MMPQ2222 [ROCHESTER]

500mA, 30V, 4 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, SOIC-16;
MMPQ2222
型号: MMPQ2222
厂家: Rochester Electronics    Rochester Electronics
描述:

500mA, 30V, 4 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, SOIC-16

PC 开关 光电二极管 晶体管
文件: 总8页 (文件大小:780K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MMPQ2222  
B4  
E4  
NPN Multi-Chip General Purpose Amplifier  
B3  
E3  
B2  
This device is for use as a medium power amplifier and switch  
requiring collector currents up to 500mA.  
Sourced from process 19.  
E2  
B1  
C4  
E1  
C4  
C3  
C3  
C2  
C2  
C1  
C1  
SOIC-16  
Mark: MMPQ2222  
Absolute Maximum Ratings * T =25°C unless otherwise noted  
a
Symbol  
Parameter  
Value  
30  
Units  
V
V
V
V
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
Collector Current  
CEO  
60  
V
CBO  
EBO  
5.0  
V
I
- Continuous  
500  
mA  
°C  
C
T , T  
Operating and Storage Junction Temperature Range  
- 55 ~ +155  
J
STG  
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired  
NOTES:  
1) These ratings are based on a maximum junction temperature of 150 degrees C.  
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations  
Electrical Characteristics T =25°C unless otherwise noted  
a
Symbol  
Parameter  
Test Condition  
Min.  
Max.  
Units  
Off Characteristics  
V
V
V
Collector-Emitter Breakdown Voltage *  
Collector-Base Breakdown Voltage  
Emitter-Base Breakdown Voltage  
Collector Cutoff Current  
I
I
I
= 10mA, I = 0  
30  
60  
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
C
C
C
B
= 10µA, I = 0  
E
= 10µA, I = 0  
5.0  
V
C
I
V
V
= 50V, I = 0  
50  
50  
nA  
nA  
CBO  
CB  
EB  
E
I
Emitter Cutoff Current  
= 3.0V, I = 0  
C
EBO  
On Characteristics *  
h
DC Current Gain  
I
I
I
= 10mA, V = 10V  
75  
100  
50  
FE  
C
C
C
CE  
= 150mA, V = 1.0V *  
CE  
= 150mA, V = 1.0V *  
CE  
V
V
Collector-Emitter Saturation Voltage *  
Base-Emitter Saturation Voltage *  
I
I
= 150mA, I = 15mA  
0.4  
1.6  
V
V
CE(sat)  
BE(sat)  
C
C
B
= 500mA, I = 50mA  
B
I
I
= 150mA, I = 15mA  
1.3  
2.6  
V
V
C
C
B
= 500mA, I = 50mA  
B
Small Signal Characteristics  
f
Current GAin Bandwidth Product  
I
= 20mA, V = 20V,  
300  
MHz  
T
C
CE  
f = 100MHz  
C
C
Output Capacitance  
Input Capacitance  
Noise Figure  
V
V
= 10V, I = 0, f = 100kHz  
4.0  
20  
pF  
pF  
dB  
obo  
ibo  
CB  
EB  
E
= 0.5V, I = 0, f = 100kHz  
E
NF  
I
= 100µA, V = 10V,  
2.0  
C
CE  
R
= 1.0k, f = 1.0kHz  
S
* Pulse Test: Pulse Width 300µs, Duty Cycle 2.0%  
©2004 Fairchild Semiconductor Corporation  
Rev. A, October 2004  
Thermal Characteristics T =25°C unless otherwise noted  
a
Symbol  
Parameter  
Max.  
Units  
P
Total Device Dissipation  
Derate above 25°C  
1000  
8.0  
mW  
mW/°C  
D
R
Thermal Resistance, Junction to Ambient  
Effective 4 Die  
θJA  
125  
240  
°C/W  
°C/W  
Each Die  
©2004 Fairchild Semiconductor Corporation  
Rev. A, October 2004  
Typical Characteristics  
vs Collector Current  
Voltage vs Collector Current  
500  
400  
300  
200  
100  
0
0.4  
0.3  
0.2  
0.1  
V
= 5V  
CE  
β = 10  
125 °C  
25 °C  
125 °C  
25 °C  
- 40 °C  
- 40 °C  
0.1  
0.3  
1
3
10  
30  
100 300  
1
10  
100  
500  
IC - COLLECTOR CURRENT (mA)  
I C - COLLECTOR CURRENT (mA)  
Figure 1. Typical Pulsed Current Gain  
vs Collector Current  
Figure 2. Collector-Emitter Saturation Voltage  
