MAX3741HETE#G16 [ROCHESTER]
SPECIALTY INTERFACE CIRCUIT, QCC16, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16;
| 型号： | MAX3741HETE#G16 |
| 厂家： | 
Rochester Electronics |
| 描述： | SPECIALTY INTERFACE CIRCUIT, QCC16, 3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16 接口集成电路 |
| 文件： | 总12页 (文件大小：1027K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-2597; Rev 2; 8/06
3.2Gbps Compact SFP VCSEL Driver
General Description
Features
The MAX3741 is a high-speed VCSEL driver for small-
form-factor (SFF) and small-form-factor pluggable (SFP)
fiber-optic LAN transmitters. It contains a bias generator,
laser modulator, and peaking current option to improve
VCSEL edge speed. The driver accommodates common
cathode and differential configurations.
♦ 2mA to 15mA Modulation Current
♦ 1mA to 15mA Bias Current
♦ Optional Peaking Current to Improve VCSEL Edge
Speed
♦ Supports Common Cathode and Differential
The MAX3741 operates up to 3.2Gbps. It can switch up
to 15mA of laser modulation current and source up to
15mA of bias current. The MAX3741 is designed to inter-
face with a digital potentiometer and control circuitry.
The MAX3741 accommodates various VCSEL packages,
including low-cost TO-46 headers.
Configuration
♦ 3mm × 3mm 16-Pin Thin QFN Package
The MAX3741 is available in a compact 3mm x 3mm
16-pin thin QFN package and operates over a tempera-
ture range of -40°C to +85°C.
Applications
Ordering Information
Multirate (1Gbps to 3.2Gbps) SFP/SFF Modules
Gigabit Ethernet Optical Transmitters
Fibre Channel Optical Transmitters
TEMP
RANGE
PIN-
PACKAGE
PKG.
CODE
PART
MAX3741ETE
-40°C to +85°C
-40°C to +85°C
16 Thin QFN T1633F-3
16 Thin QFN T1633F-3
MAX3741HETE*
*Hybrid lead-free package. See the Hybrid Lead-Free Package
section.
Pin Configuration
Typical Application Circuit
+3.3V
0.01µF
TOP VIEW
V
CC
16
15
14
13
BIAS
0.1µF
0.1µF
L1*
TX_DISABLE
BIASMON
OUT+
1
2
3
4
12
11
10
9
IN+
IN-
0.01µF
0.01µF
IN+
IN-
OUT+
MAX3741
MAX3741
3mm x 3mm
OUT-
OUT-
50Ω
N.C.
V
CC
BIASMON
TX_DISABLE
BIASSET
MODSET GND PEAKSET
5
6
7
8
R
R
R
R
MON
PEAKSET
BIASSET
MODSET
THIN QFN
EXPOSED PAD IS CONNECTED TO GND.
THIS SYMBOL REPRESENTS A TRANSMISSION LINE OF
CHARACTERISTIC IMPEDANCE Zo = 50Ω.
* FERRITE BEAD, MURATA BLM18HD102SN1B
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
3.2Gbps Compact SFP VCSEL Driver
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V ) ............................................-0.5V to +5.0V
Voltage at TX_DISABLE, IN+, IN-, MODSET,
Continuous Power Dissipation (T = +85°C)
A
CC
16-Lead Thin QFN (derate 25mW/°C above +85°C) ..........2W
Operating Temperature Range .......................... -40°C to +85°C
Storage Temperature Range.............................-55°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PEAKSET, BIASSET, BIAS, BIASMON .......-0.5V to (V + 0.5V)
CC
Voltage at OUT+, OUT-.........................(V
- 2V) to (V
+ 2V)
CC
CC
Current into OUT+, OUT-....................................................60mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
= +2.97V to +3.63V, T = -40°C to +85°C. Typical values are at V
= +3.3V, T = +25°C, unless otherwise noted.)
