BD00JC0MNUX-M (新产品) [ROHM]

BD00JC0MNUX-M是一款可从超低电压输入实现超低电压输出的线性稳压器。通过使用N-MOS FET作为内置的功率晶体管，该产品可以在低至导通电阻(RON=200mΩ)所产生的电压差（超低输入电压差）下使用。通过降低输入输出电压差，可实现大电流(Iomax=1.0A)输出，也可降低转换损耗，因此，可替代开关电源。BD00JC0MNUX-M不需要开关电源所需的扼流线圈、整流二极管和功率晶体管，因此可降低应用产品的总成本并实现小型化。可使用外置电阻器将输出电压设置为0.65～2.7V的任意值。另外，通过使用NRCS引脚，可以调整电压输出的启动时间，因此可支持应用产品的电源时序。;


型号：	BD00JC0MNUX-M (新产品)
厂家：	ROHM
描述：	BD00JC0MNUX-M是一款可从超低电压输入实现超低电压输出的线性稳压器。通过使用N-MOS FET作为内置的功率晶体管，该产品可以在低至导通电阻(RON=200mΩ)所产生的电压差（超低输入电压差）下使用。通过降低输入输出电压差，可实现大电流(Iomax=1.0A)输出，也可降低转换损耗，因此，可替代开关电源。BD00JC0MNUX-M不需要开关电源所需的扼流线圈、整流二极管和功率晶体管，因此可降低应用产品的总成本并实现小型化。可使用外置电阻器将输出电压设置为0.65～2.7V的任意值。另外，通过使用NRCS引脚，可以调整电压输出的启动时间，因此可支持应用产品的电源时序。开关晶体管整流二极管电阻器稳压器
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中文：	中文翻译
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Datasheet

1A Variable Output

LDO Regulator with Power Good

BD00JC0MNUX-M

General Description

Key Specifications

BD00JC0MNUX-M is a low-voltage output 1ch linear

regulator IC that operates from a very low input supply

and offers an ideal performance in low input voltage to

low output voltage applications. It has built-in

N-MOSFET power transistor that minimizes the

input-to-output voltage differential producing very

◼ Input Power Supply Voltage Range

Input Voltage 1 (V_CC):

Input Voltage 2 (V_IN):

◼ Output Voltage Range:

◼ Output Current:

3.0V to 5.5V

0.95V to 4.5V

0.65V to 2.7V

1.0A

◼ Operating Temperature Range:

-40°C to +105°C

small ON

resistance

(RON=200mΩ) level. By

lowering the dropout voltage in this way, the IC can

operate even at high current (Iomax=1A) with very low

power loss. As a result, this eliminates the need for

switching regulator and its associated components.

BD00JC0MNUX-M is designed for small packages that

causes cost reduction. Its output voltage can be varied

from 0.65V to 2.7V and it has a soft start (NRCS)

function that enables an output voltage ramp-up which

can be set to whatever power supply sequence is

required.

Package

W(Typ) x D(Typ) x H(Max)

3.0mm x 3.0mm x 0.6mm

Features

◼ High Output Voltage Accuracy : ±1%

◼ Built-in VCC Under Voltage Lock Out circuit

◼ With Soft Start Function (NRCS)

◼ Low ON Resistance

◼ Built-in Over-Current Protection Circuit

◼ Built-in Thermal Shut Down circuit (TSD)

◼ Variable Output

VSON010X3030

◼ With Tracking Function

◼ Small package VSON010X3030

Typical Application Circuit

PGDLY

V_CC

V_O

6,7

R₂

100kΩ

V_IN

22µF

R₁

NRCS

0.01µF

1µF

22µF

GND

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Block Diagram

V_CC

V_IN

Current

Limit

UVLO

Reference

Block

V_CC

UVLO

TSD

Thermal

Shutdown

NRCS

TSD

Power

Good

GND

PGDLY

NRCS

CPGDLY

Figure 1. Block Diagram

Pin Description

Pin No.

