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RF6555PCK-410 [RFMD]

2.0V TO 3.6V, 2.4GHz FRONT END MODULE;
RF6555PCK-410
型号： RF6555PCK-410
厂家： RF MICRO DEVICES    RF MICRO DEVICES
描述：

2.0V TO 3.6V, 2.4GHz FRONT END MODULE
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RFMD + TriQuint = Qorvo  
RF6555  
RF6555  
2.0V TO 3.6V, 2.4GHz FRONT END MODULE  
Package: Laminate, 24-Pin,  
5mm x 5mm x 1mm  
The RF6555 integrates a complete solution in a single Front  
End Module (FEM) for WiFi and ZigBee® applications in the  
2.4GHz to 2.5GHz band. This FEM integrates the PA plus  
harmonic filter in the transmit path. The RF6555 also has an  
integrated LNA with bypass mode internally. The RF6555  
provides a single balanced TDD access for Rx and Tx paths  
along with two ports on the output for connecting a diversity  
solution or a test port. The device is provided in a 5mm x 5mm  
x 1mm, 24-pin laminate package.  
Features  
■
Tx Output Power = 18dBm  
■
Integrated RF Front End Module  
with Rx Balun, PA, Filter, LNA with  
Bypass Mode, and DP2T Switch  
■
■
Single Bidirectional Differential  
Transceiver Interface.  
Voltage Range = 2.0V to 3.6V  
Applications  
■
ZigBee® 802.15.4 Based Systems  
for Remote Monitoring and Control  
■
■
■
■
Set-top Boxes  
AA Battery Operation  
2.4GHz ISM Band Applications  
Smart Meters for Energy  
Management  
Functional Block Diagram  
Ordering Information  
RF6555SB  
Standard 5-piece sample bag  
Standard 25-piece sample bag  
Standard 100-piece reel  
RF6555SQ  
RF6555SR  
RF6555TR13  
RF6555PCK-410  
Standard 2500-piece reel  
Fully assembled eval board w/ 5-piece sample bag  
1 of 10  
Revision DS20150615  
Disclaimer: Subject to change without notice  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
Absolute Maximum Ratings  
Caution! ESD sensitive device.  
Parameter  
Rating  
Unit  
DC Supply Voltage  
5.0  
150  
V
mA  
ºC  
ºC  
V
DC Supply Current  
Operating Case Temperature  
Storage Temperature  
-40 to +85  
-40 to +150  
1000  
RFMD Green: RoHS status based on EU  
Directive 2011/65/EU (at time of this  
document revision), halogen free per IEC  
61249-2-21, < 1000ppm each of  
antimony trioxide in polymeric materials  
and red phosphorus as a flame retardant,  
and <2% antimony in solder.  
ESD Human Body Model RF Pins  
ESD Human Body Model All Other Pins  
ESD Charge Device Model All Pins  
Moisture Sensitivity Level  
Maximum Tx Input Power  
Maximum Rx Input Power  
500  
V
500  
V
Exceeding any one or a combination of the Absolute  
Maximum Rating conditions may cause permanent  
damage to the device. Extended application of Absolute  
Maximum Rating conditions to the device may reduce  
device reliability. Specified typical performance or  
functional operation of the device under Absolute  
Maximum Rating conditions is not implied.  
MSL 2  
+5  
dBm  
dBm  
+8  
Nominal Operating Parameters  
Specification  
Parameter  
Unit  
Condition  
Min  
Typ  
Max  
Parameter  
VBATT  
2.0  
-40  
3.0  
+25  
50  
3.6  
VDC  
ºC  
Ω
Operating Temperature Range  
ZO  
+85  
Off Mode Current  
Storage Temperature  
ESD, HBM  
0.05  
1.0  
µA  
°C  
V
All logic low, Temp = 25°C; Over Voltage.  
-40  
1000  
500  
+150  
RF pins  
ESD, HBM  
V
All other pins  
All pins  
ESD, CDM  
500  
V
MSL  
MSL3  
Current Sourced through CT Pin  
Voltage Drop from CT Pin to RXP/RXN  
Tx Path  
18  
mA  
V
0.1  
Frequency  
2405  
10  
2480  
MHz  
dB  
Input Return Loss  
Output Return Loss  
Gain  
Pins 5, 6 (RFM, RFP) 100Ω differential  
10  
dB  
22  
25  
dB  
2.7V to 3.6V  
21  
dB  
VCC=2.0V; Temp=25oC  
Gain Flatness  
-0.8  
+0.8  
dB  
Rated Output Power  
20  
18  
16  
14  
dBm  
dBm  
dBm  
dBm  
Nominal conditions (VB=3.3 to 3.6, All Temp)  
Nominal conditions (VB=3.0 to 3.3, All Temp)  
Nominal conditions (VB=2.7, All Temp)  
Nominal conditions (VB=2.0, All Temp)  
Saturated Output Power  
Supply Current  
22  
20  
dBm  
dBm  
mA  
VB=3.6, Temp = 25C  
VB=3.0, Temp = 25C  
110  
125  
PO =21dBm 802.15.4 OQPSK (VB=3.6, All Temp)  
105  
70  
120  
95  
mA  
mA  
PO =20dBm 802.15.4 OQPSK (VB=3.0, All Temp)  
PO =18dBm 802.15.4 OQPSK (VB=3.0, All Temp)  
Revision DS20150615  
Disclaimer: Subject to change without notice  
2 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
Specification  
Typ  
Parameter  
Unit  
Condition  
Min  
Max  
50  
78  
mA  
oC/W  
PO =14dBm 802.15.4 OQPSK (VB=2.0, All Temp)  
VCC = 3.0V, POUT = 18dBm, TREF = 85oC  
At 18dBm, VCC = 3.0V to 3.6V  
Thermal Resistance  
Harmonics 2f0 to 5f0  
-45  
-42  
dBm/MHz  
VSWR Stability and Load  
VSWR No Damage  
