOC / INT
1
0
1
0
Time
INT_setup=11
Case A:
threshold1 > threshold2
Case B:
threshold1 < threshold2
Measurement
Measurement
Result
Result
max.
max.
threshold 1
threshold 2
threshold 2
threshold 1
0
0
Time
Time
Time
Time
EOC / INT
EOC / INT
1
0
1
0
6.4 Operational Modes
Figure 6.2 illustrates the ZSSC3224 power-up sequence and subsequent operation depending on the selected interface communication mode
(I2C or SPI) as determined by interface-related first activities after power-up or reset. If the first command after power-up is a valid I2C command,
the interface will function as an I2C interface until the next power-on reset (POR). If there is no valid I2C command, but an active signal at the
SS pin is detected as the first valid activity, then the interface will respond as an SPI slave. With either interface, after the voltage regulators
are switched on, the ZSSC3224’s low-voltage section (LV) is active while the related interface configuration information is read from memory.
Then the LV section is switched off, the ZSSC3224 goes into Sleep Mode, and the interface is ready to receive commands. The interface is
always powered by VDD, so it is referred to as the high voltage section (HV).
See Table 6.1 for definitions of the commands.
21
November 12, 2018
Figure 6.3 shows the ZSSC3224 operation in Normal Mode (with two operation principles: “Sleep” and “Cyclic”) and Command Mode, including
when the LV and HV sections are active as indicated by the color legend. The Normal Mode automatically returns to Sleep Mode after executing
the requested measurements, or periodically wakes up and conducts another measurement according to the setting for the sleep duration
configured by CYC_period (bits[14:12] in memory register 02HEX). In Command Mode, the ZSSC3224 remains active if a dedicated command
(e.g., Start_NOM) is sent, which is helpful during calibration. Command Mode can only be entered if Start_CM (command A9HEX; see Table
6.1) is the first command received after a POR.
Figure 6.2 Operational Flow Chart: Power Up
I2Cslave addressis loaded, and
IC Power On
SS_polarity determinesif SS pin is
active high or low
Color Legend:
LV Operation
Command:= load I/O setup
HV Operation
IO_mode = I2C
no
I2C Address /
CMD Valid?
no
SS Pin Active?
yes
yes
IO_mode:=SPI
Power up LV
Power up LV
LV Operation
LV Operation
Save: IC ID / Data / Status
Save: Setup / Data / Status
CommandMode
==active || Test==1
CommandMode
==active || Test==1
yes
no
no
no
yes
no
Power Down (switch off LV
and wait for command)
Power Down (switch off LV
and wait for command)
no
Receive: Command
no
Received CMD ID
== IC-ID
RST(SS)==1
yes
yes
Receive: Command
Read_bit == 1
(Data Fetch)
NOP
yes
Execute: Data Fetch
yes
Execute: Data Fetch
22
November 12, 2018
Figure 6.3 Operational Flow Chart: Command Mode and Normal Mode (Sleep and Cyclic)
Start LV
Color Legend:
LV Operation
Get Command fromHV
HV Operation
CYCLIC_ACTIVE?
yes
no
CMD==Start_CM
no
yes
SETUP_LV:= New
Command s Setup
New command
CM active
Case (Command)
REGULAR_CMD
INVALID_CMD
New Measurement Command or
STOP_CYCLE?
Power up all LV
Receive: Command
INVALID_CMD
Case (Command)
STOP_CYCLE
Start_NOM
Count Waiting Period
no
Do: SETUP_LV
Keep Existing
SETUP_LV
Power Down all LV
Except Oscillator
Execute: Command
CM inactive
REGULAR_CMD
Safe Command and SETUP_LV
yes
Cyclic Measurement?
no
Reset LV
Execute: Command
CYCLIC_ACITVE! to
HV
End LV
Command Mode
Cyclic Mode
Sleep Mode
23
November 12, 2018
6.4.1 SPI/I2C Commands
The SPI/I2C commands supported by the ZSSC3224 are listed in Table 6.1. The command to read an address in the user memory is the same
as its address. The command to write to an address in user memory is the address plus 40HEX
.
There is an IDT-reserved section of memory that can be read but not over-written by the user.
Table 6.1 SPI/I2C Commands
Note: Every return starts with a status byte followed by the data word as described in section 6.5.1.
Note: See important table notes at the end of the table.
Normal
Mode
Command
Mode
Command (Byte)
Return
16-bit user data
Description
00HEX to 39HEX
Read data in the user memory address (00HEX to
39HEX) matching the command (might not be using all
addresses).
Yes
Yes
3AHEX to 3FHEX
16-bit IDT-reserved memory
data
Read data in IDT-reserved memory at address (3AHEX
to 3FHEX).
Yes
Yes
Yes
Yes
40HEX to 79HEX
followed by data
(0000HEX to FFFFHEX
–
Write data to user memory at address specified by
command minus 40HEX (addresses 00HEX to 39HEX
respectively; might not be using all addresses).
)
90HEX
–
Calculate and write memory checksum (CRC), which
is register address 39HEX).
Yes
Yes
Yes
Yes
A0HEX to A7HEX
followed by XXXXHEX
24-bit formatted raw data
Get_Raw This command can be used to perform a
measurement and write the raw ADC data into the
output register. The LSB of the command determines
how the AFE configuration register is loaded for the
Get_Raw measurement (see Table 6.2).
(see Table 6.2)
A8HEX
A9HEX
–
–
Start_NOM Exit Command Mode and transition to
Normal Mode (Sleep or Cyclic).
No
Yes
No
Start_CM Exit Normal Mode and transition to
Command Mode (as very first command after power-
up).
Yes
AAHEX
24-bit formatted fully corrected
Measure Trigger full measurement cycle (AZSM,
Yes
Yes
Yes
Yes
sensor measurement data + 24- SM, AZTM, and TM, as described in section 6.2) and
bit corrected temperature data [a] calculation and storage of data in the output buffer
using the configuration from MTP.
ABHEX
24-bit formatted fully corrected
Measure Cyclic This command triggers a
sensor measurement data + 24- continuous full measurement cycle (AZSM, SM,
bit corrected temperature data [a] AZTM, and TM; see section 6.2) and calculation and
storage of data in the output buffer using the
configuration from MTP followed by a pause
determined by CYC_period (bits[14:12] in memory
register 02HEX).
ACHEX
24-bit formatted fully corrected
Oversample-2 Measure Mean value generation: 2
Yes
Yes
sensor measurement data + 24- full measurements are conducted (as in command
bit corrected temperature data [a] AAHEX), the measurements’ mean value is calculated,
and data is stored in the output buffer using the
configuration from MTP; no power down or pause
between the 2 measurements.
