MC10H131FNR2 [ROCHESTER]

10H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PQCC20, PLASTIC, LCC-20;
MC10H131FNR2
型号: MC10H131FNR2
厂家: Rochester Electronics    Rochester Electronics
描述:

10H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PQCC20, PLASTIC, LCC-20

输出元件 逻辑集成电路 触发器
文件: 总8页 (文件大小:836K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC10H131  
Dual D Type Master−Slave  
Flip−Flop  
Description  
The MC10H131 is a MECL 10Hpart which is a functional/pinout  
duplication of the standard MECL 10Kfamily part, with 100%  
improvement in clock speed and propagation delay and no increase in  
powersupply current.  
http://onsemi.com  
MARKING DIAGRAMS*  
Features  
16  
Propagation Delay, 1.0 ns Typical  
Power Dissipation, 235 mW Typical  
Improved Noise Margin 150 mV (Over Operating Voltage and  
Temperature Range)  
MC10H131L  
AWLYYWW  
1
CDIP16  
L SUFFIX  
CASE 620A  
Voltage Compensated  
MECL 10K Compatible  
PbFree Packages are Available*  
16  
1
MC10H131P  
AWLYYWWG  
16  
1
PDIP16  
P SUFFIX  
CASE 648  
10H131  
ALYWG  
SOEIAJ16  
CASE 966  
1 20  
10H131G  
AWLYYWW  
20  
1
PLLC20  
FN SUFFIX  
CASE 775  
A
= Assembly Location  
= Year  
WL, L = Wafer Lot  
YY, Y  
WW, W = Work Week  
G
= PbFree Package  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
*For additional marking information, refer to  
Application Note AND8002/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 Rev. 7  
MC10H131/D  
MC10H131  
S1  
5
Table 1. RS TRUTH TABLE  
2
3
Q1  
Q1  
R
L
S
L
Q
n+1  
D1  
CE1  
7
6
Q
n
L
H
L
H
V
V
V
= PIN 1  
= PIN 16  
R1  
4
9
CC1  
CC2  
H
H
L
C
C
H
ND  
= PIN 8  
R2 13  
EE  
ND = Not Defined  
14  
Q2  
Q2  
Table 2. CLOCKED TRUTH TABLE  
CE2 11  
D2 10  
15  
C
D
X
L
Q
n+1  
L
Q
n
S2 12  
H
H
L
Figure 1. Logic Diagram  
H
H
C = CE + C  
C
A clock H is a clock transition from a low to a high state.  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
V
CC2  
CC1  
Q1  
Q2  
Q2  
R2  
S2  
Q1  
R1  
S1  
C
C
E2  
E1  
D1  
D2  
C
V
C
EE  
Pin assignment is for DualinLine Package.  
Figure 2. Pin Assignment  
Table 3. MAXIMUM RATINGS  
Symbol  
Characteristic  
Rating  
Unit  
Vdc  
Vdc  
mA  
V
Power Supply (V = 0)  
8.0 to 0  
EE  
CC  
V
Input Voltage (V = 0)  
0 to V  
I
CC  
EE  
I
Output Current  
Continuous  
Surge  
50  
100  
out  
T
A
Operating Temperature Range  
0 to +75  
°C  
T
stg  
Storage Temperature Range Plastic  
Ceramic  
55 to +150  
55 to +165  
°C  
°C  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
http://onsemi.com  
2
MC10H131  
Table 4. ELECTRICAL CHARACTERISTICS (V = 5.2 V 5%) (Note 1)  
EE  
0°  
25°  
75°  
Symbol  
Characteristic  
Power Supply Current  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
mA  
mA  
I
62  
56  
62  
E
I
Input Current High  
Pins 6, 11  
Pin 9  
inH  
530  
660  
485  
790  
310  
390  
285  
465  
310  
390  
285  
465  
Pins 7, 10  
Pins 4, 5, 12, 13  
I
Input Current Low  
High Output Voltage  
Low Output Voltage  
High Input Voltage  
Low Input Voltage  
0.5  
0.5  
0.3  
mA  
inL  
V
1.02  
1.95  
1.17  
1.95  
0.84  
1.63  
0.84  
1.48  
0.98  
1.95  
1.13  
1.95  
0.81  
1.63  
0.81  
1.48  
0.92  
1.95  
1.07  
1.95  
0.735  
1.60  
0.735  
1.45  
Vdc  
Vdc  
Vdc  
Vdc  
OH  
V
OL  
V
IH  
V
IL  
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been  
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is  
maintained. Outputs are terminated through a 50 W resistor to 2.0 V.  
