SN74LS157NP3 [ROCHESTER]

Multiplexer, LS Series, 4-Func, 2 Line Input, 1 Line Output, True Output, TTL, PDIP16, PLASTIC, DIP-16;


型号：	SN74LS157NP3
厂家：	Rochester Electronics
描述：	Multiplexer, LS Series, 4-Func, 2 Line Input, 1 Line Output, True Output, TTL, PDIP16, PLASTIC, DIP-16 光电二极管
文件：	总21页 (文件大小：1249K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jul-2015

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

76002012A

ACTIVE

LCCC

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

76002012A

SNJ54LS

157FK

7600201EA

7600201FA

76033012A

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

7600201EA

SNJ54LS157J

7600201FA

SNJ54LS157W

LCCC

POST-PLATE

76033012A

SNJ54LS

158FK

7603301EA

7603301FA

ACTIVE

LIFEBUY

ACTIVE

CDIP

CFP

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

7603301EA

SNJ54LS158J

7603301FA

SNJ54LS158W

JM38510/07903BEA

JM38510/07903BFA

JM38510/

07903BEA

JM38510/

07903BFA

JM38510/07904BEA

JM38510/07904BFA

JM38510/30903B2A

OBSOLETE

ACTIVE

CDIP

CFP

TBD

Call TI

-55 to 125

LCCC

POST-PLATE

N / A for Pkg Type

JM38510/

30903B2A

JM38510/30903BEA

JM38510/30903BFA

M38510/07903BEA

M38510/07903BFA

M38510/30903B2A

M38510/30903BEA

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

JM38510/

30903BEA

JM38510/

30903BFA

CDIP

CFP

A42

JM38510/

07903BEA

A42

JM38510/

07903BFA

LCCC

CDIP

POST-PLATE

A42

JM38510/

30903B2A

JM38510/

30903BEA

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jul-2015

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

M38510/30903BFA

ACTIVE

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

JM38510/

30903BFA

SN54157J

SN54LS157J

SN54LS158J

SN54S157J

ACTIVE

CDIP

TBD

A42

N / A for Pkg Type

-55 to 125

SN54157J

SN54LS157J

SN54LS158J

SN54S157J

SN54S158J

SN74157N

OBSOLETE

ACTIVE

CDIP

PDIP

SOIC

TBD

Call TI

-55 to 125

0 to 70

SN74157N3

SN74LS157D

Call TI

0 to 70

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

LS157

SN74LS157DE4

SN74LS157DG4

SN74LS157DR

SN74LS157DRE4

SN74LS157DRG4

SN74LS157N

ACTIVE

SOIC

PDIP

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

0 to 70

LS157

Green (RoHS

& no Sb/Br)

LS157

2500

Green (RoHS

& no Sb/Br)

LS157

Green (RoHS

& no Sb/Br)

LS157

Green (RoHS

& no Sb/Br)

LS157

Pb-Free

(RoHS)

SN74LS157N

SN74LS157N3

SN74LS157NE4

OBSOLETE

ACTIVE

PDIP

TBD

Call TI

0 to 70

2000

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74LS157N

74LS157

LS158

SN74LS157NSR

SN74LS158D

ACTIVE

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

SOIC

Green (RoHS

& no Sb/Br)

SN74LS158DE4

Green (RoHS

& no Sb/Br)

LS158

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jul-2015

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

SN74LS158DR

SN74LS158N

ACTIVE

SOIC

PDIP

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

LS158

ACTIVE

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

SN74LS158N

SN74LS158N3

SN74LS158NE4

OBSOLETE

ACTIVE

PDIP

TBD

Call TI

0 to 70

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74LS158N

74LS158

SN74LS158NSR

SN74S157N

ACTIVE

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

N / A for Pkg Type

0 to 70

OBSOLETE

PDIP

Pb-Free

(RoHS)

SN74S157N

SN74S157N3

SN74S158D

SN74S158DR

SN74S158N

SN74S158N3

SNJ54157J

OBSOLETE

ACTIVE

PDIP

SOIC

PDIP

CDIP

TBD

Call TI

A42

Call TI

0 to 70

Call TI

0 to 70

Call TI

0 to 70

Call TI

0 to 70

N / A for Pkg Type

-55 to 125

SNJ54157J

SNJ54157W

ACTIVE

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

SNJ54LS157FK

LCCC

POST-PLATE

76002012A

SNJ54LS

157FK

SNJ54LS157J

SNJ54LS157W

SNJ54LS158FK

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

7600201EA

SNJ54LS157J

7600201FA

SNJ54LS157W

LCCC

POST-PLATE

76033012A

SNJ54LS

158FK

SNJ54LS158J

SNJ54LS158W

SNJ54S157FK

ACTIVE

LIFEBUY

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

7603301EA

SNJ54LS158J

7603301FA

SNJ54LS158W

LCCC

POST-PLATE

SNJ54S

157FK

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jul-2015

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

SNJ54S157J

SNJ54S157W

ACTIVE

CDIP

CFP

TBD

A42

N / A for Pkg Type

-55 to 125

SNJ54S157J

SNJ54S157W

ACTIVE

SNJ54S158FK

SNJ54S158J

SNJ54S158W

OBSOLETE

LCCC

CDIP

CFP

TBD

Call TI

-55 to 125

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

11-Jul-2015

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54157, SN54LS157, SN54LS158, SN54S157, SN54S158, SN74157, SN74LS157, SN74LS158, SN74S157, SN74S158 :

Catalog: SN74157, SN74LS157, SN74LS158, SN74S157, SN74S158

•

Military: SN54157, SN54LS157, SN54LS158, SN54S157, SN54S158

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Military - QML certified for Military and Defense Applications

•

Addendum-Page 5

PACKAGE MATERIALS INFORMATION

www.ti.com

8-Apr-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

SN74LS157DR

SN74LS158DR

SN74LS158NSR

SOIC

2500

2000

330.0

16.4

6.5

8.2

10.3

10.5

2.1

2.5

8.0

16.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

8-Apr-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

SN74LS157DR

SN74LS158DR

SN74LS158NSR

SOIC

2500

2000

333.2

367.0

345.9

367.0

28.6

38.0

Pack Materials-Page 2

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SN74LS157NP3 [ROCHESTER]

相关型号：

SN74LS157NS

SN74LS157NSR

SN74LS157NSRE4

SN74LS157NSRG4

SN74LS158

SN74LS158D

SN74LS158D

SN74LS158DE4

SN74LS158DR

SN74LS158DRE4

SN74LS158FNR

SN74LS158J