CC A
CC
A
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
TX_DISABLE set low,
peaking is not used
(Note 1)
I
= 2mA
41
MOD
MOD
P-P
I
= 15mA
51
65
P-P
I
CC
Supply Current
mA
Additional current when peaking is used
(Note 2)
14
20
1
I
Total current when TX_DISABLE is high
0.15
CC-SHDW
TX_DISABLE INPUT
Input Impedance
Input High Voltage
Input Low Voltage
80
2
105
0.2
kΩ
V
V
IH
V
0.8
3
V
IL
Time from rising edge of TX_DISABLE to
= I and I = I
(Note 3)
I
t_off
t_on
BIAS
BIAS_OFF
MOD
MOD_OFF
TX_DISABLE Time
µs
Time from falling edge of TX_DISABLE to
111
25
I
= 15mA and I = 15mA
P-P
BIAS
MOD
Input Leakage
V
= 0V and V
= 3.3V
40
1
µA
CC
TX_DISABLE
BIAS GENERATOR (Note 4)
Min
Bias Current
I
mA
%
BIAS
Max
15
-8
Accuracy of Programmed Bias
Current
∆I
BIAS
+8
Bias Current During Disable
BIASMON Gain
I
TX_DISABLE high
10
µA
BIAS_OFF
0.095
250
0.115
63
0.135
mA/mA
LASER MODULATOR (Note 5)
Data Input Voltage Swing
Output Resistance
V
Total differential signal
2200
80
mV
ID
P-P
R
Single-ended resistance at OUT+, OUT-
Ω
OUT
Min
2
Modulation Current
I
mA
MOD
P-P
Max
15
2
_______________________________________________________________________________________
3.2Gbps Compact SFP VCSEL Driver
ELECTRICAL CHARACTERISTICS (continued)
(V
= +2.97V to +3.63V, T = -40°C to +85°C. Typical values are at V
= +3.3V, T = +25°C, unless otherwise noted.)
CC A
CC
A
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
0.2
2
MAX
UNITS
mA
ps
Min
Programmable Peaking Current
Peaking Current Duration
I
PEAK
Max
80
Tolerance of Programmed
Modulation Current
-10
+10
%
Modulation Transition Time
Deterministic Jitter
t , t
R
5mA
5mA
≤ I
≤ I
≤ 15mA
≤ 15mA
(Note 3)
65
13
1
95
25
4
ps
F
P-P
P-P
MOD
P-P
P-P
DJ
RJ
(Notes 3, 6)
ps
P-P
MOD
Random Jitter
(Note 3)
Differential input voltage at 2200mV
ps
RMS
Laser Modulation During Disable
Differential Input Resistance
I
15
100
50
115
µA
P-P
MOD_OFF
P-P
85
Ω
V
0.3
-
CC
Input Bias Voltage
V
V
IN
Note 1: Measured with R
= 1.87kΩ (I
≈ 15mA). Supply current excludes I
.
BIASSET
BIAS
BIAS
Note 2: Tested with R
= 1.18kΩ.
PEAK
Note 3: Guaranteed by design and characterization.
Note 4: V is less than V - 0.7V.
BIAS
CC
Note 5: Measured electrically with a 50Ω load AC-coupled to OUT+.
Note 6: Deterministic jitter is the peak-to-peak deviation from the ideal time crossings measured with a K28.5 bit pattern at 3.2Gbps
(00111110101100000101).
Typical Operating Characteristics
(V
= +3.3V, T = 25°C, measured electrically with a 50Ω load AC-coupled to OUT+, unless otherwise noted.)
A
CC
ELECTRICAL EYE
ELECTRICAL EYE WITH PEAKING
ELECTRICAL EYE WITH PEAKING
MAX3741 toc03
MAX3741 toc01
MAX3741 toc02
3.2Gbps, K28.5, 10mA
MODULATION, NO PEAKING
3.2Gbps, K28.5, 10mA
MODULATION, R = 2.4kΩ
3.2Gbps, K28.5, 10mA
MODULATION, R = 500Ω
PEAKSET
PEAKSET
87mV/div
87mV/div
87mV/div
50ps/div
50ps/div
50ps/div
_______________________________________________________________________________________
3
3.2Gbps Compact SFP VCSEL Driver
Typical Operating Characteristics (continued)
(V
= +3.3V, T = 25°C, measured electrically with a 50Ω load AC-coupled to OUT+, unless otherwise noted.)
A
CC
OPTICAL EYE
AT 2.125Gbps
OPTICAL EYE
DETERMINISTIC JITTER vs. I
MOD
MAX3741 toc04
MAX3741 toc05
28
24
20
16
12
8
(E = 8.8dB, 1.063Gbps, K28.5, 850nm VCSEL, WITH
R
2.3GHz O-TO-E CONVERTER)
(E = 8.8dB, K28.5, 850nm VCSEL, WITH
R
2.3GHz O-TO-E CONVERTER)
4
0
68ps/div
135ps/div
0
5
10
15
MODULATION CURRENT (mA
)
P-P
BIAS CURRENT vs. R
BIASSET
I
vs. R
RANDOM JITTER vs. I
MOD
MOD
MODSET
16
14
12
10
8
16
14
12
10
8
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
6
6
4
4
2
2
0
0
0
5
10
15
20
25
30
0
2
4
6
8
10
12
0
5
10
15
R
(kΩ)
R
(kΩ)
MODSET
MODULATION CURRENT (mA
)
BIASSET
P-P
I
vs. BIAS CURRENT
INPUT RETURN LOSS
OUTPUT RETURN LOSS
BIASMON
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
-5
0
-2
DIFFERENTIAL
MEASUREMENT
-4
-10
-15
-20
-25
-30
-35
-6
-8
-10
-12
-14
-16
-18
-20
0
4
8
12
16
100M
1G
FREQUENCY (Hz)
10G
100M
1G
10G
BIAS CURRENT (mA)
FREQUENCY (Hz)
4
_______________________________________________________________________________________
3.2Gbps Compact SFP VCSEL Driver
Typical Operating Characteristics (continued)
(V
= +3.3V, T = 25°C, measured electrically with a 50Ω load AC-coupled to OUT+, unless otherwise noted.)
