BD1LBU50EFJ-C (新产品) [ROHM]
BD1LBU50EFJ-C is an in-vehicle 1ch low side switch. This switch builds in the overcurrent limiting circuit, thermal shutdown circuit, open load detection circuit and under voltage lock out circuit. It also provides the diagnostic output circuit when an abnormality is detected.;
| 型号： | BD1LBU50EFJ-C (新产品) |
| 厂家： | 
ROHM |
| 描述： | BD1LBU50EFJ-C is an in-vehicle 1ch low side switch. This switch builds in the overcurrent limiting circuit, thermal shutdown circuit, open load detection circuit and under voltage lock out circuit. It also provides the diagnostic output circuit when an abnormality is detected. |
| 文件： | 总19页 (文件大小：762K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1ch Low Side Switch IC
In-Vehicle 1ch Low Side Switch
BD1LB500 Series (BD1LB500EFJ-C BD1LB500FVM-C)
Features
Specifications
■ Built-in overcurrent limiting circuit
■ Built-in thermal shutdown circuit (TSD)
■ Built-in open load detection circuit (at output OFF)
■ Enables direct control from CMOS logic ICs, etc.
■ Low standby current
■ Built-in under voltage lock out circuit
■ Built-in diagnostic output (ST) terminal
■ Low ON resistance RDS(ON)=350mΩ(Typ) (VDD=IN=5V,
Ta=25°C, IOUT=0.25A)
Operating voltage range
3.5V to 5.5V
350mΩ
1.50A
ON resistance (25°C, Typ.)
Overcurrent limitation (Typ.)
Active clamp energy (25°C)
25mJ
■ Built-in overvoltage protection(active clamp) for output
circuit
Package
HTSOP-J8
MSOP8
4.90mm x 6.00mm x 1.00mm
2.90mm x 4.00mm x 0.90mm
■ Monolithic power IC in which the control unit (CMOS)
and power MOS FET are incorporated into one chip
■ 1ch low side switch for driving mechanical relay coil
■ AEC-Q100 Qualified(1)
(1) Grade1
Overview
BD1LB500 Series is an in-vehicle 1ch low side switch.
This switch builds in the overcurrent limiting circuit,
thermal shutdown circuit, open load detection circuit and
under voltage lock out circuit. It also provides the
diagnostic output circuit when an abnormality is
detected.
MSOP8
Application
HTSOP-J8
■ In-vehicle application (Air conditioners, body devices,
meters, etc.)
Basic Application Circuit (Recommendation)
VBAT
RL
VDD
8
7
6
5
N.C.
DRAIN
DRAIN
VDD
Under voltage
lock out
Open load
detection
Overvoltage
protection
Logic
(2)
Rext
0.1µF
Over current
Limit
SOURCE
(GN D)
IN
ST
2
SOURCE(GND)
1
3
4
(3)
10k
(2) When the open detection function is required, an external resistance must be added between DRAIN terminal and SOURCE terminal.
(3) It is necessary to detect unusual state(ST terminal is low) when VDD terminal is opened.
Product configuration: Silicon monolithic integrated circuit ○The product is not designed for radiation resistance.
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Pin Descriptions
Pin No.
Symbol
Function
1
IN
Input terminal; a pull down resistor is connected internally.
Self-diagnostic output terminal; outputs “L” at detection of overcurrent, at open (IN=0V),
and in the overheat state. See the truth table. It is structured as COMS inverter output
circuit.
2
ST
SOURCE
(GND)
3,4
Ground terminal
Output terminal; limits output current to protect IC when load is short-circuited and current
exceeding the overcurrent detection value (0.8A Min) flows to the output terminal.
5,6
DRAIN
N.C.
7
No Connect pin
8
VDD
Power supply terminal
The heat radiation metal on the substrate is connected to the IC sub. Therefore, connect
Cooling Tab to the external GND electrical potential (for HTSOP-J8 only).
Cooling Tab (1)
TAB
(1)MSOP8 does not have Cooling Tab.