Pin name

V_CC

Pin Function

Power supply pin

Enable input pin

Power Good pin

PGDLY

V_IN

Power Good Delay capacitor connection pin

Input voltage pin

V_O

Output voltage pin

V_O

Output voltage pin

Reference voltage feedback pin

NRCS

GND

In-rush current protection (NRCS) capacitor connection pin

Ground pin

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Description of Blocks

・AMP

This is an error amp that compares the reference voltage (0.65V) with Vo to drive the output Nch FET (Ron=200mΩ).

Frequency optimization helps to adjusts on rapid transient response, and to support the use of ceramic capacitors on the

output. AMP input voltage ranges from GND to 2.7V, while the AMP output ranges from GND to V_CC. When EN is OFF, or

when UVLO is active, output goes LOW and the output of the NchFET switches OFF.

・EN

The EN block controls the regulators ON/OFF state through the EN logic input pin. When OFF, circuit current is

maintained at 0µA, thus minimizing current consumption at standby. The FET is switched ON to enable discharge of the

NRCS pin and Vo, thereby draining the excess charge and preventing the IC on the load side from malfunctioning. Since

no electrical connection is required (e.g., between the V_CCpin and the ESD prevention Diode), operation is independent

of the input sequence.

・UVLO

To prevent malfunctions that can occur during a momentary decrease in V_CC, the UVLO circuit switches the output to OFF,

and (like the EN block) discharges NRCS and Vo. Once the UVLO threshold voltage (TYP2.5V) is reached, the power-on

reset is triggered and output continues.

・CURRENT LIMIT

When output is ON, the current limit monitors the internal IC output current against the designed value (2.0A). When

current exceeds this level, the current limit circuit lowers the output current to protect the IC. When the overcurrent state

is eliminated, output voltage is restored.

・NRCS (Non Rush Current on Start-up)

The soft start function is enabled by connecting an external capacitor between the NRCS pin and GND pin. Output

ramp-up can be set for any period up to the time the NRCS pin reaches V_FB(0.65V). During startup, the NRCS pin serves

as a 20μA (TYP) constant current source to charge the external capacitor. Output start time is calculated via formula (1)

below.

0.65V

t = C

・・・(1)

20μA

Tracking sequence is available by connecting the output voltage of external power supply instead of external capacitor.

And then, ratio-metric sequence is also available by changing the resistor divider network of external power supply output

voltage. (See next page)

・TSD (Thermal Shut Down)

The shutdown (TSD) circuit automatically switches the output OFF when the chip temperature gets too high, thus

protecting the IC against “thermal runaway” and heat damage. Because the TSD circuit is provided to shut down the IC in

the presence of extreme heat, in order to avoid potential problems with the TSD, it is crucial that the Tj (max) parameter

not be exceeded in the thermal design.

・V_IN

The V_INline acts as the major current supply line, and is connected to the output NchFET drain. Since no electrical

connection (such as between the V_CCpin and the ESD protection Diode) is necessary, V_INoperates independent of the

input sequence. However, since an output NchFET body Diode exists between V_INand Vo, a V_IN-Vo electric (Diode)

connection is present. Note, therefore, that when output is switched ON or OFF, reverse current may flow to V_INfrom Vo.

・PGOOD

It outputs the output voltage (Vo). PGOOD pin (open drain) is used to pull up the 100kΩ resistor. PGOOD is HIGH when

FB voltage is between 0.585V(TYP) to 0.715V(TYP), and LOW if the voltage is out of range.

・PGDLY

It is available to set PGOOD output delay. PGDLY pin should be connected to 100pF capacitor.

PGOOD delay time is determined by the following formula.

