BD2222G-GTR [ROHM]
1ch Adjustable Current Limit High Side Switch ICs;
| 型号： | BD2222G-GTR |
| 厂家： | 
ROHM |
| 描述： | 1ch Adjustable Current Limit High Side Switch ICs |
| 文件： | 总30页 (文件大小：764K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1 Channel Compact High Side Switch ICs
1ch Adjustable Current Limit
High Side Switch ICs
BD2222G BD2242G BD2243G
Description
BD2222G, BD2242G and BD2243G are low
Key Specifications
¢ Input Voltage Range:
¢ On Resistance: (IN=5V)
¢ Current Limit Threshold:
¢ Standby Current:
2.8V to 5.5V
89mΩ(Typ)
0.2A to 1.7A adjustable
0.01µA (Typ)
on-resistance N-channel MOSFET high-side power
switches, optimized for Universal Serial Bus (USB)
applications. These devices are equipped with the
function of over-current detection, thermal shutdown,
under-voltage lockout and soft-start. Moreover, the
range of Current limit threshold can be adjusted from
0.2A to 1.7A by changing the external resistance.
¢ Operating Temperature Range:
-40°C to +85°C
Package
W(Typ) D(Typ) H (Max)
2.90mm x 2.80mm x 1.25mm
Features
SSOP6
¢
¢
Adjustable Current Limit Threshold: 200mA to 1.7A
Low On-Resistance (Typ 89mΩ) N-channel
MOSFET Built-in
¢
¢
Soft-Start Circuit
Output Discharge Function
‹ BD2242G, BD2243G
¢
¢
¢
¢
¢
Open-Drain Fault Flag Output
Thermal Shutdown
Under-Voltage Lockout
Reverse Current Protection when Power Switch Off
Control Input Logic Active-High
SSOP6
‹ Active-High:
‹ Active-Low:
BD2222G, BD2242G
BD2243G
Applications
USB hub in consumer appliances, PC,
PC peripheral equipment and so forth
Typical Application Circuit
5V (Typ)
3.3V
IN
OUT
ILIM
/OC
CIN
10µF
1µF
+
-
CL
120µF
GND
EN
10k
100k
to
Ω
RLIM
Ω
Figure 1. Typical Application Circuit
Lineup
Output Load
Current
Adjustable
Current Limit
Threshold
Output
Control input
Discharge
Orderable Part
Number
Channel
Package
logic
Max
1.5A
1.5A
1.5A
function
200mA to 1.7A
200mA to 1.7A
200mA to 1.7A
1ch
1ch
1ch
High
High
Low
No
Yes
Yes
SSOP6 Reel of 3000 BD2222G – GTR
SSOP6 Reel of 3000 BD2242G – GTR
SSOP6 Reel of 3000 BD2243G – GTR
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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Datasheet
BD2222G BD2242G BD2243G
Block Diagram
IN
OUT
Reverse current
Protection
Under-voltage
Lockout
GND
Charge
Pump
Thermal
Shutdown
EN
/OC
Delay
Counter
Over-current
Protection
ILIM
Figure 2. Block Diagram
(BD2222G)
IN
OUT
Reverse current
Protection
/EN
Under-voltage
Lockout
GND
Charge
Pump
Thermal
EN
/OC
Shutdown
Delay
Counter
Over-current
ILIM
Protection
Figure 3. Block Diagram
(BD2242G, BD2243G)
Pin Configuration
IN
GND
EN
1
6
5
4
OUT
ILIM
/OC
2
3
Figure 4. Pin Configuration (TOP VIEW)
Function
Pin Descriptions
Pin No.
Symbol
IN
I/O
1
2
I
Switch input and the supply voltage for the IC.
GND
EN
-
Ground.
Enable input.
3
4
I
High-level input turns on the switch (BD2222G, BD2242G)
Low-level input turns on the switch (BD2243G)
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
/OC
O
Open-drain fault flag output.
Current limit threshold set Pin. External resistor used to set Current limit
5
6
ILIM
OUT
O
O
threshold. Recommended 11.97 kΩ ≤ RLIM ≤ 106.3 kΩ
Power switch output.