vs Collector Current  
Voltage vs Collector Current  
Collector Current  
1
β = 10  
1
0.8  
0.6  
0.4  
V
= 5V  
CE  
- 40 °C  
25 °C  
0.8  
0.6  
0.4  
0.2  
- 40 °C  
25 °C  
125 °C  
125 °C  
0.1  
1
10  
25  
1
10  
100  
500  
I C - COLLECTOR CURRENT (mA)  
I
C - COLLECTOR CURRENT (mA)  
Figure 3. Base-Emitter Saturation Voltage  
vs Collector Current  
Figure 4. Base-Emitter On Voltage  
vs Collector Current  
500  
100  
20  
16  
12  
8
f = 1 MHz  
V
= 40V  
CB  
10  
1
C
te  
0.1  
C
ob  
4
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
TA - AMBIENT TEMPERATURE (°C)  
REVERSE BIAS VOLTAGE (V)  
Figure 6. Emitter Transition and Output Capacitance  
vs Reverse Bias Voltage  
Figure 5. Collector Cutoff Current  
vs Ambient Temperature  
©2004 Fairchild Semiconductor Corporation  
Rev. A, October 2004  
Typical Characteristics (Continued)  
Common Emitter Characteristics  
1.00  
0.75  
0.50  
0.25  
0.00  
8
6
4
2
0
V
T
= 10 V  
= 25oC  
CE  
A
h
oe  
h
h
re  
fe  
h
ie  
0
25  
50  
75  
100  
125  
150  
0
10  
20  
30  
40  
50  
60  
TC [OC], CASE TEMPERATURE  
IC - COLLECTOR CURRENT (mA)  
Figure 7. Power Dissipation vs  
Ambient Temperature  
Figure 8. Common Emitter Characteristics  
Common Emitter Characteristics  
Common Emitter Characteristics  
2.4  
2
1.3  
I
= 10 mA  
T
= 25oC  
A
V
I
= 10 V  
= 10 mA  
C
CE  
h
1.25  
fe  
h
C
re  
h
ie  
1.2  
1.15  
1.1  
h
fe  
1.6  
1.2  
0.8  
0.4  
0
h
ie  
1.05  
1
h
oe  
h
h
0.95  
0.9  
re  
0.85  
0.8  
oe  
0.75  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
TA - AMBIENT TEMPERATURE (o C)  
VCE - COLLECTOR VOLTAGE (V)  
Figure 9. Common Emitter Characteristics  
Figure 10. Common Emitter Characteristics  
©2004 Fairchild Semiconductor Corporation  
Rev. A, October 2004  
Test Circuit  
30 V  
200 Ω  
16 V  
1.0 KΩ  
0
200ns  
500 Ω  
Figure 1. Saturated Turn-On Switching Time  
6.0 V  
- 1.5 V  
1k  
37 Ω  
30 V  
1.0 KΩ  
0
200ns  
50 Ω  
Figure 2. Saturated Turn-Off Switching Time  
©2004 Fairchild Semiconductor Corporation  
Rev. A, October 2004  
Package Dimensions  
SOIC-16  
Dimensions in Millimeters  
©2004 Fairchild Semiconductor Corporation  
Rev. A, October 2004  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  
intended to be an exhaustive list of all such trademarks.  
FAST®  
FASTr™  
FPS™  
FRFET™  
GlobalOptoisolator™  
GTO™  
ISOPLANAR™  
LittleFET™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MICROWIRE™  
MSX™  
Power247™  
Stealth™  
A
CEx™  
PowerEdge™  
PowerSaver™  
PowerTrench®  
QFET®  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
TinyLogic®  
ActiveArray™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DOME™  
QS™  
HiSeC™  
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
RapidConnect™  
µSerDes™  
EcoSPARK™  
I2C™  
MSXPro™  
OCX™  
OCXPro™  
TINYOPTO™  
TruTranslation™  
UHC™  
E2CMOS™  
i-Lo™  
ImpliedDisconnect™  
EnSigna™  
FACT™  
FACT Quiet Series™  
OPTOLOGIC®  
OPTOPLANAR™  
PACMAN™  
POP™  
UltraFET®  
SILENT SWITCHER® VCX™  
SMART START™  
SPM™  
Across the board. Around the world.™  
The Power Franchise®  
Programmable Active Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR  
CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
©2004 Fairchild Semiconductor Corporation  
Rev. I13  

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