ICL3207EIA [ROCHESTER]
Line Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO24, PLASTIC, MO-150-AG, SSOP-24;型号: | ICL3207EIA |
厂家: | Rochester Electronics |
描述: | Line Transceiver, 3 Func, 5 Driver, 3 Rcvr, CMOS, PDSO24, PLASTIC, MO-150-AG, SSOP-24 驱动 光电二极管 接口集成电路 驱动器 |
文件: | 总13页 (文件大小:1406K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ICL3207E, ICL3217E
TM
Data Sheet
November 2001
File Number 4914.4
+/- 15kV ESD Protected, +3V to +5.5V, Low
Power, 250kbps, RS-232
Features
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC1000)
Transmitters/Receivers
• 5V Lower Power Replacement for MAX207E, HIN207E,
HIN237E
The Intersil ICL32X7E devices are 3V to 5.5V powered
RS-232 transmitters (five)/receivers (three) which meet
ElA/TIA-232 and V.28/V.24 specifications, even at
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• Latch-Up Free
V
= 3.0V. Additionally, they provide ±15kV ESD protection
• On-Chip Voltage Converters Require Only Four External
CC
(IEC 1000-4-2 Air Gap) and ±15kV Human Body Model
protection on transmitter outputs and receiver inputs
(RS-232 pins). Targeted applications are ISDN Terminal
Adaptors, PDAs, Palmtops, peripherals, and notebook and
laptop computers where the low operational, and even lower
standby, power consumption is critical. The ICL3217E’s
efficient on-chip charge pumps, coupled with an automatic
powerdown function, reduces the standby supply current to
a 1µA trickle. Small footprint packaging, and the use of
small, low value capacitors ensure board space savings as
well. Data rates greater than 250kbps are guaranteed at
worst case load conditions. This family is fully compatible
with 3.3V-only systems, mixed 3.3V and 5V systems, and
5V-only systems, and is a lower power, pin-for-pin
0.1µF Capacitors
• Automatic Powerdown (I
CC
• Receiver Hysteresis For Improved Noise Immunity
= 1µA, ICL3217E Only)
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- ISDN Terminal Adaptors and Set Top Boxes
• Related Literature
replacement for ‘207E and ‘237E type devices.
- Technical Brief TB363, Guidelines for Handling and
Processing Moisture Sensitive Surface Mount
Devices (SMDs)
- Application Note AN9863, 3V to +5.5V, 250k-1Mbps,
RS-232 Transmitters/Receivers
The ICL3217E features an automatic powerdown function
which powers down the on-chip power-supply and driver
circuits. This occurs when an attached peripheral device is
shut off or the RS-232 cable is removed, conserving system
power automatically, without changes to the hardware or
operating system. The ICL3217E powers up again when a
valid RS-232 voltage is applied to any receiver input.
Ordering Information
TEMP.
RANGE ( C)
(NOTE 1)
PART NO.
o
Table 1 summarizes the features of the devices represented
by this data sheet, while application Note AN9863
summarizes the features of each device comprising the
ICL32XXE 3V family.
PACKAGE
24 Ld SSOP
PKG. NO.
M24.209
M24.209
M24.3
ICL3207ECA
ICL3207EIA
ICL3207ECB
ICL3207EIB
ICL3217ECA
ICL3217EIA
ICL3217ECB
ICL3217EIB
NOTE:
0 to 70
-40 to 85
0 to 70
24 Ld SSOP
24 Ld SOIC
24 Ld SOIC
24 Ld SSOP
24 Ld SSOP
24 Ld SOIC
24 Ld SOIC
-40 to 85
0 to 70
M24.3
M24.209
M24.209
M24.3
-40 to 85
0 to 70
-40 to 85
M24.3
1. Most surface mount devices are available on tape and reel; add
“-T” to suffix.
TABLE 1. SUMMARY OF FEATURES
NO. OF MONITOR
RX (R
MANUAL
POWER-
DOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
NO. OF NO. OF
)
DATA RATE
(kbps)
RX ENABLE
FUNCTION?
OUTB
PART NUMBER
ICL3207E
TX
RX
5
3
0
250
250
NO
NO
NO
NO
NO
ICL3217E
5
3
0
YES
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2001. All Rights Reserved
1
ICL3207E, ICL3217E
Pin Descriptions
Pinout
ICL3207E, ICL3217E (SOIC, SSOP)
PIN
FUNCTION
TOP VIEW
V
System power supply input (3.0V to 5.5V).