Pin Configurations
ON resistance
(25°C,Typ)
Product Name
BD1LB500EFJ-C
PKG
TSD function
Self-restart
HTSOP-J8
MSOP8
350mΩ
BD1LB500FVM-C
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BD1LB500 Series
Absolute Maximum Ratings
Item
Symbol
Limit values
Unit
DRAIN-SOURCE voltage
Power supply voltage
Diagnostic output voltage
Output current (DC)
Output current (Pulse)
Input voltage
VDS
VDD
VST
IOD
42 (internally limited)
7
V
V
V
A
A
V
-0.3 to +7 (1)
0.8 (2)
IOP
Internally limited(3)
-0.3 to +7 (1)
2.1(HTSOP-J8) (4)
0.587(MSOP8) (5)
-40≤Topr＜+150
-55 to +150
150
VIN
Power consumption
Pd
W
Operating temperature range
Storage temperature range
Topr
Tstg
°C
°C
°C
mJ
Maximum junction temperature
Active clamp energy (single pulse)
Tjmax
EAS
25 (6)
Operating Voltage Ratings
Item
Code
VDD
Limit values
3.5 to 5.5
Unit
V
Operating voltage range
(1) The condition, VDD＞VIN, VST is required.
(2) The value must not exceed Pd.
(3) Internally limited by the overcurrent limiting circuit.
(4) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate).
When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C.
(5) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy single-layer substrate).
When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C.
(6) Min Active clamp energy at Tj(0) = 25°C, using single non-repetitive pulse of 0.4A
Heat Dissipation Characteristics
4.00
3.75 W
3.50
HTSOP-J8 (1)
3.00
2.50
2.1 W
HTSOP-J8 (2)
2.00
1.50
1.00
MSOP8 (3)
0.587 W
0.50
0.00
0
25
50
75
100
125
150
Ｔa [℃]
(HTSOP-J8) (1) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 4-layer substrate)
When using at Ta ≥ 25°C, power dissipation is reduced at 30mW/°C.
(2) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate)
When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C.
(MSOP8)
(3) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy single-layer substrate)
When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C.
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BD1LB500 Series
Electrical Characteristics (VDD=3.5V to 5.5V, -40°C≤ Tj≤ +150°C unless otherwise is specified)
Limit values
Item
Symbol
Unit
Condition
Min
Typ
Max
[Power Supply Block]
Standby current
IDDS
IDD
－
－
－
0
10
1.0
3.0
μA
mA
V
VDD=5V,VIN=0V,VB=12V,RL=47Ω
VDD=5V,VIN=5V,VB=12V,RL=47Ω
Operating current
0.5
2.5
Under voltage lock out
threshold voltage
VUVLO
[Input Block]
VTH1
VTH2
VHYS
IINH1
IINL
－
－
VDD×0.8
－
V
V
H level input voltage
L level input voltage
Input hysteresis
－
VDD×0.2
－
0.40
50
0
－
V
－
100
1
μA
μA
VIN=5V
VIN=0V
High level input current
Low level input current
[Power MOS output]
-1
VIN=5V,
RDS(ON)
RDS(ON)
IL(OFF)
IL(OFF)
tON
－
－
350
570
－
－
20
20
1
450
750
10
100
40
40
2
mΩ
mΩ
μA
VDD=5V,ID=0.25A,Tj=25°C
Output ON resistance
Output leak current
Switching time
VIN=5V,
VDD=5V,ID=0.25A,Tj=150°C
VIN=0V,VDS=12V,Tj=25°C
VIN=0V,VDS=12V,Tj=150°C
VDD=5V,VIN=0V/5V, RL=47Ω
VDD=5V,VIN=0V/5V, RL=47Ω
－
－
μA
μs
－
tOFF
μs
－
Slew rate (at ON)
Slew rate (at OFF)
Output clamp voltage
[Diagnostic output]
dV/dtON
-dV/dtOFF
VCL
V/μs
V/μs
V
VDD=5V,VIN=0V/5V, RL=47Ω
0.5
0.5
42
1
VDD=5V,VIN=0V/5V, RL=47Ω
2
47
VIN=0V,IOUT=-1mA
52
Diagnostic output voltage
“L level”
VSTL
VSTH
ISTH
－
4.88
－
－
－
－
0.4
－
V
V
VDD=5V,VIN=5V,IST=0.1mA
VDD=5V,VIN=0V,IST=-0.1mA
VIN=0V,VST=5.5V
Diagnostic output voltage
“H level”
Diagnostic output current
“H level”
10
μA
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BD1LB500 Series
Electrical Characteristics (VDD=3.5V to 5.5V, -40°C≤ Tj≤ +150°C unless otherwise is specified)
Rated value
Item
Symbol
Unit
Condition
Min
Typ
Max
[Protective circuit]
Overcurrent detection current
IOCP
tDHL
1.5
40
2.5
80
A
μs
μs
V
VIN=5V
0.8
－
VDD=5V,RL=4Ω to ∞
VDD=5V,RL=∞ to 4Ω
IN=0V
Diagnostic output delay time
tDLH
320
2
640
3
－
Open load detection threshold
voltage (1)
VOPEN
tOPEN
1
Open load detection time
300
900
μs
IN=0V
100
(1) To enable detection, an external resistance must be added between DRAIN terminal and SOURCE terminal.
