ICL3207EIA [ROCHESTER]

Line Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO24, PLASTIC, MO-150-AG, SSOP-24;
ICL3207EIA
型号: ICL3207EIA
厂家: Rochester Electronics    Rochester Electronics
描述:

Line Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO24, PLASTIC, MO-150-AG, SSOP-24

驱动 光电二极管 接口集成电路 驱动器
文件: 总13页 (文件大小:1406K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ICL3207E, ICL3217E  
TM  
Data Sheet  
November 2001  
File Number 4914.4  
+/- 15kV ESD Protected, +3V to +5.5V, Low  
Power, 250kbps, RS-232  
Features  
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC1000)  
Transmitters/Receivers  
• 5V Lower Power Replacement for MAX207E, HIN207E,  
HIN237E  
The Intersil ICL32X7E devices are 3V to 5.5V powered  
RS-232 transmitters (five)/receivers (three) which meet  
ElA/TIA-232 and V.28/V.24 specifications, even at  
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V  
• Latch-Up Free  
V
= 3.0V. Additionally, they provide ±15kV ESD protection  
• On-Chip Voltage Converters Require Only Four External  
CC  
(IEC 1000-4-2 Air Gap) and ±15kV Human Body Model  
protection on transmitter outputs and receiver inputs  
(RS-232 pins). Targeted applications are ISDN Terminal  
Adaptors, PDAs, Palmtops, peripherals, and notebook and  
laptop computers where the low operational, and even lower  
standby, power consumption is critical. The ICL3217E’s  
efficient on-chip charge pumps, coupled with an automatic  
powerdown function, reduces the standby supply current to  
a 1µA trickle. Small footprint packaging, and the use of  
small, low value capacitors ensure board space savings as  
well. Data rates greater than 250kbps are guaranteed at  
worst case load conditions. This family is fully compatible  
with 3.3V-only systems, mixed 3.3V and 5V systems, and  
5V-only systems, and is a lower power, pin-for-pin  
0.1µF Capacitors  
• Automatic Powerdown (I  
CC  
• Receiver Hysteresis For Improved Noise Immunity  
= 1µA, ICL3217E Only)  
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps  
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs  
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V  
Applications  
• Any System Requiring RS-232 Communication Ports  
- Battery Powered, Hand-Held, and Portable Equipment  
- Laptop Computers, Notebooks, Palmtops  
- Modems, Printers and other Peripherals  
- ISDN Terminal Adaptors and Set Top Boxes  
• Related Literature  
replacement for ‘207E and ‘237E type devices.  
- Technical Brief TB363, Guidelines for Handling and  
Processing Moisture Sensitive Surface Mount  
Devices (SMDs)  
- Application Note AN9863, 3V to +5.5V, 250k-1Mbps,  
RS-232 Transmitters/Receivers  
The ICL3217E features an automatic powerdown function  
which powers down the on-chip power-supply and driver  
circuits. This occurs when an attached peripheral device is  
shut off or the RS-232 cable is removed, conserving system  
power automatically, without changes to the hardware or  
operating system. The ICL3217E powers up again when a  
valid RS-232 voltage is applied to any receiver input.  
Ordering Information  
TEMP.  
RANGE ( C)  
(NOTE 1)  
PART NO.  
o
Table 1 summarizes the features of the devices represented  
by this data sheet, while application Note AN9863  
summarizes the features of each device comprising the  
ICL32XXE 3V family.  
PACKAGE  
24 Ld SSOP  
PKG. NO.  
M24.209  
M24.209  
M24.3  
ICL3207ECA  
ICL3207EIA  
ICL3207ECB  
ICL3207EIB  
ICL3217ECA  
ICL3217EIA  
ICL3217ECB  
ICL3217EIB  
NOTE:  
0 to 70  
-40 to 85  
0 to 70  
24 Ld SSOP  
24 Ld SOIC  
24 Ld SOIC  
24 Ld SSOP  
24 Ld SSOP  
24 Ld SOIC  
24 Ld SOIC  
-40 to 85  
0 to 70  
M24.3  
M24.209  
M24.209  
M24.3  
-40 to 85  
0 to 70  
-40 to 85  
M24.3  
1. Most surface mount devices are available on tape and reel; add  
“-T” to suffix.  
TABLE 1. SUMMARY OF FEATURES  
NO. OF MONITOR  
RX (R  
MANUAL  
POWER-  
DOWN?  
AUTOMATIC  
POWERDOWN  
FUNCTION?  