C(pF)×0.75

t_PGDLY

(μsec)

I_PGDLY(μA)

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Timing Chart

EN ON/OFF

V_IN

V_CC

0.65V(TYP)

NRCS

Startup

Vo×0.9V(TYP)

V_O

40μs (TYP@ C=100pF)

PGOOD

VCC ON/OFF

V_IN

UVLO

V_OPR

Hysteresis

V_CC

0.65V(TYP)

NRCS

V_O

Startup

Vo×0.9V(TYP)

40μs (TYP@100pF)

PGOOD

Tracking sequence

1.7V Output

1.2V Output

DC/DC

(R₁=3.9kΩ, R₂=3.3kΩ)

NRCS

V_O

1.7V

V_O

1.2V

Tracking sequence

R₂

R₁

3.3kΩ

1.7V Output

1.2V Output

3.9kΩ

Ratio-metric sequence

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Absolute Maximum Ratings

Parameter

Symbol

V_CC

Limit

Unit

Input Voltage 1

+6.0 ^{(Note 1)}

-0.3 to +6.0

+6.0 ^{(Note 1)}

0.575 ^{(Note 2)}

1.8 ^{(Note 3)}

-40 to +105

-55 to +150

+150

Input Voltage 2

V_IN

Enable Input Voltage

PGOOD Input Voltage

Power Dissipation 1

Power Dissipation 2

Operating Temperature Range

Storage Temperature Range

V_EN

V_PGOOD

Pd1

°C

Pd2

Topr

Tstg

Junction Temperature

(Note 1) Not to exceed Power dissipation (Pd)

Tjmax

(Note 2) Reduced by 4.6mW/℃ for temperature above 25℃ (when mounted on a 1-layer glass epoxy board with 74.2mm×74.2mm×1.6mm dimension,

and copper foil dimension = 6.28mm²).

(Note 3) Reduced by 14.4mW/℃ for temperature above 25℃ (when mounted on a 4-layer glass epoxy board with 74.2mm×74.2mm×1.6mm dimension,

and copper foil dimension = 6.28mm²).

Recommended Operating Conditions

Parameter

Input Voltage 1

Symbol

V_CC

Min

3.0

0.95

Max

Unit

5.5

VCC-1 ^{(Note 4)}

1.0

Input Voltage 2

V_IN

Output Current

I_O

PGOOD Input Voltage

Output Voltage Setting Range

Enable Input Voltage

V_PGOOD

V_O

-0.3

V_FB

-0.3

5.5

V_IN-dVo ^{(Note 5)}

V_EN

5.5

(Note 4) No power-ON sequence for VCC and VIN.

(Note 5) Minimum dropout voltage (Electrical Characteristics).

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Electrical Characteristics

(Unless otherwise specified Ta=-40 to 105°C, V_CC=5V, V_EN=3V, V_IN=1.7V, R₁=3.9kΩ, R₂=3.3kΩ)

Parameter

Circuit Current

Symbol

I_CC

Min

Typ

0.7

Max

1.0

Unit

µA

Conditions

VCC Shutdown Mode Current

Output Voltage

I_STB

V_EN=0V

Tj=25°C

VOUT

1.200

Output Voltage Temperature

Coefficient

T_CVO

0.01

%/°C

Feedback Voltage 1

Feedback Voltage 2

Load Regulation

V_FB1

V_FB2

0.643

0.650

0.5

0.657

0.663

0.637

Tj=-40 to 105°C

Reg.L

Reg.l1

Reg.l2

Id_EN

mV I_O=0A to 1.0A

Line Regulation 1

0.1

0.5

%/V V_CC=3.0V to 5.5V

%/V V_IN=1.5V to 3.3V

mA V_EN=0V, V_O=1V

Line Regulation 2

0.1

0.5

Standby Discharge Current

[ENABLE]

Enable Pin Input Voltage High

Enable Pin Input Voltage Low

Enable Input Bias Current

[NRCS]

EN_HI

EN_LOW

I_EN

VCC×0.15

μA

V_EN=3V

NRCS Charge Current

NRCS Standby Voltage

[UVLO]

I_NRCS

V_STB

μA

V_NRCS=0.5V

mV V_EN=0V

VCC Undervoltage Lockout

Threshold Voltage

VCC Undervoltage Lockout

Hysteresis Voltage

[PGOOD]

VCC_UVLO

VCC_HYS

2.3

2.5

2.7

V_CC:Sweep-up

100

150

mV V_CC:Sweep-down

Low-side Threshold Voltage

High-side Threshold Voltage

PGDLY charge current

Ron

V_THPGL

V_THPGH

I_PGDLY

R_PG

V_O×0.87 V_O×0.9

V_O×1.07 V_O×1.1

V_O×0.93

V_O×1.13

2.6

1.4

2.0

μA

150

[AMP]