24
November 12, 2018
Normal
Mode
Command
Mode
Command (Byte)
Return
Description
ADHEX
24-bit formatted fully corrected
Oversample-4 Measure Mean value generation: 4
Yes
Yes
Yes
Yes
sensor measurement data + 24- full measurements (as in command AAHEX) are
bit corrected temperature data [a] conducted, the measurements’ mean value is
calculated, and data is stored in the output buffer
using the configuration from MTP; no power down or
pause between the 4 measurements.
AEHEX
24-bit formatted fully corrected
Oversample-8 Measure Mean value generation: 8
Yes
Yes
sensor measurement data + 24- full measurements (as in command AAHEX) are
bit corrected temperature data [a] conducted, the measurements’ mean value is
calculated, and data is stored in the output buffer
using the configuration from MTP; no power down or
pause between the 8 measurements.
AFHEX
24-bit formatted fully corrected
Oversample-16 Measure Mean value generation:
sensor measurement data + 24- 16 full measurements (as in command AAHEX) are
bit corrected temperature data [a] conducted, the measurements’ mean value is
calculated, and data is stored in the output buffer
using the configuration from MTP; no power down or
pause between the 16 measurements.
B0HEX
—
—
—
Select SM_config1 register (12HEX in memory) For
any measurement using the memory contents for the
analog front-end and sensor setup, the respective
setup is loaded from the SM_config1 register; status
bit[1]==0 (default).
Yes
Yes
Yes
Yes
B1HEX
Select SM_config2 register (16HEX in memory) For
any measurement using the memory contents for the
analog front-end and sensor setup, the respective
setup is loaded from the SM_config2 register, status
bit[1]==1
BFHEX
FXHEX
STOP_CYC This command causes a power-down
halting the update / cyclic measurement operation
and causing a transition from Normal to Sleep Mode.
Yes
Yes
Yes
Yes
Status followed by last
24-bit data
NOP Only valid for SPI (see sections 6.5.1 and
6.5.2).
[a] Note: Any ADC measurement and SSC calculation output is formatted as a 24-bit data word, regardless of the effective ADC resolution used.
25
November 12, 2018
Table 6.2 Get_Raw Commands
Command
Measurement
AFE Configuration Register
SM_config. See section 6.5.1.
A0HEX followed by 0000HEX
A1HEX followed by ssssHEX
SM – Sensor Measurement
SM – Sensor Measurement
ssss is the user’s configuration setting for the measurement
provided via the interface. The format and purpose of the
configuration bits must be according to the definitions for
SM_config (see Table 6.5).
A2HEX followed by 0000HEX
A3HEX followed by ssssHEX
SM-AZSM – Auto-Zero Corrected Sensor SM_config. See section 6.5.1.
Measurement [a]
SM-AZSM – Auto-Zero Corrected Sensor ssss is the user’s configuration setting for the measurement
Measurement [b]
provided via the interface. The format and purpose of the
configuration bits must be according to the definitions for
SM_config.
A4HEX followed by 0000HEX
A5HEX followed by ssssHEX
TM – Temperature Measurement
TM – Temperature Measurement
IDT-defined register.
ssss is the user’s configuration setting for the measurement
provided via the interface. The format and purpose of
configuration bits must be according to the definitions for
SM_config and valid for temperature measurement in this case
(bits [15:12] will be ignored).
A6HEX followed by 0000HEX
A7HEX followed by ssssHEX
TM-AZTM – Auto-Zero Corrected
IDT-defined register.
Temperature Measurement [a]
TM-AZTM – Auto-Zero Corrected
Temperature Measurement [b]
ssss is the user’s configuration setting for the measurement
provided via the interface. The format and purpose of these
configuration bits must be according to the definitions for
SM_config and valid for temperature measurement in this case
(bits [15:12] will be ignored).
[a] Recommended for raw data collection during calibration coefficient determination using the measurement setups pre-programmed in MTP.
[b] Recommended for raw data collection during calibration coefficient determination using un-programmed (not in MTP), external measurement
setups; e.g., for evaluation purposes.
6.5 Communication Interface
6.5.1 Common Functionality
Commands are handled by the command interpreter in the LV section. Commands that need additional data are not treated differently than
other commands because the HV interface is able to buffer the command and all the data that belongs to the command and the command
interpreter is activated as soon as a command byte is received.
Every response starts with a status byte followed by the data word. The data word depends on the previous command. It is possible to read the
same data more than once if the read request is repeated (I2C) or a NOP command is sent (SPI). If the next command is not a read request
(I2C) or a NOP (SPI), it invalidates any previous data.
The ZSSC3224 supports the parallel setup of two amplifier-ADC-configurations using SM_config1 (default) and SM_config2. Switching between
the two setups can be done with the commands B0HEX (selects SM_config1) and B1HEX (selects SM_config2). Note that the respective activation
command must always be sent prior to the measurement request.
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November 12, 2018
The status byte contains the following bits in the sequence shown in Table 6.3:
.
Power indication (bit 6): 1 if the device is powered (VDDB on); 0 if not powered. This is needed for the SPI Mode where the master reads all
zeroes if the device is not powered or in power-on reset (POR).
.
Busy indication (bit 5): 1 if the device is busy, which indicates that the data for the last command is not available yet. No new commands
are processed if the device is busy.
Note: The device is always busy if the cyclic measurement operation has been set up and started.
.
.
Currently active ZSSC3224 mode (bits [4:3]): 00 = Normal Mode; 01 = Command Mode; 1X = IDT reserved.
Memory integrity/error flag (bit 2): 0 if integrity test passed; 1 if test failed. This bit indicates whether the checksum-based integrity check
passed or failed. The memory error status bit is calculated only during the power-up sequence, so a newly written CRC will only be used
for memory verification and status update after a subsequent ZSSC3224 power-on reset (POR) or reset via the RES pin.
.
.
Config Setup (bit 1): This bit indicates which SM_config register is being used for the active configuration: SM_config1 (12HEX) or
SM_config2 (16HEX). The two alternate configuration setups allow for two different configurations of the external sensor channel in order to
support up to two application scenarios with the use of only one sensor-ZSSC3224 pair. This bit is 0 if SM_config1 was selected (default).
This bit is 1 if SM_config2 was selected.
ALU saturation (bit 0): If the last command was a measurement request, this bit is 0 if any intermediate value and the final SSC result are
in a valid range and no SSC-calculation internal saturation occurred in the arithmetic logic unit (ALU). If the last command was a
measurement request, this bit is 1 if an SSC-calculation internal saturation occurred. This bit is also 0 for any non-measurement
command.
Table 6.3 General Status Byte
Bit
7
6
5
4
3
2
1
0
Meaning
0
Powered?
Busy?