NO. OF NO. OF  
)
DATA RATE  
(kbps)  
RX ENABLE  
FUNCTION?  
OUTB  
PART NUMBER  
ICL3207E  
TX  
RX  
5
3
0
250  
250  
NO  
NO  
NO  
NO  
NO  
ICL3217E  
5
3
0
YES  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.  
Copyright © Intersil Americas Inc. 2001. All Rights Reserved  
1
ICL3207E, ICL3217E  
Pin Descriptions  
Pinout  
ICL3207E, ICL3217E (SOIC, SSOP)  
PIN  
FUNCTION  
TOP VIEW  
V
System power supply input (3.0V to 5.5V).  
CC  
T3  
T1  
T2  
24 T4  
1
2
3
4
5
6
7
8
9
OUT  
OUT  
OUT  
V+ Internally generated positive transmitter supply (+5.5V).  
V- Internally generated negative transmitter supply (-5.5V).  
OUT  
23 R2  
IN  
R2  
22  
21  
20  
19  
18  
17  
16  
15  
14  
OUT  
GND Ground connection.  
R1  
IN  
T5  
IN  
C1+ External capacitor (voltage doubler) is connected to this lead.  
C1- External capacitor (voltage doubler) is connected to this lead.  
C2+ External capacitor (voltage inverter) is connected to this lead.  
C2- External capacitor (voltage inverter) is connected to this lead.  
R1  
T5  
T4  
T3  
OUT  
OUT  
IN  
T2  
IN  
T1  
IN  
IN  
R3  
R3  
V-  
GND  
OUT  
V
CC  
IN  
T
TTL/CMOS compatible transmitter inputs.  
C1+ 10  
V+ 11  
IN  
C2-  
T
±15kV ESD Protected, RS-232 level (nominally ±5.5V)  
OUT  
transmitter outputs.  
C1- 12  
13 C2+  
R
±15kV ESD Protected, RS-232 compatible receiver inputs.  
IN  
R
TTL/CMOS level receiver outputs.  
OUT  
Typical Operating Circuit  
ICL32X7E  
9
C
(OPTIONAL CONNECTION)  
3
V
CC  
+
0.1µF  
10  
V
11  
15  
C1+  
CC  
+
+
+
+
C †  
V+  
V-  
1
C †  
12  
13  
3
C1-  
C2+  
C †  
2
14  
7
C †  
4
C2-  
T
T
1
2
2
3
T1  
T1  
OUT  
IN  
6
T2  
T2  
OUT  
IN  
T
3
1
18  
19  
21  
T3  
T4  
RS-232  
LEVELS  
T3  
T4  
OUT  
IN  
T
4
24  
20  
OUT  
IN  
TTL/CMOS  
T
5
LOGIC LEVELS  
T5  
T5  
OUT  
IN  
4
5
22  
17  
R1  
R1  
IN  
OUT  
5kΩ  
R
1
2
3
23  
16  
R2  
R3  
R2  
RS-232  
LEVELS  
IN  
OUT  
5kΩ  
5kΩ  
R
R
R3  
IN  
OUT  
GND  
- FOR V = 3.3V, C - C = 0.1µF or 0.22µF  
CC  
CC  
1
4
FOR V  
= 5V, C - C = 0.1µF OR 1µF  
1 4  
8
2
ICL3207E, ICL3217E  
Absolute Maximum Ratings  
Thermal Information  
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V  
Thermal Resistance (Typical, Note 2)  
θ
( C/W)  
CC  
JA  
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V  
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V  
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V  
Input Voltages  
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .  
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .  
Moisture Sensitivity (see Technical Brief TB363)  
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1  
Maximum Junction Temperature (Plastic Package) . . . . . . . 150 C  
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300 C  
(Lead Tips Only)  
75  
100  
o
o
o
T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V  
IN  
o
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V  
IN  
Output Voltages  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V  
T
OUT  
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V + 0.3V  
OUT  
Short Circuit Duration  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous  
CC  
Operating Conditions  
Temperature Range  
ICL32X7ECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C  
ICL32X7EIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
T
OUT  
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table  
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
2. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
Electrical Specifications Test Conditions: V  
= 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.  
