BD18IC0WEFJ-GTR_技术文档

Datasheet

1A Variable / Fixed Output

LDO Regulators

BDxxIC0WEFJ / BDxxIC0WHFV

●General Description

BDxxIC0W series devices are LDO regulators with an output current of 1.0A. The output accuracy is ±1% of the output

voltage. Both fixed and variable output voltage devices are available. The output voltage of the variable output voltage

device can be varied from 0.8 to 4.5V using external resistors. Various fixed output voltage devices that do not use external

resistors are also available. These LDO regulators are available in two package types: HTSOP-J8 (4.90mm x 6.00mm x

1.00mm) and HVSOF6 (1.60mm x 3.00mm x 0.75mm), and can be used in a wide variety of digital appliances. These

devices have built in over current protection to protect the device when output is shorted, 0µA shutdown mode and thermal

shutdown circuit to protect the device during over load conditions. These LDO regulators are usable with ceramic capacitors

that enable a smaller layout and longer life.

●Features

+/-1% output voltage accuracy

●Package

HTSOP-J8

HVSOF6

(Typ.)

(Max.)

4.90mm x 6.00mm x 1.00mm

1.60mm x 3.00mm x 0.75mm

Built-in Over Current Protection circuit (OCP)

Built-in Thermal Shut Down circuit (TSD)

Zero µA Shutdown mode

●Key Specifications

■

Input Power Supply Voltage range:

Output Voltage range(Variable type):

2.4V to 5.5V

0.8V to 4.5V

Output Voltage(Fixed type):

1.0V/1.2V/1.25V/1.5V

1.8V/2.5V/2.6V/3.0V/3.3V

(1.25V/2.6V:HVSOF6 only)

1.0A (Max.)

■

Output Current:

Shutdown Current:

Operating Temperature Range:

0 µA (Typ.)

-25 to +85℃

HTSOP-J8

HVSOF6

●Typical Application Circuit

V_CC

V_O

FB

V_CC

V_O

C_OUT

C_IN

R₁

R₂

V_{O_S}

EN

GND

FIN

GND

FIN

C_IN,C_OUT: Ceramic Capacitor

Output voltage variable type

Output voltage fixed type

○Product structure：Silicon monolithic integrated circuit ○This product is not designed with protection against radioactive rays.

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TSZ02201-0R6R0A600430-1-2

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Ordering Information

B D x x I

C

0 W

y

y y -

z z

Part

Output

Input

Output

Shutdown

Package

Packaging and forming specification

Number voltage

voltage

range

current mode

00:Variable :7V

C0:1.0A

EFJ : HTSOP-J8 E2 : Emboss tape reel(HTSOP-J8)

HFV : HVSOF6 GTR : Emboss tape reel(HVSOF6)

“W”：included

10:1.0V

12:1.2V

1C:1.25V

15:1.5V

18:1.8V

25:2.5V

26:2.6V

30:3.0V

33:3.3V

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TSZ02201-0R6R0A600430-1-2

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Block Diagram

BD00IC0WEFJ / BD00IC0WHFV (Variable output voltage type)

V_CC

OCP

SOFT

START

V_O

FB

EN

TSD

GND

Fig.1 Block Diagram

●Pin Configuration and Pin Description

(HTSOP-J8)

Pin No.

Pin name

V_O

Pin Function

1

Output pin

Feedback pin

GND pin

1

2

3

4

8

V_O

FB

V_CC

2

FB

3

GND

N.C

EN

7

N.C

4

No Connect (Connect to GND or leave OPEN)

Enable pin

6

N.C

GND

N.C

5

6

N.C

V_CC

No Connect (Connect to GND or leave OPEN)

Input pin

5

EN

7

8

Reverse

FIN

Substrate (Connect to GND)

(HVSOF6)

Pin No.

Pin name

V_O

Pin Function

1

Output pin

Vo

FB

1

2

3

Vcc

6

5

4

2

FB

Feedback pin

3

GND

EN

GND pin

N.C

EN

4

Enable pin

5

6

N.C

No Connect (Connect to GND or leave OPEN)

Input pin

GND

V_CC

Reverse

FIN

Substrate (Connect to GND)

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Block Diagram

BDxxIC0WEFJ / BDxxIC0WHFV (Fixed output voltage type)

V_CC

OCP

SOFT

START

V_O

EN

TSD

V_{O_S}

GND

Fig.2 Block Diagram

●Pin Configuration and Pin Description

(HTSOP-J8)

Pin No.