Minimum dropout voltage

dV_O

200

300

mV I_O=1.0A, V_IN=1.2V

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Typical Performance Curves

(Unless otherwise specified V_CC=5V, V_EN=3V, V_IN=1.7V, R₁=3.9kΩ, R₂=3.3kΩ)

50mV/div

1.0A

1A/div

10µsec/div

Figure.2 Transient Response

(Io=0 → 1.0A, Ta=-40°C)

C_O=100uF, C_FB=1000pF

Figure.3 Transient Response

(Io=0 → 1.0A, Ta=25°C)

C_O=100uF, C_FB=1000pF

50mV/div

1.0A

1A/div

10µsec/div

Figure.4 Transient Response

(Io=0 → 1.0A, Ta=105°C)

C_O=100uF, C_FB=1000pF

Figure.5 Transient Response

(Io=0 → 1.0A, Ta=-40°C)

C_O=47uF, C_FB=1000pF

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Typical Performance Curves - continued

50mV/div

1.0A

1A/div

10µsec/div

Figure.6 Transient Response

(Io=0 → 1.0A, Ta=25°C)

C_O=47uF, C_FB=1000pF

Figure.7 Transient Response

(Io=0 → 1.0A, Ta=105°C)

C_O=47uF, C_FB=1000pF

50mV/div

1.0A

1A/div

20µsec/div

Figure.8 Transient Response

(Io=0 → 1.0A, Ta=-40°C)

C_O=22uF, C_FB=1000pF

Figure.9 Transient Response

(Io=0 → 1.0A, Ta=25°C)

C_O=22uF, C_FB=1000pF

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Typical Performance Curves - continued

50mV/div

1.0A

1A/div

20µsec/div

100µsec/div

Figure.11 Transient Response

Figure.10 Transient Response

(Io=0 → 1.0A, Ta=105°C)

C_O=22uF, C_FB=1000pF

(Io=1.0A → 0, Ta=-40°C)

C_O=100uF, C_FB=1000pF

50mV/div

1.0A

1A/div

100µsec/div

Figure.12 Transient Response

(Io=1.0A → 0, Ta=25°C)

C_O=100uF, C_FB=1000pF

Figure.13 Transient Response

(Io=1.0A → 0, Ta=105°C)

C_O=100uF, C_FB=1000pF

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Typical Performance Curves - continued

50mV/div

1.0A

1A/div

100µsec/div

Figure.15 Transient Response

Figure.14 Transient Response

(Io=1.0A → 0, Ta=-40°C)

C_O=47uF, C_FB=1000pF

(Io=1.0A → 0, Ta=25°C)

C_O=47uF, C_FB=1000pF

50mV/div

1.0A

1A/div

40µsec/div

100µsec/div

Figure.17 Transient Response

(Io=1.0A → 0, Ta=-40°C)

C_O=22uF, C_FB=1000pF

Figure.16 Transient Response

(Io=1.0A → 0, Ta=105°C)

C_O=47uF, C_FB=1000pF

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Typical Performance Curves - continued

50mV/div

1.0A

1A/div

40µsec/div

Figure.18 Transient Response

(Io=1.0A → 0, Ta=25°C)

C_O=22uF, C_FB=1000pF

Figure.19 Transient Response

(Io=1.0A → 0, Ta=105°C)

C_O=22uF, C_FB=1000pF

V_EN

2V/div

NRCS

1V/div

NRCS

1V/div

200µsec/div

Figure.20 Start-up Sequence 1

(Ta=-40°C)

Figure.21 Start-up Sequence 1

(Ta=25°C)

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Typical Performance Curves - continued

V_EN

2V/div

V_EN

2V/div

NRCS

1V/div

NRCS

1V/div

200µsec/div

1msec/div

Figure.23 OFF Sequence

(Ta=-40°C)

Figure.22 Start-up Sequence 1

(Ta=105°C)

V_EN

2V/div

NRCS

1V/div

NRCS

1V/div

1msec/div

Figure.24 OFF Sequence

(Ta=25°C)