Typicals are at T = 25 C  
CC  
1
4
o
A
TEMP  
o
PARAMETER  
TEST CONDITIONS  
( C)  
MIN  
TYP  
MAX  
UNITS  
DC CHARACTERISTICS  
Supply Current, Automatic  
Powerdown  
All R Open (ICL3217E Only)  
25  
25  
-
-
1.0  
0.3  
10  
µA  
IN  
Supply Current,  
All Outputs Unloaded  
1.0  
mA  
Automatic Powerdown Disabled  
TRANSMITTER INPUTS AND RECEIVER OUTPUTS  
Input Logic Threshold Low  
Input Logic Threshold High  
T
Full  
Full  
Full  
Full  
Full  
-
2.0  
2.4  
-
-
0.8  
-
V
V
IN  
IN  
T
V
V
= 3.3V  
= 5.0V  
-
CC  
CC  
-
-
V
Input Leakage Current  
T
±0.01  
±0.05  
±1.0  
±10  
µA  
µA  
IN  
Output Leakage Current  
(ICL3217E Only)  
-
Output Voltage Low  
Output Voltage High  
I
I
= 1.6mA  
= -1.0mA  
Full  
Full  
-
-
0.4  
-
V
V
OUT  
V
-0.6  
CC  
V
-0.1  
CC  
OUT  
AUTOMATIC POWERDOWN (ICL3217E Only)  
Receiver Input Thresholds to  
Enable Transmitters  
ICL3217E Powers Up (Figure 4)  
Full  
Full  
25  
-2.7  
-
-
2.7  
0.3  
-
V
V
Receiver Input Thresholds to  
Disable Transmitters  
ICL3217E Powers Down (Figure 4)  
-0.3  
Receiver Threshold to  
Transmitters Enabled Delay (t  
-
-
100  
30  
µs  
µs  
)
WU  
Receiver Positive or Negative  
Threshold to Transmitters  
Disabled Delay  
25  
-
RECEIVER INPUTS  
Input Voltage Range  
Input Threshold Low  
Full  
25  
25  
25  
25  
-25  
0.6  
0.8  
-
-
25  
-
V
V
V
V
V
V
V
V
V
= 3.3V  
= 5.0V  
= 3.3V  
= 5.0V  
1.2  
1.5  
1.5  
1.8  
CC  
CC  
CC  
CC  
-
Input Threshold High  
2.4  
2.4  
-
3
ICL3207E, ICL3217E  
Electrical Specifications Test Conditions: V  
= 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.  
Typicals are at T = 25 C (Continued)  
CC  
1
4
o
A
TEMP  
o
PARAMETER  
Input Hysteresis  
TEST CONDITIONS  
( C)  
MIN  
TYP  
0.3  
5
MAX  
UNITS  
V
25  
25  
-
-
Input Resistance  
3
7
kΩ  
TRANSMITTER OUTPUTS  
Output Voltage Swing  
Output Resistance  
All Transmitter Outputs Loaded with 3kto Ground  
Full  
Full  
Full  
Full  
±5.0  
±5.4  
10M  
±35  
-
-
V
V
= V+ = V- = 0V, Transmitter Output = ±2V  
300  
-
CC  
Output Short-Circuit Current  
-
-
±60  
±25  
mA  
µA  
Output Leakage Current  
(ICL3217E Only)  
V
= ±12V, V  
= 0V or 3V to 5.5V  
CC  
OUT  
In Automatic Powerdown  
TIMING CHARACTERISTICS  
Maximum Data Rate  
(One Transmitter Switching)  
V
V
V
= 3.15V, C - C = 0.1µF, R = 3kΩ, C = 1000pF  
Full  
Full  
Full  
25  
250  
500  
286  
310  
0.3  
0.3  
200  
100  
15  
-
kbps  
kbps  
kbps  
µs  
CC  
CC  
CC  
1
4
L
L
= 3.0V, C - C = 0.22µF, R = 3kΩ, C = 1000pF  
250  
-
-
1
4
L
L
4.5V, C - C = 0.1µF, R = 3kΩ, C = 1000pF  
250  
1
4
L
L
Receiver Propagation Delay  
Receiver Input to Receiver  
Output, C = 150pF  
t
t
-
-
-
PHL  
PLH  
L
25  
-
µs  
Transmitter Skew  
t
- t  
PHL PLH  
Full  
Full  
25  
-
1000  
500  
30  
30  
ns  
Receiver Skew  
t - t  
PHL PLH  
-
ns  
Transition Region Slew Rate  
V
= 3.3V, R = 3kto 7kΩ,  
C = 200pF to 2500pF  
4
6
V/µs  
V/µs  
CC  
L
L
Measured From +3V to -3V or -3V  
to +3V  
C = 200pF to 1000pF  
25  
15  
L
ESD PERFORMANCE  
RS-232 Pins (T  
, R  
OUT IN  
)
IEC1000-4-2, Air-Gap Discharge Method  
IEC1000-4-2, Contact Discharge Method  
Human Body Model  
25  
25  
25  
25  
-
-
-
-
±15  
±8  
-
-
-
-
kV  
kV  
kV  
kV  
±15  
±2  
All Other Pins  
Human Body Model  
Transmitters  
Detailed Description  
The transmitters are proprietary, low dropout, inverting  
drivers that translate TTL/CMOS inputs to EIA/TIA-232  
output levels. Coupled with the on-chip ±5.5V supplies,  
these transmitters deliver true RS-232 levels over a wide  
range of single supply system voltages.  