Pin name

V_O

Pin Function

1

Output pin

1

8

V_O

V_{O_S}

GND

N.C

V_CC

2

V_{O_S}

GND

N.C

Output voltage monitor pin

GND pin

3

2

3

4

7

N.C

4

No Connect (Connect to GND or leave OPEN)

Enable pin

6

N.C

5

EN

6

N.C

No Connect (Connect to GND or leave OPEN)

Input pin

5

EN

7

8

N.C

V_CC

Reverse

FIN

Substrate (Connect to GND)

(HVSOF6)

Pin No.

Pin name

V_O

Pin Function

Output pin

1

2

3

V_CC

V_O

V_{O_S}

GND

6

5

4

2

V_{O_S}

GND

EN

Output voltage monitor pin

GND pin

3

N.C

EN

4

Enable pin

5

6

N.C

No Connect (Connect to GND or leave OPEN)

Input pin

V_CC

Reverse

FIN

Substrate (Connect to GND)

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TSZ02201-0R6R0A600430-1-2

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Absolute Maximum Ratings (Ta=25℃)

Parameter

Symbol

Ratings

Unit

Power supply voltage

EN voltage

V_CC

V_EN

7.0 *¹

V

7.0

2110 ^*2

Power dissipation

HTSOP-J8

Pd

mW

℃

Operating Temperature Range

Storage Temperature Range

Topr

Tstg

Tjmax

-25 to +85

-55 to +150

+150

℃

Junction Temperature

℃

*1 Not to exceed Pd

*2 Reduced by 16.9mW/℃ for each increase in Ta of 1℃ over 25℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)

●Recommended Operating Ratings (Ta=25℃)

Ratings

Parameter

Symbol

Unit

Min.

2.4

0.0

0.8

0.0

Max.

5.5

Input power supply voltage

EN voltage

V_CC

V_EN

V_O

I_O

V

A

5.5

Output voltage setting range

Output current

4.5

1.0

●Electrical Characteristics (Unless otherwise noted, Ta=25℃, EN=3V, V_CC=3.3V, R1=16kΩ, R2=7.5kΩ)

Limits

Parameter

Symbol

Unit

Conditions

Min.

Typ.

0

Max.

5

Circuit current at shutdown mode

Bias current

I_STB

I_CC

-

µA V_EN=0V, OFF mode

µA

-

250

-

500

1

Line regulation

Reg.Ii

Reg I_O

V_CO1

V_CO2

V_CO3

V_CO4

V_FB

-1

%

V

V_CC=( V_O+0.6V )→5.5V

I_O=0→1.0A

Load regulation

-1.5

-

1.5

Minimum dropout voltage1

Minimum dropout voltage2

Minimum dropout voltage3

Minimum dropout voltage4

Output reference voltage(variable type)

Output voltage(Fixed type)

EN Low voltage

-

0.10

0.20

0.30

0.40

0.800

Vo

-

0.15

0.30

0.45

0.60

0.808

Vo×1.01

0.8

V_CC=3.3V, I_O=250mA

V_CC=3.3V, I_O=500mA

V_CC=3.3V, I_O=750mA

V_CC=3.3V, I_O=1.0A

I_O=0A

-

V

-

V

-

V

0.792

V

V_O

Vo×0.99

V

I_O=0A

V_{EN_Low}

V_{EN_High}

I_EN

0

2.4

1

V

EN High voltage

-

5.5

V

EN Bias current

3

9

µA

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TSZ02201-0R6R0A600430-1-2

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Typical Performance Curves

(Unless otherwise noted, Ta=25℃, EN=3V, V_CC=3.3V, R1=16kΩ, R2=7.5kΩ)

V

V_O

O

VV

O

OO

I_O

I

I_O_OI_O

Fig.4

Fig.3

Transient Response(0→1.0A)

Co=1.0µF

Transient Response(1.0→0A)

Co=1.0µF

V_EN

V_CC

V_O

Fig.5

Input sequence1

Co=1.0µF

Fig.6

OFF sequence 1

Co=1.0µF

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

V_EN

V_CC

V_O

Fig.8

Fig.7

OFF sequence 2

Co=1.0µF

Input sequence2

Co=1.0µF

Ta[℃]

Fig.10

Ta-V_O(I_O=0A)

Fig.9

Ta-V_FB

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BDxxIC0WEFJ / BDxxIC0WHFV

Ta[℃]

Fig.12

Fig.11

Ta-I_CC

Ta-I_STB(V_EN=0V)

Ta[℃]

V_CC[V]

Fig.14

Ta-I_EN

Fig.13

V_CC-I_STB(V_EN=0V)

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

I_O[A]

Fig.16

I_O-V_O(V_O=1.5V)