Figure.25 OFF Sequence

(Ta=105°C)

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Typical Performance Curves - continued

V_CC

5V/div

V_CC

5V/div

V_EN

2V/div

V_EN

2V/div

V_IN

2V/div

V_IN

2V/div

V_O

1V/div

V_O

1V/div

20msec/div

Figure.27 Start-up Sequence 2

Figure.26 Start-up Sequence 2

(V_CC→ V_IN→ V_EN

)

(V_CC→ V_IN→ V_EN

)

Ta=25°C

Ta=-40°C

V_CC

5V/div

V_EN

2V/div

V_IN

2V/div

V_O

1V/div

20msec/div

Figure.28 Start-up Sequence 2

Figure.29 Start-up Sequence 3

(V_CC→ V_EN→ V_IN)

Ta=-40°C

(V_CC→ V_IN→ V_EN

)

Ta=105°C

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Typical Performance Curves - continued

V_CC

5V/div

V_CC

5V/div

V_EN

2V/div

V_EN

2V/div

V_IN

2V/div

V_IN

2V/div

V_O

1V/div

V_O

1V/div

20msec/div

Figure.31 Start-up Sequence 3

Figure.30 Start-up Sequence 3

(V_CC→ V_EN→ V_IN)

Ta=25°C

(V_CC→ V_EN→ V_IN)

Ta=105°C

V_CC

5V/div

V_EN

2V/div

V_IN

2V/div

V_O

1V/div

20msec/div

Figure.32 Start-up Sequence 4

Figure.33 Start-up Sequence 4

(V_IN→ V_CC→ V_EN

)

(V_IN→ V_CC→ V_EN

)

Ta=-40°C

Ta=25°C

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Typical Performance Curves - continued

V_CC

5V/div

V_CC

5V/div

V_EN

2V/div

V_EN

2V/div

V_IN

2V/div

V_IN

2V/div

V_O

1V/div

V_O

1V/div

20msec/div

Figure.35 Start-up Sequence 5

Figure.34 Start-up Sequence 4

(V_IN→ V_EN→ V_CC

)

(V_IN→ V_CC→ V_EN

)

Ta=-40°C

Ta=105°C

V_CC

5V/div

V_EN

2V/div

V_IN

2V/div

V_O

1V/div

20msec/div

Figure.36 Start-up Sequence 5

Figure.37 Start-up Sequence 5

(V_IN→ V_EN→ V_CC

)

(V_IN→ V_EN→ V_CC)

Ta=25°C

Ta=105°C

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Typical Performance Curves - continued

V_CC

5V/div

V_CC

5V/div

V_EN

2V/div

V_EN

2V/div

V_IN

2V/div

V_IN

2V/div

V_O

1V/div

V_O

1V/div

20msec/div

Figure.39 Start-up Sequence 6

Figure.38 Start-up Sequence 6

(V_EN→ V_CC→ V_IN)

Ta=-40°C

(V_EN→ V_CC→ V_IN)

Ta=25°C

V_CC

5V/div

V_EN

2V/div

V_IN

2V/div

V_O

1V/div

20msec/div

Figure.40 Start-up Sequence 6

(V_EN→ V_CC→ V_IN)

Ta=105°C

Figure.41 Start-up Sequence 7

(V_EN→ V_IN→ V_CC

)

Ta=-40°C

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Typical Performance Curves - continued

V_CC

5V/div

V_CC

5V/div

V_EN

2V/div

V_EN

2V/div

V_IN

2V/div

V_IN

2V/div

V_O

1V/div

V_O

1V/div

20msec/div

Figure.43 Start-up Sequence 7

Figure.42 Start-up Sequence 7

(V_EN→ V_IN→ V_CC

)

(V_EN→ V_IN→ V_CC

)

Ta=105°C

Ta=25°C

0.8

0.7

0.6

0.5

0.4

0.3

0.2

1.25

1.23

1.21

1.19

1.17

1.15

1.13

105

-40

-10

Ta (°C)

105

-40

-10

Ta (°C)

Figure.44 Ta-Vo

(I_O=0mA)