CC
T3
T1
T2
24 T4
1
2
3
4
5
6
7
8
9
OUT
OUT
OUT
V+ Internally generated positive transmitter supply (+5.5V).
V- Internally generated negative transmitter supply (-5.5V).
OUT
23 R2
IN
R2
22
21
20
19
18
17
16
15
14
OUT
GND Ground connection.
R1
IN
T5
IN
C1+ External capacitor (voltage doubler) is connected to this lead.
C1- External capacitor (voltage doubler) is connected to this lead.
C2+ External capacitor (voltage inverter) is connected to this lead.
C2- External capacitor (voltage inverter) is connected to this lead.
R1
T5
T4
T3
OUT
OUT
IN
T2
IN
T1
IN
IN
R3
R3
V-
GND
OUT
V
CC
IN
T
TTL/CMOS compatible transmitter inputs.
C1+ 10
V+ 11
IN
C2-
T
±15kV ESD Protected, RS-232 level (nominally ±5.5V)
OUT
transmitter outputs.
C1- 12
13 C2+
R
±15kV ESD Protected, RS-232 compatible receiver inputs.
IN
R
TTL/CMOS level receiver outputs.
OUT
Typical Operating Circuit
ICL32X7E
9
C
(OPTIONAL CONNECTION)
3
V
†
CC
+
0.1µF
10
V
11
15
C1+
CC
+
+
+
+
C †
V+
V-
1
C †
12
13
3
C1-
C2+
C †
2
14
7
C †
4
C2-
T
T
1
2
2
3
T1
T1
OUT
IN
6
T2
T2
OUT
IN
T
3
1
18
19
21
T3
T4
RS-232
LEVELS
T3
T4
OUT
IN
T
4
24
20
OUT
IN
TTL/CMOS
T
5
LOGIC LEVELS
T5
T5
OUT
IN
4
5
22
17
R1
R1
IN
OUT
5kΩ
R
1
2
3
23
16
R2
R3
R2
RS-232
LEVELS
IN
OUT
5kΩ
5kΩ
R
R
R3
IN
OUT
GND
† - FOR V = 3.3V, C - C = 0.1µF or 0.22µF
CC
CC
1
4
FOR V
= 5V, C - C = 0.1µF OR 1µF
1 4
8
2
ICL3207E, ICL3217E
Absolute Maximum Ratings
Thermal Information
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
Thermal Resistance (Typical, Note 2)
θ
( C/W)
CC
JA
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
Moisture Sensitivity (see Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150 C
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300 C
(Lead Tips Only)
75
100
o
o
o
T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
IN
o
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
IN
Output Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
T
OUT
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V + 0.3V
OUT
Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
CC
Operating Conditions
Temperature Range
ICL32X7ECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C
ICL32X7EIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C
T
OUT
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. θ is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V
= 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.
Typicals are at T = 25 C
CC
1
4
o
A
TEMP
o
PARAMETER
TEST CONDITIONS
( C)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Supply Current, Automatic
Powerdown
All R Open (ICL3217E Only)
25
25
-
-
1.0
0.3
10
µA
IN
Supply Current,
All Outputs Unloaded
1.0
mA
Automatic Powerdown Disabled
TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
Input Logic Threshold High
T
Full
Full
Full
Full
Full
-
2.0
2.4
-
-
0.8
-
V
V
IN
IN
T
V
V
= 3.3V
= 5.0V
-
CC
CC
-
-
V
Input Leakage Current
T
±0.01
±0.05
±1.0
±10
µA
µA
IN
Output Leakage Current
(ICL3217E Only)
-
Output Voltage Low
Output Voltage High
I
I
= 1.6mA
= -1.0mA
Full
Full
-
-
0.4
-
V
V
OUT
V
-0.6
CC
V
-0.1
CC
OUT
AUTOMATIC POWERDOWN (ICL3217E Only)
Receiver Input Thresholds to
Enable Transmitters
ICL3217E Powers Up (Figure 4)
Full
Full
25
-2.7
-
-
2.7
0.3
-
V
V
Receiver Input Thresholds to
Disable Transmitters
ICL3217E Powers Down (Figure 4)
-0.3
Receiver Threshold to
Transmitters Enabled Delay (t
-
-
100
30
µs
µs
)
WU
Receiver Positive or Negative
Threshold to Transmitters
Disabled Delay
25
-
RECEIVER INPUTS
Input Voltage Range
Input Threshold Low
Full
25
25
25
25
-25
0.6
0.8
-
-
25
-
V
V
V
V
V
V
V
V
V
= 3.3V
= 5.0V
= 3.3V
= 5.0V
1.2
1.5
1.5
1.8
CC
CC
CC
CC
-
Input Threshold High
2.4
2.4
-
3
ICL3207E, ICL3217E
Electrical Specifications Test Conditions: V
= 3V to 5.5V, C - C = 0.1µF; Unless Otherwise Specified.
