RF3807 [RFMD]
GaAs HBT PRE-DRIVER AMPLIFIER; 砷化镓HBT预驱动放大器
| 型号： | RF3807 |
| 厂家： | 
RF MICRO DEVICES |
| 描述： | GaAs HBT PRE-DRIVER AMPLIFIER |
| 文件： | 总18页 (文件大小：1235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RF3807
GaAs HBT PRE-DRIVER AMPLIFIER
0
RoHS Compliant & Pb-Free Product
Typical Applications
• GaAs Pre-Driver for Basestation Amplifiers
• Class AB Operation for NMT, GSM, DCS, PCS,
• PA Stage for Commercial Wireless Infrastructure UMTS, and WLAN Transceiver Applications
Product Description
-A-
0.157
0.150
0.004
0.002
0.0192
0.0138
The RF3807 is a GaAs pre-driver power amplifier, specifi-
cally designed for wireless infrastructure applications.
Using a highly reliable GaAs HBT fabrication process,
this high-performance single-stage amplifier achieves
high output power over a broad frequency range. The
RF3807 also provides excellent efficiency and thermal
stability through the use of a thermally-enhanced surface-
mount plastic-slug package. Ease of integration is accom-
plished through the incorporation of an optimized evalua-
tion board design provided to achieve proper 50Ω
operation. Various evaluation boards are available to
address a broad range of wireless infrastructure applica-
tions: NMT 450MHz; GSM850; GSM900; DCS1800;
PCS1900; UMTS2100; and, WLAN2400.
0.196
0.189
0.050
0.244
0.230
0.066
0.056
Shaded lead is pin 1.
EXPOSED
DIE FLAG
8° MAX
0° MIN
0.126
0.088
0.0098
0.0075
0.035
0.016
0.099
0.061
Optimum Technology Matching® Applied
Package Style: SOIC-8
Si BJT
GaAs HBT
SiGe HBT
GaN HEMT
GaAs MESFET
9
Si Bi-CMOS
InGaP/HBT
Si CMOS
Features
SiGe Bi-CMOS
• Output Power>0.5W P1dB
• High Linearity
• High Power-Added Efficiency
• Thermally-Enhanced Packaging
VREF
NC
VBIAS
1
2
3
4
8
7
6
5
Bias
Circuit
• Broadband Platform Design Approach,
450MHz to 2500MHz
RFOUT/VCC
RFOUT/VCC
NC
RFIN
NC
Ordering Information
RF3807
GaAs HBT Pre-Driver Amplifier
PACKAGE BASE
GND
RF3807PCK-410
RF3807PCK-411
RF3807PCK-412
RF3807PCK-413
RF3807PCK-414
RF3807PCK-415
Fully Assembled Evaluation Board, 450MHz
Fully Assembled Evaluation Board, 869MHz to 894MHz
Fully Assembled Evaluation Board, 920MHz to 960MHz
Fully Assembled Evaluation Board, 1800MHz to 1880MHz
Fully Assembled Evaluation Board, 1930MHz to 1990MHz
Fully Assembled Evaluation Board, UMTS
RF Micro Devices, Inc.
7628 Thorndike Road
Tel (336) 664 1233
Fax (336) 664 0454
Greensboro, NC 27409, USA
http://www.rfmd.com
Functional Block Diagram
Rev A4 050912
4-623
RF3807
Absolute Maximum Ratings
Parameter
Rating
9.0
Unit
V
Supply Voltage (V and V
)
CC
BIAS
Caution! ESD sensitive device.
