BA2901YF-LB(H2) [ROHM]
本产品是面向工业设备市场的产品，保证可长期稳定供货。是适合这些用途的产品。BA2901YF-LB是可单电源工作的集电极开路比较器。消耗电流低，工作电源电压范围较大为+2V~+36V，同相输入电压可通过接地电平输入。;
| 型号： | BA2901YF-LB(H2) |
| 厂家： | 
ROHM |
| 描述： | 本产品是面向工业设备市场的产品，保证可长期稳定供货。是适合这些用途的产品。BA2901YF-LB是可单电源工作的集电极开路比较器。消耗电流低，工作电源电压范围较大为+2V~+36V，同相输入电压可通过接地电平输入。 比较器 |
| 文件： | 总30页 (文件大小：671K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Comparator
Ground Sense Comparators
BA2903YF-LB BA2901YF-LB
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market.
BA2903YF-LB and BA2901YF-LB are open collector
output comparators that can operate in single power
supply. It features wide operating voltage range of 2V to
36V and with low supply current.
Operating Supply Voltage Range
single supply :
split supply :
Supply Current
BA2903YF-LB(Dual)
BA2901YF-LB(Quad)
Input Bias Current :
+2.0V to +36V
±1.0V to ±18V
0.6mA(Typ)
0.8mA(Typ)
50nA(Typ)
Features
Long Time Support a Product for
Input Offset Current :
5nA(Typ)
Operating Temperature Range :
-40°C to +125°C
Industrial Applications
Single or Dual Power Supply Operation
Wide Operating Supply Voltage
Standard Comparator Pin-assignments
Common-mode Input Voltage Range includes ground
level.
Packages
SOP8
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
SOP14
Wide Temperature Range
Application
Industrial Equipment
Current Monitor
Battery Monitor
Multivibrators
Simplified schematic
VCC
OUT
+IN
-IN
VEE
Figure 1. Simplified schematic (one channel only)
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
TSZ02201-0RFR0G200680-1-2
30.Jan.2014 Rev.001
1/27
Datasheet
BA2903YF-LB BA2901YF-LB
Pin Configuration
BA2903YF-LB : SOP8
Pin No.
Pin Name
1
2
3
4
5
6
7
8
OUT1
-IN1
VCC
OUT2
-IN2
1
2
8
7
OUT1
-IN1
CH1
- +
+IN1
VEE
+IN2
-IN2
3
4
+IN1
VEE
6
5
CH2
+ -
+IN2
OUT2
VCC
BA2901YF-LB : SOP14
Pin No.
Pin Name
1
2
OUT2
OUT1
VCC
-IN1
OUT2
OUT1
OUT3
OUT4
1
2
14
13
3
4
12
11
10
9
VCC
-IN1
+IN1
3
4
5
VEE
+IN4
5
+IN1
-IN2
6
CH1
－ ＋
CH4
－ ＋
7
+IN2
-IN3
8
-IN4
9
+IN3
-IN4
-IN2
6
7
+IN3
-IN3
10
11
12
13
14
CH3
－ ＋
CH2
－ ＋
+IN4
VEE
+IN2
8
OUT4
OUT3
Package
SOP8
BA2903YF-LB
SOP14
BA2901YF-LB
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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30.Jan.2014 Rev.001
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Datasheet
BA2903YF-LB BA2901YF-LB
Ordering Information
B A 2
9
0
x Y F
-
LB H2
Part Number
BA2903YF
BA2901YF
Package
Product class
F
: SOP8
SOP14
LB for Industrial applications
Packaging and forming specification
H2: Embossed tape and reel
(SOP8/SOP14)
Line-up
Operating
Supply
Voltage
Orderable
Part Number
Topr
Dual/Quad
Package
Dual
SOP8
Reel of 250
Reel of 250
BA2903YF-LBE2
BA2901YF-LBE2
-40°C to +125°C
+2.0V to +36V
Quad
SOP14
Absolute Maximum Ratings (TA=25°C)
Parameter
Ratings
Symbol
Unit
V
BA2903YF-LB
BA2901YF-LB
VCC-VEE
SOP8
SOP14
VID
+36
+36
Supply Voltage
0.77 (Note 1,3)
-
-
Power dissipation
PD
W
0.56 (Note 2,3)
Differential Input Voltage (Note 4)
Input Common-mode Voltage Range
Input Current (Note 5)
V
V
VICM
(VEE-0.3) to (VEE+36)
-10
II
mA
V
Operating Supply Voltage
Vopr
+2.0 ~ +36 (±1.0 ~ ±18)
-40 to +125
Operating Temperature Range
Storage Temperature Range
Maximum junction Temperature
Topr
°C
°C
°C
Tstg
-55 to +150
TJmax
+150
(Note 1) To use at temperature above TA=25°C reduce 6.2mW/°C.
