RT9166-25GVL [RICHTEK]
IC REG LIN 2.5V 300MA SOT23-3L;
| 型号： | RT9166-25GVL |
| 厂家： | 
RICHTEK TECHNOLOGY CORPORATION |
| 描述： | IC REG LIN 2.5V 300MA SOT23-3L |
| 文件： | 总15页 (文件大小：236K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
RT9166/A
300/600mA, Ultra-Fast Transient Response LDO Regulator
General Description
Features
z Low Quiescent Current (Typically 220μA)
z Guaranteed 300/600mA Output Current
z Low Dropout Voltage : 230/580mV at 300/600mA
z Wide Operating Voltage Ranges : 3V to 5.5V
z Ultra-Fast Transient Response
The RT9166/A series are CMOS low dropout regulators
optimized for ultra-fast transient response. The devices
are capable of supplying 300mAor 600mA of output current
with a dropout voltage of 230mV or 580mV respectively.
The RT9166/Aseries are is optimized for CD/DVD-ROM,
CD/RW or wireless communication supply applications.
The RT9166/Aregulators are stable with output capacitors
as low as 1μF. The other features include ultra low dropout
voltage, high output accuracy, current limiting protection,
and high ripple rejection ratio.
z Tight Load and Line Regulation
z Current Limiting Protection
z Thermal Shutdown Protection
z Only Low-ESR Ceramic Capacitor Required for
Stability
z Custom Voltage Available
The devices are available in fixed output voltages range of
1.2V to 4.5V with 0.1V per step. The RT9166/A regulators
are available in 3-lead SOT-23 (RT9166 only), SOT-89,
SOT-223, TO-92 andTO-252 packages.
z RoHS Compliant and 100% Lead (Pb)-Free
Applications
z CD/DVD-ROM, CD/RW
z Wireless LAN Card/Keyboard/Mouse
z Battery-Powered Equipment
z XDSL Router
Ordering Information
RT9166/A-
Package Type
z PCMCIA Card
VL : SOT-23-3 (L-Type) (RT9166 Only)
X : SOT-89
XL : SOT-89 (L-Type)
G : SOT-223
Marking Information
GL : SOT-223 (L-Type)
Z : TO-92
L : TO-252
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Pin Configurations
(TOP VIEW)
Output Voltage
12 : 1.2V
13 : 1.3V
:
VIN
3
45 : 4.5V
1B : 1.25V
2
GND
VOUT
600mA Output Current
300mA Output Current
SOT-23-3 (L-Type) (RT9166)
Note :
3
VOUT
GND
VIN
Richtek products are :
2
1
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
TO-92
Copyright 2012 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
DS9166/A-23 June 2012
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RT9166/A
1
2
3
1
2
3
1
2
3
1
1
3
2
3
2
GND
GND
VOUT
GND VIN
(TAB)
VIN
(TAB)
VOUT
VOUT
GND
VIN
(TAB)
VOUT GND
(TAB)
VIN
VOUT
VIN
SOT-89
SOT-89 (L-Type)
SOT-223
SOT-223 (L-Type)
TO-252
Typical Application Circuit
RT9166/A
V
VIN
VOUT
GND
V
IN
OUT
C
C
OUT
IN
1uF
1uF
Note: To prevent oscillation, a 1μF minimum X7R or X5R dielectric is strongly recommended if ceramics are
used as input/output capacitors. When using the Y5V dielectric, the minimum value of the input/output
capacitance that can be used for stable over full operating temperature range is 3.3μF. (see Application
Information Section for further details)
Functional Pin Description
Pin Name
Pin Function
VIN
Supply Input.
VOUT
GND
Regulator Output.
Common Ground.