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Datasheet
BD2222G BD2242G BD2243G
Absolute Maximum Ratings(Ta=25°C)
Parameter
Symbol
Rating
-0.3 to +7.0
-0.3 to +7.0
-0.3 to +7.0
1
Unit
V
IN Supply Voltage
VIN
EN Input Voltage
ILIM Voltage
VEN
V
VILIM
IILIM
V
ILIM Source Current
/OC Voltage
mA
V
V/OC
I/OC
-0.3 to +7.0
10
/OC Sink Current
OUT Voltage
mA
V
VOUT
Tstg
Pd
-0.3 to +7.0
-55 to +150
0.67
Storage Temperature
Power Dissipation (Note1)
°C
W
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃
Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to
predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to
consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the
absolute maximum ratings.
Recommended Operating Conditions
Rating
Parameter
Symbol
Unit
Min
2.8
-40
Typ
5.0
-
Max
5.5
IN Operating Voltage
VIN
V
Operating Temperature
TOPR
+85
°C
Electrical Characteristics (VIN = 5V, RLIM =20kΩ, Ta = 25°C, unless otherwise specified.)
DC Characteristics
Limit
Parameter
Symbol
IDD
Unit
Conditions
Min
-
Typ
Max
168
VEN = 5V, VOUT = open,
(BD2222G, BD2242G)
Operating Current
120
µA
V
EN = 0V, VOUT = open,
(BD2243G)
VEN = 0V, VOUT = open,
(BD2222G, BD2242G)
VEN = 5V, VOUT = open,
(BD2243G)
Standby Current
EN Input Voltage
ISTB
-
0.01
5
µA
VENH
VENL
IEN
2.0
-
-
-
-
V
V
High input
0.8
1
Low input
EN Input Leakage
On-Resistance
-1
0.01
89
µA
mΩ
µA
VEN = 0V or 5V
IOUT = 500mA
VOUT = 5V, VIN = 0V
RLIM = 100kΩ
RLIM = 20kΩ
RON
IREV
-
120
1
Reverse Leak Current
-
-
112
911
1566
212
1028
1696
313
1145
1826
Current Limit Threshold
ITH
mA
RLIM = 12kΩ
IOUT = -1mA, VEN = 0V (BD2242G)
IOUT = -1mA, VEN = 5V (BD2243G)
I/OC = -1mA
Output Discharge Resistance
/OC Output Low Voltage
RDISC
30
60
120
Ω
V/OC
VTUVH
VTUVL
-
-
0.4
V
V
V
2.35
2.30
2.55
2.50
2.75
2.70
VIN increasing
VIN decreasing
UVLO Threshold
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Datasheet
BD2222G BD2242G BD2243G
AC Characteristics
Limits
Typ
0.6
1
Parameter
Symbol
tON1
Unit
Conditions
Min
Max
6
Output rise Time
-
-
ms
ms
µs
Output Turn-On Time
Output Fall Time
tON2
10
20
40
12
RL = 100Ω
tOFF1
tOFF2
t/OC
-
1.8
3.2
7
Output Turn-Off Time
/OC Delay Time
-
µs
4
ms
Measurement Circuit
V
IN
V
IN
I
IN
A
IN
OUT
IN
OUT
C
IN
1µF
=
C =
IN
1µF
R
L
ILIM
/OC
GND
EN
ILIM
/OC
GND
EN
R
LIM
RLIM
V
EN
VEN
A. Operating Current, Standby Current
B. EN Input Voltage, Output Rise/Fall Time
Output Turn-On/ Turn-Off Time
V
IN
V
IN
I
/OC=
10kΩ
1mA
A
I
IN
OUT
I
I
OUT
IN
OUT
ILIM
/OC
IN
OUT
ILIM
/OC
C
IN
=
C
L
=
C
IN
1µF
=
C =
L
1µF
100µF
100µF
※
100µF
GND
EN
GND
EN
R
LIM
RLIM
V
EN
VEN
C. On-Resistance, Current Limit Threshold, /OC Delay Time
※Use capacitance more than 100µF at output short circuit test by using
external power supply.