The ICL32X7E interface ICs operate from a single +3V to  
+5.5V power supply, guarantee a 250kbps minimum data  
rate, require only four small external 0.1µF capacitors,  
feature low power consumption, and meet all ElA RS-232C  
and V.28 specifications. The circuit is divided into three  
sections: charge pump, transmitters and receivers.  
ICL3217E transmitter outputs disable and assume a high  
impedance state when the device enters the automatic  
powerdown mode. These outputs may be driven to ±12V  
when disabled.  
Charge-Pump  
Intersil’s new ICL32XXE family utilizes regulated on-chip  
dual charge pumps as voltage doublers, and voltage  
inverters to generate ±5.5V transmitter supplies from a V  
Both devices guarantee a 250kbps data rate for full load  
CC  
supply as low as 3V. This allows these devices to maintain  
RS-232 compliant output levels over the ±10% tolerance  
range of 3.3V powered systems. The efficient on-chip power  
supplies require only four small, external 0.1µF capacitors  
conditions (3kand 1000pF), V  
3.0V, with one  
CC  
transmitter operating at full speed. Under more typical  
conditions of V 3.3V, R = 3k, and C = 250pF, one  
CC  
L
L
transmitter easily operates at 800kbps.  
for the voltage doubler and inverter functions at V  
= 3.3V.  
CC  
See the Capacitor Selection section, and Table 3 for  
Transmitter inputs float if left unconnected, and may cause  
increases. Connect unused inputs to GND for the best  
I
CC  
performance.  
capacitor recommendations for other operating conditions.  
The charge pumps operate discontinuously (i.e., they turn off  
as soon as the V+ and V- supplies are pumped up to the  
nominal values), resulting in significant power savings.  
4
ICL3207E, ICL3217E  
Receivers  
V
CC  
The ICL32X7E each contain inverting receivers that convert  
RS-232 signals to CMOS output levels and accept inputs up  
to ±25V while presenting the required 3kto 7kinput  
impedance (see Figure 1) even if the power is off  
TRANSITION  
DETECTOR  
TO  
ICL3217E  
WAKE-UP  
(V  
= 0V). The receivers’ Schmitt trigger input stage uses  
LOGIC  
CC  
hysteresis to increase noise immunity and decrease errors  
due to slow input signal transitions.  
V-  
V
CC  
Receivers on the ICL3207E are always active. The  
ICL3217E receivers disable when in the automatic  
powerdown state, thereby eliminating the possible current  
path through a shutdown peripheral’s input protection diode  
(see Figures 2 and 3).  
R
V
= HI-Z*  
X
OUT  
POWERED  
DOWN  
UART  
T
X
* IN AUTOMATIC  
POWERDOWN  
Low Power Operation  
These 3V devices require a nominal supply current of  
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN  
0.3mA, even at V  
= 5.5V, during normal operation (not in  
CC  
powerdown mode). This is considerably less than the 11mA  
current required by comparable 5V RS-232 devices, allowing  
users to reduce system power simply by replacing the old  
style device with the ICL3207E.  
When replacing a ‘207E or ‘237E device in an existing 5V  
application, it is acceptable to terminate C to V  
as shown  
3
CC  
on the Typical Operating Circuit. Nevertheless, terminate C  
to GND if possible, as slightly better performance results  
from this configuration.  
3
Low Power, Pin Compatible Replacement  
Pin compatibility with existing 5V products (e.g., MAX207E),  
coupled with the wide operating supply range, make the  
ICL32X7E potential lower power, higher performance drop-in  
replacements for existing ‘2X7E 5V applications. As long as  
the ±5V RS-232 output swings are acceptable, the  
Automatic Powerdown (ICL3217E Only)  
Even greater power savings is available by using the  
ICL3217E which features an automatic powerdown function.  