Typicals are at T = 25 C (Continued)
CC
1
4
o
A
TEMP
o
PARAMETER
Input Hysteresis
TEST CONDITIONS
( C)
MIN
TYP
0.3
5
MAX
UNITS
V
25
25
-
-
Input Resistance
3
7
kΩ
TRANSMITTER OUTPUTS
Output Voltage Swing
Output Resistance
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
Full
Full
Full
±5.0
±5.4
10M
±35
-
-
V
Ω
V
= V+ = V- = 0V, Transmitter Output = ±2V
300
-
CC
Output Short-Circuit Current
-
-
±60
±25
mA
µA
Output Leakage Current
(ICL3217E Only)
V
= ±12V, V
= 0V or 3V to 5.5V
CC
OUT
In Automatic Powerdown
TIMING CHARACTERISTICS
Maximum Data Rate
(One Transmitter Switching)
V
V
V
= 3.15V, C - C = 0.1µF, R = 3kΩ, C = 1000pF
Full
Full
Full
25
250
500
286
310
0.3
0.3
200
100
15
-
kbps
kbps
kbps
µs
CC
CC
CC
1
4
L
L
= 3.0V, C - C = 0.22µF, R = 3kΩ, C = 1000pF
250
-
-
1
4
L
L
≥ 4.5V, C - C = 0.1µF, R = 3kΩ, C = 1000pF
250
1
4
L
L
Receiver Propagation Delay
Receiver Input to Receiver
Output, C = 150pF
t
t
-
-
-
PHL
PLH
L
25
-
µs
Transmitter Skew
t
- t
PHL PLH
Full
Full
25
-
1000
500
30
30
ns
Receiver Skew
t - t
PHL PLH
-
ns
Transition Region Slew Rate
V
= 3.3V, R = 3kΩ to 7kΩ,
C = 200pF to 2500pF
4
6
V/µs
V/µs
CC
L
L
Measured From +3V to -3V or -3V
to +3V
C = 200pF to 1000pF
25
15
L
ESD PERFORMANCE
RS-232 Pins (T
, R
OUT IN
)
IEC1000-4-2, Air-Gap Discharge Method
IEC1000-4-2, Contact Discharge Method
Human Body Model
25
25
25
25
-
-
-
-
±15
±8
-
-
-
-
kV
kV
kV
kV
±15
±2
All Other Pins
Human Body Model
Transmitters
Detailed Description
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
The ICL32X7E interface ICs operate from a single +3V to
+5.5V power supply, guarantee a 250kbps minimum data
rate, require only four small external 0.1µF capacitors,
feature low power consumption, and meet all ElA RS-232C
and V.28 specifications. The circuit is divided into three
sections: charge pump, transmitters and receivers.
ICL3217E transmitter outputs disable and assume a high
impedance state when the device enters the automatic
powerdown mode. These outputs may be driven to ±12V
when disabled.
Charge-Pump
Intersil’s new ICL32XXE family utilizes regulated on-chip
dual charge pumps as voltage doublers, and voltage
inverters to generate ±5.5V transmitter supplies from a V
Both devices guarantee a 250kbps data rate for full load
CC
supply as low as 3V. This allows these devices to maintain
RS-232 compliant output levels over the ±10% tolerance
range of 3.3V powered systems. The efficient on-chip power
supplies require only four small, external 0.1µF capacitors
conditions (3kΩ and 1000pF), V
≥ 3.0V, with one
CC
transmitter operating at full speed. Under more typical
conditions of V ≥ 3.3V, R = 3kΩ, and C = 250pF, one
CC
L
L
transmitter easily operates at 800kbps.
for the voltage doubler and inverter functions at V
= 3.3V.
CC
See the Capacitor Selection section, and Table 3 for
Transmitter inputs float if left unconnected, and may cause
increases. Connect unused inputs to GND for the best
I
CC
performance.
capacitor recommendations for other operating conditions.
The charge pumps operate discontinuously (i.e., they turn off
as soon as the V+ and V- supplies are pumped up to the
nominal values), resulting in significant power savings.
