SN74LVC3G14YEAR [ROCHESTER]
LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8, MO-211EB, DSBGA-8;型号: | SN74LVC3G14YEAR |
厂家: | Rochester Electronics |
描述: | LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8, MO-211EB, DSBGA-8 输入元件 逻辑集成电路 |
文件: | 总16页 (文件大小:1066K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74LVC3G14
TRIPLE SCHMITT-TRIGGER INVERTER
www.ti.com
SCES367H–AUGUST 2001–REVISED SEPTEMBER 2006
FEATURES
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
•
•
•
Ioff Feature Supports Partial-Power-Down
Mode Operation
•
•
•
•
•
•
Supports 5-V VCC Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Inputs Accept Voltages to 5.5 V
Max tpd of 5.4 ns at 3.3 V
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)
Typical VOLP (Output Ground Bounce) <0.8 V
at VCC = 3.3 V, TA = 25°C
•
Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
4 5
GND
2A
2Y
3A
VCC
1Y
3A
2Y
1
2
3
4
8
7
6
5
1A
3Y
VCC
1Y
3A
2Y
1
2
3
4
8
7
6
5
1A
3Y
3 6
2 7
1 8
3Y
1Y
2A
VCC
1A
GND
2A
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This triple Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC3G14 contains three inverters and performs the Boolean function Y = A. The device functions as
three independent inverters but, because of Schmitt action, it may have different input threshold levels for
positive-going (VT+) and negative-going (VT–) signals.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC3G14
TRIPLE SCHMITT-TRIGGER INVERTER
www.ti.com
SCES367H–AUGUST 2001–REVISED SEPTEMBER 2006
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC3G14YEAR
SN74LVC3G14YZAR
SN74LVC3G14YEPR
SN74LVC3G14YZPR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
Reel of 3000
_ _ _CF_
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
Reel of 3000 SN74LVC3G14DCTR
Reel of 3000 SN74LVC3G14DCUR
C14_ _ _
C14_
VSSOP – DCU
Reel of 250
SN74LVC3G14DCUT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
2
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SN74LVC3G14
TRIPLE SCHMITT-TRIGGER INVERTER
www.ti.com
SCES367H–AUGUST 2001–REVISED SEPTEMBER 2006
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
L
L
H
LOGIC DIAGRAM (POSITIVE LOGIC)
1
3
6
7
5
2
1A
2A
3A
1Y
2Y
3Y
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
6.5
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high or low state(2)(3)
6.5
V
VO
VO
IIK
6.5
V
–0.5 VCC + 0.5
V
Input clamp current
VI <0
–50
–50
±50
±100
220
227
140
102
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
DCT package
DCU package
θJA
Package thermal impedance(4)
°C/W
°C
YEA/YZA package
YEP/YZP package
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
3
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SN74LVC3G14
TRIPLE SCHMITT-TRIGGER INVERTER
www.ti.com
SCES367H–AUGUST 2001–REVISED SEPTEMBER 2006
Recommended Operating Conditions(1)
MIN
1.65
1.5
0
MAX UNIT
Operating
5.5
V
VCC
Supply voltage
Data retention only
VI
Input voltage
5.5
VCC
–4
V
V
VO
Output voltage
0
VCC = 1.65 V
VCC = 2.3 V
–8
IOH
High-level output current
–16
–24
–32
4
mA
VCC = 3 V
VCC = 4.5 V
VCC = 1.65 V
VCC = 2.3 V
8
IOL
Low-level output current
16
mA
VCC = 3 V
24
VCC = 4.5 V
32
TA
Operating free-air temperature
–40
85
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SN74LVC3G14
TRIPLE SCHMITT-TRIGGER INVERTER
www.ti.com
SCES367H–AUGUST 2001–REVISED SEPTEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