（Determine Rext depending on RL.）
Definition
Figure 1. Definition
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BD1LB500 Series
Measuring Circuit Diagram
Figure 3. Switching Time Measuring Circuit
Figure 2. Output ON Resistance Measuring
Diagram
Circuit Diagram
Figure 4. Output Clamp Voltage Measuring
Circuit Diagram
Figure 5. Open Detection Measuring Circuit
Diagram
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BD1LB500 Series
Diagnostic Output Truth Table
OUTPUT
VIN
Tj
Mode
VST
H
Output state
VOUT
IOUT
IOUT < 1.5A(Typ)
Normal
ON
Tj ≤175°C(Typ)
Tj >175°C(Typ)
-
Overcurrent
detection
H
IOUT ≥ 1.5A(Typ)
L
OFF
OFF
OFF
Thermal shut
down
-
-
-
L
H
Normal
H
(3.0V or more)
L
-
L
Open load
protection
(2.0V(Typ) or
less)
-
L
OFF
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BD1LB500 Series
Characteristic Data (Reference Data) (VDD=5V, IN=5V, Tj=25°C unless otherwise is specified)
800
700
600
500
400
800
700
600
500
400
300
200
100
0
300
200
100
0
-50 -25
0
25
50
75 100 125 150
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Ｔｊ [°C]
VDD [V]
Figure 6. Output ON Resistance Characteristic
[Temperature Characteristic]
Figure 7. Output ON Resistance Characteristic
[Source Voltage Characteristic]
200
10.0
8.0
6.0
4.0
2.0
0.0
150
100
50
Tj=150°C
Tj=25°C
Tj=-40°C
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
IN [V]
VDD [V]
Figure 9. Input Current Characteristic
[Input Voltage Characteristic]
Figure 8. Standby Current Characteristic
[Source Voltage Characteristic]
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BD1LB500 Series
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
VDD=3.5V
VDD=5.0V
VDD=3.5V
VDD=5.0V
VDD=5.5V
VDD=5.5V
0.0
0.0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25 50 75 100 125 150
Tj [°C]
Tj [°C]
Figure 10. Switching Time (ton) [Temperature
Characteristic]
Figure 11. Switching Time (toff) [Temperature
Characteristic]
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
VDD=5.5V
V
DD=5.5V
VDD=5.0V
VDD=5.0V
VDD=3.5V
VDD=3.5V
-50 -25
0
25 50 75 100 125 150
Tj [°C]
-50 -25
0
25 50 75 100 125 150
Tj [°C]
Figure 12. Slew Rate (at ON) [Temperature
Characteristic]
Figure 13. Slew Rate (at OFF) [Temperature
Characteristic]
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BD1LB500 Series
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
30
25
20
15
10
5
ON threshold
OFF threshold
1.6
1.5
0
-50 -25
0
25
50 75 100 125 150
-50 -25
0
25 50 75 100 125 150
Tj [°C]
Tj [
]
℃
Figure 14. Input Voltage Threshold Characteristic
[Temperature Characteristic]
Figure 15. Output Leak Current [Temperature
Characteristic]
(VIN=0V)
Switching Time Measurement
Timing Chart with Inductive Load
Input voltage
Error flag
Output voltage
Output current
Figure 17.Timing Chart with Inductive Load
Figure 16. Switching Time
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BD1LB500 Series
Protective Function Timing Charts
Input voltage
Chip temperature
Output current
Error flag
Figure 18. Overheat Protection Timing Chart
Input Voltage
IN
Input
voltage
VIN
t
Output Voltage
VOUT
Output
voltage
V
OUTꢀ≤ꢀ2.0V(Typ)
VOUT
(VOPEN
)
tOFF
1ms(typ)
t
t
Output current
Io
VST
Error flag
Error flag
ST
300μs(Typ)
(TOPEN
)
40µs(typ)
100µs(typ)
Figure 19. Overcurrent Protection Timing Chart
Figure 20. Open Detection Protection Timing Chart
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BD1LB500 Series
I/O Equivalent Circuits
Pin
Symbol
I/O Equivalent Circuits
1
IN
2
ST
SOURCE
（GND）
3.4
DRAIN
5,6
DRAIN
SOURCE
(GND)
8
VDD
TAB
Cooling Tab
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BD1LB500 Series
Ordering Information
B D 1 L B 5 0 0 E F J
-
-
CE2
PKG
EFJ: HTSOP-J8
C: High reliability
Packaging and forming specification
E2: Embossed tape and reel
B D 1 L B 5 0 0 F V M
CGTR
PKG
C: High reliability
FVM: MSOP8
G: Lead free
Packaging and forming specification
TR: Embossed tape and reel
Physical Dimension Tape and Reel Information
HTSOP-J8
<Tape and Reel information>
4.9 0.1
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
(3.2)
+
−
Quantity
2500pcs
6
4
°
°
4°
8
7
2
6
3
5
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
4
1PIN MARK
+0.05
-0.03
0.545
0.17
S
1.27
+0.05
0.42
0.08
-
0.04
M
0.08
S
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
MSOP8
<Tape and Reel information>
2.9 0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
+
6°
4°
Quantity
3000pcs
−4°
8
7
6
5
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
2
3
4
1PIN MARK
+0.05
1pin
+0.05