Table 5. AC CHARACTERISTICS  
0°  
25°  
75°  
Symbol  
Characteristic  
Propagation Delay  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
t
ns  
pd  
Clock, CE  
Set, Reset  
0.8  
0.6  
1.6  
1.6  
0.8  
0.7  
1.7  
1.7  
0.8  
0.7  
1.8  
1.8  
t
t
Rise Time  
Fall Time  
0.6  
0.6  
0.7  
0.8  
250  
2.0  
2.0  
0.6  
0.6  
0.7  
0.8  
250  
2.0  
2.0  
0.6  
0.6  
0.7  
0.8  
250  
2.2  
2.2  
ns  
ns  
r
f
t
Setup Time  
Hold Time  
ns  
set  
t
ns  
hold  
f
Toggle Frequency  
MHz  
tog  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
APPLICATION INFORMATION  
The MC10H131 is a dual masterslave type D flipflop.  
In this case, the enable inputs perform the function of  
controlling the common clock.  
Asynchronous Set (S) and Reset (R) override Clock (C )  
C
and Clock Enable (CE) inputs. Each flipflop may be  
clocked separately by holding the common clock in the new  
low state and using the enable inputs for the clocking  
function. If the common clock is to be used to clock the  
flipflop, the Clock Enable inputs must be in the low state.  
The output states of the flipflop change on the positive  
transition of the clock. A change in the information present  
at the data (D) input will not affect the output information at  
any other time due to master slave construction.  
http://onsemi.com  
3
MC10H131  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC10H131FN  
PLLC20  
46 Units / Rail  
46 Units / Rail  
MC10H131FNG  
PLLC20  
(PbFree)  
MC10H131FNR2  
PLLC20  
500 / Tape & Reel  
500 / Tape & Reel  
MC10H131FNR2G  
PLLC20  
(PbFree)  
MC10H131L  
MC10H131M  
MC10H131MG  
CDIP16  
25 Unit / Rail  
50 Unit / Rail  
50 Unit / Rail  
SOEIAJ16  
SOEIAJ16  
(PbFree)  
MC10H131MEL  
SOEIAJ16  
2000 / Tape & Reel  
2000 / Tape & Reel  
MC10H131MELG  
SOEIAJ16  
(PbFree)  
MC10H131P  
PDIP16  
25 Unit / Rail  
25 Unit / Rail  
MC10H131PG  
PDIP16  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
4
MC10H131  
PACKAGE DIMENSIONS  
20 LEAD PLLC  
CASE 77502  
ISSUE E  
M
S
S
N
0.007 (0.180)  
T L−M  
B
Y BRK  
N−  
S
S
N
0.007 (0.180) M T L−M  
U
D
D
L−  
M−  
Z
W
20  
1
S
S
S
N
0.010 (0.250)  
T L−M  
G1  
X
V
VIEW DD  
M
M
S
S
S
S
A
R
0.007 (0.180)  
0.007 (0.180)  
T L−M  
N
N
Z
T L−M  
M
S
S
N
0.007 (0.180)  
T L−M  
H
C
K1  
E
K
0.004 (0.100)  
G
TSEATING  
PLANE  
J
M
S
S
N
0.007 (0.180)  
T L−M  
F
VIEW S  
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T L−M  
N
NOTES:  
INCHES  
MILLIMETERS  
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,  
1982.  
