MM74HC273SJX [ROCHESTER]

HC/UH SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 5.30 MM, EIAJ TYPE2, SOP-20;
MM74HC273SJX
型号: MM74HC273SJX
厂家: Rochester Electronics    Rochester Electronics
描述:

HC/UH SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO20, 5.30 MM, EIAJ TYPE2, SOP-20

光电二极管 输出元件 逻辑集成电路 触发器
文件: 总9页 (文件大小:787K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 1983  
Revised May 2005  
MM74HC273  
Octal D-Type Flip-Flops with Clear  
General Description  
Features  
The MM74HC273 edge triggered flip-flops utilize advanced  
silicon-gate CMOS technology to implement D-type flip-  
flops. They possess high noise immunity, low power, and  
speeds comparable to low power Schottky TTL circuits.  
This device contains 8 master-slave flip-flops with a com-  
mon clock and common clear. Data on the D input having  
the specified setup and hold times is transferred to the Q  
output on the LOW-to-HIGH transition of the CLOCK input.  
The CLEAR input when LOW, sets all outputs to a low  
state.  
Typical propagation delay: 18 ns  
Wide operating voltage range  
Low input current: 1 A maximum  
Low quiescent current: 80 A (74 Series)  
Output drive: 10 LS-TTL loads  
Each output can drive 10 low power Schottky TTL equiva-  
lent loads. The MM74HC273 is functionally as well as pin  
compatible to the 74LS273. All inputs are protected from  
damage due to static discharge by diodes to VCC and  
ground.  
Ordering Code:  
Order Number Package Number  
Package Description  
MM74HC273WM  
MM74HC273SJ  
MM74HC273MTC  
MM74HC273N  
M20B  
M20D  
MTC20  
N20A  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Connection Diagram  
Top View  
© 2005 Fairchild Semiconductor Corporation  
DS005331  
www.fairchildsemi.com  
Truth Table  
Logic Diagram  
(Each Flip-Flop)  
Inputs  
Clock  
X
Outputs  
Clear  
D
X
H
L
Q
L
L
H
H
H
H
L
L
X
Q0  
H
L
X
HIGH Level (Steady State)  
LOW Level (Steady State)  
Don’t Care  
Transition from LOW-to-HIGH level  
Q
The level of Q before the indicated steady state input conditions were  
0
established  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 1)  
(Note 2)  
Recommended Operating  
Conditions  
Supply Voltage (VCC  
DC Input Voltage (VIN  
DC Output Voltage (VOUT  
Clamp Diode Current (IIK, IOK  
DC Output Current, per pin (IOUT  
DC VCC or GND Current, per pin (ICC  
)
0.5 to 7.0V  
1.5 to VCC 1.5V  
0.5 to VCC 0.5V  
20 mA  
Min  
Max  
Units  
)
Supply Voltage (VCC  
DC Input or Output Voltage  
(VIN, VOUT  
)
2
6
V
)
)
)
0
VCC  
85  
V
C
)
25 mA  
Operating Temperature Range (TA)  
Input Rise or Fall Times  
(tr, tf) VCC 2.0V  
40  
)
50 mA  
Storage Temperature Range (TSTG  
Power Dissipation (PD)  
(Note 3)  
)
65 C to 150 C  
1000  
500  
ns  
ns  
ns  
VCC 4.5V  
600 mW  
500 mW  
VCC 6.0V  
400  
S.O. Package only  
Note 1: Absolute Maximum Ratings are those values beyond which dam-  
age to the device may occur.  
Lead Temperature (TL)  
(Soldering 10 seconds)  
Note 2: Unless otherwise specified all voltages are referenced to ground.  
260 C  
Note 3: Power Dissipation temperature derating plastic Npackage:  
12 mW/ C from 65 C to 85 C.  
DC Electrical Characteristics (Note 4)  
T
25 C  
T
40 to 85 C  
T
A
55 to 125 C  
A
A
V
Symbol  
Parameter  
Conditions  
Units  
CC  
Typ  
Guaranteed Limits  
V
Minimum HIGH Level  
Input Voltage  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
1.5  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
V
V
V
V
V
V
IH  
3.15  
4.2  
V
V
Maximum LOW Level  
Input Voltage  
0.5  
0.5  
0.5  
IL  
1.35  
1.8  
1.35  
1.8  
1.35  
1.8  
Minimum HIGH Level  
Output Voltage  
V
V
or V  
IL  
OH  
IN  
IH  
|I  
|
20  
A
2.0V  
4.5V  
6.0V  
2.0  
4.5  
6.0  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
V
V
V
OUT  
V
V
V
or V  
IL  