Function Block Diagram
VIN
VOUT
Error
Amplifier
Current
Limiting
Sensor
-
Thermal
Shutdown
1.2V
Reference
GND
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DS9166/A-23 June 2012
RT9166/A
Absolute Maximum Ratings (Note 1)
z Supply Input Voltage------------------------------------------------------------------------------------------------- 6.5V
z Power Dissipation, PD @ T = 25°C
A
SOT-23-3 --------------------------------------------------------------------------------------------------------------- 0.4W
SOT-89 ------------------------------------------------------------------------------------------------------------------ 0.571W
SOT-223 ---------------------------------------------------------------------------------------------------------------- 0.740W
TO-252 ------------------------------------------------------------------------------------------------------------------ 1.470W
z Package Thermal Resistance (Note 2)
SOT-23-3, θJA ---------------------------------------------------------------------------------------------------------- 250°C/W
SOT-89, θJA ------------------------------------------------------------------------------------------------------------ 175°C/W
SOT-89, θJC ------------------------------------------------------------------------------------------------------------ 58°C/W
SOT-223, θJA ----------------------------------------------------------------------------------------------------------- 135°C/W
SOT-223, θJC ---------------------------------------------------------------------------------------------------------- 15°C/W
TO-252, θJA ------------------------------------------------------------------------------------------------------------ 68°C/W
TO-252, θJC ------------------------------------------------------------------------------------------------------------ 7°C/W
z Lead Temperature (Soldering, 10 sec.)-------------------------------------------------------------------------- 260°C
z Junction Temperature ------------------------------------------------------------------------------------------------ 150°C
z Storage Temperature Range --------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model)----------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions (Note 4)
z Supply Input Voltage------------------------------------------------------------------------------------------------- 2.8V to 5.5V
z Junction Temperature Range--------------------------------------------------------------------------------------- − 40°C to 125°C
z Ambient Temperature Range--------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = VOUT + 1V or VIN = 2.8V whichever is greater, CIN = 1μF, COUT = 1μF, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
= 1mA
OUT
Min
−1
300
600
--
Typ
--
Max
3
Unit
Output Voltage Accuracy
ΔV
I
%
OUT
RT9166
--
--
Current Limit
I
R = 1Ω
LOAD
mA
μA
LIM
RT9166A
--
--
Quiescent Current (Note 5)
I
I
= 0mA
220
230
580
300
--
Q
OUT
RT9166
I
I
= 300mA
= 600mA
--
OUT
OUT
Dropout Voltage
(Note 6)
V
DROP
mV
RT9166A
--
--
V
= (V
= 1mA
+ 0.3V) to 5.5V,
OUT
IN
Line Regulation
ΔV
ΔV
--
0.2
--
%/V
mV
LINE
I
OUT
RT9166
1mA < I
1mA < I
< 300mA
< 600mA
= 1μF
--
--
--
--
--
15
30
35
55
--
OUT
OUT
Load Regulation
(Note 7)
LOAD
RT9166A
Power Supply Rejection Rate
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
PSRR
f = 1kHz, C
−55
170
40
dB
°C
°C
OUT
T
--
SD
ΔT
--
SD
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RT9166/A
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under
no load condition (IOUT = 0mA). The total current drawn from the supply is the sum of the load current plus the ground
pin current.
Note 6.The dropout voltage is defined as VIN − VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
Note 7. Regulation is measured at constant junction temperature by using a 20ms current pulse. Devices are tested for load
regulation in the load range from 1mA to 300mA and 600mA respectively.
Copyright 2012 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
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DS9166/A-23 June 2012
RT9166/A
Typical Operating Characteristics
Dropout Voltage vs. Load Current
Power Supply Rejection Ratio
700
0
-10
-20
-30
-40
-50
-60
CIN = 1uF
COUT = 1uF
VIN = 5V
CIN = 1uF
COUT = 1uF
TJ = 125°C
600
500
TJ = 25°C
400
300
100mA
TJ = −40°C
200
1mA
100
0
10
100
1k
10k
100k
1M
0
100
200
300
400
500
600
Frequency (Hz)
Load Current (mA)
Output Noise
Region of Stable COUT ESR vs. Load Current
100.00
I
LOAD = 100mA
COUT = 1uF
VIN = 5V
CIN = 1uF
COUT = 1uF to 4.7uF
10.00
1.00
0.10
0.01
0.00
400
Instable
200
0
Stable
-200
-400
Instable
f = 10Hz to 100KHz
Time (1ms/DIV)
0
100
200
300
400
500
600
Load Current (mA)
Current Limit vs. Input voltage
Current Limit vs. Input voltage
900
850
800
750
700
900
850
800
750
700
VIN = 5V
CIN = 1uF
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5Ω
COUT = 1uF
RL = 0.5Ω
RT9166-33xX
5.5
RT9166-33xVL
5.5
3
3.5
4
4.5
5
3
3.5
4
4.5
5
Input voltage (V)
Input voltage (V)
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RT9166/A
