SNJ54ABT2244W [ROCHESTER]
ABT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20;型号: | SNJ54ABT2244W |
厂家: | Rochester Electronics |
描述: | ABT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 驱动 CD 信息通信管理 输出元件 逻辑集成电路 |
文件: | 总16页 (文件大小:1172K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN54ABT2244, SN74ABT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS106B – JANUARY 1991 – REVISED JULY 1994
SN54ABT2244 . . . J PACKAGE
SN74ABT2244 . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
• Output Ports Have Equivalent 25-Ω Series
Resistors, So No External Resistors Are
Required
• State-of-the-Art EPIC-ΙΙB BiCMOS Design
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Significantly Reduces Power Dissipation
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
• Typical V
(Output Ground Bounce)
OLP
CC
< 1 V at V
= 5 V, T = 25°C
A
• Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK), and
Plastic (N) and Ceramic (J) DIPs
description
SN54ABT2244 . . . FK PACKAGE
(TOP VIEW)
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Taken together with the ′ABT2240
and ′ABT2241, these devices provide the choice
of selected combinations of inverting and
noninverting outputs, symmetrical active-low
output-enable (OE) inputs, and complementary
OE and OE inputs. These devices feature high
fan-out and improved fan-in.
3
2
1
20 19
18
4
5
6
7
8
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
17
16
15
14
9 10 11 12 13
The outputs, which are designed to sink up to
12 mA, include 25-Ω series resistors to reduce
overshoot and undershoot.
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74ABT2244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54ABT2244 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABT2244 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
A
OE
L
H
L
H
L
L
H
X
Z
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
Copyright 1994, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
6–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT2244, SN74ABT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS106B – JANUARY 1991 – REVISED JULY 1994
†
logic symbol
logic diagram (positive logic)
1
1
1OE
1OE
EN
2
18
16
2
4
6
8
18
16
14
12
1A1
1Y1
1Y2
1
1A1
1A2
1A3
1A4
1Y1
1Y2
1Y3
1Y4
4
1A2
6
14
12
1A3
1Y3
1Y4
19
2OE
EN
8
1A4
11
13
15
17
9
7
5
3
1
2A1
2A2
2A3
2A4
2Y1
2Y2
2Y3
2Y4
19
2OE
11
9
7
2A1
†
2Y1
2Y2
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
13
2A2
schematic of Y outputs
15
5
3
2A3
2Y3
2Y4
V
CC
17
2A4
Output
GND
6–2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT2244, SN74ABT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS106B – JANUARY 1991 – REVISED JULY 1994
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
I
Voltage range applied to any output in the high state or power-off state, V
. . . . . . . . . . . . . –0.5 V to 5.5 V
O
Current into any output in the low state, I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
IK
I
Output clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
OK
O
Maximum power dissipation at T = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . 0.6 W
A
DW package . . . . . . . . . . . . . . . . . . . 1.6 W
N package . . . . . . . . . . . . . . . . . . . . . 1.3 W
PW package . . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils,
except for the N package, which has a trace length of zero. For more information, refer to the Package Thermal Considerations
application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B.
recommended operating conditions (see Note 3)
SN54ABT2244 SN74ABT2244
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
High-level input voltage
Low-level input voltage
Input voltage
IH
0.8
0.8
V
IL
0
V
CC
0
V
CC
V
I
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Power-up ramp rate
–24
12
5
–32
12
5
mA
mA
ns/V
µs/V
°C
OH
OL
∆t/∆v
∆t/∆V
Outputs enabled
200
–55
200
–40
CC
T
Operating free-air temperature
125
85
A
NOTE 3: Unused or floating inputs must be held high or low.