Gain Settling Time  
Rx Path  
4:1  
8:1  
1
10  
µS  
Frequency  
2405  
8.5  
2480  
13  
MHz  
Gain  
11  
3
dB  
dB  
Noise Figure  
Current  
Temp = 25°C; over voltage and frequency  
Nominal conditions  
8
12  
mA  
dBm  
dB  
IIP3  
7
Gain Flatness  
Input Return Loss  
Output Return Loss  
-0.5  
10  
+0.5  
15  
dB  
10  
dB  
Pins 5, 6 (RFM, RFP) 100Ω differential  
Amplitude Imbalance  
Phase Imbalance  
-1  
-15  
5
+1  
dB  
dB  
+15  
Maximum Input Power  
dBm  
Bypass Mode  
Frequency  
2405  
2480  
6.5  
MHz  
dB  
Insertion Loss/Noise Figure  
Current  
5
SW1dB, Bypass 2.5dB, Balun 1.5dB  
50  
23  
µA  
IIP3  
dBm  
dB  
Gain Flatness  
Input Return Loss  
Output Return Loss  
-0.5  
10  
10  
-1  
0.5  
12  
dB  
dB  
Pins 5, 6 (RFM, RFP) 100Ω differential  
+1  
dB  
Amplitude Imbalance  
Phase Imbalance  
-15  
10  
+15  
dB  
dBm  
Maximum Input Power  
Logic  
Logic Level “HIGH” Input Voltage  
Logic Level “LOW” Input Voltage  
Input Source Current at Logic “HIGH”  
Switch Leakage Current at Logic “LOW”  
Antenna Switch  
VBATT -0.2  
0.0  
VBATT  
0.2  
10  
V
V
5
µA  
µA  
1
RF to Control Isolation  
ANT1 to ANT2 Isolation  
T/R Switching Time  
50  
20  
dB  
dB  
µS  
1
Revision DS20150615  
Disclaimer: Subject to change without notice  
3 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
Control Logic Table  
Mode  
CE  
C_RX_TX  
C_LNA  
ANTSEL  
TX-ANT1  
High  
High  
High  
High  
High  
High  
Low  
High  
High  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
Low  
High  
Low  
High  
Low  
Low  
High  
Low  
Low  
High  
High  
Low  
TX-ANT2  
RX-ANT1 LNA  
RX-ANT1 BYP  
RX-ANT2 LNA  
RX-ANT2 BYP  
Power Down  
Revision DS20150615  
Disclaimer: Subject to change without notice  
4 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
Applications Schematic  
C_LNA  
VCC  
C_Rx_Tx  
ANT SEL  
24 23 22 21 20  
1
2
3
4
5
6
7
19  
18  
17  
16  
15  
14  
13  
CE  
J3  
ANT2  
50Ω µstrip  
50Ω µstrip  
U1  
RF6555  
CT  
50Ω µstrip  
50Ω µstrip  
J2  
ANT1  
U2  
4
5
6
3
2
1
BALUN  
2450MHz  
50Ω - 100Ω  
8
9
10 11 12  
J1  
RF_COM  
50Ω µstrip  
C1  
0.1µF  
(0402)  
VCC  
Revision DS20150615  
© 2015 RF Micro Devices, Inc.  
Disclaimer: Subject to change without notice  
5 of 10  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
Pin Out  
Revision DS20150615  
Disclaimer: Subject to change without notice  
6 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
Package Drawing  
Revision DS20150615  
Disclaimer: Subject to change without notice  
7 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
PCB Patterns  
Thermal vias for center slug “D” should be incorporated into the PCB design. The number and size of thermal vias will depend  
on the application, power dissipation and electrical requirements. Example of the number and size of vias can be found on the  
RFMD evaluation board layout (gerber files are available upon request).  
Revision DS20150615  
Disclaimer: Subject to change without notice  
8 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
RF6555 2.4 GHz Front End Module  
Revision DS20150615  
Disclaimer: Subject to change without notice  
9 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  
RF6555  
RFMD + TriQuint = Qorvo  
Pin Names and Descriptions  
Pin  
Name  
GND  
Description  
Ground.  
1
2
CE  
Control voltage pin for chip enable. See logic table.  
Ground.  
GND  
3
CT  
Center tap for passing DC voltage to RFN/RFP pins that connect to the TXVR SoIC.  
4
RFN  
Differential bi-directional RF port. Matched to 50Ω single-ended, 100Ω differential.  
5
RFP  
Differential bi-directional RF port. Matched to 50Ω single-ended, 100Ω differential.  
6
GND  
Ground.  
7
VCC_DIG  
GND  
Voltage supply pin for digital logic circuitry.  
8
Ground.  
9
VCC_PA  
N/C  
Voltage supply pin for Tx power amplifier.  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Not connected.  
GND  
Ground.  
GND  
Ground.  
GND  
Ground.  
ANT1  
GND  
Antenna port 1. Match to 50Ω and DC blocked internally.  
GND Ground.  
ANT2  
GND  
Antenna port 2. Matched to 50Ω and DC blocked internally.  
Ground.  
GND  
Ground.  
ANTSEL  
N/C  
Control pin for antenna selection. See logic table.  
Not connected.  
VCC_LNA  
C_LNA  
C_RX_TX  
Voltage supply pin for Rx low noise amplifier.  
Control voltage for pin for LNA/bypass modes. See logic table.  
Control voltage pin for Tx/Rx modes. See logic table.  
Revision DS20150615  
Disclaimer: Subject to change without notice  
10 of 10  
© 2015 RF Micro Devices, Inc.  
www.rfmd.com / www.qorvo.com  

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