Mode
Memory error?
Config Setup
ALU Saturation?
Table 6.4 Mode Status
Status[4:3]
Mode
00
01
10
11
Normal Mode (sleep and cyclic operations)
Command Mode
IDT reserved
IDT reserved
Further status information can be provided by the EOC pin. The EOC pin is set high when a measurement and calculation have been completed
(if no interrupt threshold is used, i.e. INT_setup==00BIN; see section 6.3).
6.5.2 SPI
The SPI Mode is available if the first interface activity after the ZSSC3224 power-up is an active signal at the SS pin. The polarity and phase of
the SPI clock are programmable via the CKP_CKE setting in bits [11:10] in address 02HEX as described in Table 6.5. CKP_CKE is two bits:
CPHA (bit 10), which selects which edge of SCLK latches data, and CPOL (bit 11), which indicates whether SCLK is high or low when it is idle.
The polarity of the SS signal and pin are programmable via the SS_polarity setting (bit 9). The different combinations of polarity and phase are
illustrated in the figures below.
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November 12, 2018
Figure 6.4 SPI Configuration CPHA=0
CPHA=0
SCLK (CPOL=0)
SCLK (CPOL=1)
MOSI
MISO
MSB
MSB
Bit6
Bit6
Bit5
Bit5
Bit4
Bit4
Bit3
Bit3
Bit2
Bit2
Bit1
Bit1
LSB
LSB
/SS
SAMPLE
Figure 6.5 SPI Configuration CPHA=1
CPHA=1
SCLK (CPOL=0)
SCLK (CPOL=1)
MOSI
MISO
MSB
MSB
Bit6
Bit6
Bit5
Bit5
Bit4
Bit4
Bit3
Bit3
Bit2
Bit2
Bit1
Bit1
LSB
LSB
/SS
SAMPLE
In SPI mode, each command except NOP is started as shown in Figure 6.6. After the execution of a command (busy = 0), the expected data
can be read as illustrated in Figure 6.7 or if no data are returned by the command, the next command can be sent. The status can be read at
any time with the NOP command (see Figure 6.8).
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November 12, 2018
Figure 6.6 SPI Command Request
Command Request
Command
other than
NOP
CmdDat
<15:8>
CmdDat
<7:0>
MOSI
MISO
Status
Data
Data
Note: A command request always consists of 3 bytes. If the command is shorter, then it must be completed with 0s.
The data on MISO depend on the preceding command.
Figure 6.7 SPI Read Status
Read Status
Command
MOSI
= NOP
MISO
Status
Figure 6.8 SPI Read Data
Read Data
(a) Example: after the completion of a Memory Read command
Command
= NOP
MOSI
MISO
00HEX
00HEX
MemDat
<15:8>
MemDat
<7:0>
Status
(b) Example: after the completion of a Measure command (AAHEX
)
Command
= NOP
MOSI
MISO
00HEX
00HEX
00HEX
00HEX
00HEX
00HEX
SensorDat SensorDat SensorDat TempDat
<24:16> <15:8> <7:0> <24:16>
TempDat
<15:8>
TempDat
<7:0>
Status
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November 12, 2018
6.5.3 I2C
I2C Mode will be selected if the very first interface activity after ZSSC3224 power-up is an I2C command. In I2C Mode, each command is
started as shown in Figure 6.9. Only the number of bytes that are needed for the command must be sent. An exception is the I2C High Speed
Mode (see Slave_Addr in Table 6.5) for which 3 bytes must always be sent as in SPI Mode. After the execution of a command (busy = 0), the
expected data can be read as illustrated in Figure 6.11 or if no data are returned by the command, the next command can be sent. The status
can be read at any time as illustrated in Figure 6.10.
Figure 6.9 I2C Command Request
Command Request (I2C Write)
from master to slave
from slave to master
S
P
A
N
START condition
STOP condition
acknowledge
S
S
SlaveAddr
SlaveAddr
0
A
A
Command
Command
A
A
P
write
0
CmdDat
<15:8>
CmdDat
<7:0>
A
A
P
not acknowledge
write
Figure 6.10 I2C Read Status
Read Status (I2C Read)
S
SlaveAddr
1
A
Status
N P
read
Figure 6.11 I2C Read Data
Read Data (I2C Read)
(a) Example: after the completion of a Memory Read command
MemDat
<15:8>
MemDat
<7:0>
S
SlaveAddr
1
A
Status
A
A
N P
read
(b) Example: after the completion of a Full Measurement command (AAHEX
)
SensorDat
<23:16>
SensorDat
<15:8>
SensorDat
<7:0>
TempDat
A
TempDat
<15:8>
TempDat
<7:0>
S
SlaveAddr
1
A
Status
A
A
A
A
A
N P
<23:16>
read
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November 12, 2018
All mandatory I2C-bus protocol features are implemented. Optional protocol features such as clock stretching, 10-bit slave address, etc., are
not supported by the ZSSC3224’s interface.
In I2C-High-Speed Mode, a command consists of a fixed length of three bytes.
6.6 Multiple Time Programmable (MTP) Memory
In the ZSSC3224, the memory is organized in 16-bit registers and can be programmed multiple times (at least 1000). There are 57 x 16-bit
registers available for customer use. Each register can be re-programmed. Basically, there are two MTP content sectors:
.
Customer use: accessible by means of regular write operations: 40HEX to 79HEX. It contains the customer ID, interface setup data,
measurement setup information, calibration coefficients, etc.
.
IDT use: only accessible for write operations by IDT. The IDT sector contains specific trim information and is programmed during
manufacturing test by IDT.
6.6.1 Programming Memory
Programming memory is possible with any specified supply voltage level at VDD. The MTP programming voltage itself is generated by means
of an integrated charge pump, generating an internal memory programming voltage; no additional, external voltage, other than VDD (as
specified) is needed. A single 16-bit register write will be completed within 16ms after the respective programming command has been sent.
After the memory is programmed, it must be read again to verify the validity of the memory contents.
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November 12, 2018
6.6.2 Memory Contents
Table 6.5 MTP Memory Content Assignments
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
00HEX
01HEX
15:0
15:0
0000HEX
0000HEX
Cust_ID0
Cust_ID1
Customer ID byte 0 (combines with memory word 01HEX to form customer ID).
Customer ID byte 1 (combines with memory word 00HEX to form customer ID).
Interface Configuration
I2C slave address; valid range: 00HEX to 7FHEX (default: 00HEX). Note: address
codes 04HEX to 07HEX are reserved for entering the I2C High Speed Mode.