Figure.45 Ta-I_CC

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Typical Performance Curves - continued

0.12

0.10

0.08

0.06

0.04

0.02

0.00

1.80

1.75

1.70

1.65

1.60

1.55

1.50

105

-40

-10

Ta (°C)

-40

-10

Ta (°C)

Figure.46 Ta-I_STB

Figure.47 Ta-I_IN

30.0

27.0

25.0

23.0

21.0

19.0

17.0

15.0

25.0

20.0

15.0

10.0

5.0

0.0

105

-40

-10

Ta (°C)

-40

-10

Ta (°C)

Figure.48 Ta-I_INSTB

Figure.49 Ta-I_NRCS

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Typical Performance Curves - continued

15.0

10.0

5.0

12.0

10.0

8.0

0.0

6.0

-5.0

4.0

-10.0

-15.0

2.0

0.0

105

-40

-10

Ta (°C)

-40

-10

Ta (°C)

Figure.50 Ta-I_FB

Figure.51 Ta-I_EN

200

180

160

140

120

100

220

200

180

160

140

120

100

Ta=105°C

Ta=25°C

Ta=-40°C

105

-40

-10

Ta (°C)

VCC (V)

Figure.52 Ta-R_ON

(V_CC=5V, V_O=1.2V)

Figure.53 V_CC-R_ON

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Evaluation Board

■ Evaluation Board Schematic

BD00JC0MN

BD00JC0MNUX-M

(VSON010X3030)

■ Evaluation Board Standard Component List

Component Rating Manufacturer Product Name

ROHM

BD00JC0MNUX-M

GRM188B11A105KD

GRM188B11H103KD

GRM188B11H101KD

Jumper

C13

22uF

KYOCERA

CM32X5R226M10A

GRM188B11H102KD

MCR03EZPF3901

MCR03EZPF3301

MCR03EZPF

1uF

MURATA

1000pF MURATA

3.9kΩ ROHM

3.3kΩ ROHM

100kΩ ROHM

C10

C11

0.01uF MURATA

100pF MURATA

0Ω

22uF

KYOCERA

CM32X5R226M10A

■ Evaluation Board Layout

(2nd layer and 3rd layer are GND Line)

Silkscreen

Bottom Layer

TOP Layer

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Recommended Circuit Example

V_CC

GND

V_CC

V_O(1.2V)

V_IN

Recommended

Component

Value

Programming Notes and Precautions

IC output voltage can be set with a configuration formula using the values for the internal

reference output voltage (V_FB) and the output voltage resistors (R1, R2). Select resistance

values that will avoid the impact of the V_REFcurrent (±100nA). The recommended total

resistance value is 10KΩ.

R1/R2

3.9k/3.3k

To assure output voltage stability, there should be capacitor connected across V_Opins and

the GND pin. Output capacitor plays a role in loop gain phase compensation and in

mitigating output fluctuation during rapid changes in load level. Insufficient capacitance

may cause oscillation, while high equivalent series reisistance (ESR) will exacerbate

output voltage fluctuation under rapid load change conditions. While a 22μF ceramic

capacitor is recomended, actual stability is highly dependent on temperature and load

conditions. Also, note that connecting different types of capacitors in series may result in

insufficient total phase compensation, thus causing oscillation. In light of this information,

please confirm operation across a variety of temperature and load conditions.

Input capacitor reduce the output impedance of the voltage supply source connected to

22μF

the (V_CC) input pin. If the impedance of this power supply increases, input voltage (V_CC

)

could become unstable, leading to oscillation or lowered ripple rejection function. While a

low-ESR 1μF capacitor with minimal susceptibility to temperature is recommended,

stability is highly dependent on the input power supply characteristics and the substrate

wiring pattern. In light of this information, please confirm operation across a variety of

temperature and load conditions.

Input capacitor reduce the output impedance of the voltage supply source connected to

the (V_IN) input pin. If the impedance of this power supply increases, input voltage (V_IN)

could become unstable, leading to oscillation or lowered ripple rejection function. While a

low-ESR 22μF capacitor with minimal susceptibility to temperature is recommended,

stability is highly dependent on the input power supply characteristics and the substrate

wiring pattern. In light of this information, please confirm operation across a variety of

temperature and load conditions.