Current Limit vs. Temperature
Current Limit vs. Temperature
900
850
800
750
700
900
850
800
750
700
VIN = 5V
VIN = 5V
CIN = 1uF
COUT = 1uF
RL = 0.5Ω
CIN = 1uF
COUT = 1uF
RL = 0.5Ω
RT9166-33xX
75 100 125
RT9166-33xVL
75 100 125
-40
-25
0
25
50
-50
-40
-25
0
25
50
Temperature (°C)
Temperature (°C)
Quiescent Current vs. Temperature
Quiescent Current vs. Temperature
260
240
220
200
180
160
140
260
240
220
200
180
160
140
VIN = 5V
CIN = 1uF
COUT = 1uF
VIN = 5V
CIN = 1uF
COUT = 1uF
RT9166-33xX
75 100 125
RT9166-33xVL
75 100 125
-40
-25
0
25
50
-40
-25
0
25
50
Temperature (°C)
Temperature (°C)
Temperature Stability
Temperature Stability
3.40
3.35
3.30
3.25
3.20
3.40
3.35
3.30
3.25
3.20
VIN = 5V
CIN = 1uF
COUT = 1uF
VIN = 5V
CIN = 1uF
COUT = 1uF
RT9166-33xX
75 100 125
RT9166-33xVL
75 100 125
-40
-25
0
25
50
-40
-25
0
25
50
Temperature (°C)
Temperature (°C)
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DS9166/A-23 June 2012
RT9166/A
Load Transient Response
Load Transient Response
VIN = 5V, ILOAD = 1 to 150mA
VIN = 5V, ILOAD = 1 to 150mA
CIN = COUT = 1uF (Ceramic, X7R)
CIN = COUT = 1uF (Ceramic, X7R)
200
100
0
200
100
0
20
0
20
0
-20
-20
RT9166-33xX
RT9166-33xVL
Time (100μs/Div)
Time (100μs/Div)
Line Transient Response
VIN = 4 to 5V
CIN = 1uF
COUT = 1uF
5
4
20
0
-20
Time (100μs/Div)
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RT9166/A
Application Information
No Load Stability
Like any low-dropout regulator, the RT9166/A series
requires input and output decoupling capacitors. These
capacitors must be correctly selected for good performance
(see Capacitor Characteristics Section). Please note that
linear regulators with a low dropout voltage have high
internal loop gains which require care in guarding against
oscillation caused by insufficient decoupling capacitance.
The device will remain stable and in regulation with no
external load. This is specially important in CMOS RAM
keep-alive applications.
Input-Output (Dropout) Voltage
A regulator's minimum input-to-output voltage differential
(dropout voltage) determines the lowest usable supply
voltage. In battery-powered systems, this determines the
useful end-of-life battery voltage. Because the device uses
a PMOS, its dropout voltage is a function of drain-to-
source on-resistance, RDS(ON), multiplied by the load
current :
Input Capacitor
An input capacitance of ≅ 1μF is required between the
device input pin and ground directly (the amount of the
capacitance may be increased without limit). The input
capacitor MUST be located less than 1 cm from the device
to assure input stability (see PCB Layout Section).Alower
ESR capacitor allows the use of less capacitance, while
higher ESR type (like aluminum electrolytic) require more
capacitance.
VDROPOUT = VIN − VOUT = RDS(ON) x IOUT
Current Limit
The RT9166/A monitors and controls the PMOS' gate
voltage, minimum limiting the output current to 300mA for
RT9166 and 600mA for RT9166A. The output can be
shorted to ground for an indefinite period of time without
damaging the part.
Capacitor types (aluminum, ceramic and tantalum) can
be mixed in parallel, but the total equivalent input
capacitance/ESR must be defined as above to stable
operation.
There are no requirements for the ESR on the input
capacitor, but tolerance and temperature coefficient must
be considered when selecting the capacitor to ensure the
capacitance will be ≅ 1μF over the entire operating
temperature range.
Short-Circuit Protection
The device is short circuit protected and in the event of a
peak over-current condition, the short-circuit control loop
will rapidly drive the output PMOS pass element off. Once
the power pass element shuts down, the control loop will
rapidly cycle the output on and off until the average power
dissipation causes the thermal shutdown circuit to
respond to servo the on/off cycling to a lower frequency.
Please refer to the section on thermal information for power
dissipation calculations.
Output Capacitor
The RT9166/A is designed specifically to work with very
small ceramic output capacitors. The recommended
minimum capacitance (temperature characteristics X7R
or X5R) is 1μF to 4.7μF range with 10mΩ to 50mΩ range
ceramic capacitor between LDO output and GND for
transient stability, but it may be increased without limit.
Higher capacitance values help to improve transient. The
output capacitor's ESR is critical because it forms a zero
to provide phase lead which is required for loop stability.
(When using the Y5V dielectric, the minimum value of
the input/output capacitance that can be used for stable
over full operating temperature range is 3.3μF.)
Capacitor Characteristics
It is important to note that capacitance tolerance and
variation with temperature must be taken into consideration
when selecting a capacitor so that the minimum required
amount of capacitance is provided over the full operating
temperature range. In general, a good tantalum capacitor
will show very little capacitance variation with temperature,
but a ceramic may not be as good (depending on dielectric
type).