Power Control Voltage (V
)
9.0
V
REF
DC Supply Current
Maximum Input Power
Output Load VSWR @ P1dB
Operating Ambient Temperature
Storage Temperature
250
see below
4:1
-40 to +85
-40 to +150
mA
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. RoHS marking based on EUDirective2002/95/EC
(at time of this printing). However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
°C
°C
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Overall - 450MHz
Frequency
420
480
MHz
I
=14mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+28.5
+29.0
+29.5
16
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
51.0
50.0
16.0
-21.0
-25.0
-15.0
-8.0
53.5
52.5
16.5
-19.0
-21.0
-13.0
-6.5
55.0
54.0
17.0
-18.5
-20.0
-11.0
-6.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
38.0
39.5
41.0
42.5
40.0
42.0
43.5
44.5
dBm
dBm
dBm
dBm
15dBm/tone
17dBm/tone
19dBm/tone
21dBm/tone
4-624
Rev A4 050912
RF3807
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Overall - GSM800
Frequency
869
894
MHz
I
=14mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+30.0
+30.5
+32.0
16
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
54
53
56
55
60
59
%
%
@P1dB
@P1dB
15.5
-25.0
-44.0
-33.0
-20.0
16.5
-20.0
-39.0
-18.0
-12.0
17.0
-18.0
-35.0
-10.0
-8.0
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
36.0
38.0
40.0
43.0
38.5
41.0
44.0
45.0
dBm
dBm
dBm
dBm
15dBm/tone
17dBm/tone
19dBm/tone
21dBm/tone
Overall - GSM900
Frequency
920
960
MHz
I
=14mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+30.0
+30.5
+31.0
16
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
54
53
56
55
58
57
%
%
@P1dB
@P1dB
16.0
-25.0
-33.0
-29.0
-10.0
16.5
-22.0
-30.5
-22.0
-8.5
17.0
-21.0
-24.5
-9.0
-7.5
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
41.5
42.0
41.5
40.5
42.5
43.0
44.0
42.0
dBm
dBm
dBm
dBm
15dBm/tone
17dBm/tone
19dBm/tone
21dBm/tone
Rev A4 050912
4-625
RF3807
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
Overall - DCS1800
Frequency
1805
27.5
1880
MHz
I
=14mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
29.0
30.0
18.0
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
49.0
48.0
13.0
-49.0
-47.0
-50.0
-10.0
53.0
52.0
14.5
-36.0
-36.0
-14.0
-6.0
60.0
59.0
15.5
-33.0
-30.0
-9.0
%
%
@P1dB
@P1dB
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
-4.5
38.0
39.5
40.0
41.0
40.0
41.0
42.0
42.0
dBm
dBm
dBm
dBm
15dBm/tone
17dBm/tone
19dBm/tone
21dBm/tone
Overall - PCS1900
Frequency
1930
27.5
1990
MHz
I
=14mA, V =8V, V
=8V, V
=8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
28.0
29.0
18.0
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
44.0
43.0
13.0
-63.0
-63.0
-25.0
-12.0
49.0
48.0
14.0
-41.0
-41.0
-12.0
-7.0
55.0
54.0
14.5
-34.0
-34.0
-8.0
%
%
dB
dBc
dBc
@P1dB
@P1dB
@P1dB
@P1dB
-5.5
dB
39.5
39.5
40.0
39.0
39.5
41.5
42.5
41.5
dBm
dBm
dBm
dBm
15dBm/tone
17dBm/tone
19dBm/tone
21dBm/tone
4-626
Rev A4 050912
RF3807
Specification
Typ.
Parameter
Unit
Condition
Min.
Max.