4
ICL3207E, ICL3217E
Receivers
V
CC
The ICL32X7E each contain inverting receivers that convert
RS-232 signals to CMOS output levels and accept inputs up
to ±25V while presenting the required 3kΩ to 7kΩ input
impedance (see Figure 1) even if the power is off
TRANSITION
DETECTOR
TO
ICL3217E
WAKE-UP
(V
= 0V). The receivers’ Schmitt trigger input stage uses
LOGIC
CC
hysteresis to increase noise immunity and decrease errors
due to slow input signal transitions.
V-
V
CC
Receivers on the ICL3207E are always active. The
ICL3217E receivers disable when in the automatic
powerdown state, thereby eliminating the possible current
path through a shutdown peripheral’s input protection diode
(see Figures 2 and 3).
R
V
= HI-Z*
X
OUT
POWERED
DOWN
UART
T
X
* IN AUTOMATIC
POWERDOWN
Low Power Operation
These 3V devices require a nominal supply current of
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
0.3mA, even at V
= 5.5V, during normal operation (not in
CC
powerdown mode). This is considerably less than the 11mA
current required by comparable 5V RS-232 devices, allowing
users to reduce system power simply by replacing the old
style device with the ICL3207E.
When replacing a ‘207E or ‘237E device in an existing 5V
application, it is acceptable to terminate C to V
as shown
3
CC
on the Typical Operating Circuit. Nevertheless, terminate C
to GND if possible, as slightly better performance results
from this configuration.
3
Low Power, Pin Compatible Replacement
Pin compatibility with existing 5V products (e.g., MAX207E),
coupled with the wide operating supply range, make the
ICL32X7E potential lower power, higher performance drop-in
replacements for existing ‘2X7E 5V applications. As long as
the ±5V RS-232 output swings are acceptable, the
Automatic Powerdown (ICL3217E Only)
Even greater power savings is available by using the
ICL3217E which features an automatic powerdown function.
When no valid RS-232 voltages (see Figure 4) are sensed
on any receiver input for 30µs, the ICL3217E automatically
enters its powerdown state (see Figure 5). In powerdown,
supply current drops to 1µA, because the on-chip charge
ICL32X7E devices should work in most 5V applications.
V
CC
pump turns off (V+ collapses to V , V- collapses to GND),
R
R
CC
XIN
XOUT
and the receiver and transmitter outputs three-state (see
Table 2). This micro-power mode makes the ICL3217E ideal
for battery powered and portable applications. Invalid
receiver levels occur whenever the driving peripheral’s
outputs are shut off (powered down) or when the RS-232
interface cable is disconnected. The ICL3217E powers back
up whenever it detects a valid RS-232 voltage level on any
receiver input (such as when the RS-232 cable is
reconnected). The time to recover from automatic
powerdown mode is typically 100µs.
-25V ≤ V
≤ +25V
RIN
GND ≤ V
≤ V
CC
5kΩ
ROUT
GND
FIGURE 1. INVERTING RECEIVER CONNECTIONS
V
CC
V
CC
CURRENT
FLOW
V
CC
V
= V
CC
OUT
TABLE 2. ICL3217E AUTOMATIC POWERDOWN OPERATION
RS-232 SIGNAL
Rx
Tx
POWERED
DOWN
UART
PRESENT AT
RECEIVER
INPUT?
MODE
OF
OUTPUTS OPERATION
TRANSMITTER RECEIVER
OUTPUTS
SHDN = GND
OLD
RS-232 CHIP
GND
YES
Active
Active
High-Z
Normal
Operation
NO
High-Z
Powerdown
Due to Auto
Powerdown
Logic
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
5
ICL3207E, ICL3217E
reduces ripple on the transmitter outputs and slightly
reduces power consumption. C , C , and C can be
VALID RS-232 LEVEL - ICL3217E IS ACTIVE
2
3
4
2.7V
increased without increasing C ’s value, however, do not
1
INDETERMINATE - POWERDOWN MAY OR
MAY NOT OCCUR
increase C without also increasing C , C , and C to
1
2
3
4
maintain the proper ratios (C to the other capacitors).