−0.03
0.145
0.475
S
0.22
−0.04
0.08
S
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
0.65
Reel
(Unit : mm)
∗
Marking Diagram
HTSOP-J8(TOP VIEW)
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
L
0
B
5
0
L B 5 0 0 E
1PIN MARK
1PIN MARK
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Operational Notes
1) Absolute Maximum Ratings
Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all
destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit
protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the
absolute maximum ratings.
2) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
3) Power supply lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and
supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from
affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
4)
5)
Source (GND) Voltage
The voltage of the Source (GND) pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure
that no pins are at a voltage below the ground pin at any time, even during transient condition.
Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja
Power dissipation
: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
6)
7)
Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal
temperature of the IC reaches 175°C (25°C hysteresis). It is not designed to protect the IC from damage or guarantee
its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where
this function will always be activated.
8)
9)
Over voltage protection (active clamp)
There is a built-in over voltage protection circuit (active clamp) to absorb the induced current when inductive load is off
(Power MOS = off). During active clamp and when IN=0V, TSD will not function so keep IC temperature below 150°C.
Over current protection circuit (OCP)
The IC incorporates an over-current protection circuit that operates in accordance with the rated output capacity. This
circuit protects the IC from damage when the load becomes shorted. It is also designed to limit the output current
(without latching) in the event of more than 1.5A (typ) flow, such as from a large capacitor or other component
connected to the output pin. This protection circuit is effective in preventing damage to the IC in cases of sudden and
unexpected current surges. The IC should not be used in applications where the over current protection circuit will be
activated continuously.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
11) Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
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Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
C
E
Pin A
B
C
E
N
P+
P+
P+
N
N
P+
Parasitic
P
N
P
N
N
P substrate
P substrate
Parasitic
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
Example of monolithic IC structure
12)
GND wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
13) Back electromotive force (BEMF)
There is a possibility that the BEMF is changed by using the operating condition, environment and the individual
characteristics of motor. Please make sure there is no problem when operating the IC even though the BEMF is
changed.
14)
15)
Rush Current
When power is supplied to the IC, inrush current may flow instantaneously. It is possible that the charge current from
the parasitic capacitance of the internal logic may be unstable. Therefore, give a special consideration with the power
coupling capacitance, power wiring, width of GND wiring, and routing of connections.
TAB
IC’ sub is already connected to TAB, please short TAB to External GND.
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TSZ22111・15・001
TSZ02201-0G3G0BD00040-1-2
2015.04.01 Rev.006
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BD1LB500 Series
Revision History
Date
Revision
Changes
New Release
01.Aug.2013
06.Aug.2013
10.Jan.2014
003
004
005
・P.11 Figure20 VOUT timing chart is modified.
・P4. Condition of Diagnostic output voltage “L level” is Added.
・P4. Item of Diagnostic output voltage “H level” is Added.
・P1. “AEC-Q100 qualified” is added in Features
・P1. Note (1),(2) and (3) are added
・P2. Pin No 7 N.C. is added in Pin Description
・P2. “Cooling Tab”(Symbol; TAB) is added in Pin Description
・P3.
・P4. Min of “ Diagnostic output voltage “H level” “ is changed to 4.88V
・P9. ”ton” is changed to “toff” in Figure 11. 13.
Note (6) is added
1.Apr.2015
006
・P10. Figure 17 is changed
・P15. FIN is changed to TAB in 15)
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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