UMTS 2100
Frequency
2110
2170
MHz
I
=14mA, V =8V, V
=8V, V =8V,
BIAS
REF
CC
REF
Temp=+25°C
P1dB
+28.0
+28.5
+29.0
18
dBm
dBm
P
, Maximum
IN
Total Efficiency
Total Power Added Efficiency
Gain (S21)
Second Harmonic (2fo)
Third Harmonic (3fo)
Input Return Loss (S11)
Output Return Loss (S22)
Two-Tone Specification
OIP3
41
40
46
45
51
50
%
%
@P1dB
@P1dB
13.5
-39.0
-65.0
-35.0
-20.0
14.0
-35.0
-56.0
-16.0
-11.0
14.5
-28.5
-44.5
-8.0
-6.0
dB
dBc
dBc
dB
dB
@P1dB
@P1dB
38.5
39.5
41.5
39.5
39.5
40.5
42.0
40.5
dBm
dBm
dBm
dBm
15dBm/tone
17dBm/tone
19dBm/tone
21dBm/tone
Power Supply
Power Supply Voltage
4.5
50
8.0
120
9.0
135
V
mA
Supply Current (I +I
)
I
for best IP3 and efficiency
CCQ
CC BIAS
Control Current (I
)
13
14
15
30
mA
V
V
=8V, V =8V
REF
REF
REF
CC
Power Down Current
μA
=0V, V =8V
CC
Rev A4 050912
4-627
RF3807
Pin
1
Function
VREF
Description
Control input to internal bias circuitry.
No connection.
Input for RF signal.
No connection.
No connection.
2
3
4
5
NC
RFIN
NC
NC
RF output pin and V supply pin.
6
7
8
RFOUT/VCC
RFOUT/VCC
VBIAS
GND
CC
RF output pin and V supply pin.
CC
RF supply to internal bias circuitry.
Backside of package should be connected to a short path to ground.
Pkg
Base
4-628
Rev A4 050912
RF3807
Evaluation Board Schematic
450MHz (RF3807410)
VREF
P1
P1-1
P2-1
1
VREF
VCC
C15
0.1 μF
BANANA
JACK
P2
1
C14
10 μF
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
10 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 Ω
Open
Open
Open
C16
C17
C18
C19
220 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
220 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
220 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
47 nH
C11
100 pF
L2
6.8 nH
C2
220 pF
50 Ω μstrip
L1
18 nH
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
2 pF
C5
Open
C6
Open
C7
Open
C8
Open
C9
Open
C10
Open
C1
Open
C3
5.6 pF
PACKAGE BASE
GND
3807400 r3
Evaluation Board Schematic
869MHz to 894MHz (GSM800) (RF3807411)
VREF
P1
P1-1
P2-1
1
VREF
VCC
C15
0.1 ⎯F
BANANA
JACK
P2
1
C14
10 ⎯F
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
33 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 ⎯
Open
Open
Open
C16
C17
C18
C19
33 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
33 pF
100 pF
0.1 ⎯F
VCC
C20
C21
C22
C23
33 pF
1000 pF
10 ⎯F
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
47 nH
C11
10 pF
L2
5.6 nH
C2
100 pF
50 Ω μstrip
L1
6.8 nH
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
1.5 pF
C5
Open
C6
3.3 pF
C7
Open
C8
Open
C9
Open
C10
Open
C1
Open
C3
6.2 pF
PACKAGE BASE
GND
3807401-
Rev A4 050912
4-629
RF3807
Evaluation Board Schematic
920MHz to 960MHz (GSM900) (RF3807412)
VREF
P1
P1-1
P2-1
1
VREF
VCC
C15
0.1 ٛF
BANANA
JACK
P2
1
C14
10 ٛF
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
33 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 ٛ
Open
Open
Open
C16
C17
C18
C19
33 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
33 pF
100 pF
0.1 ٛF
VCC
C20
C21
C22
C23
33 pF
1000 pF
10 ٛF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
47 nH
C11
33 pF
L2
4.7 nH
C2
100 pF
50 Ω μstrip
L1
5.6 nH
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
1 pF
C5
Open
C6
1.8 pF
C7
Open
C8
Open
C9
Open
C10
Open
C1
Open
C3
5.6 pF
PACKAGE BASE
GND
3807402-
Evaluation Board Schematic
1800MHz to 1880MHz (DCS1800) (RF3807413)
VREF
P1
P1-1
P2-1
1
VREF
VCC
C15
0.1 μF
BANANA
JACK
P2
1
C14
10 μF
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
10 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 Ω
Open
Open
Open
C16
C17
C18
C19