The Non Rush Current on Startup (NRCS) function is built into the IC to prevent rush

current from going through the load (V_INto V_O) and impacting output capacitors at power

supply start-up. Constant current comes from the NRCS pin when EN is HIGH or the

UVLO function is deactivated. The temporary reference voltage is proportionate to time,

due to the current charge of the NRCS pin capacitor, and output voltage start-up is

proportionate to this reference voltage. Capacitors with low susceptibility to temperature

are recommended, in order to assure a stable soft-start time.

1μF

22μF

0.01μF

This component is employed when the C3 capacitor causes, or may cause, oscillation. It

provides more precise internal phase correction.

100pF

Capacitor to set delay of power good. 100pF is recommended.

100k

It is pull-up resistance of Open Drain pin. 100kΩ is recommended.

Several kΩ

It is recommended that a resistance (several kΩ to several 10kΩ) be place in R4, in case

～several 10kΩ negative voltage is applied in EN pin.

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I/O Equivalent Circuit Diagram

(Resistance value is Typical)

V_IN

V_OUT

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Notes for Use

1. Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If

any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,

such as fuses.

2. GND Voltage

The potential of GND pin must be minimum potential in all operating conditions.

3. Thermal design

Use a thermal design that allows for a sufficient margin considering the power dissipation (Pd) in actual operating

conditions.

4. Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

5. ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

6. Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit: Latch type). The thermal shutdown circuit (TSD

circuit: Latch type) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or

guarantee its operation.

Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this

circuit is assumed.

TSD ON temperature

[℃](typ.)

Hysteresis temperature [℃]

(typ.)

175

7. Ground Wiring Pattern

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external components.

8. Output voltage resistance setting (R1, R2)

Output voltage is adjusted with resistor R1 and R2. Output voltage is calculated as V_FB×(R1+R2) / R1. Total 10kΩ is

recommended so that the output voltage is not affected by the V_FBbias current.

9. Output capacitor (C3)

To assure output voltage stability, there should be capacitor connected across V_Opins and the GND pin. Output

capacitors play a role in loop gain phase compensation and in mitigating output fluctuation during rapid changes in load

level. Insufficient capacitance may cause oscillation, while high equivalent series resistance (ESR) will exacerbate output

voltage fluctuation under rapid load change conditions. While a 47uF ceramic capacitor is recommended, actual stability

is highly dependent on temperature and load conditions. Also, note that connecting different types of capacitors in series

may result in insufficient total phase compensation, thus causing oscillation. In light of this information, please confirm

operation across a variety of temperature and load conditions.

10. Input capacitors setting (C1, C2)

Input capacitors reduce the impedance of the voltage supply source connected to the (V_CC, V_IN) input pins. If the

impedance of this power supply increases, input voltage (V_CC, V_IN) could become unstable, leading to oscillation or

lowered ripple rejection function. Stability highly depends on the input power supply characteristic and the substrate

wiring pattern. Please confirm operation across a variety of temperature and load conditions.

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11. NRCS pin capacitors setting (CNRCS)

The Non Rush Current on Startup (NRCS) function is built in the IC to prevent rush current from going through the load

(V_INto V_O) and impacting output capacitors at power supply start-up. The constant current comes from the NRCS pin

when EN is HIGH or the UVLO function is deactivated. The temporary reference voltage is proportionate to time, due to

the current charge of the NRCS pin capacitor, and output voltage start-up is proportionate to this reference voltage. To

obtain a stable NRCS delay time, capacitors with low susceptibility to temperature are recommended.

12. Input pins (V_CC, V_IN, EN)

This IC’s EN pin, V_INpin, and V_CCpin are isolated, and the UVLO function is built in the V_CCpin to prevent undervoltage

lockout. It does not depend on the Input pin order. Output voltage starts up when V_CCand EN reach the threshold voltage.

However, note that when putting in V_INpin lastly, V_Omay result in overshooting.