When no valid RS-232 voltages (see Figure 4) are sensed  
on any receiver input for 30µs, the ICL3217E automatically  
enters its powerdown state (see Figure 5). In powerdown,  
supply current drops to 1µA, because the on-chip charge  
ICL32X7E devices should work in most 5V applications.  
V
CC  
pump turns off (V+ collapses to V , V- collapses to GND),  
R
R
CC  
XIN  
XOUT  
and the receiver and transmitter outputs three-state (see  
Table 2). This micro-power mode makes the ICL3217E ideal  
for battery powered and portable applications. Invalid  
receiver levels occur whenever the driving peripheral’s  
outputs are shut off (powered down) or when the RS-232  
interface cable is disconnected. The ICL3217E powers back  
up whenever it detects a valid RS-232 voltage level on any  
receiver input (such as when the RS-232 cable is  
reconnected). The time to recover from automatic  
powerdown mode is typically 100µs.  
-25V V  
+25V  
RIN  
GND V  
V  
CC  
5kΩ  
ROUT  
GND  
FIGURE 1. INVERTING RECEIVER CONNECTIONS  
V
CC  
V
CC  
CURRENT  
FLOW  
V
CC  
V
= V  
CC  
OUT  
TABLE 2. ICL3217E AUTOMATIC POWERDOWN OPERATION  
RS-232 SIGNAL  
Rx  
Tx  
POWERED  
DOWN  
UART  
PRESENT AT  
RECEIVER  
INPUT?  
MODE  
OF  
OUTPUTS OPERATION  
TRANSMITTER RECEIVER  
OUTPUTS  
SHDN = GND  
OLD  
RS-232 CHIP  
GND  
YES  
Active  
Active  
High-Z  
Normal  
Operation  
NO  
High-Z  
Powerdown  
Due to Auto  
Powerdown  
Logic  
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN  
PERIPHERAL  
5
ICL3207E, ICL3217E  
reduces ripple on the transmitter outputs and slightly  
reduces power consumption. C , C , and C can be  
VALID RS-232 LEVEL - ICL3217E IS ACTIVE  
2
3
4
2.7V  
increased without increasing C ’s value, however, do not  
1
INDETERMINATE - POWERDOWN MAY OR  
MAY NOT OCCUR  
increase C without also increasing C , C , and C to  
1
2
3
4
maintain the proper ratios (C to the other capacitors).  
1
0.3V  
When using minimum required capacitor values, make sure  
that capacitor values do not degrade excessively with  
temperature. If in doubt, use capacitors with a larger nominal  
value. The capacitor’s equivalent series resistance (ESR)  
usually rises at low temperatures and it influences the  
amount of ripple on V+ and V-.  
INVALID LEVEL - POWERDOWN OCCURS AFTER 30µs  
-0.3V  
INDETERMINATE - POWERDOWN MAY OR  
MAY NOT OCCUR  
-2.7V  
VALID RS-232 LEVEL - ICL3217E IS ACTIVE  
TABLE 3. REQUIRED CAPACITOR VALUES  
FIGURE 4. DEFINITION OF VALID RS-232 RECEIVER  
LEVELS  
V
(V)  
C (µF)  
C , C , C (µF)  
2 3 4  
CC  
1
3.15 to 3.6  
3.0 to 3.6  
4.5 to 5.5  
3.0 to 5.5  
0.1  
0.22  
0.1  
RECEIVER  
INPUTS  
INVALID  
REGION  
}
0.22  
0.1 to 1.0  
0.22  
0.1 to 1.0  
0.22  
TRANSMITTER  
OUTPUTS  
PWR UP (t  
)
AUTOPWDN  
WU  
Power Supply Decoupling  
In most circumstances a 0.1µF bypass capacitor is  
adequate. In applications that are particularly sensitive to  
power supply noise, decouple V to ground with a  
V+  
V
CC  
0
CC  
capacitor of the same value as the charge-pump capacitor C .  
1
Connect the bypass capacitor as close as possible to the IC.  
V-  
Transmitter Outputs when Exiting  
Powerdown  
FIGURE 5. AUTOMATIC POWERDOWN TIMING DIAGRAM  
This automatic powerdown feature provides additional  
system power savings without changes to the existing  
operating system or hardware.  