(Note 2) To use at temperature above TA=25°C reduce 4.5mW/°C.
(Note 3) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%).
(Note 4) The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
(Note 5) An excessive input current will flow when input voltages of less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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Datasheet
BA2903YF-LB BA2901YF-LB
Electrical Characteristics
○BA2903YF-LB (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Parameter
Symbol
VIO
Unit
mV
Conditions
range
Min
Typ
Max
7
25°C
-
-
-
-
-
-
2
-
EK=-1.4V
VCC=5 to 36V, EK=-1.4V
Input Offset Voltage (Note 6,7)
Input Offset Current (Note 6,7)
Input Bias Current (Note 7,8)
Full range
25°C
15
5
-
50
IIO
nA EK=-1.4V
Full range
25°C
200
250
500
50
-
IB
VICM
AV
nA EK=-1.4V
V
Full range
Input Common-mode
Voltage Range
25°C
0
-
VCC-1.5
-
25°C
Full range
25°C
88
74
-
100
-
-
VCC=15V, EK=-1.4 to -11.4V
RL=15kΩ, VRL=15V
Large Signal Voltage Gain(Note 7)
dB
-
0.6
-
1
OUT=open
Supply Current(Note 7)
ICC
ISINK
VOL
mA
mA
mV
Full range
-
2.5
OUT=open, VCC=36V
+IN=0V, -IN=1V
OUT=1.5V
Output Sink Current (Note 9)
25°C
6
16
-
Output Saturation Voltage(Note 7)
(Maximum Output Voltage Low)
25°C
-
-
150
-
400
700
+IN=0V, -IN= 1V
I
SINK=4mA
Full range
+IN=1V, -IN=0V
OUT=5V
+IN=1V, -IN=0V
OUT=36V
RL=5.1kΩ, VRL=5V
VIN=100mVP-P, overdrive=5mV
RL=5.1kΩ, VRL=5V, VIN=TTL
Logic Swing, VREF=1.4V
25°C
-
-
-
-
0.1
-
-
1
-
Output Leakage Current(Note 7)
(High level output current)
ILEAK
μA
μs
Full range
1.3
0.4
Response Time
25°C
tRE
-
(Note 6) Absolute value
(Note 7) Full range TA=-40°C to +125°C
(Note 8) Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
(Note 9) Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0RFR0G200680-1-2
30.Jan.2014 Rev.001
4/27
Datasheet
BA2903YF-LB BA2901YF-LB
○BA2901YF-LB (Unless otherwise specified VCC=+5V, VEE=0V)
Limits
Temperature
Parameter
Symbol
VIO
Unit
mV
Conditions
range
Min
Typ
Max
7
25°C
-
-
-
-
-
-
2
-
EK=-1.4V
VCC=5 to 36V, EK=-1.4V
Input Offset Voltage (Note10,11)
Input Offset Current (Note10,11)
Input Bias Current (Note11,12)
Full range
25°C
15
5
-
50
IIO
nA EK=-1.4V
Full range
25°C
200
250
500
50
-
IB
VICM
AV
nA EK=-1.4V
V
Full range
Input Common-mode Voltage
Range
25°C
0
-
VCC-1.5
-
25°C
Full range
25°C
88
74
-
100
-
-
VCC=15V, EK=-1.4 to -11.4V
RL=15kΩ, VRL=15V
Large Signal Voltage Gain(Note11)
dB
-
0.8
-
2
OUT=open
Supply Current(Note11)
ICC
ISINK
VOL
mA
mA
mV
Full range
-
2.5
OUT=open, VCC=36V
+IN=0V, -IN=1V
OUT=1.5V
Output Sink Current (Note13)
25°C
6
16
-
Output Saturation Voltage(Note11)
(Maximum Output Voltage Low)
+IN=0V, -IN= 1V
25°C
-
-
150
-
400
700
ISINK=4mA
Full range
+IN=1V, -IN=0V
OUT=5V
+IN=1V, -IN=0V
OUT=36V
RL=5.1kΩ, VRL=5V
VIN=100mVP-P, overdrive=5mV
RL=5.1kΩ, VRL=5V, VIN=TTL
Logic Swing, VREF=1.4V
25°C
-
-
-
-
0.1
-
-
1
-
Output Leakage Current(Note11)
(High level output current)
ILEAK
μA
μs
Full range
1.3
0.4
Response Time
25°C
tRE
-
(Note 10) Absolute value
(Note 11) Full range TA=-40°C to +125°C
(Note 12) Current Direction: Since first input stage is composed with PNP transistor, input bias current flows out of IC.