13. Heat sink (FIN)

Since the heat sink (FIN) is connected to with the Sub, short it to the GND. It is possible to minimize the thermal

resistance by soldering it to substrate. Please solder properly.

(e.g.)

14. Please add a protection diode when a large inductance

OUTPUT PIN

component is connected to the output terminal,

and reverse-polarity power is possible at start-up

or in output OFF condition.

15. Short-circuits between pins and mounting errors

Please be sure to install the IC in correct position and orientation. Mounting errors, such as incorrect positioning or

orientation, or connecting of the power supply in reverse polarity can also destroy the IC. Short-circuit between pins or

pin and the power supply, or between ground may also damage to the IC.

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Heat Loss

Thermal design should allow operation within the following conditions. Note that the temperatures listed are the allowed

temperature limits, and thermal design should allow sufficient margin from the limits.

1. Ambient temperature Ta can be no higher than 105°C.

2. Chip junction temperature (Tj) can be no higher than 150°C.

Chip junction temperature can be determined as follows:

①Calculation based on ambient temperature (Ta)

Tj=Ta+θj-a X W

< Reference values >

θj-a:VSON010X3030

215°C/W

69.4°C/W

1-layer substrate (Bottom copper foil area: 6.28mm²)

4-layer substrate (Bottom copper foil area: 6.28mm²)

PCB size: 74.2mm×74.2mm×1.6mm (substrate with thermal via)

It is recommended to layout the VIA for heat radiation in the GND pattern of reverse (of IC) when there is the GND pattern

in the inner layer (in using multiplayer substrate). This package is so small (size: 3.0mm×3.0mm) that it is not available to

layout the VIA in the bottom of IC. Spreading the pattern and being increased the number of VIA like the figure below)

enables to get the superior heat radiation characteristic. (The figure below shows the recommended VIA size and the

number suitable for the actual situation.)

Most of the heat loss that occurs in the BD00JC0MNUX-M is generated from the output Nch FET. Power loss is determined

by the total VIN-Vo voltage and output current. Be sure to confirm the system’s input and output voltage and the output

current conditions in relation to the heat dissipation characteristics of the VIN and Vo in the design. Bearing in mind that

heat dissipation may vary substantially depending on the substrate employed (due to the power package incorporated in

the BD00JC0MNUX-M) considering other factor such as substrate size into the thermal design.

Power consumption (W) = { Input voltage (V_IN)- Output voltage (Vo) (Vo≒VREF) } x Io(Ave)

Example: When V_IN=1.7V, V_O=1.2V, Io(Ave) = 1A,

Power consumption (W) = { 1.7(V)-1.2(V) } x 1.0(A)

= 0.5(W)

Power Dissipation

VSON010X3030

[W]

3.0

(1) Mounted on 1-layer board

Bottom copper foil area: 6.28mm²

θj-a=215.5°C/W

(2) Mounted on 4-layer board

2.0

(2) 1.8W

Bottom copper foil area: 6.28mm²

θj-a=69.4°C/W

1.0

(1) 0.575W

85 105 125

150

[°C]

Ambient Temperature [Ta]

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Ordering Information

B D 0 0

0 M N U

M E 2

Part

Output

Input

Voltage

Output Automotive Package

Current

Packaging and forming

specification

Number voltage

00:Variable J:6V

C0:1A

“M”:M-series NUX:VSON010X3030 E2:Emboss tape reel

Marking Diagram

VSON010X3030 (TOP VIEW)

Part Number Marking

LOT Number

J C 0

M N X

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

VSON010X3030

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Revision History

Date

Revision

Changes

2.Dec.2013

001

New Release

P4: A writing errors of Timing Chart was corrected.

P11 and P12: A writing errors of Figure.20 to Figure.25 was corrected.

P22: I/O Equivalent Circuit Diagram was fixed.

P22: Reference landing pattern was removed.

P25: A writing errors of Heat Loss was corrected.

P25: A writing errors of Power Dissipation was corrected.

P26: Add Marking Diagram.

19.Apr.2022

002

P27: Add Physical Dimension and Packing Information.

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD00JC0MNUX-M (新产品) [ROHM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E