Figure 6 shows the response of two ICL3217E transmitter  
outputs when exiting powerdown mode. As they activate, the  
two transmitter outputs properly go to opposite RS-232  
levels, with no glitching, ringing, nor undesirable transients.  
Each transmitter is loaded with 3kin parallel with 2500pF.  
Note that the transmitters enable only when the magnitude  
of the supplies exceed approximately 3V.  
Utilizing power management circuitry, to power down the rest  
of the communication circuitry (e.g., the UART) when the  
ICL3217E powers down, produces even greater power  
savings. Connecting a transition detector to the V- pin (see  
Figure 3) is an easy way for the power management logic to  
determine when the ICL3217E enters and exits powerdown.  
.
5V/DIV  
RX  
IN  
Capacitor Selection  
T1  
The charge pumps require 0.1µF, or greater, capacitors for  
3.3V operation. With 0.1µF capacitors, five percent tolerance  
supplies (e.g., 3.14V minimum) deliver greater than ±5V  
transmitter swings at full data rate, while ten percent  
tolerance supplies (e.g., 2.97V minimum) deliver ±4.95V  
transmitter swings. If greater than ±5V transmitter swings are  
required with a 10% tolerance 3.3V supply, 0.22µF  
2V/DIV  
capacitors are recommended (see Table 3). Existing 5V  
applications typically utilize either 0.1µF or 1µF capacitors,  
and the ICL32X7E works well with either value. New 5V  
designs should use 0.22µF capacitors for the best results.  
For other supply voltages refer to Table 3 for capacitor  
values. Do not use values smaller than those listed in  
Table 3. Increasing the capacitor values (by a factor of two)  
T2  
V
= +3.3V  
CC  
C1 - C4 = 0.1µF  
TIME (20µs/DIV.)  
FIGURE 6. TRANSMITTER OUTPUTS WHEN EXITING  
POWERDOWN (ICL3217E ONLY)  
6
ICL3207E, ICL3217E  
Operation down to 2.7V  
ICL32X7E transmitter outputs meet RS-562 levels (±3.7V)  
5V/DIV.  
with V as low as 2.7V. RS-562 levels typically ensure inter  
operability with RS-232 devices.  
CC  
T1  
IN  
High Data Rates  
The ICL32XX maintain the RS-232 ±5V minimum transmitter  
output voltages even at high data rates. Figure 7 details a  
transmitter loopback test circuit, and Figure 8 illustrates the  
loopback test result at 120kbps. For this test, all transmitters  
were simultaneously driving RS-232 loads in parallel with  
1000pF, at 120kbps. Figure 9 shows the loopback results for  
a single transmitter driving 1000pF and an RS-232 load at  
250kbps. The static transmitters were also loaded with an  
RS-232 receiver.  
T1  
OUT  
OUT  
R1  
V
= +3.3V  
CC  
C1 - C4 = 0.1mF  
2µs/DIV.  
FIGURE 9. LOOPBACK TEST AT 250kbps  
V
CC  
+
0.1µF  
Interconnection with 3V and 5V Logic  
The ICL32X7E directly interface with 5V CMOS and TTL  
logic families. Nevertheless, with the ICL32X7E at 3.3V, and  
the logic supply at 5V, AC, HC, and CD4000 outputs can  
drive ICL32X7E inputs, but ICL32X7E outputs do not reach  
V
CC  
V+  
V-  
+
C1+  
C1-  
C2+  
C2-  
+
C
1
2
C
3
4
ICL32X7E  
+
the minimum V for these logic families. See Table 4 for  
IH  
C
C
+
more information.  
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS  
SUPPLY VOLTAGES  
T
T
OUT  
IN  
1000pF  
R
IN  
R
SYSTEM  
POWER-  
SUPPLY  
VOLTAGE  
(V)  
V
CC  
OUT  
SUPPLY  
VOLTAG  
E
5k  
(V)  
COMPATIBILITY  
3.3  
3.3  
Compatible with all CMOS  
families.  
FIGURE 7. TRANSMITTER LOOPBACK TEST CIRCUIT  
5V/DIV.  
5
5
Compatible with all TTL and  
CMOS logic families.  
5
3.3  
Compatible with ACT and HCT  
CMOS, and with TTL. ICL32X7E  
outputs are incompatible with AC,  
HC, and CD4000 CMOS inputs.  