Fig.15

I_O-V_O(V_O=1.2V)

I_O[A]

Fig.18

I_O-V_O(V_O=2.5V)

Fig.17

I_O-V_O(V_O=1.8V)

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

I_O[A]

V_CC[V]

Fig.19

I_O-V_O(V_O=3.3V)

Fig.20

V_CC-V_O(I_O=0A)

Ta[℃]

I_O[A]

Fig.22

OCP

(V_CC=5V, V_O=3.3V)

Fig.21

TSD (I_O=0A)

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

I_O[A]

Fig.23

OCP

Fig.24

OCP

(V_CC=5V, V_O=2.5V)

(V_CC=5V, V_O=1.8V)

I_O[A]

Fig.25

OCP

Fig.26

OCP

(V_CC=5V, V_O=1.5 V)

(V_CC=5V, V_O=1.2 V)

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TSZ02201-0R6R0A600430-1-2

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

I_O[A]

Fig.27

OCP

Fig.28

OCP

(V_CC=3.3V, V_O=2.5V)

(V_CC=3.3V, V_O=1.8V)

I_O[A]

Fig.30

OCP

(V_CC=3.3V, V_O=1.2 V)

Fig.29

OCP

(V_CC=3.3V, V_O=1.5 V)

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BDxxIC0WEFJ / BDxxIC0WHFV

I_O[A]

Fig.31

ESR-IO characteristics

(Co=2.2µF)

Fig.32

I_O-I_CC

Ta[℃]

Fig.34

Fig.33

PSRR(I_O=0A)

Minimum dropout Voltage 1

(V_CC=3.3V, I_O=1.0A)

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BDxxIC0WEFJ / BDxxIC0WHFV

I_O[A]

Fig.35

Fig.36

Minimum dropout Voltage2

(V_CC=2.4V)

Minimum dropout Voltage3

(V_CC=3.3V)

I_O[A]

Fig.37

Minimum dropout Voltage4

(V_CC=5.0V)

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TSZ02201-0R6R0A600430-1-2

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Power Dissipation

◎HTSOP-J8

4.0

⑤3.76W

Measurement condition: mounted on a ROHM

board,

Substrate size: 70mm × 70mm × 1.6mm

(Substrate with thermal via)

・Solder the thermal pad to Ground

3.0

① IC only

θj-a=249.5℃/W

④2.11W

2.0

② 1-layer（copper foil are :0mm×0mm）

θj-a=153.2℃/W

③ 2-layer（copper foil are :15mm×15mm）

θj-a=113.6℃/W

④ 2-layer（copper foil are :70mm×70mm）

θj-a=59.2℃/W

③1.10W

1.0

②0.82W

①0.50W

⑤ 4-layer（copper foil are :70mm×70mm）

θj-a=33.3℃/W

0

25

50

75

100

125

150

Ambient_周Te_囲m_温p_度e_:r_Ta_atu_[℃re_]:Ta [℃]

◎HVSOF6

4.0

Measurement condition: mounted on a ROHM

board,

Substrate size: 70mm × 70mm × 1.6mm

(Substrate with thermal via)

・Solder the thermal pad to Ground

3.0

2.0

① single-layer(copper foil are :2%)

θj-a=147.1℃/W

② single-layer(copper foil are :18%)

θj-a=89.3℃/W

③1.7W

③single-layer(copper foil are :51%)

θj-a=73.5℃/W

②1.4W

1.0

0.0

①0.85W

0

25

50

75

100

150

Ambient Temperature: Ta [℃] ¹²⁵

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed

temperature limits and thermal design should allow sufficient margin beyond these limits.

1. Ambient temperature Ta can be no higher than 85℃.

2. Chip junction temperature (Tj) can be no higher than 150℃.

Chip junction temperature can be determined as follows:

Calculation based on ambient temperature (Ta)

Tj=Ta+θj-a×P

＜Reference values＞

1-layer substrate (copper foil density 0mm×0mm)

2-layer substrate (copper foil density 15mm×15mm)

2-layer substrate (copper foil density 70mm×70mm)

4-layer substrate (copper foil density 70mm×70mm)

θj-a：HTSOP-J8 153.2℃/W

113.6℃/W

59.2℃/W

33.3℃/W

Substrate size: 70mm×70mm×1.6mm (substrate with thermal via)

Most of the heat loss that occurs in the BDxxIC0W series is generated from the output Pch FET. Power loss is determined by

the total V_CC-V_Ovoltage and output current. Be sure to confirm the system input and output voltage as well as the output current

conditions in relation to the heat dissipation characteristics of the V_CCand V_Oin the design. Bearing in mind that heat dissipation

may vary substantially depending on the substrate employed (due to the power package incorporated in the BDxxIC0W

series )make certain to factor conditions such as substrate size into the thermal design.