10 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
10 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
10 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
24 nH
C11
3.6 pF
R6
0 Ω
C2
7.5 pF
C30
15 pF
50 Ω μstrip
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
2 pF
C5
Open
C6
Open
C7
Open
C8
0.5 pF
C9
Open
C10
1.6 pF
C1
Open
C3
3.3 pF
PACKAGE BASE
GND
3807403-
4-630
Rev A4 050912
RF3807
Evaluation Board Schematic
1930MHz to 1990MHz (PCS1900) (RF3807414)
VREF
P1
P1-1
P2-1
1
VREF
VCC
C15
0.1 μF
BANANA
JACK
P2
1
C14
10 μF
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
10 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 Ω
Open
Open
Open
C16
C17
C18
C19
10 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
10 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
10 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
24 nH
C31
100 pF
C11
3 pF
C2
10 pF
C30
8.2 pF
50 Ω μstrip
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
1.8 pF
C5
Open
C6
Open
C7
Open
C8
Open
C9
Open
C10
1.5 pF
C1
Open
C3
3 pF
PACKAGE BASE
GND
3807404-
Evaluation Board Schematic
UMTS (RF3807415)
VREF
P1
P1-1
P2-1
1
VREF
VCC
C15
0.1 μF
BANANA
JACK
P2
1
C14
10 μF
BANANA
JACK
C13
1000 pF
P3
1
GND
C12
10 pF
BANANA
JACK
R1
R2
R3
R4
R5
680 Ω
680 Ω
Open
Open
Open
C16
C17
C18
C19
10 pF
1000 pF
10 μF
0.1 μF
C26
C24
C25
10 pF
100 pF
0.1 μF
VCC
C20
C21
C22
C23
10 pF
1000 pF
10 μF
0.1 μF
1
2
3
4
8
7
6
5
Bias
Circuit
L3
24 nH
C31
12 pF
C11
3.6 pF
C2
10 pF
C30
5.1 pF
50 Ω μstrip
J2
RF OUT
50 Ω μstrip
J1
RF IN
C4
1.1 pF
C5
Open
C6
Open
C7
Open
C8
Open
C9
Open
C10
1.2 pF
C1
Open
C3
3 pF
PACKAGE BASE
GND
3807405-
Rev A4 050912
4-631
RF3807
Evaluation Board Layout - 400MHz
Board Size 2.0” x 2.0”
Board Thickness 0.023”, Board Material Rogers 4530
4-632
Rev A4 050912
RF3807
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is
3μinch to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for PFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern
shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to
accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful
process development is recommended.
PCB Metal Land Pattern
A = 1.14 x 0.71
B = 1.02 x 0.71 Typ.
C = 3.96 x 4.44
Dimensions in mm.
5.93
Pin 1
A
B
B
B
B
B
B
B
1.27 Typ.
1.90
C
3.81 Typ.
3.00
5.99 Typ.
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 1.30 x 0.86
B = 1.17 x 0.86 Typ.
C = 4.11 x 4.60
Dimensions in mm.
5.93
Pin 1
A
B
B
B
B
B
B
B
1.27 Typ.
1.90
C
3.81 Typ.
3.00
5.99 Typ.
Rev A4 050912
4-633
RF3807
Thermal Pad and Via Design
The DUT must be connected to the PCB backside ground through a low inductance, low thermal resistance path. The
required interface is achieved with the via pattern shown below for both low inductance as well as low thermal resistance.
The footprint provided below worked well on the RFMD 20mil thick Rogers 4350 PCB and also standard FR4. The vias
are 8mil vias that are partially plated through and are finished to 8mils±2mils with a minimum plating of 1.5mil. Failure to
place these vias within the DUT mounting area on the PCB in this prescribed manner may result in electrical perfor-
mance and/or reliability degradation.
4-634
Rev A4 050912
RF3807
Tape and Reel Information
Carrier tape basic dimensions are based on EIA481. The pocket is designed to hold the part for shipping and loading
onto SMT manufacturing equipment, while protecting the boyd and the solder terminals from damaging stresses. The
individual pocket design can vary from vendor to vendor, but wide and pitch will be consistent.
