FSMD005-1210 [RFE]

Surface Mount PPTC FSMD1210 Series; 表面贴装PPTC FSMD1210系列


型号：	FSMD005-1210
厂家：	RFE INTERNATIONAL
描述：	Surface Mount PPTC FSMD1210 Series 表面贴装PPTC FSMD1210系列
文件：	总2页 (文件大小：193K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Surface Mount PPTC

FSMD1210 Series

RoHS

FEATURES

AGENCY RECOGNITION

•1210 size, Surface mount

•UL (E211981)

•Application: All high-density boards

•Operation Current: 50mA ~ 0.750mA

•Maximum Voltage: 8V ~ 60V

•Temperature Range: -40°C to 85°C

•RoHS Compliant

•C-UL (E211981)

•TUV (R50090556)

ELECTRICAL CHARACTERISTICS (23°C)

Max Time to Trip

Hold

Trip

Rated

Maximum

Current

Typical

Power

Resistance Tolerance

Current

Voltage

Part Number

Current

Amp

0.25

0.50

8.0

Time

Sec

RMIN

OHMS

3.60

R1MAX

OHMS

50.00

15.00

5.00

IH, A

0.05

0.10

0.20

0.35

0.50

0.75

IT, A

0.15

0.25

0.40

0.70

1.00

1.50

VMAX, Vdc

IMAX, A

Pd, W

0.6

FSMD005-1210

FSMD010-1210

FSMD020-1210

FSMD035-1210

FSMD050-1210

FSMD075-1210

1.50

0.02

0.20

0.10

0.6

1.60

0.6

0.80

0.6

8.0

0.32

1.30

0.6

8.0

0.25

0.90

0.6

8.0

0.13

0.40

* Devices with hold current up to 1.5 amps are in development

IH=Hold current-maximum current at which the device will not trip at 23°C still air.

IT=Trip current-maximum current at which the device will always trip at 23°C still air.

V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX).

I MAX=Maximum fault current device can withstand without damage at rated voltage (V MAX).

Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in23°C still air environment.

R MIN=Minimum device resistance at 23°C prior to tripping.

R1MAX=Maximum device resistance at 23°C measured 1 hour post trip.

Termination pad characteristics

Termination pad materials: Tin-plated copper

FSMD1210 PRODUCT DIMENSIONS (MILLIMETERS)

Top and bottom view

Side view

Part

Number

Min Max Min Max Min Max Min

3.0 3.43 2.35 2.8 0.60 1.15 0.25

3.0 3.43 2.35 2.8 0.40 0.85 0.25

3.0 3.43 2.35 2.8 0.40 0.80 0.25

3.0 3.43 2.35 2.8 0.30 0.75 0.25

3.0 3.43 2.35 2.8 0.30 0.70 0.25

FSMD005-1210

FSMD010-1210

FSMD020-1210

FSMD035-1210

FSMD050-1210

FSMD075-1210

C5ED03

REV 2007.8.14

RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com

Surface Mount PPTC

FSMD1210 Series

RoHS

THERMAL DERATING CURVE

Thermal Derating Curv e, FSMD1210 Serie s

200%

150%

100%

50%

-40

-20

Ambient Temperature (C)

TYPICAL TIME-TO-TRIPAT 23°C

100

FSMD005-1210

FSMD010-1210

FSMD020-1210

FSMD035-1210

FSMD050-1210

FSMD075-1210

0.1

0.01

0.001

0.1

100

Fault current (A)

PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS

The dimension in the table below provide the recommended pad layout for each FSMD1210 device

NOMINAL PAD DIMENSIONS (MILLIMETERS)

SOLDER REFLOW

20 to 40 Seconds

260 °C

Ramp-down

6°C/Second Max

Ramp-up

3°C/Second Max

2.80

217 °C

200 °C

150 °C

Preheat

25 °C

1.0

60 to 180 Seconds

60 to 150 Seconds

2.0

Solder Reflow

Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.

1. Recommended reflow methods; IR, vapor phase oven, hot air oven.

2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)

3. Recommended maximum paste thickness is 0.25mm.

4. Devices can be cleaned by using standard industry methods and solvents.

5. Storage Environment: <30°C / 60%RH

Caution:

If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.

Rework:

Use standard industry practices.

NOTE: All Specification subject to change without notice.

C5ED03

REV 2007.8.14

RFE International • Tel:(949) 833-1988 • Fax:(949) 833-1788 • E-Mail Sales@rfeinc.com

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