Power consumption [W] = Input voltage (V_CC) - Output voltage (V_O) ×I_O(Ave)

Example) When V_CC=3.3V, V_O=2.5V, I_O(Ave) = 0.1A

Power consumption [W] = 3.3V - 2.5V ×0.1A

=0.08[W]

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Input-to-Output Capacitor

It is recommended that a capacitor (over 1uF) is placed near pins between the input pin and GND as well as the output pin

and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also,

as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation

will be and the capacitor will make improvements of characteristics depending on the load. However, please check the

actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different,

thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use.

For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application.

10

0

Rated Voltage：10V

B1 characteristics

Rated Voltage：10V

B characteristics

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

Rated Voltage：6.3V

B characteristics

Rated Voltage:10V

F characteristics

Rated Voltage：4V

X6S characteristics

0

1

2

3

4

DC Bias Voltage [V]

Ceramic capacitor capacity – DC bias characteristics

(Characteristics example)

●Equivalent Series Resistance ESR (Output Capacitor)

10.00

1.00

0.10

0.01

To prevent oscillations, please attach a capacitor between

V_Oand GND. Capacitors usually have ESR (Equivalent

Series Resistance). Operation will be stable in the ESR-I_O

range shown to the right. Ceramic, tantalum and

electrolytic Capacitors have different ESR values, so

please ensure that you are using a capacitor that operates

in the stable operating region shown on the right. Finally,

please evaluate in the actual application.

Safety area

C_O=1uF

0

0.2

0.4

Io [A]

0.6

0.8

1

ESR – I_Ocharacteristics

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Evaluation Board Circuit

U1

C3

C7

8

1

2

3

V_CC

N.C

EN

V_O

C6

C5

C2

C1

R1

R2

7

FB

GND

6

5

GND

N.C.

SW1

V_O

EN

4

FIN

●Evaluation Board Parts List

Designation Value

Part No.

Company Designation Value

Part No.

Company

R1

R2

R3

R4

R5

R6

C1

C2

C3

16kΩ MCR01PZPZF1602

7.5kΩ MCR01PZPZF7501

ROHM

C4

C5

C6

C7

C8

C9

C10

U1

U2

‐

1µF

‐

ROHM

CM105B105K10A

KYOCERA

‐

1µF

‐

CM105B105K16A

KYOCERA

‐

BD00IC0WEFJ

‐

ROHM

‐

●Board Layout

EN

GND

C_IN

(

)

V_CC

V_IN

R1

R2

C_OUT

V_O

PCB layout considerations:

・Input capacitor C_INconnected to V_CC(Vin) should be placed as close to V_CC(V_IN) pin as possible.

Output capacitor C_OUTalso should be placed as close to IC pin as possible. In case the part is connected to inner layer

GND plane, please use several through holes.

・FB pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as

possible. Please take care of this during layout.

・Please make GND pattern wide enough to handle thermal dissipation.

・For output voltage setting

Output voltage can be set by FB pin voltage (0.800V typ.) and external resistance R1, R2.

R1+R2

V_O= V_FB×

R2

(The use of resistors with R1+R2=1k to 90k is recommended)

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●I/O Equivalent Circuits (Variable type：BD00IC0WEFJ)

8pin(V_CC) / 1pin(V_O)

8pin(V_CC

2pin(FB)

5pin(EN)

)

2pin(FB)

5pin(EN)

520kΩ

1pn(V_O)

480kΩ

●I/O Equivalent Circuits (Fixed type：BDxxIC0WEFJ)

8pin(V_CC) / 1pin(V_O)

2pin(V_{O_S}

)

5pin(EN)

8pin(V_CC

)

2pin(V_{O_S}

)

520kΩ

5pin(EN)

480kΩ

1pin(V_O)

●I/O Equivalent Circuits (Variable type：BD00IC0WHFV)

6pin(V_CC) / 1pin(V_O) 2pin(FB)

6pin(V_CC

4pin(EN)

)

2pin(FB)

4pin(EN)

520kΩ

1pn(V_O)

480kΩ

●I/O Equivalent Circuits (Fixed type：BDxxIC0WHFV)

6pin(V_CC) / 1pin(V_O)

2pin(V_{O_S}

)

4pin(EN)

6pin(V_CC

)

2pin(V_{O_S}

)

4pin(EN)

520kΩ

480kΩ

1pin(V_O)

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Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Operational Notes

(1) Absolute maximum ratings

An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can

break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit.