Carrier tape is wound or placed on a shipping reel with a diameter of either 330mm (13inches) or 178mm (7inches). The
center hub design is large enough to ensure the radius formed by the carrier tape around it does not put unnecessary
stress on the parts.
Prior to shipping, moisture sensitive parts (MSL level 2a to 5a) are baked and placed into the pockets of the carrier tape.
A cover tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier, ESD
bag, which is placed in a cardboard shipping box. It is important to note that unused moisture sensitive parts need to be
resealed in the moisture barrier bag. If the reels exceed the exposure limit and need to be rebaked, most carrier tape and
shipping reels are not rate as bakeable at 125°C. If baking is required, devices may be baked according to section 4,
table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A.
The following table provides useful information for carrier tape and reels used for shipping the devices described in this
document.
Reel
Diameter
Inch (mm)
13 (330)
Hub
Diameter
Inch (mm)
4 (102)
Width
(mm)
Pocket Pitch
(mm)
Units per
Reel
RFMD Part Number
Feed
RF3807TR13
RF3807TR7
12
12
8
8
Single
Single
2500
750
7 (178)
2.4 (61)
Carrier Tape Drawing with Part Orientation
Notes:
Ao = 6.70 ± 0.10
Bo = 5.40 ± 0.10
F = 5.50 ± 0.05
Ko = 2.10 ± 0.10
P = 8.00 ± 0.10
1. All dimensions are in millimeters (mm).
2. Unless otherwise specified, all dimension tolerances per EIA-481.
W = 12.00 +0.30/-0.10
4.00 ± 0.10
Ø1.50±.10
2.00 ± 0.05
15 inch Trailer
Pin 1
0.292
±.013
1.75±.10
Top View
15 inch Leader
Location
Sprocket holes toward
rear of reel
F
W
PART NUMBER
YYWW
PART NUMBER
YYWW
PART NUMBER
YYWW
PART NUMBER
YYWW
Bo
Trace Code
Trace Code
Trace Code
Trace Code
P
Ao
Ko
Direction of Feed
Rev A4 050912
4-635
RF3807
CDMA2K ACPR Performance for RS SMIQ03HD Sig Gen & FSU8
Spec Analyzer (1960 MHz, 882 MHz, & 450 MHz Source Signals)
-50.0
W-CDMA ACPR Performance for RS SMIQ03HD Sig Gen &
FSU8 Spec Analyzer (2140 MHz & 882 MHz Source Signals)
-40.0
-42.0
-44.0
-46.0
-48.0
-50.0
-52.0
-54.0
-56.0
-58.0
-60.0
-62.0
-64.0
-66.0
-68.0
-70.0
-72.0
-74.0
-76.0
-78.0
-80.0
(No DUT in Place)
ACPR @ 0.75 MHz 1960 MHz source
ACPR @ 0.75 MHz 882 MHz source
ACPR @ 0.75 MHz 450 MHz source
ACPR @ 5MHz 2140 MHz source
ACPR @ 5MHz 882 MHz source
-52.0
-54.0
-56.0
-58.0
-60.0
-62.0
-64.0
-66.0
-68.0
-70.0
-72.0
-74.0
-76.0
-78.0
-80.0
-6 -5 -4 -3 -2 -1
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
-6 -5 -4 -3 -2 -1
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
Output Power (dBm)
Output Power (dBm)
RF3807410 @ 450 MHz CDMA2K
SR1 and 9 Channels
RF3807411 @ 882 MHz CDMA2K
SR1 and 9 Channels
-30.0
-35.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
-80.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
-80.0
-85.0
-90.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
8
9
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
Output Power (dBm)
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Output Power (dBm)