(Note 13) Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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30.Jan.2014 Rev.001
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Datasheet
BA2903YF-LB BA2901YF-LB
Description of electrical characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC/VEE)
Indicates the maximum voltage that can be applied between the VCC terminal and the VEE terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM
)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Operating and Storage Temperature Ranges (Topr, Tstg
)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
(5) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Input Common-mode Voltage Range (VICM
)
Indicates the input voltage range where IC normally operates.
(5) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(6) Supply Current (ICC
Indicates the current that flows within the IC under specified no-load conditions.
(7) Output Sink Current (ISINK
Denotes the maximum current that can be output under specific output conditions.
(8) Output Saturation Voltage, Low Level Output Voltage (VOL
Signifies the voltage range that can be output under specific output conditions.
(9) Output Leakage Current, High Level Output Current (ILEAK
Indicates the current that flows into the IC under specific input and output conditions.
(10) Response Time (tRE
)
)
)
)
)
Response time indicates the delay time between the input and output signal is determined by the time difference
from the fifty percent of input signal swing to the fifty percent of output signal swing.
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30.Jan.2014 Rev.001
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves
○BA2903YF-LB
1.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
BA2903YF-LB
0.8
0.6
0.4
0.2
0.0
25℃
-40℃
125℃
0
25
50
75
100
125
150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 2.
Figure 3.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Supply Current vs Supply Voltage
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
200
150
100
50
125℃
25℃
36V
5V
-40℃
2V
0
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Supply Voltage [V]
Figure 4.
Figure 5.
Supply Current vs Ambient Temperature
Output Saturation Voltage vs Supply Voltage
(ISINK=4mA)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ02201-0RFR0G200680-1-2
30.Jan.2014 Rev.001
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TSZ22111 • 15 • 001
7/27
Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
200
150
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
125℃
2V
25℃
100
5V
36V
50
0
-40℃
-50 -25
0
25
50
75 100 125 150
0
2
4
6
8
10 12 14 16 18 20
Ambient Temperature [°C]
Output Sink Current [mA]
Figure 6.
Figure 7.
Output Saturation Voltage vs
Output Sink Current
(VCC=5V)
Output Saturation Voltage vs Ambient Temperature
(ISINK=4mA)
40
30
20
10
0
8
6
4
-40℃
5V
2
36V
0
25℃
125℃
-2
-4
-6
-8
2V
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 8.
Figure 9.
Output Sink Current vs Ambient Temperature
(OUT=1.5V)
Input Offset Voltage vs Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ02201-0RFR0G200680-1-2
30.Jan.2014 Rev.001
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TSZ22111 • 15 • 001
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
8
6
4
160
140
120
100
80
2V
2
-40℃
0
5V
36V
25℃
-2
-4
-6
-8
60
40
125℃
20
0
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 10.
Figure 11.
Input Offset Voltage vs Ambient Temperature
Input Bias Current vs Supply Voltage
160
140
120
100
80
50
40
30
20
10
-40℃
25℃
36V
0
125℃
-10
-20
-30
-40
-50
60
40
5V
2V
20
0
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 12.
Figure 13.
Input Bias Current vs Ambient Temperature
Input Offset Current vs Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ02201-0RFR0G200680-1-2
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TSZ22111 • 15 • 001
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
140
130
120
110
100
90
50
40
30
20
125℃
10
2V
-40℃
25℃
0
36V
5V
-10
-20
-30
-40
-50
80
70
60
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 14.
Figure 15.
Input Offset Current vs Ambient Temperature
Large Signal Voltage Gain
vs Supply Voltage
140
130
120
110
100
90
160
140
120
100
80
36V
125℃
25℃
5V
15V
-40℃
80
60
70
60
40
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 16.
Figure 17.