If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as

fuses.

(2) Connecting the power supply connector backward

Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power

supply lines. An external direction diode can be added.

(3) Power supply lines

Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply

line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply

terminals to ICs, connect a capacitor between the power supply and GND terminal. When using electrolytic capacitors in

a circuit, note that capacitance values are reduced at low temperatures and over time.

(4) GND voltage

The potential of the GND pin must be minimum potential under all operating conditions.

(5) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

(6) Off-leakage at high temperature.

Off-leakage at high temperature may increase because of manufacturing variations.

Design should consider the typical & worst cases shown below.

Ta-Ileak

0.5

0.4

worst

0.3

0.2

0.1

typ

0

25

50

75

100

125

150

Temperature (℃)

(7) Inter-pin shorts and mounting errors

Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any

connection error or if pins are shorted together.

(8) Actions in strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to

malfunction.

(9) ASO

When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.

(10) Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is

designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.

Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit

is assumed.

TSD ON Temperature[℃] (typ.)

Hysteresis Temperature [℃] (typ.)

BDxxIC0W series

175

15

www.rohm.com

TSZ02201-0R6R0A600430-1-2

21.Dec.2012 Rev.002

20/23

TSZ22111･15･001

Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

(11)Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.

Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or

removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic

measure. Use similar precaution when transporting or storing the IC.

(12) Regarding input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic

diode or transistor. For example, the relation between each potential is as follows:

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes

operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.

Resistor

Transistor (NPN)

Pin A

Pin B

B

C

E

Pin A

B

C

E

N

P⁺

P

N

P⁺

P

P⁺

N

Parasitic

element

P substrate

Parasitic

GND

element

Other adjacent elements

GND

Parasitic element

(13) Ground Wiring Pattern.

When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,

placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage

variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change

the GND wiring pattern of any external components, either.

www.rohm.com

TSZ02201-0R6R0A600430-1-2

21.Dec.2012 Rev.002

21/23

TSZ22111･15･001

Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Physical Dimension Tape and Reel Information

HTSOP-J8

4.9 0.1

(MAX 5.25 include BURR)

Tape

Embossed carrier tape

2500pcs

(3.2)

+

Quantity

6

°

4°

−4

8

7

2

6

3

5

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

4

1PIN MARK

+0.05

-0.03

0.545

0.17

S

1.27

+0.05

0.42

0.08

-

0.04

M

0.08

S

Direction of feed

1pin

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

HVSOF6

1.6 0.1

(MAX 1.8 include BURR)

Tape

Embossed carrier tape

Quantity

3000pcs

6

5 4

TR

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

(1.2)

(1.4)

1pin

1

2 3

0.145 0.05

S

0.1

S

0.22 0.05

0.5

Direction of feed

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

●Marking Diagram

HTSOP-J8(TOP VIEW)

xx

Product Name

BD00IC0WEFJ

BD10IC0WEFJ

BD12IC0WEFJ

BD15IC0WEFJ

BD18IC0WEFJ

BD25IC0WEFJ

BD30IC0WEFJ

BD33IC0WEFJ

Part Number Marking

LOT Number

00

10

12

15

18

25

30

33

x x I C 0 W

1PIN MARK

HVSOF6(TOP VIEW)

Part Number Marking

xx

B0

Product Name

BD00IC0WHFV

BD10IC0WHFV

BD12IC0WHFV

BD1CIC0WHFV

BD15IC0WHFV

BD18IC0WHFV

BD25IC0WHFV

BD26IC0WHFV

BD30IC0WHFV

BD33IC0WHFV

BT

BU

BS

BV

BW

BX

BR

BY

BZ

xx

LOT Number

1PIN MARK

www.rohm.com

TSZ02201-0R6R0A600430-1-2

21.Dec.2012 Rev.002

22/23

TSZ22111･15･001

Datasheet

BDxxIC0WEFJ / BDxxIC0WHFV

●Revision History

Date

Revision

Changes

6.Jul.2012

21.Dec.2012

001

002

New Release.

The description was modified.

www.rohm.com

TSZ02201-0R6R0A600430-1-2

21.Dec.2012 Rev.002

23/23

TSZ22111･15･001

Daattaasshheeeett

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Notice - Rev.004

Daattaasshheeeett

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Notice - Rev.004

Daattaasshheeeett

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - Rev.004


型号：	BD18IC0WEFJ-GTR
厂家：	ROHM
描述：	1A Variable Fixed Output LDO Regulators 1A可变固定输出LDO稳压器稳压器
文件：	总26页 (文件大小：517K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD18IC0WEFJ-GTR [ROHM]

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