MC10111L [ROCHESTER]

10K SERIES, DUAL 3-INPUT NOR GATE, CDIP16, CERAMIC, DIP-16;
MC10111L
型号: MC10111L
厂家: Rochester Electronics    Rochester Electronics
描述:

10K SERIES, DUAL 3-INPUT NOR GATE, CDIP16, CERAMIC, DIP-16

栅 CD 输入元件 输出元件 逻辑集成电路 触发器
文件: 总6页 (文件大小:839K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC10111  
Dual 3−Input/3−Ouput NOR  
Gate  
The MC10111 is designed to drive up to three transmission lines  
simultaneously. The multiple outputs of this device also allow the  
wire “OR”ing of several levels of gating for minimization of gate and  
package count.  
http://onsemi.com  
The ability to control three parallel lines from a single point makes  
the MC10111 particularly useful in clock distribution applications  
MARKING  
DIAGRAMS  
where minimum clock skew is desired. Three V pins are provided  
CC  
and each one should be used.  
16  
P = 80 mW typ/gate (No Load)  
CDIP16  
L SUFFIX  
CASE 620  
D
MC10111L  
AWLYYWW  
t = 2.4 ns typ (All Outputs Loaded)  
pd  
t , t = 2.2 ns typ (20%80%)  
r
f
1
16  
LOGIC DIAGRAM  
PDIP16  
P SUFFIX  
CASE 648  
MC10111P  
AWLYYWW  
2
3
4
5
6
7
1
1
12  
13  
14  
PLCC20  
FN SUFFIX  
CASE 775  
9
10  
11  
10111  
AWLYYWW  
V
V
= PIN 1,15  
= PIN 16  
= PIN 8  
CC1  
CC2  
V
EE  
A
= Assembly Location  
WL = Wafer Lot  
YY = Year  
WW = Work Week  
DIP  
PIN ASSIGNMENT  
ORDERING INFORMATION  
V
A
V
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
CC1  
CC2  
Device  
Package  
Shipping  
V
B
B
B
B
B
B
OUT  
OUT  
OUT  
CC1  
OUT  
OUT  
OUT  
IN  
MC10111L  
CDIP16  
25 Units / Rail  
A
A
MC10111P  
PDIP16  
PLCC20  
25 Units / Rail  
46 Units / Rail  
MC10111FN  
A
IN  
A
IN  
A
IN  
IN  
V
IN  
EE  
Pin assignment is for DualinLine Package.  
For PLCC pin assignment, see the Pin Conversion Tables on page 18  
of the ON Semiconductor MECL Data Book (DL122/D).  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
June, 2006 Rev. 8  
MC10111/D  
MC10111  
ELECTRICAL CHARACTERISTICS  
Test Limits  
+25°C  
Typ  
Pin  
Under  
Test  
30°C  
Max  
42  
+85°C  
Min  
Min  
Max  
38  
Min  
Max  
42  
Characteristic  
Power Supply Drain Current  
Input Current  
Symbol  
Unit  
mAdc  
μAdc  
μAdc  
Vdc  
I
8
30  
E
I
5, 6, 7  
5, 6, 7  
680  
425  
425  
inH  
I
0.5  
0.5  
0.3  
inL  
Output Voltage  
Output Voltage  
Logic 1  
Logic 0  
V
2
3
4
1.060  
1.060  
1.060  
0.890  
0.890  
0.890  
0.960  
0.960  
0.960  
0.810  
0.810  
0.810  
0.890  
0.890  
0.890  
0.700  
0.700  
0.700  
OH  
V
2
3
4
1.890  
1.890  
1.890  
1.675  
1.675  
1.675  
1.850  
1.850  
1.850  
1.650  
1.650  
1.650  
1.825  
1.825  
1.825  
1.615  
1.615  
1.615  
Vdc  
Vdc  
Vdc  
ns  
OL  
Threshold Voltage Logic 1  
Threshold Voltage Logic 0  
V
2
3
4
1.080  
1.080  
1.080  
0.980  
0.980  
0.980  
0.910  
0.910  
0.910  
OHA  
V
2
3
4
1.655  
1.655  
1.655  
1.630  
1.630  
1.630  
1.595  
1.595  
1.595  
OLA  
Switching Times (50Ω Load)  
Propagation Delay  
t
t
t
t
t
t
2
2
3
3
4
4
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
2.4  
2.4  
2.4  
2.4  
2.4  
2.4  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
3.8  
3.8  
3.8  
3.8  
3.8  
3.8  
5+2  
52+  
5+3−  
53+  
5+4−  
54+  
Rise Time  
Fall Time  
(20 to 80%)  
(20 to 80%)  
t
t
t
2
3
4
1.0  
1.0  
1.0  
3.5  
3.5  
3.5  
1.1  
1.1  
1.1  
2.2  
2.2  
2.2  
3.5  
3.5  
3.5  
1.2  
1.2  
1.2  
3.8  
3.8  
3.8  
2+  
3+  
4+  
t
t
t
2
3
4
1.0  
1.0  
1.0  
3.5  
3.5  
3.5  
1.1  
1.1  
1.1  
2.2  
2.2  
2.2  
3.5  
3.5  
3.5  
1.2  
1.2  
1.2  
3.8  
3.8  
3.8  
2−  
3−  
4−  
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2
MC10111  
ELECTRICAL CHARACTERISTICS (continued)  
TEST VOLTAGE VALUES (Volts)  
@ Test Temperature  
V
V
V
V
V
EE  
IHmax  
ILmin  
IHAmin  
ILAmax  
30°C  
+25°C  
+85°C  
0.890  
0.810  
0.700  
1.890  
1.850  
1.825  
1.205  
1.105  
1.035  
1.500  
1.475  
1.440  
5.2  
5.2  
5.2  
TEST VOLTAGE APPLIED TO PINS LISTED BELOW  
Pin  
Under  
Test  
(V  
)
CC  
V
V
V
V
V
EE  
Gnd  
Characteristic  