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DS9166/A-23 June 2012
RT9166/A
Aluminum electrolytics also typically have large
temperature variation of capacitance value.
The increasing ESR at lower temperatures can cause
oscillations when marginal quality capacitors are used (if
the ESR of the capacitor is near the upper limit of the
stability range at room temperature).
Equally important to consider is a capacitor's ESR change
with temperature: this is not an issue with ceramics, as
their ESR is extremely low. However, it is very important
in Tantalum and aluminum electrolytic capacitors. Both
show increasing ESR at colder temperatures, but the
increase in aluminum electrolytic capacitors is so severe
they may not be feasible for some applications.
Aluminum :
This capacitor type offers the most capacitance for the
money. The disadvantages are that they are larger in
physical size, not widely available in surface mount, and
have poor AC performance (especially at higher
frequencies) due to higher ESR and ESL.
Ceramic :
Compared by size, the ESR of an aluminum electrolytic
is higher than either Tantalum or ceramic, and it also varies
greatly with temperature. A typical aluminum electrolytic
can exhibit an ESR increase of as much as 50X when
going from 25°C down to −40°C.
For values of capacitance in the 10μF to 100μF range,
ceramics are usually larger and more costly than tantalums
but give superior AC performance for by-passing high
frequency noise because of very low ESR (typically less
than 10mΩ). However, some dielectric types do not have
good capacitance characteristics as a function of voltage
and temperature.
It should also be noted that many aluminum electrolytics
only specify impedance at a frequency of 120Hz, which
indicates they have poor high frequency performance. Only
aluminum electrolytics that have an impedance specified
at a higher frequency (between 20kHz and 100kHz) should
be used for the device. Derating must be applied to the
manufacturer's ESR specification, since it is typically only
valid at room temperature.
Z5U and Y5V dielectric ceramics have capacitance that
drops severely with applied voltage. Atypical Z5U or Y5V
capacitor can lose 60% of its rated capacitance with half
of the rated voltage applied to it. The Z5U and Y5V also
exhibit a severe temperature effect, losing more than 50%
of nominal capacitance at high and low limits of the
temperature range.
Any applications using aluminum electrolytics should be
thoroughly tested at the lowest ambient operating
temperature where ESR is maximum.
X7R and X5R dielectric ceramic capacitors are strongly
recommended if ceramics are used, as they typically
maintain a capacitance range within 20% of nominal over
full operating ratings of temperature and voltage. Of course,
they are typically larger and more costly than Z5U/Y5U
types for a given voltage and capacitance.
Thermal Considerations
Thermal protection limits power dissipation in RT9166/A.
When the operation junction temperature exceeds 170°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 40°C.
Tantalum :
Solid tantalum capacitors are recommended for use on
the output because their typical ESR is very close to the
ideal value required for loop compensation. They also work
well as input capacitors if selected to meet the ESR
requirements previously listed.
For continuous operation, do not exceed absolute
maximum operation junction temperature. The power
dissipation definition in device is :
PD = (VIN − VOUT) x IOUT + VIN x IQ
Tantalums also have good temperature stability : a good
quality tantalum will typically show a capacitance value
that varies less than 10 to 15% across the full temperature
range of 125°C to −40°C. ESR will vary only about 2X
going from the high to low temperature limits.
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
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RT9166/A
be calculated by following formula :
PCB Layout
Good board layout practices must be used or instability
can be induced because of ground loops and voltage drops.
The input and output capacitors MUST be directly
connected to the input, output, and ground pins of the
device using traces which have no other currents flowing
through them.
PD (MAX) = (TJ(MAX) − TA) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TAis the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification,
where TJ(MAX) is the maximum junction temperature of the
die (125°C) and TA is the operated ambient temperature.
The junction to ambient thermal resistance θJA is layout
dependent. For SOT-23-3 packages, the thermal
resistance θJA is 250°C/W on the standard JEDEC 51-3
single-layer thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by following
formula :
The best way to do this is to layout CIN and COUT near the
device with short traces to the VIN, VOUT, and ground pins.
The regulator ground pin should be connected to the
external circuit ground so that the regulator and its
capacitors have a “single point ground”.
It should be noted that stability problems have been seen
in applications where “vias” to an internal ground plane
were used at the ground points of the device and the input
and output capacitors. This was caused by varying ground
potentials at these nodes resulting from current flowing
through the ground plane. Using a single point ground
technique for the regulator and it’ s capacitors fixed the
problem. Since high current flows through the traces going
into VIN and coming from VOUT, Kelvin connect the capacitor
leads to these pins so there is no voltage drop in series
with the input and output capacitors.
