SMBTA56E6327 [ROCHESTER]

500mA, 80V, PNP, Si, SMALL SIGNAL TRANSISTOR;
SMBTA56E6327
型号: SMBTA56E6327
厂家: Rochester Electronics    Rochester Electronics
描述:

500mA, 80V, PNP, Si, SMALL SIGNAL TRANSISTOR

文件: 总8页 (文件大小:756K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMBTA56/MMBTA56  
PNP Silicon AF Transistor  
Low collector-emitter saturation voltage  
2
3
Complementary type: SMBTA06 / MMBTA06(NPN)  
1
1)  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
Type  
Marking  
Pin Configuration  
Package  
SMBTA56/MMBTA56  
s2G  
SOT23  
1=B  
2=E  
3=C  
Maximum Ratings  
Parameter  
Symbol  
Value  
80  
Unit  
V
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
V
V
V
CEO  
CBO  
EBO  
80  
4
500  
1
mA  
A
I
C
Peak collector current  
Base current  
I
CM  
100  
200  
330  
mA  
I
B
Peak base current  
Total power dissipation-  
I
BM  
mW  
°C  
P
tot  
T 79°C  
S
150  
Junction temperature  
Storage temperature  
T
j
T
-65 ... 150  
stg  
Thermal Resistance  
Parameter  
Symbol  
Value  
Unit  
2)  
K/W  
Junction - soldering point  
R
215  
thJS  
1Pb-containing package may be available upon special request  
2For calculation of R  
please refer to Application Note Thermal Resistance  
thJA  
2007-04-19  
1
SMBTA56/MMBTA56  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC Characteristics  
80  
-
-
-
-
-
-
Collector-emitter breakdown voltage  
I = 1 mA, I = 0  
V
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
CBO  
C
B
Collector-base breakdown voltage  
I = 100 µA, I = 0  
80  
4
C
E
Emitter-base breakdown voltage  
I = 10 µA, I = 0  
E
C
Collector-base cutoff current  
I
I
µA  
V
V
= 80 V, I = 0  
-
-
-
-
0.1  
20  
CB  
CB  
E
= 80 V, I = 0 , T = 150 °C  
E
A
Collector-emitter cutoff current  
-
-
0.1  
CEO  
V
= 60 V, I = 0  
CE  
B
1)  
-
DC current gain  
h
FE  
I = 10 mA, V = 1 V  
100  
100  
-
-
-
-
C
CE  
I = 100 mA, V = 1 V  
C
CE  
1)  
Collector-emitter saturation voltage  
I = 100 mA, I = 10 mA  
V
V
-
-
0.25 V  
CEsat  
C
B
1)  
Base-emitter voltage  
I = 100 mA, V = 1 V  
-
-
1.2  
BE(ON)  
C
CE  
AC Characteristics  
-
-
100  
7
-
-
MHz  
Transition frequency  
f
T
I = 20 mA, V = 5 V, f = 20 MHz  
C
CE  
pF  
Collector-base capacitance  
= 10 V, f = 1 MHz  
C
cb  
V
CB  
1Pulse test: t < 300µs; D < 2%  
2007-04-19  
2
SMBTA56/MMBTA56  
DC current gain h = ƒ(I )  
Collector-emitter saturation voltage  
FE  
C
V
= 1 V  
I = ƒ(V  
), h = 10  
CE  
C
CEsat  
FE  
EHP00852  
EHP00850  
103  
103  
mA  
Ι C  
h FE  
100 C  
25 C  
-50C  
100 C  
25 C  
102  
5
102  
101  
100  
-50 C  
101  
5
100  
10 -1  
10 0  
10 1  
10 2  
Ι C  
10 3  
mA  
0.0  
0.5  
V
1.0  
VCEsat  
Base-emitter saturation voltage  
Collector current I = ƒ(V )  
C
BE  
I = ƒ(V  
), h = 10  
V = 1V  
CE  
C
BEsat  
FE  
EHP00849  
103  
mA  
EHP00846  
103  
mA  
100 ˚C  
25 ˚C  
-50 ˚C  
Ι C  
100 C  
25 C  
-50 C  
Ι C  
102  
5
102  
5
101  
5
101  
5
100  
5
100  
5
10-1  
10-1  
0
0.5  
1.0  
V
1.5  
0
0.5  
1.0  
V
1.5  
VBE  
VBEsat  
2007-04-19  
3
SMBTA56/MMBTA56  
Collector cutoff current I  
= ƒ(T )  
Transition frequency f = ƒ(I )  
CBO  
A
T
C
V
= 80 V  
V
= parameter in V, f = 2 GHz  
CE  
CB  
EHP00848  
103  
MHz  
EHP00851  
104  
nA  
f T  
ΙCBO  
5
max  
103  
5
102  
5
102  
typ  
101  
5
5
100  
5
101  
10-1  
0
100  
5 101  
5 102  
mA 103  
50  
100  
C 150  
TA  
Ι C  
Collector-base capacitance C = ƒ(V )  
Total power dissipation P = ƒ(T )  
tot S  
cb  
CB  
Emitter-base capacitance C = ƒ(V )  
eb  
EB  
65  
pF  
360  
mW  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
300  
270  
240  
210  
180  
150  
120  
90  
CEB  
60  
30  
CCB  
22  
0
0
V
0
4
8
12  
16  
0
15 30 45 60 75 90 105 120  
150  
°C  
V
(V  
)
T
S
CB EB  
2007-04-19  
4
SMBTA56/MMBTA56  
Permissible Pulse Load R  
= ƒ(t )  
Permissible Pulse Load  
thJS  
p
P
/P  
= ƒ(t )  
totmax totDC  
p
10 3  
K/W  
10 4  
10 3  
10 2  
10 1  
10 0  
10 2  
10 1  
10 0  
10 -1  
D=0  
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.005  
D=0  
10 -7 10 -6 10 -5 10 -4 10 -3
10 0  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
s
t
tp  
p
2007-04-19  
5
Package SOT23  
SMBTA56/MMBTA56  
Package Outline  
±0.1  
1
0.1 MAX.  
±0.1  
2.9  
B
3
1
2
1)  
+0.1  
-0.05  
0.4  
A
0.08...0.15  
C
0.95  
0...8˚  
1.9  
0.25 B C  
1) Lead width can be 0.6 max. in dambar area  
M
M
0.2  
A
Foot Print  
0.8  
0.8  
1.2  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
EH  
s
Pin 1  
BCW66  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.9  
1.15  
3.15  
Pin 1  
2007-04-19  
6
SMBTA56/MMBTA56  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2007.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2007-04-19  
7

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