1.65 V
2.3 V
MIN TYP(1) MAX UNIT
0.7
1
1.4
1.7
2.2
3.1
3.7
0.7
1
VT+
Positive-going input
threshold voltage
3 V
1.3
V
V
V
4.5 V
1.9
5.5 V
2.2
1.65 V
2.3 V
0.3
0.4
VT–
Negative-going input
threshold voltage
3 V
0.6
1.3
2
4.5 V
1.1
5.5 V
1.4
2.5
0.8
0.9
1.1
1.3
1.4
1.65 V
2.3 V
0.3
0.4
∆VT
Hysteresis
3 V
0.4
(VT+ – VT–
)
4.5 V
0.6
5.5 V
0.7
IOH = –100 µA
IOH = –4 mA
IOH = –8 mA
IOH = –16 mA
IOH = –24 mA
IOH = –32 mA
IOL = 100 µA
IOL = 4 mA
1.65 V to 4.5 V
1.65 V
2.3 V
VCC – 0.1
1.2
1.9
VOH
V
V
3 V
2.4
3 V
2.3
4.5 V
3.8
1.65 V to 4.5 V
1.65 V
2.3 V
0.1
0.45
0.3
IOL = 8 mA
VOL
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
3 V
0.4
3 V
0.55
0.55
±5
4.5 V
II
A inputs VI = 5.5 V or GND
VI or VO = 5.5 V
0 to 5.5 V
0
µA
µA
µA
µA
pF
Ioff
ICC
∆ICC
Ci
±10
10
VI = 5.5 V or GND,
IO = 0
1.65 V to 5.5 V
3 V to 5.5 V
3.3 V
One input at VCC – 0.6 V,
VI = VCC or GND
Other inputs at VCC or GND
500
4.5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
9.2
MIN
MAX
5.7
MIN MAX
MIN
MAX
4.3
tpd
A
Y
3.9
1.9
2.3
5.4
1.5
ns
5
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SN74LVC3G14
TRIPLE SCHMITT-TRIGGER INVERTER
www.ti.com
SCES367H–AUGUST 2001–REVISED SEPTEMBER 2006
Operating Characteristics
TA = 25°C
VCC = 1.8 V
TYP
VCC = 2.5 V
TYP
VCC = 3.3 V
TYP
VCC = 5 V
TEST
CONDITIONS
PARAMETER
UNIT
TYP
Cpd
Power dissipation capacitance
f = 10 MHz
17
18
19
22
pF
6
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SN74LVC3G14
TRIPLE SCHMITT-TRIGGER INVERTER
www.ti.com
SCES367H–AUGUST 2001–REVISED SEPTEMBER 2006
PARAMETER MEASUREMENT INFORMATION
VLOAD
Open
S1
RL
From Output
Under Test
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
GND
Open
VLOAD
GND
CL
(see Note A)
RL
LOAD CIRCUIT
INPUTS
VCC
VM
VLOAD
CL
RL
V
D
VI
tr/tf
VCC
VCC
3 V
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
£2 ns
£2 ns
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6 V
30 pF
30 pF
50 pF
50 pF
1 kW
0.15 V
0.15 V
0.3 V
500 W
500 W
500 W
£2.5 ns
£2.5 ns
2 × VCC
0.3 V
VI
Timing Input
Data Input
VM
0 V
tW
tsu
th
VI
VI
Input
VM
VM
VM
VM
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
Output
Control
VM
VM
Input
VM
VM
0 V
0 V
tPZL
tPLZ
tPLH
tPHL
VM
Output
Waveform 1
S1 at VLOAD
VOH
VOL
VLOAD/2
VOL
VM
VM
Output
Output
VOL + V
D
(see Note B)
tPHL
tPLH
tPZH
tPHZ
VOH
VOL
Output
Waveform 2
S1 at GND
VOH
VOH – V
D
VM
VM
VM
»0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
7
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
SN74LVC3G14DCTR
SN74LVC3G14DCTRE4
SN74LVC3G14DCUR
SN74LVC3G14DCURE4
SN74LVC3G14DCUT
SN74LVC3G14DCUTE4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SM8
DCT
8
8
8
8
8
8
3000
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
SM8
US8
US8
US8
US8
DCT
DCU
DCU
DCU
DCU
3000
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC3G14YEAR
SN74LVC3G14YEPR
SN74LVC3G14YZAR
NRND
NRND
NRND
WCSP
WCSP
WCSP
YEA
YEP
YZA
8
8
8
3000
3000
TBD
TBD
SNPB
SNPB
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
3000 Green (RoHS &
no Sb/Br)
SNAGCU
SN74LVC3G14YZPR
ACTIVE
WCSP
YZP
8
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
M
0,13
0,65
8
5
0,15 NOM
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
0,25
1
4
0° – 8°
0,60
0,20
3,15
2,75
1,30 MAX
Seating Plane
0,10
0,10
0,00
4188781/C 09/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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