PD (MAX) = ( 125°C − 25°C) / 250°C/W = 0.400W for
SOT-23-3 packages
PD (MAX) = ( 125°C − 25°C) / 175°C/W = 0.571W for
SOT-89 packages
PD (MAX) = ( 125°C − 25°C) / 135°C/W = 0.740W for
SOT-223 packages
PD (MAX) = ( 125°C − 25°C) / 68°C/W = 1.470W for
TO-252 packages
Optimum performance can only be achieved when the
device is mounted on a PC board according to the diagram
below :
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. Figure 1 of derating curves allows the
designer to see the effect of rising ambient temperature
on the maximum power allowed.
V
1500
IN
Single Layer PCB
1400
1300
1200
1100
1000
900
TO-252
800
700
600
GND
SOT-223
500 SOT-89
400
300
200
100
0
V
OUT
SOT-23-3
Figure 2. SOT-23-3 Board Layout
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 1. Derating Curve of Maximum PowerDissipation
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DS9166/A-23 June 2012
RT9166/A
Outline Dimension
H
D
L
C
B
e
b
A
A1
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
A1
B
0.889
0.000
1.397
0.356
2.591
2.692
1.803
0.080
0.300
1.295
0.152
1.803
0.508
2.997
3.099
2.007
0.254
0.610
0.035
0.000
0.055
0.014
0.102
0.106
0.071
0.003
0.012
0.051
0.006
0.071
0.020
0.118
0.122
0.079
0.010
0.024
b
C
D
e
H
L
SOT-23-3 Surface Mount Package
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RT9166/A
D
D1
A
B
C
C1
e
e
H
A
b
b
b1
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
b
1.397
0.356
2.388
0.406
3.937
0.787
4.394
1.397
1.448
0.356
1.600
0.483
2.591
0.533
4.242
1.194
4.597
1.753
1.549
0.432
0.055
0.014
0.094
0.016
0.155
0.031
0.173
0.055
0.057
0.014
0.063
0.019
0.102
0.021
0.167
0.047
0.181
0.069
0.061
0.017
B
b1
C
C1
D
D1
e
H
3-Lead SOT-89 Surface Mount Package
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DS9166/A-23 June 2012
RT9166/A
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
1.800
0.100
0.840
3.700
7.300
6.700
3.100
Min
Max
A
A1
b
1.400
0.020
0.600
3.300
6.700
6.300
2.900
0.055
0.001
0.071
0.004
0.033
0.146
0.287
0.264
0.122
0.024
0.130
0.264
0.248
0.114
B
C
D
b1
e
2.300
0.091
H
0.230
1.500
0.800
0.350
2.000
1.100
0.009
0.059
0.031
0.014
0.079
0.043
L
L1
3-Lead SOT-223 Surface Mount Package
Copyright 2012 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
DS9166/A-23 June 2012
www.richtek.com
13
RT9166/A
D
U
C
D1
R
B
T
V
S
E
L1
L3
e
b1
L2
b
b2
A
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
2.388
2.032
0.889
Min
Max
0.094
0.080
0.035
0.086
0.035
0.020
A
B
2.184
0.889
0.508
b
b1
b2
C
1.016 Ref.
0.040 Ref.
0.457
0.457
6.350
5.207
5.334
2.108
9.398
0.584
0.584
6.731
5.461
6.223
2.438
0.018
0.018
0.250
0.205
0.210
0.083
0.370
0.023
0.023
0.265
0.215
0.245
0.096
0.410
D
D1
E
e
L1
L2
L3
U
10.414
0.508 Ref.
0.020 Ref.
0.025
0.040
0.635
1.016
3.810 Ref.
3.048 Ref.
0.150 Ref.
0.120 Ref.
V
R
0.200
2.500
0.500
0.850
3.400
0.850
0.008
0.098
0.020
0.033
0.134
0.033
S
T
3-Lead TO-252 Surface Mount Package
Copyright 2012 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
14
DS9166/A-23 June 2012
RT9166/A
A
D
E
L
b
C
e
D1
A1
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
0.125
0.045
0.016
0.016
0.175
0.135
0.170
0.045
0.165
0.054
0.021
0.021
0.205
0.198
0.210
0.055
A
A1
b
3.175
1.143
0.406
0.406
4.445
3.429
4.318
1.143
4.191
1.372
0.533
0.533
5.207
5.029
5.334
1.397
C
D
D1
E
e
12.700
0.500
L
3-Lead TO-92 Plastic Package
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS9166/A-23 June 2012
www.richtek.com
15
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