T1  
IN  
T1  
OUT  
±15kV ESD Protection  
All pins on ICL32XX devices include ESD protection  
structures, but the ICL32X7E incorporate advanced  
structures which allow the RS-232 pins (transmitter outputs  
and receiver inputs) to survive ESD events up to ±15kV. The  
RS-232 pins are particularly vulnerable to ESD damage  
because they typically connect to an exposed port on the  
exterior of the finished product. Simply touching the port  
pins, or connecting a cable, can cause an ESD event that  
might destroy unprotected ICs. These new ESD structures  
protect the device whether or not it is powered up, protect  
without allowing any latchup mechanism to activate, and  
don’t interfere with RS-232 signals as large as ±25V.  
R1  
OUT  
V
= +3.3V  
CC  
C1 - C4 = 0.1µF  
5µs/DIV.  
FIGURE 8. LOOPBACK TEST AT 120kbps  
7
ICL3207E, ICL3217E  
the HBM test. The extra ESD protection built into this  
Human Body Model (HBM) Testing  
device’s RS-232 pins allows the design of equipment  
meeting level 4 criteria without the need for additional board  
level protection on the RS-232 port.  
As the name implies, this test method emulates the ESD  
event delivered to an IC during human handling. The tester  
delivers the charge through a 1.5kcurrent limiting resistor,  
making the test less severe than the IEC-1000 test which  
utilizes a 330limiting resistor. The HBM method  
determines an ICs ability to withstand the ESD transients  
typically present during handling and manufacturing. Due to  
the random nature of these events, each pin is tested with  
respect to all other pins. The RS-232 pins on “E” family  
devices can withstand HBM ESD events to ±15kV.  
AIR-GAP DISCHARGE TEST METHOD  
For this test method, a charged probe tip moves toward the  
IC pin until the voltage arcs to it. The current waveform  
delivered to the IC pin depends on approach speed,  
humidity, temperature, etc., so it is difficult to obtain  
repeatable results. The “E” device RS-232 pins withstand  
±15kV air-gap discharges.  
IEC1000-4-2 Testing  
CONTACT DISCHARGE TEST METHOD  
The IEC 1000 test method applies to finished equipment,  
rather than to an individual IC. Therefore, the pins most likely  
to suffer an ESD event are those that are exposed to the  
outside world (the RS-232 pins in this case), and the IC is  
tested in its typical application configuration (power applied)  
rather than testing each pin-to-pin combination. The lower  
current limiting resistor coupled with the larger charge  
storage capacitor yields a test that is much more severe than  
During the contact discharge test, the probe contacts the  
tested pin before the probe tip is energized, thereby  
eliminating the variables associated with the air-gap  
discharge. The result is a more repeatable and predictable  
test, but equipment limits prevent testing devices at voltages  
higher than ±8kV. All “E” family devices survive ±8kV contact  
discharges on the RS-232 pins.  
o
Typical Performance Curves V = 3.3V, T = 25 C  
CC  
A
6.0  
25  
V
+
OUT  
4.0  
2.0  
20  
-SLEW  
1 TRANSMITTER AT 250kbps  
OTHER TRANSMITTERS AT 30kbps  
0
-2.0  
-4.0  
-6.0  
15  
+SLEW  
10  
V
-
OUT  
-SLEW  
5
0
1000  
2000  
3000  
4000  
5000  
0
1000  
2000  
3000  
4000  
5000  
LOAD CAPACITANCE (pF)  
LOAD CAPACITANCE (pF)  
FIGURE 10. TRANSMITTER OUTPUT VOLTAGE vs LOAD  
CAPACITANCE  
FIGURE 11. SLEW RATE vs LOAD CAPACITANCE  
55  
3.5  
NO LOAD  
ALL OUTPUTS STATIC  
1 TRANSMITTER SWITCHING  
50  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
45  
250kbps  
40  
35  
120kbps  
30  
25  
20kbps  
20  
15  
0
1000  
2000  
3000  
4000  
5000  
2.5  
3.0  
3.5  
4.0  
SUPPLY VOLTAGE (V)  