6–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT2244, SN74ABT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS106B – JANUARY 1991 – REVISED JULY 1994
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54ABT2244 SN74ABT2244
A
PARAMETER
TEST CONDITIONS
UNIT
†
MIN TYP
MAX
MIN
MAX
MIN
MAX
V
V
V
V
V
V
= 4.5 V,
= 4.5 V,
= 5 V,
I = –18 mA
–1.2
–1.2
–1.2
V
IK
CC
CC
CC
I
I
I
I
I
I
= –3 mA
= –3 mA
= –24 mA
= –32 mA
= 12 mA
2.5
3
2.5
3
2.5
3
OH
OH
OH
OH
OL
V
OH
OL
2
2
V
CC
= 4.5 V
2*
2
V
V
V
V
V
V
V
= 4.5 V,
0.8
±1
0.8
±1
0.8
±1
V
CC
CC
CC
CC
CC
CC
CC
CC
I
I
I
I
I
I
= 0 to 5.5 V,
= 0 to 2.1 V,
= 2.1 V to 0,
= 2.1 V to 5.5 V,
= 2.1 V to 5.5 V,
= 0,
V = V or GND
I CC
µA
µA
µA
µA
µA
µA
I
V
O
V
O
V
O
V
O
= 0.5 to 2.7 V, OE = X
= 0.5 to 2.7 V, OE = X
= 2.7 V, OE ≥ 2 V
±50
±50
10
±50
±50
10
±50
±50
10
OZPU
OZPD
OZH
OZL
off
= 0.5 V, OE ≥ 2 V
–10
±100
–10
–10
±100
V or V ≤ 4.5 V
I
O
V
V
= 5.5 V,
= 5.5 V
I
Outputs high
50
50
50
µA
CEX
O
‡
I
V
= 5.5 V,
V
= 2.5 V
–50
–100 –180
–50
–180
250
30
–50
–180
250
30
mA
µA
O
CC
O
Outputs high
1
24
250
30
V
I
= 5.5 V,
= 0,
CC
O
I
Outputs low
mA
µA
CC
V = V
I
or GND
CC
Outputs disabled
Outputs enabled
0.5
250
1.5
250
1.5
250
1.5
V
CC
= 5.5 V,
Data
inputs
One input at 3.4 V,
§
∆I
Outputs disabled
0.05
1.5
0.05
1.5
0.05
1.5
mA
CC
Other inputs at
Control inputs
V
or GND
CC
V = 2.5 V or 0.5 V
C
C
3
pF
pF
i
I
V
O
= 2.5 V or 0.5 V
8.5
o
* On products compliant to MIL-STD-883, Class B, this parameter does not apply.
†
‡
§
All typical values are at V
= 5 V.
CC
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V or GND.
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)
L
V
T
= 5 V,
= 25°C
CC
A
SN54ABT2244 SN74ABT2244
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1
TYP
3.4
4.5
3.8
6.3
4.5
4.3
MAX
4.3
5.3
4.8
7.3
5.6
5.3
MIN
1
MAX
5.3
6.8
6.5
10.2
7
MIN
1
MAX
4.7
5.6
5.5
8.3
6.6
5.8
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
ns
ns
ns
1
1
1
1.1
2.1
2.1
1.7
1.1
2.1
2.1
1.7
1.1
2.1
2.1
1.7
OE
OE
7.4
6–4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ABT2244, SN74ABT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS106B – JANUARY 1991 – REVISED JULY 1994
PARAMETER MEASUREMENT INFORMATION
7 V
Open
S1
500 Ω
From Output
Under Test
TEST
S1
GND
t
t
/t
Open
7 V
PLH PHL
/t
C
= 50 pF
L
t
500 Ω
PLZ PZL
/t
(see Note A)
Open
PHZ PZH
LOAD CIRCUIT FOR OUTPUTS
3 V
0 V
Timing Input
Data Input
1.5 V
t
w
t
t
h
su
3 V
0 V
3 V
0 V
Input
1.5 V
1.5 V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
0 V
Input
(see Note B)
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
t
PZL
t
t
PHL
PLH
t
PLZ
Output
Waveform 1
S1 at 7 V
V
V
3.5 V
OH
1.5 V
1.5 V
1.5 V
1.5 V
Output
V
V
+ 0.3 V
– 0.3 V
OL
V
OL
OL
(see Note C)
t
PHZ
t
PLH
t
t
PZH
PHL
Output
Waveform 2
S1 at Open
(see Note C)
V
OH
V
V
OH
OH
1.5 V
1.5 V
Output
0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A.
C includes probe and jig capacitance.
L
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6–5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
6–6
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
FK
J
5962-9467301Q2A
5962-9467301QRA
5962-9467301QSA
SN74ABT2244DBLE
SN74ABT2244DW
SN74ABT2244DWR
SN74ABT2244N
ACTIVE
ACTIVE
20
20
20
20
20
20
20
20
20
20
20
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
W
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
SSOP
SOIC
SOIC
PDIP
DB
DW
DW
N
Call TI
Call TI
Call TI
SN74ABT2244PWLE
SNJ54ABT2244FK
SNJ54ABT2244J
OBSOLETE TSSOP
PW
FK
J
Call TI
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CFP
1
1
1
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
N / A for Pkg Type
SNJ54ABT2244W
W
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
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