1
0.3V
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
INVALID LEVEL - POWERDOWN OCCURS AFTER 30µs
-0.3V
INDETERMINATE - POWERDOWN MAY OR
MAY NOT OCCUR
-2.7V
VALID RS-232 LEVEL - ICL3217E IS ACTIVE
TABLE 3. REQUIRED CAPACITOR VALUES
FIGURE 4. DEFINITION OF VALID RS-232 RECEIVER
LEVELS
V
(V)
C (µF)
C , C , C (µF)
2 3 4
CC
1
3.15 to 3.6
3.0 to 3.6
4.5 to 5.5
3.0 to 5.5
0.1
0.22
0.1
RECEIVER
INPUTS
INVALID
REGION
}
0.22
0.1 to 1.0
0.22
0.1 to 1.0
0.22
TRANSMITTER
OUTPUTS
PWR UP (t
)
AUTOPWDN
WU
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple V to ground with a
V+
V
CC
0
CC
capacitor of the same value as the charge-pump capacitor C .
1
Connect the bypass capacitor as close as possible to the IC.
V-
Transmitter Outputs when Exiting
Powerdown
FIGURE 5. AUTOMATIC POWERDOWN TIMING DIAGRAM
This automatic powerdown feature provides additional
system power savings without changes to the existing
operating system or hardware.
Figure 6 shows the response of two ICL3217E transmitter
outputs when exiting powerdown mode. As they activate, the
two transmitter outputs properly go to opposite RS-232
levels, with no glitching, ringing, nor undesirable transients.
Each transmitter is loaded with 3kΩ in parallel with 2500pF.
Note that the transmitters enable only when the magnitude
of the supplies exceed approximately 3V.
Utilizing power management circuitry, to power down the rest
of the communication circuitry (e.g., the UART) when the
ICL3217E powers down, produces even greater power
savings. Connecting a transition detector to the V- pin (see
Figure 3) is an easy way for the power management logic to
determine when the ICL3217E enters and exits powerdown.
.
5V/DIV
RX
IN
Capacitor Selection
T1
The charge pumps require 0.1µF, or greater, capacitors for
3.3V operation. With 0.1µF capacitors, five percent tolerance
supplies (e.g., 3.14V minimum) deliver greater than ±5V
transmitter swings at full data rate, while ten percent
tolerance supplies (e.g., 2.97V minimum) deliver ±4.95V
transmitter swings. If greater than ±5V transmitter swings are
required with a 10% tolerance 3.3V supply, 0.22µF
2V/DIV
capacitors are recommended (see Table 3). Existing 5V
applications typically utilize either 0.1µF or 1µF capacitors,
and the ICL32X7E works well with either value. New 5V
designs should use 0.22µF capacitors for the best results.
For other supply voltages refer to Table 3 for capacitor
values. Do not use values smaller than those listed in
Table 3. Increasing the capacitor values (by a factor of two)
T2
V
= +3.3V
CC
C1 - C4 = 0.1µF
TIME (20µs/DIV.)
FIGURE 6. TRANSMITTER OUTPUTS WHEN EXITING
POWERDOWN (ICL3217E ONLY)
6
ICL3207E, ICL3217E
Operation down to 2.7V
ICL32X7E transmitter outputs meet RS-562 levels (±3.7V)
5V/DIV.
with V as low as 2.7V. RS-562 levels typically ensure inter
operability with RS-232 devices.
CC
T1
IN
High Data Rates
The ICL32XX maintain the RS-232 ±5V minimum transmitter
output voltages even at high data rates. Figure 7 details a
transmitter loopback test circuit, and Figure 8 illustrates the
loopback test result at 120kbps. For this test, all transmitters
were simultaneously driving RS-232 loads in parallel with
1000pF, at 120kbps. Figure 9 shows the loopback results for
a single transmitter driving 1000pF and an RS-232 load at
250kbps. The static transmitters were also loaded with an
RS-232 receiver.
T1
OUT
OUT
R1
V
= +3.3V
CC
C1 - C4 = 0.1mF
2µs/DIV.
FIGURE 9. LOOPBACK TEST AT 250kbps
V
CC
+
0.1µF
Interconnection with 3V and 5V Logic
The ICL32X7E directly interface with 5V CMOS and TTL
logic families. Nevertheless, with the ICL32X7E at 3.3V, and
the logic supply at 5V, AC, HC, and CD4000 outputs can
drive ICL32X7E inputs, but ICL32X7E outputs do not reach
V
CC
V+
V-
+
C1+
C1-
C2+
C2-
+
C
1
2
C
3
4
ICL32X7E
+
the minimum V for these logic families. See Table 4 for
IH
C
C
+
more information.
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
T
T
OUT
IN
1000pF
R
IN
R
SYSTEM
POWER-
SUPPLY
VOLTAGE
(V)
V
CC
OUT
SUPPLY
VOLTAG
E
5k
(V)
COMPATIBILITY
3.3
3.3
Compatible with all CMOS
families.