D. /OC Output Low Voltage
V
IN
V
IN
I
OUT
=
1mA
IN
OUT
ILIM
/OC
IN
OUT
C
IN
1µF
=
C =
IN
R
L
1µF
ILIM
/OC
GND
EN
GND
EN
R
LIM
RLIM
V
EN
VEN
E. UVLO Threshold
F. Output Discharge Resistance
Figure 5. Measurement Circuit
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Datasheet
BD2222G BD2242G BD2243G
Timing Diagram
VENL
VENH
VENH
VENL
VEN
VEN
tON2
tON2
tOFF2
tOFF2
90%
10%
90%
10%
90%
10%
90%
10%
VOUT
VOUT
tON1
tOFF1
tON1
tOFF1
Figure 7. Output Rise/Fall Time
(BD2243G)
Figure 6. Output Rise/Fall Time
(BD2222G, BD2242G)
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves
160
160
120
80
VIN=5.0V
RLIM=20kΩ
Ta=25°C
RLIM=20kΩ
120
80
40
0
40
0
2
3
4
5
6
-50
0
50
100
SupplyVoltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 9. Operating Current vs Ambient Temperature
EN Enable
Figure 8. Operating Current vs Supply Voltage
EN Enable
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
RLIM=20kΩ
VIN=5.0V
RLIM=20kΩ
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 10. Standby Current vs Supply Voltage
EN Disable
Figure 11. Standby Current vs Ambient Temperature
EN Disable
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves - continued
2.0
2.0
1.5
1.0
0.5
0.0
Ta=25°C
RLIM=20kΩ
VIN=5.0V
RLIM=20kΩ
Low to High
High to Low
1.5
Low to High
High to Low
1.0
0.5
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 12. EN Input Voltage vs
Supply Voltage
Figure 13. EN Input Voltage vs
Ambient Temperature
200
150
100
50
200
150
100
50
Ta=25°C
RLIM=20kΩ
IOUT=500mA
VIN=5.0V
RLIM=20kΩ
IOUT=500mA
0
0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 14. On-Resistance vs Supply Voltage
Figure 15. On-Resistance vs Ambient Temperature
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves - continued
0.5
0.4
0.3
0.2
0.1
0.0
0.5
Ta=25°C
RLIM=100kΩ
VIN=5.0V
RLIM=100kΩ
0.4
0.3
0.2
0.1
0.0
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : V [V]
IN
Figure 16. Over-Current Threshold 1 vs
Supply Voltage
Figure 17. Over-Current Threshold 1 vs
Ambient Temperature
1.3
1.2
1.1
1.0
0.9
0.8
1.3
1.2
1.1
1.0
0.9
0.8
Ta=25°C
RLIM=20kΩ
VIN=5.0V
RLIM=20kΩ
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 18. Over-Current Threshold 2 vs
Supply Voltage
Figure 19. Over-Current Threshold 2 vs
Ambient Temperature
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves - continued
2.0
1.9
1.8
1.7
1.6
1.5
2.0
Ta=25°C
RLIM=12kΩ
VIN=5.0V
RLIM=12kΩ
1.9
1.8
1.7
1.6
1.5
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : V [V]
IN
Figure 20. Over-Current Threshold 3 vs
Supply Voltage
Figure 21. Over-Current Threshold 3 vs
Ambient Temperature
100
80
60
40
20
0
100
80
60
40
20
0
Ta=25°C
VIN=5.0V
RLIM=20kΩ
RLIM=20kΩ
I/OC=1mA
I/OC=1mA
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 22. /OC Output Low Voltage vs
Supply Voltage
Figure 23. /OC Output Low Voltage vs
Ambient Temperature
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves - continued
2.7
1.0
0.8
0.6
0.4
0.2
0.0
RLIM=20kΩ
RLIM=20kΩ
2.6
VTUVH
2.5
VTUVL
2.4
2.3
2.2
-50
0
50
100
-50
0
50
100
Ambient Temperature : Ta[
]
Ambient Temperature : Ta[°C]
℃
Figure 24. UVLO Threshold vs
Ambient Temperature
Figure 25. UVLO Hysteresis Voltage vs
Ambient Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0
Ta=25°C
RLIM=20kΩ
RL=100Ω
VIN=5.0V
RLIM=20kΩ
RL=100Ω
2.5
2.0
1.5
1.0
0.5