DIM  
A
B
C
E
MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
2.79  
0.48  
0.385  
0.385  
0.165  
0.090  
0.013  
2. DIMENSIONS IN INCHES.  
3. DATUMS L, M, AND NDETERMINED WHERE TOP  
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD  
PARTING LINE.  
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT  
DATUM T, SEATING PLANE.  
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC  
1.27 BSC  
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.  
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.  
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER  
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE  
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY  
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION  
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR  
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO  
BE SMALLER THAN 0.025 (0.635).  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
0.032  
−−−  
−−−  
0.356  
0.356  
0.048  
0.048  
0.056  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
−−−  
2
0.81  
−−−  
−−−  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
−−− 0.020  
Z
2
10  
0.330  
−−−  
_
_
_
_
G1 0.310  
K1 0.040  
7.88  
1.02  
8.38  
−−−  
http://onsemi.com  
5
MC10H131  
PACKAGE DIMENSIONS  
SOEIAJ16  
CASE 96601  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
16  
9
E
Q
1
H
E
E
M
_
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
1
8
L
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
MIN MAX  
−−− 0.081  
A
DIM MIN  
MAX  
2.05  
0.20  
0.50  
0.20  
10.50  
5.45  
c
A
−−−  
0.05  
0.35  
0.10  
9.90  
5.10  
A
1
0.002  
0.008  
0.020  
0.011  
0.413  
0.215  
b
c
0.014  
0.007  
0.390  
0.201  
D
E
A
1
b
e
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
M
H
0.13 (0.005)  
7.40  
0.50  
1.10  
8.20  
0.85  
1.50  
0.291  
0.020  
0.043  
0.323  
0.033  
0.059  
E
L
L
E
0
10  
10  
0.035  
M
Q
0
0.028  
_
_
_
_
0.70  
−−−  
0.90  
0.78  
1
Z
−−− 0.031  
CDIP16  
L SUFFIX  
CERAMIC DIP PACKAGE  
CASE 620A01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION F MAY NARROW TO 0.76 (0.030)  
WHERE THE LEAD ENTERS THE CERAMIC  
BODY.  
B
B
A
A
M
16  
9
8
5
THIS DRAWING REPLACES OBSOLETE  
CASE OUTLINE 620−10.  
L
INCHES  
DIM MIN MAX  
MILLIMETERS  
1
MIN  
19.05  
6.10  
−−−  
MAX  
19.93  
7.49  
5.08  
0.50  
A
B
C
D
E
F
0.750  
0.240  
0.785  
0.295  
16X J  
−−− 0.200  
0.015 0.020  
0.050 BSC  
0.39  
M
0.25 (0.010)  
T B  
1.27 BSC  
E
0.055  
0.065  
1.40  
1.65  
G
H
K
L
0.100 BSC  
2.54 BSC  
F
0.008  
0.125  
0.015  
0.170  
0.21  
3.18  
0.38  
4.31  
0.300 BSC  
7.62 BSC  
M
N
0
0.020  
15  
_
0.040  
0
_
0.51  
15  
_
1.01  
_
C
K
N
SEATING  
PLANE  
T
G
16X D  
M
0.25 (0.010)  
T A  
http://onsemi.com  
6
MC10H131  
PACKAGE DIMENSIONS  
PDIP16  
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 64808  
ISSUE R  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
A−  
16  
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
A
B
C
D
F
0.740  
0.250  
0.145  
0.015  
0.040  
0.770  
0.270  
0.175  
0.021  
0.70  
C
L
SEATING  
PLANE  
T−  
G
H
J
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
K
L
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
M
S
_
_
_
_
0.020  
0.040  
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
MECL 10H and MECL 10K are trademarks of Motorola, Inc.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 850821312 USA  
Phone: 4808297710 or 8003443860 Toll Free USA/Canada  
Fax: 4808297709 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
291 Kamimeguro, Meguroku, Tokyo, Japan 1530051  
Phone: 81357733850  
For additional information, please contact your  
local Sales Representative.  
MC10H131/D  

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