RF3807412 @ 940 MHz
EDGE EVM
RF3807413 @ 1840 MHz
EDGE EVM
20.0
18.0
16.0
14.0
12.0
10.0
8.0
20.0
18.0
16.0
14.0
12.0
10.0
8.0
EVM_rms(%)
EVM_peak(%)
EVM_rms(%)
EVM_peak(%)
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
18.0
19.0
20.0
21.0
22.0
23.0
24.0
25.0
26.0
27.0
28.0
15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0
Output Power (dBm)
Output Power (dBm)
4-636
Rev A4 050912
RF3807
RF3807414 @ 1960 MHz CDMA2K
SR1 and 9 Channels
RF3807415 @ 2140 MHz UMTS W-CDMA
64 Channels with No Clipping
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
-80.0
-85.0
-90.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
-35.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
ACPR @ 5MHz
Efficiency (%)
0.0
0.0
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Output Power (dBm)
12
13
14
15
16
17
18
19
20
21
22
Output Power (dBm)
RF3807411 @ 882 MHz W-CDMA
64 Channels and No Clipping
RF3807412 @ 940 MHz
EDGE EVM
-35.0
-40.0
-45.0
-50.0
-55.0
-60.0
-65.0
-70.0
-75.0
40
35
30
25
20
15
10
5
20.0
18.0
16.0
14.0
12.0
10.0
8.0
ACPR @ 5MHz
Efficiency (%)
EVM_rms(%)
EVM_peak(%)
6.0
4.0
2.0
0
0.0
10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0
Output Power (dBm)
18.0
19.0
20.0
21.0
22.0
23.0
24.0
25.0
26.0
27.0
28.0
Output Power (dBm)
RF3807413 @ 1840 MHz
EDGE EVM
20.0
18.0
16.0
14.0
12.0
10.0
8.0
EVM_rms(%)
EVM_peak(%)
6.0
4.0
2.0
0.0
15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0
Output Power (dBm)
Rev A4 050912
4-637
RF3807
RF3807410 Evaluation Board S-Parameters
RF3807411 Evaluation Board S-Parameters
25.0
20.0
15.0
10.0
5.0
25.0
20.0
15.0
10.0
5.0
S21
S21
0.0
0.0
-5.0
S22
-5.0
S22
S11
S12
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
S11
S12
420.0
430.0
440.0
450.0
460.0
470.0
480.0
869.0
874.0
879.0
884.0
889.0
894.0
Frequency (MHz)
Frequency (MHz)
RF3807412 Evaluation Board S-Parameters
RF3807413 Evaluation Board S-Parameters
20.0
15.0
10.0
5.0
25.0
20.0
15.0
10.0
5.0
S21
S21
0.0
0.0
S22
-5.0
-5.0
S22
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
S11
S12
S11
S12
910.0
920.0
930.0
940.0
950.0
960.0
970.0
1800.0 1810.0 1820.0 1830.0 1840.0 1850.0 1860.0 1870.0 1880.0
Frequency (MHz)
Frequency (MHz)
RF3807414 Evaluation Board S-Parameters
RF3807415 Evaluation Board S-Parameters
25.0
20.0
15.0
10.0
5.0
25.0
20.0
15.0
10.0
5.0
S21
S21
0.0
0.0
-5.0
S22
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
S22
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
S11
S12
S11
S12
1930.0
1940.0
1950.0
1960.0
1970.0
1980.0
1990.0
2110.0
2120.0
2130.0
2140.0
2150.0
2160.0
2170.0
Frequency (MHz)
Frequency (MHz)
4-638
Rev A4 050912
RF3807
RF3807415 Junction Temperature @ 2140MHz
Thermal Resistance of RF3807 @ 2.14 GHz
165.0
160.0
155.0
150.0
145.0
140.0
135.0
130.0
125.0
120.0
115.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
13.0
15.0
17.0
19.0
21.0
23.0
25.0
27.0
29.0
31.0
POUT (dB)
POUT (dBm)
Rev A4 050912
4-639
RF3807
4-640
Rev A4 050912
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