FSMD005-1206 [RFE]
Surface Mount PPTC FSMD1206 Series; 表面贴装PPTC FSMD1206系列
| 型号： | FSMD005-1206 |
| 厂家： | 
RFE INTERNATIONAL |
| 描述： | Surface Mount PPTC FSMD1206 Series |
| 文件： | 总2页 (文件大小：195K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mount PPTC
FSMD1206 Series
RoHS
ü
FEATURES
AGENCY RECOGNITION
•1206 size, Surface mount
•Application: All high-density boards
•Maximum Voltage: 8V ~ 60V
•Temperature Range: -40°C to 85°C
•RoHS Compliant
•UL (E211981)
•C-UL (E211981)
•TUV (R50090556)
ELECTRICAL CHARACTERISTICS (23°C)
Max Time to Trip
Hold
Trip
Rated
Maximum
Current
Typical
Power
Resistance Tolerance
Current
Current
Voltage
Part Number
Current
Amp
0.25
0.50
8.0
Time
Sec
RMIN
OHMS
3.60
R1MAX
OHMS
50.00
15.00
2.50
IH, A
0.05
0.10
0.20
0.35
0.50
IT, A
0.15
0.25
0.40
0.75
1.00
VMAX, Vdc
IMAX, A
Pd, W
0.4
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
60
60
30
16
8
10
1.50
1.00
0.05
0.10
0.10
10
0.4
1.60
10
0.4
0.60
40
0.4
8.0
0.30
1.20
40
0.4
8.0
0.15
0.70
*Devices with hold current up to 1.5amps are in development
IH=Hold current-maximum current at which the device will not trip at 23°C still air.
IT=Trip current-maximum current at which the device will always trip at 23°C still air.
V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX).
I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in23°C still air environment.
R MIN=Minimum device resistance at 23°C prior to tripping.
R1MAX=Maximum device resistance at 23°C measured 1 hour post trip.
Termination pad characteristics
Termination pad materials: Tin-plated copper
FSMD1206 PRODUCT DIMENSIONS (MILLIMETERS)
D
B
A
Top and bottom view
Side view
C
Part
A
B
C
D
Number
Min Max Min Max Min Max Min
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
3.0
3.0
3.0
3.0
3.0
3.5
3.5
3.5
3.5
3.5
1.5
1.5
1.5
1.5
1.5
1.8 0.45 0.75 0.10
1.8 0.45 0.75 0.10
1.8 0.45 0.75 0.10
1.8 0.45 0.75 0.10
1.8 0.25 0.55 0.10
C5ED01
RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
REV 2007.8.14
Surface Mount PPTC
FSMD1206 Series
RoHS
ü
THERMAL DERATING CURVE
Thermal Derating Curve, FSMD1206 Series
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Tempera ture (C)
TYPICAL TIME-TO-TRIPAT 23°C
A
B
C D
100
10
Z = FSMD005-1206
A = FSMD010-1206
B = FSMD020-1206
C = FSMD035-1206
D = FSMD050-1206
1
Z
0.1
0.01
0.001
0.1
1
10
100
Fault current (A)
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimension in the table below provide the recommended pad layout for each FSMD1206 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER REFLOW
20 to 40 Seconds
260 °C
Ramp-down
6°C/Second Max
Ramp-up
3°C/Second Max
1.9
217 °C
f
200 °C
150 °C
Preheat
1.0
1.0
25 °C
2.0
60 to 180 Seconds
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
NOTE: All Specification subject to change without notice.
C5ED01
RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com
REV 2007.8.14
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