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 26. Output Rise Time vs
Supply Voltage
Figure 27. Output Rise Time vs
Ambient Temperature
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves - continued
3.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta=25°C
V
IN=5.0V
RLIM=20k
RL=100
RLIM=20k
RL=100
Ω
Ω
Ω
Ω
2.5
2.0
1.5
1.0
0.5
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 28. Output Turn-On Time vs
Supply Voltage
Figure 29. Output Turn-On Time vs
Ambient Temperature
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
RLIM=20k
RL=100
V
IN=5.0V
Ω
RLIM=20k
RL=100
Ω
Ω
Ω
2
3
4
5
6
-50
0
50
100
SupplyVoltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 30. Output Fall Time vs
Supply Voltage
Figure 31. Output Fall Time vs
Ambient Temperature
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves - continued
6.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VIN=5.0V
RLIM=20k
RLIM=20k
Ω
Ω
RL=100
Ω
RL=100
Ω
5.0
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 33. Output Turn-Off Time vs
Ambient Temperature
Figure 32. Output Turn-Off Time vs
Supply Voltage
10
8
10
8
Ta=25°C
RLIM=20k
VIN=5.0V
RLIM=20k
Ω
Ω
6
6
4
4
2
2
0
0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
Ambient Temperature : Ta[°C]
IN
Figure 35. /OC Delay Time vs
Ambient Temperature
Figure 34. /OC Delay Time vs
Supply Voltage
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Datasheet
BD2222G BD2242G BD2243G
Typical Performance Curves - continued
200
200
150
100
50
Ta=25°C
RLIM=20k
IOUT=1mA
VIN=5.0V
RLIM=20k
Ω
Ω
IOUT=1mA
150
100
50
0
0
2
3
4
5
6
-50
0
50
100
Supply Voltage : V [V]
IN
Ambient Temperature : Ta[°C]
Figure 36. Discharge On Resistance
vs Supply Voltage
Figure 37. Discharge On Resistance vs
Ambient Temperature
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Datasheet
BD2222G BD2242G BD2243G
Typical Wave Forms
VEN
VEN
(5V/div.)
(5V/div.)
V/OC
V/OC
(5V/div.)
(5V/div.)
VOUT
VOUT
(5V/div.)
(5V/div.)
IIN
IIN
VIN=5V
LIM=20k
RL=100
(50mA/div.)
VIN=5V
(50mA/div.)
R
Ω
Ω
RLIM=20k
Ω
RL=100
Ω
TIME (0.5ms/div.)
TIME (1µs/div.)
Figure 38. Output Rise Characteristic
(BD2242G)
Figure 39. Output Fall Characteristic
(BD2242G)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
VOUT
(5V/div.)
(5V/div.)
CL=47
µF
CL=100
µF
Limit current
VOUT
(5V/div.)
Current limit threshold
CL=220µF
VIN=5V
RLIM=20k
Ω
IIN
IIN
RL=100
Ω
VIN=5V
(0.5A/div.)
(0.5A/div.)
RLIM=20k
CL=100µF
Ω
CL=100
µF
CL=47µF
TIME (1ms/div.)
TIME (20ms/div.)
Figure 40. Inrush Current Response
(BD2242G)
Figure 41. Over Current Response
Ramped Load
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Datasheet
BD2222G BD2242G BD2243G
Typical Wave Forms - continued
VEN
(5V/div.)
VEN
(5V/div.)
VIN=5V
RLIM=20k
CL=100
Ω
F
µ
V/OC
V/OC
(5V/div.)
(5V/div.)
Removal of load
TSD detection
TSD detection
TSD recovery
TSD recovery
VOUT
VOUT
(5V/div.)
(5V/div.)
VIN=5V
LIM=20k
R
Ω
IIN
IIN
CL=100
µF
(0.5A/div.)
(0.5A/div.)
TIME (20ms/div.)
TIME (20ms/div.)
Figure 43. Over Current Response
Disenable From Short Circuit
(BD2242G)
Figure 42. Over Current Response
Enable Into Short Circuit
(BD2242G)
VIN
(5V/div.)
VIN
(5V/div.)
VIN=VEN
VIN=VEN
V/OC
(5V/div.)
V/OC
(5V/div.)
UVLO detection
UVLO recovery
VOUT
(5V/div.)
VOUT
(5V/div.)
IIN
IIN
(50mA/div.)
(50mA/div.)
V
/OC=3.3V
RLIM=20k
RL=100
V
/OC=3.3V
RLIM=20k
RL=100
Ω
Ω
Ω
Ω
TIME (1s/div.)