6:0
000 0000BIN
Slave_Addr
INT_setup
Interrupt configuration, EOC pin functionality (see section 6.3):
00
01
End-of-conversion signal
0-1 transition on EOC/INT if conditioned measurement result (MEAS)
exceeds threshold1 (TRSH1) and 1-0 transition if MEAS falls below
threshold1 again
10
11
0-1 transition if MEAS falls below threshold1 and 1-0 transition if
MEAS rises above threshold1 again
8:7
00BIN
EOC is determined by threshold settings :
If (TRSH1>TRSH2) then EOC/INT (interrupt level) = 0 if (TRSH1 > MEAS ≥
TRSH2). Otherwise EOC/INT=1.
If (TRSH1 ≤ TRSH2) then EOC/INT = 1 if (TRSH1 ≤ MEAS < TRSH2).
Otherwise EOC/INT = 0.
Determines the polarity of the Slave Select pin (SS) for SPI operation:
0 Slave Select is active low (SPI and ZSSC3224 are active if SS==0)
1 Slave Select is active high (SPI and ZSSC3224 are active if SS==1)
9
0BIN
SS_polarity
CKP_CKE
Clock polarity and clock-edge select—determines polarity and phase of SPI
interface clock with the following modes:
02HEX
00 SCLK is low in idle state, data latch with rising edge and data output
with falling edge
01 SCLK is low in idle state, data latch with falling edge and data output
11:10
00BIN
with rising edge
10 SCLK is high in idle state, data latch with falling edge and data output
with rising edge
11 SCLK is high in idle state, data latch with rising edge and data output
with falling edge
Update period (ZSSC3224 sleep time, except oscillator) in cyclic operation:
000 not assigned
001 125ms
100 1000ms
101 2000ms
110 4000ms
111 not assigned
14:12
15
000BIN
CYC_period
SOT_curve
010 250ms
011 500ms
Type/shape of second-order curve correction for the sensor signal.
0 parabolic curve
0BIN
1 s-shaped curve
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November 12, 2018
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
Signal Conditioning Parameters
Bits [15:0] of the 24-bit sensor offset correction coefficient Offset_S. (The MSBs
03HEX
04HEX
05HEX
15:0
15:0
15:0
0000HEX
0000HEX
0000HEX
Offset_S[15:0] of this coefficient including sign are Offset_S[23:16], which is bits [15:8] in
0DHEX.)
Bits [15:0] of the 24-bit value of the sensor gain coefficient Gain_S. (The MSBs
Gain_S[15:0]
of this coefficient including sign are Gain_S[23:16], which is bits [7:0] in 0DHEX.)
Bits [15:0] of the 24-bit coefficient Tcg for the temperature correction of the
Tcg[15:0]
Tco[15:0]
sensor gain. (The MSBs of this coefficient including sign are Tcg[23:16], which
is bits [15:8] in 0EHEX.)
Bits [15:0] of the 24-bit coefficient Tco for temperature correction of the sensor
offset. (The MSBs of this coefficient including sign are Tco[23:16], which is bits
[7:0] in 0EHEX.)
06HEX
15:0
0000HEX
Bits [15:0] of the 24-bit 2nd order term SOT_tco applied to Tco. (The MSBs of
this term including sign are SOT_tco[23:16], which is bits[15:8] in 0FHEX.)
07HEX
08HEX
15:0
15:0
0000HEX
0000HEX
SOT_tco[15:0]
SOT_tcg[15:0]
Bits [15:0] of the 24-bit 2nd order term SOT_tcg applied to Tcg. (The MSBs of
this term including sign are SOT_tcg[23:16], which is bits[7:0] in 0FHEX.)
Bits [15:0] of the 24-bit 2nd order term SOT_sens applied to the sensor readout.
09HEX
15:0
15:0
0000HEX
0000HEX
SOT_sens[15:0] (The MSBs of this term including sign are SOT_sens[23:16], which is bits[15:8]
in 10HEX.)
Bits [15:0] of the 24-bit temperature offset correction coefficient Offset_T. (The
Offset_T[15:0] MSBs of this coefficient including sign are Offset_T[23:16], which is bits[7:0] in
10HEX.)
0AHEX
Bits [15:0] of the 24-bit absolute value of the temperature gain coefficient
Gain_T.
0BHEX
15:0
15:0
0000HEX
0000HEX
Gain_T[15:0]
(The MSBs of this coefficient including sign are Gain_T[23:16], which is bits
[15:8] in 11HEX.)
Bits [15:0] of the 24-bit 2nd-order term SOT_T applied to the temperature
reading.
(The MSBs of this coefficient including sign are SOT_T[23:16], which is bits
0CHEX
SOT_T[15:0]
[7:0] in 11HEX.)
Bits [23:16] including sign for the 24-bit sensor gain correction coefficient
Gain_S[23:16]
7:0
15:8
7:0
00HEX
00HEX
00HEX
00HEX
00HEX
00HEX
Gain_S. (The LSBs of this coefficient are Gain_S[15:0] in register 04HEX.)
0DHEX
0EHEX
0FHEX
Bits [23:16] including sign for the 24-bit sensor offset correction coefficient
Offset_S[23:16]
Offset_S. (The LSBs are Offset_S[15:0] in register 03HEX.)
Bits [23:16] including sign for the 24-bit coefficient Tco for temperature
Tco[23:16]
correction for the sensor offset. (The LSBs are Tco[15:0] in register 06HEX.)
Bits [23:16] including sign for the 24-bit coefficient Tcg for the temperature
Tcg[23:16]
15:8
7:0
correction of the sensor gain. (The LSBs are Tcg[15:0] in register 05HEX.)
Bits [23:16] including sign for the 24-bit 2nd order term SOT_tcg applied to Tcg.
SOT_tcg[23:16]
(The LSBs are SOT_tcg[15:0] in register 08HEX.)
Bits [23:16] including sign for the 24-bit 2nd order term SOT_tco applied to Tco.
SOT_tco[23:16]
15:8
(The LSBs are SOT_tco[15:0] in register 07HEX.)
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November 12, 2018
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
Bits [23:16] including sign for the 24-bit temperature offset correction coefficient
Offset_T. (The LSBs are Offset_T[15:0] in register 0AHEX.)
7:0
00HEX
00HEX
Offset_T[23:16]
10HEX
Bits [23:16] including sign for the 24-bit 2nd order term SOT_sens applied to the
SOT_sens[23:16] sensor readout.
(The LSBs are SOT_sens[15:0] in register 09HEX.)
15:8
Bits [23:16] including sign for the 24-bit 2nd-order term SOT_T applied to the
temperature reading. (The LSBs are SOT_T[15:0] in register 0CHEX.)
7:0
00HEX
00HEX
SOT_T[23:16]
Gain_T[23:16]
11HEX
Bits [23:16] including sign for the 24-bit absolute value of the temperature gain
coefficient Gain_T. (The LSBs are Gain_T[15:0] in register 0BHEX.)