Power Supply Drain Current  
Input Current  
Symbol  
IHmax  
ILmin  
IHAmin  
ILAmax  
I
8
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
E
I
5, 6, 7  
5, 6, 7  
*
inH  
I
*
inL  
Output Voltage  
Logic 1  
Logic 0  
Logic 1  
Logic 0  
V
2
3
4
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
OH  
Output Voltage  
V
2
3
4
5
6
7
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
OL  
Threshold Voltage  
Threshold Voltage  
V
2
3
4
5
6
7
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
OHA  
V
2
3
4
5
6
7
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
OLA  
Switching Times  
(50Ω Load)  
Pulse In Pulse Out  
3.2 V  
+2.0 V  
Propagation Delay  
t
t
t
t
t
t
2
2
3
3
4
4
5
5
5
5
5
5
2
2
3
3
4
4
8
8
8
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
1, 15, 16  
1, 15, 16  
1, 15, 16  
5+2−  
52+  
5+3−  
53+  
5+4−  
54+  
Rise Time  
Fall Time  
(20 to 80%)  
(20 to 80%)  
t
t
t
2
3
4
5
5
5
2
3
4
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
2+  
3+  
4+  
t
t
t
2
3
4
5
5
5
2
3
4
8
8
8
1, 15, 16  
1, 15, 16  
1, 15, 16  
2−  
3−  
4−  
* Individually test each input using the pin connections shown.  
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been  
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.  
Outputs are terminated through a 50-ohm resistor to 2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the  
same manner.  
http://onsemi.com  
3
MC10111  
PACKAGE DIMENSIONS  
PLCC20  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 77502  
ISSUE C  
S
S
0.007 (0.180) M  
T
L−M  
N
B
Y BRK  
N−  
M
S
S
N
0.007 (0.180)  
T
L−M  
U
D
D
L−  
M−  
Z
W
20  
1
S
S
S
0.010 (0.250)  
T
L−M  
N
G1  
X
V
A
VIEW DD  
M
S
S
S
S
0.007 (0.180)  
T
L−M  
L−M  
N
N
M
S
S
N
H
0.007 (0.180)  
T
L−M  
Z
0.007 (0.180) M  
T
R
K1  
K
C
E
M
S
S
N
0.007 (0.180)  
T
L−M  
F
0.004 (0.100)  
VIEW S  
G
TSEATING  
PLANE  
J
VIEW S  
NOTES:  
INCHES  
MILLIMETERS  
G1  
1. DATUMS −L−, −M−, AND −N− DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM −T−, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
DIM MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
S
S
S
0.010 (0.250)  
T
L−M  
N
A
B
C
E
F
0.385  
0.385  
0.165  
0.090  
0.013  
2.79  
0.48  
G
H
J
0.050 BSC  
1.27 BSC  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
0.032  
−−−  
−−−  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
−−−  
2
0.81  
−−−  
−−−  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
K
R
U
V
W
X
Y
Z
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
0.356  
0.356  
0.048  
0.048  
0.056  
−−− 0.020  
10  
2
_
_
_
_
G1 0.310  
K1 0.040  
0.330  
−−−  
7.88  
1.02  
8.38  
−−−  
http://onsemi.com  
4
MC10111  
PACKAGE DIMENSIONS  
CDIP16  
L SUFFIX  
CERAMIC DIP PACKAGE  
CASE 62010  
ISSUE T  
A−  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION F MAY NARROW TO 0.76 (0.030)  
WHERE THE LEAD ENTERS THE CERAMIC  
BODY.  
16  
1
9
8
B−  
C
L
INCHES  
DIM MIN MAX  
0.785 19.05  
MILLIMETERS  
MIN  
MAX  
19.93  
7.49  
5.08  
0.50  
A
B
C
D
E
F
0.750  
0.240  
0.295  
6.10  
−−−  
0.39  
−−− 0.200  
0.015 0.020  
0.050 BSC  
T−  
SEATING  
PLANE  
K
N
1.27 BSC  
0.055  
0.065  
1.40  
1.65  
G
H
K
L
0.100 BSC  
2.54 BSC  
M
E
0.008  
0.125  
0.015  
0.170  
0.21  
3.18  
0.38  
4.31  
F
J 16 PL  
G
0.300 BSC  
7.62 BSC  
M
S
T B  
0.25 (0.010)  
M
N
0
0.020  
15  
0.040  
0
_
0.51  
15  
1.01  
D 16 PL  
_
_
_
M
S
T A  
0.25 (0.010)  
PDIP16  
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 64808  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
A−  
ISSUE R  
16  
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
A
B
C
D
F
0.740  
0.250  
0.145  
0.015  
0.040  
0.770  
0.270  
0.175  
0.021  
0.70  
C
L
SEATING  
PLANE  
T−  
G
H
J
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
K
L
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
M
S
_
_
_
_
0.020  
0.040  
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC10111/D  

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