TIME (1s/div.)
Figure 44. UVLO Response
Increasing VIN (BD2242G)
Figure 45. UVLO Response
Decreasing VIN (BD2242G)
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Typical Wave Forms - continued
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RLIM=20k
VIN=5V
RLIM=20k
CL=100
Ω
Ω
F
CL=100
µF
µ
IIN
(1A/div.)
IIN
(1A/div.)
TIME (2ms/div.)
Figure 46. Over Current Response
Load Connected At Enable
TIME (5
Figure 47. Over Current Response
Load Connected At Enable
µs/div.)
1
Ω
1
Ω
V/OC
V/OC
(5V/div.)
(5V/div.)
VOUT
VOUT
(5V/div.)
(5V/div.)
VIN=5V
RLIM=20k
CL=100
VIN=5V
RLIM=20k
CL=100
Ω
F
Ω
F
µ
µ
IIN
IIN
(1A/div.)
(1A/div.)
TIME (2ms/div.)
Figure 48. Over Current Response
Load Connected At Enable
TIME (5
Figure 49. Over Current Response
Load Connected At Enable
µs/div.)
0
Ω
0Ω
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Datasheet
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Application Circuit Example
5V (Typ)
10kΩ to
100kΩ
IN
OUT
ILIM
/OC
C
IN
+
-
Controller
GND
EN
CL
RLIM
Figure 50. Application Circuit Example
Application Information
Ringing may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across IN
terminal and GND terminal of IC. 1 F or higher is recommended. When excessive current flows due to output short-circuit
or so, ringing occurs because of inductance between power source line to IC may exert a bad influence upon IC. In order to
µ
decrease voltage fluctuations from power source line to IC, connect a low ESR capacitor in parallel with CIN. 10
or higher is effective.
µF to 100µF
Pull up /OC output via resistance value of 10k
Set up a value for C which satisfies the application.
This system connection diagram does not guarantee operation as the intended application.
Ω to 100kΩ.
L
When using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as the design tolerance of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned on from EN control input, the IN terminal and OUT terminal are connected by a 89mΩ(Typ)
switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the IN
terminal, current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, current flow from OUT to IN is
prevented during off state.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 120
turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 110
is turned on and fault flag (/OC) is cancelled. Also, regardless of over-current condition, if the junction temperature were
beyond 160 (Typ), thermal shutdown circuit makes power switch turn off and outputs fault flag (/OC).When junction
temperature decreases lower than 140 (Typ), power switch is turned on and fault flag (/OC) is cancelled. Unless the fact
℃
(Typ) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch
℃
(Typ), power switch
℃
℃
of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. Fault
flag (/OC) is output without delay time at thermal shutdown.
The thermal shutdown circuit operates when the switch is on (EN signal is active).
3. Over-Current Detection (OCD)
The over current detection circuit (OCD) limits current and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three cases when the OCD is activated. The OCD operates when the
switch is on (EN signal is active).
(1). When the switch is turned on while the output is in short-circuit status, the switch gets in current limit status
immediately. (See figure 42)
(2). When the output short-circuits or when high current load is connected while the switch is on, very large current
flows until the over current limit circuit reacts. When this happens, the over-current limit circuit is activated and the
current limitation is carried out. (See figure 48)
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Datasheet
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(3). When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection value, current limitation is carried out.
(See Figure 41)
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the IN exceeds 2.55V(Typ). If the IN drops below 2.5V(Typ) while
the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 50mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN signal is active). (see Figure 44,45)
5. Fault Flag (/OC) Output
Fault flag output is an N-MOS open drain output. At detection of over-current or thermal shutdown, output is low-level.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current
at switch on, hot plug from being informed to outside, but if charge up time for output capacitance is longer than delay
time, fault flag output asserts low level. When output current is close to Current Limit Threshold value, fault flag output
(/OC) might be low level before turning to over-current condition because it is affected by current swinging or noise. If
fault flag output is unused, /OC pin should be connected to open or ground line.