Large Signal Voltage Gain
vs Ambient Temperature
Common Mode Rejection Ratio
vs Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ22111 • 15 • 001
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
150
125
6
4
25℃
36V
-40℃
100
2
125℃
75
0
5V
2V
50
25
0
-2
-4
-6
-50 -25
0
25
50
75 100 125 150
-1
0
1
2
3
4
5
Ambient Temperature [°C]
Input Voltage [V]
Figure 18.
Figure 19.
Common Mode Rejection Ratio
vs Ambient Temperature
Input Offset Voltage - Input Voltage
(VCC=5V)
200
180
160
140
120
100
80
5
4
3
2
1
0
125℃
-40℃
25℃
60
-50 -25
0
25
50
75 100 125 150
-100
-80
-60
-40
-20
0
Ambient Temperature [°C]
Over Drive Voltage [mV]
Figure 21.
Figure 20.
Response Time (Low to High)
vs Over Drive Voltage
Power Supply Rejection Ratio
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ02201-0RFR0G200680-1-2
30.Jan.2014 Rev.001
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TSZ22111 • 15 • 001
11/27
Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2903YF-LB
5
4
3
2
1
0
5
4
3
125℃
2
5mV overdrive
25℃
20mV overdrive
-40℃
100mV overdrive
1
0
-50 -25
0
25
50
75 100 125 150
0
20
40
60
80
100
Over Drive Voltage [mV]
Ambient Temperature [°C]
Figure 22.
Figure 23.
Response Time (Low to High)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
Response Time (High to Low)
vs Over Drive Voltage
(VCC=5V, VRL=5V, RL=5.1kΩ)
5
4
3
2
1
0
5mV overdrive
20mV overdrive
100mV overdrive
-50 -25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Figure 24.
Response Time (High to Low)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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TSZ02201-0RFR0G200680-1-2
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TSZ22111 • 15 • 001
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
1.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.8
25℃
-40℃
BA2901YF-LB
0.6
0.4
0.2
0.0
125℃
0
25
50
75
100
125
150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 25.
Figure 26.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Supply Current vs Supply Voltage
200
150
100
50
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
36V
125℃
25℃
5V
2V
-40℃
0
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 27.
Figure 28.
Supply Current vs Ambient Temperature
Output Saturation Voltage vs Supply Voltage
(ISINK=4mA)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
200
150
125℃
2V
25℃
100
5V
36V
50
0
-40℃
0
2
4
6
8
10 12 14 16 18 20
-50 -25
0
25
50
75 100 125 150
Output Sink Current [mA]
Ambient Temperature [°C]
Figure 30.
Output Saturation Voltage vs
Output Sink Current
(VCC=5V)
Figure 29.
Output Saturation Voltage vs Ambient Temperature
(ISINK=4mA)
40
30
20
10
0
8
6
4
-40℃
5V
2
36V
0
25℃
125℃
-2
-4
-6
-8
2V
0
10
20
30
40
-50 -25
0
25 50 75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 31.
Figure 32.
Output Sink Current vs Ambient Temperature
(OUT=1.5V)
Input Offset Voltage vs Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
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Typical Performance Curves - continued
○BA2901YF-LB
8
6
4
160
140
120
100
80
2V
2
-40℃
0
5V
36V
25℃
-2
-4
-6
-8
60
40
125℃
20
0
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 33.
Figure 34.
Input Offset Voltage vs Ambient Temperature
Input Bias Current vs Supply Voltage
160
50
40
140
120
100
80
30
20
10
25℃
-40℃
36V
0
125℃
-10
-20
-30
-40
-50
60
40
5V
2V
20
0
0
10
20
30
40
-50 -25
0
25
50
75 100 125 150
Supply Voltage [V]
Ambient Temperature [°C]
Figure 36.
Input Offset Current vs Supply Voltage
Figure 35.
Input Bias Current vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
140
130
120
110
100
90
50
40
30
20
125℃
10
2V
-40℃
25℃
0
5V
36V
-10
-20
-30
-40
-50
80
70
60
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 37.
Figure 38.
Input Offset Current vs Ambient Temperature
Large Signal Voltage Gain
vs Supply Voltage
140
130
120
110
100
90
160
140
120
100
80
36V
125℃
25℃
5V
15V
-40℃
80
60
70
60
40
-50 -25
0
25
50
75 100 125 150
0
10
20
30
40
Ambient Temperature [°C]
Supply Voltage [V]
Figure 40.
Figure 39.