FIGURE 7. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV.
5
5
Compatible with all TTL and
CMOS logic families.
5
3.3
Compatible with ACT and HCT
CMOS, and with TTL. ICL32X7E
outputs are incompatible with AC,
HC, and CD4000 CMOS inputs.
T1
IN
T1
OUT
±15kV ESD Protection
All pins on ICL32XX devices include ESD protection
structures, but the ICL32X7E incorporate advanced
structures which allow the RS-232 pins (transmitter outputs
and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
don’t interfere with RS-232 signals as large as ±25V.
R1
OUT
V
= +3.3V
CC
C1 - C4 = 0.1µF
5µs/DIV.
FIGURE 8. LOOPBACK TEST AT 120kbps
7
ICL3207E, ICL3217E
the HBM test. The extra ESD protection built into this
Human Body Model (HBM) Testing
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC-1000 test which
utilizes a 330Ω limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
IEC1000-4-2 Testing
CONTACT DISCHARGE TEST METHOD
The IEC 1000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
o
Typical Performance Curves V = 3.3V, T = 25 C
CC
A
6.0
25
V
+
OUT
4.0
2.0
20
-SLEW
1 TRANSMITTER AT 250kbps
OTHER TRANSMITTERS AT 30kbps
0
-2.0
-4.0
-6.0
15
+SLEW
10
V
-
OUT
-SLEW
5
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 10. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
FIGURE 11. SLEW RATE vs LOAD CAPACITANCE
55
3.5
NO LOAD
ALL OUTPUTS STATIC
1 TRANSMITTER SWITCHING
50
3.0
2.5
2.0
1.5
1.0
0.5
0
45
250kbps
40
35
120kbps
30
25
20kbps
20
15
0
1000
2000
3000
4000
5000
2.5
3.0
3.5
4.0
SUPPLY VOLTAGE (V)
FIGURE 13. SUPPLY CURRENT vs SUPPLY VOLTAGE
4.5
5.0
5.5
6.0
LOAD CAPACITANCE (pF)
FIGURE 12. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
8
ICL3207E, ICL3217E
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
104 mils x 122 mils (2650µm x 3100µm)
Type: Silox
Thickness: 13kÅ
METALLIZATION:
TRANSISTOR COUNT:
ICL3207E: 469
Type: Metal 1: AISi (1%)
Thickness: Metal 1: 8kÅ
Type: Metal 2: AISi (1%)
Thickness: Metal 2: 10kÅ
ICL3217E: 488
PROCESS:
SUBSTRATE POTENTIAL (POWERED UP):
Si Gate CMOS
GND
9
ICL3207E, ICL3217E
10
ICL3207E, ICL3217E
Shrink Small Outline Plastic Packages (SSOP)
M24.209 (JEDEC MO-150-AG ISSUE B)
N
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
0.078
-
-
0.002
0.065
0.009
0.004
0.312
0.197
-
0.05
1.65
0.22
0.09
7.90
5.00
1
2
3
0.072
0.014
0.009
0.334
0.220
1.85
0.38
0.25
8.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-
-A-
C
D
E
D
3
4
-
-C-
α
µ
e
0.026 BSC
0.65 BSC
A2
e
A1
C
H
L
0.292
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
0.022
6
7
-
0.25(0.010) M
C
A M B S
N
α
24
24
o
0
o
8
o
0
o
8
NOTES:
Rev. 1 3/95
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
11
ICL3207E, ICL3217E
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
15.60
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.020
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.5985
0.2914
0.0125
-
-A-
o
0.6141 15.20
3
h x 45
D
0.2992
7.40
4
-C-
0.05 BSC
1.27 BSC
-
α
µ
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C A M B S
N
α
24
24
7
o
0
o
8
o
0
o
8
-
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
7585 Irvine Center Drive
Suite 100
EUROPE
ASIA
Intersil Corporation
Intersil Corporation
2401 Palm Bay Rd.
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7946
Intersil Europe Sarl
Ave. William Graisse, 3
1006 Lausanne
Switzerland
TEL: +41 21 6140560
Unit 1804 18/F Guangdong Water Building
83 Austin Road
TST, Kowloon Hong Kong
TEL: +852 2723 6339
FAX: +852 2730 1433
Irvine, CA 92618
TEL: (949) 341-7000
FAX: (949) 341-7123
FAX: +41 21 6140579
12
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