Over-Current
Detection
Over-Current
Load Removed
V
OUT
I
TH
Limit current
IOUT
T/OC
V
/OC
Figure 51. Over-Current Detection
VEN
Over-current detection
Thermal Shutdown
VOUT
IOUT
V/OC
Thermal Shutdown recover
/OC delay time
Figure 52. Over-Current Detection, Thermal Shutdown Timing (BD2222G, BD2242G)
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Datasheet
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VEN
Over-current detection
Thermal Shutdown
VOUT
IOUT
V/OC
Thermal Shutdown recover
/OC delay time
Figure 53. Over-Current Detection, Thermal Shutdown Timing (BD2243G)
6. Adjustable Current Limit Threshold
BD2222/42/43G is able to change over-current detection value from 200mA to 1.7A by connecting resistance (RLIM
between ILIM pin and GND pin. The resistance value from 11.97K to 106.3k is recommended for RLIM. The
relational expression and the table for resistance value and over-current detection value are described below. Allocate
LIM close to IC as possible. Be careful not to be affected by parasitic resistance of board pattern because over-current
)
Ω
Ω
R
detection value is depended on the resistance value between ILIM pin and GND pin. ILIM pin cannot be used as open
and short to GND pin. The RLIM resistance tolerance directly affects the current limit threshold accuracy.
Recommended to use low tolerance resistance.
Over Current Threshold Equation,
Ith(Typ)[mA] = 19364
×
RLIM[kΩ -0.98
]
Ith(Min)[mA] = Ith(Typ)[mA]
Ith(Max)[mA] = Ith(Typ)[mA]
×
0.98 - 96
1.02 + 96
×
2000
1800
1600
1400
1200
1000
800
Typ.
Min.
Max.
600
400
200
0
0
20
40
60
80
100
120
LIM
Current Limit Resistor : R
[kΩ]
Figure 54. Ith vs. RLIM graph
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Datasheet
BD2222G BD2242G BD2243G
Current Limit Threshold (mA)
RLIM (kΩ)
MIN
100
198
296
394
492
590
688
786
TYP
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
MAX
300
402
504
606
708
810
912
1014
1116
1218
1320
1422
1524
1626
1728
1830
106.30
70.28
52.40
41.73
34.65
29.60
25.83
22.91
20.57
18.67
17.08
15.74
14.59
13.60
12.73
11.97
884
982
1080
1178
1276
1374
1472
1570
Table 1. Ith Tolerance vs. RLIM
7. Output Discharge Function (BD2242G and BD2243G)
When the switch is turned off from disable control input or UVLO function, the 60
Ω(Typ.) discharge circuit between
OUT and GND turns on. By turning on this switch, electric charge at capacitive load is discharged. But when the
voltage of IN declines extremely, then the OUT pin becomes Hi-Z without UVLO function.
Power Dissipation
(SSOP6 package)
700
600
500
400
300
200
100
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE : Ta [
]
℃
* 70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 55. Power Dissipation Curve (Pd-Ta Curve)
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Datasheet
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I/O Equivalence Circuit
Symbol
Pin No.
Equivalent Circuit
EN
3
EN
/OC
/OC
4
5
ILIM
ILIM
OUT
6
OUT
BD2222G
OUT
6
BD2242G
BD2243G
OUT
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Datasheet
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 56. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Datasheet
BD2222G BD2242G BD2243G
Ordering Information
B D
2
2
x
x
G
-
G T
R
Part Number
BD2222
Package
G: SSOP6
G: Halogen free
package
Packaging and forming specification
TR: Embossed tape and reel
BD2242
BD2243
Marking Diagram
SSOP6 (TOP VIEW)
Part Number Marking
1PIN MARK
LOT Number
Part Number
Part Number Marking
BD2222G
BD2242G
BD2243G
BN
AY
AZ
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Datasheet
BD2222G BD2242G BD2243G
Physical Dimension, Tape and Reel Information
Package Name
SSOP6
<Tape and Reel information>
Tape
Embossed carrier tape
3000pcs
Quantity
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1pin
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
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Datasheet
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Revision History
Date
Revision
Changes
12.OCT.2012
27.FEB.2013
7.MAR.2013
0000
0001
001
Draft
Over Current Threshold Limits
Authentic Release
Add Typical Wave Forms for over current response
Change I/O Equivalence Circuit (EN)
23.APR.2013
002
Applied new style and improved understandability.
Improved Symbol name.
Improved in Operational Notes.
Add Output Discharge Function in Functional Description
Add BD2222G
12.FEB.2014
9.JUN.2014
003
004
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
Rev.002
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
Rev.002
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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