Common Mode Rejection Ratio
vs Supply Voltage
Large Signal Voltage Gain
vs Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
BA2903YF-LB BA2901YF-LB
Typical Performance Curves - continued
○BA2901YF-LB
150
125
6
4
25℃
36V
-40℃
100
2
125℃
75
0
5V
2V
50
25
0
-2
-4
-6
-50 -25
0
25
50
75 100 125 150
-1
0
1
2
3
4
5
Ambient Temperature [°C]
Input Voltage [V]
Figure 41.
Figure 42.
Common Mode Rejection Ratio
vs Ambient Temperature
Input Offset Voltage - Input Voltage
(VCC=5V)
5
4
3
2
1
0
200
180
160
140
120
100
80
125℃
-40℃
25℃
60
-50 -25
0
25
50
75 100 125 150
-100
-80
-60
-40
-20
0
Ambient Temperature [°C]
Over Drive Voltage [mV]
Figure 44.
Response Time (Low to High)
vs Over Drive Voltage
Figure 43.
Power Supply Rejection Ratio
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
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Typical Performance Curves - continued
○BA2901YF-LB
5
4
3
5
4
3
2
1
0
125℃
2
5mV overdrive
25℃
20mV overdrive
-40℃
100mV overdrive
1
0
-50 -25
0
25
50
75 100 125 150
0
20
40
60
80
100
Over Drive Voltage [mV]
Ambient Temperature [°C]
Figure 46.
Response Time (High to Low)
vs Over Drive Voltage
Figure 45.
Response Time (Low to High)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(VCC=5V, VRL=5V, RL=5.1kΩ)
5
4
3
2
1
0
5mV overdrive
20mV overdrive
100mV overdrive
-50 -25
0
25
50
75 100 125 150
Ambient Temperature [°C]
Figure 47.
Response Time (High to Low)
vs Ambient Temperature
(VCC=5V, VRL=5V, RL=5.1kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
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Datasheet
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 48(a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax-TA) / PD
°C/W
The Derating curve in Figure 48(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 48(c) and (d) shows an example of the derating curve for
BA2903YF-LB, BA2901YF-LB.
Power diss
ip
a
tion of LSI [W]
PD
(m x)
a
θJA=(TJmax-TA)/PD °C /W
P2
P1
θ
< θ
JA2 JA1
T
A
Ambient temperature
[ °C ]
θ’
JA2
θ
JA2
TJ’(max) TJ(max)
θ’JA
1
1
θJA1
0
25
50
75
100
T
[ °C ]
A
125
150
Chip surface temperature
TJ [ °C ]
Ambient temperature
(a) Thermal resistance
(b) Derating curve
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
(Note 14)
BA2903YF-LB
(Note 15)
BA2901YF-LB
0
25
50
75 100 125 150
0
25
50
75 100 125 150
Ambient Temperature [°C]
Ambient Temperature [°C]
(c) BA2903Y
(d) BA2901Y
(Note14)
6.2
(Note15)
4.5
UNIT
mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree.
Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted.
Figure 48. Thermal resistance and derating
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Datasheet
BA2903YF-LB BA2901YF-LB
Application Information
NULL method condition for Test circuit1
VCC,VEE,EK,VICM Unit：V
Parameter
VF
S1
S2
S3
VCC
VEE
0
EK
VICM
Calculation
Input Offset Voltage
Input Offset Current
VF1
ON
ON
ON
ON
5 to 36
-1.4
0
1
2
VF2
VF3
VF4
VF5
VF6
OFF
OFF
ON
OFF
ON
5
5
0
0
0
0
0
-1.4
-1.4
-1.4
-1.4
-11.4
0
0
0
0
0
Input Bias Current
ON
ON
3
4
OFF
5
15
15
Large Signal Voltage Gain
ON
ON
- Calculation -
1. Input Offset Voltage (VIO)
|VF1|
VIO
[V]
=
=
1+RF/RS
|VF2-VF1|
2. Input Offset Current (IIO)
3. Input Bias Current (IB)
[A]
IIO
RI ×(1+RF/RS)
|VF4-VF3|
=
[A]
IB
2 × RI ×(1+RF/RS)
ΔEK × (1+RF/RS)
AV
= 20Log
[dB]
4. Large Signal Voltage Gain (AV)
|VF5-VF6|
RF=50kΩ
0.1µF
500kΩ
SW1
VCC
DUT
EK
15V
RS=50Ω
RI=10kΩ
Vo
500kΩ
0.1µF
0.1µF
NULL
-15V
SW3
RL
RI=10kΩ
1000pF
RS=50Ω
50kΩ
VF
VICM
SW2
VRL
VEE
Figure 49. Test circuit1 (one channel only)
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Datasheet
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Switch Condition for Test Circuit 2
SW
1
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
SW No.