IN  
IH  
|I  
|I  
|
|
4.0 mA  
5.2 mA  
4.5V  
6.0V  
4.2  
5.7  
3.98  
5.48  
3.84  
5.34  
3.7  
5.2  
V
V
OUT  
OUT  
V
Maximum LOW Level  
Output Voltage  
V
or V  
IL  
OL  
IN  
IH  
|I  
|
20  
A
2.0V  
4.5V  
6.0V  
0
0
0
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
V
V
OUT  
V
V
or V  
IL  
IN  
IH  
|I  
|I  
|
|
4 mA  
5.2 mA  
4.5V  
6.0V  
6.0V  
0.2  
0.2  
0.26  
0.26  
0.1  
0.33  
0.33  
1.0  
0.4  
0.4  
1.0  
V
V
A
OUT  
OUT  
I
Maximum Input  
Current  
V
V
V
or GND  
IN  
IN  
CC  
I
Maximum Quiescent  
Supply Current  
V
or GND  
6.0V  
8
80  
160  
A
CC  
IN  
CC  
I
0 A  
OUT  
Note 4: For a power supply of 5V 10% the worst case output voltages (V , and V ) occur for HC at 4.5V. Thus the 4.5V values should be used when  
OH  
OL  
designing with this supply. Worst case V and V occur at V  
5.5V and 4.5V respectively. (The V value at 5.5V is 3.85V.) The worst case leakage cur-  
IH  
IH  
IL  
CC  
rent (I , I , and I ) occur for CMOS at the higher voltage and so the 6.0V values should be used.  
IN CC  
OZ  
3
www.fairchildsemi.com  
AC Electrical Characteristics  
V
5V, TA 25 C, CL 15 pF, tr tf 6 ns  
CC  
Guaranteed  
Symbol  
Parameter  
Conditions  
Typ  
Units  
Limit  
30  
f
t
Maximum Operating Frequency  
Maximum Propagation  
Delay, Clock to Output  
Maximum Propagation  
Delay, Clear to Output  
Minimum Removal Time,  
Clear to Clock  
50  
18  
MHz  
ns  
MAX  
, t  
27  
PHL PLH  
t
t
t
t
t
18  
10  
10  
2
27  
20  
20  
0
ns  
ns  
ns  
ns  
ns  
PHL  
REM  
s
Minimum Setup Time  
Data to Clock  
Minimum Hold Time  
Clock to Data  
H
Minimum Pulse Width  
Clock or Clear  
10  
16  
W
AC Electrical Characteristics  
C
50 pF, tr tf 6 ns (unless otherwise specified)  
L
T
25 C  
T
40 to 85 C  
T
A
55 to 125 C  
A
A
V
Symbol  
Parameter  
Conditions  
Units  
CC  
Typ  
16  
74  
78  
38  
14  
12  
42  
19  
18  
0
Guaranteed Limits  
f
Maximum Operating  
Frequency  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
2.0V  
4.5V  
6.0V  
5
4
21  
24  
170  
34  
29  
170  
34  
29  
32  
6
3
18  
20  
205  
41  
35  
205  
41  
35  
37  
7
MHz  
MHz  
MHz  
ns  
MAX  
27  
31  
135  
27  
23  
135  
27  
23  
25  
5
t
, t  
Maximum Propagation  
Delay, Clock to Output  
PHL PLH  
ns  
ns  
t
Maximum Propagation  
Delay, Clear to Output  
ns  
PHL  
ns  
ns  
t
Minimum Removal Time  
Clear to Clock  
ns  
REM  
0
ns  
0
4
5
6
ns  
t
Minimum Setup Time  
Data to Clock  
26  
7
100  
20  
17  
0
125  
25  
21  
0
150  
30  
25  
0
ns  
s
ns  
5
ns  
t
Minimum Hold Time  
Clock to Data  
15  
6
ns  
H
0
0
0
ns  
4
0
0
0
ns  
t
Minimum Pulse Width  
Clock or Clear  
34  
11  
10  
80  
16  
14  
1000  
500  
400  
75  
15  
13  
100  
20  
18  
1000  
500  
400  
95  
19  
16  
120  
24  
20  
1000  
500  
400  
110  
22  
19  
ns  
W
ns  
ns  
t , t  
Maximum Input Rise and  
Fall Time, Clock  
ns  
r
f
ns  
ns  
t
, t  
Maximum Output Rise  
and Fall Time  
28  
11  
9
ns  
THL TLH  
ns  
ns  
C
Power Dissipation  
Capacitance (Note 5)  
Maximum Input  
Capacitance  
(per flip-flop)  
45  
pF  
PD  
C
7
10  
10  
10  
pF  
IN  
2
Note 5: C determines the no load dynamic power consumption, P  
C
V
f
I
V
, and the no load dynamic current consumption,  
PD  
D
PD CC  
CC CC  
I
C
V
f
I
.
S
PD CC  
CC  
www.fairchildsemi.com  
4
Physical Dimensions inches (millimeters) unless otherwise noted  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Package Number M20B  
5
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
Package Number M20D  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Package Number MTC20  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
Package Number N20A  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
8

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