A
CC
TRANSITION TIME vs. I
SUPPLY CURRENT vs. TEMPERATURE
POWER-SUPPLY REJECTION
MOD
80
75
70
65
60
55
50
45
40
80
70
60
50
40
30
20
10
0
-2
∆V
∆V
I
= 2mA
P-P
PSR = 20log
OUT
CC
MEASURED FROM
20% TO 80%
MOD
-4
RISE TIME
-6
FALL TIME
-8
-10
-12
2
4
6
8
10
12
14
16
-40
-15
10
35
60
85
100
1k
10k
100k
1M
10M 100M
I
(mA)
TEMPERATURE (°C)
FREQUENCY (Hz)
MOD
Pin Description
PIN
NAME
FUNCTION
Transmit Disable. Driver output is disabled when TX_DISABLE is high or left unconnected. The driver
output is enabled when the pin is asserted low.
1
TX_DISABLE
2
3
4
IN+
IN-
Noninverted Data Input
Inverted Data Input
No Connection
N.C.
5, 9, 15
V
+3.3V Supply Voltage
CC
Modulation Set. A resistor connected from MODSET to ground (R
modulation current amplitude.
) programs the desired
MODSET
6
MODSET
PEAKSET
Peaking Current Set. A resistor connected between PEAKSET and ground (R
peaking current amplitude. To disable peaking, leave PEAKSET open.
) programs the
PEAKSET
7
8, 16
10
GND
OUT-
OUT+
Ground
Inverted Modulation-Current Output
Noninverted Modulation-Current Output
11
Bias Current Monitor. The output of BIASMON is a sourced current proportional to the bias current. A
12
BIASMON resistor connected between BIASMON and ground (R ) can be used to form a ground
BIASMON
referenced bias monitor.
13
14
BIAS
Bias Current Output
Bias Current Set. A resistor connected between BIASSET and ground (R
VCSEL bias current.
) programs the
BIASSET
BIASSET
Exposed
Pad
Ground. This must be soldered to the circuit board ground for proper thermal and electrical
performance. See the Layout Considerations section.
EP
_______________________________________________________________________________________
5
3.2Gbps Compact SFP VCSEL Driver
Input Termination
Functional Diagram
The MAX3741 data inputs are SFP MSA compatible.
On-chip 100Ω differential input impedance is provided
for optimal termination (Figure 4). The MAX3741 inputs
self-bias to the proper operating point to accommodate
AC-coupling.
BIASSET
BIASMON
ENABLE
BIAS
GENERATOR
BIAS
TX_DISABLE
Applications Information
V
CC
VCSEL Selection
Select a communications-grade VCSEL with a rise time
of 260ps or better for 1.25Gbps or 130ps or better for
2.5Gbps applications.
LASER
MODULATOR
MAX3741
R
R
OUT
OUT
OUT-
OUT+
Use a high-efficiency VCSEL that requires low modula-
tion current and generates a low voltage swing. Trim the
leads to reduce VCSEL package inductance. The typical
package leads have inductance of 25nH per inch
(1nH/mm). This inductance causes a large voltage swing
across the VCSEL. A compensation filter network can be
used to reduce ringing, edge speed, and voltage swing.
See the Designing the Laser-Compensation Filter
Network section for more information.
IN+
IN-
PEAKING
CONTROL
100Ω
MODULATION-CURRENT
GENERATOR
ENABLE
MODSET
PEAKSET
Layout Considerations
To minimize inductance, keep the connections between
the MAX3741 output pins and VCSEL as close as pos-
sible. Use good high-frequency layout techniques and
multiple-layer boards with uninterrupted ground planes
to minimize EMI and crosstalk.
Detailed Description
The MAX3741 contains a bias generator and a laser
modulator with optional peaking compensation.