Supply Current
OFF
OFF
OFF
OFF
ON
OFF
ON
OFF
ON
ON
ON
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
ON
Output Sink Current
Output Saturation Voltage
Output Leakage Current
Response Time
OUT=1.5V
SINK=4mA
ON
OFF
ON
I
ON
OFF
OFF
OFF
OFF
OUT=36V
OFF
OFF
RL=5.1kΩ, VRL=5V
VCC
A
－
＋
SW1
SW2
SW3
SW4 SW5 SW6
SW7
VEE
RL
A
V
VRL
-IN
+IN
OUT
Figure 50. Test Circuit 2 (one channel only)
IN
IN
Input wave
Input wave
VREF
overdrive voltage
overdrive voltage
VREF
OUT
OUT
Output wave
VCC/2
Output wave
VCC/2
VCC
VCC
0V
0V
tRE (Low to High)
tRE (High to Low)
Figure 51. Response Time
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Datasheet
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Example of circuit
○Reference voltage is -IN
VCC
VRL
IN
IN
+
VREF
-
OUT
Reference Voltage
Vref
VEE
Time
OUT
High
While the input voltage is higher that the reference
voltage, the output voltage remains high. In case
the input voltage becomes lower than the reference
voltage, the output voltage will turn low.
Low
Time
○Reference voltage is +IN
IN
VCC
VRL
RL
VREF
Time
+
-
Reference Voltage
Vref
IN
VEE
OUT
High
Low
While the input voltage is smaller that the reference
voltage, the output voltage remains high. In case
the input voltage becomes higher than the
reference voltage, the output voltage will turn low.
Time
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Datasheet
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
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Datasheet
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Operational Notes – continued
11. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P+
P+
P+
P+
P
N
P
N
N
N
N
N
N
N
Parasitic
Element
Parasitic
Element
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Element
Parasitic
Element
Parasitic element
or Transistor
Figure 52. Example of Monolithic IC Structure
12. Unused Circuits
When there are unused circuits it is recommended that they be connected as in Figure 53, setting the non-inverting
input terminal to a potential within the in-phase input voltage range (VICR).
VCC
OPEN
+
-
keep this potential
in VICM
VICM
VEE
Figure 53. Disable Circuit Example
13. Input Terminal Voltage
Applying VEE + 36V to the input terminal is possible without causing deterioration of the electrical characteristics or
destruction, irrespective of the supply voltage. However, this does not ensure normal circuit operation. Please note that
the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric
characteristics.
14. Power Supply (signal / dual)
The comparator operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply
comparator can be used as a dual supply op-amp as well.
15. Terminal short-circuits
When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation
and, subsequently, destruction.
16. IC Handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
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Datasheet
BA2903YF-LB BA2901YF-LB
Physical Dimensions Tape and Reel Information
Package Name
SOP8
Max 5.35 (include. BURR)
Drawing: EX112-5001-1
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Datasheet
BA2903YF-LB BA2901YF-LB
Physical Dimension Tape and Reel Information - continued
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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Datasheet
BA2903YF-LB BA2901YF-LB
Marking Diagrams
SOP14(TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
Product Name
Package Type
Marking
BA2903Y
BA2901Y
F-LB
F-LB
SOP8
2903Y
SOP14
BA2901YF
Land pattern data
SOP8, SOP14
MIE
ℓ2
All dimensions in mm
Land length
Land pitch
Land space
MIE
Land width
b2
PKG
e
≧ℓ 2
SOP8
SOP14
1.27
4.60
1.10
0.76
Revision History
Date
Revision
001
Changes
30.Jan.2014
New Release
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - SS
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
相关型号：
BA2901YFV-M
车载适用品BA2903Yxxx-M、BA2901Yxx-M是各自独立的高增益比较器，是将2个电路集成于1个芯片的单片IC。尤其是工作范围较大，为+2V～+36V(单电源工作时)，且消耗电流较小，可用于汽车导航、汽车音响等用途。
ROHM
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