BD2801MUV (新产品) [ROHM]

BD2801MUV是一款内置电荷泵电源的三通道线性恒流LED驱动器IC。该产品可以通过与IREF引脚连接的外置电阻器来调整各通道的输出电流，还可以通过输入外部信号来控制各通道的ON/OFF。非常适合用作CIS接触式图像传感器用R、G、B的LED驱动IC。;


型号：	BD2801MUV (新产品)
厂家：	ROHM
描述：	BD2801MUV是一款内置电荷泵电源的三通道线性恒流LED驱动器IC。该产品可以通过与IREF引脚连接的外置电阻器来调整各通道的输出电流，还可以通过输入外部信号来控制各通道的ON/OFF。非常适合用作CIS接触式图像传感器用R、G、B的LED驱动IC。驱动泵传感器图像传感器驱动器电阻器
文件：	总18页 (文件大小：938K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Built-in Charge Pump

3ch Linear LED Driver

BD2801MUV

General Description

Key Specifications

The BD2801MUV is a 3ch linear constant-current LED

driver IC with a built-in charge pump power supply, allowing

the output current of each channel to be adjusted by

external resistors connected to the IREF pin.

In addition, each ch can be controlled ON/OFF by inputting

an external signal.

◼ Input Voltage Range:

◼ Output Current Accuracy:

◼ Maximum Output Current:

◼ Operating Temperature:

3.135 V to 3.465 V

±9.1 %

100 mA (DC)

0 °C to 70 °C

Package

VQFN016V3030

W (Typ) x D (Typ) x H (Max)

3.0 mm x 3.0 mm x 1.0 mm

It is suitable for R, G, and B LED driver IC for CIS type

sensors.

Features

◼ Built-in Charge Pump Power Supply

◼ 3ch Independent ON/OFF

◼ 8-step Current Setting

◼ IREF Pin Ground Fault Protection (IREF SCP)

Application

◼ LED Driver for CIS Type Sensor

Typical Application Circuit

CPOUT

LED_R

LED_G

LED_B

VDD

CONT_R

CONT_G

CONT_B

Current

Driver

Charge

Pump

Current

Driver

Current

Setting

Current

Driver

PDN

VSS

IREF

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Pin Configuration

(TOP VIEW)

VDD

IREF

PDN

LED_R

GND

LED_G

GND

Exposed PAD

Pin Descriptions

Pin No.

Pin Name

Function

VDD

IREF

Power supply

Output current setting^{(Note 1)}

Power-down mode input

Enable Input

PDN

CONT_B

CONT_G

CONT_R

LED_B

GND

LED control signal input B

LED control signal input G

LED control signal input R

LED current output B

GND

LED_G

GND

LED current output G

GND

LED_R

CPOUT

GND

LED current output R

Charge pump power output

GND

Charge pump positive side

Charge pump negative side

Exposed pad. Connect EXP-PAD to the GND

EXP-PAD

(Note 1) Do not connect external capacitors.

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Block Diagram

CPOUT

LED_R

LED_G

LED_B

VDD

CONT_R

CONT_G

CONT_B

Current

Driver

Charge

Pump

Current

Driver

Current

Setting

Current

Driver

PDN

VSS

IREF

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Description of Blocks

Charge Pump Block

Generates the voltage required to light the LEDs from the voltage supplied to the VDD pin.

LED Driver Block

This product is a 3-channel LED driver that drives anode common R, G, and B LEDs with constant current. The current

applied to each channel can be adjusted with external resistors, and the current can be turned ON/OFF with the CONT_R,

CONT_G and CONT_B pins.

The current can be set in 8 steps by the CONT_R, CONT_G, CONT_B and EN pins.

In case of 3-channel simultaneous lighting, the current setting shall be 50 % or less. (In case of 66 mA)

Power Down Function

When the PDN pin is set to Low during VDD power-up, the device enters a power-down state.

During power-down, the current supply inside the device stops, the LED_R, LED_G and LED_B pins are High-Z, and the

CPOUT pin is Low. At startup, VDD should be started up with PDN = Low.

LED Current Setting Method

On the rising edge of the EN pin, the pattern on the CONT_R, CONT_G and CONT_B pins is latched to determine the

current value. Then, once the CONT_R, CONT_G and CONT_B pins are set to Low, the LED current is turned on and off

according to the CONT_R, CONT_G and CONT_B.

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Absolute Maximum Ratings (Ta = 25 °C)

No.

Parameter

Symbol

Rating

Unit

A-1 VDD Pin Voltage

IREF, PDN, EN, CONT_B,

V_DD

-0.3 to +4.0

V_IREF, V_PDN, V_EN

CONT_G, CONT_R

Pin Voltage

LED_B, LED_G, LED_R,

CPOUT Pin Voltage

V_{CONT_B}, V_{CONT_G}

V_{CONT_R}

V_{LED_B}, V_{LED_G}, V_{LED_R}

V_CPOUT

-0.3 to VDD + 0.3

A-2

-0.3 to +8.0

-55 to +150

150

A-3

A-4

A-5

A-6

CP to CN Pin Voltage

V_CP-CN

Tstg

Storage Temperature Range

°C

Maximum Junction

Temperature

Tjmax

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

VQFN016V3030

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

189.0

57.5

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A (Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Thermal Via^{(Note 5)}

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 5) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.