Bias Generator
Figure 1 shows the bias generator circuitry that con-
tains a bandgap voltage reference, current mirror, and
bias monitor. The bias current output to the laser is
CURRENT
AMPLIFIER
controlled with the R
resistor. For appropriate
BIASSET
ENABLE
R
values, see the Bias Current vs. R
graph in the Typical Operating Characteristics.
BIASSET
BIASSET
I
BIAS
40
MAX3741
BIAS
The BIASMON output provides a current proportional to
the laser bias current given by:
FERRITE
BEAD
BIASMON
I
= I
/ 9
BIAS
BIASMON
I
BIAS
9
0.8V
Modulation Circuit
The modulation circuitry consists of an input buffer, a cur-
rent mirror, and a high-speed current switch (Figure 2).
The modulators drive up to 15mA of modulation into a
50Ω VCSEL load.
200Ω
R
BIAS GENERATOR
BIASMON
BIASSET
The amplitude of the modulation current is set with resis-
R
BIASSET
tor at MODSET (R
). For appropriate R
MODSET
MODSET
values, see the I
vs. R
graph in the Typical
MOD
MODSET
Operating Characteristics. Figure 3 shows a simplified
diagram of the MAX3741 output stage.
Figure 1. Bias Generator
6
_______________________________________________________________________________________
3.2Gbps Compact SFP VCSEL Driver
Designing the Compensation
V
CC
Filter Network
VCSEL package inductance causes the VCSEL imped-
ance to increase at high frequencies, leading to ring-
ing, overshoot, and degradation of the VCSEL output. A
VCSEL compensation filter network can be used to
reduce the VCSEL impedance at high frequencies,
thereby reducing output ringing and overshoot.
MAX3741
R
OUT
R
OUT
OUT+
OUT-
CURRENT
SWITCH
INPUT
BUFFER
IN+
IN-
PEAKING
100Ω
CONTROL
The compensation components (R and C ) are most
F
F
PEAKSET
R
easily determined by experimentation. Begin with R =
F
50Ω and C = 1pF. Increase C until the desired trans-
F
F
MODULATION
CURRENT
GENERATION
CURRENT AMPLIFIER
34x
PEAKSET
mitter response is obtained (Figure 5). Refer to
Application Note HFAN-2.0: Interfacing Maxim Laser
Drivers with Laser Diodes for more information.
ENABLE
Exposed-Pad (EP) Package
The exposed pad on the 16-pin thin QFN provides a
very low thermal resistance path for heat removal from
the IC. The pad is electrical ground on the MAX3741
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note HFAN-08.1: Thermal
Considerations for QFN and Other Exposed Pad
Packages, for additional information.
1.0V
MODSET
R
MODSET
Figure 2. Modulation Circuit
V
CC
MAX3741
V
CC
PACKAGE
R
R
OUT
OUT
16kΩ
1nH
0.5pF
OUT-
OUT+
V
V
CC
PACKAGE
1nH
0.5pF
IN+
1nH
50Ω
50Ω
0.5pF
CC
1nH
0.5pF
IN-
24kΩ
MAX3741
Figure 4. Simplified Input Structure
Figure 3. Simplified Output Structure
_______________________________________________________________________________________
7
3.2Gbps Compact SFP VCSEL Driver
Laser Safety and IEC 825
The International Electrotechnical Commission (IEC)
UNCOMPENSATED
determines standards for hazardous light emissions
from fiber-optic transmitters. IEC 825 defines the maxi-
mum light output for various hazard levels. Using this
laser driver alone does not ensure that a transmitter
design is compliant with IEC 825. The entire transmitter
circuit and component selections must be considered.
Customers must determine the level of fault tolerance
required by their applications, recognizing that Maxim
products are not designed or authorized for use as
components in systems intended for surgical implant
into the body, for applications intended to support or
sustain life, or for any other application where the fail-
ure of a Maxim product could create a situation where
personal injury or death may occur.
CORRECTLY COMPENSATED
OVERCOMPENSATED
TIME
Figure 5. Laser Compensation
Hybrid Lead-Free Package
The MAX3741HETE is a MAX3741 in a hybrid lead-free
package. It is a hybrid part that contains high-lead
bumps inside a lead-free thin QFN package. The part is
not 100% lead free; however, the high-lead solder in
the internal portion of the part does meet the RoHS
exemption for high-lead solders. For more information,
visit www.maxim-ic.com/emmi.