15:8
Measurement Configuration Register 1 (SM_config1)
Gain setting for the 1st PREAMP stage with Gain_stage1 Gainamp1
:
000 6
001 12
010 20
011 30
100 40
101 60
110 80
2:0
000BIN
Gain_stage1
111 120 (might affect noise and accuracy
specifications depending on sensor setup)
Gain setting for the 2nd PREAMP stage with
Gain_stage2 Gainamp2
:
000 1.1
001 1.2
010 1.3
011 1.4
100 1.5
101 1.6
110 1.7
111 1.8
5:3
000BIN
Gain_stage2
Gain_polarity
Adc_bits
Set up the polarity of the sensor bridge’s gain
(inverting of the chopper) with
12HEX
6
0BIN
0 positive (no polarity change)
1 negative (180° polarity change)
Absolute number of bits for the ADC conversion ADC_bits:
0000 12-bit
0001 13-bit
0010 14-bit
0011 15-bit
0100 16-bit
0101 17-bit
0110 18-bit
0111 19-bit
1000 20-bit
1001 21-bit
1010 22-bit
1011 23-bit
10:7
11
0000BIN
1100 24-bit
1101 to 1111 not assigned
Enable bit for thermopile input selection (INN connected to AGND, INP
connected to absolute voltage source) with AbsV_enable:
0BIN
AbsV_enable
0 absolute voltage input disabled (default)
1 absolute voltage input enabled (e.g., for a thermopile)
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November 12, 2018
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
Differential signal’s offset shift in the ADC; compensation of signal offset by x%
of input signal:
000 no offset compensation
001 6.75% offset
100 25% offset
101 31.75% offset
110 38.5% offset
111 43.25% offset
14:12
000BIN
Offset
010 12.5% offset
011 19.25% offset
Note: Shift_method (bit 15 below) must be set to 1 to enable the offset shift.
Offset shift method selection:
0 No offset shift. Offset (bits [14:12] in 12HEX) must be set to 000BIN
GainADC = 1
;
15
0BIN
Shift_method
1 Offset shift ADC; GainADC = 2
Bits [15:0] of the 24-bit interrupt threshold1, TRSH1. (The MSB bits for this
threshold are TRSH1[23:16], which is bits [7:0] of register 15HEX.)
13HEX
14HEX
15:0
15:0
7:0
0000HEX
0000HEX
00HEX
TRSH1[15:0]
TRSH2[15:0]
TRSH1[23:16]
TRSH2[23:16]
Bits [15:0] of the 24-bit interrupt threshold2, TRSH2. (The MSB bits for this
threshold are TRSH2[23:16], which is bits [15:8] of register 15HEX.)
Bits [23:16] of the 24-bit interrupt threshold1, TRSH1. (The LSB bits for this
threshold are TRSH1[15:0], which is bits [15:0] of register 13HEX.)
15HEX
Bits [23:16] of the 24-bit interrupt threshold2, TRSH2. (The LSB bits for this
threshold are TRSH2[15:0], which is bits [15:0] of register 14HEX.)
15:8
00HEX
Measurement Configuration Register 2 (SM_config2)
Gain setting for the 1st PREAMP stage with Gain_stage1 Gainamp1
:
000 6
001 12
010 20
011 30
100 40
101 60
110 80
2:0
000BIN
Gain_stage1
111 120 (might affect noise and accuracy
specifications depending on sensor setup)
Gain setting for the 2nd PREAMP stage with Gain_stage2 Gainamp2
:
000 1.1
001 1.2
010 1.3
011 1.4
100 1.5
101 1.6
110 1.7
111 1.8
5:3
6
000BIN
Gain_stage2
Gain_polarity
16HEX
Set up the polarity of the sensor bridge’s gain (inverting of the chopper) with
0 positive (no polarity change)
0BIN
1 negative (180° polarity change)
Absolute number of bits for the ADC conversion ADC_bits:
0000 12-bit
0001 13-bit
0010 14-bit
0011 15-bit
0100 16-bit
0101 17-bit
0110 18-bit
0111 19-bit
1000 20-bit
1001 21-bit
1010 22-bit
1011 23-bit
10:7
0000BIN
Adc_bits
1100 24-bit
1101 to 1111 not assigned
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November 12, 2018
MTP
Address
Word / Bit
Range
Default
Setting
Description
Notes / Explanations
Enable bit for thermopile input selection (INN connected to AGND, INP
connected to absolute voltage source) with AbsV_enable:
11
14:12
15
0BIN
000BIN
0BIN
AbsV_enable
0 absolute voltage input disabled (default)
1 absolute voltage input enabled (e.g. for a thermopile)
Differential signal’s offset shift in the ADC; compensation of signal offset by x%
of input signal:
000 no offset compensation
001 6.75% offset
010 12.5% offset
011 19.25% offset
Offset
100 25% offset
101 31.75% offset
110 38.5% offset
111 43.25% offset
Note: Shift_method (bit 15 below) must be set to 1 to enable the offset shift.
Offset shift method selection:
0
GainADC = 1
1 Offset Shift ADC, GainADC = 2
No offset shift. Offset (bits[14:12] in 16HEX) must be set to 000BIN;
Shift_method
Post-Calibration Offset Correction Coefficients
Bits [15:0] of the post-calibration sensor offset shift coefficient SENS_Shift.
(The MSB bits of SENS_Shift are bits [7:0] of register 19HEX.)
17HEX
18HEX
15:0
15:0
7:0
0000HEX
0000HEX
00HEX
SENS_Shift[15:0]
T_Shift[15:0]
Bits [15:0] of the post-calibration temperature offset shift coefficient T_Shift.
(The MSB bits of T_Shift are bits [15:8] of register 19HEX.)
Bits [23:16] of the post-calibration sensor offset shift coefficient SENS_Shift.
(The LSB bits of SENS_Shift are in register 17HEX.)
SENS_Shift[23:16]
T_Shift[23:16]
19HEX
Bits [23:16] of the post-calibration temperature offset shift coefficient T_Shift.
(The LSB bits of T_Shift are in register 18HEX.)
15:8
00HEX
Free Memory – Arbitrary Use
20HEX
21HEX
…
15:0
15:0
0000HEX
0000HEX
Not assigned (e.g., can be used for Cust_IDx customer identification number)
Not assigned (e.g., can be used for Cust_IDx customer identification number)
Not assigned (e.g., can be used for Cust_IDx customer identification number)
Not assigned (e.g., can be used for Cust_IDx customer identification number)
Not assigned (e.g., can be used for Cust_IDx customer identification number)
37HEX
38HEX
15:0
15:0
0000HEX
0000HEX
Checksum generated for the entire memory through a linear feedback shift
register (LFSR);
39HEX
15:0
-
Checksum
signature is checked on power-up to ensure memory content integrity
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November 12, 2018
The memory integrity checksum (referred to as CRC) is generated through a linear feedback shift register with the following polynomial:
g(x) = x16 + x15 + x2 + 1
with the initialization value: FFFFHEX
.