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Recommended Operating Conditions

No.

Parameter

Symbol

V_DD

Min

Typ

Max

Unit

O-1 VDD Power Supply Voltage^{(Note 1)}

3.135

3.300

3.465

Operating Temperature

Topr

°C

O-2

(Note 1) ASO should not be exceeded.

Operating Conditions

No.

Parameter

Symbol

C_VDD

Min

Typ

Max

Unit

μF

kΩ

P-1 VDD Pin Connection Capacitor^{(Note 2)}

CP to CN Pins Connection

P-2

C_CP-CN

C_CPOUT

R_IREF

1.0

3.4

1.1

Capacitor^{(Note 2)}

CPOUT Pin Connection Capacitor^(Note

P-3

Output Current Setting Resistor

LED Vf

4.7

14.1

4.8

P-4

P-5

(Note 2) Connect the capacitor within 10 mm from the IC; if the capacitor is connected beyond 10 mm, the output current I_{LED_X (X = R,G,B)}may oscillate or otherwise

become unstable, so evaluate the capacitor thoroughly on the actual device for confirmation.

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Electrical Characteristics

(Unless otherwise specified Ta = 0 °C to 70 °C, V_DD= 3.135 V to 3.465 V)

Standard Value

No.

Parameter

Symbol

Unit

Condition

Min

Typ

Max

Circuit Current

E-1 VDD Pin Circuit Current

Digital Input DC Characteristic

E-2 Input High Voltage

I_VDD

5.0

R_IREF= 4.7 kΩ

V_DD

x 0.7

V_IH

V_IL

V_DD

x 0.3

PDN, EN, CONT_R,

CONT_G, CONT_B

E-3 Input Low Voltage

E-4 Input Leakage Current

Charge Pump

I_LEAK

-2

μA

V_DD= 3.3 V

At LED current disable

E-5 CPOUT Voltage

V_CPO

t_CPON

t_CPOFF

6.27

6.60

6.93

E-6 CPOUT Rise Time

E-7 CPOUT Fall Time

LED Driver

E-8 LED Current Setting Range

I_RANGE

I_REF

IREF Pin Output Current

E-9

120

150

180

V_IREF= 0 V

at Ground Fault

R_IREF= 4.7 kΩ,

LED pin voltage

= (2 x V_DD- 3.1) V

LED Pin Voltage

= (2 x V_DD- 3.1) V

CONT_X (X = R, G, B)

000

E-10 LED Current (R/G/B)

I_LED

E-11

100

87.5

75.0

62.5

50.0

37.5

25.0

12.5

E-12

86.0

73.5

60.5

48.0

35.5

23.0

10.5

89.0

76.5

64.5

52.0

39.5

27.0

14.5

001

010

011

100

101

110

111

E-13

E-14 LED Current Accuracy (R/G/B)

A_LED

E-15

E-16

E-17

E-18

When I_{LED_X (X = R, G, B)}

= 49.5 mA setting,

LED pin voltage range

= 1.1 V to 6.6 V,

Dependence of LED Current on

LED Pin Voltage

E-19

D_LEDVF

-2.5

+2.5

V_{LED_ X (X = R, G, B)}

= 2.0 V reference

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Electrical Characteristics - continued

(Unless otherwise specified Ta = 0 °C to 70 °C, V_DD= 3.135 V to 3.465 V)

Standard Value

No.

Parameter

Symbol

Unit

Condition

Min

Typ

Max

LED Driver

E-20 LED Current Rise Time

E-21 LED Current Fall Time

t_ON

μs

t_OFF

CONT_X (X = R, G, B)

E-22 Current Setting Setup Time

E-23 Current Setting Hold Time

E-24 Current Setting Mode Clear Time

t_S

t_H

μs

to EN(0.3V_DD

)

EN(0.7V_DD

)

to CONT_X (X = R, G, B)

CONT_X (X = R, G, B):

0.7V_DD

t_CL

PDN

E-25 Power Down Period

E-26 Startup Time

t_PD

150

t_STUP

E-27 Power Down Current

I_PDN

μA

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Timing Chart

CONT_R

CONT_G

CONT_B

LED_R

LED_G

LED_B

CONT_R

CONT_G

CONT_B

Current Setting (Typ)

100 %

87.5 %

75 %

62.5 %

50 %

37.5 %

25 %

12.5 %

Figure 1. Output current setting

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Timing Chart - continued

LED Driver Block Switching Characteristics

0.7 VDD

0.3 VDD

CONT_R

CONT_G

CONT_B

0.7 VDD

(Set：High)

tCL

CONT_R

CONT_G

tCL

CONT_B

0.3 VDD

(Set：Low)

tON

tOFF

90 %

LED Current

10 %

Figure 2. LED current switching

PDN Switching Characteristics

tPD

3.135 V

VDD

tSTUP

PDN

Figure 3. Startup input switching

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 4. Example of Monolithic IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

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Ordering Information

B D 2

1 M U V

E 2

Package

MUV:

VQFN016V3030

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

VQFN016V3030 (TOP VIEW)

Part Number Marking

B D 2

8 0 1

LOT Number

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

VQFN016V3030

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Revision History

Date

Revision

001

Changes

New Release

24.Aug.2022

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Notice

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(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

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Precaution for Mounting / Circuit board design

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please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

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third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD2801MUV (新产品) [ROHM]

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