Chip Information
TRANSISTOR COUNT: 1597
PROCESS: SiGe bipolar
8
_______________________________________________________________________________________
3.2Gbps Compact SFP VCSEL Driver
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
(NE - 1)
X e
MARKING
E
E/2
D2/2
(ND - 1)
X e
D/2
AAAA
e
C
D2
D
L
k
b
0.10 M
C
A
B
C
L
E2/2
L
E2
C
C
L
L
0.10
C
0.08 C
A
A2
A1
L
L
e
e
PACKAGE OUTLINE
8, 12, 16L THIN QFN, 3x3x0.8mm
1
21-0136
G
2
_______________________________________________________________________________________
9
3.2Gbps Compact SFP VCSEL Driver
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
PKG
8L 3x3
12L 3x3
16L 3x3
EXPOSED PAD VARIATIONS
REF. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
DOWN
BONDS
ALLOWED
D2
E2
PKG.
PIN ID
JEDEC
CODES
A
b
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80
0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30
2.90 3.00 3.10 2.90 3.00 3.10 2.90 3.00 3.10
2.90 3.00 3.10 2.90 3.00 3.10 2.90 3.00 3.10
MIN. NOM. MAX. MIN. NOM. MAX.
TQ833-1
T1233-1
T1233-3
T1233-4
T1633-1
T1633-2
T1633F-3
0.25
0.95
0.95
0.95
0.95
0.95
0.65
0.70 1.25
1.10 1.25
1.10 1.25
0.25
0.95
0.95
0.95
0.95
0.95
0.65
0.65
0.95
0.70 1.25
0.35 x 45°
0.35 x 45°
0.35 x 45°
0.35 x 45°
0.35 x 45°
0.35 x 45°
WEEC
NO
NO
D
1.10
1.10
1.25
1.25
WEED-1
WEED-1
WEED-1
WEED-2
WEED-2
E
e
YES
YES
NO
0.65 BSC.
0.50 BSC.
0.50 BSC.
1.25
1.25
1.10
1.10
1.10 1.25
L
N
0.35 0.55 0.75 0.45 0.55 0.65 0.30 0.40 0.50
1.10
1.10
0.80
0.80
1.10
1.25
1.25
0.95
0.95
1.25
8
12
16
YES
1.10 1.25
0.80 0.95
0.80 0.95
1.10 1.25
ND
NE
A1
A2
k
2
3
4
0.225 x 45° WEED-2
0.225 x 45° WEED-2
N/A
N/A
NO
2
3
4
T1633FH-3 0.65
T1633-4
0.95
0
0.02 0.05
0
0.02 0.05
0
0.02 0.05
0.35 x 45°
WEED-2
0.20 REF
0.20 REF
0.20 REF
-
-
-
-
-
-
0.25
0.25
0.25
NOTES:
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO
JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED
WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.20 mm AND 0.25 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220 REVISION C.
10. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
11. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
PACKAGE OUTLINE
8, 12, 16L THIN QFN, 3x3x0.8mm
2
21-0136
G
2
Revision History
Rev 0; 10/02: Initial data sheet release.
Rev 1; 5/04:
Rev 2; 8/06:
Added package code (page 1); added package drawing (page 9).
Added hybrid package ordering information (pages 1 and 8).
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2006 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products.
ENGL ISH • ? ? ? ? • ? ? ? • ? ? ?
WH AT 'S NEW
PR OD UC TS
SO LUTI ONS
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M EMB ERS
M A X 3 7 4 1
Pa rt Nu m ber T abl e
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1 . S e e t h e M A X 3 7 4 1 Q u i c k V i e w D a t a S h e e t f o r f u r t h e r i n f o r m a t i o n o n t h i s p r o d u c t f a m i l y o r d o w n l o a d t h e M A X 3 7 4 1
f u l l d a t a s h e e t ( P D F , 2 9 2 k B ) .
2 . O t h e r o p t i o n s a n d l i n k s f o r p u r c h a s i n g p a r t s a r e l i s t e d a t : h t t p : / / w w w . m a x i m - i c . c o m / s a l e s .
3 . D i d n ' t F i n d W h a t Y o u N e e d ? A s k o u r a p p l i c a t i o n s e n g i n e e r s . E x p e r t a s s i s t a n c e i n f i n d i n g p a r t s , u s u a l l y w i t h i n o n e
b u s i n e s s d a y .
4 . P a r t n u m b e r s u f f i x e s : T o r T & R = t a p e a n d r e e l ; + = R o H S / l e a d - f r e e ; # = R o H S / l e a d - e x e m p t . M o r e : S e e f u l l
d a t a s h e e t o r P a r t N a m i n g C o n v e n t i o n s .
5 . * S o m e p a c k a g e s h a v e v a r i a t i o n s , l i s t e d o n t h e d r a w i n g . " P k g C o d e / V a r i a t i o n " t e l l s w h i c h v a r i a t i o n t h e p r o d u c t
u s e s .
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