FIGURE 13. SUPPLY CURRENT vs SUPPLY VOLTAGE  
4.5  
5.0  
5.5  
6.0  
LOAD CAPACITANCE (pF)  
FIGURE 12. SUPPLY CURRENT vs LOAD CAPACITANCE  
WHEN TRANSMITTING DATA  
8
ICL3207E, ICL3217E  
Die Characteristics  
DIE DIMENSIONS:  
PASSIVATION:  
104 mils x 122 mils (2650µm x 3100µm)  
Type: Silox  
Thickness: 13kÅ  
METALLIZATION:  
TRANSISTOR COUNT:  
ICL3207E: 469  
Type: Metal 1: AISi (1%)  
Thickness: Metal 1: 8kÅ  
Type: Metal 2: AISi (1%)  
Thickness: Metal 2: 10kÅ  
ICL3217E: 488  
PROCESS:  
SUBSTRATE POTENTIAL (POWERED UP):  
Si Gate CMOS  
GND  
9
ICL3207E, ICL3217E  
10  
ICL3207E, ICL3217E  
Shrink Small Outline Plastic Packages (SSOP)  
M24.209 (JEDEC MO-150-AG ISSUE B)  
N
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
GAUGE  
PLANE  
SYMBOL  
MIN  
MAX  
MIN  
-
MAX  
2.00  
-
NOTES  
-B-  
A
A1  
A2  
B
-
0.078  
-
-
0.002  
0.065  
0.009  
0.004  
0.312  
0.197  
-
0.05  
1.65  
0.22  
0.09  
7.90  
5.00  
1
2
3
0.072  
0.014  
0.009  
0.334  
0.220  
1.85  
0.38  
0.25  
8.50  
5.60  
-
L
0.25  
0.010  
SEATING PLANE  
A
9
-
-A-  
C
D
E
D
3
4
-
-C-  
α
µ
e
0.026 BSC  
0.65 BSC  
A2  
e
A1  
C
H
L
0.292  
0.322  
0.037  
7.40  
0.55  
8.20  
0.95  
-
B
0.10(0.004)  
0.022  
6
7
-
0.25(0.010) M  
C
A M B S  
N
α
24  
24  
o
0
o
8
o
0
o
8
NOTES:  
Rev. 1 3/95  
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.20mm  
(0.0078 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “B” does not include dambar protrusion. Allowable dambar  
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-  
sion at maximum material condition.  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
11  
ICL3207E, ICL3217E  
Small Outline Plastic Packages (SOIC)  
M24.3 (JEDEC MS-013-AD ISSUE C)  
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE  
INDEX  
AREA  
0.25(0.010)  
M
B M  
H
INCHES  
MILLIMETERS  
E
SYMBOL  
MIN  
MAX  
MIN  
2.35  
0.10  
0.33  
0.23  
MAX  
2.65  
0.30  
0.51  
0.32  
15.60  
7.60  
NOTES  
-B-  
A
A1  
B
C
D
E
e
0.0926  
0.0040  
0.013  
0.1043  
0.0118  
0.020  
-
-
1
2
3
L
9
SEATING PLANE  
A
0.0091  
0.5985  
0.2914  
0.0125  
-
-A-  
o
0.6141 15.20  
3
h x 45  
D
0.2992  
7.40  
4
-C-  
0.05 BSC  
1.27 BSC  
-
α
µ
H
h
0.394  
0.010  
0.016  
0.419  
0.029  
0.050  
10.00  
0.25  
0.40  
10.65  
0.75  
1.27  
-
e
A1  
C
5
B
0.10(0.004)  
L
6
0.25(0.010) M  
C A M B S  
N
α
24  
24  
7
o
0
o
8
o
0
o
8
-
NOTES:  
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of  
Publication Number 95.  
Rev. 0 12/93  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate burrs.  
Mold flash, protrusion and gate burrs shall not exceed 0.15mm  
(0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions. Inter-  
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per  
side.  
5. The chamfer on the body is optional. If it is not present, a visual index  
feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater  
above the seating plane, shall not exceed a maximum value of  
0.61mm (0.024 inch)  
10. Controlling dimension: MILLIMETER. Converted inch dimensions  
are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
Intersil Corporation  
7585 Irvine Center Drive  
Suite 100  
EUROPE  
ASIA  
Intersil Corporation  
Intersil Corporation  
2401 Palm Bay Rd.  
Palm Bay, FL 32905  
TEL: (321) 724-7000  
FAX: (321) 724-7946  
Intersil Europe Sarl  
Ave. William Graisse, 3  
1006 Lausanne  
Switzerland  
TEL: +41 21 6140560  
Unit 1804 18/F Guangdong Water Building  
83 Austin Road  
TST, Kowloon Hong Kong  
TEL: +852 2723 6339  
FAX: +852 2730 1433  
Irvine, CA 92618  
TEL: (949) 341-7000  
FAX: (949) 341-7123  
FAX: +41 21 6140579  
12  

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