If the CRC is valid, then the “Memory Error” status bit is set to 0.
6.7 Calibration Sequence
Calibration essentially involves collecting raw signal and temperature data from the sensor-ZSSC3224 system for different known sensor-
element values (i.e., for a resistive bridge or an absolute voltage source) and temperatures. This raw data can then be processed by the
calibration master (assumed to be the user’s computer), and the calculated calibration coefficients can then be written to on-chip memory.
Here is a brief overview of the three main steps involved in calibrating the ZSSC3224.
Assigning a unique identification to the ZSSC3224. This identification is written to shadow RAM and programmed in MTP memory. This unique
identification can be stored in the two 16-bit registers dedicated to the customer ID (00HEX and 01HEX; see Table 6.5). It can be used as an index
into a database stored on the calibration PC. This database will contain all the raw values of the connected sensor-element readings and
temperature readings for that part, as well as the known sensor-element measurand conditions and temperature to which the sensor-element
was exposed.
Data collection. Data collection involves getting uncorrected (raw) data from the external sensor at different known measurand values and
temperatures. Then this data is stored on the calibration master using the unique identification of the device as the index to the database.
Coefficient calculation and storage in MTP memory. After enough data points have been collected to calculate all the desired coefficients, the
coefficients can be calculated by the calibration master. Then the coefficients can be programmed to the MTP memory.
Result. The sensor signal and the characteristic temperature effect on output will be linearized according to the setup-dependent maximum
output range.
It is essential to perform the calibration with a fixed programming setup during the data collection phase. In order to prevent any accidental
incorrect processing, it is further recommended that the MTP memory setup is kept stable during the entire calibration process as well as in the
subsequent operation. A ZSSC3224 calibration only fits the setup used during its calibration. Changes in functional parameters after a
successful calibration can decrease the precision and accuracy performance of the ZSSC3224 as well as of the entire application.
The ZSSC3224 supports operation with different sensor setups by means of the SM_config1 and SM_config2 registers. However, only one
calibration coefficient set is supported. Therefore, either an alternative ZSSC3224-external signal calibration using the alternate SM_config
settings must be performed to ensure that the programmed SSC coefficients are valid for both setups, or a full reprogramming of the SSC
coefficients must be performed each time the sensor setup is changed. The selection of the external sensor setup (i.e., the AFE configuration)
can be done with the interface commands B0HEX and B1HEX (see Table 6.1).
6.7.1 Calibration Step 1 – Assigning Unique Identification
Assign a unique identification number to the ZSSC3224 by using the memory write command (40HEX + data and 41HEX + data; see Table 6.1
and Table 6.5) to write the identification number to Cust_ID0 at memory address 00HEX and Cust_ID1 at address 01HEX as described in section
6.6.1. These two 16-bit registers allow for more than 4 billion unique devices.
6.7.2 Calibration Step 2 – Data Collection
The number of unique points (measurand and/or temperature) at which calibration must be performed generally depends on the requirements
of the application and the behavior of the sensor in use. The minimum number of points required is equal to the number of correction coefficients
to be corrected with a minimum of three different temperatures at three different sensor values. For a full calibration resulting in values for all 7
possible (external) sensor coefficients and 3 possible temperature coefficients, a minimum of 7 pairs of sensor with temperature measurements
must be collected.
37
November 12, 2018
Within this minimum field of 3 measurand measurements x 3 temperature measurements, data must be collected for the specific value pairs (at
known conditions) and then processed to calculate the coefficients. In order to obtain the potentially best and most robust coefficients, it is
recommended that measurement pairs (temperature versus measurand) be collected at the outer corners of the intended operation range or at
least at points that are located far from each other. It is also essential to provide highly precise reference values as nominal, expected values.
The measurement precision of the external calibration-measurement equipment should be ten times more accurate than the expected
ZSSC3224 output accuracy after calibration in order to avoid accuracy losses caused by the nominal reference values (e.g., measurand signal
and temperature deviations).
Note: The coefficients SENS_shift and T_shift must not be determined during this calibration step.
Strong recommendation: Set these coefficients to zero until after initial calibration.
Note: An appropriate selection of measurement pairs can significantly improve the overall system performance.
The determination of the measurand-related coefficients will use all of the measurement pairs. For the temperature-related correction
coefficients, 3 of the measurement pairs (at three different temperatures) will be used.
Note: There is an inherent redundancy in the 7 sensor-related and 3 temperature-related coefficients. Since the temperature is a necessary
output (which also needs correction), the temperature-related information is mathematically separated, which supports faster and more efficient
DSP calculations during the normal usage of the sensor-ZSSC3224 system. The recommended approach for data collection is to make use of
the raw-measurement commands described in Table 6.2.
For external sensor values, either of the following commands can be used depending on the user’s requirements:
.
A2HEX + 0000HEX
Single sensor measurement for which the configuration register will be loaded from the SM_config1 register (12HEX in
MTP); preprogramming the measurement setup in the MTP is required.
Note: SM_config1 is the default configuration. Alternatively, SM_config2 (16HEX in MTP) can be used by first sending the command B1HEX
(see section 6.7.5).
.
A3HEX + ssssHEX
Single sensor measurement for which the SM_config configuration register (Gain, ADC, Offset, etc.) will be loaded
as the user’s configuration ssssHEX, which must be provided externally via the interface as the data part of this command.
For temperature values, either of the following commands can be used depending on the user’s requirements:
.
A6HEX + 0000HEX
Single temperature measurement for which the configuration register will be loaded from an internal temperature
configuration register (preprogrammed by IDT in the MTP); preprogramming of the respective configuration is done by IDT prior to
ZSSC3224 delivery. This is the recommended approach for temperature data collection.
.
A7HEX + ssssHEX
Single temperature measurement for which the configuration register (Gain, ADC, Offset, etc.) will be loaded as the
user’s configuration ssssHEX, which must be provided externally via the interface as the data part of this command. The format and
purpose of these configuration bits must be according to the definitions for SM_config and valid for temperature measurement; in this
case (bits [15:12] will be ignored).
6.7.3 Calibration Step 3a) – Coefficient Calculations
The math to perform the coefficient calculation is complicated and will not be discussed in detail. There is a brief overview in the next section.
IDT provides software (DLLs) to perform the coefficient calculation (external to the sensor-ZSSC3224 system) based on auto-zero corrected
values. After the coefficients are calculated, the final step is to write them to the MTP memory of the ZSSC3224.
6.7.4 Calibration Step 3b) – Post-Calibration Offset Correction
There are two special SSC coefficients, SENS_shift and T_shift. Normally, these coefficients must be set to zero during the initial sensor
calibration. The primary purpose of these two coefficients is to cancel additional offset shifts that could occur during or after final sensor
assembly; e.g. if a respective sensor is finally placed and soldered on an application board.
If the final sensor assembly induced any kind of offset (on either the temperature or external sensor signal), the respective influence can be
directly compensated by means of the SENS_shift and T_shift coefficients without the need to change the original SSC coefficient set. However,
this post-calibration offset correction must be done under known ambient conditions (i.e., sensor measurand and/or temperature).
38
November 12, 2018
6.7.5 SSC Measurements
After the completion of the calibration procedure, linearized external sensor and temperature readings can be obtained using the commands
AAHEX to AFHEX as described in Table 6.1.
Typically, only one external sensor is used in a single analog configuration using the setup in the SM_config1 MTP register (12HEX). However,
the ZSSC3224 can support a second analog configuration that is set up in the SM_config2 MTP register (16HEX). This might be useful in cases
where only one sensor-ZSSC3224 pair must support the measurand ranges for two different external sensors that have different precisions,
required amplification, and sensor offset.
If a respective switching between setups is to be performed, the SSC coefficients for the alternate external sensor must be handled with one of
the following methods:
.
The programmed SSC coefficients are not used for the alternate external sensor. The ZSSC3224 performs only a one-to-one transfer, i.e.
no effective digital SSC correction – only a transfer of the auto-zero corrected raw ADC readings to the ZSSC3224 output without any
scaling, etc.
.
The coefficients are re-programmed each time the analog setup is changed.
SM_config1 is selected as the analog setup register by default, so no specific activation is needed if only SM_config1 is used. If SM_config2
will also be used, the activation command B1HEX must be sent once prior to the measurement request. To switch to using SM_config1, the
activation command B0HEX must be sent prior to use. This activation must be refreshed after any power-on reset or RES pin reset.
6.8 The Calibration Math
6.8.1 Bridge Signal Compensation
The saturation check in the ZSSC3224 detects saturation effects of the internal calculation steps, allowing the final correction output to be
determined despite the saturation. It is possible to get potentially useful signal conditioning results that have had an intermediate saturation
during the calculations. These cases are detectable by observing the status bit 0 for each measurement result. Details about the saturation
limits and the valid ranges for values are provided in the following equations.
The calibration math description assumes a calculation with integer numbers. The description is numerically correct concerning values, dynamic
range, and resolution.
SOT_curve selects whether second-order equations compensate for sensor nonlinearity with a parabolic or S-shaped curve. The parabolic
compensation is recommended for most sensor types.
For the following equations, the terms are as follows:
S
=
=
=
=
=
=
=
=
=
=
Corrected sensor reading output via I2C or SPI; range [0HEX to FFFFFFHEX
Raw sensor reading from ADC after AZ correction; range [-7FFFFHEX, 7FFFFHEX
Sensor gain term; range [-7FFFFHEX, 7FFFFHEX
Sensor offset term; range [-7FFFFHEX, 7FFFFHEX
Temperature coefficient gain term; range [-7FFFFHEX, 7FFFFHEX
Temperature coefficient offset term; range [-7FFFFHEX, 7FFFFHEX
Raw temperature reading after AZ correction; range [-7FFFFHEX, 7FFFFHEX
]
S_Raw
Gain_S
Offset_S
Tcg
]
]
]
]
Tco
]
T_Raw
SOT_tcg
SOT_tco
SOT_sens
]
Second-order term for Tcg non-linearity; range [-7FFFFHEX, 7FFFFHEX
]
]
Second-order term for Tco non-linearity; range [-7FFFFHEX, 7FFFFHEX
Second-order term for sensor non-linearity; range [-7FFFFHEX, 7FFFFHEX
]
SENS_shift = Post-calibration, post-assembly sensor offset shift; range [-7FFFFHEX, 7FFFFHEX
]
ll
=
=
Absolute value
Bound/saturation number range from ll to ul, over/under-flow is reported as saturation in the status byte
ul
39
November 12, 2018
The correction formula for the differential signal reading is represented as a two-step process depending on the SOT_curve setting.
Equations for the parabolic SOT_curve setting (SOT_curve = 0):
Simplified:
T _Raw
4SOT_tcg
K1 223
T _Raw 4Tcg
223
223
(1)
(2)
T _Raw
223
4SOT_tco
K2 4Offset_S S_Raw
T _Raw 4Tco
223
4Gain _S K1
(delimited to positive number range)
(delimited to positive number range)
ZSP
K2 223
223
223
(3)
(4)
ZBP
4SOT_sens
S
ZSP 223 SENS_shift
223
223
Complete:
25
2
1
25
2
1
25
1
25
1
2
2
T _ Raw
SOT_ tcg
23
K1 2
T _ Raw
4Tcg
25
(5)
(6)
223
221
2
25
2
25
2
25
2
25
2
1
25
2
1
25
2
1
25
1
2
25
1
2
T _ Raw
SOT_ tco
K2 4 Offset_S S _ Raw
T _ Raw
4Tco
25
223
221
2
25
2
25
2
25
2
25
2
25
1
2
25
2
1
25
1
Gain _S
K
1
223
2
ZSP
K2
223
(7)
(8)
221
25
2
25
2
0
24
1
2
25
1
2
25
1
2
ZSP
SOT_sens
223
SENS_shift
B
ZBP
223
221
25
2
25
2
0
40
November 12, 2018
Equations for the S-shaped SOT_curve setting (SOT_curve = 1):
Simplified:
4Gain _S K1
ZSS
K2
223
223
(9)
ZSS
223
4SOT_sens
Z SS 223 223 SENS_shift
(delimited to positive number range)
S
223
(10)
Complete:
25
2
1
25
1
2
Gain _S
K
1
223
ZSS
K2
(11)
(12)
221
25
2
25
2
24
1
25
2
1
2
25
1
2
25
1
2
ZSS
SOT_sens
S
ZSS
223
223 SENS_shift
223
221
25
2
25
2
25
2
0
6.8.2 Temperature Signal Compensation
Temperature is measured internally. Temperature correction contains both linear gain and offset terms as well as a second-order term to correct
for any nonlinearities. For temperature, second-order compensation for nonlinearity is always parabolic.
For the following equations, the terms are as follows:
T
=
=
=
=
=
=
Corrected temperature sensor reading output via I2C or SPI; range [0HEX to FFFFFFHEX
Gain coefficient for temperature; range [-7FFFFFHEX to 7FFFFFHEX
Raw temperature reading after AZ correction; range [-7FFFFFHEX to 7FFFFFHEX
Offset coefficient for temperature; range [-7FFFFFHEX to 7FFFFFHEX
Second-order term for temperature source non-linearity; range [-7FFFFFHEX to 7FFFFFHEX
Shift for post-calibration/post-assembly offset compensation; range [-7FFFFFHEX to 7FFFFFHEX
]
Gain_T
T_Raw
Offset_T
SOT_T
T_Shift
]
]
]
]
]
The correction formula is best represented as a two-step process as follows:
Simplified:
4Gain _T
(delimited to positive number range)
(delimited to positive number range)
ZT
T
T _Raw 4Offset _T
223
223
(13)
(14)
ZT
4SOT_T
ZT 223 T_Shift
223
223
41
November 12, 2018
Complete:
25
1
2
25
2
1
25
Gain _T
1
2
ZT
T _Raw 4Offset _T225
223
221
25
(15)
(16)
2
0
24
1
2
25
1
2
25
1
2
ZT
SOT_T
221
T
ZT
223
T_Shift
223
25
2
25
2
0
6.8.3 Measurement Output Data Format
The data format and bit assignment of the raw measurement and SSC-corrected outputs of the ZSSC3224 are defined in the following tables.
Any ADC measurement and SSC calculation output is formatted as a 24-bit data word, regardless of the effective ADC resolution used. The
values are either in two’s complement or sign-absolute format.
Table 6.6 Measurement Results of ADC Raw Measurement Request (Two’s Complement)
Bit
Meaning,
23
22
21
20
…
1
0
-20
2-1
2-2
2-3
…
2-22
2-23
Weighting
Table 6.7 Calibration Coefficients (Factors and Summands) in Memory (Sign Magnitude)
Bit
Meaning,
23
22
21
20
…
1
0
0=positive
1=negative
21
20
2-1
…
2-20
2-21
weighting
Table 6.8 Output Results from SSC-Correction Math or DSP—Sensor and Temperature
Bit
Meaning,
23
22
21
20
…
1
0
20
2-1
2-2
2-3
…
2-22
2-23
weighting
Table 6.9 Interrupt Thresholds TRSH1 and TRSH2—Format as for SSC-Correction Math Output
Bit
Meaning,
23
22
21
20
…
1
0
20
2-1
2-2
2-3
…
2-22
2-23
weighting
42
November 12, 2018
7. Package Outline Drawings
7.1 ZSSD3224 Die Dimensional Drawings
Figure 7.1 provides an illustration of the approximate pad layout. See the ZSSC3224 Technical Note – Delivery Specifications for the die
dimensions and related specifications.
Figure 7.1 Approximate ZSSC3224 Pad Layout
Seal Ring
IC Core
VDD
VSS
ZMDI-test
ZMDI-test
SS
ZMDI-test
RES
ZMDI-test
INP
VDDB
INN
VSSB
EOC
MISO
MOSI/SDA
SCLK/SCL
ZMDI-test
43
November 12, 2018
7.2 24-PQFN Package Dimensions
Figure 1.2 provides dimensions for the 24-PQFN package (ZSSC3224BI3R).
Figure 7.2 General 24-PQFN Package Dimensions
Table 7.1 Physical Package Dimensions
Parameter / Dimension
Min (mm)
0.80
Max (mm)
0.90
A
A1
b
0.00
0.05
0.18
0.30
e
0.5 nom
HD
HE
L
3.90
3.90
0.35
4.10
4.10
0.45
44
November 12, 2018
8. Quality and Reliability
The ZSSC3224 is available as a qualified IC for consumer-market applications. All data specified parameters are guaranteed if not stated
otherwise.
9. Related Documents
Visit the ZSSC3224 product page www.IDT.com/ZSSC3224 or contact your nearest sales office for the latest version of ZSSC3224 documents.
The following document is available on request: ZSSC3224 Technical Note – Delivery Specifications.
10. Glossary
Term
Description
A2D
ACK
ADC
ALU
AZ
Analog-to-Digital
Acknowledge (interface’s protocol indicator for successful data/command transfer)
Analog-to-Digital Converter or Conversion
Arithmetic Logic Unit
Auto-Zero (unspecific)
AZSM
AZTM
Au
Auto-Zero Measurement for (external) Sensor Path
Auto-Zero Measurement for Temperature Path
Gold
CLK
Cu
Clock
Copper
DAC
DF
Digital-to-Analog Conversion or Converter
Data Fetch (command type)
DSP
EOC
FSO
LSB
LFSR
MR
Digital Signal Processor
End of Conversion
Full Scale Output (value in percent relative to the ADC maximum output code; resolution dependent)
Least Significant Bit
Linear Feedback Shift Register
Measurement Request (command type)
Most Significant Bit
MSB
MTP
NACK
POR
Multiple-Time Programmable Memory
Not Acknowledge (interface’s protocol indicator for unsuccessful data/command transfer)
Power-on Reset
PreAmp
PSRR
Preamplifier
Power Supply Disturbance Rejection Ratio
45
November 12, 2018
Term
Description
SM
SOT
TC
Signal Measurement
Second-Order Term
Temperature Coefficient (of a resistor or the equivalent bridge resistance)
Temperature Measurement
TM
11. Marking Diagram
Line 1 3224B the truncated part number
Line 2 YYWW are the last 2 digits of the year and week that the part was assembled
Line 3 Last 5 digits of lot number
3224B
YYWW
XXXXX
12. Ordering Information
Contact IDT Sales for additional information.
Orderable Part Number
ZSSC3224BI1B
Description and Package
MSL Rating
Not applicable
Not applicable
MSL1
Carrier Type
Unsawn wafer
Unsawn wafer
Reel
Temperature
–40°C to +85 °C
-40°C to +85 °C
-40°C to +85 °C
ZSSC3224 die: thickness 304µm
ZSSC3224BI2B
ZSSC3224 die: thickness 725µm (without backlapping)
ZSSC3224 24-PQFN: 4.0 4.0 0.85 mm
ZSSC3224BI3R
ZSSC3224KITV1P0
Evaluation Kit for ZSSC3224, including boards, cable, software, and 5 samples
46
November 12, 2018
13. Document Revision History
Date
Description
November 12, 2018
.
.
.
24-PQFN is now available for production rather than as engineering samples.
Update for template.
Minor edits.
October 24, 2016
April 20, 2016
Correction for Table 4.1 The ADC “Conversion Rate” is 144Hz.
Changed to IDT branding. Revision number is now the release date.
First release.
January 14, 2016
(Rev. 1.00)
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